Integrated inverter brick

Abstract

The invention relates to the technical field of inversion bricks, in particular to an integrated inversion brick. The integrated inversion brick comprises a base assembly, a capacitor assembly, a bleeder resistor, a heat dissipation substrate, a power module and a circuit board. The capacitor assembly comprises a thin-film capacitor and an output end. And an X capacitor and a Y capacitor are integrated in the thin film capacitor. The bleeder resistor is arranged in the resistor containing groove and penetrates through the base through an electric wire to be packaged with the thin-film capacitor, and the space of the bottom of the base is fully utilized. The power module includes a substrate, a housing, a positive power terminal, a negative power terminal, and an output terminal. The housing is provided with a through hole, and the output terminal is provided with a detection hole. One end of the current sensor is arranged on the circuit board, the other end of the current sensor penetrates through the through hole and is inserted into the detection hole, the current sensor is arranged in the output terminal in an insertion mode, the overall structure is reduced, and installation is convenient.

Description

Technical Field

[0001] The present invention relates to the technical field of inverter bricks, and in particular to an integrated inverter brick. Background Art

[0002] An inverter brick is a power module primarily used to convert low-voltage DC power into controllable AC power. It consists of multiple power transistors and control circuits, enabling high-efficiency and high-density power conversion. This device is particularly suitable for applications requiring extremely high efficiency, density, and controllability, such as electric vehicles, ships, and rail transportation. Prior art inverter bricks include the inverter disclosed in application number CN114844371A and an electric drive assembly having the same. The inverter includes a housing, a positive charging harness, and a negative charging harness. The negative charging harness is connected to and secured to the power battery via a DC busbar connector located within the accommodating cavity, while the positive charging harness is connected to and secured to the three-phase motor via a three-phase four-wire connector located within the accommodating cavity. This allows the positive and negative charging harnesses to be integrated into the inverter, ensuring that both the positive and negative charging harnesses are drawn from the inverter, with both ends connected to the same device. However, the use of high-voltage wiring harnesses to connect the various parts of the inverter will result in low integration of the inverter bricks. The large number of connecting parts such as copper busbars makes the overall weight very heavy, which is not conducive to modular design. Summary of the Invention

[0003] In view of this, the present invention provides an integrated inverter brick to solve the above technical problems.

[0004] An integrated inverter brick comprises a base assembly, a capacitor assembly disposed on the base assembly, a bleeder resistor disposed on the base assembly, a heat sink substrate disposed on the base assembly, a power module disposed on the heat sink substrate, and a circuit board disposed on the power module. The capacitor assembly comprises a thin film capacitor disposed on the base assembly, and two rows of output terminals disposed on the thin film capacitor. The thin film capacitor is integrated with an X capacitor and two Y capacitors. A resistor accommodating slot is disposed at the bottom of the base. The bleeder resistor is disposed in the resistor accommodating slot and is packaged with the thin film capacitor via wires passing through the base. The power module comprises a base plate, a housing disposed on the base assembly, a positive power terminal disposed on the housing assembly, a negative power terminal disposed on the housing assembly, and an output terminal disposed on the base assembly. A through hole is disposed at one end of the housing near the output terminal, and a detection hole is disposed on the output terminal at a position corresponding to the position of the through hole. The circuit board is disposed on the capacitor assembly and the power module. A plurality of current sensors are provided at one end of the circuit board close to the through hole, one end of the current sensor is provided on the circuit board, and the other end passes through the through hole and is vertically inserted into the detection hole. The current sensor is located in the detection hole of the output terminal and is spaced apart from the hole wall of the detection hole.

[0005] Furthermore, the base assembly includes a base, a capacitor accommodating groove arranged on the base, a flow channel arranged on the base, and two inlets and outlets arranged on the base, the two ends of the flow channel are respectively connected to the two inlets and outlets, and the substrate has a structure with copper layers on the upper and lower surfaces and an insulating layer in the middle.

