Ultrasonic scanning clamp for packaged chip

Abstract

The invention relates to the technical field of electronic packaging, and discloses a packaged chip ultrasonic scanning clamp which comprises a substrate, and a scanning area made of a transparent material and an installation area which is arranged on the periphery of the edge of the scanning area in a surrounding mode and used for ultrasonic equipment to make contact with and position the scanning area are formed on the substrate. The scanning area is provided with a plurality of positioning areas used for positioning different packaging chips. According to the invention, the installation and use are convenient by arranging the installation area, the scanning area is matched, and a plurality of positioning areas are arranged to realize the positioning of various packaging chips of different types and specifications, so that the simultaneous detection of various packaging chips can be realized while direct observation is facilitated, the detection efficiency is effectively improved, additional pasting is not needed, and the detection cost is reduced. The packaging chip is not damaged, and the detection efficiency is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic packaging, and in particular to an ultrasonic scanning fixture for packaging chips. Background Art

[0002] With the increasing use of electronic components in the aerospace industry, their reliability is fundamental to the reliability of all aerospace projects. Due to the non-repairability of aerospace products, the failure of a single electronic component can lead to the failure of the entire aerospace product. Therefore, component reliability is a key factor in the success or failure of aerospace products. Therefore, improving component reliability is imperative.

[0003] Chip packaging is a crucial step in the integrated circuit manufacturing process, encapsulating tiny and fragile chip components in a protective housing to ensure their stability and durability. However, packaged chips are prone to delamination issues between the encapsulation resin and the interfaces between different parts of the device. Therefore, a rigorous quality verification process is required to ensure the quality and performance of the packaged chips. Various structural and functional tests are essential steps. Among them, scanning acoustic testing (SAT), as a non-invasive detection method, has unique advantages in detecting possible delamination issues within the packaged chip. It is one of the key links in this process.

[0004] Faced with increasingly stringent reliability demands, full inspection of packaged chips has become crucial, as it effectively identifies all possible delamination issues, ensuring they are fully resolved. However, the full inspection process faces challenges such as high labor costs, complex operations, and irregular bonding positions, making existing chip mounting methods inefficient. Summary of the Invention

[0005] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is to provide a packaged chip ultrasonic scanning fixture to solve the problem of low efficiency in the ultrasonic inspection process of the existing packaged chips.

[0006] In order to solve the above technical problems, a technical solution adopted by the present invention is: to provide a packaged chip ultrasonic scanning fixture including a substrate, on which is formed a scanning area made of a transparent material and an installation area surrounded by the edge of the scanning area for ultrasonic equipment to contact and position it; the scanning area is provided with multiple positioning areas for positioning different packaged chips.

[0007] Furthermore, at least one of the positioning areas is provided with a plurality of convex portions distributed in an array, and a first mounting space for the packaged chip to be mounted therein is spaced apart between the convex portions.

[0008] Furthermore, the depth of the first card installation space is the thickness of the packaged chip. to

[0009] Furthermore, at least one of the positioning areas is provided with a plurality of recesses distributed in an array, and a second mounting space for the packaged chip to be mounted therein is formed in the recesses.

[0010] Furthermore, the depth of the second card space is the thickness of the packaged chip. to

[0011] Furthermore, the installation area is made of elastic high molecular polymer material.

[0012] Furthermore, scales adapted to the ultrasonic equipment are evenly arranged around the edge of the scanning area, and the positioning area is located inside the scales.

[0013] Furthermore, the substrate has an upward operating surface, and the scanning area and the installation area are both formed on the operating surface; a plurality of installation grooves are provided on the scanning area, and a positioning plate is placed in each installation groove, and the positioning plate is configured as the positioning area, and each of the positioning areas is provided with a plurality of first positioning grooves distributed in an array.

