Adhesive tape and bonding process

Abstract

The invention provides an adhesive tape and a bonding process, the adhesive tape comprises a base material and an adhesive coating layer, the base material has an adhesive surface, the adhesive coating layer comprises a first adhesive layer and second adhesive layers, the first adhesive layer is arranged in the middle area of the adhesive surface, and the second adhesive layers are arranged on the adhesive surface and located on the two sides of the first adhesive layer in the width direction of the adhesive surface; or, the second glue layer is arranged on the glue face, the first glue layer is arranged on the face, away from the base material, of the second glue layer in a stacked mode, the first glue layer is located in the middle area, in the width direction of the glue face, of the second glue layer, the first glue body can lose viscidity within the preset time, and the second glue body keeps viscidity within the preset time; thus, by arranging the first adhesive layer and the second adhesive layer which are different in aging, the first adhesive layer firstly loses viscosity after the preset time, so that a gap is formed between the position, on the first adhesive layer, of the adhesive tape and a bonded material, the gap forms a separation channel between the adhesive tape and the material, the resistance needing to be overcome when the adhesive tape is torn off subsequently is greatly reduced, and the adhesive tape is prevented from being damaged. And the convenience of the adhesive tape disassembling process is remarkably improved.

Description

Technical Field

[0001] The present application relates to the field of bonding technology, and in particular to an adhesive tape and a bonding process. Background Art

[0002] In the related art, the adhesive tape usually has only a single type of adhesive layer, and the adhesive layer has a long-term adhesive property to meet the needs of products that require long-term bonding and fixation.

[0003] However, in application scenarios that require temporary fixation, the tape has obvious limitations. Take the use of packaging boxes in the logistics industry as an example. After delivery, users need to remove the tape to open the packaging box to obtain the items inside. Users usually remove the tape by using a knife or directly tearing it apart. Since the knife can easily scratch the internal goods and the user needs to find a knife, it brings great inconvenience to the user. Directly tearing the tape is difficult, time-consuming and labor-intensive, resulting in inconvenient disassembly operations.

[0004] Therefore, it is necessary to develop a new type of tape that is easy to disassemble later to be suitable for application scenarios that require temporary fixation. Summary of the Invention

[0005] The present application provides an adhesive tape and a bonding process to at least solve the above-mentioned problems in the related art.

[0006] To achieve the above objectives, the present application provides the following technical solution: an adhesive tape, comprising:

[0007] a substrate having an adhesive surface;

[0008] The adhesive layer comprises a first adhesive layer and a second adhesive layer;

[0009] The first adhesive layer is provided in the middle region of the adhesive surface in the width direction, and the second adhesive layer is provided on both sides of the adhesive surface in the width direction; or, the second adhesive layer is provided on the adhesive surface, the first adhesive layer is superimposed on the side of the second adhesive layer facing away from the substrate, and the first adhesive layer is located in the middle region of the second adhesive layer along the width direction of the adhesive surface; wherein,

[0010] The first adhesive layer is formed of a first colloid that can lose its viscosity within a predetermined time, and the second adhesive layer is formed of a second colloid that maintains its viscosity within a predetermined time.

[0011] In one embodiment, the first colloid is acrylic glue, epoxy resin glue, silane resin glue or alumina glue; the first colloid completes a curing reaction when in contact with air and reaches a predetermined time, thereby losing its viscosity.

[0012] In one embodiment, the second colloid is a pressure-sensitive adhesive.

[0013] In one embodiment, the tape is provided with a plurality of ventilation holes, which penetrate the tape in a direction perpendicular to the adhesive surface and are distributed in the contour area of ​​the first adhesive layer, so that the first adhesive layer contacts the air through the ventilation holes and undergoes a curing reaction.

[0014] In one embodiment, the present application further provides a bonding process, which includes:

[0015] Positioning: Align the first material and the second material to be bonded so that the first adhesive layer of the adhesive tape is aligned with the gap between the first material and the second material;

[0016] Bonding: using adhesive tape to bond the first material and the second material;

[0017] Cutting: using a cutting knife to cut a specific notch at one end of the tape, so that the portion of the tape containing the first adhesive layer at the end is exposed at the specific notch.

