Test system and test method for photoelectric detector

Abstract

The invention discloses a test system and a test method for a photoelectric detector, the test system comprises an upper computer, a system board and a test assembly, and the system board is configured to be in communication connection with the upper computer and the test assembly; the test assembly is configured to be in communication connection with a to-be-tested photoelectric detector, and the test assembly is used for providing test light for the to-be-tested photoelectric detector and receiving an output signal of the to-be-tested photoelectric detector; the system board generates a test signal after receiving a test instruction sent by the upper computer, and sends the test signal to the test assembly; and the test assembly generates corresponding test light based on the test signal so as to test the photoelectric detector to be tested, receives an output signal generated by the photoelectric detector to be tested based on the test light, and transmits the output signal to the system board, so that the system board processes the output signal and transmits the processed output signal to the upper computer. The test efficiency of the test system can be improved, and the test cost can be reduced.

Description

Technical Field

[0001] The present application relates to the field of photoelectric detection technology, and in particular to a testing system and a testing method for a photoelectric detector. Background Art

[0002] Photodetector is an emerging technology that is often used in medical CT (Computed Tomography) and is one of the most important components of CT machines.

[0003] Photodetectors directly determine key indicators such as the clarity, resolution, and contrast of CT images. In related technologies, in order to ensure the reliability and stability of photodetectors, photodetector testing equipment is usually used to test the performance of each photodetector.

[0004] However, existing photodetector testing equipment is usually an integral structure without modular design and extremely high integration, which makes its compatibility and scalability poor, and it is unable to flexibly test different types of photodetectors, resulting in low testing efficiency and high testing costs. Summary of the Invention

[0005] The main technical problem solved by the present application is to provide a testing system and a testing method for a photoelectric detector, which can solve the problems of low testing efficiency and high testing cost existing in related photoelectric detector testing technologies.

[0006] In order to solve the above technical problems, the first technical solution adopted in this application is to provide a test system for photodetectors, including a host computer, a system board and a test component, the system board is configured to be communicatively connected with both the host computer and the test component; the test component is configured to be communicatively connected with the photodetector to be tested, and the test component is used to provide at least one wavelength of test light for the photodetector to be tested, and to receive the output signal of the photodetector to be tested; wherein, after the system board receives the test instruction sent by the host computer, it generates a test signal based on the test instruction, and sends the test signal to the test component; after receiving the test signal, the test component generates corresponding test light based on the test signal to test the photodetector to be tested, and receives the output signal generated by the photodetector to be tested based on the test light, and transmits the output signal to the system board, so that the system board processes the output signal and transmits the processed output signal to the host computer.

[0007] Among them, the test component includes a communication carrier board and a light source component, a communication adapter board and a first connector arranged on the communication carrier board, and the first connector is connected to both the light source component and the communication adapter board; the light source component is used to provide test light for the photodetector to be tested, the communication adapter board is used to connect with the photodetector to be tested, and the first connector is connected to the system board; wherein, the light source component receives the test signal sent by the system board through the first connector, and emits corresponding test light based on the test signal to illuminate the photodetector to be tested; the communication adapter board receives the output signal generated by the photodetector to be tested based on the test light, and transmits the output signal to the system board through the first connector.

[0008] The communication adapter board is connected to the photoelectric detector to be tested via a first communication connection line; the communication adapter board receives the output signal generated by the photoelectric detector to be tested via the first communication connection line.

[0009] The communication adapter board and the communication carrier board are detachably connected.

[0010] The test assembly includes a darkroom, which includes a top wall and a side wall connected to the top wall. One end of the side wall away from the top wall is connected to the communication carrier board to form a closed space, which is used to accommodate the photodetector to be tested.

[0011] A support member is provided on the side wall of the darkroom, and the support member is provided with an opening, which corresponds to the light source assembly; the photodetector to be tested is provided on the support member, and the area where the photodetector to be tested is provided with a scintillator corresponds to the opening, so that the test light emitted by the light source assembly illuminates the scintillator through the opening.

