Ultrathin electronic aluminum foil production process

Abstract

The invention relates to the technical field of aluminum foil production, in particular to an ultrathin electronic aluminum foil production process which comprises the following steps: smelting, namely forming raw materials into molten aluminum by using a heat accumulating type smelting furnace, and sequentially carrying out cast rolling, cold rolling, rough rolling, intermediate rolling and finish rolling to obtain ultrathin electronic aluminum foil; wherein the raw materials comprise the following components in percentage by weight: 0.006-0.008% of an extension agent; according to the nickel-plated Al2O3 material coated TiB2-CeO2 extension agent disclosed by the invention, Al2O3 and TiB2 can be synergistically matched, so that the ductility of an aluminum foil is effectively improved, and an ultrathin electronic aluminum foil is convenient to prepare.

Description

Technical Field

[0001] The invention relates to the technical field of aluminum foil production, and in particular to a production process of ultra-thin electronic aluminum foil. Background Art

[0002] With the advancement of miniaturization and higher density in electronic components, demand for ultra-thin electronic aluminum foil (thickness ≤ 0.011 mm) is growing in applications such as capacitors and lithium battery current collectors. However, traditional aluminum foil production processes have significant shortcomings in material design, grain refinement, and high-temperature stability, hindering performance improvements and high-end applications.

[0003] Traditional aluminum foil mostly improves its strength by adding a single grain refiner (such as Al-Ti-B master alloy), but excessive addition will lead to excessive grain refinement, causing work hardening and a significant decrease in elongation; the grains of aluminum foil are easily coarsened during annealing or high-temperature working environments, and traditional refiners (such as TiB2) easily react with the aluminum matrix interface to form a brittle Al3Ti phase, resulting in insufficient high-temperature elongation retention; it is difficult to prepare ultra-thin electronic aluminum foil. Summary of the Invention

[0004] The purpose of the present invention is to provide a production process for ultra-thin electronic aluminum foil. The technical problems solved by the present invention are as follows: conventional aluminum foil is mostly improved in strength by adding a single grain refiner (such as Al-Ti-B master alloy), but excessive addition will lead to excessive grain refinement, induce work hardening, and significantly reduce elongation; the grains of aluminum foil are easily coarsened during annealing or high-temperature working environment, and the interface between traditional refiners (such as TiB2) and the aluminum matrix is ​​easily reacted to form a brittle Al3Ti phase, resulting in insufficient high-temperature elongation retention; it is difficult to prepare ultra-thin electronic aluminum foil.

[0005] The purpose of the present invention can be achieved through the following technical solutions: A production process for ultra-thin electronic aluminum foil comprises the following steps: smelting, wherein raw materials are melted into aluminum liquid in a regenerative melting furnace, and then subjected to casting, cold rolling, rough rolling, intermediate rolling and finish rolling in sequence to obtain ultra-thin electronic aluminum foil; The raw materials include 0.006-0.008% by weight of an extender.

[0006] As a further solution of the present invention: a process for preparing an extender comprises the following steps: Step 1: preparing TiB2-CeO2 composite particles; Step 2: Prepare Al2O3 material coated TiB2-CeO2 composite particles; Step 3: Prepare nickel-plated Al2O3 material coated with TiB2-CeO2 ductility agent.

[0007] As a further embodiment of the present invention: in step 1, the titanium source solution is slowly added dropwise to the cerium-boron mixed solution; the reaction temperature is controlled at 50-60°C, stirring is continued for 2-3 hours, the pH of the solution is adjusted to 3.0-3.5 with dilute nitric acid (0.1 mol / L), and the temperature is then raised to 70-80°C to form a sol; The sol is dried and calcined to obtain TiB2-CeO2 composite particles.

[0008] As a further solution of the present invention: Preparation of titanium source solution: Butyl titanate and anhydrous ethanol are mixed in a volume ratio of 1:4, and magnetically stirred for 30 minutes to obtain a titanium source solution.

[0009] As a further embodiment of the present invention, a cerium-boron mixed solution is prepared by weighing Ce(NO3)3·6H2O and H3BO3 at a Ti:Ce:B molar ratio of 1:0.25:2 and dissolving them in an ethanol-water mixed solvent; adding citric acid and stirring until completely dissolved to obtain a cerium-boron mixed solution.

