High-power GPU phase change liquid cooling radiator

Abstract

The invention relates to a high-power GPU phase change liquid cooling radiator which comprises a bottom plate, a GPU mainboard and a cover plate which are stacked in sequence. A sealing groove and a cooling chamber are sequentially arranged on one side, close to the cover plate, of the bottom plate from outside to inside, and a liquid inlet and a liquid outlet which are respectively communicated with the cooling chamber are formed in the side surface of the bottom plate; the GPU phase change liquid cooling radiator further comprises a sealing ring and a cooling cold plate, the sealing ring is placed in the sealing groove, the cooling cold plate abuts against the sealing groove, and a micro rib column structure arranged on the cooling cold plate is located in the cooling chamber. The phase change liquid cooling technology and the micro rib column structure are combined, and the heat conduction and heat dissipation efficiency is effectively improved. Due to the design of the heat dissipation cold plate, the contact area between the cooling working medium and the GPU core is optimized, the heat dissipation effect is further enhanced through the hydrophilic or hydrophobic modification layer, different cooling requirements are met, and the service life of the GPU can be prolonged.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a high-power GPU phase-change liquid cooling radiator. Background Art

[0002] With the explosive growth in demand for high-power GPU computing power, traditional air and liquid cooling technologies face severe challenges due to inefficiency, uneven heat distribution, and delayed dynamic response. Limited by the heat capacity of air, air cooling struggles to cope with transient high heat loads, which can easily lead to core overheating and frequency throttling. While water cooling improves heat dissipation efficiency, it carries the risk of leakage, and the cold plate structure isn't optimized for the differentiated heat source distribution between the GPU core and memory modules. This uneven heat dissipation leads to the expansion of localized high-temperature zones.

[0003] While existing phase-change liquid cooling technology has partially addressed the thermal conductivity bottleneck, the insufficient thermal conductivity of organic phase-change materials and the uneven flow of fluid in microchannels can easily lead to localized dry-out failure. The single-ribbed structure and unoptimized surface hydrophilicity and hydrophobicity of traditional cold plates also limit phase-change boiling efficiency. Furthermore, the interfacial thermal resistance generated by mechanical connections, the compatibility issues between the fluid and metal materials, and the hysteresis of response under dynamic loads further restrict the reliability and energy efficiency of cooling systems. Summary of the Invention

[0004] The purpose of the present invention is to provide a high-power GPU phase change liquid cooling radiator in order to overcome at least one of the above-mentioned defects in the prior art.

[0005] Phase change cooling technology, with its unique advantages, offers a breakthrough solution to these challenges. Leveraging the latent heat absorption properties of phase change materials, it efficiently dissipates heat in a very short time, significantly reducing core temperatures and eliminating local hotspots. A passive cooling mechanism, devoid of active energy supply, combines a porous media composite structure with a gradient micro-rib design to significantly improve boiling heat transfer efficiency and fluid flow uniformity. Adaptive interface properties allow the material to conform closely to the chip surface through phase transitions, effectively reducing contact thermal resistance. The synergistic design of hydrophilic and hydrophobic surface modification and the porous media layer enhances liquid film coverage stability while addressing fluid corrosion and microchannel clogging. Furthermore, the phase change cooling system optimizes the heat conduction path through a solid thermal conductive layer. Combined with a high-positioned outlet and self-circulating flow channels, it achieves rapid response and optimized energy consumption under dynamic loads. These innovations not only overcome the core shortcomings of traditional cooling technologies but also provide an efficient, compact, and long-term stable thermal management path for applications such as high-power GPUs, AI computing clusters, and new energy vehicles, driving cooling technology towards intelligent control and high integration.

[0006] The purpose of the present invention can be achieved by the following technical solutions:

[0007] A high-power GPU phase-change liquid cooling radiator, comprising a base plate, a GPU mainboard and a cover plate stacked in sequence;

[0008] The bottom plate is provided with a sealing groove and a cooling chamber in sequence from outside to inside on one side thereof close to the cover plate, and a liquid inlet and a liquid outlet respectively connected to the cooling chamber are provided on the side of the bottom plate;

[0009] The GPU phase-change liquid cooling radiator further includes a sealing ring and a heat dissipation cold plate. The sealing ring is placed in the sealing groove. The heat dissipation cold plate abuts against the sealing groove. The micro-rib column structure provided on the heat dissipation cold plate is located in the cooling chamber.