[0006] Furthermore, the inlet and outlet are L-shaped channels, one end of the inlet and outlet is connected to the bottom of the base, and the other end is connected to the flow channel.

[0007] Furthermore, the heat dissipation substrate is arranged on the base and covers the flow channel, and a plurality of heat dissipation columns are arranged in an array on the end surface of the heat dissipation substrate facing the flow channel.

[0008] Furthermore, the power module further includes a plurality of chips arranged on the substrate, a positive power terminal arranged on the housing, and a negative power terminal arranged on the housing.

[0009] Furthermore, the positive power terminal and the negative power terminal are located at one end of the substrate close to the capacitor assembly, and the output terminal is located at the other end of the substrate. One end of the positive power terminal and the negative power terminal are respectively welded to the output end of the capacitor assembly, and the other end of the positive power terminal and the negative power terminal are connected to the upper copper layer of the substrate.

[0010] Compared with the prior art, the thin film capacitor of the integrated inverter brick provided by the present invention is integrated with an X capacitor and two Y capacitors. Integrating the two together can reduce the number of external components. The capacitor installation can be completed by directly placing the thin film capacitor in the capacitor receiving groove, thereby reducing the volume and weight of the system and making it convenient for users to use. A resistor receiving groove is provided at the bottom of the base. The discharge resistor is provided in the resistor receiving groove and is packaged with the thin film capacitor through the base through an electric wire, so that the discharge resistor is provided at the bottom of the base, making full use of the space at the bottom of the base and reducing the overall volume space. One end of the current sensor is provided on the circuit board, and the other end is passed through the through hole and vertically inserted into the detection hole. The current sensor is located in the detection hole of the output terminal and is spaced apart from the hole wall of the detection hole, so that the current sensor can be directly provided in the output terminal by plugging, avoiding the use of a transfer copper bus for connection, reducing the overall structure, and facilitating installation. In summary, the integrated inverter brick has a compact overall structure and a complete modular design. Users can directly install and connect it for use, eliminating a lot of connecting copper buses and transfer copper buses, and being lighter in weight. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a structural schematic diagram of an integrated inverter brick provided by the present invention.

[0012] Figure 2 for Figure 1 Schematic diagram of the structure of the integrated inverter brick without the circuit board.

[0013] Figure 3 for Figure 1 Schematic diagram of the structure of the integrated inverter brick from another angle.

[0014] Figure 4 for Figure 1 Schematic diagram of the decomposed structure of the integrated inverter brick.

[0015] Figure 5 for Figure 1 Schematic diagram of the structure of the power module of the integrated inverter brick.

[0016] Explanation of the accompanying figures: base assembly 10, capacitor assembly 20, bleeder resistor 30, heat dissipation substrate 40, power module 50, circuit board 60, base 11, resistor accommodating groove 111, capacitor accommodating groove 12, flow channel 13, inlet and outlet 14, thin film capacitor 21, output end 22, substrate 51, chip 52, housing 53, positive power terminal 54, negative power terminal 55, output terminal 56, through hole 531, detection hole 561, current sensor 61. DETAILED DESCRIPTION

[0017] The following is a further detailed description of specific embodiments of the present invention. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the scope of protection of the present invention.

[0018] like Figures 1 to 5 , which is a schematic diagram of the structure of the integrated inverter brick provided by the present invention. The integrated inverter brick includes a base assembly 10, a capacitor assembly 20 disposed on the base assembly 10, a bleeder resistor 30 disposed on the base assembly 10, a heat dissipation substrate 40 disposed on the base assembly 10, a power module 50 disposed on the heat dissipation substrate 40, and a circuit board 60 disposed on the power module 50. It is conceivable that the integrated inverter brick also includes other functional modules, such as connection components and mounting components, etc., which are well known to those skilled in the art and will not be described in detail here.