[0010] As a further solution of the present invention: In step 2, the preparation process of the Al2O3 material coated TiB2-CeO2 precursor is: TiB2-CeO2 was mixed with water to prepare a 100 g / L TiB2-CeO2 suspension, and then 0.1-0.4 mol / L ammonium aluminum sulfate solution and 0.4-1.6 mol / L ammonium bicarbonate solution were added dropwise to perform precipitation reaction.

[0011] As a further solution of the present invention: in step 3, the nickel plating solution and the Al2O3 material coated TiB2-CeO2 composite particles are mixed and stirred at 40-70°C for 1-2 hours to obtain a nickel-plated Al2O3 material coated TiB2-CeO2 ductile agent.

[0012] As a further solution of the present invention: the usage ratio of nano-Al2O3 to nickel plating solution is 1g:200-500mL.

[0013] As a further embodiment of the present invention, the nickel plating solution is prepared as follows: Slowly add nickel sulfate solution to sodium citrate solution, then add sodium hypophosphite solution and boric acid solution in sequence to obtain a basic solution, finally add choline chloride-ethylene glycol solution to the basic solution, and adjust the pH value of the solution to 9-10 with sodium hydroxide to obtain a nickel plating solution.

[0014] As a further solution of the present invention, the nickel sulfate content in the basic solution is 25-55 g / L, the sodium hypophosphite content is 20-40 g / L, the sodium citrate content is 10-40 g / L, the boric acid content is 10-30 g / L; and the choline chloride-ethylene glycol content is 2-70 g / L.

[0015] Beneficial effects of the present invention: The nickel-plated Al2O3 material of the present invention is coated with a TiB2-CeO2 ductility agent, and its ductility agent is analyzed in detail: TiB2 (titanium diboride) as a grain refiner in aluminum and aluminum alloys can significantly refine grains and improve material properties; CeO2's grain boundary pinning effect can synergistically refine grains, improve the elongation of aluminum alloys, and enhance high-temperature stability; An Al2O3 coating layer is introduced to isolate CeO2 from direct contact at high temperatures. This prevents the CeO2 nanoparticles from undergoing grain growth (Ostwald ripening) or sintering at high temperatures (>800°C), which can lead to a sharp decrease in specific surface area. Electroless nickel is plated on the surface of the Al2O3 particles, and the metal layer acts as a "bridge" to promote bonding between the aluminum melt and the particles. The addition of Al2O3 nanoparticles improves overall performance through dispersion strengthening and crack propagation retardation. The nickel-plated Al2O3 material coated TiB2-CeO2 ductility agent of the present invention can effectively improve the ductility of the aluminum foil through the synergistic cooperation between Al2O3 and TiB2, thereby facilitating the preparation of ultra-thin electronic aluminum foil. DETAILED DESCRIPTION

