Wafer cutting equipment

Abstract

The invention relates to the technical field of wafer cutting, and particularly discloses wafer cutting equipment. The cutting machine comprises a machine table and an air suction cleaning assembly used for filtering and cleaning particles generated in the cutting process. The air suction cleaning assembly comprises a collecting box installed on the side wall of the machine table and an air extractor used for extracting air in the machine table into the collecting box, and an air inlet pipe of the air extractor communicates with an air collecting hood. A first filtering piece, a first cleaning piece, a second filtering piece and a second cleaning piece are sequentially mounted in the collecting box in the air flowing direction; smoke dust at the welding position is adsorbed into the collecting box through the air extractor, the first filtering piece and the second filtering piece are cleaned through the first cleaning piece and the second cleaning piece, the first filtering piece and the second filtering piece are kept smooth, continuous and stable suction air volume and efficient filtering are ensured, and therefore tiny particles generated by laser cutting are effectively removed.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cutting, and in particular to a wafer cutting device. Background Art

[0002] Wafers are the core substrate for semiconductor chip manufacturing. Their production process begins with high-purity polysilicon raw materials. In the back-end of the wafer manufacturing process, the dicing process uses laser cutting or grinding wheel dicing technology to divide the complete wafer into thousands of independent chips. This process directly affects the chip yield and packaging feasibility.

[0003] During the laser cutting process, the laser beam instantly melts or vaporizes the wafer material. After the material vaporizes, it condenses to form tiny particles (such as silicon oxide, metal vapor condensate, etc.). These particles are suspended in the air and need to be processed.

[0004] Therefore, it is necessary to provide a new technical solution to overcome the above-mentioned defects. Summary of the Invention

[0005] The object of the present invention is to provide a wafer cutting device that can effectively solve the above technical problems.

[0006] In order to achieve the purpose of the present invention, the following technical solutions are adopted:

[0007] A wafer cutting device includes: a machine table, and an air suction cleaning component for filtering and cleaning particles generated during the cutting process; the air suction cleaning component includes: a collection box installed on the side wall of the machine table, an air pump that draws the air inside the machine table into the collection box, and the air inlet pipe of the air pump is connected to an air collecting hood; a first filter element, a first cleaning element, a second filter element, and a second cleaning element are installed in the collection box in sequence along the direction of air flow; the first cleaning element is used to clean the first filter element and the second filter element, and the second cleaning element is used to clean the first filter element.

[0008] Furthermore, a mounting seat is installed in the collection box, the mounting seat is coaxially connected to a connecting rod, and fan blades are installed on the connecting rod; the connecting rod is coaxially connected to the second cleaning member, and the connecting rod passes through the middle of the second filter member and is coaxially connected to the first cleaning member.

[0009] Furthermore, a connecting block is provided inside the collection box, a spring is installed on the connecting block, the other end of the spring is connected to the second filter element, and the second filter element is installed inside the collection box along a transverse sliding direction.

[0010] Furthermore, the connecting blocks and the springs are provided in at least two groups and are symmetrically mounted on the filtering side and the non-filtering side of the second filter element, respectively.

[0011] Furthermore, an abutment block is installed on the side of the second filter element close to the first cleaning element; an extrusion block is installed on the end of the first cleaning element close to the second filter element; and the abutment block abuts against the extrusion block.

[0012] Furthermore, a cutting assembly for cutting wafers is provided inside the machine; the cutting assembly includes: a laser cutting head, a vertical moving module for driving the laser cutting head to move up and down to adjust the height of the laser cutting head, and a horizontal moving module for driving the vertical moving module to move horizontally.

[0013] Furthermore, a limiting plate for limiting the wafer is provided inside the machine, and a rotating motor is connected to the bottom of the limiting plate.

[0014] Furthermore, a circular groove is coaxially formed on the top of the limiting plate; a guide groove is also formed on the side wall of the limiting plate, and a limiting block is slidably installed in the guide groove.

[0015] Compared with the prior art, the present invention has the following beneficial effects: the present invention absorbs the smoke from the welding site into a collection box through an exhaust fan, and cleans the first filter element and the second filter element through the first cleaning element and the second cleaning element, keeping the first filter element and the second filter element unobstructed, ensuring continuous and stable suction air volume and high-efficiency filtration, thereby effectively removing tiny particles generated by laser cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention.

