Modular PLC backboard structure and use method thereof

Abstract

The invention discloses a modularized PLC backboard structure and a use method thereof, and relates to the technical field of PLC backboards, the modularized PLC backboard structure comprises a backboard main body, a protection mechanism is arranged on the backboard main body, the backboard main body comprises a substrate, module sockets and power sockets, the module sockets are arranged on the substrate at equal intervals, the power sockets are installed on the substrate to supply power to the module sockets, and the protection mechanism is arranged on the backboard main body. The protection mechanism comprises a heat dissipation sleeve, a dustproof cover, a first guide frame and a second guide frame, the heat dissipation sleeve is arranged on the outer side of the module socket in a sleeving mode and fixedly installed on the substrate, the dustproof cover is movably installed on the protection sleeve, the first guide frame is fixedly installed on the upper end face of the dustproof cover, and the second guide frame is fixedly installed on the heat dissipation sleeve. The device has the advantages of automatic dust prevention, convenient operation and efficient heat dissipation, and solves the problems that in the prior art, an idle connector is prone to dust falling, poor contact is caused, and simple protection measures lack an automatic closing mechanism.

Description

Technical Field

[0001] The present invention relates to the technical field of PLC backplanes, and in particular to a modular PLC backplane structure and a method for using the same. Background Art

[0002] Most existing PLC backplanes utilize a modular design. While this design offers a high degree of flexibility and scalability, allowing users to add or remove functional modules as needed, it also presents certain challenges. In particular, when module connectors are not fully utilized, dust easily accumulates on the unused connectors.

[0003] Dust, oil, and other contaminants are common problems in industrial environments. These contaminants can enter unused modular connectors, causing poor contact and even equipment failure. Dust entering the modular connectors can increase contact resistance, affecting signal transmission quality and, in severe cases, causing intermittent equipment failure or permanent damage. Furthermore, cleaning accumulated dust requires specialized personnel, increasing downtime and maintenance costs. This is particularly true for PLC systems operating in harsh environments. To prevent dust intrusion, additional protective measures, such as dust covers or hoods, are often required. These simple protective measures often lack automatic closing and opening mechanisms, and cannot effectively prevent dust from entering the jacks when not in use. Therefore, a modular PLC backplane structure and its use method are needed to address the aforementioned issues. Summary of the Invention

[0004] The purpose of the present invention is to provide a modular PLC backplane structure and a method for using the same, which has the advantages of automatic dust prevention, convenient operation and efficient heat dissipation, and solves the problems in the prior art that idle joints are prone to dust accumulation, resulting in poor contact, and simple protective measures lack an automatic closing mechanism.

[0005] To achieve the above object, the present invention provides the following technical solution: a modular PLC backplane structure, comprising a backplane body, wherein a protective mechanism is provided on the backplane body;

[0006] The backplane body includes a substrate, a modular socket and a power socket, wherein the modular sockets are arranged in an equidistant array on the substrate, and the power socket is installed on the substrate to supply power to the modular sockets;

[0007] The protective mechanism includes a heat dissipation sleeve, a dust cover, a first guide frame and a second guide frame. The heat dissipation sleeve is sleeved on the outside of the module socket and fixedly installed on the substrate. The dust cover is movably installed on the protective sleeve. The first guide frame is fixedly installed on the upper end surface of the dust cover. The second guide frame is fixedly installed on the heat dissipation sleeve.

[0008] As a preferred modular PLC backplane structure of the present invention, the upper end face of the heat dissipation sleeve is provided with a mounting hole that passes through the lower end face, the dust cover is mirror-mounted on the left and right sides of the upper end face of the mounting hole, the upper end face edge of the heat dissipation sleeve is provided with a slide groove, the bottom of the dust cover is provided with a slide rod that slides with the slide groove, the side wall of the slide groove is provided with an axial hole that cooperates with the slide rod, the slide rod is provided with a compression spring, and the dust cover and the heat dissipation sleeve are elastically slidably connected through the slide rod and the compression spring.

[0009] As a preferred modular PLC backplane structure of the present invention, the first guide frame is fixedly installed on the front and rear sides of the upper end surface of the dust cover, and the upper end surface of the first guide frame is provided with a first guide surface, and the angle between the first guide surface and the horizontal plane is forty-five degrees.