[0016] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention. Example 1

[0017] An embodiment of the present invention provides a process for producing ultra-thin electronic aluminum foil, which comprises the following steps: Melting: The raw materials are melted into aluminum liquid in a regenerative melting furnace, filtered and then enter the casting and rolling mill through the launder; The weight percentages of the raw materials include Si: 0.15%, Cu: 0.03%, Zn: 0.05%, Mn: 0.08%, Ti: 0.05%, Fe: 0.3%, Ni: 0.05%, Cr: 0.005%, Cd: 0.006%, Pb: 0.005%, Sn: 0.006%, Zr: 0.006%, ductility agent 0.006%, and the remainder is Al; Casting and rolling: the smelted aluminum liquid is introduced into the casting and rolling mill to be cast into aluminum foil billets; Cold rolling: After cooling the aluminum foil blank to room temperature, it is rolled to 0.78 mm by a cold rolling mill, then sent to an annealing furnace for homogenization annealing, and then further rolled to 0.36 mm to obtain aluminum foil blank; Rough rolling: the aluminum foil raw material is subjected to rough rolling, and the reduction passes of the rough rolling are 0.36 mm → 0.19 mm → 0.09 mm → 0.043 mm; Intermediate rolling: the aluminum foil raw material after rough rolling is subjected to intermediate rolling, and the reduction pass of the intermediate rolling is 0.043 mm→0.021 mm. The roller used in the intermediate rolling process is No. 220 roller with a roughness of 0.095-0.105 μm; Finish rolling, wherein the aluminum foil raw material after the intermediate rolling is subjected to finish rolling, and the reduction pass of the finish rolling is 0.021 mm→0.011 mm, to obtain electronic aluminum foil; Exemplarily, the preparation process of the extender includes the following steps: Step 1: preparing TiB2-CeO2 composite particles; The titanium source solution was slowly added dropwise to the cerium-boron mixed solution; the reaction temperature was controlled at 50°C and stirring was continued for 2 hours. The pH of the solution was then adjusted to 3.0 with dilute nitric acid (0.1 mol / L), and the temperature was raised to 70°C. Stirring was continued until the solution viscosity increased significantly and a sol was formed; The sol was transferred to a vacuum drying oven and dried at 60°C for 24 hours to form a xerogel. The xerogel was placed in a muffle furnace and heated to 400°C at a rate of 2°C / min and kept at that temperature for 2 hours. The xerogel was then transferred to a tube furnace and heated to 1200°C at a rate of 5°C / min in a H2 / Ar mixed atmosphere and kept at that temperature for 3 hours to obtain TiB2-CeO2 composite particles. The titanium source solution was prepared by mixing butyl titanate and anhydrous ethanol in a volume ratio of 1:4 and magnetically stirring for 30 minutes to obtain a titanium source solution. Preparation of a cerium-boron mixed solution: Ce(NO₃)₃·6H₂O and H₃BO₃ were weighed and dissolved in an ethanol-water mixed solvent (ethanol:water = 3:1, volume ratio) at a Ti:Ce:B molar ratio of 1:0.25:2. Citric acid (total metal ion molar ratio of 1.5:1) was added and stirred until completely dissolved to obtain a cerium-boron mixed solution. Step 2: Preparation of Al2O3 material coated TiB2-CeO2 composite particles The Al2O3 material coated TiB2-CeO2 precursor was calcined in a muffle furnace at 500℃ for 1 hour to obtain the ductility agent; The preparation process of Al2O3 material coated TiB2-CeO2 precursor is as follows: TiB2-CeO2 was mixed with water to prepare a 100 g / L TiB2-CeO2 suspension, and then 0.1 mol / L aluminum ammonium sulfate solution and 0.4 mol / L ammonium bicarbonate solution were added dropwise to react with precipitation. The pH value was stabilized between 7 and the reaction time was controlled within 2 h. The precipitate was washed three times with deionized water, filtered, and dried at 80 ° C for 12 hours to obtain Al2O3 coated TiB2-CeO2 precursor. Step 3: Preparation of nickel-plated Al2O3 material coated with TiB2-CeO2 ductility agent The nickel plating solution and the Al2O3 material coated TiB2-CeO2 composite particles were mixed and stirred at 40°C for 1-2 hours to obtain a nickel-plated Al2O3 material coated TiB2-CeO2 ductility agent; Among them, the dosage ratio of nano-Al2O3 to nickel plating solution is 1g:200mL; More specifically, the nickel plating solution is prepared as follows: Slowly adding nickel sulfate solution to sodium citrate solution, followed by sequentially adding sodium hypophosphite solution and boric acid solution to obtain a base solution, finally adding choline chloride-ethylene glycol solution to the base solution, and adjusting the pH value of the solution to 9 with sodium hydroxide to obtain a nickel plating solution; The basic solution contains 25 g / L nickel sulfate, 20 g / L sodium hypophosphite, 10 g / L sodium citrate, 10 g / L boric acid, and 2 g / L choline chloride-ethylene glycol. Example 2

