Substrate processing apparatus

Abstract

The present invention relates to a substrate handling apparatus for applying a filler to gaps in edge portions of a plurality of substrates constituting a laminated substrate. The substrate processing apparatus applies a filler (F) to a laminated substrate (Ws) formed by joining a first substrate (W1) and a second substrate (W2), and is provided with: a substrate holding device (2) that holds and rotates the laminated substrate (Ws); and a multi-nozzle head (20) that applies a filler (F) to a gap (G) between the edge (E1) of the first substrate (W1) and the edge (E2) of the second substrate (W2). The multi-nozzle head (20) is provided with a plurality of liquid ejection nozzles (21) that eject the filler (F), and the plurality of liquid ejection nozzles (21) are arranged along the rotation axis (Ct) of the substrate holding device (2).

Description

Technical Field

[0001] The present invention relates to a substrate processing apparatus for applying a filler to gaps at edges of a plurality of substrates constituting a stacked substrate. Background Art

[0002] In recent years, to achieve higher density and functionality in semiconductor devices, three-dimensional mounting technology, which stacks multiple substrates for three-dimensional integration, has been developed. In this technology, for example, the device surface of a first substrate, on which integrated circuits and electrical wiring are formed, is bonded to the device surface of a second substrate, also on which integrated circuits and electrical wiring are formed. After bonding the first and second substrates, the second substrate is thinned using a grinding or lapping device. This allows the integrated circuits to be stacked perpendicularly on the device surfaces of the first and second substrates.

[0003] In three-dimensional mounting technology, it is also possible to join three or more substrates. For example, after thinning the second substrate already joined to the first, a third substrate can be joined to the second substrate and then thinned. In this specification, the method of joining multiple substrates together is sometimes referred to as a "laminated substrate."

[0004] Usually, in order to prevent breakage (cracks) or defects (breakage), the edge of the substrate is ground into an arc shape or chamfered shape in advance. If the second substrate having such a shape is ground (thinned), a sharp end will be formed on the second substrate. This sharp end (hereinafter referred to as the knife edge) is formed by the back surface of the ground second substrate and the outer peripheral surface of the second substrate. Such a knife edge is easily damaged due to physical contact, which may cause the stacked substrate itself to be damaged during transportation of the stacked substrate. In addition, if the bonding between the first substrate and the second substrate is not sufficient, the second substrate may also be broken during grinding.

[0005] To prevent cracking and chipping of the blade edge, a filler is applied to the edge of the laminated substrate before grinding the second substrate. The filler is applied to the gap between the edges of the first and second substrates. The filler supports the blade edge formed after grinding the second substrate, preventing cracking and chipping of the blade edge.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Laid-Open No. 2022-38834

[0009] Problems to be solved by the invention

[0010] like Figure 18As shown, the filler is applied to the gap between the edge of the first substrate and the edge of the second substrate by discharging the filler F from the syringe 121 of the coating device 103 from the filler outlet 122 while rotating the stacked substrate Ws. The stacked substrate Ws is held by a substrate holding device (not shown). The stacked substrate Ws is rotated around its center by the substrate holding device. In the coating device 103, droplets of the filler F are intermittently discharged from the filler outlet 122 toward the gap between the stacked substrates Ws.

[0011] If the droplets of filler F ejected from the filler ejection port 122 are large, the droplets of filler F may splash when they land on the laminated substrate Ws, or may form holes in the applied filler F. Furthermore, in a coating apparatus 103 having a single syringe 121, if an abnormality such as clogging of the filler F within the syringe 121 occurs, the operation of the coating apparatus 103 may be interrupted, and the filler F may not be stably applied to the laminated substrate Ws. Summary of the Invention

[0012] Here, the present invention provides a substrate processing apparatus capable of appropriately and stably applying a filler to a gap between an edge portion of a first substrate and an edge portion of a second substrate.

[0013] Means of solving problems

[0014] In one embodiment, a substrate processing device is provided for applying a filler to a stacked substrate formed by bonding a first substrate and a second substrate, the device comprising: a substrate holding device that holds the stacked substrate and rotates the stacked substrate; and a multi-nozzle nozzle that applies the filler to a gap between an edge portion of the first substrate and an edge portion of the second substrate, the multi-nozzle nozzle head comprising a plurality of liquid injection nozzles for ejecting the filler, the plurality of liquid injection nozzles being arranged along the rotation axis of the substrate holding device.

[0015] In one embodiment, the plurality of liquid ejecting nozzles are arranged across the multilayer substrate in a thickness direction of the multilayer substrate held by the substrate holding device.

[0016] In one embodiment, the arrangement pitch of the plurality of liquid ejecting nozzles is smaller than the width of the gap.

[0017] In one embodiment, at least two of the plurality of liquid ejecting nozzles are arranged at ejection positions facing the gap.

[0018] In one embodiment, an arrangement length of the plurality of liquid ejecting nozzles is greater than a thickness of the laminate substrate.

[0019] In one embodiment, the liquid ejecting nozzle further includes an operation control unit that individually controls ejection operations of the plurality of liquid ejecting nozzles.

[0020] In one embodiment, the substrate processing apparatus further includes an imaging device that generates an image of the gap, and the operation control unit is configured to select a liquid ejecting nozzle that ejects the filler from among the plurality of liquid ejecting nozzles based on the image.

[0021] In one embodiment, the operation control unit is configured to select a liquid ejecting nozzle that ejects the filler from among the plurality of liquid ejecting nozzles based on a coating state of the filler in the gap on the image.

[0022] In one embodiment, the operation control unit is configured to detect a position of the gap in the thickness direction of the laminated substrate based on the image, and select a liquid ejecting nozzle from among the plurality of liquid ejecting nozzles to eject the filler based on the detected position of the gap.

[0023] In one embodiment, the imaging device is arranged upstream of the plurality of liquid ejecting nozzles in the rotation direction of the stacked substrate.

[0024] In one embodiment, the substrate processing device further includes: a nozzle moving mechanism, which moves the multiple liquid injection nozzles; and an abnormality detection device, which detects abnormalities of the multiple liquid injection nozzles, and the action control unit is configured to control the action of the nozzle moving device, and the action control unit is configured to: move the multiple liquid injection nozzles toward the direction in which the liquid injection nozzles detected to be abnormal by the abnormality detection device are away from the ejection position relative to the gap through the nozzle moving mechanism.

[0025] In one embodiment, the plurality of liquid ejecting nozzles are arranged obliquely with respect to a thickness direction of the laminated substrate held by the substrate holding device.