[0019] The base assembly 10 includes a base 11 , a capacitor receiving slot 12 disposed on the base 11 , a flow channel 13 disposed on the base 11 , and two inlets and outlets 14 disposed on the base 11 .

[0020] The base 11 is used to support the aforementioned functional modules. The capacitor receiving slot 12 and the flow channel 13 are located on the end surface of the base 11 facing the heat dissipation substrate 40. The capacitor receiving slot 12 is used to accommodate the capacitor assembly 20. The flow channel 13 is used to flow the coolant, and the two ends of the flow channel 13 are respectively connected to the two inlets and outlets 14.

[0021] The inlet and outlet 14 is located on the end face of the base 11 away from the heat dissipation substrate 40. The inlet and outlet 14 is an L-shaped channel, and the two inlets and outlets 14 serve as a water outlet and a water inlet respectively. One end of the inlet and outlet 14 is connected to the bottom of the base 11, and the other end is connected to the flow channel 13, so that the coolant flows into the flow channel 13 through one inlet and outlet 14, and then flows out through the other inlet and outlet 14, so as to exchange heat with the power module 50 through the coolant. At the same time, the position of the inlet and outlet 14 at the bottom of the base 11 can reduce the floor space. Compared with the solution in which the inlet and outlet 14 are located on both sides of the base 11, the water pipes connected to the inlet and outlet 14 will be inserted from both sides, resulting in the water pipes on both sides taking up space. In addition, since the inlet and outlet 14 is an L-shaped channel, it is difficult to directly form it during processing. It is necessary to perform two drilling processes in directions perpendicular to each other, and then block the holes on both sides. Its processing method should be the existing technology and will not be repeated here.

[0022] The capacitor assembly 20 includes a thin film capacitor 21 arranged on the base 11, and two rows of output terminals 22 arranged on the thin film capacitor 21. The thin film capacitor 21 is fixed in the capacitor receiving groove 12 by potting glue. The potting fixation improves the stability of the capacitor assembly 20 structure, so that the capacitor assembly 20 has a high vibration resistance and good corrosion resistance, dust resistance and moisture resistance. The thin film capacitor 21 is integrated with an X capacitor and two Y capacitors. The X capacitor is connected to the positive and negative terminals and is used to eliminate differential mode interference. The Y capacitor is connected between the positive or negative terminal and the ground wire to eliminate common mode interference. The X capacitor and the Y capacitor protect other components in the circuit from interference by suppressing power supply electromagnetic interference and common mode interference, thereby improving the stability and reliability of the circuit. At the same time, integrating the two can reduce the number of external components. The film capacitor 21 can be directly placed in the capacitor receiving groove 12 to complete the capacitor installation, thereby reducing the volume and weight of the system and facilitating user use. The output terminal 22 is used to connect the thin film capacitor 21 and the power module 50 to achieve circuit circulation.

[0023] The base 11 has a resistor accommodating slot 111 at its bottom. The bleeder resistor 30 is disposed in the resistor accommodating slot 111 and is packaged with the thin film capacitor 21 via a wire passing through the base 11. This arrangement reduces the footprint of the base 11, fully utilizing the space and reducing the overall volume, compared to the prior art where the bleeder resistor is disposed at the top of the base 11 and connected to the capacitor via a copper busbar. The bleeder resistor 30 primarily discharges the parasitic capacitance charge between the GS electrodes of the power device to protect the power device and ensure proper operation of the half-bridge function.

[0024] The heat sink 40 is secured to the base 11 with fasteners, covering the flow channel 13. A sealing ring or other device seals the gap between the flow channel 13 and the heat sink 40, forming a sealed channel for coolant flow. The heat sink 40 has a plurality of heat sink posts (not shown) arranged in an array on the end surface facing the flow channel 13. These posts exchange heat with the coolant as it flows, increasing the heat exchange area and thus improving the heat dissipation effect.