[0014] Furthermore, at least one first positioning groove on the positioning area passes through the positioning plate in the thickness direction, and a second positioning groove adapted to the first positioning groove is opened on the bottom wall of the mounting groove at a position corresponding to each first positioning groove. After the positioning plate is installed in the mounting groove, the first positioning groove and the second positioning groove can be distributed in an overlapping manner for the packaged chip to be installed therein, and the sum of the depths of the first positioning groove and the second positioning groove after overlapping is less than the thickness of the packaged chip.

[0015] Furthermore, the positioning plate has a first side edge and a second side edge relatively distributed on both sides, and the bottom sides of the first side edge and the second side edge are convexly provided with a step portion with a top recessed relative to the top of the positioning plate; on the groove walls on both sides of the mounting groove corresponding to the first side edge and the second side edge, there are recessed grooves for the step portion to be snapped into so as to limit the movement of the positioning plate in the thickness direction; the positioning plate has a first state, a second state and a third state relative to the mounting groove in sequence; when in the first state, the step portion where the first side edge is located is snapped into the slot, and the edge of the second positioning groove overlaps the first positioning groove; when in the second state, the step portions are all outside the slot, and the second positioning groove is Overlapping the first positioning groove; when in the third state, the step portion where the second side is located is inserted into the slot, and the second positioning groove completely overlaps the first positioning groove.

[0016] The ultrasonic scanning fixture for packaged chips of the present invention has at least the following beneficial effects: the present invention facilitates installation and use by setting an installation area, cooperates with a scanning area, and sets multiple positioning areas to realize the positioning of packaged chips of various types and specifications. It can realize simultaneous detection of multiple packaged chips while facilitating direct observation, effectively improving detection efficiency, eliminating the need for additional pasting, and causing no damage to the packaged chips, thereby effectively improving detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0018] Figure 1 This is a schematic structural diagram of embodiment 1 of the present invention;

[0019] Figure 2 A side sectional view of the first embodiment of the present invention;

[0020] Figure 3 This is a structural diagram of embodiment 2 of the present invention;

[0021] Figure 4 A partial side sectional view of the first state of the second embodiment of the present invention;

[0022] Figure 5 A partial side sectional view of the second state of the second embodiment of the present invention;

[0023] Figure 6 A partial cross-sectional view of the third state of the second embodiment of the present invention;

[0024] Figure 7 This is a structural diagram of a positioning plate according to the second embodiment of the present invention.

[0025] The meanings of the reference numerals in the accompanying drawings are:

[0026] Inner plate 1, outer plate 2, scanning area 3, positioning area 31, convex portion 32, first card-mounting space 33, concave portion 34, second card-mounting space 35, mounting groove 36, card groove 37, second positioning groove 38, mounting area 4, scale 5, positioning plate 6, first side edge 61, second side edge 62, first positioning groove 63, step portion 64, and notch 65. DETAILED DESCRIPTION

[0027] The present invention will be further described below with reference to the accompanying drawings.

[0028] See also Figures 1 to 7The packaged chip ultrasonic scanning fixture of the present invention includes a substrate, wherein the substrate includes an inner plate 1 made of acrylic and an outer plate 2 arranged around the outer periphery of the inner plate 1 and made of an elastic polymer material. The acrylic inner plate 1 has a high transparency, which facilitates observation, reduces refraction and interference with ultrasonic waves, and enables visual detection throughout the experiment at a low cost. The inner plate 1 has a rectangular structure, which is easy to place and process. The outer plate 2 can be made of rubber or silicone and has a rectangular frame structure that can be just fitted onto the outer side of the inner plate 1. The outer plate 2 can be tightened to the inner plate 1 through its elastic properties, or it can be adhered to the inner plate 1 using glue. The use of elastic polymers such as rubber or silicone can buffer the direct contact pressure between the sensor and the fixture, ensuring safe contact between the fixture and the sensor. The length, width, and height of the inner plate 1 are 30 cm, 20 cm, and 5 cm, respectively, while the width of each side of the outer plate 2 is the same and can be 2 cm.

