Server

Abstract

The invention discloses a server, and relates to the technical field of servers, the server comprises a first heat dissipation structure, a second heat dissipation structure, board cards, processing elements and a case, the first heat dissipation structure is in contact with the board cards, the second heat dissipation structure is in contact with the second heat dissipation structure and is attached to the processing elements, reliable heat dissipation of the multiple board cards and the multiple processing elements can be guaranteed, and the heat dissipation efficiency is improved. The technical problem that reliable heat dissipation of the board card and the processing element cannot be met in the prior art is solved, reliable and limited installation of a full liquid cooling structure of the board card and the processing element in the case can be achieved, and the effect of reliable heat dissipation is guaranteed.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to a server. Background Art

[0002] With the continuous development of information technology, the demand for server computing power is increasing, and the increasing computing power demand corresponds to an increasingly higher heat dissipation demand.

[0003] In related technologies, when multiple boards are densely arranged on a circuit board, the boards on the circuit board and the processing components corresponding to the boards are all cooled by a liquid cooling structure. However, in actual situations, there are a large number of processing components. If heat is dissipated by a single liquid cooling structure, it is easy to cause insufficient cooling. If multiple liquid cooling structures are used to dissipate heat for each processing component one by one, the process will be very complicated.

[0004] In summary, how to ensure reliable heat dissipation of multiple boards and corresponding processing components is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0005] The present application provides a server to at least solve the problem in the related art that boards and processing elements cannot be reliably cooled.

[0006] This application provides a server, including:

[0007] Chassis;

[0008] Multiple boards are arranged symmetrically in the chassis;

[0009] A plurality of processing elements are disposed on one side of the plurality of boards, wherein the surface area of ​​the processing elements is smaller than the surface area of ​​the boards;

[0010] The first heat dissipation structure includes a plurality of liquid cooling components, and the liquid cooling components are attached to the board;

[0011] The second heat dissipation structure includes a plurality of heat-conducting components, the heat-conducting components are connected to their corresponding liquid cooling components, and the heat-conducting components are arranged in close contact with the processing elements.

[0012] On the other hand, the heat conduction component includes a metal hose and a heat conduction block. One side of the metal hose is connected to the heat conduction block, and the other side of the metal hose extends to connect to the liquid cooling component. The heat conduction block is connected to the circuit board so that it can fit the processing element.

[0013] On the other hand, at least two contact parts are provided on the side of the heat conductive block away from the metal hose and in contact with the processing element. The at least two contact parts are used to correspond to the processing elements of at least two boards respectively, and a flow part recessed relative to the contact parts is provided between two adjacent contact parts.

[0014] On the other hand, a first thermal pad is provided between the contact portion and the processing element. Both the first thermal pad and the metal hose can be deformed to adjust the fit between the contact portion and the processing element.

[0015] On the other hand, the metal hose includes a first part and a second part. The outer periphery of the first part is embedded in the heat-conducting block, and the first part extends from the center part to the edge part of the heat-conducting block. The second part is bent relative to the first part and is used to contact the liquid cooling component.

[0016] On the other hand, the liquid cooling assembly includes a plurality of liquid cooling structures arranged parallel to the direction of the board cards, and the plurality of liquid cooling structures are connected to each other for heat dissipation of at least two corresponding board cards.

[0017] On the other hand, the liquid cooling structure includes a heat conducting plate and a liquid cooling chamber connected to the heat conducting plate. The heat conducting plate is connected to the corresponding board so that the liquid cooling chamber and the heat conducting plate can be attached to the board on one side close to the board.

[0018] On the other hand, the liquid cooling chamber includes a first chamber body and a second chamber body connected to the first chamber body. The first chamber body is arranged to protrude from the surface of the second chamber body and both are attached to the heat conduction plate.

[0019] On the other hand, the board is provided with a processing unit and a control unit located around the processing unit; a second thermal pad is provided between the control unit and the heat conduction plate, and between the processing unit and the liquid cooling chamber.

[0020] On the other hand, among the multiple liquid cooling structures arranged in a direction parallel to the board, the heat conducting plate of the liquid cooling structure close to the heat conducting component is provided with a heat conducting groove body, into which the heat conducting component extends to contact the liquid cooling chamber and the heat conducting plate.

[0021] On the other hand, the two adjacent liquid cooling structures are connected through a connecting structure, which includes at least one bellows section, which can be bent and / or stretched so that the liquid cooling bins and heat conduction plates corresponding to the two adjacent liquid cooling structures can contact the board.

[0022] On the other hand, the connection structure further includes a connection section, which connects two adjacent bellows sections;

[0023] Alternatively, one end of the connecting section is connected to the bellows section, and the other end of the connecting section is connected to the inlet of any one of the two adjacent liquid cooling structures or the outlet of the other one.

[0024] On the other hand, the connecting section is located in the limiting portion of the heat conducting plate, and a clearance groove is provided on the board corresponding to the position of the connecting section. The limiting portion and the clearance groove cooperate to form an accommodating space for the connecting section.

[0025] On the other hand, it also includes a water collector assembly arranged in the chassis, and the water collector assembly is connected to multiple liquid cooling assemblies.

[0026] On the other hand, the water collector assembly includes a water outlet water collector and a water inlet water collector, and the water outlet water collector and the water inlet water collector are both connected to the liquid cooling assembly through connecting pipes;

[0027] Either the outlet water manifold or the inlet water manifold is provided with a placement groove, and the corresponding connecting pipe of either the outlet water manifold or the inlet water manifold passes through the placement groove and is connected to the other one.

