Cooling device for molded rubber conductive sealing ring

Abstract

The invention relates to a cooling device for a formed rubber conductive sealing ring, which comprises an electric turntable, a support shaft, a turntable, support arms, a lower die and an upper die, the support shaft is mounted at the output end of the electric turntable, the turntable is mounted on the support shaft, a plurality of support arms are mounted on the turntable at equal intervals, the lower die is mounted on the support arms, and the upper die is mounted on the upper die. An upper die is installed on the lower die, and a cooling mechanism is installed on the outer side of the lower die and the outer side of the upper die. The vertical spraying pipes and the transverse spraying pipes of the air cooling assembly form surrounding type airflow, when the mold is cooled, the surface cooling uniformity reaches + / -2 DEG C, according to the specification and size of the mold, the vertical spraying pipes are rotated, the angle of the spraying holes is adjusted, the inclination angle between the spraying holes and the mold is adjusted conveniently during air cooling, and the airflow wall attaching rate is increased.

Description

Technical Field

[0001] The invention relates to the technical field of rubber conductive sealing ring processing, in particular to a cooling device for a rubber conductive sealing ring after it is formed. Background Art

[0002] Rubber conductive sealing ring is a special rubber product with both sealing performance and conductive function. It is widely used in sealing scenarios that require electromagnetic shielding, electrostatic protection or grounding conduction. Among them, the compression molding process is the mainstream molding process of rubber conductive sealing ring.

[0003] The existing cooling device uses a single-stage rough cooling method, which leads to thermal stress cracks and migration of conductive fillers. The air cooling efficiency is low, and the filler distribution is uneven. It is also impossible to flexibly adjust the nozzle angle according to different molds. The continuous operation of a single semiconductor refrigeration plate leads to the accumulation of lattice defects at the cold end. At the same time, the single-station cooling continues to operate at full load, with high energy consumption, a single cooling method, many defects, and a lot of manual intervention. Summary of the Invention

[0004] The problem solved by the present invention is to provide a cooling device for the rubber conductive sealing ring after it is formed, which solves the technical problems of the existing cooling device, such as single-stage rough cooling causing thermal stress cracks and conductive filler migration, low air cooling efficiency, uneven filler distribution, and inability to flexibly adjust the spray hole angle according to different molds, and continuous operation of a single semiconductor refrigeration plate causing accumulation of cold end lattice defects; at the same time, single-station cooling continues at full load, with high energy consumption, single cooling means, many defects, and a lot of manual intervention.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: A cooling device for a rubber conductive sealing ring after molding, comprising an electric turntable, a support shaft, a turntable, a support arm, a lower mold, and an upper mold, wherein the output end of the electric turntable is mounted with a support shaft, the support shaft is mounted on the turntable, a plurality of support arms are mounted on the turntable at equal intervals, the support arms are mounted with a lower mold, the lower mold is mounted with an upper mold, and cooling mechanisms are mounted on the outer sides of the lower mold and the upper mold; The cooling mechanism includes two cooling platforms located at the top and bottom of the lower mold and the upper mold, and the two cooling platforms are sequentially arranged with a molding station, a pre-cooling station, a main cooling station and a final cooling station. The pre-cooling station is equipped with an air cooling component, the main cooling station is equipped with a water cooling component, and the final cooling station is equipped with a semiconductor refrigeration component.

[0006] Preferably, a lifting arm is installed on the inner side of the upper mold, a first pneumatic cylinder is installed on the lifting arm, and the telescopic end of the first pneumatic cylinder is connected to the lifting arm.

[0007] Preferably, the cooling mechanism also includes a ring gear box installed on the electric turntable, and threaded rods are rotatably installed on the ring gear box at equal intervals. The threads at both ends of the threaded rods have opposite directions. A number of threaded barrels are installed at equal intervals on the two cooling platforms, and the threaded barrels on the two cooling platforms are respectively threadedly connected to the two ends of the threaded rods.