[0017] Figure 1 This is a schematic structural diagram of a wafer cutting device according to the present invention;

[0018] Figure 2 A schematic diagram of a wafer cutting device according to the present invention;

[0019] Figure 3 This is a schematic diagram of the internal structure of a wafer cutting device according to the present invention;

[0020] Figure 4 This is a schematic diagram of the internal structure of a collection box of a wafer cutting device of the present invention;

[0021] Figure 5 A wafer cutting device of the present invention Figure 4 A partial enlarged schematic diagram of part A.

[0022] In the figure: 1. Machine; 2. Cutting assembly; 3. Vacuum; 4. Air collecting hood; 5. Limiting plate; 6. Collection box; 7. Air inlet pipe; 8. Mounting seat; 9. Fan blade; 10. Second cleaning member; 11. Second filter member; 12. First cleaning member; 13. First filter member; 14. Connecting block; 15. Spring; 16. Pressure relief groove; 17. Abutment block; 18. Extrusion block; 19. Lateral moving module; 20. Vertical moving module; 21. Limiting block; 22. Rotating motor; 23. Suction cleaning assembly; 24. Laser cutting head; 25. Connecting rod. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments.

[0024] In the description of the present invention, it should be understood that the terms "center", "transverse", "longitudinal", "front", "back", "left", "right", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present invention. When a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a centered component. When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centered component at the same time. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a centered component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0025] like Figures 1 to 5 As shown, the present invention relates to a wafer cutting device, comprising: a platform 1, a side wall of which is provided with an observation window, and transparent glass is installed on the observation window to facilitate observation of the equipment status inside the platform 1.

[0026] The machine 1 is internally provided with a cutting assembly 2 for cutting wafers. The cutting assembly 2 is preferably a laser cutting assembly 2. The cutting assembly 2 includes: a laser cutting head 24; a vertically movable module 20 for driving the laser cutting head 24 up and down to adjust the height of the laser cutting head 24; the laser cutting head 24 is mounted at the bottom of the vertically movable module 20; and a horizontally movable module 19 for driving the vertically movable module 20 to move horizontally, thereby driving the laser cutting head 24 to move horizontally. The vertically movable module 20 is slidably mounted on the horizontally movable module 19.

[0027] The interior of the machine 1 is also provided with a limit plate 5 for limiting the wafer. A circular groove is coaxially provided on the top of the limit plate 5 for holding the wafer to facilitate limiting the wafer; a guide groove is also provided on the side wall of the limit plate 5, and a limit block 21 is slidably installed in the guide groove. By sliding the limit block 21, the clamping diameter of the limit block 21 can be adjusted to facilitate adaptation to wafers of different diameters; a rotating motor 22 is connected to the bottom of the limit plate 5, and the rotating motor 22 consists of a motor and a reducer connected to the motor. The output end of the reducer is coaxially connected to the bottom of the limit plate 5, and is used to drive the reducer through the motor, thereby driving the limit plate 5 to rotate. The combination of the motor and the reducer facilitates stable rotation at low speed and high torque to meet the requirements of various cutting trajectories.

[0028] When the wafer needs to be cut, first place the wafer in the circular groove of the limit plate 5, then adjust the limit block 21 so that the limit block 21 fixes the wafer from the outer peripheral side of the wafer, and then adjust the lateral movement of the laser cutting head 24 through the lateral movement module 19 according to the preset cutting process, or adjust the height of the laser cutting head 24 through the vertical movement module 20, or adjust the rotation angle of the wafer by rotating the motor 22, thereby completing the wafer cutting.

[0029] During the laser cutting process, the laser beam instantly melts or vaporizes the wafer material. After the material vaporizes, it condenses to form tiny particles (such as silicon oxide, metal vapor condensate, etc.). These particles are suspended in the air, causing air pollution and posing a threat to the health of workers. Therefore, these particles need to be processed.

