Ring-shaped semiconductor COS laser housing sintering and fixing device and fixing method

Abstract

This application provides a sintering and fixing device and method for a ring-shaped semiconductor COS laser housing, relating to the field of laser welding equipment manufacturing technology. The sintering and fixing device for a ring-shaped semiconductor laser housing includes: a base, with support frames connected to both ends of the base; support frames connected to both ends of the base; and a plurality of rotatable sintering fixing blocks connected between two support frames. Each sintering fixing block has at least one first mounting hole and at least two second mounting holes spaced apart along a second direction. The first and second mounting holes are arranged along the first direction. The size of the first mounting hole in the second direction is larger than that of the second mounting holes in the second direction. The first and second mounting holes are used to mount sintering probes. Each sintering probe corresponds to one chip in the ring-shaped semiconductor laser housing to be sintered. This application achieves the effect of allowing users to easily adjust the pressure between the sintering fixing block and the chip to be sintered.

Description

Technical Field

[0001] This application relates to the field of laser welding equipment manufacturing technology, and in particular to a device and method for fixing the housing of a ring semiconductor COS laser. Background Technology

[0002] Laser technology has a wide range of applications, including welding and cutting. COS (Chip On Sub-mount) packaging is one of the mainstream semiconductor laser packaging methods. Ring-shaped laser spots offer higher welding quality. To form a ring-shaped laser spot, existing technologies employ a ring-shaped, double-layer chip structure for semiconductor COS lasers. However, this structure presents significant challenges in sintering the laser chip, is complex to operate, and is prone to displacement during sintering. Existing laser sintering fixing devices cannot stably fix the ring-shaped semiconductor laser housing and chip to be sintered, failing to meet the precision requirements of sintering. Summary of the Invention

[0003] The purpose of this application is to provide a sintering and fixing device and method for a ring-shaped semiconductor COS laser housing, so as to improve the technical problems mentioned in the background section.

[0004] For the purposes mentioned above, this application provides the following technical solution:

[0005] The first aspect of this application provides a sintering and fixing device for a ring-shaped semiconductor laser housing, comprising:

[0006] The base has support frames connected to its two ends.

[0007] Support frames are connected to both ends of the base.

[0008] Multiple rotatable sintering fixing blocks are connected between two support frames. The multiple sintering fixing blocks form a hollow area to accommodate the annular semiconductor laser housing to be sintered.

[0009] The sintered fixing block has at least one first mounting hole (1660) and at least two second mounting holes (1670) spaced apart along a second direction, wherein the first mounting hole (1660) and the second mounting holes (1670) are arranged along a first direction;

[0010] The size of the first mounting hole in the second direction is larger than that of the second mounting hole in the second direction. The first mounting hole and the second mounting hole are used to mount sintering probes, and each sintering probe corresponds to one chip to be sintered in the annular semiconductor laser housing.

[0011] Furthermore, the first direction is set to be parallel to the axial direction of the annular semiconductor laser housing, and the second direction is set to be the circumferential direction of the annular semiconductor laser housing.

[0012] Furthermore, the support frame includes:

[0013] The outer ring of the first support frame is connected to the first end of the base;

[0014] The outer ring of the second support frame is connected to the second end of the base;

[0015] The inner ring of the first support frame is interlocked with the outer ring of the first support frame, and the inner ring of the first support frame is rotatable relative to the outer ring of the first support frame.

[0016] The inner ring of the second support frame is interlocked with the outer ring of the second support frame, and the inner ring of the second support frame is rotatable relative to the outer ring of the second support frame.

[0017] Furthermore, the tool path of the first mounting hole is shorter than that of the second mounting hole; and / or,

[0018] The area of ​​the first mounting hole is larger than the area of ​​the second mounting hole.

[0019] Furthermore, the sintered fixing block includes:

[0020] The first connecting part connects to the inner ring of the first support frame;

[0021] The second connecting part connects to the inner ring of the second support frame;

[0022] A first mounting part, on which a first mounting hole is formed;

[0023] The second mounting part has a second mounting hole formed on it.

[0024] Furthermore, the second mounting portion has a fixed tilt angle on both sides of the second direction toward the chip to be sintered; and / or, both the first connecting portion and the second connecting portion adopt a hollow U-shaped structure.

[0025] Furthermore, the second mounting part includes a rotating shaft, a first hinge part, and a second hinge part. The rotating shaft, through a spring, enables the first hinge part and the second hinge part to have a self-restoring force on both sides of the second direction toward the chip to be sintered. The sintering probe on the second mounting part automatically adjusts its angle according to the position of the annular semiconductor laser housing to be sintered.

[0026] Furthermore, the first mounting part and the second mounting part form a T-shaped structure, and the length of the first mounting part along the second direction is shorter than the length of the second mounting part along the second direction.

[0027] Furthermore, multiple detachable first fixing sliders are provided along the circumferential direction at the edge of the inner ring of the first support frame, and the first connecting part, the first fixing sliders and the inner ring of the first support frame are connected and fixed by fasteners;

[0028] Multiple detachable second fixing sliders are provided along the circumferential direction at the edge of the inner ring of the second support frame. The second connecting part, the second fixing sliders and the inner ring of the second support frame are connected and fixed by fasteners.