[0018] In one embodiment, the specific notch is V-shaped, so that the portion of the cut adhesive tape containing the first adhesive layer is exposed at the specific notch.

[0019] In one embodiment, a tape production device is provided, and the tape is produced by the tape production device; the tape production steps include:

[0020] Using an adhesive tape production device, coating a first colloid on the adhesive surface of the substrate, with the first colloid being located in the middle area of ​​the adhesive surface, to form a first adhesive layer;

[0021] The second colloid is coated on the adhesive surface of the substrate by using an adhesive tape production device, and the second colloid is located on both sides of the first adhesive layer along the width direction of the adhesive surface.

[0022] In one embodiment, a tape production device is provided, the tape production device comprising a glue coating component and a tape slitting component, wherein the glue coating component is mounted on the tape slitting component;

[0023] The tape slitting assembly cuts the original tape on the tape mother roll into a plurality of slit tapes having a predetermined width, wherein the tape mother roll includes a base material and a second adhesive layer, wherein the second adhesive layer is provided on the adhesive surface;

[0024] The first colloid is coated on the slitting tape by the glue coating assembly so that the first colloid is located on the side of the second glue layer away from the substrate and arranged along the middle area in the width direction of the glue surface to form a first glue layer.

[0025] In one embodiment, the slit tape coated with the first adhesive is rolled up by a tape slitting assembly to form a finished tape roll.

[0026] In one embodiment, the first material and the second material are two sealing panels on a packaging box;

[0027] A carton sealing device equipped with a cutting knife is provided. The packaging box is sealed by the carton sealing device, and the cutting knife is driven to move in a direction perpendicular to the adhesive surface to cut a specific notch at one end of the tape, and the portion of the cut tape containing the first adhesive layer at the end is exposed at the specific notch.

[0028] In the above-mentioned adhesive tape, the first adhesive layer and the second adhesive layer cooperate to achieve the bonding function. Within a predetermined time, the first adhesive layer and the second adhesive layer jointly exert an adhesive effect to provide a stable bonding force between the adhesive tape and the adhered material, so as to meet the requirements of bonding stability in temporary fixing scenarios. When the predetermined time node is reached, the first colloid used in the first adhesive layer reacts to make the first adhesive layer lose its adhesiveness; in this way, by providing the first adhesive layer and the second adhesive layer with different time aging, the first adhesive layer loses its adhesiveness first after the predetermined time, so that a gap is formed between the position of the first adhesive layer and the adhered material of the adhesive tape. The gap forms a separation channel between the adhesive tape and the material, which greatly reduces the resistance that needs to be overcome when tearing off the adhesive tape subsequently. The user does not need to use additional tools or expend too much physical strength, which significantly improves the convenience of the tape disassembly process.

[0029] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present application, nor is it intended to limit the scope of the present application. Other features of the present application will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] The above and other objects, features and advantages of the exemplary embodiments of the present application will become readily understood by reading the detailed description below with reference to the accompanying drawings. In the accompanying drawings, several embodiments of the present application are shown in an illustrative and non-limiting manner, in which:

[0031] In the drawings, the same or corresponding reference numerals denote the same or corresponding parts.

[0032] Figure 1 A schematic cross-sectional view of the adhesive tape when the first adhesive layer and the second adhesive layer are arranged side by side in an embodiment of the present application is shown;

[0033] Figure 2 A schematic cross-sectional view of the adhesive tape when the first adhesive layer and the second adhesive layer are stacked and arranged in an embodiment of the present application is shown;

[0034] Figure 3 A flowchart of the bonding process in an embodiment of the present application is shown;

[0035] Figure 4 A schematic structural diagram of a cutting knife in an embodiment of the present application is shown;

[0036] Figure 5 A schematic diagram of a tape with a specific notch cut out in an embodiment of the present application is shown;

[0037] Figure 6 A flow chart showing a first method for producing an adhesive tape according to an embodiment of the present application is shown;

[0038] Figure 7 A schematic structural diagram of an adhesive tape production device according to an embodiment of the present application is shown;

[0039] Figure 8 A flow chart of a second method for producing adhesive tape in an embodiment of the present application is shown.

