Press and control method thereof

Abstract

The invention provides a press and a control method thereof, and relates to the field of printed circuit boards. The pressing machine comprises a pressing mold, a control piece and a detection piece, the pressing die comprises an upper die and a lower die which are matched with each other, the upper die and the lower die are oppositely arranged in parallel, and the surface, facing the upper die, of the lower die is used for containing a core plate; when the pressing machine is in a pressing state, the upper mold and the lower mold are close to each other and press the core plate; when the press is in a separated state, the upper die and the lower die are far away from each other; the control piece is connected with at least one of the upper die and the lower die, and the control piece is used for controlling the pressing machine to be in a pressing state or a separation state; the detection piece obtains the current state of the pressing mold and is electrically connected with the control end of the control piece. According to the invention, the problem that the yield of the printed circuit board is low due to the fact that the core board is easy to be scrapped in the process of pressing the multi-layer core board through the upper die and the lower die can be solved.

Description

Technical Field

[0001] The present application relates to the field of printed circuit boards, and in particular to a press and a control method thereof. Background Art

[0002] Presses are crucial processing equipment in the printed circuit board (PCB) manufacturing process, laminating multilayer core boards together using adhesive layers to form a laminated structure. These presses typically consist of cooperating upper and lower dies, between which the multilayer core boards are placed. However, during this process, the core boards are prone to failure, resulting in a low yield rate for the PCB. Summary of the Invention

[0003] The embodiments of the present application provide a press and a control method thereof, which are used to solve the problem that the core board is easily scrapped and the yield rate of the printed circuit board is low during the process of pressing the multi-layer core board together through the upper mold and the lower mold.

[0004] In a first aspect, an embodiment of the present application provides a press, comprising a pressing die, a control component, and a detection component;

[0005] The pressing mold includes an upper mold and a lower mold that match each other, the upper mold and the lower mold are arranged parallel to each other, and the surface of the lower mold facing the upper mold is used to hold the core plate;

[0006] When the press is in a pressing state, the upper mold and the lower mold are close to each other and are used to press the core plate; when the press is in a disengaged state, the upper mold and the lower mold are away from each other;

[0007] The control component is connected to at least one of the upper mold and the lower mold, and is used to control the press to be in the pressing state or the disengaging state; the detection component obtains the current state of the pressing mold, and the detection component is electrically connected to the control end of the control component;

[0008] The control component and the detection component are configured such that: when the press is in the pressing state, the detection component detects that the distance between the upper die and the lower die is greater than a set distance, the detection component outputs a first signal to the control component, and the control component controls the upper die and the lower die to move closer to each other;

[0009] And / or, the control member and the detection member are configured as follows: when the detection member obtains that the time when the press is in the pressing state is greater than the set time, the detection member outputs a second signal to the control member, and the control member controls the upper mold and the lower mold to move away from each other.

[0010] By adopting the above technical solution, in the process of pressing the multi-layer core board together by the upper mold and the lower mold, the multi-layer core board can be placed between the upper mold and the lower mold, and then the press is controlled by the control component to be in a pressing state, and the control component controls the upper mold and the lower mold to approach each other so that the surface of the multi-layer core board facing away from the lower mold can abut against the upper mold, thereby realizing the pressing of the multi-layer core board by the cooperation between the upper mold and the lower mold;

[0011] When the press is in a pressing state, the detection component obtains that the distance between the upper die and the lower die is greater than the set distance, and the pressing force of the upper die and the lower die on the multi-layer core board is small. The detection component outputs a first signal to the control component, and the control component controls the upper die and the lower die to move closer to each other, so that the distance between the upper die and the lower die is reduced, thereby ensuring the pressing effect of the multi-layer core board and reducing the possibility of scrapping the core board;

[0012] When the press is in the pressing state for a time greater than the set time, the pressing time of the upper and lower dies on the multi-layer core board is long, and the core board is prone to over-pressure and other conditions. The detection component outputs a second signal to the control component, and the control component controls the upper and lower dies to move away from each other, thereby reducing the possibility of over-pressure and other conditions on the core board, reducing the possibility of core board scrapping, and improving the yield rate of printed circuit boards.