[0029] A second aspect of this application provides a method for sintering and fixing a ring-shaped semiconductor laser housing, comprising:

[0030] Step S10: Install the ring-shaped semiconductor laser housing to be sintered between two support frames;

[0031] Step S20: Install multiple sintered fixing blocks between two support frames;

[0032] Step S30: Install the sintering probes in the first mounting hole and the second mounting hole, and the multiple sintering probes press the multiple chips to be sintered against the ring-shaped semiconductor laser housing to be sintered in a one-to-one correspondence.

[0033] Step S40: Place the annular semiconductor laser housing sintering fixing device, the chip to be sintered, and the annular semiconductor laser housing to be sintered obtained in step S30 into a reflow oven for sintering.

[0034] A third aspect of this application provides a method for sintering and fixing a ring-shaped semiconductor laser housing, comprising:

[0035] Step S11: Install the ring-shaped semiconductor laser housing to be sintered between two support frames;

[0036] Step S21: Determine the number of sintering fixing blocks, the first fixing slider, and the second fixing slider corresponding to the annular semiconductor laser housing to be sintered;

[0037] Step S31: Install the required number of first fixed sliders and second fixed sliders on the inner ring of the first support frame and the inner ring of the second support frame respectively, and install the required number of sintered fixing blocks between the inner ring of the first support frame and the inner ring of the second support frame.

[0038] Step S41: Install the sintering probes in the first mounting hole and the second mounting hole, and the multiple sintering probes press the multiple chips against the ring-shaped semiconductor laser housing to be sintered in a one-to-one correspondence.

[0039] Step S51: Place the annular semiconductor laser housing sintering fixing device, the chip to be sintered, and the annular semiconductor laser housing to be sintered obtained in step S41 into a reflow oven for sintering.

[0040] This application has at least the following advantages or beneficial effects: By designing a fixing device that facilitates the sintering of the chip to be sintered to the housing of a ring semiconductor laser, this application solves the technical problems of high difficulty in sintering the chip to be sintered, complex operation, and easy displacement of the sintering position in a ring-shaped double-layer chip structure of a ring semiconductor COS laser. It achieves the technical effect of allowing users to easily adjust the structure of the chip to be sintered from 360 degrees, easily adjust the pressure between the sintering fixing block and the chip to be sintered, and gradually release the pressure of the sintering fixing block on the chip to be sintered as the solder melts. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0042] Figure 1 A schematic diagram of a ring-shaped semiconductor laser housing sintering and fixing device provided in Embodiment 1 of this application, in which a ring-shaped semiconductor laser housing is internally placed;

[0043] Figure 2 A schematic diagram of a ring-shaped semiconductor laser housing sintering and fixing device without an internal ring-shaped semiconductor laser housing provided in Embodiment 1 of this application;

[0044] Figure 3 A schematic diagram of the base, the outer ring of the first support frame, the outer ring of the second support frame, the inner ring of the first support frame, the inner ring of the second support frame, and the annular semiconductor laser housing provided in Embodiment 1 of this application;

[0045] Figure 4A This is an exploded view of the right side of the outer ring and inner ring of the first support frame provided in Embodiment 1 of this application;

[0046] Figure 4B This is an exploded left view of the outer ring and inner ring of the first support frame provided in Embodiment 1 of this application;

[0047] Figure 5A The exploded view of the right side of the outer ring of the second support frame and the inner ring of the second support frame provided in Embodiment 1 of this application;

[0048] Figure 5B This is an exploded left view of the outer ring of the second support frame and the inner ring of the second support frame provided in Embodiment 1 of this application.

[0049] Figure 6A This is a front view of the sintered fixing block provided in Embodiment 1 of this application;

[0050] Figure 6B This is a schematic diagram of the back side of the sintered fixing block provided in Embodiment 1 of this application;

[0051] Figure 6C An exploded view of the sintering fixing block and sintering probe provided in Embodiment 1 of this application;

[0052] Figure 6D This is a schematic diagram illustrating the interaction between the sintering fixing block and the chip to be sintered, as provided in Embodiment 1 of this application.

[0053] Figure 7A A schematic diagram of a ring-shaped semiconductor laser housing to be sintered, provided for an embodiment of this application;

[0054] Figure 7B A schematic diagram showing the chip to be sintered onto the ring-shaped semiconductor laser housing, provided for an embodiment of this application;

[0055] Figure 7C for Figure 7B A magnified view of a portion of region A;

[0056] Figure 7D for Figure 7C The diagram shows the optimized structure.

[0057] Figure 8A for Figure 6C A magnified view of a portion of region D;

[0058] Figure 8B This is a schematic diagram of the tool path for the first mounting hole;

[0059] Figure 8C This is a schematic diagram of the tool path for the second mounting hole;

[0060] Figure 9A This is a front view of the sintering fixing block and sintering probe provided in Embodiment 2 of this application;

[0061] Figure 9B This is a schematic diagram of the back side of the sintered fixing block provided in Embodiment 2 of this application;

[0062] Figure 9C A schematic diagram of the inner ring of the first support frame provided in Embodiment 2 of this application;

[0063] Figure 10 This is a flowchart of the method for sintering and fixing an annular semiconductor laser housing applied to the annular semiconductor laser housing sintering and fixing device described in Embodiment 1;

[0064] Figure 11 This is a flowchart of the method for sintering and fixing the annular semiconductor laser housing, which is applied to the annular semiconductor laser housing sintering and fixing device described in Embodiment 2.