[0012] Among them, the system board includes a main control unit, a programmable logic unit, a power supply unit, a first communication interface and a second connector, and the second connector is connected to the first connector; the main control unit is respectively connected to the host computer, the programmable logic unit and the power supply unit, for receiving test instructions sent by the host computer, so as to generate a power signal based on the test instructions, and output the power signal and the test instructions to the power supply unit and the programmable logic unit respectively; the power supply unit is respectively connected to the main control unit, the programmable logic unit and the second connector, for providing working power to the main control unit, the programmable logic unit and the second connector according to the power signal; the programmable logic unit is connected to the second connector, for receiving test instructions forwarded by the main control unit, so as to generate a test signal based on the test instructions, and transmit the test signal to the first connector through the second connector, so as to transmit it to the light source component through the first connector, and receive the output signal transmitted by the first connector through the second connector, process the output signal, and transmit the processed output signal to the host computer through the main control unit.

[0013] Among them, the first connector is connected to the second connector through the second communication connection line; the first connector receives the test signal transmitted by the second connector through the second communication connection line, and transmits the output signal received by the communication adapter board to the second connector through the second communication connection line; the system board includes a first communication interface, the first communication interface is connected to the host computer through the third communication connection line, and the main control unit is connected to the first communication interface; the main control unit receives the test instructions sent by the host computer through the first communication interface.

[0014] In order to solve the above technical problems, the second technical solution adopted in this application is to provide a testing method for photodetectors, which is performed through a testing system. The testing system includes a host computer, a system board and a testing component. The system board is configured to be communicatively connected with both the host computer and the testing component; the testing component is configured to be communicatively connected with the photodetector to be tested, and the testing component is used to provide at least one wavelength of test light to the photodetector to be tested, and to receive the output signal of the photodetector to be tested; the testing method includes: receiving a test instruction sent by the host computer through the system board, generating a test signal based on the test instruction, and sending the test signal to the testing component; receiving the test signal through the testing component, and generating corresponding test light based on the test signal to test the photodetector to be tested; and receiving the output signal generated by the photodetector to be tested based on the test light through the testing component, and transmitting the output signal to the system board; receiving the output signal through the system board and processing the output signal, and transmitting the processed output signal to the host computer.

[0015] Among them, before the steps of receiving the test instruction sent by the host computer through the system board, generating a test signal based on the test instruction, and sending the test signal to the test component, it includes: receiving the detection instruction sent by the host computer through the system board, generating a detection signal based on the detection instruction, and sending the detection signal to the test component; receiving the detection signal through the test component, and detecting the circuit board to be tested without a scintillator mounted thereon based on the detection signal; and receiving the communication signal generated by the circuit board to be tested through the test component, and transmitting the communication signal to the system board; receiving the communication signal through the system board and processing the communication signal, and transmitting the processed communication signal to the host computer so that the host computer detects the processed communication signal; in response to the detection result that the processed communication signal is valid communication data, mounting a scintillator on the circuit board to be tested to obtain a photoelectric detector to be tested.

[0016] The beneficial effects of the present application are as follows: Different from the prior art, the present application provides a test system and test method for a photodetector. By making the test system include a host computer, a system board, and a test component, and by making the system board, the host computer, and the test component all communicatively connected, the test system can be modularly designed to facilitate independent configuration of the system board and the test component. Furthermore, when the test requirements change, by adjusting or replacing the test component and / or upgrading the system board software, the compatibility and scalability of the test system can be improved, so that the test system can be applied to more test scenarios and meet the test requirements of more types of photodetectors to be tested, thereby not only improving the test efficiency of the test system but also reducing the test cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 This is a principle block diagram of an embodiment of a test system for a photoelectric detector of the present application;

[0019] Figure 2 yes Figure 1 Signal flow diagram of the test system;

[0020] Figure 3 yes Figure 1 Schematic diagram of the test system.

[0021] Figure 4 This is a flow chart of a first embodiment of a testing method for a photoelectric detector according to the present application;

[0022] Figure 5 It is a flow chart of the second embodiment of the testing method for photoelectric detectors of the present application. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0024] The terms used in the examples of this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms "a," "the," and "the" used in the examples of this application and the appended claims are also intended to include plural forms. Unless otherwise clearly indicated above, "a plurality" generally includes at least two, but does not exclude the inclusion of at least one.