[0030] The present invention also includes an air suction cleaning component 23 for filtering and cleaning the above-mentioned particles; the air suction cleaning component 23 includes: a collection box 6 installed on the side wall of the machine 1, and an air pump 3 fixedly installed on the top of the collection box 6, the air pump 3 is used to draw the air inside the machine 1 into the collection box 6, and a first through hole is opened at one end of the top of the collection box 6, and the air inlet end of the air pump 3 is connected to the through hole; a second through hole is opened on the side wall of the collection box 6 close to the machine 1, and the second through hole is connected to the air intake pipe 7, and the other end of the air intake pipe 7 is connected to the air collecting hood 4, the air intake side of the air collecting hood 4 faces the limit plate 5, and the air collecting hood 4 is located above one side of the limit plate 5. When the air pump 3 draws air, the air at the laser cutting position is drawn away through the air collecting hood 4, thereby sucking away the particles generated during the cutting process to avoid particles from polluting the air.

[0031] The inside of the collecting box 6 is sequentially installed with a first filter element 13, a first cleaning element 12, a second filter element 11, and a second cleaning element 10 from the second through hole to the first through hole (i.e., the direction of air flow); the first filter element 13 and the second filter element 11 are installed vertically; wherein, the first filter element 13 is used for preliminary filtration of particles, and the material can be selected from non-woven fabrics, glass fibers, etc., and the filtration efficiency is generally G4-H10, which is used to remove particles larger than 5μm; the second filter element 11 is used for secondary filtration of particles, and a high-efficiency particulate air filter can be selected to remove submicron particles such as silicon oxide.

[0032] The first cleaning member 12 is composed of a mounting plate and bristles mounted on the mounting plate. The bristles of the first cleaning member 12 are respectively facing the second filter element 11 and the first filter element 13, and are used to clean the second filter element 11 and the first filter element 13 respectively during rotation; the second cleaning member 10 is composed of a mounting plate and bristles arranged on the mounting plate. The bristles are facing the second filter element 11, and are used to clean the second filter element 11 during rotation.

[0033] On the side wall of the collecting box 6 near the first through hole ( Figure 4The left side wall in the figure is provided with a mounting seat 8, which is installed horizontally, and the mounting seat 8 is coaxially installed with a bearing, and the bearing is coaxially connected to a connecting rod 25, and a fan blade 9 is installed on the connecting rod 25; and the connecting rod 25 is coaxially connected to the second cleaning member 10, and the connecting rod 25 passes through the middle of the second filter member 11 and is coaxially connected to the first cleaning member 12; when the vacuum fan 3 is started, the fan blade 9 rotates with the airflow, thereby driving the second cleaning member 10 and the first cleaning member 12 to rotate synchronously. During the rotation of the second cleaning member 10, the non-filtering side of the second filter member 11 is cleaned; when the first cleaning member 12 rotates, on the one hand, the filtering side of the second filter member 11 is cleaned, and on the other hand, the non-filtering side of the first filter member 13 is cleaned to prevent the second filter member 11 and the first filter member 13 from being blocked. In addition, through the rotation of the fan blades 9, eddies or disturbances can be generated inside the collection box 6, helping to evenly distribute the airflow, avoid local airway dead corners, and improve filtration efficiency; the rotational movement of the fan blades 9, the first cleaning member 12, and the second cleaning member 10 can stir some particles, making it easier for the particles to be guided to the filter layer or the pressure relief groove 16, rather than being deposited in a fixed area, thereby reducing dust accumulation and helping to dissipate static electricity accumulation on the surface of the filter material.

[0034] As can be seen from the above description, the present invention absorbs the smoke from the welding site into the collection box 6 through the vacuum fan 3, and cleans the first filter element 13 and the second filter element 11 through the first cleaning element 12 and the second cleaning element 10, keeping the first filter element 13 and the second filter element 11 unobstructed, ensuring continuous and stable suction air volume and high-efficiency filtration, thereby effectively removing tiny particles generated by laser cutting.