[0028] The present application is provided with a chassis, a board, a processing element, a first heat dissipation structure and a second heat dissipation structure, wherein the surface area of ​​the board is larger than the surface area of ​​the processing element; the first heat dissipation structure includes a plurality of liquid cooling components, which can be arranged in a manner that fits the board, and achieves heat dissipation of a plurality of boards with relatively large surface areas through liquid cooling; the second heat dissipation structure includes a plurality of heat conductive components, which are connected to their corresponding liquid cooling components, and the heat conductive components are fitted to the processing element, and heat dissipation of a plurality of processing elements corresponding to the plurality of boards is achieved through the heat conductive components, so as to meet the heat dissipation of a plurality of processing elements with relatively small surface areas; through this arrangement, in the case where a plurality of processing elements have a small surface area and it is not convenient to arrange liquid cooling components, the liquid cooling components can be connected by the heat conductive components and fitted to the processing elements to ensure a reliable heat dissipation effect of the processing elements.

[0029] The beneficial effect of the present application is that: through the provision of the first heat dissipation structure and the second heat dissipation structure, the structure is simple and effective, and can ensure reliable heat dissipation of the board and the processing components corresponding to the board through full liquid cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0031] Figure 1 A schematic diagram of the server structure provided for this application;

[0032] Figure 2 Schematic diagram of the distribution of boards and processing elements provided for this application;

[0033] Figure 3 A schematic diagram of the connection between the first heat dissipation structure and the second heat dissipation structure provided in this application;

[0034] Figure 4 for Figure 3 Bottom view of

[0035] Figure 5 A schematic diagram of the structure of the heat conducting plate provided in this application;

[0036] Figure 6 A schematic diagram of the connection structure provided in this application;

[0037] Figure 7 A schematic diagram of the distribution of the second heat dissipation structure provided in this application;

[0038] Figure 8 for Figure 7 Bottom view of

[0039] Figure 9 A schematic structural diagram of the second heat dissipation structure provided in this application;

[0040] Figure 10 A schematic diagram of the cooling channel between two adjacent liquid cooling structures provided in this application;

[0041] Figure 11 A schematic diagram of the structure of the board provided for this application;

[0042] Figure 12 A schematic diagram of the structure of the liquid cooling chamber provided in this application;

[0043] Figure 13 This is a schematic diagram of the internal structure of the liquid cooling chamber provided in this application.

[0044] The above drawings include the following reference numerals:

[0045] 1-Liquid cooling assembly; 2-Board; 3-Connection structure; 4-First thermal pad; 5-Heat conduction assembly; 6-Connection pipe; 7-Water collector assembly; 8-Processing unit; 9-Power control element; 10-Auxiliary control element; 11-Liquid cooling structure; 12-Second thermal pad; 13-Chassis; 14-Processing element; 15-Circuit board; 16-Relief slot; 17-Connection bracket; 18-Handle;

[0046] 31- bellows section; 32- connecting section; 51- heat conducting block; 52- metal hose; 53- support frame; 71- water outlet manifold; 72- water inlet manifold;

[0047] 111 - heat conduction plate; 112 - liquid cooling chamber; 511 - contact portion; 512 - circulation portion; 521 - first portion; 522 - second portion; 722 - placement slot;

[0048] 1111 - heat-conducting groove body; 1112 - limiting part; 1121 - outlet; 1122 - inlet; 1123 - first storage body; 1124 - second storage body; 1125 - heat dissipation strip. DETAILED DESCRIPTION

[0049] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0050] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0051] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0052] The server provided in this application includes a chassis 13, a plurality of boards 2, a plurality of processing elements 14, a first heat dissipation structure and a second heat dissipation structure. Figure 1 、 Figure 2 .

[0053] Please refer to Figure 2Multiple boards 2 are symmetrically arranged within chassis 13. Multiple processing components 14 are located on one side of the boards 2. The surface area of ​​the processing components 14 is smaller than that of the boards 2. The structures of the multiple processing components 14 can be consistent or inconsistent, depending on actual design requirements.

[0054] The first heat dissipation structure and the second heat dissipation structure are used to reliably dissipate heat for multiple boards 2 and multiple processing elements 14 corresponding to the multiple boards 2. The multiple processing elements 14 can specifically avoid problems such as signal attenuation and jitter during long-distance or high-frequency transmission, and can ensure the integrity and stability of data transmission of the board 2.

[0055] The first heat dissipation structure includes multiple liquid cooling components 1, which are arranged in contact with the board 2 and are used for heat dissipation of the board 2 with a relatively large area. Specifically, a single liquid cooling component 1 corresponds to the heat dissipation of one or two or more boards 2, which is determined according to actual conditions.

[0056] The second heat dissipation structure includes multiple heat-conducting components 5, each connected to its corresponding liquid-cooling component 1. Alternatively, each heat-conducting component 5 corresponds to a single liquid-cooling component 1. Contact between the heat-conducting components 5 and the liquid-cooling component 1 dissipates heat from the processing components 14 they contact. This contact between the heat-conducting components 5 and the liquid-cooling component 1 ensures that each of the multiple processing components 14 reliably contacts the heat-conducting components 5 for heat dissipation, ensuring reliable heat dissipation for the multiple processing components 14. The layout is simple and reliable, with low design costs. Furthermore, this separate heat dissipation method does not interfere with other components outside the board 2, nor does it affect the normal operation of these components.

[0057] In addition, by configuring the heat-conducting component 5 to contact the liquid-cooling component 1 , the specifications and dimensions of the corresponding heat-conducting component 5 can be designed according to the different distribution conditions of the multiple processing elements 14 , making the overall design more flexible and reliable.

[0058] In one embodiment, multiple processing components 14 are arranged in a regular array on one side of multiple boards 2, such as with each processing component 14 being equidistant from the boards 2. In this case, the thermally conductive components 5 corresponding to each processing component 14 can be arranged in the same array to provide targeted heat dissipation for each processing component 14.