[0013] In some possible implementations, the detection member is configured as a position sensor, and the position sensor detects the distance between the upper mold and the lower mold;

[0014] The position sensor is arranged on a surface of the lower mold facing the upper mold, or the position sensor is arranged on a surface of the upper mold facing the lower mold.

[0015] In some possible implementations, the press includes a travel switch; the travel switch is electrically connected to the control member, and the travel switch is used to drive the upper mold and the lower mold to move closer to or away from each other;

[0016] The time during which the press is in the pressing state is equal to the set time, and the travel switch drives the upper die and the lower die to move away from each other.

[0017] In some possible implementations, the press is further provided with a vacuum chamber, wherein the vacuum chamber accommodates the upper mold and the lower mold;

[0018] The press is provided with a vacuum pump, which is connected to the vacuum chamber and is used to form a negative pressure state in the vacuum chamber.

[0019] In some possible implementations, the control element is electrically connected to a control end of the vacuum pump;

[0020] The detection component detects that the time for which the press is in the pressing state is greater than a set time, and the control component controls the vacuum pump to be turned off.

[0021] In some possible implementations, the press is further provided with a circulating heating system;

[0022] The circulation heating system includes a circulation passage filled with a heating medium, and the circulation passage is provided in at least one of the upper mold and the lower mold.

[0023] In some possible implementations, the press further includes a prompting member electrically connected to the control member;

[0024] When the detecting element outputs the first signal to the controlling element, the prompting element issues a prompt; and / or when the detecting element outputs the second signal to the controlling element, the prompting element issues a prompt.

[0025] In a second aspect, an embodiment of the present application provides a control method for a press, wherein the press includes a pressing mold, a control component, and a detection component, wherein the pressing mold includes a matching upper mold and a lower mold, and the control method includes:

[0026] Controlling the upper die and the lower die to approach each other so that the press is in a pressing state;

[0027] Obtaining the distance between the upper die and the lower die through the detection member;

[0028] If the distance between the upper mold and the lower mold is greater than a set distance, the control component controls the upper mold and the lower mold to move closer to each other;

[0029] and / or, obtaining the time during which the press is in the pressing state through the detection member;

[0030] If the time that the press is in the pressing state is greater than a set time, the control component controls the upper mold and the lower mold to move away from each other.

[0031] By adopting the above technical solution, in the process of pressing the multi-layer core board together by the upper mold and the lower mold, the multi-layer core board can be placed between the upper mold and the lower mold, and then the press is controlled by the control component to be in a pressing state, and the control component controls the upper mold and the lower mold to approach each other so that the surface of the multi-layer core board facing away from the lower mold can abut against the upper mold, thereby realizing the pressing of the multi-layer core board by the cooperation between the upper mold and the lower mold;

[0032] When the press is in a pressing state, the detection component obtains that the distance between the upper die and the lower die is greater than the set distance, and the pressing force of the upper die and the lower die on the multi-layer core board is small. The detection component outputs a first signal to the control component, and the control component controls the upper die and the lower die to move closer to each other, so that the distance between the upper die and the lower die is reduced, thereby ensuring the pressing effect of the multi-layer core board and reducing the possibility of scrapping the core board;

[0033] When the press is in the pressing state for a time greater than the set time, the pressing time of the upper and lower dies on the multi-layer core board is long, and the core board is prone to over-pressure and other conditions. The detection component outputs a second signal to the control component, and the control component controls the upper and lower dies to move away from each other, thereby reducing the possibility of over-pressure and other conditions on the core board, reducing the possibility of core board scrapping, and improving the yield rate of printed circuit boards.

[0034] In some possible implementations, the press further includes a travel switch electrically connected to the control element; and the control method further includes:

[0035] If the time that the press is in the pressing state is equal to the set time, the travel switch is controlled to drive the upper mold and the lower mold to move away from each other.