[0008] Preferably, the bottom end of the threaded rod is located in a ring gear box and is equipped with sprockets, the sprockets are connected via a chain transmission, a first motor is installed on the bottom side of the ring gear box, and an output end of the first motor is connected to one of the sprockets.

[0009] Preferably, the air cooling assembly includes a plurality of vertical nozzles rotatably mounted on the cooling table toward the mold side, and the four vertical nozzles are distributed in a rectangular shape, wherein two adjacent vertical nozzles are externally mounted with pipe sleeves, and the pipe sleeves are in a communicating state with the vertical nozzles, the pipe sleeves are fixedly connected to the cooling table, and a sealing ring is provided between the pipe sleeves and the vertical nozzles, and a transverse nozzle is installed between the two pipe sleeves, the spray holes of the vertical nozzles are toward the side wall of the mold, and the spray holes of the transverse nozzles are toward the top and bottom sides of the mold; A multi-sided inner cavity is provided in the vertical nozzle on one of the cooling platforms, and a multi-sided insert is provided at the end of the vertical nozzle on the other cooling platform.

[0010] Preferably, a regulating box is installed on the top side of the cooling platform located on the top of the mold, and a rotary joint rotatably connected to the vertical nozzle is installed on the top side of the regulating box, and the air pipe on the rotary joint is connected to the air pump.

[0011] Preferably, a synchronous wheel is installed on the outer side of the top of the vertical nozzle in the adjustment box, and several synchronous wheels are connected by a synchronous belt transmission. A second motor is installed on the top side of the adjustment box, and one of the outer side of the top of the vertical nozzle and the output end of the second motor are both installed with rotating teeth, and the two rotating teeth are engaged with each other.

[0012] Preferably, the main cooling station includes a water-cooling plate installed on the side of the cooling platform facing the mold, and a connecting nozzle is installed on the outer side of the water-cooling plate.

[0013] Preferably, the semiconductor refrigeration component includes a rotating seat rotatably installed in the cooling platform and a heat dissipation fan, and two heat dissipation grids are installed between the rotating seats, and semiconductor refrigeration fins are respectively installed on the top and bottom sides of the two heat dissipation grids, and the heat dissipation fan is located between the two heat dissipation grids.

[0014] Preferably, a third motor is installed in the cooling table, and an output end of the third motor is connected to the rotating seat.

[0015] The beneficial effects of the present invention are as follows: the vertical nozzles and the horizontal nozzles of the air cooling assembly form an enveloping airflow, and when cooling the mold, the surface cooling uniformity reaches ±2°C. According to the specifications of the mold, the angle of the nozzle hole can be adjusted by rotating the vertical nozzle, which facilitates the adjustment of the inclination angle between the nozzle hole and the mold during air cooling, thereby improving the airflow wall adhesion rate; The rotating dual-cooling plate design of the semiconductor refrigeration component uses a third motor to drive the semiconductor cooling plate to rotate 180 degrees. This allows the alternating working mode to reduce the working time of a single semiconductor cooling plate during continuous operation, achieving continuous cooling capacity while reducing cold end temperature fluctuations. Through three-stage coordinated cooling, laminar air flow prevents surface bubbles in the pre-cooling stage, uniform water cooling prevents deformation in the main cooling stage, and precise temperature control prevents shrinkage in the final cooling stage, forming a scientific cooling curve. Compared with single-stage cooling, thermal stress is reduced, shrinkage stress is released in stages, and the uniformity of conductive filler distribution is improved; The electric turntable drives the four-station synchronous operation, which greatly shortens the cooling time compared with the traditional process and greatly improves the production capacity; Through a rotating multi-station layout, three-stage gradient cooling and modular quick-change design, the device achieves precision, efficiency and intelligence in the cooling process of rubber conductive sealing rings, making it suitable for mass production of high-precision conductive sealing rings. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the first overall structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the ring gear box of the present invention; Figure 3 This is a schematic diagram of the second overall structure of the present invention; Figure 4 This is a schematic diagram of the internal structure of the regulating box of the present invention; Figure 5 This is a schematic diagram of the third overall structure of the present invention.