[0059] In another specific embodiment, multiple processing components 14 are arranged in an irregular pattern on one side of multiple boards 2. This irregular pattern may include, for example, unequal distances between each processing component 14 and each board 2, or varying surface areas. In this case, the dimensions of the multiple thermally conductive components 5, as well as the shape of the portion that fits the processing components 14, can be modified to meet operational requirements. Since modifications to the thermally conductive components 5 do not affect the liquid cooling component 1, the modified thermally conductive components 5 can simply be placed in contact with the liquid cooling component 1, resulting in convenient operation and increased applicability.

[0060] In this embodiment, it should be noted that the chassis 13 has a height of 1U, and the board 2, processing element 14, first heat dissipation structure, and second heat dissipation structure are all located within the chassis 13 and within the height range of the chassis 13. The design of the first heat dissipation structure and the second heat dissipation structure satisfies the requirement of full liquid cooling to dissipate heat from the internal components of the server, ensuring reliable heat dissipation. Through this application, even in situations where the server height is limited and there is no active air supply, a simple structural design can simultaneously meet the requirements of reliable heat dissipation for the board 2 and the corresponding processing element 14, ensuring the reliability and effectiveness of the full liquid cooling structure.

[0061] It should be specifically noted that the server's height is limited because the chassis 13 also needs to accommodate the circuit boards 15 and the cards 2, leaving very little room for heat dissipation. This is why the present application proposes a heat dissipation method that provides full liquid cooling without the need for air cooling. This method can reliably dissipate heat from the cards 2 and processing components 14 within the chassis 13, even within the limited height of the chassis 13.

[0062] In actual application scenarios, the server of this application adopts full liquid cooling to dissipate heat, which can ensure reliable heat dissipation of multiple boards 2 and processing elements 14 when multiple boards 2 are densely arranged on the circuit board 15 and the ventilation space is limited due to the limited height of the chassis 13.

[0063] Based on the above examples, please refer to Figure 1 、 Figure 7 The heat-conducting component 5 includes a metal hose 52 and a heat-conducting block 51. One side of the metal hose 52 is connected to the heat-conducting block 51, and the other side of the metal hose 52 extends to connect to the liquid cooling component 1. The heat-conducting block 51 is connected to the circuit board 15 so that it can fit the processing element 14.

[0064] The metal hose 52 is a component that can be bent by external force, specifically a copper tube. It can have good thermal conductivity while being able to bend by external force, thereby ensuring reliable heat dissipation of the processing element 14 corresponding to the heat-conducting component 5.

[0065] Among them, the bending of the metal hose 52 can ensure that when there is a certain height tolerance of the processing element 14, the influence of this tolerance on the reliable installation of the heat-conducting block 51 is eliminated, ensuring that the heat-conducting block 51 can reliably contact with the processing element 14 and ensure reliable heat conduction effect.

[0066] In this embodiment, the metal hose 52 contacts the liquid cooling assembly 1 , and the heat conducting block 51 contacts the metal hose 52 , so that the heat of the processing element 14 to which the heat conducting block 51 is attached can be conducted away, thereby ensuring the heat dissipation effect.

[0067] The structural form of the metal hose 52 and the heat conducting block 51 can be adaptively adjusted based on the size and positional relationship of the multiple processing components 14 within the server. For example, if the processing components 14 are located at different distances from the multiple boards 2, the length of the metal hose 52 can be adjusted to achieve adaptive adjustment, ensuring reliable contact and heat dissipation between the heat conducting assembly 5 and the corresponding processing components 14.

[0068] Furthermore, it should be noted that the heat conducting block 51 may correspond to a single processing element 14 or to multiple processing elements 14. For example, if a single liquid cooling assembly 1 is used to dissipate heat for two boards 2, then the single or two heat conducting blocks 51 of the heat conducting assembly 5 corresponding to this liquid cooling assembly 1 are used to dissipate heat for the two corresponding processing elements 14.

[0069] like Figure 9 As shown, the number of metal hoses 52 is greater than the number of heat-conducting blocks 51, and the surface area of ​​the processing element 14 is small. Therefore, multiple processing elements 14 can be covered by a single heat-conducting block 51 to simplify the structure. The multiple processing elements 14 here are not all processing elements 14, but the processing elements 14 corresponding to the multiple boards 2 corresponding to the liquid cooling component 1 corresponding to this heat-conducting component 5.

[0070] Alternatively, the number of metal hoses 52 is equal to the number of heat-conducting blocks 51, and multiple heat-conducting blocks 51 are provided, each heat-conducting block 51 is connected to a corresponding metal hose 52, and a single heat-conducting block 51 is used to dissipate heat for a single processing element 14. In this case, reliable heat dissipation can also be achieved for multiple processing elements 14 corresponding to each heat-conducting assembly 5.

[0071] In this embodiment, a relatively simple pipeline design is used to ensure reliable heat dissipation of the processing element 14. The installation process is simple and the cost is low. Liquid cooling of the processing element 14 can be performed within the limited height space of the chassis 13 without the need for air cooling. The overall design is simple, effective, and highly adaptable.

[0072] Based on any of the above embodiments, please refer to Figure 9At least two contact portions 511 are provided on the side of the heat conductive block 51 away from the metal hose 52 and in contact with the processing element 14. The at least two contact portions 511 are used to correspond to the processing elements 14 of at least two boards 2 respectively. A flow portion 512 is provided between two adjacent contact portions 511 and is recessed relative to the contact portion 511.

[0073] In this embodiment, the contact portion 511 is configured to fit the processing element 14 . Through the fit between the contact portion 511 and the processing element 14 , heat is transferred to the liquid cooling assembly 1 through the metal hose 52 to dissipate heat from the processing element 14 .

[0074] The at least two processing elements 14 corresponding to the at least two contact portions 511 correspond to the at least two boards 2 to which the same liquid cooling assembly 1 is applied. In other words, a single board 2 corresponds to a single processing element 14 .