[0025] It should be understood that the term "and / or" as used herein is merely a description of the relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0026] It should be understood that the terms "comprises," "comprising," or any other variations used herein are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0027] Photodetectors directly determine key indicators such as the clarity, resolution, and contrast of CT images. In related technologies, in order to ensure the reliability and stability of photodetectors, photodetector testing equipment is usually used to test the performance of each photodetector.

[0028] However, existing photodetector testing equipment is usually an integral structure without modular design and extremely high integration, which makes its compatibility and scalability poor, and it is unable to flexibly test different types of photodetectors, resulting in low testing efficiency and high testing costs.

[0029] Based on the above situation, the present application provides a testing system and a testing method for a photoelectric detector, which can solve the problems of low testing efficiency and high testing cost existing in related photoelectric detector testing technologies.

[0030] Specifically, see Figure 1 , Figure 1 This is a principle block diagram of an embodiment of a test system for a photoelectric detector of the present application.

[0031] In this embodiment, a photodetector testing system 100 includes a host computer 10, a system board 20, and a testing assembly 30. The system board 20 is configured to be communicatively connected to both the host computer 10 and the testing assembly 30. The testing assembly 30 is configured to be communicatively connected to the photodetector under test, and is configured to provide test light of at least one wavelength to the photodetector under test and to receive an output signal from the photodetector under test.

[0032] Among them, the photodetector to be tested includes a PCB (Printed Circuit Board) and a scintillator and a photodetection chip arranged on the PCB. The scintillator is used to convert the test light into visible light, and the photodetection chip is used to receive the visible light converted by the scintillator and convert it into an electrical signal for output.

[0033] Please refer to Figure 2 , Figure 2 yes Figure 1 Signal flow diagram of the test system in FIG. In this embodiment, the host computer 10 sends a test instruction to the system board 20. After receiving the test instruction sent by the host computer 10, the system board 20 generates a test signal based on the test instruction and sends the test signal to the test component 30. After receiving the test signal, the test component 30 generates corresponding test light based on the test signal to test the photodetector to be tested, receives the output signal generated by the photodetector to be tested based on the test light, and transmits the output signal to the system board 20 so that the system board 20 processes the output signal and transmits the processed output signal to the host computer 10.

[0034] In some implementations, the host computer 10 may be host computer software running on an industrial computer, or may be a hardware device such as a computer, a mobile phone, or a tablet computer.

[0035] In some embodiments, the test instruction is a program code written by the host computer 10 based on the photodetector to be tested. The test instruction includes various test parameters for performing the test. Upon receiving the test instruction, the system board 20 may generate a corresponding test signal based on the various test parameters in the test instruction. The test signal includes the wavelength parameters of the corresponding test light.

[0036] In this embodiment, a test instruction is sent to the system board 20 by the host computer 10, and a test signal generated based on the test instruction is transmitted to the test component 30 by the system board 20, so that the corresponding test light is generated by the test component 30 to test the photodetector to be tested, and the output signal (original test data) generated by the photodetector to be tested is transmitted to the system board 20 by the test component 30, so that the output signal is processed by the system board 20, and the processed output signal is transmitted to the host computer 10, which can analyze the processed output signal and compare the test result obtained by the analysis with the preset test threshold, thereby completing the detection of at least one performance of the photodetector to be tested, and then accurately screening out defective products.

[0037] In some implementations, the test result of each photoelectric detector to be tested is displayed via a corresponding display interface of the host computer 10 .

[0038] In some implementations, the screening criteria for the photoelectric detectors to be tested can be adjusted by modifying the preset test threshold in the corresponding display interface of the host computer 10 .

[0039] In this embodiment, by adjusting or replacing the test components 30 , different test components 30 can provide test lights of different wavelengths to meet the test requirements of different types of photodetectors to be tested.

[0040] In this embodiment, the software program in the system board 20 can be remotely upgraded through remote monitoring and online firmware upgrade, so that the system board 20 can test more types of photodetectors to be tested.