[0026] In one embodiment, the substrate holding device includes multiple substrate holding mechanisms that hold multiple stacked substrates and rotate the multiple stacked substrates, and at least a portion of the multiple liquid injection nozzles are arranged at multiple ejection positions opposite to multiple gaps between the multiple stacked substrates.

[0027] In one embodiment, the plurality of liquid ejecting nozzles are arranged across the plurality of stacked substrates held by the plurality of substrate holding mechanisms in a thickness direction of the plurality of stacked substrates.

[0028] Effects of the Invention

[0029] According to the present invention, the multi-nozzle printhead includes multiple liquid ejection nozzles for ejecting filler. Therefore, it is possible to eject droplets of appropriate sizes from each liquid ejection nozzle without reducing the amount of filler F ejected per unit time. Furthermore, according to the present invention, even if a malfunction occurs in any of the liquid ejection nozzles, the remaining liquid ejection nozzles can be used to stably apply the filler to the gap between the edge portions of the first and second substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1A This is a cross-sectional view showing an example of an edge portion of a laminated substrate to be processed.

[0031] Figure 1B This is a cross-sectional view showing an example of the edge portion of a laminate substrate coated with a filler.

[0032] Figure 1C This is a cross-sectional view showing an example of the edge portion of a laminated substrate that has been thinned after applying a filler.

[0033] Figure 2 It is a schematic diagram showing one embodiment of a substrate processing apparatus.

[0034] Figure 3 It is from Figure 2 The figure is viewed in the direction indicated by arrow A.

[0035] Figure 4 It is an enlarged view schematically showing a plurality of liquid ejecting nozzles.

[0036] Figure 5 Yes Figure 4 A top view of an arrangement of multiple liquid ejection nozzles is shown.

[0037] Figure 6 It is a plan view showing another embodiment of the arrangement of a plurality of liquid ejecting nozzles.

[0038] Figure 7 It is a top view showing another embodiment of the multi-nozzle shower head.

[0039] Figure 8 It is a top view showing still another embodiment of the multi-nozzle shower head.

[0040] Figure 9 This is a schematic diagram showing an example of applying a filler to gaps between laminated substrates using a plurality of liquid ejecting nozzles.

[0041] Figure 10 This is a schematic diagram showing an example of an image of a gap between stacked substrates generated by an imaging device.

[0042] Figure 11This is a schematic diagram showing another embodiment in which a plurality of liquid ejecting nozzles apply a filler to gaps between laminated substrates.

[0043] Figure 12 This is a schematic diagram showing still another embodiment in which a plurality of liquid ejecting nozzles apply a filler to gaps between stacked substrates.

[0044] Figure 13 It is a schematic diagram showing another embodiment of the coating system.

[0045] Figure 14 This is a diagram illustrating one embodiment of a method for detecting abnormalities in a plurality of liquid ejecting nozzles.

[0046] Figure 15 Schematic diagram showing an example of an image of a test plate after test coating, generated by the abnormality detection imaging device.

[0047] Figure 16 This is a diagram illustrating one embodiment of a method of moving a plurality of liquid ejecting nozzles when an abnormality detection device detects an abnormality in a liquid ejecting nozzle.

[0048] Figure 17 It is a schematic diagram showing another embodiment of a substrate processing apparatus.

[0049] Figure 18 It is a schematic diagram showing a conventional substrate processing apparatus. DETAILED DESCRIPTION

[0050] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0051] Figure 1A 1 is a cross-sectional view showing an example of an edge portion of a stacked substrate Ws to be processed. Figure 1A As shown in FIG. 1 , the laminated substrate Ws has a structure in which a first substrate W1 and a second substrate W2 are bonded together. The first substrate W1 and the second substrate W2 used in this embodiment are circular.

[0052] The edge portion E1 of the first substrate W1 is the outermost side surface that is inclined relative to the bonding surface (e.g., device surface) S1 of the first substrate W1. More specifically, the edge portion E1 of the first substrate W1 has an arc-shaped or chamfered shape. The edge portion E2 of the second substrate W2 is the same and is the outermost side surface that is inclined relative to the bonding surface (e.g., device surface) S2 of the second substrate W2. More specifically, the edge portion E2 of the second substrate W2 has an arc-shaped or chamfered shape. The edge portions E1 and E2 are sometimes also referred to as bevel portions. A gap G is formed between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2. The edge portion of the stacked substrate Ws includes the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2.

[0053] Figure 1B This is a cross-sectional view showing an example of the edge of a stacked substrate Ws coated with filler F. The filler F is applied to the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2. This gap G extends across the entire periphery of the stacked substrate Ws and has a generally triangular cross-section. The filler F is applied to completely fill this gap G.

[0054] Figure 1C This is a cross-sectional view showing an example of the edge of a laminated substrate Ws that has been thinned after application of filler F. As a result of this thinning process, a knife edge Ek is formed at the edge E2 of the second substrate W2. Because the knife edge Ek is held (supported) by the filler F, it is prevented from breaking (cracks) or chipping (breakage) at the knife edge Ek.

[0055] Figure 2 is a schematic diagram showing an embodiment of a substrate processing apparatus, Figure 3 It is from Figure 2 The figure is viewed in the direction indicated by arrow A. The substrate processing apparatus is used to apply a filler F to a stacked substrate Ws formed by bonding a first substrate W1 and a second substrate W2. The substrate processing apparatus includes: a substrate holding device 2 that holds the stacked substrate Ws in a vertical position and rotates the held stacked substrate Ws; a coating system 3 that applies the filler F to the stacked substrate Ws; a curing device 4 that cures the applied filler F; and an imaging device 5 that generates an image of a gap G between the stacked substrates Ws.

[0056] The substrate holding device 2 includes a plurality of rollers 12 (four in this embodiment) capable of contacting the peripheral edge of the stacked substrates Ws, and a roller rotation mechanism (not shown) that rotates each roller 12 about its axis. In this embodiment, the substrate holding device 2 includes four rollers 12, but the substrate holding device 2 may also include three or five or more rollers.

[0057] The four rollers 12 are in contact with the peripheral edge of the stacked substrate Ws, holding the stacked substrate Ws so that its flat portion is perpendicular to the horizontal plane. Therefore, the stacked substrate Ws is held in a vertical position by the substrate holding device 2. The roller rotation mechanism is connected to the four rollers 12 and is configured to rotate the four rollers 12 in the same direction and at the same speed. The four rollers 12 are rotated by the roller rotation mechanism, and the stacked substrate Ws is rotated along the rotation axis Ct of the substrate holding device 2. Figure 2 The roller rotating mechanism can be configured in any manner as long as it can rotate the plurality of rollers 12 in the same direction and at the same speed. A known rotating mechanism can be used as the roller rotating mechanism. Examples of roller rotating mechanisms include a combination of a motor, pulleys (and / or gears), and a rotating belt.