[0075] A flow portion 512 recessed relative to the contact portion 511 is provided between two adjacent contact portions 511 . The provision of the flow portion 512 can avoid interference in heat dissipation between the processing elements 14 and ensure reliable heat dissipation of the multiple processing elements 14 .

[0076] In this embodiment, the structures and shapes of two adjacent contact portions 511 may be consistent or inconsistent, which may be determined based on the corresponding multiple processing elements 14 in actual application.

[0077] In addition, the surface area of ​​the contact portion 511 is greater than or equal to the surface area of ​​the corresponding processing element 14 , thereby ensuring reliable heat dissipation and further ensuring reliable operating performance of the processing element 14 .

[0078] Based on any of the above embodiments, please refer to Figure 4 、 Figure 8 A first thermal pad 4 is provided between the contact portion 511 and the processing element 14 . Both the first thermal pad 4 and the metal hose 52 can be deformed to adjust the fit between the contact portion 511 and the processing element 14 .

[0079] Specifically, the bending of the metal hose 52 can ensure that when there is a certain height tolerance of the processing elements 14 at different positions, the influence of this tolerance on the contact portion 511 of the heat-conducting block 51 being in reliable contact with the processing element 14 is eliminated, and the first thermal pad 4 can provide a certain compressibility to cooperate to ensure the reliable fit between the processing element 14 and the contact portion 511, and ensure the reliable installation of the heat-conducting component 5, thereby ensuring the reliable heat dissipation effect of the corresponding processing element 14.

[0080] In this embodiment, the first thermal pad 4 is made of elastic material and can produce appropriate compression deformation in actual application. The number, shape and material of the first thermal pad 4 can be set according to the parameters and model of the actual processing component 14.

[0081] Based on any of the above embodiments, the heat-conducting component 5 also includes a support frame 53. The support frame 53 here can be set as a sheet metal part and can also have a certain flexibility to cooperate with the setting of the metal hose 52 to meet the floating and reliable installation of the heat-conducting component 5 relative to the processing element 14, thereby ensuring reliable heat dissipation of the processing element 14.

[0082] One side of the support frame 53 can be connected to the heat conductive block 51, and the other side of the support frame 53 can be connected to the liquid cooling assembly 1, so as to ensure relatively reliable installation of the heat conductive assembly 5. In addition, the support frame 53 is also provided with fastening screws, which can be used to lock the heat conductive block 51 to the circuit board 15. Correspondingly, the first thermal pad 4 and the corresponding processing element 14 can be securely attached to ensure reliable and effective heat dissipation.

[0083] The metal hose 52 is connected to the support frame 53 and extends toward the liquid cooling assembly 1 . Specifically, the metal hose 52 can extend to contact the liquid cooling assembly 1 so as to remove heat from the processing element 14 through the good thermal conductivity of the metal hose 52 .

[0084] If the distances between multiple processing components 14 and multiple boards 2 are inconsistent, the support frame 53 and the metal hose 52 can be modified to improve the applicability of the heat conducting assembly 5 and ensure reliable and effective heat dissipation from the heat conducting assembly 5 to the multiple processing components 14. This modification does not affect the use of the liquid cooling assembly 1 and does not require disassembly or modification, making it relatively simple and easy to operate.

[0085] In actual application, multiple sets of different models of thermal conductive components 5 can also be directly processed so that the corresponding thermal conductive components 5 can be adaptively selected according to the positional relationship and distribution relationship of each board 2 on the actual circuit board 15 and the processing components 14 corresponding to the board 2.

[0086] Based on any of the above embodiments, please refer to Figure 7 The metal hose 52 includes a first part 521 and a second part 522. The outer periphery of the first part 521 is embedded in the heat-conducting block 51, and the first part 521 extends from the center part to the edge part of the heat-conducting block 51. The second part 522 is bent relative to the first part 521 and is used to contact the liquid cooling component 1.

[0087] By dividing the metal hose 52 into a first portion 521 and a second portion 522, and by bending the first portion 521 relative to the second portion 522, the metal hose 52 can, firstly, increase its contact area with the heat-conducting block 51, thereby avoiding excessive space occupation. Secondly, it can serve as a guide, transferring heat from the processing element 14 to the liquid cooling assembly 1 through the first portion 521 for reliable heat dissipation. Furthermore, because the outer periphery of the first portion 521 is embedded within the heat-conducting block 51, the first portion 521 can actually be arranged using the height space of the heat-conducting block 51 itself, thereby reducing the overall space occupied by the structure. Furthermore, the heat-conducting area provided by the first portion 521 embedded within the heat-conducting block 51 ensures reliable heat dissipation of the corresponding processing element 14.

[0088] Corresponding to the second portion 522 , the second portion 522 is supported on the support frame 53 and extends into and contacts the liquid cooling assembly 1 to transfer heat from the processing element 14 .

[0089] Based on any of the above embodiments, please refer to Figure 3 The liquid cooling assembly 1 includes a plurality of liquid cooling structures 11 arranged parallel to the board 2 , and the plurality of liquid cooling structures 11 are connected to dissipate heat for corresponding at least two boards 2 .

[0090] It should be noted that the direction parallel to the board 2 is set here. Figure 3 In the x-direction, the multiple liquid cooling structures 11 included in a single liquid cooling assembly 1 are connected to enable the cooling medium to flow, thereby ensuring reliable and effective heat dissipation of the board 2 corresponding to each liquid cooling structure 11 .

[0091] In addition, the multiple liquid cooling structures 11 can be connected with the help of pipeline components. The specific connection form is not limited and can be determined in combination with actual needs.

[0092] The distribution of the multiple liquid cooling structures 11 is determined in combination with the positions of the corresponding multiple boards 2 and is not limited to a regular arrangement.