[0010] As a preferred modular PLC backplane structure of the present invention, an installation groove is provided on the first guide surface, a support block is provided in the installation groove, and guide rollers rotatably connected to the first guide frame are provided at the upper and lower ends of the support block, and the outer ends of the guide rollers and the support block are provided with resistance-reducing sliding belts.

[0011] As a preferred modular PLC backplane structure of the present invention, the second guide frame is installed on the front and rear sides of the protective cover in a mirror-symmetrical manner, and a second guide surface is provided on the top of the second guide frame, and the angle between the second guide surface and the horizontal plane is sixty degrees.

[0012] As a preferred modular PLC backplane structure of the present invention, the upper end face of the dust cover is a bevel structure, the edge of the upper end face of the dust cover is provided with bristles, the angle between the bristles and the upper end face of the dust cover is one hundred and twenty degrees, and the bristles are made of stainless steel.

[0013] As a preferred modular PLC backplane structure of the present invention, the outer end surface of the heat dissipation sleeve is provided with a heat sink, the bottom of the inner end surface of the mounting hole is provided with a heat conductive block that fits with the module socket, and the heat dissipation sleeve is made of aluminum nitride ceramics.

[0014] As a preferred modular PLC backplane structure of the present invention, the side end surfaces of the dust cover are evenly provided with anti-slip racks, and the anti-slip racks are made of rubber material.

[0015] As a preferred modular PLC backplane structure of the present invention, a fixing ear plate is provided at the bottom of the side end surface of the heat dissipation sleeve, and a ventilation hole is provided at the side end surface of the base plate.

[0016] A method for using a modular PLC backplane structure comprises the following steps:

[0017] Step 1: Install the heat dissipation sleeve firmly on the base plate, ensure that the back plate is firmly installed, and clean the surface of the dust cover briefly;

[0018] Step 2: Insert the module. Hold the module plug and insert it into the protective cover. Press the module plug into the protective cover, causing the dust cover to move to both sides and open automatically.

[0019] Step 3: Auxiliary heat dissipation: The heat generated by the module socket is conducted outward through the heat dissipation sleeve to perform auxiliary heat dissipation;

[0020] Step 4: Remove the module. Manually push the dust covers on both sides outward, hold the module plug, and pull it out smoothly and forcefully in the opposite direction of insertion.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] 1. The present invention realizes automatic closing protection when the modular socket is not in use through a protective mechanism consisting of a heat dissipation sleeve, an elastically sliding dust cover and a compression spring. The dust cover closes toward the center under the action of the compression spring, effectively blocking dust from entering the socket and avoiding poor contact caused by dust accumulation. At the same time, the inclined stainless steel bristles arranged on the edge of the dust cover rub against the pins when the plug is inserted, automatically removing the surface oxide layer and enhancing conductivity. The inclined surface design of the upper end of the dust cover allows accumulated dust to slide down due to gravity, further reducing the risk of pollutant intrusion. This series of structures work synergistically to significantly improve the long-term stability and electrical connection quality of the socket.

[0023] 2. The 45-degree inclined guide surface of the first guide frame of the present invention and the 60-degree inclined surface of the second guide frame form a composite guide system. Through the force distribution, the plug is automatically aligned with the horizontal and longitudinal center positions of the modular socket during the downward pressing process, avoiding pin bending caused by manual trial and error. The resistance-reducing sliding belt and guide roller structure added to the first guide frame replace sliding friction with rolling friction, greatly reducing the resistance between the plug and the guide surface, which not only improves the smoothness of plugging but also reduces component wear. This design makes the plug installation process both accurate and convenient, and significantly reduces the difficulty of operation.

[0024] 3. The heat dissipation sleeve of the present invention adopts aluminum nitride ceramic material and external heat sink, combined with the bottom heat conduction block to form a three-dimensional heat dissipation channel, which quickly conducts the heat generated by the socket to the external environment. The ventilation holes on the side of the substrate promote air convection, further enhance the overall heat dissipation capacity, and effectively avoid the hidden danger of overheating caused by excessive resistance. At the same time, the rubber anti-slip rack on the side of the dust cover increases the friction of the plug through elastic pressure, and cooperates with the fixed ear plate bolt reinforcement design at the bottom of the heat dissipation sleeve to doubly ensure the stability of the plug connection. The combination of heat dissipation and fixing system significantly improves the safety and durability of equipment operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 An exploded view of the present invention;