[0035] The top and bottom of the collecting box 6 are respectively equipped with connecting blocks 14, and a spring 15 is installed on the connecting block 14. The other end of the spring 15 is connected to the second filter element 11, and the second filter element 11 is installed in the interior of the collecting box 6 along the horizontal sliding direction; wherein, the connecting block 14 and the spring 15 are symmetrically installed on the filtering side and the non-filtering side of the second filter element 11; the second filter element 11 is further equipped with an abutment block 17 on the side close to the first cleaning member 12, and the end of the first cleaning member 12 is equipped with an extrusion block 18 on the side close to the second filter element 11; the abutment block 17 abuts against the extrusion block 18, and when the first cleaning member 12 rotates, it drives the extrusion block 18 to rotate, and then the extrusion block 18 intermittently pushes the abutment block 17 to slide horizontally, thereby driving the second filter element 11 to slide horizontally, so that the second cleaning member 10 can clean the second filter element 11 while the bristles of the second cleaning member 10 are inserted into the inside of the second filter element 11 to dredge the second filter element 11.

[0036] A pressure relief groove 16 is also provided at the bottom of the inner wall of the collection box 6. The pressure relief groove 16 is arranged on the sliding path of the second filter element 11, and the bottom of the pressure relief groove 16 is connected to the collection box; when the second filter element 11 slides, part of the air is discharged through the pressure relief groove 16, which facilitates the discharge of particles between the second filter element 11 and the first filter element 13 cleaned by the first cleaning element 12.

[0037] The standard parts used in the present invention can all be purchased from the market, and special-shaped parts can be customized according to the description in the specification and the drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the existing technology. The machinery, parts and equipment all adopt conventional models in the existing technology, and the circuit connection adopts the conventional connection method in the existing technology. It will not be described in detail here. The content not described in detail in this specification belongs to the existing technology known to professional and technical personnel in this field.

[0038] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the appended claims of the present invention.

Claims

1. A wafer cutting device, characterized in that: include: A machine (1), an air suction cleaning component (23) for filtering and cleaning particles generated during the cutting process; The air suction cleaning assembly (23) comprises: a collection box (6) installed on the side wall of the machine (1), an air extractor (3) that draws air from the inside of the machine (1) into the collection box (6), and an air inlet pipe (7) of the air extractor (3) is connected to an air collecting hood (4); a first filter element (13), a first cleaning element (12), a second filter element (11), and a second cleaning element (10) are sequentially installed in the collection box (6) along the direction of air flow; the first cleaning element (12) is used to clean the first filter element (13) and the second filter element (11), and the second cleaning element (10) is used to clean the first filter element (13).

2. The wafer cutting device according to claim 1, wherein: A mounting seat (8) is installed in the collection box (6), and the mounting seat (8) is coaxially connected to a connecting rod (25), and a fan blade (9) is installed on the connecting rod (25); the connecting rod (25) is coaxially connected to the second cleaning member (10), and the connecting rod (25) passes through the middle of the second filter member (11) and is coaxially connected to the first cleaning member (12).

3. The wafer cutting device according to claim 2, wherein: A connecting block (14) is provided inside the collection box (6), a spring (15) is installed on the connecting block (14), the other end of the spring (15) is connected to the second filter element (11), and the second filter element (11) is installed inside the collection box (6) in a transverse sliding manner.

4. The wafer cutting device according to claim 3, wherein: The connecting block (14) and the spring (15) are at least two groups and are symmetrically mounted on the filtering side and the non-filtering side of the second filter element (11).

5. The wafer cutting device according to claim 3, wherein: A contact block (17) is also installed on the side of the second filter element (11) close to the first cleaning element (12); an extrusion block (18) is installed on the end of the first cleaning element (12) close to the side of the second filter element (11); the contact block (17) abuts against the extrusion block (18).

6. The wafer cutting device according to claim 1, wherein: A cutting assembly (2) for cutting wafers is provided inside the machine (1); the cutting assembly (2) comprises: a laser cutting head (24), a vertical moving module (20) for driving the laser cutting head (24) to move up and down so as to adjust the height of the laser cutting head (24), and a horizontal moving module (19) for driving the vertical moving module (20) to move horizontally.

7. The wafer cutting device according to claim 6, wherein: A limiting plate (5) for limiting the position of the wafer is also provided inside the machine (1), and a rotating motor (22) is connected to the bottom of the limiting plate (5).

8. The wafer cutting device according to claim 7, wherein: A circular groove is coaxially provided on the top of the limiting plate (5); a guide groove is also provided on the side wall of the limiting plate (5), and a limiting block (21) is slidably installed in the guide groove.

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