[0065] Reference numerals: 100 - sintering and fixing device for ring-shaped semiconductor laser housing; 110 - base;

[0066] 120 - Outer ring of the first support frame; 1201 - First annular groove; 140 - Inner ring of the first support frame; 1401 - First annular protrusion; 1402 - First positioning post; 1403 - First fixing slider; 1404 - First fixing hole; 1405 - Second fixing hole;

[0067] 130 - Second support frame outer ring; 1301 - Second annular groove; 150 - Second support frame inner ring; 1501 - Second annular protrusion; 1502 - Second positioning post;

[0068] 160 - Sintered fixing block; 1610 - First connecting part; 1620 - Second connecting part; 1630 - First mounting part; 1640 - Second mounting part; 1650 - Sintered probe; 1660 - First mounting hole; 1670 - Second mounting hole; 1641 - Rotating shaft; 1642 - First hinge part; 1643 - Second hinge part; 1680 - Positioning hole;

[0069] 200 - Ring-shaped semiconductor laser housing; 210 - Chip to be sintered; 220 - Positioning step; 230 - Guide groove. Detailed Implementation

[0070] The technical solutions of this application will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0071] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0072] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this invention is in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. In addition, the terms "first," "second," "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0073] Furthermore, terms such as "horizontal" and "vertical" do not imply that the component must be absolutely horizontal or suspended, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," not that the structure must be completely horizontal, but can be slightly tilted. Similarly, terms such as "front," "back," "left," and "right" do not imply that the component must be absolutely front, back, left, or right, but can be slightly tilted.

[0074] In the description of this invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0075] Example 1

[0076] The annular semiconductor laser housing sintering and fixing device provided in this application is used to fix the chip to be sintered and the annular semiconductor laser housing to be sintered, thereby stably sintering the chip to be sintered onto the annular semiconductor laser housing. The annular semiconductor laser housing described in this application can have various structures, including but not limited to the tower-shaped structure described in this embodiment, and can also be a columnar structure, etc.

[0077] like Figures 1-3 As shown, the annular semiconductor laser housing sintering and fixing device 100 includes a base 110, a support frame, and multiple sintering fixing blocks 160. The support frame includes a first support frame outer ring 120, a second support frame outer ring 130, a first support frame inner ring 140, and a second support frame inner ring 150. Figure 1 , Figure 3 As shown, the annular semiconductor laser housing 200 to be sintered is housed in a hollow space formed by multiple sintering fixing blocks 160. The inner ring 140 of the first support frame and the inner ring 150 of the second support frame together fix the position of the annular semiconductor laser housing 200 to be sintered.

[0078] The outer ring 120 of the first support frame is connected to the first end of the base 110, i.e. Figure 3 The left end of the base 110 shown; the outer ring 130 of the second support frame is connected to the second end of the base 110, that is, as shown Figure 3 The right end of the base 110 shown.

[0079] like Figure 4A , 4BAs shown, the inner ring 140 of the first support frame is engaged with the outer ring 120 of the first support frame. The inner ring 140 of the first support frame is rotatable relative to the outer ring 120 of the first support frame. Specifically, the outer ring 120 of the first support frame has a first annular groove 1201 in the direction facing the inner ring 140 of the first support frame, and the inner ring 140 of the first support frame has a first annular protrusion 1401 corresponding to the first annular groove 1201 in the direction facing the outer ring 120 of the first support frame. The first annular groove 1201 and the first annular protrusion 1401 cooperate with each other, thereby allowing the inner ring 140 of the first support frame to rotate relative to the outer ring 120 of the first support frame. The inner ring 140 of the first support frame also has a first positioning post 1402 with an enlarged end. When the inner ring 140 of the first support frame rotates to a preset position relative to the outer ring 120 of the first support frame, the first positioning post 1402 is used to fix the inner ring 140 of the first support frame and the outer ring 120 of the first support frame together.

[0080] like Figure 5A , 5B As shown, the inner ring 150 of the second support frame is engaged with the outer ring 130 of the second support frame. The inner ring 150 of the second support frame is rotatable relative to the outer ring 130 of the second support frame. Specifically, the outer ring 130 of the second support frame has a second annular groove 1301 in the direction facing the inner ring 150 of the second support frame, and the inner ring 150 of the second support frame has a second annular protrusion 1501 corresponding to the second annular groove 1301 in the direction facing the outer ring 130 of the second support frame. The second annular groove 1301 and the second annular protrusion 1501 cooperate with each other, thereby allowing the inner ring 150 of the second support frame to rotate relative to the outer ring 130 of the second support frame. The inner ring 150 of the second support frame also has a second positioning post 1502 with an enlarged end. When the inner ring 150 of the second support frame rotates to a preset position relative to the outer ring 130 of the second support frame, the second positioning post 1502 is used to fix the inner ring 150 of the second support frame and the outer ring 130 of the second support frame together. In actual use, the inner ring 140 of the first support frame and the inner ring 150 of the second support frame rotate synchronously, which makes it convenient for users to adjust the structure such as the chip 210 to be sintered 360 degrees.