[0058] In one embodiment, the substrate holding device 2 may include a holding stage (not shown) for holding the back surface of the stacked substrate Ws, in place of the plurality of rollers 12. Alternatively, the stacked substrate Ws may be held by the holding stage so that the flat portion of the stacked substrate Ws is perpendicular to the horizontal plane. In this case, the substrate holding device 2 includes a rotation shaft (not shown) connected to the center of the holding stage and a stage rotation mechanism (not shown) for rotating the holding stage and the rotation shaft, in place of the roller rotation mechanism. The stage rotation mechanism rotates the holding stage and the stacked substrate Ws held thereon together about the rotation axis Ct of the substrate holding device 2.

[0059] like Figure 3 As shown, the coating system 3 includes: a multi-nozzle nozzle 20, which coats the filler F on the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2; a filler supply source 25, which stores the filler F for coating on the gap G between the edge portion E1 of the first substrate W1 and the edge portion E2 of the second substrate W2; and a filler supply pipeline 27, which supplies the filler F from the filler supply source 25 to the multi-nozzle nozzle 20; a flow adjustment device 30, which is installed on the filler supply pipeline 27; and a filler return pipeline 28, which returns the filler F from the multi-nozzle nozzle 20 to the filler supply source 25.

[0060] The multi-nozzle nozzle head 20 is located radially outward from the stacked substrates Ws held by the substrate holding device 2 and is disposed above the stacked substrates Ws. A filler supply line 27 connects the filler supply source 25 and the multi-nozzle nozzle head 20. The multi-nozzle nozzle head 20 includes a filler chamber 24, the interior of which is connected to the filler supply line 27. The filler F in the filler supply source 25 flows through the filler supply line 27 and is supplied to the filler chamber 24 of the multi-nozzle nozzle head 20. The flow rate adjustment device 30 is configured to adjust the flow rate of the filler F flowing through the filler supply line 27.

[0061] The filler return line 28 is connected to the multi-nozzle nozzle 20 and the filler supply source 25. The filler chamber 24 is connected to the filler return line 28, and a portion of the filler F supplied to the filler chamber 24 returns to the filler supply source 25 through the filler return line 28. In this way, the filler F circulates between the filler supply source 25 and the filler chamber 24 through the filler supply line 27 and the filler return line 28.

[0062] The multi-nozzle nozzle 20 includes a plurality of liquid ejecting nozzles 21 communicating with a filler chamber 24. Part of the filler F in the filler chamber 24 is supplied to the plurality of liquid ejecting nozzles 21. The plurality of liquid ejecting nozzles 21 is configured to eject the filler F supplied from the filler chamber 24.

[0063] The plurality of liquid jet nozzles 21 are arranged along the rotation axis Ct of the substrate holding device 2. When viewed from above the liquid jet nozzles 21, the arrangement direction of the plurality of liquid jet nozzles 21 is parallel to the rotation axis Ct of the substrate holding device 2, or is inclined relative to the rotation axis Ct of the substrate holding device 2. In the present embodiment, the arrangement direction of the plurality of liquid jet nozzles 21 is parallel to the rotation axis Ct of the substrate holding device 2. The plurality of liquid jet nozzles 21 are arranged across the stacked substrate Ws in the thickness direction of the stacked substrate Ws held by the substrate holding device 2. The arrangement length L of the plurality of liquid jet nozzles 21 is greater than the thickness t of the stacked substrate Ws. The arrangement length L of the plurality of liquid jet nozzles 21 is the distance between the two liquid jet nozzles 21 located at both ends, including the width of the two liquid jet nozzles 21 located at both ends.

[0064] The multi-nozzle nozzle head 20 can apply the filler F to the gap G of the stacked substrates Ws by ejecting the filler F from at least some of the plurality of liquid ejecting nozzles 21. The application of the filler F by the multi-nozzle nozzle head 20 is performed while the stacked substrate Ws is rotated by the substrate holding device 2. The filler F can also be applied while the stacked substrate Ws rotates multiple times, depending on the total amount of the filler F to be applied.

[0065] The coating system 3 further includes a nozzle moving mechanism 40 for moving the multi-nozzle nozzle 20 (plural liquid ejecting nozzles 21). Figure 3 As shown, the nozzle moving mechanism 40 is connected to the multi-nozzle nozzle head 20 and is configured to move the multiple liquid ejecting nozzles 21 of the multi-nozzle nozzle head 20 in the direction in which they are arranged (i.e., the thickness direction of the stacked substrates Ws). In this embodiment, the nozzle moving mechanism 40 is configured to move the multiple liquid ejecting nozzles 21 of the multi-nozzle nozzle head 20 parallel to the rotation axis Ct of the substrate holding device 2. Examples of the nozzle moving mechanism 40 include a combination of a linear motion mechanism (ball screw mechanism) and a motor (servo motor, stepping motor, etc.), or a linear motion electric actuator (linear motor, etc.).

[0066] like Figure 2 As shown, the curing device 4 is located radially outside the stacked substrate Ws held by the substrate holding device 2, and is arranged relative to the gap G of the stacked substrate Ws. The curing device 4 is arranged on the downstream side of the multi-nozzle nozzle 20 of the coating system 3 in the rotation direction of the stacked substrate Ws. The curing device 4 is constructed in a manner to cure the filler F applied to the stacked substrate Ws by the multi-nozzle nozzle 20. The curing of the filler F based on the curing device 4 is carried out while the stacked substrate Ws is rotated by the substrate holding device 2. In this embodiment, the filler F is a filler having thermosetting properties. Examples of such fillers include thermosetting resins.

[0067] Filler F includes an adhesive, a solvent, particles, etc. The particles are dispersed in the adhesive dissolved in the solvent. For example, the composition of filler F includes the type of adhesive, the amount of solvent, the amount of particles, and the size of the particles. Examples of adhesives include inorganic adhesives containing alkali metal silicates, organic adhesives composed of silicone resins or epoxy resins, and inorganic / organic hybrid adhesives. Particles are, for example, particles of silicon dioxide or aluminum oxide. In order to increase the volume of filler F and adjust the viscosity of filler F, particles are mixed into the adhesive. In order to reduce the viscosity of filler F, filler F sometimes does not contain particles.

[0068] The curing device 4 in this embodiment is an air heater configured to blow hot air toward the filler F applied to the laminated substrate Ws. The filler F, heated by the hot air, solidifies due to a cross-linking reaction. If the filler F contains a solvent, the solvent evaporates due to heating. The curing device 4 is not limited to an air heater, as long as it can heat and solidify the filler F; it may also be a lamp heater or other configuration.