[0010] Furthermore, a heat dissipation belt, a video memory module and a GPU core are provided on a side of the GPU mainboard close to the bottom plate; and a vertical projection of the micro-rib structure completely covers the GPU core.

[0011] Furthermore, a solid heat-conducting medium layer is provided between the GPU core and the heat-dissipating cold plate. The solid heat-conducting medium is silicone grease, heat-dissipating tape, liquid metal, graphite or a gasket. The heat-dissipating tape may also be silicone grease, heat-dissipating tape or graphite.

[0012] Furthermore, the micro-rib structure is composed of micro-ribs arranged in an array on the heat dissipation cold plate.

[0013] Furthermore, the shape of the micro-rib is a rectangle, a parallelogram, or a triangle, and the length of any side of the micro-rib is 100 μm to 2000 μm.

[0014] Furthermore, the surface of the micro-ribs is provided with a hydrophilic modification layer and / or a hydrophobic modification layer.

[0015] Furthermore, the micro-rib column is a solid column, a solid column whose surface is partially covered with the first porous medium layer, a solid column whose surface is completely covered with the first porous medium layer, a mixed column with a part being solid and the other part being porous, or a porous column with a completely porous structure;

[0016] The pore size of the first porous medium is in the range of 0.1 μm to 800 μm, and the pore size of the porous structure is in the range of 0.1 μm to 800 μm.

[0017] Furthermore, the heat dissipation cold plate is covered with a second porous medium layer on one side close to the bottom plate. The thickness of the second porous medium layer is 0.01 to 10 mm, the porosity of the second porous medium is 5% to 99%, and the pore size range is 0.1 μm to 800 μm.

[0018] Furthermore, the base plate and the heat dissipation cold plate are connected by welding, threading or snapping.

[0019] Furthermore, the liquid outlet is located above the liquid inlet, and the liquid outlet and the liquid inlet are arranged on the same side or opposite sides.

[0020] Furthermore, the height of the micro-rib structure is recorded as H1, the height of the heat exchange cavity formed by the heat dissipation cold plate and the cooling chamber on the bottom plate is recorded as H2, and the ratio of H1 / H2 is 0-1.

[0021] Compared with the prior art, the present invention has the following advantages:

[0022] (1) This invention combines phase-change liquid cooling technology with a micro-ribbed structure to effectively improve heat conduction and heat dissipation efficiency. The design of the heat dissipation cold plate optimizes the contact area between the coolant and the GPU core, and further enhances the heat dissipation effect through a hydrophilic or hydrophobic modified layer, adapting to different cooling requirements and extending the service life of the GPU.

[0023] (2) The various components of the present invention are fastened by screws to ensure a tight fit between the heat dissipation cold plate, GPU motherboard, cover plate, etc. In particular, the multiple fixing methods between the base plate and the cold plate ensure the overall strength and durability of the device during operation, and are not prone to loosening or displacement;

[0024] (3) The present invention uses high thermal conductivity materials such as copper, aluminum, and silicon carbide, which have good thermal conductivity, and the selection of cooling media is flexible and diverse (such as water, refrigerant, mineral oil, electronic fluorinated liquid, etc.), which can adapt to the heat dissipation requirements in different application scenarios;

[0025] (4) The present invention introduces phase change, which greatly improves the heat dissipation efficiency;

[0026] (5) The present invention is simple and easy to process and assemble. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0028] Figure 2 It is a schematic diagram of the explosion of the structure of the present invention;

[0029] Figure 3 Schematic diagram of the structure of the bottom plate of the present invention;

[0030] Figure 4 Schematic diagram of the structure of the flow channel distribution of the bottom plate in the present invention (four cases);

[0031] Figure 5 Schematic diagram of the sealing ring structure of the present invention;