[0018] An embodiment of the present invention provides a process for producing ultra-thin electronic aluminum foil, which comprises the following steps: Melting: The raw materials are melted into aluminum liquid in a regenerative melting furnace, filtered and then enter the casting and rolling mill through the launder; The raw materials include Si: 0.20%, Cu: 0.05%, Zn: 0.10%, Mn: 0.09%, Ti: 0.07%, Fe: 0.5%, Ni: 0.055%, Cr: 0.0055%, Cd: 0.007%, Pb: 0.005-0.006%, Sn: 0.007%, Zr: 0.007%, ductility agent 0.007%, and the balance is Al; Casting and rolling: the smelted aluminum liquid is introduced into the casting and rolling mill to be cast into aluminum foil billets; Cold rolling: After cooling the aluminum foil blank to room temperature, it is rolled to 0.78 mm by a cold rolling mill, then sent to an annealing furnace for homogenization annealing, and then further rolled to 0.36 mm to obtain aluminum foil blank; Rough rolling: the aluminum foil raw material is subjected to rough rolling, and the reduction passes of the rough rolling are 0.36 mm → 0.19 mm → 0.09 mm → 0.043 mm; Intermediate rolling: the aluminum foil raw material after rough rolling is subjected to intermediate rolling, and the reduction pass of the intermediate rolling is 0.043 mm→0.021 mm. The roller used in the intermediate rolling process is No. 220 roller with a roughness of 0.095-0.105 μm; Finish rolling, wherein the aluminum foil raw material after the intermediate rolling is subjected to finish rolling, and the reduction pass of the finish rolling is 0.021 mm→0.011 mm, to obtain electronic aluminum foil; Exemplarily, the preparation process of the extender includes the following steps: Step 1: preparing TiB2-CeO2 composite particles; The titanium source solution was slowly added dropwise to the cerium-boron mixed solution; the reaction temperature was controlled at 55°C and stirring was continued for 2 hours. The pH of the solution was then adjusted to 3.2 with dilute nitric acid (0.1 mol / L), and the temperature was raised to 75°C. Stirring was continued until the solution viscosity increased significantly and a sol was formed; The sol was transferred to a vacuum drying oven and dried at 60°C for 24 hours to form a xerogel. The xerogel was placed in a muffle furnace and heated to 400°C at a rate of 2°C / min and kept at that temperature for 2 hours. The xerogel was then transferred to a tube furnace and heated to 1200°C at a rate of 5°C / min in a H2 / Ar mixed atmosphere and kept at that temperature for 3 hours to obtain TiB2-CeO2 composite particles. The titanium source solution was prepared by mixing butyl titanate and anhydrous ethanol in a volume ratio of 1:4 and magnetically stirring for 30 minutes to obtain a titanium source solution. Preparation of a cerium-boron mixed solution: Ce(NO₃)₃·6H₂O and H₃BO₃ were weighed and dissolved in an ethanol-water mixed solvent (ethanol:water = 3:1, volume ratio) at a Ti:Ce:B molar ratio of 1:0.25:2. Citric acid (total metal ion molar ratio of 1.5:1) was added and stirred until completely dissolved to obtain a cerium-boron mixed solution. Step 2: Preparation of Al2O3 material coated TiB2-CeO2 composite particles The Al2O3 material coated TiB2-CeO2 precursor was calcined in a muffle furnace at 700℃ for 1 hour to obtain the ductility agent; The preparation process of Al2O3 material coated TiB2-CeO2 precursor is as follows: TiB2-CeO2 was mixed with water to prepare a 100 g / L TiB2-CeO2 suspension, and then 0.2 mol / L aluminum ammonium sulfate solution and 0.9 mol / L ammonium bicarbonate solution were added dropwise to react with precipitation. The pH value was stabilized between 7 and the reaction time was controlled at 4 h. The precipitate was washed three times with deionized water, filtered, and dried at 80 ° C for 12 hours to obtain Al2O3 coated TiB2-CeO2 precursor. Step 3: Preparation of nickel-plated Al2O3 material coated with TiB2-CeO2 ductility agent The nickel plating solution and the Al2O3 material coated TiB2-CeO2 composite particles were mixed and stirred at 40°C for 1 hour to obtain a nickel-plated Al2O3 material coated TiB2-CeO2 ductility agent; Among them, the dosage ratio of nano-Al2O3 to nickel plating solution is 1g:400mL; More specifically, the nickel plating solution is prepared as follows: Slowly adding nickel sulfate solution to sodium citrate solution, followed by sequentially adding sodium hypophosphite solution and boric acid solution to obtain a base solution, finally adding choline chloride-ethylene glycol solution to the base solution, and adjusting the pH value of the solution to 9 with sodium hydroxide to obtain a nickel plating solution; The basic solution contains 45 g / L nickel sulfate, 30 g / L sodium hypophosphite, 30 g / L sodium citrate, 20 g / L boric acid, and 30 g / L choline chloride-ethylene glycol. Example 3

