Multilayer ceramic capacitor

Abstract

The present invention is provided with: a laminate having a first surface and a second surface facing each other in a lamination direction, a third surface and a fourth surface facing each other in a first direction orthogonal to the lamination direction, and a fifth surface and a sixth surface facing each other in a second direction orthogonal to the lamination direction and the first direction; and an external electrode disposed on the fifth surface of the laminate. The laminated body is provided with an inner layer part. The inner layer part is provided with: an inner dielectric layer; and an internal electrode laminated on the inner dielectric layer in the lamination direction, the internal electrode having an end portion located on the fifth surface. The external electrode is provided with: an inner base electrode layer that is disposed on the fifth surface on the inner layer section and that is connected to the internal electrode; an inner glass layer disposed on the inner base electrode layer and containing a glass component; a plating layer disposed on the inner glass layer; and a connection part extending to penetrate the inner glass layer and electrically connecting the inner base electrode layer and the plating layer.

Description

Technical Field

[0001] The present invention relates to a laminated ceramic capacitor. Background Art

[0002] In recent years, there has been a demand for improved reliability in multilayer ceramic capacitors for electronic components and multilayer ceramic capacitors for automotive use.

[0003] For example, in the multilayer ceramic capacitor described in Patent Document 1, an internal electrode layer is arranged within a laminated sheet having a dielectric layer composed of a ceramic material that functions as a dielectric. The internal electrode layer is exposed on the surface of the laminated sheet, and an external electrode is arranged so as to bond to the internal electrode layer. The surface of the external electrode is provided with a plating layer primarily composed of a metal such as copper (Cu), nickel (Ni), or tin (Sn).

[0004] Patent Document 2 describes that hydrogen generated by a chemical reaction in a plating layer forming step is occluded by an internal electrode, and the occluded hydrogen insulates a dielectric layer around the internal electrode, thereby degrading insulation resistance.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Laid-Open No. 2022-119088

[0008] Patent Document 2: Japanese Patent Application Laid-Open No. 1-80011 Summary of the Invention

[0009] Problems to be solved by the invention

[0010] An object of the present invention is to suppress degradation of insulation resistance in a multilayer ceramic capacitor.

[0011] Technical solutions to solve problems

[0012] The present invention provides a multilayer ceramic capacitor comprising: a laminate having a first surface and a second surface opposing each other in a stacking direction, a third surface and a fourth surface opposing each other in a first direction perpendicular to the stacking direction, and a fifth surface and a sixth surface opposing each other in a second direction perpendicular to both the stacking direction and the first direction; and an external electrode disposed on the fifth surface of the laminate. The laminate comprises an inner layer portion comprising an inner dielectric layer; and an internal electrode laminated on the inner dielectric layer in the stacking direction and having an end portion located on the fifth surface. The external electrode comprises an inner base electrode layer disposed on the inner layer portion on the fifth surface and connected to the internal electrode; an inner glass layer disposed on the inner base electrode layer and comprising a glass component; a plating layer disposed on the inner glass layer; and a connecting portion extending through the inner glass layer to electrically connect the inner base electrode layer and the plating layer.

[0013] According to the present invention, it is possible to prevent degradation of insulation resistance in a multilayer ceramic capacitor. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a perspective view of a multilayer ceramic capacitor according to a first embodiment of the present invention.

[0015] Figure 2 yes Figure 1 Cross-sectional view at line II-II.

[0016] Figure 3 yes Figure 1 Cross-sectional view at line III-III.

[0017] Figure 4 It is an exploded perspective view of the inner layer portion according to the first embodiment of the present invention.

[0018] Figure 5 yes Figure 2 An enlarged view of region R.

[0019] Figure 6 It is a perspective view of a multilayer ceramic capacitor according to a second embodiment of the present invention.

[0020] Figure 7 yes Figure 7 Cross-sectional view at line VII-VII.

[0021] Figure 8 yes Figure 7 A cross-sectional view taken along line VIII-VIII of FIG.

[0022] Figure 9 yes Figure 8 A sectional view taken along line IX-IX of FIG.

[0023] Figure 10 yes Figure 8 Cross-sectional view at line XX.

[0024] Figure 11 This is a flowchart for explaining the method for manufacturing the multilayer ceramic capacitor according to the first embodiment of the present invention. DETAILED DESCRIPTION

[0025] The following, with the attached Figure 1 The mode for implementing the present invention will be described together.

[0026] In addition, each embodiment illustrates an embodiment of the present invention by way of example, and the present invention is not limited to the contents of the embodiment. In addition, it is also possible to combine the contents described in different embodiments and implement them, and the implementation contents in this case are also included in the present invention. In addition, the drawings are used to help understand the description, and sometimes they are drawn schematically, and sometimes the ratios of the dimensions of the drawn components or the components are inconsistent with the ratios of these dimensions described in the description. In addition, there are also cases where the components described in the description are omitted in the drawings, or the number of components is omitted and drawn, etc.

[0027] 1. Multilayer ceramic capacitors

[0028] (First embodiment)

[0029] A multilayer ceramic capacitor according to a first embodiment of the present invention will be described.

[0030] Figure 1 It is a perspective view showing an example of a multilayer ceramic capacitor according to the first embodiment of the present invention. Figure 2 yes Figure 1 Cross-sectional view at line II-II. Figure 3 yes Figure 1 Cross-sectional view at line III-III.

[0031] The stacking direction X, width direction Y, and length direction Z of the multilayer ceramic capacitor 10 are sometimes shown in the drawings, and these directions may be referred to in the following description. The width direction Y in this embodiment is an example of the first direction according to the present invention, and the length direction Z is an example of the second direction according to the present invention. Furthermore, the width direction Y in this embodiment may also be an example of the second direction according to the present invention, and the length direction Z may also be an example of the second direction according to the present invention.

[0032] Reference Figure 1The multilayer ceramic capacitor 10 includes a multilayer body 12, a first external electrode 30a, and a second external electrode 30b. In the following description, when there is no need to distinguish between the first external electrode 30a and the second external electrode 30b, either one may be referred to as simply the external electrode 30.