[0041] It can be understood that when the test requirements change, the compatibility and scalability of the test system 100 can be improved by adjusting or replacing the test component 30, so that the test system 100 can be applied to more test scenarios to meet the test requirements of more types of photodetectors to be tested, thereby not only improving the test efficiency of the test system 100, but also reducing the test cost.

[0042] Please refer to Figure 3 , Figure 3 yes Figure 1 Schematic diagram of the test system.

[0043] In this embodiment, the test assembly 30 includes a communication carrier board 31, a light source assembly 32, a communication adapter board 33, and a first connector 34 disposed on the communication carrier board 31. The first connector 34 is connected to both the light source assembly 32 and the communication adapter board 33. The light source assembly 32 is used to provide test light to the photodetector 40 under test. The communication adapter board 33 is used to connect to the photodetector 40 under test. The first connector 34 is connected to the system board 20. The light source assembly 32 receives a test signal from the system board 20 via the first connector 34 and, based on the test signal, emits corresponding test light to illuminate the photodetector 40 under test. The communication adapter board 33 receives an output signal generated by the photodetector 40 under test based on the test light and transmits the output signal to the system board 20 via the first connector 34.

[0044] In some embodiments, the communication adapter board 33 is connected to the photodetector 40 to be tested via a first communication connection line 51. The communication adapter board 33 receives the output signal generated by the photodetector 40 to be tested via the first communication connection line 51.

[0045] In some embodiments, the photodetector 40 to be tested includes a circuit board 41 and a scintillator 42 arranged on the circuit board 41, a photodetection chip (not shown), and a third connector 43 arranged on the side of the photodetection chip away from the circuit board 41. The scintillator 42 is used to convert the test light into visible light, and the photodetection chip is used to receive the visible light converted by the scintillator 42 and convert it into an electrical signal for output. The third connector 43 is connected to the end of the first communication connection line 51 away from the communication adapter board 33, and is used to transmit the electrical signal output by the photodetection chip to the communication adapter board 33 through the first communication connection line 51.

[0046] In some embodiments, the communication adapter board 33 is detachably connected to the communication carrier board 31 .

[0047] As can be understood, by replacing different communication adapter boards 33, communication connections with different types of photodetectors 40 under test can be achieved, allowing the test assembly 30 to test different types of photodetectors 40 under test, thereby meeting the testing requirements of different types of photodetectors 40 under test and improving the compatibility and scalability of the test system 100. Furthermore, by only replacing the communication adapter board 33, the maintenance and R&D costs of the test assembly 30 can be reduced, thereby reducing the overall testing cost.

[0048] In some implementations, the light source assembly 32 is a light source matrix.

[0049] In some implementations, the light source assembly 32 is configured to provide test lights of three wavelengths, so that the photodetector 40 to be tested generates corresponding output signals based on the three different test lights.

[0050] In some specific implementations, the light source assembly 32 is configured to provide three test lights having wavelengths of 525 nm, 590 nm, and 850 nm, respectively.

[0051] It is understandable that by replacing the entire test assembly 30 , different types of light source assemblies 32 can be replaced to provide test lights of more wavelengths for the photodetector 40 to be tested, thereby meeting the test requirements of different types of photodetectors 40 to be tested.

[0052] In some embodiments, the test assembly 30 includes a darkroom 60, which includes a top wall 61 and a side wall 62 connected to the top wall 61, and an end of the side wall 62 away from the top wall 61 is connected to the communication carrier board 31 to form a closed space, which is used to accommodate the photodetector 40 to be tested.

[0053] In some specific embodiments, such as Figure 3 As shown, a support member 63 is provided on a side wall 62 of the darkroom 60. The support member 63 is provided with an opening 64, and the opening 64 corresponds to the light source assembly 32. The photodetector 40 to be tested is disposed on the support member 63, and the area of ​​the photodetector 40 to be tested where the scintillator 42 is provided corresponds to the opening 64, so that the test light emitted by the light source assembly 32 illuminates the scintillator 42 through the opening 64.

[0054] It can be understood that the closed space formed by the darkroom 60 and the communication carrier board 31 can better shield external light to simulate a special optical environment, thereby improving the test accuracy.