[0040] Explanation of the numbers in the figure: 111, substrate; 112, first adhesive layer; 113, second adhesive layer; 114, specific notch; 115, exposed part of the first adhesive layer; 20, cutting knife; 21, blade; 30, tape production equipment; 31, frame; 32, gluing assembly; 33, tape slitting assembly; 34, tape releasing assembly; 35, tape winding assembly; 351, tape winding shaft; 352, driving assembly. DETAILED DESCRIPTION

[0041] In order to make the purpose, features, and advantages of this application more obvious and easy to understand, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of this application.

[0042] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this disclosure can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of this application can be achieved. This is not limited herein.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0044] Adhesive tape typically uses a single adhesive layer for long-term fixation, but this structure presents significant drawbacks in applications requiring temporary fixation. For example, in the sealing of logistics packaging boxes, traditional adhesive tape requires tools or forceful tearing to remove the tape after transporting the goods. This poses a risk of damage to the goods and is inconvenient to operate, making it impossible to quickly and non-destructively remove the tape.

[0045] To address the aforementioned issues in related technologies, one possible solution is to create a predefined peel path by combining adhesive layers with varying aging properties. This synergistic effect of a central aging adhesive layer and two side permanent adhesive layers ensures initial bond strength while also creating a mechanically weak zone after a predetermined period of time. This established delamination failure mechanism allows for controlled peeling of the tape without compromising its functionality.

[0046] Therefore, the embodiment of the present application provides a technical solution for an adhesive tape, the adhesive tape includes a base material 111 and an adhesive layer. The base material 111 has an adhesive surface, and the adhesive layer includes a first adhesive layer 112 and a second adhesive layer 113. Figure 1 , the first adhesive layer 112 is provided in the middle area of ​​the adhesive surface in the width direction, and the second adhesive layer 113 is provided on both sides of the adhesive surface in the width direction; or, please combine Figure 2 The second adhesive layer 113 is provided on the adhesive surface, and the first adhesive layer 112 is stacked on the side of the second adhesive layer 113 facing away from the substrate 111, and the first adhesive layer 112 is located in the middle area of ​​the second adhesive layer 113 along the width direction of the adhesive surface. The first adhesive layer 112 is formed by a first colloid that loses its viscosity within a predetermined time, and the second adhesive layer 113 is formed by a second colloid that maintains its viscosity within a predetermined time. Figure 1 is a schematic cross-sectional view of the adhesive tape when the first adhesive layer 112 and the second adhesive layer 113 are arranged side by side; Figure 2 It is a cross-sectional schematic diagram of the adhesive tape when the first adhesive layer 112 and the second adhesive layer 113 are stacked and arranged.

[0047] In the above-mentioned adhesive tape, the first adhesive layer 112 and the second adhesive layer 113 cooperate to achieve the bonding function. Within a predetermined time, the first adhesive layer 112 and the second adhesive layer 113 jointly exert an adhesive effect to provide a stable bonding force between the adhesive tape and the adhered material, thereby meeting the requirement of bonding stability in a temporary fixing scenario. When the predetermined time node is reached, the first colloid used in the first adhesive layer 112 reacts to cause the first adhesive layer 112 to lose its adhesiveness. In this way, by providing the first adhesive layer 112 and the second adhesive layer 113 with different time aging, the first adhesive layer 112 loses its adhesiveness first after the predetermined time, so that a gap is formed between the position of the first adhesive layer 112 and the adhered material of the adhesive tape. The gap forms a separation channel between the adhesive tape and the material, greatly reducing the resistance required to overcome when subsequently tearing off the adhesive tape. The user does not need to use additional tools or expend excessive physical strength, which significantly improves the convenience of the tape disassembly process.

[0048] It should be noted that substrate 111 refers to a flexible carrier capable of supporting first adhesive layer 112 and second adhesive layer 113. For example, substrate 111 may be made of polyester film, woven fabric, or flexible paper. Furthermore, first adhesive layer 112 and second adhesive layer 113 may be arranged in two different configurations: a first configuration in which first adhesive layer 112 and second adhesive layer 113 are arranged side-by-side along the width of substrate 111; a second configuration in which first adhesive layer 112 and second adhesive layer 113 are stacked along the thickness of substrate 111.