[0093] Based on any of the above embodiments, please refer to Figure 10 The liquid cooling structure 11 includes a heat conducting plate 111 and a liquid cooling chamber 112 that is attached to the heat conducting plate 111. The heat conducting plate 111 is connected to the corresponding board 2 so that the liquid cooling chamber 112 and the heat conducting plate 111 can be attached to the board 2 on the side close to the board 2.

[0094] The heat conducting plate 111 and the liquid cooling chamber 112 are in reliable contact, and the heat conducting plate 111 and the liquid cooling chamber 112 correspond to the components at various locations on the board 2 for reliable heat dissipation.

[0095] By relatively fixing the heat conducting plate 111 and the board 2 , it is possible to ensure reliable adhesion between the board 2 , the liquid cooling chamber 112 , and the heat conducting plate 111 , thereby ensuring reliable heat dissipation of the board 2 .

[0096] This combination of the liquid cooling chamber 112 and the heat conducting plate 111 can increase the heat dissipation area of ​​the entire liquid cooling structure 11 through the heat conducting plate 111, ensuring that the components on each board 2 can be covered and ensuring a reliable heat dissipation effect of the board 2.

[0097] In addition, the liquid cooling chamber 112 is fixed on the heat conducting plate 111. After the heat conducting plate 111 is fixed to the board 2, the liquid cooling chamber 112 is also fixed relative to the board 2, ensuring reliable adhesion to the board 2 for heat dissipation.

[0098] In this embodiment, the liquid cooling chamber 112 is a chamber structure with a cooling medium inside. The cooling medium flows between the multiple liquid cooling structures 11 to reliably dissipate heat for the multiple boards 2 corresponding to the multiple liquid cooling structures 11.

[0099] The liquid cooling chamber 112 and the heat conducting plate 111 are both provided with portions in contact with the board 2, corresponding to reliable heat dissipation of various types of components at different positions on the board 2, ensuring the heat dissipation effect of the liquid cooling assembly 1 on the multiple boards 2 it uses.

[0100] Based on any of the above embodiments, please refer to Figure 1 、 Figure 12 The liquid cooling chamber 112 includes a first chamber body 1123 and a second chamber body 1124 connected to the first chamber body 1123 . The first chamber body 1123 is protruded from the surface of the second chamber body 1124 and both are attached to the heat conducting plate 111 .

[0101] The arrangement of the first chamber 1123 and the second chamber 1124 can increase the contact area between the liquid cooling chamber 112 and the heat conducting plate 111 , thereby ensuring the reliability of heat dissipation of the board 2 and the processing element 14 corresponding to the board 2 through the liquid cooling assembly 1 .

[0102] In addition, the first chamber 1123 and the second chamber 1124 have different surface areas, and their inner cavities are connected to circulate the cooling medium.

[0103] like Figure 12 A second bin body 1124 is provided on both sides of the first bin body 1123. The second bin body 1124 can be used to set an inlet and an outlet for communication between adjacent liquid cooling structures 11, so that the liquid cooling medium can flow in the liquid cooling bin formed by welding the second bin body 1124 and the first bin body 1123.

[0104] In addition, if Figure 13In order to ensure the effect of the liquid cooling structure 11, a plurality of heat dissipation strips 1125 are provided in the first housing 1123. Two adjacent heat dissipation strips 1125 can form a fluid channel, so that the cooling medium can fully flow through the first housing 1123, thereby increasing the contact area and improving the heat dissipation efficiency of the electronic components. In addition, the setting of the heat dissipation strips 1125 can provide a certain flow guiding effect, thereby ensuring the reliable flow of the cooling medium.

[0105] In actual application, the first chamber 1123 and the second chamber 1124 are both attached to the heat conducting plate 111 and are in contact with the heat conducting plate 111 and the second chamber 1124 through the heat conducting component 5 so as to be used for heat dissipation of the processing element 14 corresponding to the board 2.

[0106] Furthermore, the heat conducting plate 111 is provided with multiple contact areas, which can contact the second housing 1124 of the liquid cooling assembly 1 for heat conduction. The bottom surface of the heat conducting plate 111, which is close to the first housing 1123, can also contact the first housing 1123 for heat conduction. This increases the contact area between the heat conducting plate 111 and the liquid cooling structure 11, improving heat conduction efficiency and ensuring reliable heat dissipation of the board 2.

[0107] Based on any of the above embodiments, a processing unit 8 and a control unit located around the processing unit 8 are distributed on the board 2; a second thermal pad 12 is provided between the control unit and the heat conduction plate 111 and between the processing unit 8 and the liquid cooling chamber 112.

[0108] In this embodiment, the control unit is the power control element 9 and the auxiliary control element 10 , and the processing unit 8 is the main processing unit with a larger area on the board 2 .

[0109] The provision of second thermal pad 12, combined with the use of bellows section 31, allows the liquid cooling structure 11 to be securely aligned with the control unit and processing unit 8 on board 2, ensuring reliable heat dissipation. Specifically, the deformability of second thermal pad 12 combined with the flexibility or bendability of bellows section 31 creates a floating space for the liquid cooling structure 11 relative to board 2, creating an adjustable space that prevents damage to board 2 components while ensuring a secure fit between board 2 and liquid cooling structure 11.

[0110] In the case where the height limit of the server chassis 13 of this application is 1U, the provision of the second thermal pad 12 and the connection structure 3 can eliminate the influence of processing errors on installation reliability in a relatively compact space, and can be reliably installed through the liquid cooling component 1 and the board 2 to ensure reliable heat dissipation effect of the board 2.

[0111] In this embodiment, through the cooperation of the heat conducting plate 111 and the liquid cooling chamber 112, and the provision of multiple second heat conducting pads 12, the liquid cooling structure 11 can meet the reliable and effective heat dissipation of various components of different types and positions on the board 2.

