Double-carrier-plate test platform

Abstract

The invention aims to provide a double-carrier-plate test platform. The device comprises a rack, a carrier plate module is arranged on the rack in a sliding mode, a needle plate module is arranged below the carrier plate module, a pressing module is arranged above the carrier plate module and comprises a pressing plate, driving assemblies are arranged on the two sides of the pressing plate, each driving assembly comprises a first driving air cylinder and a mounting plate, and the first driving air cylinders are arranged on the first driving air cylinders. The mounting plate is provided with a transverse guide rail and a vertical guide rail, a transmission plate is arranged at the action end of the first driving air cylinder, the transmission plate is in sliding fit with the transverse guide rail, an inclined groove is formed in the transmission plate, a guide wheel is connected to the side portion of the pressing plate, and the guide wheel is in guiding fit with the inclined groove. And the guide wheels are in sliding fit with the vertical guide rails. The method is applied to the technical field of mainboard testing.

Description

Technical Field

[0001] The present invention is applied to the technical field of motherboard testing, and particularly relates to a dual-carrier board testing platform. Background Art

[0002] Currently, electronic motherboard testing requirements and precision are becoming increasingly stringent, and with the need to reduce testing time and costs, there's a need to meet these requirements in the simplest way possible. During the testing process, two motherboards require simultaneous probing. This involves product layout issues, which can affect signal accuracy and test values. Current two-motherboard testing requires even higher requirements for simultaneous probing. Because the test requires signal switching, while minimizing signal attenuation and minimizing the impact of increased switching impedance on the test, traditional layouts, constrained by space constraints, use one motherboard as a fixed golden board and the other as a test board. However, this approach fails to meet the new requirements for simultaneous probing. For example, Chinese patent application number CN211669319U discloses a motherboard testing device. A driver connects to and drives a pressure plate, with multiple pressure posts elastically mounted within the plate and extending downward. When the lower ends of the pressure posts elastically abut the motherboard, the carrier plate descends toward the base, allowing the motherboard to contact the probes. However, during the pressing process, the mainboard and the probe are prone to hard contact, causing rigid damage to the mainboard and the probe. Therefore, it is necessary to provide a dual-carrier test platform with an integrated structure, compact structure, stable contact, effective reduction of signal attenuation, and improved test accuracy. The use of a dual-carrier test platform can achieve assembly modularization and reduce the impact on test values. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to overcome the shortcomings of the existing technology and provide a dual-carrier board test platform with an integrated structure, compact structure, stable contact, effective reduction of signal attenuation, and improved test accuracy. The use of the dual-carrier board test platform realizes assembly modularization, which can reduce the impact on test values.

[0004] The technical solution adopted by the present invention is: the present invention includes a frame, the frame is slidingly provided with a carrier plate module, a needle plate module is provided below the carrier plate module, a pressing module is provided above the carrier plate module, the pressing module includes a pressure plate, and driving components are provided on both sides of the pressure plate, the driving component includes a first driving cylinder and a mounting plate, the mounting plate is provided with a transverse guide rail and a vertical guide rail, the action end of the first driving cylinder is provided with a transmission plate, the transmission plate is slidably matched with the transverse guide rail, the transmission plate is provided with an inclined groove, the side part of the pressure plate is connected with a guide wheel, the guide wheel is guided and matched with the inclined groove, and the guide wheel is slidably matched with the vertical guide rail.

[0005] It can be seen from the above scheme that this application adopts an integrated design with a compact structure and reasonable layout, which effectively reduces signal attenuation, improves test accuracy, realizes the connection of dual main boards, and thus completes signal testing. It adopts a left-right design structure, and the two sets of carrier board modules operate independently to realize assembly modularization. It adopts a double-layer probe adapter to effectively reduce the traditional wire connection method, improve the overall module service life, and has a high test value accuracy, which effectively improves test accuracy.

[0006] A preferred solution is that the carrier module includes a second driving cylinder and a carrier, the action end of the second driving cylinder is provided with a sliding frame, the sliding frame is slidably set on the frame, a plurality of positioning columns are provided on the top of the sliding frame, the carrier is guided and matched with the positioning columns, a compression spring is provided between the carrier and the positioning columns, the PCB board to be tested is provided in the contoured groove of the carrier, and when the pressure plate presses down the PCB board to be tested, the PCB board to be tested is connected and matched with the needle plate module.

[0007] A preferred solution is that the needle plate module includes a probe, and the probe is connected to an external tester. When the pressing plate presses down the PCB board to be tested, the PCB board to be tested is communicated with the external tester through the probe.

[0008] A preferred solution is that the transverse guide rail is slidably provided with a first slider, the first slider is connected to the transmission plate, and the vertical guide rail is slidably provided with a second slider, the second slider is connected to the guide wheel.