[0081] like Figure 1 , Figure 2 As shown, a plurality of sintering fixing blocks 160 are connected between the inner ring 140 of the first support frame and the inner ring 150 of the second support frame. The plurality of sintering fixing blocks 160 form a hollow area in the shape of prism surfaces, thereby placing the annular semiconductor laser housing 200 to be sintered in the hollow area. In this embodiment, eight sintering fixing blocks 160 are installed exemplary. In actual applications, the number of sintering fixing blocks 160 can be adjusted according to the situation. In this embodiment, screws are used to fix the sintering fixing blocks 160 to the inner ring 140 and the inner ring 150 of the first support frame respectively. In actual applications, the fixing method can be adjusted according to the situation.

[0082] like Figure 6A As shown in Figure -6D, each sintering fixing block 160 is provided with multiple sintering probes 1650. Each sintering probe 1650 corresponds to one chip 210 on the annular semiconductor laser housing 200 to be sintered. Therefore, the number of sintering probes 1650 can be adjusted according to the number of chips 210 to be sintered. In this embodiment, each sintering fixing block 160 is provided with three sintering probes 1650, corresponding to three chips distributed in two layers on the annular semiconductor laser housing 200. In this embodiment, the sintering probes 1650 are fixed to the sintering fixing block 160 by screws. In practical applications, the fixing method can be adjusted according to the situation. Figure 6B As shown, each sintering probe 1650 in this embodiment has two pins for fixing the chip to be sintered. In practical applications, the appropriate number of pins can be selected according to the area or mass of the chip to be sintered. Generally speaking, the larger the area of ​​the chip to be sintered, the more pins are required. Figure 6D As shown, in the working state, the three sintering probes 1650 of the sintering fixing block 160 respectively abut against the three chips 210 to be sintered, and the two pins on each sintering probe fix one chip to be sintered.

[0083] like Figure 6A As shown, the sintered fixing block 160 includes a first connecting part 1610, a second connecting part 1620, a first mounting part 1630, and a second mounting part 1640. These parts are divided according to their functions. When manufacturing the sintered fixing block 160, each part can be formed separately and then assembled into a complete sintered fixing block, or it can be formed as a single piece. Figure 6A The sintered fixing block 160 shown is made of four parts molded as one piece.

[0084] like Figure 1 and 6A As shown, the first connecting part 1610 is connected to the inner ring 140 of the first support frame by screws, and the second connecting part 1620 is connected to the inner ring 150 of the second support frame by screws, thereby stably installing the sintered fixing block 160 between the inner ring 140 and the inner ring 150 of the first support frame. Figure 3 As shown, a mounting groove is provided at the center of the inner ring 140 of the first support frame. The shape of the mounting groove matches the shape of the annular semiconductor laser housing 200 near the inner ring 140 of the first support frame, so that the annular semiconductor laser housing 200 can be stably inserted into the mounting groove, making the connection between the annular semiconductor laser housing 200 and the inner ring 140 of the first support frame more stable. Optionally, as Figure 6A , 6DAs shown, both the first connecting part 1610 and the second connecting part 1620 are designed with a hollow U-shaped structure, which facilitates the user's external observation of the contact between the sintering probe 1650 and the chip to be sintered, thereby allowing for timely adjustment of the pressure between the sintering fixing block 160 and the chip to be sintered 210. Since the sintering probe 1650 and the sintering fixing block 160 are connected by screws, the pressure between the sintering fixing block 160 and the chip to be sintered 210 can be easily adjusted by adjusting the tightness of the screws. Simultaneously, during the sintering and welding process between the chip to be sintered 210 and the annular semiconductor laser housing 200, as the solder melts, the pressure on the sintering fixing block 160 is gradually released, thereby improving the positioning and welding effect.

[0085] like Figure 6A As shown, a first mounting hole 1660 is formed on the first mounting portion 1630, and one sintering probe 1650 is installed in the first mounting hole 1660. A second mounting hole 1670 is formed on the second mounting portion 1640, and two sintering probes 1650 are installed in the second mounting hole 1670. The first sintering probe 1650 and the second sintering probe 1650 are arranged along a first direction (X direction), and the first sintering probe is located between the two second sintering probes along a second direction (Y direction). The first direction is set to be parallel to the axial direction of the annular semiconductor laser housing 200, and the second direction is set to be the circumferential direction of the annular semiconductor laser housing 200.

[0086] like Figure 6A , 6B As shown, optionally, the second mounting portion 1640 has a fixed tilt angle on both sides of the second direction toward the chip 210 to be sintered, so that the pins of the two sintering probes 1650 on the second mounting portion 1640 tilt and approach each other, so that the sintering probes 1650 further adapt to the shape of the annular semiconductor laser housing 200 to be sintered, so that the chip 210 to be sintered fits more tightly to the annular semiconductor laser housing 200 to be sintered.