[0112] In this embodiment, the expansion and contraction direction of the bellows section 31 and the deformable direction of the second thermal pad 12 can be two mutually perpendicular directions, so that they can be adjusted from multiple directions to ensure that the first heat dissipation structure can be floated relative to the board 2, thereby ensuring the heat dissipation effect of the processing unit 8 and the control unit on the board 2.

[0113] In addition, the arrangement of the bellows section 31 and the second thermal pad 12 can also adjust the reliable installation of the adjacent liquid cooling structure 11 relative to its corresponding board 2, thereby ensuring a reliable heat dissipation effect of the corresponding board 2.

[0114] It should be noted that the first thermal pad 4 and the second thermal pad 12 in this embodiment are both structural members with a certain elasticity, which can produce appropriate deformation to meet the requirements of floating installation.

[0115] Based on any of the above embodiments, please refer to Figure 4 The compressible amount of the second thermal pad 12 corresponding to the processing unit 8 at the middle position of the same board 2 is X1, and the compressible amount of the second thermal pad 12 corresponding to the control unit at the edge position of the same board 2 is X2, X1<X2.

[0116] Specifically, the second thermal pad 12 at the middle position is the largest area, while the second thermal pad 12 at the edge position corresponds to a slightly smaller area. Figure 4 .

[0117] The configuration of second thermal pads 12 with varying compressibility is based on the need for larger adjustable spaces for the deformable elements at the edges of the board 2. After the processing unit 8 and the corresponding second thermal pad 12 at the center are adaptively adjusted, the second thermal pads 12 at the edges are then used for adaptive adjustment, ensuring reliable and effective heat dissipation for components at various locations on the board 2. The specific configuration of varying compressibility can be achieved through material, thickness, and other factors, without further limitation.

[0118] Based on any of the above embodiments, please refer to Figure 3 、 Figure 5 Among the multiple liquid cooling structures 11 arranged in a direction parallel to the board 2, the heat conducting plate 111 of the liquid cooling structure 11 close to the heat conducting component 5 is provided with a heat conducting groove body 1111, and the heat conducting groove body 1111 is used for the heat conducting component 5 to extend into to contact the liquid cooling chamber 112 and the heat conducting plate 111.

[0119] In this embodiment, the direction parallel to the board 2 is Figure 3 The x direction in the figure, and the distribution direction of the multiple liquid cooling components 1 is Figure 3 y direction in .

[0120] By setting a heat-conducting groove body 1111 on the heat-conducting plate 111, this heat-conducting groove body 1111 can support and limit the metal hose 52 of the heat-conducting component 5. The metal hose 52 extends into the liquid cooling chamber 112 and the heat-conducting plate 111 through this heat-conducting groove body 1111 and contacts the liquid cooling chamber 112 and the heat-conducting plate 111, so as to take away the heat of the processing element 14 and complete reliable heat dissipation of the processing element 14.

[0121] Based on any of the above embodiments, please refer to Figure 4 Adjacent liquid-cooling structures 11 are connected via a connecting structure 3 to enable the flow of cooling medium between the two adjacent liquid-cooling structures 11. The connecting structure 3 includes at least one bellows section 31. The inner wall of the bellows section 31 is smooth to reduce the flow resistance of the cooling medium, and the outer wall of the bellows section is provided with multiple sections of corrugations.

[0122] Under the action of axial, angular, or lateral forces, the bellows section 31 bends and / or expands, allowing the liquid cooling chambers 112 and heat conducting plates 111 corresponding to two adjacent liquid cooling structures 11 to contact the board 2. The arrangement of the bellows section 31 essentially adjusts the position of the liquid cooling chambers 112 and heat conducting plates 111 relative to the board 2, ensuring reliable contact with the board 2 and a reliable heat dissipation effect.

[0123] In addition, by providing the bellows section 31 , the stress caused by tolerance assembly affects the fit between the liquid cooling chamber 112 , the heat conducting plate 111 and the board 2 , thereby ensuring reliable heat dissipation of the board 2 .

[0124] Based on any of the above embodiments, please refer to Figure 4 、 Figure 5 The connecting structure 3 also includes a connecting section 32. The setting of the connecting section 32 can provide support force for the connecting structure 3 when the cooling medium circulates, ensure the structural strength and reliability of the connecting structure 3, reduce the impact on the bellows section 31, and ensure the reliable effect of the connecting structure 3.

[0125] The connecting section 32 connects two adjacent bellows sections 31. In this case, multiple bellows sections 31 can be provided, and adjacent bellows sections 31 are connected through the connecting section 32. Of course, in this case, the components that can be connected to the liquid cooling structure 11 can pass directly through the bellows section 31 or through another connecting section 32, depending on the actual situation.

[0126] Alternatively, one end of the connecting section 32 is connected to the bellows section 31, and the other end of the connecting section 32 is connected to the inlet 1122 of one of the two adjacent liquid cooling structures 11 or the outlet 1121 of the other. Figure 4 As shown, the connecting section 32 is directly welded to the inlet 1122 or outlet 1121, reducing leakage points of the cooling medium and avoiding affecting the normal operation of the board 2. By welding, the use of connectors is avoided, the overall structure of the connecting structure 3 is simplified, and the requirements of compact design are further met.

[0127] In this embodiment, the cooling medium in the adjacent two liquid cooling structures 11 is circulated, the inlet 1122 is the port for the cooling medium to enter the liquid cooling structure 11, and the outlet 1121 is the port for the cooling medium to flow out of the liquid cooling structure 11. The specific cooling flow channel between the adjacent two liquid cooling structures 11 can be referred to Figure 10 and Figure 4 Indicated by the arrow in the middle.