[0027] Figure 3 A top view of the present invention;

[0028] Figure 4 The appended Figure 3 Middle AA section;

[0029] Figure 5 It is a schematic structural diagram of the protection mechanism of the present invention;

[0030] Figure 6 A top view of the protective mechanism of the present invention;

[0031] Figure 7 For the present invention Figure 6 Middle BB cross-section;

[0032] Figure 8 It is a front cross-sectional view of the protective mechanism, modular socket and modular plug in the mating state of the present invention;

[0033] Figure 9 For the present invention Figure 7 Enlarged view of point C in the middle;

[0034] Figure 10 For the present invention Figure 7 Enlarged view of point D in the middle.

[0035] In the figure: 1. backplane body; 101. base plate; 102. module socket; 1021. jack; 103. ventilation hole; 104. power socket; 2. protective mechanism; 201. heat dissipation sleeve; 2011. heat sink; 2012. fixing ear plate; 2013. heat conductive block; 2014. mounting hole; 2015. slide groove; 2016. axis hole; 202. dust cover; 2022. anti-slip rack; 2023. slide rod; 2024. compression spring; 203. first guide frame; 2031. first guide surface; 2032. mounting groove; 2034. support block; 2035. guide roller; 204. second guide frame; 2041. second guide surface; 205. drag-reducing sliding belt; 206. bristles; 3. module plug; 301. protective cover; 302. pin. DETAILED DESCRIPTION

[0036] Example 1

[0037] See also Figures 1-10 , a modular PLC backplane structure, comprising a backplane body 1, on which a protection mechanism 2 is provided;

[0038] The backplane body 1 includes a base plate 101, a modular socket 102 and a power socket 104. The modular sockets 102 are arranged in an equidistant array on the base plate 101. The power socket 104 is installed on the base plate 101 to supply power to the modular socket 102.

[0039] The protective mechanism 2 includes a heat dissipation sleeve 201, a dust cover 202, a first guide frame 203 and a second guide frame 204. The heat dissipation sleeve 201 is sleeved on the outside of the module socket 102 and fixedly installed on the substrate 101. The dust cover 202 is movably installed on the protective sleeve 301. The first guide frame 203 is fixedly installed on the upper end surface of the dust cover 202. The second guide frame 204 is fixedly installed on the heat dissipation sleeve 201.

[0040] Furthermore, the upper end face of the heat dissipation sleeve 201 is provided with a mounting hole 2014 which passes through the lower end face, and the dust cover 202 is mirror-mounted on the left and right sides of the upper end face of the mounting hole 2014. The edge of the upper end face of the heat dissipation sleeve 201 is provided with a slide groove 2015, and the bottom of the dust cover 202 is provided with a slide rod 2023 which slides with the slide groove 2015. The side wall of the slide groove 2015 is provided with an axial hole 2016 which cooperates with the slide rod 2023. A compression spring 2024 is provided on the slide rod 2023. The dust cover 202 and the heat dissipation sleeve 201 are elastically slidably connected through the slide rod 2023 and the compression spring 2024.

[0041] Under the action of the compression spring 2024, the dust cover 202 closes toward the center of the upper end surface of the installation slot 2032, thereby blocking the upper end surface of the installation slot 2032, preventing dust from falling into the module socket 102 when not in use, causing dust to fall into the socket 1021 of the module socket 102. When the module socket 102 is in use, it affects the electrical connection between the module plug 3 and the module socket 102, resulting in poor contact of the equipment.

[0042] Furthermore, the first guide frame 203 is fixedly mounted on the front and rear sides of the upper end surface of the dust cover 202 . The upper end surface of the first guide frame 203 is provided with a first guide surface 2031 . The angle between the first guide surface 2031 and the horizontal plane is forty-five degrees.

[0043] The first guide frame 203 guides the module plug 3 in the horizontal direction so that the module plug 3 can be aligned horizontally with the module socket 102 when pressed down, and a horizontal component force can be generated on the dust cover 202 during the pressing process, so that it presses the compression spring 2024 to slide outward, automatically opening the mounting hole 2014, and facilitating the docking of the module plug 3 and the module socket 102.