[0017] Legend: 1. Electric turntable; 2. Support shaft; 3. Turntable; 4. Support arm; 5. Lower mold; 6. Lifting arm; 7. Upper mold; 8. First pneumatic cylinder; 9. Ring gear box; 10. First motor; 11. Sprocket; 12. Threaded rod; 13. Cooling table; 14. Threaded barrel; 15. Vertical nozzle; 16. Multilateral inner cavity; 17. Pipe sleeve; 18. Horizontal nozzle; 19. Multilateral insert; 20. Adjustment box; 21. Synchronous wheel; 22. Synchronous belt; 23. Rotary joint; 24. Air pipe; 25. Second motor; 26. Rotating gear; 27. Connecting nozzle; 28. Water cooling plate; 29. ​​Third motor; 30. Rotating seat; 31. Heat dissipation grid; 32. Semiconductor cooling plate; 33. Cooling fan. DETAILED DESCRIPTION

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0019] Specific examples are given below.

[0020] See also Figures 1 to 5 , a cooling device for a rubber conductive sealing ring after molding, comprising an electric turntable 1, a support shaft 2, a turntable 3, a support arm 4, a lower mold 5 and an upper mold 7, the output end of the electric turntable 1 is equipped with a support shaft 2, a turntable 3 is installed on the support shaft 2, a plurality of support arms 4 are installed on the turntable 3 at equal intervals, and a lower mold 5 is installed on the support arm 4, an upper mold 7 is installed on the lower mold 5, a lifting arm 6 is installed on the inner side of the upper mold 7, a first pneumatic cylinder 8 is installed on the lifting arm 6, the telescopic end of the first pneumatic cylinder 8 is connected to the lifting arm 6, the lower mold 5 and the upper mold 7 are separated and combined by the operation of the first pneumatic cylinder 8, and a cooling mechanism is installed on the outer side of the lower mold 5 and the upper mold 7; The cooling mechanism includes two cooling platforms 13 that move on the top and bottom of the lower mold 5 and the upper mold 7. The two cooling platforms 13 are sequentially arranged with a molding station, a pre-cooling station, a main cooling station and a final cooling station. The pre-cooling station is equipped with an air cooling component, the main cooling station is equipped with a water cooling component, and the final cooling station is equipped with a semiconductor refrigeration component.

[0021] The cooling mechanism also includes a ring gear box 9 installed on the electric turntable 1, and threaded rods 12 are installed on the ring gear box 9 at equal intervals. The threads at both ends of the threaded rod 12 are in opposite directions. Several threaded barrels 14 are installed on the two cooling platforms 13 at equal intervals, and the threaded barrels 14 on the two cooling platforms 13 are respectively threadedly connected to the two ends of the threaded rod 12. The bottom end of the threaded rod 12 is located in the ring gear box 9 and a sprocket 11 is installed. The sprocket 11 is connected through a chain transmission. A first motor 10 is installed on the bottom side of the ring gear box 9, and the output end of the first motor 10 is connected to one of the sprockets 11. The sprocket 11 is driven to rotate by the first motor 10, and the synchronous rotation of the threaded rod 12 is achieved through chain transmission. The rotating threaded rod 12 drives the threaded barrel 14 to move, thereby adjusting the spacing between the two cooling platforms 13, and adjusting the position of the air-cooling component, water-cooling component, semiconductor refrigeration component and mold on the cooling platform 13.