[0087] like Figure 7A , 7BAs shown in the embodiment of this application, the annular semiconductor laser housing 200 to be sintered has a tower-shaped double-layer chip structure. The upper layer of the tower has 8 chips, and the lower layer has 16 chips. The number of chips in the lower layer is twice that in the upper layer. Therefore, the corresponding sintering fixing block 160 has a triangular structure. The first sintering probe 1650 corresponds to the chip in the upper layer of the tower, and the second sintering probe 1650 corresponds to the chip in the lower layer of the tower. The number of chips in the upper and lower layers of the annular semiconductor laser housing 200 to be sintered can be adjusted as needed. For example, the number of chips in the upper layer of the tower can be 6, and the corresponding number of chips in the lower layer of the tower can be 12, etc. In order to adapt to the number of chips in the upper and lower layers of the annular semiconductor laser housing 200 to be sintered, the number of sintering fixing blocks on the annular semiconductor laser housing sintering fixing device should also be adjusted accordingly. The number of sintering fixing blocks 160 can be 6 to 10. Figure 7C for Figure 7B A magnified view of a portion of region A, as shown below. Figure 7C As shown, no chip 210 to be sintered is placed in region B, while chip 210 is placed in region C. A positioning step 220 is also provided on the annular semiconductor laser housing 200 to be sintered, used to precisely define the position of the chip 210. Regions B and C can be further optimized. Figure 7D The structure shown is as follows: Figure 7D As shown, a guide groove 230 is provided on the positioning step 220 between adjacent chips 210 to be sintered to prevent solder from overflowing and accumulating due to gravity during the sintering process of the chips 210 to be sintered.

[0088] like Figure 8A As shown, the first mounting part 1630 has one first mounting hole 1660, and the second mounting part 1640 has two second mounting holes 1670. Both the first mounting hole 1660 and the second mounting hole 1670 are used to mount the sintering probe 1650. Since the first mounting part 1630 only has one mounting hole, while the second mounting part 1640 requires two mounting holes, the mounting space of the first mounting part 1630 is relatively ample, and the area of ​​the first mounting hole 1660 can be larger than the area of ​​the second mounting hole 1670. Figure 8A As shown, the dimension of the first mounting hole 1660 in the second direction is larger than that of the second mounting hole 1670 in the second direction. This is because, in the second direction, the four corner positioning holes 1680 of the first mounting hole 1660 are located on the outer side of the main body, while the four corner positioning holes of the second mounting hole 1670 are located on the inner side of the main body. Considering the current mounting hole machining technology, a single-pass precision machining is adopted, such as... Figure 8B , 8C As shown, Figure 8B The tool path of the first mounting hole 1660 is relatively... Figure 8CThe tool path of the second mounting hole 1670 is shorter. Specifically, in this embodiment, the tool path of the first mounting hole 1660 is 17.4 mm, and the tool path of the second mounting hole 1670 is 19.5 mm. Therefore, the first mounting hole 1660 has a shorter processing time and higher efficiency, but occupies a larger area; while the second mounting hole 1670 has a longer processing time and lower efficiency, but occupies a smaller area. The smaller second mounting hole 1670 can be processed in a way that allows for... Figure 8A The second mounting hole 1670 shown has a larger area reserved on both sides along the second direction to improve the mechanical strength of the second mounting part 1640.

[0089] This embodiment solves the technical problems of high sintering difficulty, complex operation, and easy displacement of the sintering position in a ring-shaped semiconductor COS laser housing by designing a fixing device that facilitates sintering the chip to be sintered to the housing. It achieves the technical effect of allowing users to easily adjust the structure of the chip to be sintered from 360 degrees, easily adjust the pressure between the sintering fixing block and the chip to be sintered, and gradually release the pressure of the sintering fixing block on the chip to be sintered as the solder melts.

[0090] Example 2

[0091] The difference between this embodiment and the annular semiconductor laser housing sintering and fixing device in Embodiment 1 lies in the improved structure of the sintering fixing block 160. Correspondingly, the structures of the inner ring 140 of the first support frame and the inner ring 150 of the second support frame have been adapted accordingly. For example... Figure 9A , 9B As shown, the sintered fixing block 160 includes a first connecting part 1610, a second connecting part 1620, a first mounting part 1630 and a second mounting part 1640. The above parts are divided according to their functions. When manufacturing the sintered fixing block 160, each part can be formed separately and then spliced ​​into a complete sintered fixing block, or it can be formed as a whole.

[0092] The second mounting part 1640 of the sintered fixing block 160 adopts a hinge structure, such as Figure 9B As shown, the hinge structure includes: a rotating shaft 1641, a first hinge portion 1642, and a second hinge portion 1643. The rotating shaft 1641 has an internal elastic structure, such as a torsion spring, which allows the first hinge portion 1642 and the second hinge portion 1643 to naturally approach the chip 210 to be sintered without external force. Under external force, the angle between the first hinge portion 1642 and the second hinge portion 1643 can be adjusted appropriately. Two sintering probes 1650 are respectively mounted on the first hinge portion 1642 and the second hinge portion 1643 of the second mounting portion 1640. Therefore, the sintering probes 1650 on the second mounting portion 1640 can automatically adjust their angle according to the position of the annular semiconductor laser housing 200 to be sintered. Figure 9A, 9B As shown, the first mounting part 1630 and the second mounting part 1640 form a T-shaped structure. The length of the first mounting part 1630 along the second direction is shorter than the length of the second mounting part 1640 along the second direction. An observation gap is formed between the first mounting part 1630 and the second mounting part 1640, which is beneficial for the user to observe the contact between the sintering probe 1650 and the chip 210 to be sintered from the outside, so as to adjust the pressure between the sintering fixing block 160 and the chip 210 to be sintered in a timely manner.