[0055] In this embodiment, the system board 20 includes a main control unit 21 , a programmable logic unit 22 , a power supply unit 23 , a first communication interface 24 , and a second connector 25 . The second connector 25 is connected to the first connector 34 .

[0056] In this embodiment, the main control unit 21 is connected to the host computer 10, the programmable logic unit 22 and the power supply unit 23 respectively, and is used to receive the test instructions sent by the host computer 10 to generate a power signal based on the test instructions, and output the power signal and the test instructions to the power supply unit 23 and the programmable logic unit 22 respectively.

[0057] In some implementations, the power signal includes a voltage parameter and a power parameter.

[0058] In some embodiments, the system board 20 includes a first communication interface (not shown), the first communication interface is connected to the host computer 10 via a third communication connection line 53, the main control unit 21 is connected to the first communication interface, and the main control unit 21 receives the test instructions sent by the host computer 10 through the first communication interface.

[0059] In some embodiments, the first connector 34 is connected to the second connector 25 via a second communication connection line 52. The first connector 34 receives a test signal transmitted by the second connector 25 via the second communication connection line 52, and transmits an output signal received by the communication adapter board 33 to the second connector 25 via the second communication connection line 52.

[0060] In some implementations, the main control unit 21 is a microcontroller (MCU) that can be programmed to perform complex control functions.

[0061] In some implementations, the program in the main control unit 21 can be upgraded through remote monitoring or firmware online upgrade.

[0062] In this embodiment, the power supply unit 23 is connected to the main control unit 21, the programmable logic unit 22 and the second connector 25 respectively, and is used to provide working power to the main control unit 21, the programmable logic unit 22 and the second connector 25 according to the power signal.

[0063] In this embodiment, the programmable logic unit 22 is connected to the second connector 25, and is used to receive test instructions forwarded by the main control unit 21, to generate a test signal based on the test instruction, and to transmit the test signal to the first connector 34 through the second connector 25, to transmit it to the light source assembly 32 through the first connector 34, and to receive the output signal transmitted by the first connector 34 through the second connector 25, and to process the output signal, and to transmit the processed output signal to the host computer 10 through the main control unit 21.

[0064] In some implementations, the test signal includes various test parameters for performing a test.

[0065] In some implementations, the programmable logic unit 22 is a Field Programmable Gate Array (FPGA). After receiving the output signal, the programmable logic unit 22 processes the output signal using a preset algorithm.

[0066] In some implementations, the program in the programmable logic unit 22 can be upgraded through remote monitoring or firmware online upgrade.

[0067] It can be understood that by remotely upgrading the main control unit 21 and / or the programmable logic unit 22, the main control unit 21 and / or the programmable logic unit 22 can be used to test more performance of the photodetector 40 to be tested without contacting the physical platform, thereby not only improving the maintainability and flexibility of the test system 100, but also reducing maintenance costs.

[0068] In this embodiment, before the scintillator 42 is mounted on the circuit board 41, the test system 100 can be used to perform a communication test on the circuit board 41 to test the communication performance between the circuit board 41 and the photodetection chip. Only after the communication test passes can the scintillator 42 be mounted on the circuit board 41. Conversely, if the communication test fails, the subsequent scintillator mounting is not performed.

[0069] It can be understood that performing communication detection on the circuit board 41 before mounting the scintillator 42 can screen out defective products in advance, thereby reducing the waste caused by mounting the scintillator despite abnormal communication functions, thereby reducing the preparation cost and testing cost of the photodetector to be tested.

[0070] Unlike related art, this embodiment enables modular design of the test system 100 by enabling communication between the system board 20, the host computer 10, and the test component 30. This facilitates independent configuration of the system board 20 and the test component 30. Furthermore, when testing requirements change, the compatibility and scalability of the test system 100 can be improved by adjusting or replacing the test component 30, allowing the test system 100 to be applied to more testing scenarios and meet the testing requirements of more types of photodetectors under test. This not only improves the testing efficiency of the test system 100 but also reduces testing costs.

[0071] Correspondingly, the present application provides a testing method for a photodetector.