[0049] In some embodiments, the first colloid is acrylic glue, epoxy resin glue, silane resin glue or alumina glue. The first colloid completes a curing reaction when in contact with air and reaches a predetermined time, thereby losing its viscosity.

[0050] In this way, the first colloid undergoes chemical reactions or physical crosslinking when exposed to air. For example, acrylic adhesive forms a crosslinked network through oxidation, epoxy resin adhesive induces crosslinking through a curing agent, silane resin adhesive forms a dense structure through moisture condensation, and alumina adhesive forms a stable layer through surface hydroxyl reactions. These reactions are designed to complete within a predetermined timeframe. For example, by controlling the adhesive layer thickness, ambient humidity, or adding a reaction rate modifier, the first adhesive layer 112 completely loses its adhesiveness after a set timeframe, while the second adhesive layer 113 retains its adhesive strength. Simultaneously, the central area of ​​the tape automatically peels off after a predetermined timeframe, while the side areas maintain their fixed properties.

[0051] It is understandable that acrylic glue refers to an adhesive with acrylic ester polymers as the main component. Specifically, the oxidation reaction rate can be controlled by adjusting the monomer ratio. The oxidation reaction causes the internal cross-linking of the colloid to form a rigid structure, thereby losing viscosity. Among them, epoxy resin glue refers to a polymer compound containing epoxy groups. Specifically, an amine curing agent can be added to gradually cause a cross-linking reaction after contact with air, and eventually form an irreversible hard structure. Among them, silane resin glue refers to a polymer with siloxane as the main chain. Specifically, it can trigger a condensation reaction by exposure to moisture in the air, forming a three-dimensional network structure and causing the viscosity to disappear. Among them, alumina glue refers to a colloid containing nano-alumina particles. Specifically, the hydroxyl groups on the surface of the particles can react with moisture or oxygen in the air to form a stable oxide, causing the colloid to harden and fail.

[0052] In some embodiments, the second colloid is a pressure-sensitive adhesive. The second adhesive layer 113 formed by the pressure-sensitive adhesive forms a stable bonding interface on both sides of the adhesive surface or on the surface of the substrate 111, and its viscosity remains constant after a predetermined time. When the first adhesive layer 112 loses its viscosity due to the curing reaction, the second adhesive layer 113 continues to adhere to the surface of the adherend through the viscoelastic properties of the pressure-sensitive adhesive, thereby preventing the entire tape from being peeled off. Because the cohesive force of the pressure-sensitive adhesive is greater than the interfacial adhesion force, partial separation can be achieved by peeling off the area where the first adhesive layer 112 is located on the tape, while the retained portion of the second adhesive layer 113 still maintains structural fixation.

[0053] Pressure-sensitive adhesives (PSA) are polymer materials that develop adhesiveness at room temperature through the application of slight pressure. Their molecular structure comprises a composite system of long-chain polymers and tackifying resins, which form interfacial adhesion through physical adsorption. These materials maintain long-lasting bond strength without external energy input during tape use and exhibit creep and peel resistance.

[0054] Preferably, the pressure-sensitive adhesive can be made of acrylate, rubber or silicone polymers. In addition, the present application does not limit the specific type of the pressure-sensitive adhesive.

[0055] In some embodiments, the tape is provided with a plurality of ventilation holes extending in a direction perpendicular to the adhesive surface and distributed within the contour area of ​​the first adhesive layer 112 , so that the first adhesive layer 112 contacts the air through the ventilation holes and undergoes a curing reaction.

[0056] In this way, air enters the interior of the adhesive tape through the vent holes along the thickness direction of the adhesive tape and contacts the first adhesive layer, thereby ensuring that the first adhesive completes the overall curing reaction within a predetermined time.

[0057] In some embodiments, the plurality of vent holes penetrates the substrate in a direction perpendicular to the adhesive surface.

[0058] In other embodiments, multiple vent holes are formed perpendicularly to the adhesive surface through the substrate and the first adhesive layer. This allows air to penetrate the first adhesive layer 112 through the vent holes along the thickness of the tape, expanding the contact area between the first adhesive and the air from the edge of the adhesive layer to the entire depth of the adhesive layer.

[0059] It should be noted that the above-mentioned depth of the vent holes on the tape is merely an example, and this application does not limit the specific depth of the vent holes on the tape.