[0032] Figure 6 This is a schematic diagram of the heat dissipation cold plate structure in the present invention;

[0033] Figure 7Schematic diagram of the formation of tiny rib structures (left: square, middle: parallelogram, right: triangle);

[0034] Figure 8 Schematic diagram of the micro-rib structure;

[0035] Figure 9 This is a schematic diagram of the GPU motherboard structure in the present invention;

[0036] Figure 10 Schematic diagram of the cover plate structure in the present invention;

[0037] Figure 11 This is a schematic diagram of the connection (welding) structure between the bottom plate and the heat dissipation cold plate in the present invention;

[0038] Figure 12 This is a cross-sectional view of the connection (welding) between the bottom plate and the heat dissipation cold plate in the present invention;

[0039] As shown in the figure, the numbers are as follows: 1-base plate; 2-sealing ring; 3-heat dissipation cold plate; 4-fastening screw; 5-GPU mainboard; 6-cover plate; 7-countersunk screw; 11-first threaded hole; 12-sealing groove; 13-second threaded hole; 14-cooling chamber; 15-liquid outlet; 16-liquid inlet; 21-first through hole; 31-first countersunk hole; 32-inner wall of cold plate; 33-micro-rib structure; 34-outer wall of cold plate; 331-solid structure of micro-rib; 332-mixed structure of micro-rib; 333-porous medium structure; 51-second through hole; 52-heat dissipation belt; 53-memory module; 54-GPU core; 61-second countersunk hole; 62-circular boss. DETAILED DESCRIPTION

[0040] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments. This embodiment is implemented based on the technical solution of the present invention, and provides a detailed implementation method and specific operation process, but the protection scope of the present invention is not limited to the following embodiments.

[0041] A high-power GPU phase-change liquid cooling radiator comprises a base plate 1, a GPU mainboard 5 and a cover plate 6 stacked in sequence;

[0042] The bottom plate 1 is provided with a sealing groove 12 and a cooling chamber 14 on one side thereof from outside to inside, and a liquid inlet 16 and a liquid outlet 15 connected to the cooling chamber 14 are provided on the side of the bottom plate 1.

[0043] The GPU phase-change liquid cooling radiator further includes a sealing ring 2 and a heat dissipation cold plate 3 . The sealing ring 2 is placed in the sealing groove 12 . The heat dissipation cold plate 3 abuts against the sealing groove 12 . The micro-rib column structure 33 provided on the heat dissipation cold plate 3 is located in the cooling chamber 14 .

[0044] In some embodiments of the present invention, the GPU motherboard 5 is provided with a heat dissipation belt 52, a memory module 53, and a GPU core 54 on a side near the base plate 1; the vertical projection of the micro-rib structure 33 completely covers the GPU core 54. In other words, the width of the area covered by the micro-rib structure is greater than or equal to the width of the integrated heat dissipation cover area of ​​the CPU.

[0045] In some embodiments of the present invention, there is a solid thermal conductive medium layer between the GPU core 54 and the heat dissipation cold plate 3, and the solid thermal conductive medium is silicone grease, heat dissipation tape, liquid metal, graphite or gasket; the heat dissipation tape 53 can also be silicone grease, heat dissipation tape or graphite.

[0046] In some embodiments of the present invention, the micro-rib structure 33 is composed of micro-ribs arranged in an array on the heat dissipation cold plate 3 .

[0047] In some embodiments of the present invention, the shape of the micro-ribs is a rectangle, a parallelogram, or a triangle, and the length of any side of the micro-ribs is 100 μm to 2000 μm.

[0048] Furthermore, the planar projection feature of the micro-rib column structure is an arbitrary polygon formed by the interlacing of multiple groups of parallel lines with the same spacing but different angles; the gap width of the micro-rib column structure depends on the line width of the parallel lines in the parallel line group, and the side length of the micro-rib column structure depends on the spacing of the parallel lines in the parallel line group; the present invention does not limit the shape of the micro-rib column structure, and the shape of the micro-rib column structure depends on the number of parallel line groups and the relative angle between the parallel line groups. For example, when the spacing between two groups of parallel line groups is the same and the relative angle is 90°, square ribs with arbitrary spin angles can be formed.