[0025] The number of power modules 50 is determined based on actual needs. In this embodiment, there are three power modules 50. The three power modules 50 have the same structure, and each power module 50 includes a substrate 51, multiple chips 52 disposed on the substrate 51, a housing 53 disposed on the substrate 51, a positive power terminal 54 disposed on the housing 53, a negative power terminal 55 disposed on the housing 53, and an output terminal 56 disposed on the substrate 51.

[0026] The substrate 51 has a structure with copper layers on the upper and lower surfaces and an insulating layer in the middle. The insulating layer is ceramic. The substrate 51 itself is prior art and will not be described in detail here. The lower copper layer of the substrate 51 facing the heat dissipation substrate 40 is used for soldering to the heat dissipation substrate 40 using tin sheets or solder paste, while the upper copper layer facing away from the heat dissipation substrate 40 is used to arrange various electronic components such as chips 52, positive power terminals 54, etc. In power electronic module technology, the substrate 51 mainly serves as a carrier for various electronic components. It should be prior art and will not be described in detail here.

[0027] The chips 52 are arrayed on the upper copper layer of the substrate 51. The chips 52 themselves should be prior art, and their structure and working principle will not be described in detail here.

[0028] The housing 53 is a rectangular frame structure. A through hole 531 is provided at one end of the housing 53 close to the output terminal 56 . The through hole 531 is used to pass a current sensor described below so that the current sensor can extend into the output terminal 56 .

[0029] The positive power terminal 54 and the negative power terminal 55 are located at one end of the substrate 51 close to the capacitor assembly 20, and the output terminal 56 is located at the other end of the substrate 51. One end of the positive power terminal 54 and the negative power terminal 55 are respectively welded to the output end 22 of the capacitor assembly 20, thereby avoiding the need to punch holes in the terminals and connect them with fasteners, reducing the use of parts. The other ends of the positive power terminal 54 and the negative power terminal 55 are connected to the upper copper layer of the substrate 51. One end of the output terminal 56 is connected to the upper copper layer of the substrate 51, and the other end is used to connect to external electronic components. The output terminal 56 is provided with a detection hole 561 whose position corresponds to the position of the through hole 531. The detection hole 561 is used to insert the following current sensor to detect the current. The specific description will be explained below in conjunction with the current sensor.

[0030] The circuit board 60 is arranged on the capacitor assembly 20 and the power module 50 through fasteners. The control circuit, drive circuit and other circuit modules of the inverter brick are arranged on the circuit board 60. The circuit board 60 serves as the control center of the entire inverter brick and is responsible for receiving, processing and sending control signals. The control circuit and the drive circuit are integrated into the circuit board 60. At the same time, the circuit board 60 also encapsulates the top of the capacitor assembly 20 and the power module 50, avoiding the top cover structure of the circuit module in the inverter system in the prior art, simplifying the overall design, reducing the complexity of the assembly of the integrated inverter brick and the difficulty of maintenance, and facilitating customization and replacement.

[0031] A plurality of current sensors 61 are provided at one end of the circuit board 60 close to the through hole 531. The current sensor 61 is a magnetic field sensor such as a Hall current sensor. One end of the current sensor 61 is provided on the circuit board 60, and the other end is passed through the through hole 531 and vertically inserted into the detection hole 561. The current sensor 61 is located in the detection hole 561 of the output terminal 56 and is spaced apart from the hole wall of the detection hole 561, so that the current sensor 61 can be directly set in the output terminal 56 by plugging it in, avoiding the use of a transfer copper bus for connection, reducing the overall structure, and facilitating installation. The current sensor 61 can also be plugged in at the same time as the circuit board 60 is installed. The detection principle of the current sensor 61 should be the existing technology, which measures the current by converting the magnitude and direction of the magnetic field into the magnitude and direction of the voltage.