[0128] In this embodiment, the connecting section 32 and the bellows section 31 may be formed by integrally forming the connecting structure 3 , and the connecting structure 3 may be a stainless steel bellows.

[0129] When the connecting structure 3 is in a deformed state or static state, due to the reliable connection between the connecting section 32 and the liquid cooling structure 11, the bellows section 31 and the connecting section 32 are both located in the chassis 13, which can meet the compact design requirements.

[0130] Based on any of the above embodiments, please refer to Figure 4 、 Figure 5 The connecting section 32 is located in the limiting portion 1112 of the heat conducting plate 111 , and a clearance groove 16 is provided on the board 2 at a position corresponding to the connecting section 32 . The limiting portion 1112 and the clearance groove 16 cooperate to form an accommodating space for the connecting section 32 .

[0131] When the connecting structure 3 is arranged between two adjacent liquid cooling structures 11 , the connecting section 32 is located in the limiting portion 1112 , and the provision of the accommodating groove 16 can provide an accommodating space for the connecting section 32 .

[0132] The board 2 is provided with a recessed groove 16 relative to its surface. The recessed groove 16 is arranged close to the processing unit 8 recessed on the board 2, and the bottom of the recessed groove 16 is arranged higher than the processing unit 8, so as to avoid interference of the board 2 with the connecting structure 3 and ensure reliable fit between the processing unit 8 and the liquid cooling structure 11.

[0133] The clearance groove 16 can prevent the plane of the board 2 from interfering with the connecting section 32 of the connecting structure 3 when the connecting structure 3 floats relative to the board 2, thereby ensuring reliable fit between the liquid cooling chamber 112 and the processing unit 8 on the board 2 and reliable heat dissipation of the processing unit 8.

[0134] Based on any of the above embodiments, please refer to Figure 3 , and also includes a water collector assembly 7, which is connected to multiple liquid cooling assemblies 1.

[0135] In this embodiment, the multiple liquid cooling structures 11 corresponding to the liquid cooling assembly 1 include a portion closest to the water collector assembly 7 and a portion relatively far from the water collector assembly 7. The portion closest to the water collector assembly 7 is connected to the water collector assembly 7 via a connecting pipe 6. The connecting pipe 6 can be a rigid pipe or a flexible pipe. This section of the pipe is no longer provided with a portion that can be expanded or deformed, ensuring reliable flow of the liquid cooling medium and effective heat dissipation. The liquid cooling structures 11 in the remaining portions are connected via a connecting structure 3 to meet the requirements of a floating design.

[0136] Furthermore, the connecting tube 6 is a copper tube, which can be welded to the liquid cooling structure 11 and the water collector assembly 7, reducing leak points and preventing them from affecting the normal operation of the board 2. The copper tube's flexibility allows for adjustments to the relative position of the water collector assembly 7 and the liquid cooling structure 11 to accommodate component manufacturing tolerances, ensuring the reliability of the entire device assembly.

[0137] Based on any of the above embodiments, please refer to Figure 3 、 Figure 4 The manifold assembly 7 includes an outlet manifold 71 and an inlet manifold 72, both of which are connected to the liquid cooling assembly 1 via a connecting pipe 6. The inlet manifold 72 can deliver the cooling medium to the liquid cooling structures 11 of the multiple liquid cooling assemblies 1, while the outlet manifold 71 is used to recover the cooling medium after heat exchange and deliver it to an external water circulation device.

[0138] Either the outlet water manifold 71 or the inlet water manifold 72 is provided with a placement groove 722 , and the connecting pipe 6 corresponding to either the outlet water manifold 71 or the inlet water manifold 72 passes through the placement groove 722 and is connected to the other one.

[0139] like Figure 3 As shown, the placement of the placement slot 722 essentially allows the connection pipe 6 to be placed by utilizing the space between the water outlet manifold 71 and the water inlet manifold 72. The placement slot 722 is not connected to the water inlet manifold 72 or the water outlet manifold 71, but simply serves as a slot with an opening on the surface. This arrangement effectively reduces the height space occupied by the manifold assembly 7, further satisfying the compact structural design and installation requirements.

[0140] The depth of the placement groove 722 only needs to meet the requirements and does not need to be set too deep to avoid affecting the flow effect of the cooling medium inside the water inlet manifold 72 or the water outlet manifold 71.

[0141] Based on any of the above embodiments, please refer to Figure 3 The heat conducting plates 111 corresponding to the multiple liquid cooling components 1 are connected via a handle assembly. The handle assembly includes a connecting frame 17 and a handle 18. The handle 18 is used to connect the multiple connecting frames 17. The handle assembly connects the multiple heat conducting plates 111 into one piece, and the heat conducting plates 111 can also connect and secure the liquid cooling chamber 112. After the first and second heat dissipation structures and the connecting structure 3 are installed in the chassis 13, the handle 18 is removed to avoid occupying height space. The handle 18 is provided only to facilitate the disassembly and assembly of components and is not fixed to the chassis 13. After the server is assembled, the handle 18 is removed.

[0142] The server provided by this application can meet the requirements of designing a full liquid cooling heat dissipation solution within a 1U height space. Through a simple pipeline design, it can provide reliable liquid cooling heat dissipation for multiple electronic components on the circuit board 15 at the same time. The fitting between the liquid cooling component 1 and the electronic components of the board 2 adopts a floating design to ensure that the liquid cooling component 1 is in reliable contact with the fitting surface of the electronic components, thereby ensuring a reliable heat dissipation effect. In addition, the server provided by this application can also meet the reliable liquid cooling heat dissipation of the processing element 14 corresponding to the board 2. The heat conducting component 5 can be reliably arranged under the condition of limited height space. The heat conducting component 5 is in contact with the liquid cooling component 1 to reliably dissipate heat for the processing element 14. The heat conducting component 5 has a simple process and does not interfere with other components of the circuit board 15. It can be adaptively adjusted according to actual conditions to ensure a reliable liquid cooling heat dissipation effect for the processing element 14.