[0019] An embodiment of the present invention provides a process for producing ultra-thin electronic aluminum foil, which comprises the following steps: Melting: The raw materials are melted into aluminum liquid in a regenerative melting furnace, filtered and then enter the casting and rolling mill through the launder; The raw materials include Si: 0.3%, Cu: 0.06%, Zn: 0.15%, Mn: 0.10%, Ti: 0.10%, Fe: 0.7%, Ni: 0.06%, Cr: 0.006%, Cd: 0.008%, Pb: 0.006%, Sn: 0.008%, Zr: 0.008%, ductility agent 0.008%, and the balance is Al; Casting and rolling: the smelted aluminum liquid is introduced into the casting and rolling mill to be cast into aluminum foil billets; Cold rolling: After cooling the aluminum foil blank to room temperature, it is rolled to 0.78 mm by a cold rolling mill, then sent to an annealing furnace for homogenization annealing, and then further rolled to 0.36 mm to obtain aluminum foil blank; Rough rolling: the aluminum foil raw material is subjected to rough rolling, and the reduction passes of the rough rolling are 0.36 mm → 0.19 mm → 0.09 mm → 0.043 mm; Intermediate rolling: the aluminum foil raw material after rough rolling is subjected to intermediate rolling, and the reduction pass of the intermediate rolling is 0.043 mm→0.021 mm. The roller used in the intermediate rolling process is No. 220 roller with a roughness of 0.095-0.105 μm; Finish rolling, wherein the aluminum foil raw material after the intermediate rolling is subjected to finish rolling, and the reduction pass of the finish rolling is 0.021 mm→0.011 mm, to obtain electronic aluminum foil; Exemplarily, the preparation process of the extender includes the following steps: Step 1: preparing TiB2-CeO2 composite particles; The titanium source solution was slowly added dropwise to the cerium-boron mixed solution; the reaction temperature was controlled at 60°C and stirring was continued for 3 hours. The pH of the solution was then adjusted to 3.5 with dilute nitric acid (0.1 mol / L), and the temperature was raised to 80°C. Stirring was continued until the solution viscosity increased significantly and a sol was formed; The sol was transferred to a vacuum drying oven and dried at 60°C for 24 hours to form a xerogel. The xerogel was placed in a muffle furnace and heated to 400°C at a rate of 2°C / min and kept at that temperature for 2 hours. The xerogel was then transferred to a tube furnace and heated to 1200°C at a rate of 5°C / min in a H2 / Ar mixed atmosphere and kept at that temperature for 3 hours to obtain TiB2-CeO2 composite particles. The titanium source solution was prepared by mixing butyl titanate and anhydrous ethanol in a volume ratio of 1:4 and magnetically stirring for 30 minutes to obtain a titanium source solution. Preparation of a cerium-boron mixed solution: Ce(NO₃)₃·6H₂O and H₃BO₃ were weighed and dissolved in an ethanol-water mixed solvent (ethanol:water = 3:1, volume ratio) at a Ti:Ce:B molar ratio of 1:0.25:2. Citric acid (total metal ion molar ratio of 1.5:1) was added and stirred until completely dissolved to obtain a cerium-boron mixed solution. Step 2: Preparation of Al2O3 material coated TiB2-CeO2 composite particles The Al2O3 material is coated on the TiB2-CeO2 precursor and calcined in a muffle furnace at 500-900°C for 2 hours to obtain the ductility agent; The preparation process of Al2O3 material coated TiB2-CeO2 precursor is as follows: TiB2-CeO2 was mixed with water to prepare a 100 g / L TiB2-CeO2 suspension, and then 0.4 mol / L aluminum ammonium sulfate solution and 0.4-1.6 mol / L ammonium bicarbonate solution were added dropwise to react with precipitation. The pH value was stabilized between 8 and the reaction time was controlled within 6 h. The precipitate was washed three times with deionized water, filtered, and dried at 80 ° C for 12 hours to obtain Al2O3 coated TiB2-CeO2 precursor. Step 3: Preparation of nickel-plated Al2O3 material coated with TiB2-CeO2 ductility agent The nickel plating solution and the Al2O3 material coated TiB2-CeO2 composite particles were mixed and stirred at 70°C for 2 hours to obtain a nickel-plated Al2O3 material coated TiB2-CeO2 ductility agent; Among them, the dosage ratio of nano-Al2O3 to nickel plating solution is 1g:500mL; More specifically, the nickel plating solution is prepared as follows: Slowly adding nickel sulfate solution to sodium citrate solution, followed by sequentially adding sodium hypophosphite solution and boric acid solution to obtain a base solution, finally adding choline chloride-ethylene glycol solution to the base solution, and adjusting the pH value of the solution to 10 with sodium hydroxide to obtain a nickel plating solution; The basic solution contains 55 g / L nickel sulfate, 40 g / L sodium hypophosphite, 40 g / L sodium citrate, 30 g / L boric acid, and 70 g / L choline chloride-ethylene glycol.

[0020] Comparative Example 1 Comparative Example 1 uses the aluminum foil disclosed in Chinese Patent No. CN111519050B.