[0036] In some possible implementations, the press is further provided with a vacuum chamber, the vacuum chamber accommodating the upper mold and the lower mold; the press is provided with a vacuum pump, the vacuum pump being connected to the vacuum chamber, and the control method further includes:

[0037] The press is in the pressing state, the time the press is in the pressing state is less than or equal to the set time, and the vacuum pump causes the vacuum chamber to form a negative pressure state;

[0038] If the time that the press is in the pressing state is greater than the set time, the control component controls the vacuum pump to be turned off. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0040] Figure 1 A schematic structural diagram of a press provided in an embodiment of the present application;

[0041] Figure 2 A schematic diagram of the connection of the control components provided in the embodiment of the present application;

[0042] Figure 3 A flow chart of a press control method provided in an embodiment of the present application.

[0043] Description of reference numerals:

[0044] 100. Subject;

[0045] 110. Prompt member; 120. Vacuum chamber; 130. Travel switch;

[0046] 200, pressing mold;

[0047] 210, upper die; 220, lower die;

[0048] 300, test piece;

[0049] 400, control components;

[0050] 500, vacuum pump;

[0051] 600, circulation heating system;

[0052] 700, core board.

[0053] The above drawings illustrate specific embodiments of the present application, which will be described in more detail below. These drawings and the textual description are not intended to limit the scope of the present application in any way, but rather to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments. DETAILED DESCRIPTION

[0054] As described in the background art, a press typically includes an upper mold and a lower mold that cooperate with each other. A multi-layer core panel can be placed between the upper mold and the lower mold to press the multi-layer core panel together. However, during the process of pressing the multi-layer core panel together using the upper mold and the lower mold, the press is in a pressing state, and the distance between the upper mold and the lower mold may be greater than the set distance. The pressing force of the upper mold and the lower mold on the multi-layer core panel is weak, which makes the core panel prone to insufficient pressing.

[0055] When the press is in the pressing state for a longer time than the set time, the upper and lower dies press the multi-layer core board for a long time, and the upper and lower dies are prone to over-pressure on the core board, making the core board prone to damage or even scrapping, resulting in a low yield rate of the printed circuit board.

[0056] In order to solve the above technical problems, the embodiments of the present application provide a press and a control method thereof. In the process of pressing a multi-layer core board together by an upper die and a lower die, the multi-layer core board can be placed between the upper die and the lower die. Then, the press is controlled to be in a pressing state by a control component. The control component controls the upper die and the lower die to approach each other so that the surface of the multi-layer core board facing away from the lower die can abut against the upper die, thereby realizing the pressing of the multi-layer core board by the cooperation between the upper die and the lower die.

[0057] When the press is in a pressing state, the detection component obtains that the distance between the upper die and the lower die is greater than the set distance, and the pressing force of the upper die and the lower die on the multi-layer core board is small. The detection component outputs a first signal to the control component, and the control component controls the upper die and the lower die to move closer to each other, so that the distance between the upper die and the lower die is reduced, thereby ensuring the pressing effect of the multi-layer core board and reducing the possibility of scrapping the core board;

[0058] When the press is in the pressing state for a time greater than the set time, the pressing time of the upper and lower dies on the multi-layer core board is long, and the core board is prone to over-pressure and other conditions. The detection component outputs a second signal to the control component, and the control component controls the upper and lower dies to move away from each other, thereby reducing the possibility of over-pressure and other conditions on the core board, reducing the possibility of core board scrapping, and improving the yield rate of printed circuit boards.

[0059] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, like numbers in different figures represent like or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present application. Instead, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0060] The following specific embodiments describe in detail the technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be repeated in some embodiments. The embodiments of the present application will be described below in conjunction with the accompanying drawings.

[0061] Reference Figure 1 and Figure 2 The embodiment of the present application provides a press, including a main body 100 and a pressing mold 200 disposed on the main body 100. The pressing mold 200 may include a matching upper mold 210 and a lower mold 220. The upper mold 210 and the lower mold 220 are both mounted on the main body 100, and the upper mold 210 and the lower mold 220 are arranged parallel to each other. The surface of the lower mold 220 facing the upper mold 210 is used to hold the multi-layer core board 700.