[0093] Figure 9C This is a schematic diagram of the inner ring 140 of the first support frame provided in Embodiment 2 of this application. It should be noted that... Figure 9C Only the structure distinguishing it from the inner ring of the first support frame described in Embodiment 1 is shown; therefore, structures such as the annular protrusion and positioning posts are omitted from the figure. The actual product still contains structures such as the annular protrusion and positioning posts. Figure 9C As shown, the inner ring 140 of the first support frame adopts a circular structure. The outer edge of the circle is used to install multiple detachable first fixing sliders 1403. Each first fixing slider 1403 has two first fixing holes 1404. An appropriate number of first fixing sliders 1403 can be selected according to the structure of the annular semiconductor laser housing 200 to be sintered, and the first fixing sliders 1403 are fixed to the inner ring 140 of the first support frame through the first fixing holes 1404. The first connecting part 1610, the first fixing sliders 1403, and the inner ring 140 of the first support frame are connected and fixed by a fastener, such as a screw, i.e., a screw passes through the first fixing hole 1404, thereby determining the number and position of the first fixing sliders 1403. The first connecting part 1610 and the first fixing sliders 1403 are connected and fixed so that their positions on the inner ring 140 of the first support frame are relatively fixed. Figure 9B As shown, the first connecting part 1610 has a screw hole that matches the second fixing hole 1405 on the first fixing slider 1403. The first connecting part 1610 and the first fixing slider 1403 are fixed and locked together by screws. The structure of the inner ring 150 of the second support frame is similar to that of the inner ring 140 of the first support frame, and will not be described again here.

[0094] like Figure 9B As shown, since the first connecting part 1610 and the second connecting part 1620 are respectively connected to the first fixed slider 1403 and the second fixed slider by one screw, the number of the first fixed slider 1403 is equal to the number of the second fixed slider, and the number of the first fixed slider 1403 and the second fixed slider are both equal to the number of the sintering fixing blocks 160. Depending on the structure of the annular semiconductor laser housing 200 to be sintered, the number of sintering fixing blocks 160 can be 6 to 10, such as... Figure 8A , 8BAs shown, the corresponding number of upper-layer chips in the annular semiconductor laser housing 200 to be sintered is 6 to 10.

[0095] Compared to Embodiment 1, Embodiment 2 adjusts the structure of the sintering fixing block 160, the inner ring 140 of the first support frame, and the inner ring 150 of the second support frame. For example, the second mounting part 1640 is designed as a hinge structure, and a first fixing slider 1403 is set on the inner ring 140 of the first support frame. This solves the technical problem that the existing laser sintering fixing device cannot adapt to changes in the number of chips and can only adapt to specific annular semiconductor laser housings 200 to be sintered. Embodiment 2, by adjusting the number of the first fixing slider 1403 and the second fixing slider, combined with the automatically adjustable angle characteristic of the hinge structure of the second mounting part 1640, achieves the technical effect that the annular semiconductor laser housing sintering fixing device of this embodiment can be adjusted according to the structure of the annular semiconductor laser housing 200 to be sintered.

[0096] Example 3

[0097] Figure 10 This is a flowchart illustrating the method for sintering and fixing a ring-shaped semiconductor laser housing, applied to the ring-shaped semiconductor laser housing sintering and fixing apparatus described in Embodiment 1. Figure 10 As shown, the sintering and fixing method for the annular semiconductor laser housing includes:

[0098] Step S10: Install the annular semiconductor laser housing to be sintered between the inner ring of the first support frame and the inner ring of the second support frame. That is, as shown... Figure 3 As shown, the annular semiconductor laser housing 200 is fixed to the annular semiconductor laser housing sintering and fixing device 100 by the inner ring 140 of the first support frame and the inner ring 150 of the second support frame. The annular semiconductor laser housing 200 can rotate synchronously with the inner ring 140 of the first support frame and the inner ring 150 of the second support frame, thereby achieving the technical effect that the annular semiconductor laser housing 200 can rotate freely relative to the outer ring 120 of the first support frame and the outer ring 130 of the second support frame.

[0099] Step S20: Install multiple sintered fixing blocks between the inner ring of the first support frame and the inner ring of the second support frame. For example... Figure 2 , 6A As shown, the sintering fixing block 160 can be fixed to the inner ring 140 and the inner ring 150 of the first support frame by screws on the first connecting part 1610 and the second connecting part 1620 of the sintering fixing block 160, and the sintering fixing block 160 can rotate synchronously with the inner ring 140 of the first support frame, the inner ring 150 of the second support frame and the annular semiconductor laser housing 200.

[0100] Step S30: Install the sintering probes into the first mounting hole and the second mounting hole, with multiple sintering probes corresponding one-to-one to press multiple chips to be sintered against the annular semiconductor laser housing to be sintered. For example... Figure 6D As shown, by using the screws on the first mounting part 1630 and the second mounting part 1640 of the sintering fixing block 160, the clamping force of the sintering probe 1650 on the sintering fixing block 160 on the chip to be sintered is adjusted so that each sintering probe 1650 tightly presses against the corresponding chip 210 to be sintered.