[0060] Preferably, the vents are evenly distributed throughout the first adhesive layer 112. The vents penetrate the structure, allowing air to reach the interior of the adhesive layer without relying on a lateral diffusion path at the edge of the adhesive layer. This eliminates the difference in curing rate between the center and edge of the adhesive layer, ensuring that the first adhesive completes the entire curing reaction within a predetermined time, resulting in a more uniform curing of the first adhesive.

[0061] Preferably, the vent holes can be nano-scale micropores, micro-scale micropores or millimeter-scale micropores.

[0062] Preferably, the width of the first adhesive layer 112 accounts for 10%-30% of the total width of the adhesive tape. This ensures that the adhesive tape corresponding to the first adhesive layer 112 is not easily torn, and also ensures that the adhesive bond is reliable even after the first adhesive layer 112 fails to cure. When the width of the first adhesive layer 112 accounts for less than 10% of the total width of the adhesive tape, the adhesive tape corresponding to the first adhesive layer 112 is too narrow, and the adhesive tape corresponding to the first adhesive layer 112 is easily broken when torn. When the width of the first adhesive layer 112 accounts for more than 30% of the total width of the adhesive tape, the width of the adhesive tape corresponding to the second adhesive layer 113 is too narrow, resulting in a significant decrease in the adhesive bond of the adhesive tape after the first adhesive tape fails to cure in the middle and late stages, and the adhesive bond strength of the adhesive tape is relatively strong. For example, in logistics, express packaging boxes may not be opened in time after a predetermined period of time, and the adhesive tape may not be firmly bonded, causing the seal of the packaging box to crack, causing items inside the box to fall and be damaged.

[0063] It is understandable that the predetermined time required for the first colloid to be completely cured can be controlled by adjusting the diameter and number of the vent holes.

[0064] In some embodiments, please combine Figure 3 , this application also proposes a bonding process, the bonding process includes:

[0065] Step S1: providing an adhesive tape production device 30, and producing an adhesive tape having a first adhesive layer 112 and a second adhesive layer 113 with different bonding times by the adhesive tape production device 30;

[0066] Step S2: Positioning, aligning the first material and the second material to be bonded so that the first adhesive layer 112 of the adhesive tape is aligned with the gap between the first material and the second material;

[0067] Step S3: bonding, using an adhesive tape to bond the first material and the second material;

[0068] Step S4: Please combine Figure 4 and Figure 5 , cutting, using the cutting knife 20 to cut a specific notch 114 at one end of the tape, and making the part of the cut tape containing the first adhesive layer 112 at the end exposed at the specific notch 114. Figure 3 It is a flow chart of the bonding process; Figure 4 Schematic diagram of the structure of the cutting knife; Figure 5 Schematic diagram of tape with specific notches cut out.

[0069] In this way, the positioning operation ensures that the curable first adhesive layer 112 of the tape covers the gap between the two materials, making this area a weak link in the connection after bonding. During the bonding process, the tape is stably fixed by the long-term adhesive layer on the periphery, while the curable adhesive layer in the middle fails after a predetermined time. In the cutting step, a specific notch 114 is formed at the end of the tape. The first adhesive layer 112 in the specific notch 114 is directly exposed to the air, quickly completes the curing reaction and loses its stickiness, forming a starting point for local peeling. When the user needs to disassemble, he only needs to apply tension from the specific notch 114 to the exposed part of the tape containing the first adhesive layer 112 at that end, and the tape can be peeled off at the exposed part containing the first adhesive layer 112 at that end to achieve disassembly, avoiding direct tearing or using a knife.

[0070] In some embodiments, the specific notch 114 is V-shaped so that the portion of the cut tape containing the first adhesive layer 112 is exposed at the specific notch 114 to form an exposed portion of the tape containing the first adhesive layer 112 at the end.

[0071] In this way, when the specific notch 114 is in a V-shaped structure, the tape exposed at the specific notch 114 forms an acute angle with the edges on both sides, making it easier to tear the exposed portion of the tape containing the first adhesive layer 112 at that end; wherein, the exposed portion of the first adhesive layer 115 refers to the exposed portion of the end of the tape at the V-shaped notch after the tape is cut, making it easier to identify the starting point of disassembly.