[0062] At least one of the upper mold 210 and the lower mold 220 can be movably provided on the main body 100 so that the upper mold 210 and the lower mold 220 can be moved closer to or farther away from each other, thereby pressing the multi-layer core board 700 together through the cooperation between the upper mold 210 and the lower mold 220.

[0063] For example, when the press is in the pressing state, the upper mold 210 and the lower mold 220 can be close to each other and used to press the multi-layer core panel 700; when the press is in the disengaged state, the upper mold 210 and the lower mold 220 can be moved away from each other to realize the picking and placing process of the multi-layer core panel 700.

[0064] Exemplarily, the press further includes a control unit 400, which is connected to at least one of the upper die 210 and the lower die 220 and is used to control the press to be in a pressing state or a disengaging state. The press further includes a detection unit 300, which detects the current state of the pressing die 200 and is electrically connected to a control terminal of the control unit 400.

[0065] The control part 400 and the detection part 300 are configured as follows: when the press is in a pressing state, the detection part 300 can obtain that the distance between the upper mold 210 and the lower mold 220 is greater than the set distance, and the detection part 300 outputs a first signal to the control part 400. The control part 400 controls the upper mold 210 and the lower mold 220 to approach each other, so that the distance between the upper mold 210 and the lower mold 220 is reduced, thereby ensuring the pressing effect of the multi-layer core board 700 and reducing the possibility of the core board 700 being scrapped.

[0066] And / or, the control component 400 and the detection component 300 are configured as follows: the detection component 300 can obtain that the time when the press is in the pressing state is greater than the set time, the detection component 300 outputs a second signal to the control component 400, and the control component 400 controls the upper mold 210 and the lower mold 220 to move away from each other, thereby reducing the possibility of overpressure on the core board 700, reducing the possibility of scrapping the core board 700, and improving the yield rate of the printed circuit board.

[0067] It should be noted that the set distance can be determined based on the thickness of the pressed structure formed by the multi-layer core panels 700. When the distance between the upper mold 210 and the lower mold 220 is greater than the set distance, the pressed structure formed by the multi-layer core panels 700 has a poor pressing effect and the connection stability between the multi-layer core panels 700 is poor.

[0068] For example, when the thickness of the pressed structure formed by the multi-layer core panel 700 is set to 1 cm, the set distance can be set within any distance range of 0.9 cm-1 cm or 1 cm-1.1 cm to ensure the pressing effect of the upper mold 210 and the lower mold 220 of the press on the multi-layer core panel 700.

[0069] The set time can be determined based on the time required for the multi-layer core panel 700 to form a pressed structure. If the time the press is in the pressed state is longer than the set time, the upper mold 210 and the lower mold 220 press the multi-layer core panel 700 for a long time, and the press is prone to over-pressing the multi-layer core panel 700, thereby damaging or even rendering the core panel 700 useless.

[0070] Exemplarily, the set time can be set within any time range of 40 seconds to 50 seconds, 50 seconds to 60 seconds, 60 seconds to 70 seconds, and 70 seconds to 80 seconds to reduce the possibility of overvoltage and the like in the multi-layer core panel 700 and reduce the possibility of the core panel 700 being scrapped.

[0071] Reference Figure 1 and Figure 2 In some possible implementations, the detection member 300 can be configured as a position sensor. The position sensor detects the distance between the upper mold 210 and the lower mold 220. The position sensor is disposed on the surface of the lower mold 220 facing the upper mold 210. Alternatively, the position sensor is disposed on the surface of the upper mold 210 facing the lower mold 220.

[0072] When the press is in the pressing state, the control part 400 controls the upper mold 210 and the lower mold 220 to approach each other, and the distance between the upper mold 210 and the lower mold 220 is minimized. For example, the distance between the upper mold 210 and the lower mold 220 can be equal to the set distance so that the upper mold 210 and the lower mold 220 can be used to press the multi-layer core panel 700.

[0073] The position sensor can obtain the distance between the upper mold 210 and the lower mold 220 . When the distance between the upper mold 210 and the lower mold 220 obtained by the position sensor is greater than a set distance, the position sensor can output a first signal to the control component 400 .