[0072] Specifically, see Figure 4 , Figure 4 The figure is a flow chart of a first embodiment of the test method for photodetectors of the present application. The test method is performed using the aforementioned test system, which includes a host computer, a system board, and a test component. The system board is configured to communicate with both the host computer and the test component. The test component is configured to communicate with the photodetector to be tested, and the test component is used to provide test light of at least one wavelength to the photodetector to be tested, and to receive an output signal from the photodetector to be tested. In this embodiment, the test method includes:

[0073] S11: receiving a test instruction sent by the host computer through the system board, generating a test signal based on the test instruction, and sending the test signal to the test component.

[0074] In some implementations, the test instruction is a program code written by a host computer based on the photodetector to be tested, wherein the test instruction includes various test parameters for performing the test.

[0075] In this embodiment, after receiving the test instruction, the system board can generate a corresponding test signal based on various test parameters in the test instruction, wherein the test signal includes the wavelength parameter of the corresponding test light.

[0076] S12: receiving a test signal through a test component, and generating corresponding test light based on the test signal to test the photodetector to be tested.

[0077] In this embodiment, after receiving the test signal, the test component emits corresponding test light based on the wavelength parameter corresponding to the test signal, so as to provide illumination for the photoelectric detector to be tested based on the test light.

[0078] S13: Receive, through the test component, an output signal generated by the photoelectric detector to be tested based on the test light, and transmit the output signal to the system board.

[0079] In this embodiment, the scintillator in the photodetector to be tested converts the test light into visible light. After the photodetection chip in the photodetector to be tested receives the visible light converted by the scintillator, it converts the visible light into an electrical signal for output and interacts with the test component for data, so that the test component receives the output signal (original test data) generated by the photodetector to be tested and transmits the output signal to the system board.

[0080] S14: receiving the output signal through the system board, processing the output signal, and transmitting the processed output signal to the host computer.

[0081] In this embodiment, the system board receives the output signal through the FPGA, and processes the output signal through the FPGA based on a preset algorithm, and then receives the processed output signal transmitted by the FPGA through the MAU, and transmits the processed output signal to the host computer, so that the host computer analyzes the processed output signal and compares the test result obtained by the analysis with the preset test threshold, thereby completing the detection of at least one performance of the photoelectric detector to be tested, and then accurately screening out defective products.

[0082] As can be understood, this embodiment enables modular design of the test system by including a host computer, a system board, and test components, and by ensuring that the system board is communicatively connected to both the host computer and the test components. This facilitates independent configuration of the system board and the test components. Furthermore, when test requirements change, the compatibility and scalability of the test system can be improved by adjusting or replacing the test components and / or upgrading the system board software. This allows the test system to be applied to a wider range of test scenarios and meet the test requirements of a wider range of photodetector types, thereby improving the test system's test efficiency and reducing test costs.

[0083] See also Figure 5 , Figure 5This is a flow chart of a second embodiment of the test method for photodetectors of the present application. The test method is performed using the aforementioned test system, which includes a host computer, a system board, and a test component. The system board is configured to communicate with both the host computer and the test component. The test component is configured to communicate with the photodetector under test, providing at least one wavelength of test light to the photodetector under test and receiving an output signal from the photodetector under test. In this embodiment, the test method includes:

[0084] S21: Receive a detection instruction sent by the host computer through the system board, generate a detection signal based on the detection instruction, and send the detection signal to the test component.

[0085] In this embodiment, the detection instruction is a program code written by the host computer based on the circuit board to be tested. The detection instruction includes various test parameters for performing communication testing.

[0086] S22: receiving a detection signal through the test component, and detecting the circuit board to be tested without the scintillator mounted thereon based on the detection signal.

[0087] In this embodiment, after receiving the detection signal, the test component performs a communication test on the circuit board to be tested and the photoelectric detection chip mounted on the circuit board to be tested based on the test parameters corresponding to the detection signal.

[0088] S23: Receive the communication signal generated by the circuit board under test through the test component, and transmit the communication signal to the system board.

[0089] S24: receiving the communication signal through the system board, processing the communication signal, and transmitting the processed communication signal to the host computer so that the host computer detects the processed communication signal.