[0101] Step S40: The annular semiconductor laser housing sintering and fixing device, the chip to be sintered, and the annular semiconductor laser housing to be sintered obtained in step S30 are placed in a reflow oven for sintering. The solder between the chip to be sintered 210 and the annular semiconductor laser housing 200 to be sintered is melted by the high temperature in the reflow oven, thereby stably sintering the chip to be sintered 210 onto the annular semiconductor laser housing 200 to be sintered.

[0102] The ring-shaped semiconductor laser housing sintering and fixing method of this embodiment fully utilizes the design advantages of the ring-shaped semiconductor laser housing sintering and fixing device described in Embodiment 1. Therefore, it has the same technical effect as the ring-shaped semiconductor laser housing sintering and fixing device described in Embodiment 1, namely, it achieves the technical effect of allowing users to easily adjust the structure such as the chip to be sintered from 360 degrees, easily adjust the pressure between the sintering fixing block and the chip to be sintered, and gradually release the pressure of the sintering fixing block on the chip to be sintered as the solder melts.

[0103] Example 4

[0104] Figure 11 This is a flowchart of the ring-shaped semiconductor laser housing sintering and fixing method applied to the ring-shaped semiconductor laser housing sintering and fixing device described in Embodiment 2. Figure 11 As shown, the sintering and fixing method for the annular semiconductor laser housing includes:

[0105] Step S11: Install the ring-shaped semiconductor laser housing to be sintered between the inner ring of the first support frame and the inner ring of the second support frame.

[0106] Step S21: Determine the number of sintering fixing blocks, the first fixing slider, and the second fixing slider corresponding to the annular semiconductor laser housing to be sintered. For example... Figure 7A , 7BAs shown in the figure, the number of chips required for the upper layer of the annular semiconductor laser housing 200 to be sintered is 8, and the number of chips required for the lower layer of the tower is 16. Therefore, the number of sintering fixing blocks, the first fixing slider and the second fixing slider required are both 8. If the number of chips required for the upper layer of the tower is 6 and the number of chips required for the lower layer of the tower is 12, then the number of sintering fixing blocks, the first fixing slider and the second fixing slider required are both 6.

[0107] Step S31: Install the required number of first and second fixed sliders onto the inner rings of the first and second support frames, respectively, and install the required number of sintered fixing blocks between the inner rings of the first and second support frames. Figure 9C As shown, the first fixing slider 1403 is mounted on the inner ring 140 of the first support frame using screws and the first fixing hole 1404, and the second fixing slider is mounted on the inner ring 150 of the second support frame in the same manner. Figure 9A , 9C As shown, the sintering fixing block 160 can be fixed to the second fixing hole 1405 of the first fixing slider 1403 by screws on the first connecting part 1610 of the sintering fixing block 160, and the sintering fixing block 160 can be installed on the inner ring 150 of the second support frame in the same way. Both the first fixing hole 1404 and the second fixing hole 1405 provide a stable connection between the first fixing slider 1403 and the inner ring 140 of the first support frame. The sintering fixing block 160 can rotate synchronously with the inner ring 140 of the first support frame, the inner ring 150 of the second support frame, and the annular semiconductor laser housing 200.

[0108] Step S41: Install the sintering probes into the first and second mounting holes, with each sintering probe corresponding to the others to press the chips against the annular semiconductor laser housing to be sintered. Figure 9A As shown, by using the screws on the first mounting part 1630 and the second mounting part 1640 of the sintering fixing block 160, the clamping force of the sintering probe 1650 on the sintering fixing block 160 on the chip to be sintered is adjusted so that each sintering probe 1650 tightly presses against the corresponding chip 210 to be sintered.

[0109] Step S51: Place the annular semiconductor laser housing sintering fixing device, the chip to be sintered, and the annular semiconductor laser housing to be sintered obtained in step S41 into a reflow oven for sintering.

[0110] The ring-shaped semiconductor laser housing sintering and fixing method of this embodiment fully utilizes the design advantages of the ring-shaped semiconductor laser housing sintering and fixing device described in Embodiment 2. Therefore, it has the same technical effect as the ring-shaped semiconductor laser housing sintering and fixing device described in Embodiment 2, that is, it achieves the technical effect that the ring-shaped semiconductor laser housing sintering and fixing device of this embodiment can be adjusted according to the structure of the ring-shaped semiconductor laser housing 200 to be sintered.

[0111] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A sintering and fixing device (100) for a ring-shaped semiconductor laser housing, characterized in that, include: A base (110), with support frames connected to both ends of the base; Support frames, which are respectively connected to both ends of the base (110); A plurality of rotatable sintering fixing blocks (160) are connected between two of the support frames, and the plurality of sintering fixing blocks (160) form a hollow area to accommodate the annular semiconductor laser housing (200) to be sintered. The sintered fixing block (160) has at least one first mounting hole (1660) and at least two second mounting holes (1670) arranged at intervals along a second direction, wherein the first mounting hole (1660) and the second mounting hole (1670) are arranged along a first direction; The first mounting hole (1660) is larger in the second direction than the second mounting hole (1670) in the second direction. The first mounting hole (1660) and the second mounting hole (1670) are used to mount sintering probes (1650), and each sintering probe (1650) corresponds to one chip (210) of the annular semiconductor laser housing (200) to be sintered.