[0044] Furthermore, an installation groove 2032 is provided on the first guide surface 2031, a support block 2034 is provided in the installation groove 2032, and guide rollers 2035 rotatably connected to the first guide frame 203 are provided at the upper and lower ends of the support block 2034, and the outer ends of the guide roller 2035 and the support block 2034 are provided with a resistance-reducing sliding belt 205.

[0045] By providing a resistance-reducing sliding strip 205 on the upper end surface of the first guide frame 203, the frictional resistance between the module plug 3 and the first guide frame 203 bracket is reduced, thereby improving the smoothness of the module plug 3 when inserted, and reducing the wear between the module plug 3 and the first guide frame 203, thereby increasing the service life of the equipment.

[0046] Furthermore, the second guide frame 204 is mounted on the front and rear sides of the protective cover 301 in a mirror-symmetrical manner. A second guide surface 2041 is provided on the top of the second guide frame 204 , and the angle between the second guide surface 2041 and the horizontal plane is 60 degrees.

[0047] The module plug 3 is guided by the second guide frame 204 so that when the module plug 3 slides down along the second guide surface 2041, it is aligned with the longitudinal center of the heat dissipation sleeve 201, thereby facilitating the docking installation of the pin 302 and the socket 1021 without shaking for trial and error to avoid bending of the pin 302.

[0048] Furthermore, the upper end surface of the dust cover 202 is a bevel structure, and the edge of the upper end surface of the dust cover 202 is provided with bristles 206. The angle between the bristles 206 and the upper end surface of the dust cover 202 is 120 degrees, and the bristles 206 are made of stainless steel.

[0049] The upper end surface of the dust cover 202 is set to an inclined structure, so that dust or other stains accumulated on the surface of the dust cover 202 can slide to both sides under the action of gravity, thereby preventing dust from falling into the module socket 102 after the dust cover 202 is opened. Stainless steel bristles 206 are set on the upper end surface of the dust cover 202, so that when the module socket 102 is inserted, the internal pins 302 and the bristles 206 can generate contact friction, thereby removing the oxide layer on the surface of the pins 302 and improving the conductive effect. The inclined structure of the bristles 206 allows the bristles 206 to automatically slide off under the pressure of the protective sleeve 301, thereby preventing the bristles 206 from getting stuck on the inner end surface of the protective sleeve 301.

[0050] Furthermore, a heat sink 2011 is provided on the outer end surface of the heat dissipation sleeve 201 , and a heat conducting block 2013 is provided at the bottom of the inner end surface of the mounting hole 2014 to fit with the module socket 102 . The heat dissipation sleeve 201 is made of aluminum nitride ceramic.

[0051] The heat of the module socket 102 is guided to the protective sleeve 301 for heat dissipation through the heat conductive block 2013. The heat sink 2011 increases the heat dissipation area of ​​the protective sleeve 301. The protective sleeve 301 made of aluminum nitride ceramic has good insulation and thermal conductivity, and excellent wear resistance, which effectively prevents the equipment from spontaneously combusting due to excessive resistance at the joint and severe heat generation.

[0052] Furthermore, the side end surface of the dust cover 202 is evenly provided with anti-slip racks 2022, and the anti-slip racks 2022 are made of rubber material.

[0053] The anti-slip rack 2022 squeezes the side surface of the module plug 3 under the action of the compression spring 2024, and increases the friction between the dust cover 202 and the module plug 3 through the anti-slip rack 2022, thereby preventing the module plug 3 from loosening and falling, and improving the stability of the module plug 3.

[0054] Furthermore, a fixing ear plate 2012 is provided at the bottom of the side end surface of the heat dissipation sleeve 201 , and a ventilation hole 103 is provided on the side end surface of the base plate 101 .

[0055] The heat dissipation sleeve 201 is fixed to the substrate 101 by inserting bolts into the fixing ear plate 2012 to prevent the heat dissipation sleeve 201 from loosening. By setting ventilation holes 103 on the side end surface of the substrate 101, air can circulate on the left and right sides of the substrate 101, and at the same time, the contact area between the substrate 101 and the air is increased, further improving the heat dissipation effect.