[0090] In this embodiment, the system board receives the communication signal through the FPGA, and processes the communication signal based on a preset algorithm through the FPGA, and then receives the processed communication signal transmitted by the FPGA through the MAU, and transmits the processed communication signal to the host computer, so that the host computer analyzes the processed communication signal, and compares the test results obtained by the analysis with the preset test threshold to complete the detection of the communication performance of the photoelectric detector to be tested.

[0091] S25: In response to the detection result that the processed communication signal is valid communication data, a scintillator is mounted on the circuit board to be tested to obtain a photodetector to be tested.

[0092] In some embodiments, in response to the detection result that the processed communication signal is valid communication data, it indicates that the communication functions of the circuit board to be tested and the photodetection chip are normal, and the subsequent scintillator mounting can be performed.

[0093] In other embodiments, in response to the detection result that the processed communication signal is invalid communication data, indicating that the communication function of the circuit board to be tested and the photodetection chip is abnormal, the subsequent scintillator mounting is not performed at this time, which can effectively reduce the preparation cost and testing cost of the photodetector to be tested.

[0094] S26: Receive the test instruction sent by the host computer through the system board, generate a test signal based on the test instruction, and send the test signal to the test component.

[0095] For the specific process, please refer to the description in S11 and will not be repeated here.

[0096] S27: receiving a test signal through the test component, and generating corresponding test light based on the test signal to test the photodetector to be tested.

[0097] For the specific process, please refer to the description in S12 and will not be repeated here.

[0098] S28: Receive, through the test component, an output signal generated by the photoelectric detector to be tested based on the test light, and transmit the output signal to the system board.

[0099] For the specific process, please refer to the description in S13 and will not be repeated here.

[0100] S29: Receive the output signal through the system board, process the output signal, and transmit the processed output signal to the host computer.

[0101] For the specific process, please refer to the description in S14 and will not be repeated here.

[0102] As can be understood, this embodiment, by performing communication testing on the circuit board before scintillator mounting, can preemptively screen out defective products, reducing waste caused by mounting the scintillator despite communication dysfunction, thereby lowering the production and testing costs of the photodetectors under test. Furthermore, by testing the photodetectors under test after scintillator mounting, at least one performance characteristic of the photodetectors under test can be fully tested, thereby accurately screening out defective products and improving product yield.

[0103] Unlike related technologies, the present application utilizes a modular design for the test system by including a host computer, a system board, and test components, and by ensuring that the system board is in communication with the host computer and the test components. This allows for independent configuration of the system board and test components. Furthermore, when test requirements change, the compatibility and scalability of the test system can be improved by adjusting or replacing the test components and / or upgrading the system board software. This allows the test system to be applied to more test scenarios and meet the test requirements of more types of photodetectors to be tested, thereby improving the test efficiency of the test system and reducing test costs.

[0104] The above description is only an implementation method of the present application and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the description and drawings of this application, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A test system for a photoelectric detector, characterized in that: It includes a host computer, a system board and a test component, wherein the system board is configured to be communicatively connected with the host computer and the test component; The test component is configured to be in communication with the photodetector to be tested, and is used to provide a test light of at least one wavelength to the photodetector to be tested, and is used to receive an output signal of the photodetector to be tested; Among them, after the system board receives the test instruction sent by the host computer, it generates a test signal based on the test instruction and sends the test signal to the test component; after the test component receives the test signal, it generates the corresponding test light based on the test signal to test the photodetector to be tested, and receives the output signal generated by the photodetector to be tested based on the test light, and transmits the output signal to the system board, so that the system board processes the output signal and transmits the processed output signal to the host computer.

2. The test system according to claim 1, wherein: The test assembly includes a communication carrier board and a light source assembly, a communication adapter board, and a first connector provided on the communication carrier board, wherein the first connector is connected to both the light source assembly and the communication adapter board; the light source assembly is used to provide the test light to the photodetector to be tested, the communication adapter board is used to connect to the photodetector to be tested, and the first connector is connected to the system board; Among them, the light source component receives the test signal sent by the system board through the first connector, and emits the corresponding test light based on the test signal to illuminate the photodetector to be tested; the communication adapter board receives the output signal generated by the photodetector to be tested based on the test light, and transmits the output signal to the system board through the first connector.