2. The annular semiconductor laser housing sintering and fixing device according to claim 1, characterized in that, The first direction is set to be parallel to the axial direction of the annular semiconductor laser housing (200), and the second direction is set to be the circumferential direction of the annular semiconductor laser housing (200).

3. The annular semiconductor laser housing sintering and fixing device according to claim 1, characterized in that, The tool path of the first mounting hole (1660) is shorter than that of the second mounting hole (1670); and / or, The area of ​​the first mounting hole (1660) is larger than the area of ​​the second mounting hole (1670).

4. The annular semiconductor laser housing sintering and fixing device according to claim 1, characterized in that, The support frame includes: The first support frame outer ring (120) is connected to the first end of the base (110); The second support frame outer ring (130) is connected to the second end of the base (110); The first support frame inner ring (140) is engaged with the first support frame outer ring (120), and the first support frame inner ring (140) is rotatable relative to the first support frame outer ring (120); The second support frame inner ring (150) is engaged with the second support frame outer ring (130), and the second support frame inner ring (150) is rotatable relative to the second support frame outer ring (130).

5. The annular semiconductor laser housing sintering and fixing device according to claim 4, characterized in that, The sintered fixing block (160) includes: The first connecting part (1610) is connected to the inner ring (140) of the first support frame. The second connecting part (1620) is connected to the inner ring (150) of the second support frame; The first mounting portion (1630) has the first mounting hole (1660) formed thereon. The second mounting part (1640) has the second mounting hole (1670) formed on it.

6. The annular semiconductor laser housing sintering and fixing device according to claim 5, characterized in that, The second mounting portion (1640) has a fixed tilt angle on both sides of the second direction toward the chip to be sintered (210); and / or, both the first connecting portion (1610) and the second connecting portion (1620) have a hollow structure.

7. The annular semiconductor laser housing sintering and fixing device according to claim 5, characterized in that, The second mounting part (1640) includes a rotating shaft (1641), a first hinge part (1642), and a second hinge part (1643). The rotating shaft (1641) is provided with a spring so that the first hinge part (1642) and the second hinge part (1643) have a self-restoring force on both sides of the second direction toward the chip (210) to be sintered. The sintering probe (1650) on the second mounting part (1640) automatically adjusts its angle according to the position of the annular semiconductor laser housing (200) to be sintered.

8. The annular semiconductor laser housing sintering and fixing device according to claim 5, characterized in that, The first mounting part (1630) and the second mounting part (1640) form a T-shaped structure, and the length of the first mounting part (1630) along the second direction is shorter than the length of the second mounting part (1640) along the second direction.

9. The annular semiconductor laser housing sintering and fixing device according to claim 7, characterized in that, Multiple detachable first fixing sliders (1403) are provided along the circumferential direction at the edge of the inner ring (140) of the first support frame. The first connecting part (1610), the first fixing sliders (1403) and the inner ring (140) of the first support frame are connected and fixed by fasteners. Multiple detachable second fixing sliders are provided along the circumferential direction at the edge of the inner ring (150) of the second support frame. The second connecting part (1620), the second fixing sliders and the inner ring (150) of the second support frame are connected and fixed by fasteners.

10. A method for sintering and fixing an annular semiconductor laser housing using the annular semiconductor laser housing sintering and fixing apparatus according to any one of claims 1-6, characterized in that, The method includes: Step S10: Install the ring-shaped semiconductor laser housing to be sintered between two support frames; Step S20: Install multiple sintered fixing blocks between two support frames; Step S30: Install the sintering probes in the first mounting hole and the second mounting hole, and the multiple sintering probes press the multiple chips to be sintered against the ring-shaped semiconductor laser housing to be sintered in a one-to-one correspondence. Step S40: Place the annular semiconductor laser housing sintering fixing device, the chip to be sintered, and the annular semiconductor laser housing to be sintered obtained in step S30 into a reflow oven for sintering.

11. A method for sintering and fixing an annular semiconductor laser housing using the annular semiconductor laser housing sintering and fixing apparatus according to any one of claims 7-9, characterized in that, The method includes: Step S11: Install the ring-shaped semiconductor laser housing to be sintered between two support frames; Step S21: Determine the number of sintering fixing blocks, the first fixing slider, and the second fixing slider corresponding to the annular semiconductor laser housing to be sintered; Step S31: Install the required number of first fixed sliders and second fixed sliders on the inner ring of the first support frame and the inner ring of the second support frame respectively, and install the required number of sintered fixing blocks between the inner ring of the first support frame and the inner ring of the second support frame. Step S41: Install the sintering probes in the first mounting hole and the second mounting hole, and the multiple sintering probes press the multiple chips against the ring-shaped semiconductor laser housing to be sintered in a one-to-one correspondence. Step S51: Place the annular semiconductor laser housing sintering fixing device, the chip to be sintered, and the annular semiconductor laser housing to be sintered obtained in step S41 into a reflow oven for sintering.

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