[0022] The air cooling assembly includes a plurality of vertical nozzles 15 rotatably mounted on the cooling platform 13 toward the mold side, and the four vertical nozzles 15 are distributed in a rectangular shape, wherein two adjacent vertical nozzles 15 are externally mounted with a pipe sleeve 17, and the pipe sleeve 17 is in a connected state with the vertical nozzle 15, the pipe sleeve 17 is fixedly connected to the cooling platform 13, and a sealing ring is provided between the pipe sleeve 17 and the vertical nozzle 15, a horizontal nozzle 18 is installed between the two pipe sleeves 17, the spray holes of the vertical nozzle 15 are toward the side wall of the mold, and the spray holes of the horizontal nozzle 18 are toward the top and bottom sides of the mold, a polygonal inner cavity 16 is provided in the vertical nozzle 15 on one of the cooling platforms 13, and a polygonal insert 19 is provided at the end of the vertical nozzle 15 on the other cooling platform 13, and an adjustment box 20 is installed on the top side of the cooling platform 13 at the top of the mold, and the top side of the adjustment box 20 A rotary joint 23 is installed that is rotatably connected to the vertical nozzle 15, and the air pipe 24 on the rotary joint 23 is connected to the air pump. A synchronous wheel 21 is installed on the outer side of the top of the vertical nozzle 15 in the adjustment box 20, and several synchronous wheels 21 are connected through a synchronous belt 22. A second motor 25 is installed on the top side of the adjustment box 20. A rotating gear 26 is installed on the outer side of the top of one vertical nozzle 15 and the output end of the second motor 25, and the two rotating gears 26 are engaged with each other. The vertical nozzle 15 and the horizontal nozzle 18 of the air-cooling assembly form an enveloping airflow. When cooling the mold, the surface cooling uniformity reaches ±2°C. According to the specifications of the mold, the angle of the nozzle hole can be adjusted by rotating the vertical nozzle 15, which is convenient for adjusting the inclination angle of the nozzle hole and the mold during air cooling and improving the airflow wall adhesion rate.

[0023] The main cooling station includes a water cooling plate 28 installed on the side of the cooling platform 13 facing the mold, and a connecting nozzle 27 is installed on the outer side of the water cooling plate 28.

[0024] The semiconductor refrigeration component includes a rotating seat 30 and a cooling fan 33 rotatably installed in the cooling platform 13, and two heat dissipation grilles 31 are installed between the rotating seat 30. Semiconductor cooling fins 32 are installed on the top and bottom sides of the two heat dissipation grilles 31 respectively. The cooling fan 33 is located between the two heat dissipation grilles 31. A third motor 29 is installed in the cooling platform 13, and the output end of the third motor 29 is connected to the rotating seat 30. The rotating double cooling fin design of the semiconductor refrigeration component drives the semiconductor cooling fin 32 to perform a 180° displacement through the third motor 29, so that during continuous operation, the working time of a single semiconductor cooling fin 32 can be reduced through an alternating working mode, thereby achieving continuous cooling capacity and reducing the temperature fluctuation of the cold end.

[0025] Through three-stage coordinated cooling, pre-cooling air cooling from 150℃ to 100℃, laminar air flow in the pre-cooling stage to prevent surface bubbles, main cooling water cooling from 100℃ to 60℃, uniform water cooling in the main cooling stage to prevent deformation, final cooling semiconductor from 60℃ to 30℃, precise temperature control in the final cooling stage to prevent shrinkage, forming a scientific cooling curve. Compared with single-stage cooling, thermal stress is reduced by more than 60%, shrinkage stress is released in stages, and the uniformity of conductive filler distribution is improved by 45%; The electric turntable 1 drives four workstations to operate synchronously, shortening the cooling time to 1 / 3 of the traditional process and greatly improving production capacity; Through a rotating multi-station layout, three-stage gradient cooling and modular quick-change design, the device achieves precision, efficiency and intelligence in the cooling process of rubber conductive sealing rings, making it suitable for mass production of high-precision conductive sealing rings.