[0074] When the press is in the pressing state, when the position sensor obtains that the distance between the upper mold 210 and the lower mold 220 is equal to the set distance, the upper mold 210 and the lower mold 220 can be used to press the multi-layer core board 700; the position sensor starts to obtain the pressing time of the upper mold 210 and the lower mold 220 on the multi-layer core board 700, that is, the time when the press is in the pressing state; when the time when the press is in the pressing state is greater than the set time, the position sensor outputs a second signal to the control part 400.

[0075] It should be noted that the detection part 300 can obtain the distance between the upper mold 210 and the lower mold 220, and the detection part 300 can also obtain the time when the press is in the pressing state, so as to output the first signal or the second signal to the control part 400 according to the distance between the upper mold 210 and the lower mold 220, and the time when the press is in the pressing state.

[0076] For example, refer to Figure 1 and Figure 2 The press can include a limit switch 130. The limit switch 130 can be electrically connected to the control unit 400 and can be used to move the upper mold 210 and the lower mold 220 closer together or further apart. The limit switch 130 moves the upper mold 210 and the lower mold 220 away from each other when the press is in the closed state for a set time.

[0077] By setting a limit switch 130, when the multi-layer core board 700 is pressed together by the upper mold 210 and the lower mold 220, the multi-layer core board 700 can be placed between the upper mold 210 and the lower mold 220, and the upper mold 210 and the lower mold 220 can be driven closer to each other by the limit switch 130, thereby realizing the pressing of the multi-layer core board 700.

[0078] When the time the press is in the pressing state is equal to the set time, the limit switch 130 drives the upper mold 210 and the lower mold 220 to move away from each other, so that the pressing structure formed by the multi-layer core board 700 can be removed from between the upper mold 210 and the lower mold 220.

[0079] When the travel switch 130 fails, the distance between the upper die 210 and the lower die 220 exceeds the set distance, and the detection member 300 can output a first signal to the control member 400. When the travel switch 130 fails, the press remains in the pressed state for longer than the set time, and the detection member 300 can output a second signal to the control member 400.

[0080] It is easy to understand that when the limit switch 130 is in normal working condition, the press can control the distance between the upper mold 210 and the lower mold 220 through the limit switch 130, thereby ensuring the normal pressing of the multi-layer core board 700. When the press is in the pressing state, the distance between the upper mold 210 and the lower mold 220 is equal to the set distance, and the time the press is in the pressing state is equal to the set time.

[0081] When the limit switch 130 fails, the detection part 300 can obtain the distance between the upper mold 210 and the lower mold 220 when the press is in the pressing state, as well as the time the press is in the pressing state, thereby controlling the pressing process of the press multiple times through the detection part 300 and the limit switch 130, thereby improving the stability of the press, reducing the possibility of scrapping the core board 700, and improving the yield rate of the printed circuit board.

[0082] For example, the press may further include a prompting member 110, which may be electrically connected to the control member 400. When the detection member 300 outputs a first signal to the control member 400, the prompting member 110 issues a prompt; and / or when the detection member 300 outputs a second signal to the control member 400, the prompting member 110 issues a prompt.

[0083] The prompt member 110 may emit a prompt light, or the prompt member 110 may emit a prompt sound, which is not further limited in the embodiment of the present application.

[0084] Reference Figure 1 and Figure 2 In some possible embodiments, the press can be provided with a vacuum chamber 120. The vacuum chamber 120 accommodates the upper mold 210 and the lower mold 220. The press is provided with a vacuum pump 500, which is connected to the vacuum chamber 120. The vacuum pump 500 is used to create a negative pressure state in the vacuum chamber 120. When the press is in the pressing state, the multi-layer core board 700 is in a negative pressure state, thereby reducing the possibility of bubbles forming between the multi-layer core boards 700.

[0085] For example, the control component 400 may be electrically connected to a control terminal of the vacuum pump 500. When the detection component 300 detects that the time the press is in the pressing state is greater than a set time, the control component 400 controls the vacuum pump 500 to turn off.