[0072] It is understandable that the specific notch 114 can also be a U-shaped structure; this application does not specifically limit the shape of the specific notch 114, as long as the end of the tape can form an exposed portion and the tape portion corresponding to the second adhesive layer 113 forms a sharp angle.

[0073] Please combine Figure 6 In some embodiments, the first method of producing the adhesive tape comprises the following steps:

[0074] Step S11: using the adhesive tape production device 30 to apply a first adhesive to the adhesive surface of the substrate 111, with the first adhesive being located in the middle region of the adhesive surface, to form a first adhesive layer 112;

[0075] Step S12: Use the tape production equipment 30 to apply the second colloid on the adhesive surface of the substrate 111, and make the second colloid be located on both sides of the first adhesive layer 112 along the width direction of the adhesive surface. Figure 6 The flowchart of the first production method of the tape is shown in FIG.

[0076] In some implementations, the tape production device 30 first applies a first adhesive to the center of the adhesive surface of the substrate 111 to form a first adhesive layer 112. During the coating process, positioning sensors or guide structures on the tape production device 30 control the coating range, ensuring that the first adhesive layer 112 covers only a predetermined width. Subsequently, the tape production device 30 applies a second adhesive to both sides of the adhesive surface of the substrate 111 to form a second adhesive layer 113. A gap between the adhesive-free areas on both sides and the first adhesive layer 112 is maintained. The timing of the coating of the first and second adhesive layers 112, 113, can be controlled by the timing of the coating to prevent mixing of the adhesives.

[0077] In other possible implementations, the tape production equipment 30 first coats a first colloid on the middle of the adhesive surface of the substrate 111 to form a second adhesive layer 113. Subsequently, the tape production equipment 30 coats a second colloid on both sides of the adhesive surface of the substrate 111 to form a second adhesive layer 113. A glue-free gap is maintained between the glue-coated areas on both sides and the first adhesive layer 112. The coating time difference between the first adhesive layer 112 and the second adhesive layer 113 can be controlled by the glue coating timing to avoid colloid mixing.

[0078] In yet other possible implementations, the tape production apparatus 30 simultaneously coats the first adhesive layer 112 and the second adhesive layer 113 to improve tape production efficiency. In this solution, incompatible first and second adhesives are used to prevent compatibility upon contact between the two adhesives, which could interfere with the functions of the two adhesive layers. Alternatively, when the tape production apparatus 30 simultaneously coats the first and second adhesive layers 112, 113, a gap is created between the first and second adhesive layers 112, 113 to prevent compatibility upon contact.

[0079] It should be noted that in the first method of producing tape, the tape production equipment 30 can be modified by adding a coating component 32 for coating the second colloid to the existing single-coating head automatic coating machine. This design method is smaller, more clumsy and lower-profile for the modification of the existing tape production equipment 30.

[0080] In some embodiments, see Figure 7The adhesive tape production equipment 30 includes a glue coating component 32 and a tape slitting component 33. The glue coating component 32 is installed on the tape slitting component 33 and is used to coat the first colloid; please refer to Figure 8 The second method for producing the adhesive tape comprises the following steps:

[0081] Step S13: The tape slitting assembly 33 cuts the original tape with the second adhesive layer 113 on the tape mother roll into a plurality of slit tapes of predetermined widths. The tape mother roll includes a base material 111 and a second adhesive layer 113, wherein the second adhesive layer 113 is disposed on the adhesive surface.

[0082] Step S14 : The first adhesive is coated on the slitting tape by the adhesive coating assembly 32 , so that the first adhesive is located on the side of the second adhesive layer 113 facing away from the substrate 111 and arranged along the middle area in the width direction of the adhesive surface to form the first adhesive layer 112 .

[0083] Step S15: The tape slitting assembly 33 is used to reel in the slitting tape coated with the first colloid to form a finished tape roll, thereby achieving continuous production and stable storage of the temporary adhesive layer and the permanent adhesive layer structure of the tape. Figure 7 Schematic diagram of the structure of the tape production equipment; Figure 8 Flow chart of the second production method of adhesive tape.