[0033] The stack 12 of this embodiment has a rectangular parallelepiped shape or a roughly rectangular parallelepiped shape as a whole. The stack 12 has a first surface 12a and a second surface 12b that are opposite to each other in the stacking direction X, a third surface 12c and a fourth surface 12d that are opposite to each other in the width direction Y, and a fifth surface 12e and a sixth surface 12f that are opposite to each other in the length direction Z. In this embodiment, the stacking direction X, the width direction Y, and the length direction Z are orthogonal to each other. The stack 12 preferably has rounded corners at the corners and ridges. The so-called corners are the parts where three adjacent surfaces of the stack 12 intersect. The so-called ridges are the parts where two adjacent surfaces of the stack 12 intersect. Concavities and convexities may also be formed on part or all of the first surface 12a, the second surface 12b, the third surface 12c, the fourth surface 12d, the fifth surface 12e, and the sixth surface 12f.

[0034] like Figure 2 As shown, the laminate 12 includes an inner layer portion 13, a first outer layer portion 16a, and a second outer layer portion 16b. In the following description, when there is no need to distinguish between the first outer layer portion 16a and the second outer layer portion 16b, one of them may be referred to as simply the outer layer portion 16.

[0035] (Inner layer 13)

[0036] Reference Figure 2 as well as Figure 3 The inner layer portion 13 includes multiple internal electrodes 13a and multiple inner dielectric layers 14a. The inner layer portion 13 is located between the internal electrode 13a closest to the first outer layer portion 16a and the internal electrode 13a closest to the second outer layer portion 16b. In other words, the inner layer portion 13 is located between the internal electrode 13a adjacent to the first outer layer portion 16a and the internal electrode 13a adjacent to the second outer layer portion 16b.

[0037] Multiple inner dielectric layers 14a are stacked in the stacking direction X. In other words, the multiple inner dielectric layers 14a are arranged in the stacking direction X. The material of each inner dielectric layer 14a is arbitrary. For example, a dielectric ceramic containing barium titanate (BaTiO3) as a main component can be used as the material of the inner dielectric layer 14a. In particular, the material of the inner dielectric layer 14a can also include multiple crystal grains containing a perovskite-type compound with BaTiO3 as its basic structure. However, a dielectric ceramic containing other compounds such as calcium titanate (CaTiO3), strontium titanate (SrTiO3), or calcium zirconate (CaZrO3) as a main component instead of BaTiO3 can also be used as the material of the inner dielectric layer 14a. Alternatively, the material for the inner dielectric layer 14a may be a material in which a compound such as a manganese (Mn) compound, an iron (Fe) compound, a chromium (Cr) compound, a cobalt (Co) compound, or a nickel (Ni) compound is added as a minor component to a main component such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3, with the content thereof being less than that of the main component. The thickness of the inner dielectric layer 14a (i.e., the dimension in the stacking direction X) is arbitrary, but is preferably 10.0 μm or less, for example.

[0038] Each internal electrode 13a is arranged between two adjacent dielectric layers in the stacking direction X among the plurality of dielectric layers included in the stacked body 12. The internal electrode 13a may also be arranged between two adjacent inner dielectric layers 14a in the stacking direction X among the plurality of inner dielectric layers 14a. The internal electrode 13a may also be arranged between an inner dielectric layer 14a adjacent to each other in the stacking direction X and an outer dielectric layer 17a of the outer layer portion 16. An inner dielectric layer 14a is arranged between two adjacent inner electrodes 13a in the stacking direction X. The internal electrode 13a is arranged so as to be in contact with the inner dielectric layer 14a.

[0039] The internal electrode 13 a of this embodiment is a plate-shaped electrode and extends in the longitudinal direction Z. The internal electrode 13 a has a first end exposed on either the fifth surface 12 e or the sixth surface 12 f and a second end located inside the laminate 12 .

[0040] Reference Figure 2 In this embodiment, each internal electrode 13a is exposed on either the fifth surface 12e or the sixth surface 12f of the laminate 12. The plurality of internal electrodes 13a include internal electrodes 13a that are exposed on the fifth surface 12e and not on the sixth surface 12f, and internal electrodes 13a that are exposed on the sixth surface 12f and not on the fifth surface 12e. The internal electrodes 13a that are exposed on the fifth surface 12e and not on the sixth surface 12f and the internal electrodes 13a that are exposed on the sixth surface 12f and not on the fifth surface 12e are staggered in the stacking direction X.

[0041] Figure 4 This is an exploded perspective view of the inner layer portion 13. Figure 4 Each internal electrode 13a includes an opposing electrode portion 15a and an extraction electrode portion 15b. The opposing electrode portion 15a is the portion of the internal electrode 13a that opposes the other internal electrode 13a adjacent in the stacking direction X. The extraction electrode portion 15b is the portion of the internal electrode 13a other than the opposing electrode portion 15a. The opposing electrode portions 15a of two adjacent internal electrodes 13a in the stacking direction X oppose each other with the inner dielectric layer 14a interposed therebetween, thereby forming an electrostatic capacitor. Furthermore, each extraction electrode portion 15b is exposed on either the fifth surface 12e or the sixth surface 12f.

[0042] The shape of the internal electrode 13a is not particularly limited, but is preferably rectangular when viewed in the stacking direction X. Furthermore, the corners of the opposing electrode portion 15a may be chamfered or rounded. The corners of the lead electrode portion 15b may also be chamfered or rounded.

[0043] The internal electrode 13 a preferably has a uniform thickness (ie, dimension in the stacking direction X) along the width direction Y. The thickness of the end portions of the internal electrode 13 a in the width direction Y may be thicker than the thickness of the center portion of the internal electrode 13 a in the width direction Y.

[0044] In this embodiment, the main component of the internal electrode 13a is copper (Cu). However, the main component of the internal electrode 13a is arbitrary and may be replaced by another metal such as nickel, palladium (Pd), or silver (Ag). Furthermore, the main component of the internal electrode 13a may be an alloy of nickel, palladium, Ag, or Cu with another metal.

[0045] The thickness of the internal electrode 13 a is arbitrary, but is preferably, for example, not less than 0.2 μm and not more than 2.0 μm.

[0046] (Outer layer 16)

[0047] Reference Figure 2 The first outer layer portion 16a and the second outer layer portion 16b are arranged to sandwich the inner layer portion 13 in the stacking direction X. The first outer layer portion 16a is arranged on one side of the inner layer portion 13 in the stacking direction X (at the Figure 2 In other words, the first outer layer portion 16a is arranged on the first surface 12a side relative to the inner layer portion 13. The second outer layer portion 16b is arranged on the other side of the inner layer portion 13 in the stacking direction X (at the Figure 2 In other words, the second outer layer portion 16b is arranged on the second surface 12b side relative to the inner layer portion 13.