[0056] Example 2

[0057] See also Figures 1-10 A method for using a modular PLC backplane structure includes the following steps:

[0058] Step 1, installation preparation, first, place the backplane body 1 in the pre-planned position of the equipment rack, use bolts to pass through the fixing ear plate 2012 at the bottom of the side end face of the heat dissipation sleeve 201 in sequence, and tighten it with the corresponding screw holes on the base plate 101 to ensure that the heat dissipation sleeve 201 is firmly installed on the base plate 101, so that the backplane body 1 forms a reliable connection with the equipment rack to prevent loosening or displacement during subsequent use that affects the operation of the equipment. At the same time, carefully check the ventilation holes 103 on the side end face of the base plate 101, and use tools to clean the dust and debris that may exist in the ventilation holes 103 to ensure that the ventilation holes 103 are unobstructed, thereby creating a good ventilation environment and laying the foundation for efficient heat dissipation of the backplane during operation. In addition, the surface of the dust cover 202 needs to be simply cleaned. Use a clean soft cloth to wipe the dust cover 202 to remove dust and stains that may exist on the surface to prevent these impurities from falling into the module socket 102 during the opening and closing process of the dust cover 202;

[0059] Step 2: Insert the module. Hold the module plug 3 and use the second guide surface 2041 at a 60-degree angle on the top of the second guide frame 204 to guide the module plug 3 in the longitudinal direction so that it is aligned with the center of the heat dissipation sleeve 201. When it slides to the first guide frame 203, the module plug 3 slowly slides down along the first guide surface 2031 of the first guide frame 203. Since the first guide surface 2031 is at a 45-degree angle to the horizontal plane, the first guide frame 203 will accurately guide the module plug 3 in the horizontal direction during the sliding process so that it is gradually aligned with the module socket 102 in the horizontal direction. As the modular plug 3 is pressed downward, the horizontal force generated by it acts on the slide rod 2023 at the bottom of the dust cover 202, forcing the slide rod 2023 to slide in the slide groove 2015 on the upper end surface of the heat dissipation sleeve 201, compressing the compression spring 2024 sleeved on the slide rod 2023, thereby moving the dust cover 202 to the sides, automatically opening the mounting hole 2014 of the heat dissipation sleeve 201, ensuring that the pins 302 of the modular plug 3 can be accurately aligned with the sockets 1021 of the modular socket 102. Finally, the modular plug 3 is smoothly and slowly inserted into the modular socket 102, completing the reliable connection between the module and the backplane;

[0060] Step 3, auxiliary heat dissipation. During the operation of the equipment, the module socket 102 on the back panel will generate heat during operation. At this time, the heat-conducting block 2013 at the bottom of the inner end surface of the mounting hole 2014 and the module socket 102 will quickly conduct the heat generated by the module socket 102 to the heat dissipation sleeve 201. Since the heat dissipation sleeve 201 is made of aluminum nitride ceramic, it has good thermal conductivity. Heat can be quickly diffused on the heat dissipation sleeve 201. At the same time, the heat sink 2011 provided on the outer end surface of the heat dissipation sleeve 201 further increases the heat dissipation area, accelerates the heat exchange between heat and the outside air, and continuously conducts and dissipates the heat outward, thereby achieving auxiliary heat dissipation for the module socket 102, effectively reducing the temperature of the module socket 102 and surrounding components, preventing equipment performance degradation and malfunction due to excessive temperature, and ensuring long-term stable operation of the equipment.

[0061] Step 4. Remove the module. When you need to remove the module, first press both sides of the dust cover 202 with your fingers, manually push the dust cover 202 outward, compress the compression spring 2024, and slide the dust cover 202 outward along the slide groove 2015 to fully open the mounting hole 2014 of the heat dissipation sleeve 201. Then, hold the module plug 3, keep it steady, and pull it out slowly and evenly in the opposite direction of insertion. During the removal process, avoid excessive force or direction deviation to prevent damage to the pins 302 of the module plug 3 or the socket 1021 of the module socket 102. When the module plug 3 is completely pulled out, the dust cover 202 automatically closes under the elastic force of the compression spring 2024, re-covering the mounting hole 2014 to prevent dust from entering the module socket 102.