[0021] The aluminum foils of Examples 1-3 and Comparative Example 1 were tested for ductility, specifically: Tensile test (ASTM E8 standard): Specimen size: gauge section 50 mm × 15 mm (thickness 0.011 mm); Testing equipment: universal material testing machine (Instron 3369); Tensile rate: 2 mm / min; Test parameters: tensile strength (MPa), elongation (%).

[0022] Cupping test (Erichsen value, ISO 20482): Specimen size: 100 mm × 100 mm; Punch diameter: 20 mm; Test speed: 5 mm / min; Record the maximum depth (mm) at which the material breaks.

[0023]

[0024] It can be seen from the above table that the aluminum foil prepared by the nickel-plated Al2O3 material coated with TiB2-CeO2 ductility agent of the present invention has good ductility.

[0025] The above is a detailed description of an embodiment of the present invention. However, the content described is only a preferred embodiment of the present invention and should not be considered to limit the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A process for producing ultra-thin electronic aluminum foil, characterized in that: The following steps are involved: Melting: The raw materials are melted into aluminum liquid in a regenerative melting furnace, and then subjected to casting, cold rolling, rough rolling, intermediate rolling and finishing rolling to obtain ultra-thin electronic aluminum foil; The raw materials include 0.006-0.008% by weight of an extender.

2. The process for producing ultra-thin electronic aluminum foil according to claim 1, characterized in that: The preparation process of the extender comprises the following steps: Step 1: preparing TiB2-CeO2 composite particles; Step 2: Prepare Al2O3 material coated TiB2-CeO2 composite particles; Step 3: Prepare nickel-plated Al2O3 material coated with TiB2-CeO2 ductility agent.

3. The process for producing ultra-thin electronic aluminum foil according to claim 2, characterized in that: In step 1, the titanium source solution is slowly added dropwise to the cerium-boron mixed solution; the reaction temperature is controlled at 50-60°C, stirring is continued for 2-3 hours, and the pH of the solution is adjusted to 3.0-3.5 with dilute nitric acid (0.1 mol / L), and the temperature is then raised to 70-80°C to form a sol; The sol is dried and calcined to obtain TiB2-CeO2 composite particles.

4. The process for producing ultra-thin electronic aluminum foil according to claim 3, characterized in that: Preparation of titanium source solution: Butyl titanate and anhydrous ethanol were mixed in a volume ratio of 1:4 and magnetically stirred for 30 minutes to obtain a titanium source solution.

5. The process for producing ultra-thin electronic aluminum foil according to claim 3, characterized in that: Preparation of cerium-boron mixed solution: Ce(NO3)3·6H2O and H3BO3 were weighed and dissolved in an ethanol-water mixed solvent at a Ti:Ce:B molar ratio of 1:0.25:2; citric acid was added and stirred until completely dissolved to obtain a cerium-boron mixed solution.

6. The process for producing ultra-thin electronic aluminum foil according to claim 1, characterized in that: In step 2, the preparation process of Al2O3 material coated TiB2-CeO2 precursor is as follows: TiB2-CeO2 was mixed with water to prepare a 100 g / L TiB2-CeO2 suspension, and then 0.1-0.4 mol / L ammonium aluminum sulfate solution and 0.4-1.6 mol / L ammonium bicarbonate solution were added dropwise to perform precipitation reaction.

7. The process for producing ultra-thin electronic aluminum foil according to claim 1, characterized in that: In step 3, the nickel plating solution and the Al2O3 material coated TiB2-CeO2 composite particles are mixed and stirred at 40-70°C for 1-2 hours to obtain a nickel-plated Al2O3 material coated TiB2-CeO2 ductility agent.

8. The process for producing ultra-thin electronic aluminum foil according to claim 7, characterized in that: The usage ratio of nano-Al2O3 to nickel plating solution is 1g:200-500mL.

9. The process for producing ultra-thin electronic aluminum foil according to claim 8, characterized in that: The nickel plating solution is prepared as follows: Slowly add nickel sulfate solution to sodium citrate solution, then add sodium hypophosphite solution and boric acid solution in sequence to obtain a basic solution, finally add choline chloride-ethylene glycol solution to the basic solution, and adjust the pH value of the solution to 9-10 with sodium hydroxide to obtain a nickel plating solution.

10. The process for producing ultra-thin electronic aluminum foil according to claim 9, characterized in that: The basic solution contains 25-55 g / L of nickel sulfate, 20-40 g / L of sodium hypophosphite, 10-40 g / L of sodium citrate, 10-30 g / L of boric acid, and 2-70 g / L of choline chloride-ethylene glycol.

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