[0048] The outer layer portion 16 includes a plurality of outer dielectric layers 17a. The plurality of outer dielectric layers 17a are stacked in the stacking direction X. The material of each outer dielectric layer 17a is arbitrary. For example, a dielectric ceramic having BaTiO3 as a main component can be used as the material of the outer dielectric layer 17a. However, a dielectric ceramic having other compounds such as CaTiO3, SrTiO3, or CaZrO3 as a main component instead of BaTiO3 can also be used as the material of the outer dielectric layer 17a. In addition, a material in which compounds such as Mn compounds, Fe compounds, Cr compounds, Co compounds, and Ni compounds are added as minor components to the main components such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3, with a content range lower than that of the main component, can also be used. The material of the outer dielectric layer 17a can also be formed from a main component different from that of the material of the inner dielectric layer 14a.

[0049] Although not shown, insulating layers may be provided on the third surface 12c and the fourth surface 12d of the laminate 12. Providing insulating layers can suppress the intrusion of moisture into the interface between the internal electrode 13a and the inner dielectric layer 14a, the interface between the internal electrode 13a and the outer dielectric layer 17a, and the interior of the laminate 12. Furthermore, the insulating layer preferably has the same or similar composition as the inner dielectric layer 14a or the outer dielectric layer 17a. When the insulating layer has the same or similar composition as the inner dielectric layer 14a, the adhesion between the insulating layer and the inner dielectric layer 14a is improved. When the insulating layer has the same or similar composition as the outer dielectric layer 17a, the adhesion between the insulating layer and the outer dielectric layer 17a is improved.

[0050] Alternatively, the insulating layer may be arranged so as to be bonded to the internal electrode 13a. In this case, the surface of the insulating layer not bonded to the internal electrode 13a becomes the third surface 12c and the fourth surface 12d. In other words, when the insulating layer is bonded to the internal electrode 13a, the surface of the insulating layer opposite to the internal electrode 13a constitutes the third surface 12c and the fourth surface 12d of the laminate 12.

[0051] The insulating layer preferably includes an inner layer positioned innermost in the width direction Y and an outer layer positioned outermost in the first direction. Furthermore, when an inner layer and an outer layer are provided, the boundary between the inner and outer layers can be easily identified by observation using an optical microscope based on the difference in sinterability between the inner and outer layers. In other words, a boundary exists between the inner and outer layers. Multiple boundaries may also be present.

[0052] In addition, the insulating layer is not limited to a two-layer structure and may also be a three-layer or more structure. When the insulating layer includes three or more layers, the innermost layer arranged in the width direction Y is regarded as the inner layer, and the outermost layer arranged in the width direction Y is regarded as the outer layer.

[0053] A stepped layer 19 is arranged on the same plane as the internal electrode 13a. Without the stepped layer 19, the thickness of the inner layer 13 differs between the portion where the internal electrode 13a is arranged and the portion where the internal electrode 13a is not arranged. This can cause deformation during pressing, etc., during the manufacturing process of the multilayer ceramic capacitor 10 described later, and may result in structural defects. In contrast, in this embodiment, the stepped layer 19 fills the gap by an amount corresponding to the thickness of the internal electrode 13a in the stacking direction X. This can alleviate deformation during pressing, etc., during the manufacturing process of the multilayer ceramic capacitor 10, thereby suppressing structural defects. The stepped layer 19 preferably has the same or approximately the same thickness as the internal electrode 13a arranged on the same plane. The stepped layer 19 preferably contains the same or approximately the same composition as the inner dielectric layer 14a.

[0054] (External electrode 30)

[0055] The first external electrode 30a is arranged on the side of the fifth surface 12e of the stack 12. In this embodiment, the first external electrode 30a is arranged on the first surface 12a, the second surface 12b, the third surface 12c, the fourth surface 12d, and the fifth surface 12e. The first external electrode 30a may be arranged only on the fifth surface 12e of the stack 12, but is preferably arranged continuously on the fifth surface 12e, the first surface 12a, and the second surface 12b. In addition, the first external electrode 30a is more preferably also arranged on the third surface 12c and the fourth surface 12d. The first external electrode 30a is bonded to the internal electrode 13a exposed on the fifth surface 12e of the stack 12. Thus, the first external electrode 30a is electrically connected to the internal electrode 13a arranged on the fifth surface 12e of the stack 12.

[0056] The second external electrode 30b is arranged on the side of the sixth surface 12f of the stack 12. In this embodiment, the second external electrode 30b is arranged on the first surface 12a, the second surface 12b, the third surface 12c, the fourth surface 12d, and the sixth surface 12f. The second external electrode 30b can also be arranged only on the sixth surface 12f of the stack 12, but is preferably arranged continuously on the sixth surface 12f, the first surface 12a, and the second surface 12b. In addition, the second external electrode 30b is more preferably also arranged on the third surface 12c and the fourth surface 12d. The second external electrode 30b is bonded to the internal electrode 13a exposed on the sixth surface 12f of the stack 12. As a result, the second external electrode 30b is electrically connected to the internal electrode 13a arranged on the sixth surface 12f of the stack 12.

[0057] Figure 5 yes Figure 2 An enlarged view of region R. Figure 5, although a portion of the first external electrode 30 a is shown in an enlarged manner, the second external electrode 30 b also has the same structure as the first external electrode 30 a.

[0058] like Figure 2 、 Figure 3 as well as Figure 5 As shown, the external electrode 30 includes a glass layer 31 and a base electrode layer 32 arranged to cover the glass layer 31. The external electrode 30 includes an inner glass layer 33a and an outer glass layer 33b arranged on the base electrode layer 32, a plating layer 34 arranged on the inner glass layer 33a and the outer glass layer 33b, and a surface plating layer 35 arranged on the plating layer 34.

[0059] The glass layer 31 includes a glass component. The glass component includes at least one selected from boron (B), silicon (Si), barium (Ba), magnesium (Mg), aluminum (Al), and lithium (Li). In this embodiment, as the glass component of the glass layer 31, at least one selected from B, Ba, Mg, Al, and Li is added to silicon dioxide (SiO2). When the laminate 12 is observed along the longitudinal direction Z, the glass layer 31 is arranged at a position overlapping with the outer layer portion 16. The glass layer 31 is arranged on both sides of the inner base electrode layer 32a described later in the stacking direction X (at the Figure 2 (center refers to the upper and lower sides).