[0062] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A modular PLC backplane structure, comprising a backplane body (1), characterized in that: A protective mechanism (2) is provided on the backboard body (1); The backplane body (1) comprises a substrate (101), a modular socket (102) and a power socket (104); the modular sockets (102) are arranged in an equidistant array on the substrate (101); and the power socket (104) is mounted on the substrate (101) to supply power to the modular sockets (102); The protective mechanism (2) comprises a heat dissipation sleeve (201), a dust cover (202), a first guide frame (203) and a second guide frame (204); the heat dissipation sleeve (201) is sleeved on the outside of the module socket (102) and fixedly mounted on the base plate (101); the dust cover (202) is movably mounted on the protective sleeve (301); the first guide frame (203) is fixedly mounted on the upper end surface of the dust cover (202); and the second guide frame (204) is fixedly mounted on the heat dissipation sleeve (201).

2. A modular PLC backplane structure according to claim 1, characterized in that: The upper end face of the heat dissipation sleeve (201) is provided with a mounting hole (2014) which is in communication with the lower end face; the dust cover (202) is mirror-mounted on the left and right sides of the upper end face of the mounting hole (2014); the edge of the upper end face of the heat dissipation sleeve (201) is provided with a slide groove (2015); the bottom of the dust cover (202) is provided with a slide rod (2023) which is slidably matched with the slide groove (2015); the side wall of the slide groove (2015) is provided with an axial hole (2016) which is matched with the slide rod (2023); a compression spring (2024) is sleeved on the slide rod (2023); the dust cover (202) and the heat dissipation sleeve (201) are elastically slidably connected through the slide rod (2023) and the compression spring (2024).

3. The modular PLC backplane structure according to claim 1, wherein: The first guide frame (203) is fixedly mounted on the front and rear sides of the upper end surface of the dust cover (202); the upper end surface of the first guide frame (203) is provided with a first guide surface (2031); and the angle between the first guide surface (2031) and the horizontal plane is forty-five degrees.

4. A modular PLC backplane structure according to claim 3, characterized in that: The first guide surface (2031) is provided with a mounting groove (2032), a support block (2034) is provided in the mounting groove (2032), and guide rollers (2035) rotatably connected to the first guide frame (203) are provided at the upper and lower ends of the support block (2034), and the outer ends of the guide roller (2035) and the support block (2034) are provided with a resistance-reducing sliding belt (205).

5. The modular PLC backplane structure according to claim 1, wherein: The second guide frame (204) is mounted on the front and rear sides of the protective sleeve (301) in a mirror-symmetrical manner. A second guide surface (2041) is provided on the top of the second guide frame (204), and the angle between the second guide surface (2041) and the horizontal plane is sixty degrees.

6. The modular PLC backplane structure according to claim 1, wherein: The upper end surface of the dust cover (202) is a bevel structure, and the edge of the upper end surface of the dust cover (202) is provided with bristles (206). The axial direction of the bristles (206) and the upper end surface of the dust cover (202) form an angle of one hundred and twenty degrees, and the bristles (206) are made of stainless steel.

7. The modular PLC backplane structure according to claim 2, wherein: The outer end surface of the heat dissipation sleeve (201) is provided with a heat dissipation fin (2011), the bottom of the inner end surface of the mounting hole (2014) is provided with a heat conduction block (2013) that fits with the module socket (102), and the heat dissipation sleeve (201) is made of aluminum nitride ceramics.

8. The modular PLC backplane structure according to claim 1, wherein: The side end surface of the dust cover (202) is evenly provided with anti-skid racks (2022), and the anti-skid racks (2022) are made of rubber material.

9. The modular PLC backplane structure according to claim 1, wherein: A fixing ear plate (2012) is provided at the bottom of the side end surface of the heat dissipation sleeve (201), and a ventilation hole (103) is provided at the side end surface of the base plate (101).

10. A method for using a modular PLC backplane structure, applicable to a modular PLC backplane structure according to any one of claims 1 to 9, characterized in that: The following steps are involved: Step 1: Installation preparation: firmly install the heat dissipation sleeve (201) on the base plate (101), ensure that the back plate is firmly installed, and simply clean the surface of the dust cover (202); Step 2: Insert the module. Hold the module plug (3) and insert it into the protective cover (301), so that it squeezes the dust cover (202), causing the dust cover (202) to move to both sides and open automatically. Step 3, auxiliary heat dissipation, the heat generated by the module socket (102) is conducted outwards through the heat dissipation sleeve (201) to perform auxiliary heat dissipation; Step 4: Remove the module. Manually push the dust covers (202) on both sides outwards, hold the module plug (3), and pull it out smoothly and forcefully in the opposite direction of insertion.

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