3. The test system according to claim 2, wherein: The communication adapter board is connected to the photoelectric detector to be tested via a first communication connection line; the communication adapter board receives the output signal generated by the photoelectric detector to be tested via the first communication connection line.

4. The test system according to claim 2, wherein: The communication adapter board is detachably connected to the communication carrier board.

5. The test system according to claim 2, wherein: The test assembly includes a darkroom, which includes a top wall and a side wall connected to the top wall. One end of the side wall away from the top wall is connected to the communication carrier board to form a closed space, and the closed space is used to accommodate the photodetector to be tested.

6. The test system according to claim 5, characterized in that: A support member is provided on the side wall of the darkroom, and the support member is provided with an opening, which corresponds to the light source assembly; the photodetector to be tested is provided on the support member, and the area of ​​the photodetector to be tested where the scintillator is provided corresponds to the opening, so that the test light emitted by the light source assembly illuminates the scintillator through the opening.

7. The test system according to claim 2, wherein: The system board includes a main control unit, a programmable logic unit, a power supply unit, a first communication interface, and a second connector, wherein the second connector is connected to the first connector; The main control unit is connected to the host computer, the programmable logic unit and the power supply unit respectively, and is used to receive the test instruction sent by the host computer, generate a power signal based on the test instruction, and output the power signal and the test instruction to the power supply unit and the programmable logic unit respectively; The power supply unit is connected to the main control unit, the programmable logic unit and the second connector respectively, and is used to provide working power to the main control unit, the programmable logic unit and the second connector according to the power signal; The programmable logic unit is connected to the second connector and is used to receive the test instruction forwarded by the main control unit, to generate the test signal based on the test instruction, and to transmit the test signal to the first connector through the second connector, so as to transmit it to the light source assembly through the first connector, and to receive the output signal transmitted by the first connector through the second connector, and to process the output signal, and to transmit the processed output signal to the host computer through the main control unit.

8. The test system according to claim 7, characterized in that: The first connector is connected to the second connector via a second communication connection line; the first connector receives the test signal transmitted by the second connector via the second communication connection line, and transmits the output signal received by the communication adapter board to the second connector via the second communication connection line; The system board includes a first communication interface, which is connected to the host computer via a third communication connection line, and the main control unit is connected to the first communication interface; the main control unit receives the test instruction sent by the host computer via the first communication interface.

9. A method for testing a photoelectric detector, characterized in that: The test method is performed by a test system, the test system including a host computer, a system board, and a test component, the system board being configured to be in communication with both the host computer and the test component; the test component being configured to be in communication with a photodetector to be tested, the test component being configured to provide test light of at least one wavelength to the photodetector to be tested, and being configured to receive an output signal of the photodetector to be tested; the test method includes: Receiving a test instruction sent by a host computer through the system board, generating a test signal based on the test instruction, and sending the test signal to the test component; receiving the test signal through the test component and generating the corresponding test light based on the test signal to test the photodetector to be tested; and receiving, by the testing component, the output signal generated by the photodetector to be tested based on the testing light, and transmitting the output signal to the system board; The output signal is received and processed by the system board, and the processed output signal is transmitted to the host computer.

10. The testing method according to claim 9, characterized in that: Before the steps of receiving the test instruction sent by the host computer through the system board, generating a test signal based on the test instruction, and sending the test signal to the test component, the method includes: receiving a detection instruction sent by the host computer through the system board, generating a detection signal based on the detection instruction, and sending the detection signal to the test component; receiving the detection signal through the test component, and detecting the circuit board to be tested without the scintillator mounted thereon based on the detection signal; and receiving, by the test component, a communication signal generated by the circuit board under test, and transmitting the communication signal to the system board; receiving the communication signal through the system board, processing the communication signal, and transmitting the processed communication signal to the host computer so that the host computer detects the processed communication signal; In response to a detection result that the processed communication signal is valid communication data, the scintillator is mounted on the circuit board to be tested to obtain the photodetector to be tested.

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