[0060] The glass layer 31 of the first external electrode 30a is disposed on the fifth surface 12e side of the laminate 12. In this embodiment, the glass layer 31 of the first external electrode 30a is continuously disposed on the first surface 12a, the second surface 12b, the third surface 12c, the fourth surface 12d, and the fifth surface 12e of the laminate 12. The glass layer 31 of the first external electrode 30a may be disposed only on the fifth surface 12e of the laminate 12, but is preferably disposed continuously on the fifth surface 12e, the first surface 12a, and the second surface 12b. Furthermore, the glass layer 31 of the first external electrode 30a is preferably also disposed on the third surface 12c and the fourth surface 12d.

[0061] The glass layer 31 of the first external electrode 30a is arranged on the outer layer 16 on the fifth surface 12e of the laminate 12. The glass layer 31 of the first external electrode 30a is arranged on the outer dielectric layer 17a. In this embodiment, the glass layer 31 of the first external electrode 30a is not connected to the internal electrode 13a exposed on the fifth surface 12e of the laminate 12, but it can be connected to the internal electrode 13a. Regarding the glass layer 31 of the first external electrode 30a, the thickness of the end portion on the center side of the laminate 12 in the longitudinal direction Z on the first surface 12a and the second surface 12b is thinner than that of other portions. Although not shown in the figure, the thickness of the glass layer 31 of the first external electrode 30a on the center side in the longitudinal direction Z on the third surface 12c and the fourth surface 12d is preferably thinner than that of other portions.

[0062] The glass layer 31 of the second external electrode 30b is disposed on the sixth surface 12f side of the laminate 12. In this embodiment, the glass layer 31 of the second external electrode 30b is continuously disposed on the first surface 12a, the second surface 12b, the third surface 12c, the fourth surface 12d, and the sixth surface 12f of the laminate 12. The glass layer 31 of the second external electrode 30b may be disposed only on the sixth surface 12f of the laminate 12, but is preferably continuously disposed on the sixth surface 12f, the first surface 12a, and the second surface 12b. Furthermore, the glass layer 31 of the second external electrode 30b is preferably also disposed on the third surface 12c and the fourth surface 12d.

[0063] The glass layer 31 of the second external electrode 30b is arranged on the outer layer 16 on the sixth surface 12f of the laminate 12. The glass layer 31 of the second external electrode 30b is arranged on the outer dielectric layer 17a. In this embodiment, the glass layer 31 of the second external electrode 30b is not connected to the internal electrode 13a exposed on the sixth surface 12f of the laminate 12, but it can be connected to the internal electrode 13a. Regarding the glass layer 31 of the second external electrode 30b, the thickness of the end portion on the center side of the laminate 12 in the longitudinal direction Z on the first surface 12a and the second surface 12b is thinner than that of the other portions. Although not shown, the thickness of the glass layer 31 of the first external electrode 30a on the center side in the longitudinal direction Z on the third surface 12c and the fourth surface 12d is preferably thinner than that of the other portions.

[0064] The base electrode layer 32 is composed of a sintered layer. The sintered layer contains a glass component and a metal. The glass component contained in the sintered layer includes at least one selected from B, Si, Ba, Mg, Al, and Li. In this embodiment, the glass component contained in the sintered layer is silicon dioxide (SiO2) to which at least one selected from B, Ba, Mg, Al, and Li is added. In this embodiment, the glass components include Al, Ba, and O in addition to Si. The metal contained in the sintered layer includes, for example, at least one selected from Cu, Ni, Ag, Pd, an Ag-Ni alloy, and gold (Au).

[0065] The foundation electrode layer 32 includes an inner foundation electrode layer 32a and an outer foundation electrode layer 32b. When the foundation electrode layer 32 is viewed along the longitudinal direction Z, the inner foundation electrode layer 32a overlaps with the inner layer portion 13. When the foundation electrode layer 32 is viewed along the longitudinal direction Z, the outer foundation electrode layer 32b overlaps with the outer layer portion 16. The outer foundation electrode layer 32b is disposed on the glass layer 31. The outer foundation electrode layer 32b is disposed so as to cover the glass layer 31 from the outer side in the longitudinal direction Z.

[0066] The inner foundation electrode layer 32a of the first external electrode 30a is arranged on the inner layer portion 13 on the fifth surface 12e of the multilayer body 12. The inner foundation electrode layer 32a of the first external electrode 30a is connected to the internal electrode 13a exposed on the fifth surface 12e of the multilayer body 12. Thus, the inner foundation electrode layer 32a of the first external electrode 30a is electrically connected to the internal electrode 13a arranged on the fifth surface 12e of the multilayer body 12.

[0067] The inner foundation electrode layer 32a of the second external electrode 30b is arranged on the inner layer portion 13 on the sixth surface 12f of the multilayer body 12. The inner foundation electrode layer 32a of the second external electrode 30b is connected to the internal electrode 13a exposed on the sixth surface 12f of the multilayer body 12. Thus, the inner foundation electrode layer 32a of the second external electrode 30b is electrically connected to the internal electrode 13a arranged on the sixth surface 12f of the multilayer body 12.

[0068] The outer foundation electrode layer 32b of the first external electrode 30a in this embodiment is continuously disposed at positions opposing the fifth surface 12e, first surface 12a, second surface 12b, third surface 12c, and fourth surface 12d of the multilayer body 12. The outer foundation electrode layer 32b of the first external electrode 30a may be disposed only at positions opposing the fifth surface 12e of the multilayer body 12, but is preferably also continuously disposed at positions opposing the first and second surfaces 12a, 12b. Furthermore, the outer foundation electrode layer 32b of the first external electrode 30a is preferably also disposed at positions opposing the third and fourth surfaces 12c, 12d. The outer foundation electrode layer 32b of the first external electrode 30a is connected to the inner foundation electrode layer 32a of the first external electrode 30a. Consequently, the outer foundation electrode layer 32b of the first external electrode 30a is electrically connected to the internal electrode 13a exposed on the fifth surface 12e of the multilayer body 12. Alternatively, the outer base electrode layer 32 b of the first outer electrode 30 a may be arranged between the third surface 12 c or the fourth surface 12 d and the inner electrode 13 a .