[0029] In this embodiment, one side of the substrate along its thickness or height, i.e., its top side, is configured as an operating surface. The corresponding operating surface portion of the inner panel 1 is configured as a scanning area 3, and the corresponding operating surface portion of the outer panel 2 is configured as a mounting area 4. The mounting area 4 surrounds the edge of the scanning area 3. The scanning area 3 is used to locate the packaged chip and, in conjunction with ultrasonic equipment, inspect the packaged chip in the scanning area 3. The transparent scanning area 3 ensures the accuracy of the inspection results and facilitates observation of the packaged chip's proper positioning. The mounting area 4 allows for contact positioning by the ultrasonic equipment. Alternatively, the entire substrate can be placed directly in a container containing an ionic liquid. The outer panel 2, through its material characteristics, increases friction between the container and the ultrasonic probe, ensuring that even after entering the ionic liquid, movement of the probe does not cause movement of the substrate. Alternatively, a shallow groove, much deeper than the substrate, can be provided in the container, and the entire substrate can be mounted within the shallow groove. The material of the outer panel 2 can also improve the stability between the shallow groove and the substrate.

[0030] Scales 5 adapted to the ultrasonic device are evenly arranged around the edge of the scanning area 3. The scales 5 are consistent with the scanning system of the ultrasonic device. When the ultrasonic device is used, the scanning system can quickly set the coordinates of the ultrasonic probe according to the scales 5, thereby quickly locating the position of the packaged chip to improve the scanning efficiency.

[0031] In the first embodiment of the present invention, multiple positioning areas 31 for locating different packaged chips are provided on the scanning area 3. Each positioning area 31 is used to locate a different packaged chip. This allows multiple packaged chips to be installed simultaneously on the scanning area 3, thereby completing the inspection of multiple packaged chips during a single round of ultrasonic inspection. This avoids the need for a separate assembly for each packaged chip inspection, reduces fixture preparation and fabrication, and thus reduces costs, while improving inspection and assembly efficiency. The positioning areas 31 are distributed in a rectangular array on the scanning area 3 and are located inside the scale 5.

[0032] At least one positioning area 31 is provided with a plurality of protrusions 32 distributed in an array, and a first card-mounting space 33 for the packaged chip to be inserted is separated between each protrusion 32. The depth of the first card-mounting space 33 is equal to the thickness of the packaged chip. to This ensures that the packaged chip can be inserted into the first card-mounting space 33 for positioning, while also ensuring that a portion of the packaged chip is directly exposed and unobstructed, thereby ensuring detection accuracy. While a portion of the packaged chip is exposed, it is also convenient to check whether the bottom of the packaged chip is properly installed during installation. The exposed portion is easy to pick up for adjustment and placement. The first card-mounting space 33 is suitable for packaged chips with shorter shapes, such as square and multi-shaped ones.

[0033] At least one positioning area 31 is provided with a plurality of recesses 34 distributed in an array, and a second card-mounting space 35 for the packaged chip to be inserted into the recess 34 is formed in the recess 34. The depth of the second card-mounting space 35 is equal to the thickness of the packaged chip. to This also facilitates the positioning and installation of packaged chips.

[0034] In one implementation of this embodiment, four positioning areas 31 are provided and arranged in a rectangular array, arranged in two rows and two columns. Each positioning area 31 is provided with a plurality of protrusions 32 arranged in a rectangular array, and three positioning areas 31 are provided with a plurality of recesses 34 arranged in a rectangular array. Both the protrusions 32 and recesses 34 are arranged in at least two rows and at least two columns, respectively, to accommodate a greater number of packaged chips. It should be noted that the number of positioning areas 31 can be increased or decreased, and is not limited to this embodiment.