[0069] In this embodiment, the filler F is a thermosetting filler. In one embodiment, the filler F may also be an ultraviolet-curing filler. In this case, the curing device 4 may be a UV irradiation device that irradiates the filler F with ultraviolet rays to cure the filler F. If the filler F contains a solvent, an air heater or the like may be used to volatilize the solvent.

[0070] like Figure 2 As shown, the imaging device 5 is located radially outside the stacked substrate Ws held by the substrate holding device 2, and is arranged relative to the gap G of the stacked substrate Ws. The imaging device 5 is arranged on the upstream side of the multi-nozzle nozzle 20 of the coating system 3 in the rotation direction of the stacked substrate Ws. The position of the imaging device 5 is fixed. The imaging device 5 is configured in a manner to generate an image of the gap G of the stacked substrate Ws. In the present embodiment, the imaging device 5 is configured in a manner to generate an image of the gap G at a position P2 upstream of a position P1 directly below the multi-nozzle nozzle 20 in the rotation direction of the stacked substrate Ws. As an example of the imaging device 5, a camera having an image sensor such as a CMOS sensor or a CCD sensor can be cited.

[0071] The substrate processing apparatus further includes an operation control unit 10 that controls the operation of the substrate holding device 2, the coating system 3, the curing device 4, and the imaging device 5. The substrate holding device 2, the coating system 3 (more specifically, the flow rate adjustment device 30, the nozzle movement mechanism 40, and the plurality of liquid ejection mechanisms 35 described later), the curing device 4, and the imaging device 5 are electrically connected to the operation control unit 10.

[0072] The motion control unit 10 is composed of at least one computer. The motion control unit 10 includes a storage device 10a that stores programs and a processing device 10b that executes operations based on the instructions contained in the programs. The storage device 10a includes a primary storage device such as a random access memory (RAM) and a secondary storage device such as a hard disk drive (HDD) or a solid-state drive (SSD). Examples of the processing device 10b include a CPU (central processing unit) and a GPU (graphics processing unit). However, the specific configuration of the motion control unit 10 is not limited to these examples.

[0073] Figure 4 is an enlarged view schematically showing a plurality of liquid ejecting nozzles 21. Figure 5 Yes Figure 4 FIG. 2 is a top view of the arrangement of the plurality of liquid ejecting nozzles 21 shown. Figure 4 and Figure 5 , a plurality of (13 in this embodiment) liquid ejecting nozzles 21A to 21M located near the stacked substrate Ws in the multi-nozzle nozzle head 20 are shown. The following describes the structure of the 13 liquid ejecting nozzles 21A to 21M, but the plurality of liquid ejecting nozzles 21 of the multi-nozzle nozzle head 20 all have the same structure. The plurality of liquid ejecting nozzles 21A to 21M are arranged parallel to the thickness direction of the stacked substrate Ws. The plurality of liquid ejecting nozzles 21A to 21M are arranged across the stacked substrate Ws in the thickness direction of the stacked substrate Ws. As Figure 5 As shown, the plurality of liquid ejecting nozzles 21A to 21M are arranged at equal intervals at an arrangement pitch k in the thickness direction of the stacked substrate Ws. The arrangement pitch k of the plurality of liquid ejecting nozzles 21A to 21M is smaller than the width h of the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2.

[0074] At least two of the plurality of liquid ejecting nozzles 21 are arranged at ejection positions opposite to the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2. The ejection position is the position of the liquid ejecting nozzle 21 that can eject the filler F into the gap G of the stacked substrates Ws. In this embodiment, Figure 5 The three liquid ejecting nozzles 21F, 21G, and 21H indicated by black dots are arranged at ejecting positions. These liquid ejecting nozzles 21F, 21G, and 21H can eject the filler F into the gap G between the stacked substrates Ws.

[0075] like Figure 4As shown, the plurality of liquid jet nozzles 21 each have a filler ejection port 22 at its top end for ejecting the filler F. The appropriate shape of the filler ejection port 22 is selected based on the physical properties of the filler F to be applied (such as viscosity, etc.). The two filler ejection ports 22 of at least two liquid jet nozzles 21 among the plurality of liquid jet nozzles 21 are opposite to the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2. In this embodiment, the three filler ejection ports 22 of the three liquid jet nozzles 21F, 21G, and 21H are opposite to the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2. If the filler F is ejected from the filler ejection ports 22 of the liquid jet nozzles 21F, 21G, and 21H arranged at the ejection position, the filler F falls toward the gap G of the stacked substrates Ws, and as a result, the filler F can be applied to the gap G of the stacked substrates Ws.

[0076] The multi-nozzle printhead 20 includes a plurality of liquid ejection mechanisms 35, each attached to a plurality of liquid ejection nozzles 21. Each liquid ejection mechanism 35 is configured to impart a force to each liquid ejection nozzle 21 to eject the filler F from the filler ejection port 22. Examples of the liquid ejection mechanism 35 include a piezoelectric device utilizing the piezoelectric effect and a solenoid valve utilizing the repulsive force of an electromagnet. Commercially available inkjet nozzles can be used for each of the plurality of liquid ejection nozzles 21.

[0077] The plurality of liquid ejection mechanisms 35 are electrically connected to the motion control unit 10. The motion control unit 10 can issue commands to the plurality of liquid ejection mechanisms 35 to individually control the ejection actions of the plurality of liquid ejection nozzles 21. The motion control unit 10 is based on the image pickup device 5 (refer to FIG. Figure 2 ) and a predetermined coating recipe to select the liquid injection nozzle 21 that should eject the filler F.

[0078] The motion control unit 10 issues a discharge signal to the liquid discharge mechanism 35 attached to the liquid discharge nozzle 21 to discharge the liquid, causing the filler F to be discharged from the liquid discharge nozzle 21. While the discharge signal is being issued from the motion control unit 10, the liquid discharge nozzle 21 corresponding to the liquid discharge mechanism 35 that has received the discharge signal intermittently discharges droplets of the filler F from the filler discharge port 22. The amount of filler F discharged from each liquid discharge nozzle 21 per unit time can be adjusted by the time interval between the discharge signals issued from the motion control unit 10 to each liquid discharge mechanism 35. In one embodiment, the time interval between the discharge signals may also depend on the frequency of the power supply (not shown) used.

[0079] According to this embodiment, the multi-nozzle head 20 includes a plurality of liquid ejecting nozzles 21 for ejecting the filler F. Therefore, liquid droplets of appropriate size can be ejected from each liquid ejecting nozzle 21 without reducing the amount of the filler F ejected per unit time by the multi-nozzle head 20.