[0069] The outer foundation electrode layer 32b of the second external electrode 30b of this embodiment is continuously arranged at positions opposing the sixth surface 12f, the first surface 12a, the second surface 12b, the third surface 12c, and the fourth surface 12d of the multilayer body 12. The outer foundation electrode layer 32b of the second external electrode 30b may be arranged only at positions opposing the sixth surface 12f of the multilayer body 12, but is preferably also continuously arranged at positions opposing the first surface 12a and the second surface 12b. Furthermore, the outer foundation electrode layer 32b of the second external electrode 30b is preferably also arranged at positions opposing the third surface 12c and the fourth surface 12d. The outer foundation electrode layer 32b of the second external electrode 30b is connected to the inner foundation electrode layer 32a of the second external electrode 30b. Consequently, the outer foundation electrode layer 32b of the second external electrode 30b is electrically connected to the internal electrode 13a exposed on the sixth surface 12f of the multilayer body 12. Alternatively, the outer base electrode layer 32 b of the second outer electrode 30 b may be arranged between the third surface 12 c or the fourth surface 12 d and the inner electrode 13 a .

[0070] The inner glass layer 33a contains a glass component. The glass component includes at least one selected from B, Si, Ba, Mg, Al, and Li. In this embodiment, the glass component of the inner glass layer 33a is silicon dioxide (SiO2) doped with at least one selected from B, Ba, Mg, Al, and Li. The inner glass layer 33a is disposed on the inner foundation electrode layer 32a. In other words, when viewed along the longitudinal direction Z, the inner glass layer 33a is disposed at a position overlapping with the inner foundation electrode layer 32a. In other words, the inner glass layer 33a is disposed so as to cover the inner foundation electrode layer 32a. Since the inner glass layer 33a covers the inner foundation electrode layer 32a, the area of ​​alloying between the inner foundation electrode layer 32a and the plating layer 34, which occurs when forming the plating layer 34, is reduced. This reduces the amount of hydrogen absorbed into the internal electrode 13a, thereby suppressing degradation of insulation resistance.

[0071] The thickness of the inner glass layer 33a (i.e., the dimension in the longitudinal direction Z of the laminate 12) is preferably 0.2 μm or more and 3.5 μm or less. By making it thicker than 0.2 μm, the occlusion of hydrogen generated during the formation of the plating layer 34 can be further suppressed. By making it thinner than 3.5 μm, the time required to form the connecting portion 36, described later, can be prevented from being prolonged.

[0072] The outer glass layer 33b contains a glass component. The glass component includes at least one selected from B, Si, Ba, Mg, Al, and Li. In this embodiment, the outer glass layer 33b comprises silicon dioxide (SiO2) doped with at least one selected from B, Ba, Mg, Al, and Li. The outer glass layer 33b is disposed on the outer foundation electrode layer 32b. In other words, when viewed along the longitudinal direction Z, the outer glass layer 33b is disposed at a position overlapping with the outer foundation electrode layer 32b. In other words, the outer glass layer 33b is disposed so as to cover the outer foundation electrode layer 32b.

[0073] When the inner glass layer 33a and the outer glass layer 33b are continuously arranged, the area on the outer base electrode layer 32b side from the following position: 5 μm on the inner base electrode layer 32a side from the boundary between the inner base electrode layer 32a and the outer base electrode layer 32b in the stacking direction X is referred to as the outer glass layer 33b.

[0074] The outer glass layer 33b extends toward the front end of the outer electrode 30 according to the shape of the outer electrode 30. At this time, the front end of the outer glass layer 33b may be tapered or may not reach the front end of the outer electrode 30.

[0075] The outer glass layer 33b of the first external electrode 30a in this embodiment is continuously disposed at a position opposing the fifth surface 12e, the first surface 12a, the second surface 12b, the third surface 12c, and the fourth surface 12d of the laminate 12. The outer glass layer 33b of the first external electrode 30a may be disposed only on the fifth surface 12e of the laminate 12, but is preferably also disposed continuously on the first surface 12a and the second surface 12b. Furthermore, the outer glass layer 33b of the first external electrode 30a is preferably also disposed on the third surface 12c and the fourth surface 12d.

[0076] The outer glass layer 33b of the second external electrode 30b of this embodiment is continuously disposed at a position opposing the sixth surface 12f, the first surface 12a, the second surface 12b, the third surface 12c, and the fourth surface 12d of the laminate 12. The outer glass layer 33b of the second external electrode 30b may be disposed only on the sixth surface 12f of the laminate 12, but is preferably also disposed continuously on the first surface 12a and the second surface 12b. Furthermore, the outer glass layer 33b of the second external electrode 30b is preferably also disposed on the third surface 12c and the fourth surface 12d.

[0077] The thickness of the outer glass layer 33b in a direction perpendicular to the laminate 12 is thinner than the thickness of the inner glass layer 33a in a direction perpendicular to the laminate 12. For example, the thickness of the portion of the outer glass layer 33b facing the first surface 12a is the thickness in the direction perpendicular to the first surface 12a (i.e., the lamination direction X). Similarly, the thickness of the portion of the inner glass layer 33a facing the first surface 12a is the thickness in the direction perpendicular to the first surface 12a (i.e., the lamination direction X). Furthermore, the thickness of the portion of the outer glass layer 33b facing the fifth surface 12e or the sixth surface 12f is the thickness in the direction perpendicular to the fifth surface 12e or the sixth surface 12f (i.e., the longitudinal direction Z). Similarly, the thickness of the portion of the inner glass layer 33a facing the fifth surface 12e or the sixth surface 12f of the laminate 12 is the thickness in the direction perpendicular to the fifth surface 12e or the sixth surface 12f (ie, the longitudinal direction Z).

[0078] The plating layer 34 is disposed so as to cover the inner glass layer 33a and the outer glass layer 33b. The plating layer 34 is disposed on the inner glass layer 33a and the outer glass layer 33b. In this embodiment, the plating layer 34 is a Ni plating layer. In other words, the main component of the plating layer 34 is Ni. The Ni plating layer 34 can prevent corrosion of the inner base electrode layer 32a by solder during assembly of the multilayer ceramic capacitor 10 (commonly known as copper corrosion).

[0079] The surface plating layer 35 is arranged to cover the plating layer 34. The surface plating layer 35 is arranged on the plating layer 34. The surface plating layer 35 of this embodiment is a Sn plating layer. In other words, the main component of the surface plating layer 35 is Sn.

[0080] like Figure 5 As shown, the external electrode 30 has a connecting portion 36 , which extends through the inner glass layer 33 a and electrically connects the inner base electrode layer 32 a and the plating layer 34 .