[0035] In this embodiment, the protrusion 32 includes a plurality of columns each having a rectangular parallelepiped structure and spaced apart from each other. The height of the columns is equal to the height of the packaged chip to be tested. The width is 1mm, and the length is the same as the length of the packaged chip being tested. The length of the pillars is arranged along the row direction. The first mounting space 33 is formed between two adjacent rows of pillars. The spacing between the two pillars along the column direction can be set to 1cm. The specific spacing is set according to the width of the packaged chip to be positioned. Each first mounting space 33 is connected along the row direction. Therefore, a first mounting space 33 can be formed between one pillar between two rows of pillars, forming multiple first mounting spaces 33 in total. Alternatively, a first mounting space 33 can be formed between multiple pillars in two rows. The specific arrangement depends on the structure of the packaged chip. Therefore, the first mounting space 33 is suitable for positioning not only shorter packaged chips, but also longer packaged chips.

[0036] In this embodiment, the recesses 34 on one of the positioning areas 31 are set to be rectangular, the recesses 34 on one of the positioning areas 31 are set to be square, and the recesses 34 on the remaining positioning area 31 are set to be a hexagonal structure. Among them, the positioning areas 31 with square and hexagonal recesses 34 can be set to at least two columns and at least two rows, specifically, can be set to three rows and six columns. The positioning areas 31 with rectangular recesses 34 can be set to two rows, wherein the length of one row of recesses 34 is arranged along the column direction and is set to six, and the length of the other row of recesses 34 is arranged along the row direction and is set to three. Among them, each recess 34 is formed into a groove body by being recessed on the operating surface, and the depth of each recess 34 can be 1 / 4 of the height of the packaged chip to be measured. Thus, the recess 34 can be used to position three types of packaged chips. Among them, the rectangular recess 34 can be used to place rectangular packaged chips, such as dual in-line packages (DIPs). The length and width of the rectangular recess 34 are the same as the length and width of the packaged chip, and the depth is 1 / 2 the height of the packaged chip. The spacing between the recesses 34 can be set to 1 cm. The square recesses 34 can be used to place square packaged chips such as ball grid array (BGA). The side length of the square recess 34 is the same as the side length of the packaged chip. Its depth can be 1 mm, and the spacing between the recesses 34 is 1 cm. The hexagonal recesses 34 can be used to place irregular packaged chips such as quad flat packages (QFP). Its side length is equal to the main body side length of the packaged chip, so that the external pins of the packaged chip can be placed in the recesses 34. The spacing between the recesses 34 is 1 cm. It should be noted that the shape and structure of the recesses 34 are not limited to the structure in this embodiment. According to the structure of the packaged chip, it can also be set to other shapes such as triangle, circle, diamond, etc., and the spacing between the recesses 34 is also adjusted according to the actual packaged chip size and is not limited to the above examples.

[0037] In the second embodiment of the present invention, a plurality of mounting grooves 36 are provided on the scanning area 3. Also, taking the four positioning areas 31 as an example, the structures of the protrusions 32 and recesses 34 are the same as those in the first embodiment. Therefore, four mounting grooves 36 are provided. A positioning plate 6 is placed in each mounting groove 36. The positioning plate 6 is configured as the positioning area 31. Each positioning area 31 is provided with a plurality of first positioning grooves 63 distributed in an array. The first positioning grooves 63 correspond to the protrusions 32 and recesses 34 in the first embodiment, respectively. Therefore, the shape and arrangement of the first positioning grooves 63 are consistent with those in the first embodiment. There is only a difference in quantity, which will not be described in detail here. Among them, the recess 34 on the positioning plate 6 with the recess 34 passes through the positioning plate 6 in the thickness direction. Therefore, the first positioning groove 63 on at least one positioning area 31 passes through the positioning plate 6 in the thickness direction. The first positioning grooves 63 on the positioning region 31 with protrusions 32 do not need to extend through the thickness. Instead, the first positioning grooves 63 on the positioning region 31 with protrusions 32 are located between any two rows of protrusions 32, thereby positioning the packaged chip. Second positioning grooves 38 are provided on the bottom wall of the mounting groove 36 at locations corresponding to the first positioning grooves 63. The shape of the second positioning grooves 38 is the same as that of the recesses 34, and the first positioning grooves 63 are also consistent with the recesses 34. Therefore, the second positioning grooves 38 corresponding to the square first positioning grooves 63 are also square, and the second positioning grooves 38 corresponding to the rectangular first positioning grooves 63 are also square, and so on. After the positioning plate 6 is installed in the mounting groove 36, the first positioning grooves 63 and the second positioning grooves 38 can overlap to accommodate the packaged chip. This allows the overall depth to be increased and adjusted to accommodate packaged chips of the same shape but different thicknesses, or even packaged chips of the same shape and thickness, thereby varying the positioning effect of the packaged chip by adjusting the depth. The sum of the depths of the overlapping first positioning groove 63 and second positioning groove 38 is less than the thickness of the packaged chip. The groove-shaped structure for mounting the packaged chip is configured as a groove body. When the positioning plate 6 is in the first and second positions, the groove body is the first positioning groove 63. When the positioning plate 6 is in the third position, the groove body is the overlapping first positioning groove 63 and second positioning groove 38.