[0086] It is easy to understand that when the press is in the pressing state for a time greater than the set time, the upper mold 210 and the lower mold 220 complete the pressing process of the multi-layer core board 700. The control component 400 can output a signal to the control terminal of the vacuum pump 500, so that the control component 400 can control the vacuum pump 500 to stop working, thereby making the use of the vacuum pump 500 more convenient.

[0087] Exemplarily, the press can also be provided with a circulation heating system 600, which includes a circulation passage filled with a heating medium. The circulation passage is provided in at least one of the upper mold 210 and the lower mold 220 to heat the upper mold 210 and the lower mold 220 through the circulation heating system 600, thereby increasing the temperature of the multi-layer core panel 700, making the pressing process of the multi-layer core panel 700 more convenient.

[0088] In summary, in the process of pressing the multi-layer core board 700 by the upper mold 210 and the lower mold 220, the multi-layer core board 700 can be placed between the upper mold 210 and the lower mold 220, and then the press is controlled by the control part 400 to be in a pressing state, and the control part 400 controls the upper mold 210 and the lower mold 220 to approach each other, so that the surface of the multi-layer core board 700 facing away from the lower mold 220 can abut against the upper mold 210, thereby realizing the pressing of the multi-layer core board 700 by the cooperation between the upper mold 210 and the lower mold 220;

[0089] When the press is in the pressing state, the detection component 300 obtains that the distance between the upper mold 210 and the lower mold 220 is greater than the set distance, and the pressing force of the upper mold 210 and the lower mold 220 on the multi-layer core board 700 is small. The detection component 300 outputs a first signal to the control component 400, and the control component 400 controls the upper mold 210 and the lower mold 220 to move closer to each other, so that the distance between the upper mold 210 and the lower mold 220 is reduced, thereby ensuring the pressing effect of the multi-layer core board 700 and reducing the possibility of scrapping the core board 700;

[0090] When the time that the press is in the pressing state is greater than the set time, the pressing time of the upper mold 210 and the lower mold 220 on the multi-layer core board 700 is long, and the core board 700 is prone to overpressure and other conditions. The detection component 300 outputs a second signal to the control component 400, and the control component 400 controls the upper mold 210 and the lower mold 220 to move away from each other, thereby reducing the possibility of overpressure and other conditions on the core board 700, reducing the possibility of the core board 700 being scrapped, and improving the yield rate of the printed circuit board.

[0091] Reference Figure 1-Figure 3 The present invention also provides a method for controlling a press, wherein the press may include a pressing mold 200, a control component 400, and a detection component 300. The pressing mold 200 includes a matching upper mold 210 and a lower mold 220. For example, the structure and configuration of the press can be referred to above and will not be further described in detail in the present invention.

[0092] The control method may include: controlling the upper mold 210 and the lower mold 220 to approach each other so that the press is in a pressed state; obtaining the distance between the upper mold 210 and the lower mold 220 through the detection part 300; if the distance between the upper mold 210 and the lower mold 220 is greater than the set distance, the control part 400 controls the upper mold 210 and the lower mold 220 to approach each other; and / or, obtaining the time when the press is in the pressed state through the detection part 300; if the time when the press is in the pressed state is greater than the set time, the control part 400 controls the upper mold 210 and the lower mold 220 to move away from each other.

[0093] For example, the press may further include a travel switch 130. The travel switch 130 is electrically connected to the control member 400, and the travel switch 130 may be used to drive the upper die 210 and the lower die 220 to move closer to or farther from each other.

[0094] The control method may specifically include the following steps:

[0095] S101, controlling the upper die and the lower die to move closer to each other so that the press is in a pressing state;

[0096] Reference Figure 1-Figure 3 In the process of pressing the multi-layer core board 700 through the upper mold 210 and the lower mold 220, the multi-layer core board 700 can be placed between the upper mold 210 and the lower mold 220, and then the press is controlled to be in a pressing state through the control component 400. The control component 400 controls the limit switch 130 so that the limit switch 130 can drive the upper mold 210 and the lower mold 220 to approach each other, thereby pressing the multi-layer core board 700 through the upper mold 210 and the lower mold 220.