[0080] In one embodiment, if Figure 6 As shown in FIG. 1 , the plurality of liquid ejecting nozzles 21 may be arranged obliquely relative to the thickness direction of the stacked substrate Ws when viewed from above. In this case, the plurality of liquid ejecting nozzles 21 are arranged obliquely across the stacked substrate Ws in the thickness direction of the stacked substrate Ws. The arrangement direction of the plurality of liquid ejecting nozzles 21 is relative to the rotation axis Ct ( Figure 6 By such a configuration, it is possible to increase the number of liquid injection nozzles 21 (such as Figure 6 Therefore, the filler F can be efficiently applied to the gap G of the stacked substrate Ws.

[0081] In one embodiment, if Figure 7 As shown, the coating system 3 may also include a plurality of (two in this embodiment) multi-nozzle nozzles 20 arranged in parallel. Figure 8 As shown, the multi-nozzle nozzle 20 may also have multiple rows (two rows in this embodiment) of liquid injection nozzles 21. Figure 7 and Figure 8 In any of the multi-nozzle nozzles 20 shown, a plurality of liquid injection nozzles 21 (such as Figure 7 and Figure 8 Therefore, the filler F can be efficiently applied to the gap G of the stacked substrate Ws.

[0082] In one embodiment, the plurality of liquid ejecting nozzles 21 may be respectively connected to a plurality of liquid ejecting mechanisms composed of a syringe and a piston, instead of the plurality of liquid ejecting mechanisms 35 .

[0083] Figure 9 1 is a schematic diagram showing an example in which a plurality of liquid ejecting nozzles 21 apply the filler F to the gap G of the stacked substrate Ws. Figure 9The illustration of the multiple liquid ejection mechanisms 35 installed on the multiple liquid ejection nozzles 21 is omitted. The shape of the gap G of the stacked substrates Ws is such that the width gradually increases from the bottom (the end of the bonding surface S1 of the first substrate W1 and the bonding surface S2 of the second substrate W2) to the top. In this embodiment, first, the filler F is ejected from a liquid ejection nozzle 21G located in the center of the liquid ejection nozzles 21F to 21H arranged at the ejection position. Then, the filler F is ejected from the three liquid ejection nozzles 21F to 21H arranged at the ejection position. In this way, the liquid ejection nozzle 21 to eject the filler F is selected in accordance with the shape of the gap G of the stacked substrates Ws. The multi-nozzle nozzle head 20 can adjust the coating amount of the filler F in accordance with the shape of the gap G of the stacked substrates Ws and appropriately apply the filler F to the gap G.

[0084] The operation control unit 10 is configured to switch the liquid ejecting nozzle 21 ejecting the filler F based on a predetermined coating recipe. The coating recipe is predetermined so that the filler F is appropriately coated on the gap G of the stacked substrates Ws based on the shape of the gap G of the stacked substrates Ws.

[0085] In one embodiment, the motion control unit 10 may also be configured based on the image capture device 5 (see Figure 2 ) and selects a liquid ejection nozzle 21 from among the plurality of liquid ejection nozzles 21 to eject the filler F. The imaging device 5 generates images of the gap G between the stacked substrates Ws at predetermined time intervals. The images of the gap G between the stacked substrates Ws generated by the imaging device 5 are transmitted to the operation control unit 10. Figure 10 1 is a schematic diagram showing an example of an image of the gap G between the stacked substrates Ws generated by the imaging device 5 . Figure 10 , an image generated during the application of the filler F to the gap G of the stacked substrate Ws is shown. When the filler F is applied to the gap G of the stacked substrate Ws, the image generated by the imaging device 5 includes an image of the filler F applied to the gap G of the stacked substrate Ws. Therefore, the operation control unit 10 can monitor the filler F in the gap G of the stacked substrate Ws based on the image generated by the imaging device 5.

[0086] The image generated by the imaging device 5 includes the shape of the filler F in the gap G of the stacked substrates Ws (the width and depth of the filler F in the gap G, etc.). The operation control unit 10 selects the liquid ejecting nozzle 21 from among the plurality of liquid ejecting nozzles 21 to eject the filler F based on the image generated by the imaging device 5. Figure 9 In the example shown in the figure, in this embodiment, first, the filler F is ejected from the liquid ejection nozzle 21G located in the center among the liquid ejection nozzles 21F to 21H arranged at the ejection position. Then, the operation control unit 10 adjusts the width of the filler F in the gap G to be equal to the width of the filler F in the gap G based on the image generated by the imaging device 5. Figure 10 When the depth of the filler F in the gap G exceeds the predetermined depth, the liquid ejecting nozzle 21 ejecting the filler F is switched to the three liquid ejecting nozzles 21F to 21H. In other embodiments, the operation control unit 10 may switch the liquid ejecting nozzle 21 ejecting the filler F to the three liquid ejecting nozzles 21F to 21H when the depth of the filler F in the gap G reaches a predetermined depth or more based on the image generated by the imaging device 5.

[0087] As described above, the imaging device 5 is configured to generate an image of the gap G located at the position P2 upstream of the position P1 immediately below the multi-nozzle nozzle head 20 (see FIG. Figure 2 The operation control unit 10 is configured to determine (calculate) the timing for switching the liquid ejecting nozzle 21 ejecting the filler F based on the rotation speed of the stacked substrate Ws rotated by the substrate holding device 2 and the distance between the position P1 and the position P2.

[0088] Figure 11 1 is a schematic diagram showing another embodiment in which a plurality of liquid jet nozzles 21 apply a filler F to a gap G of a stacked substrate Ws. The configuration and operation of this embodiment, which are not specifically described, are the same as those of the above-described embodiment, and therefore their repeated description is omitted. The filler F applied to the gap G of the stacked substrate Ws may sometimes accumulate unevenly within the gap G and not be applied uniformly. Therefore, in this embodiment, the action control unit 10 is configured to select a liquid jet nozzle 21 from among the plurality of liquid jet nozzles 21 to eject the filler F based on the filling state of the filler F within the gap G in the image generated by the imaging device 5. The filling state of the filler F includes, for example, the bias of the filler F within the gap G, and can be obtained from an image showing the filler F within the gap G.

[0089] Figure 11 In the illustrated embodiment, the filler F applied to the gap G from the three liquid ejection nozzles 21F to 21H is biased toward the edge E1 side of the first substrate W1. Based on the filler F filling state within the gap G as shown in the image generated by the imaging device 5, the operation control unit 10 switches the liquid ejection nozzle 21 ejecting the filler F to a single liquid ejection nozzle 21F located on the second substrate W2 side. Subsequently, the filler F applied to the gap G of the stacked substrates Ws is biased toward both the edge E1 side of the first substrate W1 and the edge E2 side of the second substrate W2, with the center of the applied filler F being recessed. Based on the filler F filling state within the gap G as shown in the image generated by the imaging device 5, the operation control unit 10 switches the liquid ejection nozzle 21 ejecting the filler F to the centrally located liquid ejection nozzle 21G. In this way, the multi-nozzle nozzle head 20 can uniformly apply the filler F to the gap G, consistent with the filler F already applied to the gap G.