[0038] To facilitate adjustment of the overall thickness of the slot body and to facilitate installation, replacement, and disassembly of the positioning plate 6, the positioning plate 6 has a first side 61 and a second side 62 that are relatively distributed on both sides. The bottom sides of the first side 61 and the second side 62 are both provided with a stepped portion 64 with a top that is recessed relative to the top of the positioning plate 6. A retaining groove 37 is provided on both side walls of the mounting slot 36 corresponding to the first side 61 and the second side 62, into which the stepped portion 64 is inserted to restrict movement of the positioning plate 6 in the thickness direction. The retaining groove 37 is a strip-shaped structure. The first side 61 and the second side 62 can be distributed along the row direction. The retaining groove 37 is formed on the two side walls of the mounting slot 36 along the row direction, and the lengths of the two retaining grooves 37 are distributed along the column direction. If the first side 61 and the second side 62 are distributed along the column direction, the two retaining grooves 37 are formed on the two side walls of the mounting slot 36 along the column direction, and the lengths of the two retaining grooves 37 are distributed along the row direction. The depth of the slot 37 matches the depth of the step 64, allowing the step 64 to be inserted therein. When the step 64 is inserted into the slot 37, the side of the step 64 engages with the side of the mounting slot 36 where the slot 37 is located. The thickness of the positioning plate 6 is the same as the depth of the mounting slot 36. In this embodiment, the distance between the two steps 64 on the first side 61 and the second side 62 is smaller than the distance between the two groove walls of the mounting slot 36 where the slot 37 is located (excluding the depth of the slot 37). The positioning plate 6 sequentially has a first state, a second state, and a third state relative to the mounting slot 36. When the positioning plate 6 is in the first state, the step portion 64 of the first side 61 is inserted into one of the slots 37 of the mounting groove 36. At this time, the step portion 64 of the second side 62 is located outside the other slot 37. The edge of the second positioning groove 38 overlaps with the first positioning groove 63 and most of it is blocked by the positioning plate 6. At this time, the packaged chip is installed in the first positioning groove 63, and the bottom wall of the mounting groove 36 supports the packaged chip. When the positioning plate 6 is in the second state, the step portions 64 on both sides are outside the slot 37, and the edge of the second positioning groove 38 overlaps with the first positioning groove 63. Overlapping with the first positioning. At this time, the positioning plate 6 can be easily disassembled and assembled. In order to facilitate pushing the positioning plate 6, each side has two step portions 64 and is respectively arranged at both ends of the side where it is located. A notch 65 is recessed between the two step portions 64 on each side to facilitate pushing the positioning plate 6 to move through the notch 65. When the positioning plate 6 is in the third state, the step portion 64 where the second side 62 is located is snapped into the corresponding card slot 37, and the second positioning slot 38 completely overlaps with the first positioning slot 63. At this time, the completely overlapping first positioning slot 63 and second positioning slot 38 increase the overall depth for installing the packaged chip, but by pushing the positioning plate 6, the first positioning slot 63 and the second positioning slot 38 can be staggered to reduce the depth.