[0097] When the multi-layer core board 700 is pressed together by the upper mold 210 and the lower mold 220, the time that the press is in the pressing state is less than or equal to the set time. The vacuum pump 500 is used to form a negative pressure state in the vacuum chamber 120. When the press is in the pressing state, the multi-layer core board 700 is in a negative pressure state to reduce the possibility of bubbles forming between the multi-layer core boards 700.

[0098] When the multi-layer core panel 700 is pressed together by the upper mold 210 and the lower mold 220, the circulating heating system 600 can heat the upper mold 210 and the lower mold 220, thereby increasing the temperature of the multi-layer core panel 700, making the pressing process of the multi-layer core panel 700 more convenient.

[0099] S102, obtaining the distance between the upper die and the lower die through the detection part;

[0100] For example, the detection member 300 can be configured as a position sensor. The position sensor is disposed on the surface of the lower mold 220 facing the upper mold 210. Alternatively, the position sensor is disposed on the surface of the upper mold 210 facing the lower mold 220. The position sensor detects the distance between the upper mold 210 and the lower mold 220 and can output a signal to the control member 400.

[0101] S103: If the distance between the upper mold and the lower mold is greater than the set distance, the control unit controls the upper mold and the lower mold to move closer to each other;

[0102] Reference Figure 1-Figure 3 For example, when the limit switch 130 is in normal working state, the press can control the distance between the upper mold 210 and the lower mold 220 through the limit switch 130, thereby ensuring the normal pressing of the multi-layer core board 700. When the press is in the pressing state, the distance between the upper mold 210 and the lower mold 220 is equal to the set distance.

[0103] If the distance between the upper mold 210 and the lower mold 220 is greater than the set distance, the detection component 300 can output a first signal to the control component 400 .

[0104] The control part 400 can receive the first signal from the detection part 300, so that the control part 400 controls the upper mold 210 and the lower mold 220 to approach each other, so that the distance between the upper mold 210 and the lower mold 220 is reduced, thereby ensuring the pressing effect of the multi-layer core board 700 and reducing the possibility of scrapping the core board 700.

[0105] S104, obtaining the time the press is in the pressing state through the detection part;

[0106] For example, the detection component 300 can obtain the distance between the upper mold 210 and the lower mold 220, and the detection component 300 can also obtain the time when the press is in the pressing state, so as to issue a limit signal to the control component 400 according to the time when the press is in the pressing state.

[0107] S105: If the time the press is in the pressing state is greater than the set time, the control component controls the upper mold and the lower mold to move away from each other.

[0108] Reference Figure 1-Figure 3 For example, when the limit switch 130 is in a normal working state, when the time when the press is in the pressing state is equal to the set time, the limit switch 130 drives the upper mold 210 and the lower mold 220 away from each other, so that the pressing structure formed by the multi-layer core board 700 can be removed from between the upper mold 210 and the lower mold 220.

[0109] If the time that the press is in the pressing state is greater than the set time, the detection component 300 can output a second signal to the control component 400.

[0110] The control component 400 can receive the second signal from the detection component 300. The control component 400 controls the upper mold 210 and the lower mold 220 to move away from each other, thereby reducing the possibility of overvoltage and the like in the core board 700, reducing the possibility of the core board 700 being scrapped, and improving the yield rate of the printed circuit board.

[0111] The control component 400 can be electrically connected to the control terminal of the vacuum pump 500. When the detection component 300 detects that the time the press is in the pressing state is greater than the set time, the control component 400 controls the vacuum pump 500 to turn off.

[0112] For example, the press may further include a prompting member 110, which may be electrically connected to the control member 400. When the detection member 300 outputs a first signal to the control member 400, the prompting member 110 issues a prompt; and / or when the detection member 300 outputs a second signal to the control member 400, the prompting member 110 issues a prompt.

[0113] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0114] In the description of the present invention, it should be understood that the terms "including" and "having" and any variations thereof used herein are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0115] Unless otherwise expressly specified or limited, the terms "mounted," "connected," "connected," "fixed," etc. should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integration; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal connections between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in this disclosure based on the specific circumstances. Furthermore, the terms "first," "second," etc., etc., are used for descriptive purposes only and should not be construed to indicate or imply relative importance or implicitly specify the quantity of the technical features indicated.