[0090] Figure 121 is a schematic diagram showing another embodiment in which a plurality of liquid jet nozzles 21 apply a filler F to a gap G of a stacked substrate Ws. The structure and operation of this embodiment not specifically described are the same as those of the above embodiment, and thus their repeated description is omitted. Figure 12 As shown, during the application of the filler F to the gap G of the laminated substrate Ws, the position of the gap G in the thickness direction of the laminated substrate Ws may change due to the deflection of the laminated substrate Ws as the laminated substrate Ws rotates. Therefore, in this embodiment, the operation control unit 10 is configured to detect the position of the gap G in the thickness direction of the laminated substrate Ws based on an image generated by the imaging device 5, and select a liquid ejection nozzle 21 from among the plurality of liquid ejection nozzles 21 to eject the filler F based on the detected position of the gap G.

[0091] Because the position of the imaging device 5 is fixed, the operation control unit 10 can detect the position of the gap G appearing in the image based on the position of the gap G of the stacked substrates Ws located at a known position in the image and the correlation between the distance in the image and the actual distance. The position of the gap G may be the deepest part of the gap G of the stacked substrates Ws appearing in the image, or it may be the midpoint in the thickness direction of the stacked substrates Ws appearing in the image. In this embodiment, the position of the gap G is the deepest part of the gap G of the stacked substrates Ws appearing in the image.

[0092] Figure 12 In the illustrated embodiment, the position of the gap G between the stacked substrates Ws changes from position j1 ​​to position j2, and then to position j3. When the gap G between the stacked substrates Ws is at position j1, the three liquid ejecting nozzles 21F to 21H are at the ejection position. When the gap G between the stacked substrates Ws is at position j2, the three liquid ejecting nozzles 21E to 21G are at the ejection position. When the gap G between the stacked substrates Ws is at position j3, the three liquid ejecting nozzles 21G to 21I are at the ejection position.

[0093] When the detected position of the gap G is j1, the operation control unit 10 selects the liquid ejecting nozzles 21F to 21H as the liquid ejecting nozzles for ejecting the filler F. When the detected position of the gap G is j2, the operation control unit 10 selects the liquid ejecting nozzles 21E to 21G as the liquid ejecting nozzles for ejecting the filler F. When the detected position of the gap G is j3, the operation control unit 10 selects the liquid ejecting nozzles 21G to 21I as the liquid ejecting nozzles for ejecting the filler F. Thus, the multi-nozzle printhead 20 can track the position of the gap G on the stacked substrate Ws and appropriately apply the filler F.

[0094] Figure 13Schematic diagram showing another embodiment of the coating system 3. The structure and operation of this embodiment that are not specifically described are the same as those of the above-mentioned embodiment, so their repeated description is omitted. As the use time passes, the filler F in the multi-nozzle nozzle 20 solidifies and clogs the nozzle, and some of the multiple liquid injection nozzles 21 may become abnormal. Therefore, the coating system 3 of this embodiment is also provided with an abnormality detection device 50 for detecting abnormalities of the multiple liquid injection nozzles 21. The abnormality detection device 50 includes: a camera 52 for abnormality detection, which generates an image of the test plate M; an abnormality detection unit 53, which detects abnormalities of the multiple liquid injection nozzles 21 based on the image generated by the camera 52 for abnormality detection; a plate holding unit 55, which holds the test plate M; and a plate moving mechanism 56, which moves the test plate M.

[0095] The test plate M is a plate on which a filler F is tested and applied in order to detect abnormalities of the plurality of liquid injection nozzles 21. The test plate M is held by a plate holding portion 55. A plate moving mechanism 56 is connected to the plate holding portion 55 and is configured to move the test plate M between a test plate coating position below the multi-nozzle nozzle 20 and a test plate photographing position below the photographing device 52 for abnormality detection. The test plate coating position is a position on the test plate M where the plurality of liquid injection nozzles 21 of the multi-nozzle nozzle 20 can spray the filler F onto the surface of the test plate M (e.g., Figure 13 The test plate photographing position is a position of the test plate M where the abnormality detection photographing device 52 can generate an image of the test plate M coated with the filler F (e.g. Figure 13 shown by the dotted line).

[0096] The abnormality detection unit 53 is connected to the abnormality detection imaging device 52 and is configured to detect abnormalities in the plurality of liquid ejecting nozzles 21 based on an image of the test plate M generated by the abnormality detection imaging device 52. The abnormality detection unit 53 is connected to the operation control unit 10, and the abnormality detection results of the abnormality detection unit 53 are transmitted to the operation control unit 10.

[0097] The abnormality detection unit 53 includes a storage device (not shown in the figure) that stores a program and an arithmetic device (not shown in the figure) that performs operations according to the commands contained in the program. The arithmetic device includes a CPU (central processing unit) or a GPU (graphics processing unit) that performs operations according to the commands contained in the program. The storage device includes a main storage device (such as a random access memory) that can be accessed by the arithmetic device and an auxiliary storage device (such as a hard disk or a solid-state drive) that stores data and programs. However, the specific structure of the abnormality detection unit 53 is not limited to these examples. The abnormality detection unit 53 can also be composed of at least one computer. In one embodiment, the abnormality detection unit 53 can also be integrally formed with the action control unit 10.

[0098] The abnormality detection imaging device 52 and the plate moving mechanism 56 are electrically connected to the operation control unit 10 , and the operations of the abnormality detection imaging device 52 and the plate moving mechanism 56 are controlled by the operation control unit 10 .

[0099] Figure 14 This is a diagram illustrating an embodiment of a method for detecting an abnormality of a plurality of liquid ejecting nozzles 21. First, filler F is ejected from a plurality of liquid ejecting nozzles 21 (in this embodiment, a plurality of liquid ejecting nozzles 21A to 21M) toward the surface of a test plate M disposed at a test plate coating position, and the filler F is test-coated on the test plate M. In this embodiment, since an abnormality occurs in the liquid ejecting nozzle 21H, the filler F is not ejected from the liquid ejecting nozzle 21H. Then, by referring to Figure 13 The plate moving mechanism 56 described above moves the test plate M to the test plate imaging position, and then an image of the test plate M is generated by the abnormality detection imaging device 52 .