[0081] Connecting portion 36 contains the same components as plating layer 34. Specifically, if plating layer 34 is a Ni plating layer, connecting portion 36 contains Ni. If plating layer 34 is a Sn plating layer, connecting portion 36 contains Sn. The presence of connecting portion 36 allows for a uniform plating layer 34 to be formed on inner glass layer 33a in a short period of time, shortens the current path, and thus reduces the resistance of laminated ceramic capacitor 10.

[0082] The connection portion 36 can be confirmed by observing a cross section obtained by cross-section grinding of the laminate 12 in the width direction Y (ie, a cross section including the lamination direction X and the longitudinal direction Z). Figure 5 In the cross section shown, the connecting portion 36 has a columnar shape, but is not limited to this and may also have a shape extending in the width direction Y. In this case, this can be confirmed by observing a cross section obtained by cross-section polishing in the stacking direction X (i.e., a cross section including the width direction Y and the length direction Z).

[0083] The inner foundation electrode layer 32 a preferably satisfies the following relationship in a cross section including the stacking direction X and the longitudinal direction Z (for example, a cross section obtained when the multilayer ceramic capacitor 10 is polished to ½ of its dimension in the width direction Y): area of ​​the glass component / (area of ​​the glass component + area of ​​the metal component) ≤ 0.2. In other words, in a cross section including the stacking direction X and the longitudinal direction Z, the area of ​​the glass component included in the inner foundation electrode layer 32 a is preferably no greater than 20% of the total area of ​​the glass component and the metal component included in the inner foundation electrode layer 32 a. When the area of ​​the glass component and the metal component included in the inner foundation electrode layer 32 a satisfy this relationship, the inner foundation electrode layer 32 a has a high density of metal components, thereby suppressing moisture intrusion into the internal electrodes 13 a.

[0084] For example, the area of ​​the glass component / (area of ​​the glass component + area of ​​the metal component) can be measured as follows. The multilayer ceramic capacitor 10 is ground to 1 / 2 of its dimension in the width direction Y. If an internal electrode 13a is present, it may be ground to 1 / 3 instead of 1 / 2. In the surface exposed by grinding, a position 1.5 μm away from the laminate 12 in the longitudinal direction Z from the internal electrode 13a closest to the outer layer 16 is set as a reference position. The area ratio of the glass is obtained within a range of 20 μm from the reference position toward the center of the laminate 12 in the stacking direction X and 2.0 μm away from the laminate 12 in the longitudinal direction Z from the reference position. The area ratio of glass is calculated, for example, by binarizing the glass component and the metal component using image processing software (e.g., ImageJ from the National Institutes of Health, U.S.) for an image measured under conditions of 2000x magnification, 15.0 kV acceleration voltage, and WD of 7.5 mm using a FE-SEM (Field Emission Scanning Electron Microscope).

[0085] (Effect)

[0086] According to the multilayer ceramic capacitor 10 according to this embodiment, the following effects can be achieved.

[0087] Because the inner glass layer 33a having a glass component is disposed on the inner foundation electrode layer 32a, the area where the inner foundation electrode layer 32a and the plating layer 34 are alloyed is reduced when the plating layer 34 is formed. This reduces the amount of hydrogen stored in the internal electrode 13a and suppresses degradation of insulation resistance.

[0088] The thickness of the inner glass layer 33a having a glass component of the external electrode in the longitudinal direction of the laminate 12 is preferably 0.2 μm or more and 3.5 μm or less. By making it thicker than 0.2 μm, the absorption of hydrogen generated when forming the plating layer 34 can be further suppressed. While if it is less than 3.5 μm, the time required to form the connection portion 36 can be prevented from being prolonged.

[0089] The external electrode 30 includes a connecting portion 36 that extends through the inner glass layer 33a and electrically connects the inner base electrode layer 32a and the plating layer 34. The presence of the connecting portion 36 allows for a uniform plating layer 34 to be formed on the inner glass layer 33a in a short period of time, shortens the current path, and thereby reduces the resistance of the multilayer ceramic capacitor 10.

[0090] The thickness of the inner glass layer 33a having a glass component of the external electrode 30 in the longitudinal direction Z of the laminate 12 is 0.2 μm to 3.5 μm. This structure can further suppress hydrogen absorption and efficiently form the plating layer 34.

[0091] In the inner foundation electrode layer 32 a , area of ​​glass / (area of ​​glass + area of ​​metal component) ≤ 0.2. This structure allows the inner foundation electrode layer 32 a to have a high density of metal components, thereby suppressing moisture intrusion into the internal electrode 13 a.

[0092] (Second embodiment)

[0093] The following describes a multilayer ceramic capacitor according to a second embodiment of the present invention. The multilayer ceramic capacitor according to the second embodiment has the same structure as the multilayer ceramic capacitor according to the first embodiment, except for the shape and arrangement of the first internal electrodes, the shape and arrangement of the second internal electrodes, and the number and structure of the external electrodes. In the second embodiment, the same or similar structures as those in the first embodiment are denoted by the same or similar reference numerals, and detailed descriptions thereof are omitted.

[0094] Figure 6 It is a perspective view of a multilayer ceramic capacitor 110 according to the present embodiment. Figure 7 yes Figure 6 Cross-sectional view at line VII-VII. Figure 8 yes Figure 6 A cross-sectional view taken along line VIII-VIII of FIG.

[0095] Reference Figure 6 The multilayer ceramic capacitor 110 of this embodiment includes a multilayer body 112 and four external electrodes 130a, 130b, 130c, and 130d. In the following description, when there is no need to distinguish between the four external electrodes 130a, 130b, 130c, and 130d, one of the four external electrodes 130a, 130b, 130c, and 130d may be referred to as simply the external electrode 130.

[0096] Reference Figure 7 as well as Figure 8 The internal electrodes of this embodiment include a first internal electrode 113a and a second internal electrode 113b. Figure 9 As shown, the first internal electrode 113a includes a counter electrode portion 115a and two lead electrode portions 115b. Each lead electrode portion 115b is exposed on either the fifth surface 112e or the sixth surface 112f. Figure 10As shown in FIG. 1 , the second inner electrode 113b includes a counter electrode portion 115c and two lead electrode portions 115d. Each lead electrode portion 115d is exposed on either the third surface 112c or the fourth surface 112d. Figure 9 The lead electrode portion 115b and the counter electrode portion 115a are shown as having substantially equal dimensions in the width direction Y. However, the dimension of the lead electrode portion 115b in the width direction Y may decrease as it approaches the nearest of the fifth surface 112e and the sixth surface 112f. The first inner electrode 113a and the second inner electrode 113b are arranged so as to sandwich the inner dielectric layer 14a in the stacking direction X.