[0084] Thus, before slitting, the tape mother roll consists only of the base material 111 and the second adhesive layer 113. The slitting machine cuts the wide tape mother roll lengthwise into multiple narrow slit tapes, with the second adhesive layer 113 of each slit tape completely covering the adhesive surface of the base material 111. The adhesive coating assembly 32 then precisely applies the first adhesive to the surface of the second adhesive layer 113 of the slit tape. This coating is limited to the middle region of the slit tape widthwise and covers only the middle region of the second adhesive layer 113.

[0085] Preferably, when there are multiple slitting tapes, each slitting tape is independently coated with the first colloid, thereby achieving synchronous production of multiple tape units, thereby improving tape production efficiency.

[0086] Preferably, in the second production method of the adhesive tape, the adhesive tape production equipment 30 can be directly produced by an existing automatic coating machine with a single coating head, without the need to modify the adhesive tape production equipment 30, which has low cost and higher production efficiency.

[0087] Please combine Figure 8Preferably, the tape production equipment 30 also includes a frame 31, a tape release assembly 34, and a tape rewinding assembly 35. The tape release assembly 34 and the tape rewinding assembly 35 are spaced apart along the front-to-back direction of the equipment and are both connected to the frame 31. The tape release assembly 34 is used to carry the tape mother roll and release the original tape from the tape mother roll, wherein the original tape has a second adhesive layer 113. The tape slitting assembly 33 is connected to the frame 31 and is located between the tape release assembly 34 and the tape rewinding assembly 35. The tape slitting assembly 33 is used to cut the original tape into multiple slit tapes of predetermined widths. The glue coating assembly 32 is connected to the frame 31 and is located above the tape rewinding assembly 35. The glue coating assembly 32 is used to apply a first glue to the slit tapes. Exemplarily, the tape release assembly 34 can be a tape unwinding rotating shaft.

[0088] Furthermore, the number of slit tapes cut by the glue coating component 32 and the tape slitting component 33 is the same, and both are multiple.

[0089] Please combine Figure 8 Furthermore, the tape winding assembly 35 includes multiple tape winding shafts 351 and a driving assembly 352. The multiple tape reels are arranged at intervals and are rotatably connected to the frame 31, and each tape reel 351 is detachably connected to the frame 31. The driving assembly 352 is connected to each tape winding shaft 351 and is used to drive each tape winding shaft 351 to rotate simultaneously so that the tape winding shaft 351 can rewind the material; the driving assembly 352 is detachably connected to each tape winding shaft 351 to facilitate the non-stop shaft replacement of each tape winding shaft 351.

[0090] Exemplarily, the drive assembly 352 can be a plurality of mutually meshing gears and motors, wherein the number of gears is the same as the number of the tape reel 351, each gear is connected to the end of a corresponding tape reel 351, the drive assembly 352 is connected to the tape reel 351 through the gears, the motor is connected to any one of the gears, the motor is mounted on the frame 31, and is used to drive the gear to rotate.

[0091] In some embodiments, please combine Figure 5 In step S4, the first material and the second material are two sealing panels on the packaging box; a sealing device equipped with a cutting knife 20 is provided, the packaging box is sealed by the sealing device, and the cutting knife 20 is driven to move in a direction perpendicular to the adhesive surface to cut a specific notch 114 at one end of the tape, and the portion of the cut tape containing the first adhesive layer 112 at the end is exposed at the specific notch 114.

[0092] In this way, the sealing device synchronously drives the cutting blade 20 to move vertically downward during the sealing process. After the cutting blade 20 cuts the end of the tape, a specific notch 114 is formed. Because the first adhesive layer 112 is pre-aligned with the gap in the sealing plate, the first adhesive layer 112 is directly exposed to the air. Air enters the surface of the first adhesive layer 112 through the gap in the sealing plate, triggering a curing reaction that causes it to lose its viscosity. When unpacking, the user only needs to peel off the tape along the notch. The area where the first adhesive layer 112 has failed will separate first due to loss of adhesion. The second adhesive layers 113 on both sides remain fixed, but the peeling resistance is significantly reduced.

[0093] It should be noted that the carton sealing device in the present application can be realized by replacing the cutting knife 20 in the existing carton sealing device. This design method requires less modification to the existing tape production equipment 30 and has lower costs.