[0100] Figure 15 1 is a schematic diagram showing an example of an image of a test plate M after test coating, which is generated by the abnormality detection imaging device 52. Figure 15 As shown, in the image of the test plate M generated by the abnormality detection imaging device 52, filler F ejected from multiple liquid ejection nozzles 21A to 21G and 21I to 21M appears. However, in the image, filler F is not present in the portion corresponding to the abnormal liquid ejection nozzle 21H. Based on the image of the test plate M generated by the abnormality detection imaging device 52, the abnormality detection unit 53 identifies the liquid ejection nozzle 21H corresponding to the portion without filler F, and detects the abnormality of the liquid ejection nozzle 21H. In this way, the abnormality detection device 50 can detect abnormalities in multiple liquid ejection nozzles 21.

[0101] Figure 16 This is a diagram illustrating an embodiment of a method for moving a plurality of liquid injection nozzles 21A to 21M when an abnormality is detected in a liquid injection nozzle 21H by an abnormality detection device 50. In this embodiment, while a previously processed stacked substrate is being transported to another device and a subsequently processed stacked substrate Ws is being transported, abnormalities in a plurality of liquid injection nozzles 21 are detected by the abnormality detection device 50. As described above, if an abnormality is detected in a liquid injection nozzle 21H by the abnormality detection device 50, the detection result of the abnormality is sent to the action control unit 10. The detection result of the abnormality includes information that can identify the liquid injection nozzle 21 in which the abnormality is detected (for example, an identification number assigned to each liquid injection nozzle 21). In this embodiment, the detection result of the abnormality in the liquid injection nozzle 21H is sent from the abnormality detection device 50 to the action control unit 10.

[0102] The structure is as follows: before starting to apply the filler F to the laminated substrate Ws to be processed later, the operation control unit 10 controls the nozzle moving mechanism 40 (see FIG. 5 ) based on the abnormality detection result sent from the abnormality detection device 50. Figure 3 ) The multiple liquid ejecting nozzles 21 of the multi-nozzle nozzle head 20 are moved in a direction away from the ejection position of the liquid ejecting nozzle 21H where the abnormality was detected, which is opposite to the gap G of the stacked substrates Ws. In this embodiment, the multiple liquid ejecting nozzles 21 of the multi-nozzle nozzle head 20 are moved in the thickness direction of the stacked substrates Ws to the first substrate W1 side, and the liquid ejecting nozzle 21H where the abnormality was detected is arranged outside the ejection position. The liquid ejecting nozzle 21H where the abnormality was detected is arranged at a position not opposite to the gap G of the stacked substrates Ws. The liquid ejecting nozzles 21E to 21G where the abnormality was not detected are arranged at the ejection position.

[0103] According to this embodiment, if any of the multiple liquid ejection nozzles 21 experiences an abnormality, the multi-nozzle nozzle head 20 can continue to apply the filler F to the gap G between the stacked substrates Ws using the remaining liquid ejection nozzles 21 that have not experienced the abnormality. As a result, the filler F can be stably applied to the gap G between the edge E1 of the first substrate W1 and the edge E2 of the second substrate W2. The abnormality detection device 50 can detect abnormalities in the multiple liquid ejection nozzles 21 after each processing of a single stacked substrate, or after each processing of multiple stacked substrates.

[0104] Figure 17 It is a schematic diagram showing other embodiments of the substrate processing device. The structure and operation of this embodiment that are not specifically described are the same as those of the above-mentioned embodiment, so their repeated description can be omitted. The multi-nozzle nozzle 20 of this embodiment is capable of applying filler F to multiple stacked substrates Ws in parallel. The substrate holding device 60 of this embodiment has a plurality of (six in this embodiment) substrate holding mechanisms 61, which respectively hold and rotate multiple (six in this embodiment) stacked substrates Ws; and a plurality of (four in this embodiment) connecting shafts 64, which are connected to the multiple substrate holding mechanisms 61. Each substrate holding mechanism 61 has a plurality of (four in this embodiment) rollers 62 that can contact the peripheral portion of the stacked substrate Ws. In this embodiment, each substrate holding mechanism 61 has four rollers 62, but each substrate holding mechanism 61 may also have three rollers or more than five rollers.

[0105] The four rollers 62 of each substrate holding mechanism 61 are in contact with the peripheral portion of the stacked substrate Ws to hold the stacked substrate Ws and make its flat portion perpendicular to the horizontal plane. Therefore, multiple stacked substrates Ws are held in a vertical position by the multiple substrate holding mechanisms 61. The four connecting shafts 64 extend parallel to the rotation axis Ct of the substrate holding device 60 in such a way that the four axis centers of the four rollers 62 of each substrate holding mechanism 61 are respectively aligned with the axis centers of the four connecting shafts 64. Each connecting shaft 64 extends through a through hole (not shown) formed in each roller 62, passing through the six rollers 62 whose axis centers are aligned with each other. Each connecting shaft 64 is fixed to the six rollers 62 whose axis centers are aligned with each other.

[0106] The substrate holding device 60 is provided with a connecting shaft rotation mechanism (not shown in the figure), which rotates each connecting shaft 64 around the axis of the connecting shaft rotation mechanism. The connecting shaft rotation mechanism is connected to the four rotating shafts 64 and is configured to rotate the four rotating shafts 64 in the same direction at the same speed. By rotating the four rotating shafts 64 by the connecting shaft rotation mechanism, the four rollers 62 of each substrate holding mechanism 61 rotate together with the four rotating shafts 64, and the multiple stacked substrates Ws rotate together around the rotation axis Ct of the substrate holding device 60. The structure of the connecting shaft rotation mechanism is arbitrary as long as it can rotate multiple rotating shafts 64 in the same direction at the same speed, and a known rotation mechanism can be used as the connecting shaft rotation mechanism. As an example of the connecting shaft rotation mechanism, a combination of a motor, a pulley (and / or a gear) and a rotating belt can be listed.

[0107] The multi-nozzle nozzle 20 is located radially outside the multi-piece stacked substrate Ws held by the substrate holding device 60 and is arranged above the multi-piece stacked substrate Ws. At least a portion of the multiple liquid jet nozzles 21 of the multi-nozzle nozzle 20 is arranged at a plurality of ejection positions opposite to the multiple gaps G of the multi-piece stacked substrate Ws. Because the multi-piece stacked substrates Ws are arranged at prescribed intervals, the multiple ejection positions corresponding to the multiple gaps G of the multi-piece stacked substrates Ws are also arranged at prescribed intervals. Therefore, a portion of the multiple liquid jet nozzles 21 is arranged at a position that is not opposite to any of the multiple gaps G of the multi-piece stacked substrates Ws. The multiple ejection positions opposite to the multiple gaps G of the multi-piece stacked substrates Ws are respectively corresponding to the reference Figure 4 and Figure 5 The ejection position of the stacked substrate Ws described above is the same, so repeated description thereof will be omitted.