[0097] When viewing the stack 112 along the stacking direction X, the external electrodes 130 are arranged on each of the four sides of the stack 112. The first external electrode 130a and the second external electrode 130b are arranged to cover a portion of the first surface 112a, a portion of the second surface 112b, a portion of the third surface 112c, a portion of the fourth surface 112d, and the fifth surface 112e or the sixth surface 112f of the stack 112. The first external electrode 130a and the second external electrode 130b are electrically connected to the first internal electrode 113a. The third external electrode 130c and the fourth external electrode 130d are arranged to cover a portion of the first surface 112a, a portion of the second surface 112b, and the third surface 112c or the fourth surface 112d of the stack 112. The third external electrode 130c and the fourth external electrode 130d are electrically connected to the second internal electrode 113b.

[0098] The external electrode 130 has the same structure as the external electrode 30 according to the first embodiment. Figure 7 、 Figure 8 、 Figure 9 as well as Figure 10As shown, the external electrode 130 includes a glass layer 31 and a base electrode layer 32 disposed so as to cover the glass layer 31. The external electrode 130 includes an inner glass layer 33a and an outer glass layer 33b disposed on the base electrode layer 32, a plating layer 34 disposed on the inner and outer glass layers 33a and 33b, and a surface plating layer 35 disposed on the plating layer 34. The base electrode layer 32 of the external electrodes 130a and 130b is an example of the first base electrode layer according to the present disclosure, while the base electrode layer 32 of the external electrodes 130c and 130d is an example of the second base electrode layer according to the present disclosure. The inner glass layer 33a of the external electrodes 130a and 130b is an example of the first inner glass layer according to the present disclosure, while the inner glass layer 33a of the external electrodes 130c and 130d is an example of the second inner glass layer according to the present disclosure. The plating layer 34 of the external electrodes 130 a and 130 b is an example of a first plating layer according to the present disclosure, and the plating layer 34 of the external electrodes 130 c and 130 d is an example of a second plating layer according to the present disclosure.

[0099] In this embodiment, each of the four external electrodes 130a, 130b, 130c, and 130d has the above-described structure, that is, the same structure as the external electrode 30 according to the first embodiment, but the present invention is not limited thereto. Alternatively, two external electrodes 130 disposed at opposing positions among the four external electrodes 130a, 130b, 130c, and 130d may have the above-described structure. Alternatively, only external electrodes 130a and 130b may have the above-described structure, or only external electrodes 130c and 130d may have the above-described structure.

[0100] The foundation electrode layer 32 includes an inner foundation electrode layer 32a and an outer foundation electrode layer 32b. When the foundation electrode layer 32 is viewed along the longitudinal direction Z or the width direction Y, the inner foundation electrode layer 32a overlaps with the inner layer portion 13. When the foundation electrode layer 32 is viewed along the longitudinal direction Z or the width direction Y, the outer foundation electrode layer 32b overlaps with the outer layer portion 16. The outer foundation electrode layer 32b is disposed on the glass layer 31. The outer foundation electrode layer 32b is disposed so as to cover the glass layer 31 from the outside in the longitudinal direction Z.

[0101] like Figure 7 、 Figure 8 、 Figure 9 as well as Figure 10As shown, the external electrode 130 has a connecting portion 36 that extends through the inner glass layer 33a and electrically connects the inner base electrode layer 32a and the plating layer 34. The connecting portion 36 of the external electrodes 130a and 130b is an example of a first connecting portion according to the present disclosure, and the connecting portion 36 of the external electrodes 130c and 130d is an example of a second connecting portion according to the present disclosure.

[0102] In the multilayer ceramic capacitor 110 of the second embodiment, by applying the structure of the external electrode 30 of the multilayer ceramic capacitor 10 of the first embodiment to the external electrode 130 to which a "+" potential is applied among the four external electrodes 130a, 130b, 130c, and 130d, the same operational effects as those of the multilayer ceramic capacitor 10 of the first embodiment are achieved. Furthermore, even if the structure of the external electrode 30 of the multilayer ceramic capacitor 10 of the first embodiment is applied to all four external electrodes 130a, 130b, 130c, and 130d, the same operational effects as those of the multilayer ceramic capacitor 10 of the first embodiment are achieved.

[0103] 2. Manufacturing Method of Multilayer Ceramic Capacitors

[0104] Below, refer to Figure 11 A method for manufacturing a multilayer ceramic capacitor will be described. Figure 11 This is a flowchart for explaining a method for manufacturing a multilayer ceramic capacitor. The following description uses the method for manufacturing the multilayer ceramic capacitor 10 according to the first embodiment as an example. The multilayer ceramic capacitor 110 according to the second embodiment can be manufactured using the same manufacturing method as the multilayer ceramic capacitor 10 according to the first embodiment.

[0105] In step S1, a dielectric sheet, a conductive paste for internal electrodes, and a conductive paste for external electrodes are prepared. The dielectric sheet, the conductive paste for internal electrodes, and the conductive paste for external electrodes contain a binder and a solvent.

[0106] In step S2, a conductive paste for the internal electrodes is printed in a predetermined pattern on the dielectric sheet, thereby forming an inner layer dielectric sheet having the internal electrode pattern of the inner layer portion 13 printed thereon. Printing the conductive paste for the internal electrodes onto the dielectric sheet can also be performed by, for example, screen printing or gravure printing.

[0107] In step S3 , the dielectric sheets and the dielectric sheets for internal electrodes are stacked and pressed in the stacking direction by, for example, isostatic pressing, to form a stacked block.

[0108] In step S4, the stacked block is cut into predetermined sizes to produce stacked small pieces. The corners and ridges of the stacked small pieces may then be rounded by barrel grinding or the like.

[0109] In step S5 , the stacked small pieces are fired to form the stacked body 12 according to the present embodiment.

[0110] In step S6, a conductive paste containing a glass component and a metal is applied to the third to sixth surfaces 12c to 12f, for example, by dipping or by extruding the conductive paste through a slit plate. Then, a sintering process is performed to form the glass layer 31, the inner foundation electrode layer 32a, the outer foundation electrode layer 32b, the inner glass layer 33a, and the outer glass layer 33b.

[0111] In step S6, increasing the glass content in the conductive paste containing the glass component can increase the thickness of the inner glass layer 33a. In addition, increasing the temperature during the sintering process can increase the thickness of the inner glass layer 33a.