[0009] A preferred solution is that the transmission plate is provided with two groups of the inclined grooves, the two groups of the inclined grooves are arranged in parallel, and the angle between the inclined grooves and the horizontal plane is 45 degrees.

[0010] A preferred solution is that a feed and discharge through hole is opened at the front end of the frame, and under the drive of the second driving cylinder, the carrier plate shuttles back and forth in the feed and discharge through hole to realize the loading and unloading of the PCB board to be tested.

[0011] A preferred solution is that there are two groups of the carrier modules, and the two groups of the carrier modules are arranged side by side in a horizontal direction.

[0012] A preferred solution is that a plurality of bumps are provided on the bottom of the pressing plate, and when the pressing plate is pressed downward, the bumps are pressed and fitted with the PCB to be tested. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional structural diagram of the present invention; Figure 2 It is a three-dimensional structural exploded view of the present invention; Figure 3 is a three-dimensional structural diagram of the drive assembly; Figure 41 is a three-dimensional structural diagram of the pressing plate; Figure 5 3D is a three-dimensional structural diagram of the carrier board. DETAILED DESCRIPTION

[0014] like Figures 1 to 5 As shown, in this embodiment, the present invention includes a frame 1, and the frame 1 is slidingly provided with a carrier module 2, a needle plate module 3 is provided below the carrier module 2, and a pressing module 4 is provided above the carrier module 2, and the pressing module 4 includes a pressing plate 5, and driving components 6 are provided on both sides of the pressing plate 5, and the driving component 6 includes a first driving cylinder 7 and a mounting plate 8, and the mounting plate 8 is provided with a transverse guide rail 9 and a vertical guide rail 10, and the action end of the first driving cylinder 7 is provided with a transmission plate 11, and the transmission plate 11 is slidably matched with the transverse guide rail 9, and the transmission plate 11 is provided with an inclined groove 12, and the side of the pressure plate 5 is connected with a guide wheel 13, and the guide wheel 13 is guided and matched with the inclined groove 12, and the guide wheel 13 is slidably matched with the vertical guide rail 10.

[0015] The first driving cylinder 7 is arranged horizontally, and the mounting plate 8 is perpendicular to the first driving cylinder 7. When the first driving cylinder 7 drives the transmission plate 11 to move backward, the guide wheel 13 gradually moves downward along the inclined slot 12, driving the pressure plate 5 to move downward, and vice versa. The transverse guide rail 9 and the vertical guide rail 10 respectively play a guiding and supporting role for the movement of the transmission plate 11 and the pressure plate 5. When the pressure plate 5 is pressed on the carrier module 2, the carrier module 2 is placed with the PCB board to be tested, and the driving assembly 6 drives the pressure plate 5 to press down, driving the PCB board to be tested to contact the probe of the needle plate module 3, pulling out the signal for testing, and realizing the transmission of the overall transfer signal.

[0016] like Figures 1 to 5 As shown, in this embodiment, the carrier module 2 includes a second drive cylinder 14 and a carrier 15. The actuating end of the second drive cylinder 14 is provided with a sliding frame 16. The sliding frame 16 is slidably mounted on the frame 1. A plurality of positioning posts 17 are provided on the top of the sliding frame 16. The carrier 15 is guided and engaged with the positioning posts 17. Compression springs are provided between the carrier 15 and the positioning posts 17. The PCB to be tested is disposed in the contoured groove of the carrier 15. When the pressure plate 5 presses down on the PCB to be tested, the PCB to be tested is connected and engaged with the needle plate module 3. The second drive cylinder 14 is arranged horizontally and drives the sliding frame 16 to move forward or backward. The carrier 15 is used to place the PCB to be tested. The positioning posts 17 limit the displacement of the carrier 15. The compression springs support and reset the lifting and lowering of the carrier 15.

[0017] like Figures 1 to 5 As shown, in this embodiment, the needle plate module 3 includes a probe 18, which is connected to an external tester. When the pressure plate 5 presses down on the PCB under test, the PCB under test communicates with the external tester through the probe 18. The drive assembly 6 drives the pressure plate 5 downward, bringing the PCB under test into contact with the probe 18, pulling the signal from the PCB under test for testing, and achieving overall transfer signal transmission.

[0018] like Figures 1 to 5 As shown, in this embodiment, the transverse guide rail 9 is slidably provided with a first slider 19, and the first slider 19 is connected to the transmission plate 11, and the vertical guide rail 10 is slidably provided with a second slider 20, and the second slider 20 is connected to the guide wheel 13.

[0019] like Figures 1 to 5 As shown, in this embodiment, the transmission plate 11 is provided with two groups of the inclined slots 12 , which are arranged in parallel, and the angle between the inclined slots 12 and the horizontal plane is 45 degrees.