[0026] Working Principle: The lower mold 5 and upper mold 7 for producing the rubber conductive sealing ring are connected to the support arm 4 and the lifting arm 6 respectively. The first pneumatic cylinder 8 is used to separate and combine the lower mold 5 and the upper mold 7. The electric turntable 1 drives the rotation of the support shaft 2 and the turntable 3 to adjust the position of the mold. When the mold rotates to the forming station, the molten raw material is injected into the mold. At this time, the mold is rotated to the pre-cooling station. The pre-cooling mold rotates to the main cooling station. The mold that has completed the main cooling rotates to the final cooling station. The mold that has completed the final cooling is separated by the lower mold 5 and the upper mold 7 to unload the rubber conductive sealing ring. When the mold is in the pre-cooling position, the sprocket 11 is driven to rotate by the first motor 10, and the synchronous rotation of the threaded rod 12 is realized through the chain transmission. The rotating threaded rod 12 drives the threaded cylinder 14 connected with the thread to move, thereby adjusting the distance between the two cooling platforms 13. When the mold is in the pre-cooling position, the two cooling platforms 13 are close to each other until the multilateral insertion tube 19 of the vertical nozzle 15 is inserted into the multilateral inner cavity 16 of the vertical nozzle 15. At this time, the second motor 25 is operated, and the two rotating teeth 26 are engaged and driven to drive one of the synchronous wheels 21 to rotate. The synchronous belt 22 is driven to drive the synchronous wheels 21 to rotate together, thereby realizing the rotation of the vertical nozzle 15, adjusting the spray hole angle of the vertical nozzle 15, and working through the air pump. After passing through the air pipe 24 and the rotary joint 23, cooling air is blown out from the spray holes of the vertical nozzle 15 and the horizontal nozzle 18 to the outside of the mold to realize air cooling of the mold. The mold temperature drops from 150°C to 100°C. When the mold is located in the main cooling station, the water-cooling plate 28 is in contact with the top and bottom sides of the mold, and is connected to the external water pipe through the connecting nozzle 27 to realize the rotation of water in the water-cooling plate 28, and the mold is water-cooled to reduce the mold temperature from 100°C to 60°C. When the mold is located in the final cooling station, the semiconductor refrigeration plate 32 is in contact with the top and bottom sides of the mold. The heat of the mold is transferred to the heat dissipation grid 31 through the power of the semiconductor refrigeration plate 32, and the heat dissipation fan 33 works to accelerate the dissipation of heat on the heat dissipation grid 31, and the mold temperature is reduced from 60°C to 30°C. When the next mold moves to the final cooling station and the two cooling platforms 13 move away from each other, the third motor 29 is used to realize the rotation of the turntable 30, and then the two semiconductor refrigeration plates 32 on the same cooling platform 13 are replaced, and the two semiconductor refrigeration plates 32 work alternately.

[0027] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A cooling device for a rubber conductive sealing ring after molding, characterized in that: The electric turntable (1) comprises an electric turntable (1), a support shaft (2), a turntable (3), a support arm (4), a lower mold (5) and an upper mold (7), wherein the output end of the electric turntable (1) is provided with a support shaft (2), the turntable (3) is provided with a support shaft (2), a plurality of support arms (4) are provided at equal intervals on the turntable (3), a lower mold (5) is provided on the support arm (4), an upper mold (7) is provided on the lower mold (5), and cooling mechanisms are provided on the outer sides of the lower mold (5) and the upper mold (7); The cooling mechanism comprises two cooling platforms (13) located at the top and bottom of the lower mold (5) and the upper mold (7) and moving thereon, wherein the two cooling platforms (13) are sequentially provided with a molding station, a pre-cooling station, a main cooling station and a final cooling station, wherein an air cooling component is installed on the pre-cooling station, a water cooling component is installed on the main cooling station, and a semiconductor refrigeration component is installed on the final cooling station.

2. The cooling device for a rubber conductive sealing ring after molding according to claim 1, characterized in that: A lifting arm (6) is installed inside the upper mold (7), a first pneumatic cylinder (8) is installed on the lifting arm (6), and a telescopic end of the first pneumatic cylinder (8) is connected to the lifting arm (6).