[0039] One embodiment of the ultrasonic scanning fixture for packaged chips of the present invention works as follows: when in use, multiple types of packaged chips are placed in the recesses 34 and / or protrusions 32 on the corresponding positioning areas 31, so that part of the packaged chip is stuck therein and the other part protrudes upward to the scanning area 3. Then, the entire substrate is placed in a container equipped with ionic liquid. After the ultrasonic probe locates the coordinates through the scale 5, ultrasonic scanning is performed on the packaged chips on the scanning area 3 in turn. During the movement of the ultrasonic probe, the movement of the ultrasonic probe drives the ionic liquid to flow slightly, but the positioning of the protrusions 32 and recesses 34 prevents the packaged chips from moving and being blocked. While achieving the positioning of the packaged chips, the structure is also simple and the manufacturing cost is low.

Claims

1. A chip package ultrasonic scanning fixture, characterized by: It includes a substrate, on which is formed a scanning area made of transparent material and a mounting area arranged around the edge of the scanning area for ultrasonic equipment to contact and position it; the scanning area is provided with multiple positioning areas for positioning different packaged chips.

2. The ultrasonic scanning fixture for packaged chips according to claim 1, wherein: At least one of the positioning areas is provided with a plurality of convex portions distributed in an array, and a first card-mounting space for the packaged chip to be carded in is spaced between the convex portions.

3. The ultrasonic scanning fixture for packaged chips according to claim 2, wherein: The depth of the first card space is the thickness of the packaged chip. to 4. The ultrasonic scanning fixture for packaged chips according to claim 1, wherein: At least one of the positioning areas is provided with a plurality of recesses distributed in an array, and a second mounting space for the packaged chip to be mounted therein is formed in the recesses.

5. The ultrasonic scanning fixture for packaged chips according to claim 4, wherein: The depth of the second card space is the thickness of the packaged chip. to 6. The ultrasonic scanning fixture for packaged chips according to claim 1, wherein: The installation area is made of elastic high molecular polymer material.

7. The ultrasonic scanning fixture for packaged chips according to claim 1, wherein: Scales adapted to the ultrasonic equipment are evenly arranged around the edge of the scanning area, and the positioning area is located inside the scales.

8. The ultrasonic scanning fixture for packaged chips according to claim 1, wherein: The substrate has an upward operating surface, and the scanning area and the installation area are both formed on the operating surface; a plurality of installation grooves are provided on the scanning area, and a positioning plate is placed in each installation groove, and the positioning plate is configured as the positioning area, and each of the positioning areas has a plurality of first positioning grooves distributed in an array.

9. The ultrasonic scanning fixture for packaged chips according to claim 8, wherein: The first positioning groove on at least one of the positioning areas passes through the positioning plate in the thickness direction, and a second positioning groove adapted thereto is provided on the bottom wall of the mounting groove at a position corresponding to each first positioning groove. After the positioning plate is installed in the mounting groove, the first positioning groove and the second positioning groove can be distributed in an overlapping manner for the packaged chip to be installed therein, and the sum of the depths of the first positioning groove and the second positioning groove after overlapping is less than the thickness of the packaged chip.

10. The ultrasonic scanning fixture for packaged chips according to claim 9, wherein: The positioning plate has a first side and a second side that are relatively distributed on both sides, and the bottom sides of the first side and the second side are both convexly provided with a step portion with a top that is concave relative to the top of the positioning plate; the groove walls on both sides of the mounting groove corresponding to the first side and the second side are both concavely provided with a clamping groove for the step portion to be clamped therein to limit the movement of the positioning plate along the thickness direction; the positioning plate has a first state, a second state and a third state relative to the mounting groove in sequence; when in the first state, the step portion where the first side is located is clamped in the clamping groove, and the edge of the second positioning groove overlaps the first positioning groove; when in the second state, the step portions are all outside the clamping groove, and the second positioning groove is Overlapping the first positioning groove; when in the third state, the step portion where the second side is located is inserted into the slot, and the second positioning groove completely overlaps the first positioning groove.

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