[0116] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A press, characterized in that: Including pressing molds, control parts and detection parts; The pressing mold includes an upper mold and a lower mold that match each other, the upper mold and the lower mold are arranged parallel to each other, and the surface of the lower mold facing the upper mold is used to hold the core plate; When the press is in a pressing state, the upper mold and the lower mold are close to each other and are used to press the core plate; when the press is in a disengaged state, the upper mold and the lower mold are away from each other; The control component is connected to at least one of the upper mold and the lower mold, and is used to control the press to be in the pressing state or the disengaging state; the detection component obtains the current state of the pressing mold, and the detection component is electrically connected to the control end of the control component; The control component and the detection component are configured such that: when the press is in the pressing state, the detection component detects that the distance between the upper die and the lower die is greater than a set distance, the detection component outputs a first signal to the control component, and the control component controls the upper die and the lower die to move closer to each other; And / or, the control member and the detection member are configured as follows: when the detection member obtains that the time when the press is in the pressing state is greater than the set time, the detection member outputs a second signal to the control member, and the control member controls the upper mold and the lower mold to move away from each other.

2. The press according to claim 1, characterized in that The detecting member is configured as a position sensor, and the position sensor detects the distance between the upper die and the lower die; The position sensor is arranged on a surface of the lower mold facing the upper mold, or the position sensor is arranged on a surface of the upper mold facing the lower mold.

3. The press according to claim 1, characterized in that The press includes a travel switch; the travel switch is electrically connected to the control member, and the travel switch is used to drive the upper mold and the lower mold to move closer to or away from each other; The time during which the press is in the pressing state is equal to the set time, and the travel switch drives the upper die and the lower die to move away from each other.

4. The press according to any one of claims 1 to 3, characterized in that The press is further provided with a vacuum chamber, wherein the vacuum chamber accommodates the upper mold and the lower mold; The press is provided with a vacuum pump, which is connected to the vacuum chamber and is used to form a negative pressure state in the vacuum chamber.

5. The press according to claim 4, characterized in that The control element is electrically connected to the control end of the vacuum pump; The detection component detects that the time for which the press is in the pressing state is greater than a set time, and the control component controls the vacuum pump to be turned off.

6. The press according to any one of claims 1 to 3, characterized in that The press is also provided with a circulating heating system; The circulation heating system includes a circulation passage filled with a heating medium, and the circulation passage is provided in at least one of the upper mold and the lower mold.

7. The press according to any one of claims 1 to 3, characterized in that The press further includes a prompting member electrically connected to the control member; When the detecting element outputs the first signal to the controlling element, the prompting element issues a prompt; and / or when the detecting element outputs the second signal to the controlling element, the prompting element issues a prompt.

8. A method for controlling a press, characterized in that: The press comprises a pressing die, a control component and a detection component, wherein the pressing die comprises a matching upper die and a lower die; and the control method comprises: Controlling the upper die and the lower die to approach each other so that the press is in a pressing state; Obtaining the distance between the upper die and the lower die through the detection member; If the distance between the upper mold and the lower mold is greater than a set distance, the control component controls the upper mold and the lower mold to move closer to each other; and / or, obtaining the time during which the press is in the pressing state through the detection member; If the time that the press is in the pressing state is greater than a set time, the control component controls the upper mold and the lower mold to move away from each other.

9. The control method of a press according to claim 8, characterized in that: The press further includes a travel switch electrically connected to the control element; the control method further includes: If the time that the press is in the pressing state is equal to the set time, the travel switch is controlled to drive the upper mold and the lower mold to move away from each other.

10. The control method of a press according to claim 8, characterized in that: The press is further provided with a vacuum chamber, the vacuum chamber accommodating the upper die and the lower die; the press is provided with a vacuum pump, the vacuum pump being connected to the vacuum chamber, and the control method further includes: The press is in the pressing state, the time the press is in the pressing state is less than or equal to the set time, and the vacuum pump causes the vacuum chamber to form a negative pressure state; If the time that the press is in the pressing state is greater than the set time, the control component controls the vacuum pump to be turned off.

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