3. The cooling device for a rubber conductive sealing ring after molding according to claim 2, characterized in that: The cooling mechanism further comprises a ring gear box (9) mounted on the electric turntable (1), threaded rods (12) being rotatably mounted on the ring gear box (9) at equal intervals, the threads at both ends of the threaded rods (12) being in opposite directions, a plurality of threaded barrels (14) being mounted at equal intervals on the two cooling platforms (13), and the threaded barrels (14) on the two cooling platforms (13) being respectively threadedly connected to both ends of the threaded rods (12).

4. The cooling device for a rubber conductive sealing ring after molding according to claim 3, characterized in that: The bottom end of the threaded rod (12) is located in the ring gear box (9) and is equipped with a sprocket (11). The sprocket (11) is connected via a chain transmission. A first motor (10) is installed on the bottom side of the ring gear box (9), and the output end of the first motor (10) is connected to one of the sprockets (11).

5. The cooling device for a rubber conductive sealing ring after molding according to claim 4, characterized in that: The air cooling assembly includes a plurality of vertical nozzles (15) rotatably mounted on the cooling table (13) toward the mold side, and the four vertical nozzles (15) are distributed in a rectangular shape, wherein two adjacent vertical nozzles (15) are externally mounted with a pipe sleeve (17), and the pipe sleeve (17) and the vertical nozzle (15) are in a communicating state, the pipe sleeve (17) is fixedly connected to the cooling table (13), and a sealing ring is provided between the pipe sleeve (17) and the vertical nozzle (15), and a transverse nozzle (18) is installed between the two pipe sleeves (17), the spray holes of the vertical nozzles (15) are toward the side wall of the mold, and the spray holes of the transverse nozzles (18) are toward the top and bottom sides of the mold; A multi-sided inner cavity (16) is provided in the vertical nozzle (15) on one of the cooling platforms (13), and a multi-sided insert (19) is provided at the end of the vertical nozzle (15) on the other cooling platform (13).

6. The cooling device for a rubber conductive sealing ring after molding according to claim 5, characterized in that: A regulating box (20) is installed on the top side of the cooling platform (13) located at the top of the mold. A rotary joint (23) rotatably connected to the vertical nozzle (15) is installed on the top side of the regulating box (20), and an air pipe (24) on the rotary joint (23) is connected to an air pump.

7. The cooling device for a rubber conductive sealing ring after molding according to claim 6, characterized in that: A synchronous wheel (21) is installed on the outer side of the top of the vertical nozzle (15) in the regulating box (20), and a plurality of synchronous wheels (21) are connected by a synchronous belt (22). A second motor (25) is installed on the top side of the regulating box (20), and a rotating gear (26) is installed on the outer side of the top of one of the vertical nozzles (15) and the output end of the second motor (25), and the two rotating gears (26) are meshed with each other.

8. The cooling device for a rubber conductive sealing ring after molding according to claim 7, characterized in that: The main cooling station includes a water-cooling plate (28) installed on the cooling platform (13) facing the mold side, and a connecting nozzle (27) is installed on the outside of the water-cooling plate (28).

9. The cooling device for a rubber conductive sealing ring after molding according to claim 8, characterized in that: The semiconductor refrigeration component comprises a rotating seat (30) and a heat dissipation fan (33) rotatably mounted in a cooling platform (13), and two heat dissipation grilles (31) are mounted between the rotating seat (30), and semiconductor refrigeration fins (32) are mounted on the top and bottom sides of the two heat dissipation grilles (31), respectively, and the heat dissipation fan (33) is located between the two heat dissipation grilles (31).

10. The cooling device for a rubber conductive sealing ring after molding according to claim 9, characterized in that: A third motor (29) is installed in the cooling table (13), and an output end of the third motor (29) is connected to the rotating seat (30).

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