[0112] In step S7, the glass layer 31, the inner base electrode layer 32a, the outer base electrode layer 32b, the inner glass layer 33a, and the outer glass layer 33b formed in step S6 are immersed in a glass dissolving liquid, thereby forming a crack in the inner glass layer 33a. The crack is formed so as to extend through the inner glass layer 33a in the thickness direction.

[0113] In step S8, the plated layer 34 is formed so as to connect the inner base electrode layer 32a and the outer base electrode layer 32b. Electrolytic plating is preferably used as the plating process. Barrel plating is preferably used as the plating method. The nickel used to form the plated layer 34 forms a connecting portion 36 along the crack formed in step S7.

[0114] When four external electrodes are arranged on the laminate 112 as in the second embodiment, the glass layer 31, the inner base electrode layer 32a, the outer base electrode layer 32b, the inner glass layer 33a, and the outer glass layer 33b are arranged on the third to sixth surfaces in step S6. In step S7, the glass layer 31, the base electrode layer 32, the inner glass layer 33a, and the outer glass layer 33b arranged on desired surfaces among the third to sixth surfaces are selectively immersed in a glass dissolving liquid, thereby forming the external electrodes according to the present invention on the desired surfaces.

[0115] Furthermore, as described above, the embodiments of the present invention are disclosed through the above description, but the present invention is not limited thereto. That is, various modifications can be made to the embodiments described above with respect to mechanism, shape, material, quantity, position, or arrangement, etc., without departing from the scope of the technical concept and purpose of the present invention, and such modifications are encompassed by the present invention.

[0116] As an example, in Figure 2 、 Figure 3 、 Figure 4 In FIG, the step layer 19 is arranged on the same plane as the internal electrode 13a, but the step layer 19 may not be arranged on the same plane as the internal electrode 13a. Figures 7 to 10 In the embodiment shown in FIG1 , the stepped layer 19 is arranged on the same plane as the first internal electrode 113 a and the second internal electrode 113 b. However, the stepped layer 19 does not need to be arranged on the same plane as the first internal electrode 113 a and the second internal electrode 113 b. In other words, the stepped layer 19 does not need to be provided in the inner layer portion 13.

[0117] Description of Reference Numerals

[0118] 10: Multilayer ceramic capacitor;

[0119] 12: laminate;

[0120] 13: inner layer;

[0121] 13a: internal electrode;

[0122] 14a: inner dielectric layer;

[0123] 15a: opposing electrode portion;

[0124] 15b: lead-out electrode portion;

[0125] 16: outer part;

[0126] 16a: 1st outer part;

[0127] 16b: 2nd outer part;

[0128] 17a: outer dielectric layer;

[0129] 19: step layer;

[0130] 30: external electrode;

[0131] 30a: first external electrode;

[0132] 30b: second external electrode;

[0133] 31: glass layer;

[0134] 32: base electrode layer;

[0135] 32a: inner base electrode layer;

[0136] 32b: outer base electrode layer;

[0137] 33a: inner glass layer;

[0138] 33b: outer glass layer;

[0139] 34: plating layer;

[0140] 35: surface coating;

[0141] 36: Connection part.

Claims

1. A multilayer ceramic capacitor comprising: a laminate having a first surface and a second surface opposing each other in a stacking direction, a third surface and a fourth surface opposing each other in a first direction perpendicular to the stacking direction, and a fifth surface and a sixth surface opposing each other in a second direction perpendicular to the stacking direction and the first direction; and The external electrode is arranged on the fifth surface of the stack. The laminate includes an inner layer portion, the inner layer portion including: an inner dielectric layer; and an internal electrode stacked on the inner dielectric layer in the stacking direction and having an end portion located on the fifth surface. The external electrode comprises: an inner base electrode layer, arranged on the inner portion on the fifth surface and connected to the inner electrode; an inner glass layer, disposed on the inner base electrode layer, comprising a glass component; a coating layer disposed on the inner glass layer; as well as The connecting portion extends to penetrate the inner glass layer and electrically connects the inner base electrode layer and the plating layer.

2. The multilayer ceramic capacitor according to claim 1, wherein The connection portion includes the same metal component as the plating layer.

3. The multilayer ceramic capacitor according to claim 1 or 2, wherein The main component of the plating layer is Ni.

4. The multilayer ceramic capacitor according to any one of claims 1 to 3, wherein The device comprises an outer layer portion including an outer dielectric layer, and is arranged on the first surface side relative to the inner layer portion. The external electrode comprises: a glass layer, disposed on the outer dielectric layer, and having a glass component; an outer base electrode layer, disposed on the glass layer and connected to the inner base electrode layer; and The outer glass layer is disposed on the outer base electrode layer and has a glass component.

5. The multilayer ceramic capacitor according to claim 4, wherein The thickness of the outer glass layer is thinner than that of the inner glass layer.

6. A multilayer ceramic capacitor comprising: A laminate having a first surface and a second surface opposing each other in a laminating direction, a third surface and a fourth surface opposing each other in a first direction perpendicular to the laminating direction, and a fifth surface and a sixth surface opposing each other in a second direction perpendicular to the laminating direction and the first direction; a first external electrode disposed on the fifth surface of the stack; a second external electrode disposed on the sixth surface of the stack; a third external electrode disposed on the third surface of the stack; and a fourth external electrode disposed on the fourth surface of the stacked body; The laminate includes an inner layer portion having an inner dielectric layer; and a first inner electrode and a second inner electrode arranged to sandwich the inner dielectric layer in the lamination direction. The first internal electrode has two end portions located on the fifth surface and the sixth surface, respectively. The second internal electrode has two end portions located on the third surface and the fourth surface, respectively. The first external electrode and the second external electrode each include: a first inner base electrode layer disposed on the inner portion and connected to the first inner electrode; a first inner glass layer, disposed on the first inner base electrode layer, comprising a glass component; a first coating layer disposed on the first inner glass layer; and The first connecting portion extends to penetrate the first inner glass layer and electrically connects the first inner base electrode layer and the first plating layer.

7. The multilayer ceramic capacitor according to claim 6, wherein The third external electrode and the fourth external electrode each include: a second inner base electrode layer disposed on the inner layer portion and connected to the second inner electrode; a second inner glass layer, disposed on the second inner base electrode layer, comprising a glass component; a second coating layer disposed on the second inner glass layer; as well as The second connecting portion extends to penetrate the second inner glass layer and electrically connects the second inner base electrode layer and the second plating layer.

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