[0108] The multiple liquid jet nozzles 21 of the multi-nozzle nozzle head 20 are arranged along the rotation axis Ct of the substrate holding device 60. The arrangement direction of the multiple liquid jet nozzles 21 is parallel to the rotation axis Ct of the substrate holding device 60 or inclined relative to the rotation axis Ct of the substrate holding device 60. In this embodiment, the arrangement direction of the multiple liquid jet nozzles 21 is parallel to the rotation axis Ct of the substrate holding device 60. The multiple liquid jet nozzles 21 are arranged across the multiple stacked substrates Ws in the thickness direction of the multiple stacked substrates Ws held by the substrate holding device 60. The arrangement length L of the multiple liquid jet nozzles 21 is greater than the overall thickness tp of the multiple stacked substrates Ws. The arrangement length L of the multiple liquid jet nozzles 21 is the distance between the two liquid jet nozzles 21 located at the two ends, including the width of the two liquid jet nozzles 21 located at the two ends. The overall thickness tp of the multiple stacked substrates Ws is the distance between the two stacked substrates Ws located at the two ends, including the width of the two stacked substrates Ws located at the two ends.

[0109] The plurality of liquid ejecting nozzles 21 arranged at a plurality of ejection positions eject the filler F into the plurality of gaps G between the plurality of stacked substrates Ws. According to this embodiment, the multi-nozzle ejecting head 20 can apply the filler F to the plurality of stacked substrates Ws held by the substrate holding device 60 in parallel. As a result, the substrate processing apparatus can improve the throughput of the process of applying the filler F to the stacked substrates Ws.

[0110] The above embodiments are described for the purpose of enabling those skilled in the art to implement the present invention. Those skilled in the art can, of course, create various variations of the above embodiments, and the technical concepts of the present invention can also be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments and is to be interpreted in accordance with the broadest scope of the technical concepts defined by the claims.

[0111] Industrial applicability

[0112] The present invention can be utilized in a substrate processing apparatus for applying a filler to gaps at edges of a plurality of substrates constituting a laminated substrate.

[0113] Explanation of symbols

[0114] 2: Substrate holding device 3: Coating system 4: Curing device 5: Camera 10: Motion control unit 10a: Storage device 10b: Processing device 12: Roller 20: Multi-nozzle nozzle 21, 21A~21M: Liquid injection nozzle 22: Filler outlet 24: Filler chamber 25: Filler supply source 27: Filler supply pipeline 28: Filler return pipeline 30: Flow adjustment device 35, 35A~35M: Liquid ejection mechanism 40: Nozzle moving mechanism 50: Abnormality detection device 52: Camera for abnormality detection 53: Abnormality detection unit 55: Plate holding unit 56: Plate moving mechanism 60: Substrate holding device 61: Substrate holding mechanism 62: Roller 64: Rotating axis W1: First substrate W2: Second substrate Ws: Stacked substrate E1, E2: Edge portion F: Filler G: Gap M: Test plate.

Claims

1. A substrate processing apparatus for applying a filler to a laminated substrate formed by bonding a first substrate and a second substrate, characterized in that: have: a substrate holding device that holds the stacked substrates and rotates the stacked substrates; and a multi-nozzle nozzle that applies the filler to a gap between an edge portion of the first substrate and an edge portion of the second substrate; The multi-nozzle nozzle includes a plurality of liquid injection nozzles for ejecting the filler. The plurality of liquid ejecting nozzles are arranged along a rotation axis of the substrate holding device.

2. The substrate processing apparatus according to claim 1, wherein The plurality of liquid ejecting nozzles are arranged across the stacked substrate in a thickness direction of the stacked substrate held by the substrate holding device.

3. The substrate processing apparatus according to claim 1, wherein: An arrangement pitch of the plurality of liquid ejecting nozzles is smaller than a width of the gap.

4. The substrate processing apparatus according to claim 3, wherein: At least two of the plurality of liquid ejecting nozzles are arranged at ejection positions facing the gap.

5. The substrate processing apparatus according to claim 1, wherein: An arrangement length of the plurality of liquid ejecting nozzles is greater than a thickness of the laminated substrate.

6. The substrate processing apparatus according to claim 1, wherein: The invention further includes an operation control unit for individually controlling the ejection operations of the plurality of liquid ejecting nozzles.

7. The substrate processing apparatus according to claim 6, wherein: further comprising an imaging device for generating an image of the gap, The operation control unit is configured to select a liquid ejecting nozzle that ejects the filler from among the plurality of liquid ejecting nozzles based on the image.

8. The substrate processing apparatus according to claim 7, wherein: The operation control unit is configured to select a liquid ejecting nozzle that ejects the filler from among the plurality of liquid ejecting nozzles based on a coating state of the filler in the gap on the image.

9. The substrate processing apparatus according to claim 7, wherein: The operation control unit is configured to detect a position of the gap in the thickness direction of the laminated substrate based on the image, and select a liquid ejecting nozzle from among the plurality of liquid ejecting nozzles to eject the filler based on the detected position of the gap.

10. The substrate processing apparatus according to claim 7, wherein: The imaging device is arranged upstream of the plurality of liquid ejecting nozzles in the rotation direction of the stacked substrate.

11. The substrate processing apparatus according to claim 1, wherein: Also features: a nozzle moving mechanism that moves the plurality of liquid ejecting nozzles; and an abnormality detection device that detects abnormalities in the plurality of liquid ejecting nozzles, The motion control unit is configured to control the motion of the nozzle moving device. The operation control unit is configured to move the plurality of liquid ejecting nozzles via the nozzle moving mechanism in a direction in which the liquid ejecting nozzle detected as abnormal by the abnormality detecting device is separated from a ejection position facing the gap.

12. The substrate processing apparatus according to claim 1, wherein: The plurality of liquid ejecting nozzles are arranged obliquely with respect to a thickness direction of the stacked substrate held by the substrate holding device.

13. The substrate processing apparatus according to claim 1, wherein The substrate holding device includes a plurality of substrate holding mechanisms that hold a plurality of stacked substrates and rotate the plurality of stacked substrates. At least some of the plurality of liquid ejecting nozzles are arranged at a plurality of ejecting positions facing the plurality of gaps between the plurality of laminated substrates.

14. The substrate processing apparatus according to claim 13, wherein: The plurality of liquid ejecting nozzles are arranged across the plurality of stacked substrates held by the plurality of substrate holding mechanisms in a thickness direction of the plurality of stacked substrates.

Images