[0020] The pressure plate 5 is raised and lowered by the cooperation of the guide wheel 13 and the inclined groove 12, instead of the straight up and down method, providing stable support for the lifting of the pressure plate 5. The angle between the inclined groove 12 and the horizontal plane is 45 degrees, which effectively ensures that the guide wheel 13 slides smoothly in the inclined groove 12, and at the same time can reduce the lifting amplitude of the pressure plate 5, further improving the test efficiency.

[0021] like Figures 1 to 5 As shown, in this embodiment, a feed and discharge through hole 22 is opened at the front end of the frame 1. Driven by the second driving cylinder 14, the carrier plate 15 shuttles back and forth in the feed and discharge through hole 22 to realize the loading and unloading of the PCB board to be tested.

[0022] like Figures 1 to 5 As shown, in this embodiment, there are two groups of carrier modules 2, which are arranged side by side in a horizontal direction. The left and right design structure is adopted, and the two groups of carrier modules 2 are operated independently to achieve modular assembly.

[0023] like Figures 1 to 5 As shown, in this embodiment, the bottom of the pressure plate 5 is provided with a plurality of protrusions 21. When the pressure plate 5 is pressed down, the protrusions 21 press and fit with the PCB to be tested. The bottom of the pressure plate 5 is also provided with a plurality of positioning pins, and the carrier module 2 is provided with positioning holes adapted to fit the positioning pins.

[0024] Although the embodiments of the present invention are described with practical solutions, they do not limit the meaning of the present invention. For those skilled in the art, it is obvious to modify the implementation scheme and combine it with other solutions based on this description.

Claims

1. A dual-carrier test platform, comprising a frame (1), wherein the frame (1) is slidably provided with a carrier module (2), a needle plate module (3) is provided below the carrier module (2), and a pressing module (4) is provided above the carrier module (2), characterized in that: The pressing module (4) includes a pressing plate (5), and driving components (6) are provided on both sides of the pressing plate (5). The driving component (6) includes a first driving cylinder (7) and a mounting plate (8), and the mounting plate (8) is provided with a transverse guide rail (9) and a vertical guide rail (10). The action end of the first driving cylinder (7) is provided with a transmission plate (11), and the transmission plate (11) is slidably matched with the transverse guide rail (9). The transmission plate (11) is provided with an inclined groove (12). The side of the pressing plate (5) is connected to a guide wheel (13), and the guide wheel (13) is guided and matched with the inclined groove (12). The guide wheel (13) is slidably matched with the vertical guide rail (10).

2. The dual-carrier test platform according to claim 1, characterized in that: The carrier module (2) comprises a second driving cylinder (14) and a carrier (15); a sliding frame (16) is provided at the action end of the second driving cylinder (14); the sliding frame (16) is slidably provided on the frame (1); a plurality of positioning columns (17) are provided on the top of the sliding frame (16); the carrier (15) and the positioning columns (17) are guided and matched; a compression spring is provided between the carrier (15) and the positioning columns (17); a PCB to be tested is provided in the contoured groove of the carrier (15); when the pressure plate (5) presses down the PCB to be tested, the PCB to be tested is connected and matched with the needle plate module (3).

3. The dual-carrier test platform according to claim 1, characterized in that: The needle plate module (3) includes a probe (18), and the probe (18) is connected to an external test machine. When the pressing plate (5) presses down the PCB board to be tested, the PCB board to be tested is connected to the external test machine through the probe (18).

4. The dual-carrier test platform according to claim 1, characterized in that: The transverse guide rail (9) is slidably provided with a first slider (19), the first slider (19) being connected to the transmission plate (11), and the vertical guide rail (10) is slidably provided with a second slider (20), the second slider (20) being connected to the guide wheel (13).

5. The dual-carrier test platform according to claim 1, characterized in that: The transmission plate (11) is provided with two groups of inclined grooves (12), the two groups of inclined grooves (12) are arranged in parallel, and the angle between the inclined grooves (12) and the horizontal plane is 45 degrees.

6. The dual-carrier test platform according to claim 2, characterized in that: A material inlet and outlet through hole (22) is provided at the front end of the frame (1). Driven by the second driving cylinder (14), the carrier plate (15) shuttles back and forth in the material inlet and outlet through hole (22) to achieve loading and unloading of the PCB board to be tested.

7. The dual-carrier test platform according to claim 1, characterized in that: There are two groups of the carrier modules (2), and the two groups of the carrier modules (2) are arranged side by side in a transverse direction.

8. The dual-carrier test platform according to claim 1, characterized in that: A plurality of bumps (21) are provided at the bottom of the pressing plate (5); when the pressing plate (5) is pressed downward, the bumps (21) are pressed and matched with the PCB board to be tested.

Images