[0032] Compared to the prior art, the thin-film capacitor 21 of the integrated inverter brick provided by the present invention integrates an X capacitor and two Y capacitors. Integrating the two can reduce the number of external components. The thin-film capacitor 21 can be directly placed in the capacitor receiving slot 12 to complete the capacitor installation, thereby reducing the volume and weight of the system and facilitating user use. A resistor receiving slot 111 is provided at the bottom of the base 11. The bleeder resistor 30 is disposed in the resistor receiving slot 111 and is packaged with the thin-film capacitor 21 via wires passing through the base 11. Thus, the bleeder resistor 30 is disposed at the bottom of the base 11, fully utilizing the space at the bottom of the base 11 and reducing the overall volume. One end of the current sensor 61 is set on the circuit board 60, and the other end is passed through the through hole 531 and vertically inserted into the detection hole 561. The current sensor 61 is located in the detection hole 561 of the output terminal 56 and is spaced apart from the hole wall of the detection hole 561, so that the current sensor 61 can be directly set in the output terminal 56 by plugging, avoiding the use of adapter copper bars for connection, reducing the overall structure, and facilitating installation. In summary, the integrated inverter brick has a compact overall structure and a complete modular design. Users can directly install and connect it for use, eliminating many connecting copper bars and adapter copper bars, and are lighter in weight.

[0033] The above are only preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent replacements or improvements within the spirit of the present invention are included in the scope of the claims of the present invention.

Claims

1. An integrated inverter brick, characterized by: The integrated inverter brick includes a base component, a capacitor component arranged on the base component, a bleeder resistor arranged on the base component, a heat dissipation substrate arranged on the base component, a power module arranged on the heat dissipation substrate, and a circuit board arranged on the power module. The capacitor component includes a film capacitor arranged on the base and two rows of output terminals arranged on the film capacitor. The film capacitor is integrated with an X capacitor and two Y capacitors. A resistor accommodating groove is provided at the bottom of the base. The bleeder resistor is arranged in the resistor accommodating groove and is packaged with the film capacitor through a wire passing through the base. The power module includes a substrate. A shell is arranged on the substrate, a positive power terminal is arranged on the shell, a negative power terminal is arranged on the shell, and an output terminal is arranged on the substrate, a through hole is arranged at one end of the shell close to the output terminal, a detection hole is arranged on the output terminal at a position corresponding to the position of the through hole, the circuit board is arranged on the capacitor assembly and the power module, a plurality of current sensors are arranged at one end of the circuit board close to the through hole, one end of the current sensor is arranged on the circuit board, and the other end is passed through the through hole and vertically inserted into the detection hole, the current sensor is located in the detection hole of the output terminal and is spaced apart from the hole wall of the detection hole.

2. The integrated inverter brick according to claim 1, characterized in that: The base assembly includes a base, a capacitor accommodating groove arranged on the base, a flow channel arranged on the base, and two inlets and outlets arranged on the base. The two ends of the flow channel are respectively connected to the two inlets and outlets. The substrate has a structure with copper layers on the upper and lower surfaces and an insulating layer in the middle.

3. The integrated inverter brick according to claim 2, characterized in that: The inlet and outlet are L-shaped channels, one end of the inlet and outlet is connected to the bottom of the base, and the other end is connected to the flow channel.

4. The integrated inverter brick according to claim 2, characterized in that: The heat dissipation substrate is arranged on the base and covers the flow channel. A plurality of heat dissipation columns are arranged in an array on the end surface of the heat dissipation substrate facing the flow channel.

5. The integrated inverter brick according to claim 1, characterized in that: The power module further includes a plurality of chips arranged on the substrate, a positive power terminal arranged on the housing, and a negative power terminal arranged on the housing.

6. The integrated inverter brick according to claim 5, characterized in that: The positive power terminal and the negative power terminal are located at one end of the substrate close to the capacitor assembly, and the output terminal is located at the other end of the substrate. One end of the positive power terminal and the negative power terminal are respectively welded to the output end of the capacitor assembly, and the other end of the positive power terminal and the negative power terminal are connected to the upper copper layer of the substrate.

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