[0094] Preferably, the cutter 20 has a blade 21 of a specific shape, and the specific shape of the blade 21 matches the shape of the specific notch 114 and the exposed portion of the tape containing the first adhesive layer 112. This allows the end of the tape containing the first adhesive layer 112 to be exposed in the specific notch 114, making it easier to find the tearing location and improving tearing convenience.

[0095] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. An adhesive tape, characterized in that: The adhesive tape comprises: a substrate having an adhesive surface; The adhesive layer comprises a first adhesive layer and a second adhesive layer; The first adhesive layer is provided in the middle region of the adhesive surface in the width direction, and the second adhesive layer is provided on both sides of the adhesive surface in the width direction; or, the second adhesive layer is provided on the adhesive surface, the first adhesive layer is superimposed on the side of the second adhesive layer facing away from the substrate, and the first adhesive layer is located in the middle region of the second adhesive layer along the width direction of the adhesive surface; wherein, The first adhesive layer is formed of a first colloid that can lose its viscosity within a predetermined time, and the second adhesive layer is formed of a second colloid that maintains its viscosity within a predetermined time.

2. The adhesive tape according to claim 1, wherein The first colloid is acrylic glue, epoxy resin glue, silane resin glue or alumina glue; The first colloid completes a curing reaction by contacting with air when the predetermined time is reached, thereby losing its viscosity.

3. The adhesive tape according to claim 1, wherein The second colloid is a pressure-sensitive adhesive.

4. The adhesive tape according to claim 1, wherein The tape is provided with a plurality of ventilation holes, which penetrate the tape in a direction perpendicular to the adhesive surface and are distributed in the contour area of ​​the first adhesive layer, so that the first adhesive layer contacts the air through the ventilation holes and undergoes a curing reaction.

5. A bonding process, characterized in that: The bonding process includes: Positioning, aligning the first material to be bonded with the second material so that the first adhesive layer of the adhesive tape according to any one of claims 1 to 4 is directly opposite to the gap between the first material and the second material; Bonding: using the adhesive tape to bond the first material and the second material; Cutting: using a cutting knife to cut a specific notch at one end of the adhesive tape, and making the portion of the adhesive tape containing the first adhesive layer at the end after cutting exposed at the specific notch.

6. The bonding process according to claim 5, characterized in that: The specific notch is in a V-shaped structure, so that the portion of the adhesive tape containing the first adhesive layer at the end after being cut is exposed at the specific notch.

7. The bonding process according to claim 5, characterized in that: Providing an adhesive tape production device, and producing the adhesive tape by the adhesive tape production device; The production steps of the adhesive tape include: The first colloid is coated on the adhesive surface of the substrate by the adhesive tape production equipment, and the first colloid is located in the middle area of ​​the adhesive surface to form the first adhesive layer; The second colloid is coated on the adhesive surface of the substrate by the adhesive tape production equipment, and the second colloid is located on both sides of the first adhesive layer along the width direction of the adhesive surface.

8. The bonding process according to claim 5, characterized in that: Provided is an adhesive tape production device, comprising a gluing assembly and a tape slitting assembly, wherein the gluing assembly is mounted on the tape slitting assembly; Cutting the original tape on the tape mother roll by the tape slitting assembly and cutting the original tape into a plurality of slit tapes with predetermined widths, the tape mother roll comprising a base material and a second adhesive layer, the second adhesive layer being disposed on the adhesive surface; The first colloid is coated on the slitting tape by the glue coating assembly so that the first colloid is located on the side of the second glue layer facing away from the substrate and arranged along the middle area in the width direction of the glue surface to form a first glue layer.

9. The bonding process according to claim 8, characterized in that: The slitting tape coated with the first colloid is rolled up by the tape slitting assembly to form a finished tape roll.

10. The bonding process according to claim 5, characterized in that: The first material and the second material are two sealing plates on the packaging box; A box sealing device equipped with the cutting knife is provided, and the packaging box is sealed by the box sealing device, and the cutting knife is driven to move in a direction perpendicular to the adhesive surface to cut a specific notch at one end of the tape, and the portion of the cut tape containing the first adhesive layer at this end is exposed at the specific notch.

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