[0143] The above is a detailed introduction to a server provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only intended to help understand the method and core ideas of the present application. It should be noted that, for those skilled in the art, without departing from the principles of the present application, several improvements and modifications may be made to the present application, and such improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A server, characterized in that: include: Chassis (13); A plurality of boards (2) are symmetrically arranged in the chassis (13); A plurality of processing elements (14) are provided on one side of the plurality of boards (2), and the surface area of ​​the processing elements (14) is smaller than the surface area of ​​the boards (2); A first heat dissipation structure comprises a plurality of liquid cooling components (1), wherein the liquid cooling components (1) are arranged in contact with the board (2); The second heat dissipation structure comprises a plurality of heat-conducting components (5), wherein the heat-conducting components (5) are connected to the corresponding liquid cooling components (1), and the heat-conducting components (5) are arranged in contact with the processing element (14).

2. The server according to claim 1, wherein: The heat-conducting assembly (5) comprises a metal hose (52) and a heat-conducting block (51). One side of the metal hose (52) is connected to the heat-conducting block (51), and the other side of the metal hose (52) extends to connect to the liquid cooling assembly (1). The heat-conducting block (51) is connected to the circuit board (15) so that it can fit the processing element (14).

3. The server according to claim 2, wherein: At least two contact portions (511) are provided on a side of the heat conducting block (51) that is away from the metal hose (52) and in contact with the processing element (14), and the at least two contact portions (511) are used to respectively correspond to the processing elements (14) of at least two boards (2), and a flow portion (512) that is recessed relative to the contact portion (511) is provided between two adjacent contact portions (511).

4. The server according to claim 3, wherein: A first thermal pad (4) is provided between the contact portion (511) and the processing element (14), and both the first thermal pad (4) and the metal hose (52) are capable of deformation so as to adjust the degree of fit between the contact portion (511) and the processing element (14).

5. The server according to claim 4, wherein: The metal hose (52) includes a first portion (521) and a second portion (522), wherein the outer periphery of the first portion (521) is embedded in the heat-conducting block (51), and the first portion (521) is extended from the central portion to the edge portion of the heat-conducting block (51), and the second portion (522) is bent relative to the first portion (521) and is used to contact the liquid cooling component (1).

6. The server according to any one of claims 1 to 5, characterized in that: The liquid cooling assembly (1) comprises a plurality of liquid cooling structures (11) arranged in parallel with the board (2), and the plurality of liquid cooling structures (11) are connected to dissipate heat for corresponding at least two of the board (2).

7. The server according to claim 6, wherein: The liquid cooling structure (11) comprises a heat conducting plate (111) and a liquid cooling chamber (112) that is bonded to the heat conducting plate (111); the heat conducting plate (111) is connected to the corresponding board (2) so that the liquid cooling chamber (112) and the heat conducting plate (111) can be bonded to the board (2) on a side close to the board (2).

8. The server according to claim 7, wherein: The liquid cooling chamber (112) comprises a first chamber body (1123) and a second chamber body (1124) connected to the first chamber body (1123); the first chamber body (1123) is arranged to protrude from the surface of the second chamber body (1124), and both are attached to the heat conducting plate (111).

9. The server according to claim 8, wherein: A processing unit (8) and a control unit located around the processing unit (8) are distributed on the board (2); a second thermal pad (12) is provided between the control unit and the heat conducting plate (111), and between the processing unit (8) and the liquid cooling chamber (112).

10. The server according to claim 9, wherein: Among the plurality of liquid cooling structures (11) arranged in a direction parallel to the board (2), the heat conducting plate (111) of the liquid cooling structure (11) close to the heat conducting component (5) is provided with a heat conducting groove (1111), and the heat conducting groove (1111) is used for the heat conducting component (5) to extend into so as to contact the liquid cooling chamber (112) and the heat conducting plate (111).

11. The server according to claim 10, wherein: Two adjacent liquid cooling structures (11) are connected via a connecting structure (3), and the connecting structure (3) includes at least one bellows section (31). The bellows section (31) is bendable and / or retractable so that the liquid cooling bins (112) and the heat conducting plates (111) corresponding to the two adjacent liquid cooling structures (11) can contact the board (2).

12. The server according to claim 11, wherein: The connecting structure (3) further comprises a connecting section (32), wherein the connecting section (32) connects two adjacent bellows sections (31); Alternatively, one end of the connecting section (32) is connected to the bellows section (31), and the other end of the connecting section (32) is connected to the inlet (1122) of any one of the two adjacent liquid cooling structures (11) or the outlet (1121) of the other.

13. The server according to claim 12, wherein: The connecting section (32) is located in the limiting portion (1112) of the heat conducting plate (111), and a clearance groove (16) is provided on the board (2) at a position corresponding to the connecting section (32), and the limiting portion (1112) and the clearance groove (16) cooperate to form an accommodating space for the connecting section (32).

14. The server according to claim 13, wherein: It also includes a water collector assembly (7) arranged in the chassis (13), and the water collector assembly (7) is connected to the plurality of liquid cooling assemblies (1).

15. The server according to claim 14, wherein: The water collector assembly (7) comprises an outlet water collector (71) and an inlet water collector (72), and both the outlet water collector (71) and the inlet water collector (72) are connected to the liquid cooling assembly (1) via a connecting pipe (6); Either the outlet water manifold (71) or the inlet water manifold (72) is provided with a placement groove (722), and the connecting pipe (6) corresponding to either the outlet water manifold (71) or the inlet water manifold (72) passes through the placement groove (722) and is then connected to the other.

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