[0049] In some embodiments of the present invention, the surface of the micro-rib column is provided with a hydrophilic modification layer and / or a hydrophobic modification layer. The hydrophilic and hydrophobic modification of the surface of the micro-rib column structure can further increase the boiling rate of the working medium and improve the heat removal efficiency. The choice of hydrophilic and hydrophobic modification of the micro-rib column structure is selected according to the heat flux density of the specific working conditions: selecting hydrophobic modification under low heat flux density has a better heat transfer effect, and selecting hydrophilic modification under high heat flux density has a better heat transfer effect; this is because: generally speaking, the heat transfer coefficient obtained by selecting a hydrophilic surface under high heat flux density is large, and the heat transfer coefficient obtained by selecting a hydrophobic surface under low heat flux density is large.

[0050] In some embodiments of the present invention, the micro-rib pillars are solid pillars, solid pillars whose surface is partially covered with the first porous medium layer, solid pillars whose surface is completely covered with the first porous medium layer, mixed pillars with a partially solid structure and a partially porous structure, and porous pillars with a completely porous structure.

[0051] The pore size of the first porous medium is in the range of 0.1 μm to 800 μm, and the pore size of the porous structure is in the range of 0.1 μm to 800 μm.

[0052] Specifically, the micro-rib hybrid structure can be understood as a solid metal structure in which the lower part of the micro-rib is machined and the upper part is a porous structure processed by metal sintering or other methods; the porous medium structure can be understood as a porous metal structure in which all micro-ribs are processed by metal sintering, or a solid metal structure machined inside and a coated porous metal structure outside.

[0053] In some embodiments of the present invention, the heat dissipation cold plate 3 is covered with a second porous medium layer on one side close to the base plate 1. The thickness of the second porous medium layer is 0.01 to 10 mm, the porosity of the second porous medium is 5% to 99%, the pore size range is 0.1 μm to 800 μm, and the thickness in different positions or areas is adjusted differently according to design requirements.

[0054] In some embodiments of the present invention, the base plate 1 and the heat dissipation cold plate 3 are connected by welding, threading or snapping.

[0055] In some embodiments of the present invention, the liquid outlet 15 is located above the liquid inlet 16 , and the liquid outlet 15 and the liquid inlet 16 are located on the same side or opposite sides.

[0056] In some embodiments of the present invention, the height of the micro-rib structure 33 is recorded as H1, and the height of the heat exchange cavity formed by the heat dissipation cold plate 3 and the cooling chamber 14 on the base plate 1 is recorded as H2. The ratio of H1 / H2 is 0 to 1. When the ratio is 0, the upper end surface of the micro-rib structure can be in contact with the bottom surface of the cooling chamber.

[0057] In some embodiments of the present invention, the base plate is made of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic or silicon.

[0058] In some embodiments of the present invention, the heat dissipation cold plate is made of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic or silicon.

[0059] In some embodiments of the present invention, the cover plate is made of acrylic, metal or plastic; the sealing ring is made of fluoropolymer, rubber or plastic.

[0060] In some embodiments of the present invention, the material of the micro-rib structure is selected from solid copper, powdered copper, silver, aluminum, stainless steel, or graphene-reinforced metal composite material.

[0061] In some embodiments of the present invention, the thermal conductive material between the GPU core and the outer wall of the cold plate is silicone grease, heat dissipation tape, liquid metal, graphite or a gasket; the heat dissipation tape can also be silicone grease, heat dissipation tape or graphite.

[0062] In some embodiments of the present invention, the cooling medium introduced into the heat dissipation device when in use includes water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oils, nanofluids, transformer oils or electronic fluorinated liquids.

[0063] Example 1

[0064] like Figures 1 to 10 As shown, this embodiment provides a high-power GPU phase-change liquid cooling radiator, which includes a base plate 1, a sealing ring 2, a heat dissipation cold plate 3, a GPU motherboard 5, and a cover plate 6. The sealing ring 2 is pressed between the base plate 1 and the GPU motherboard, and the GPU motherboard 5 is pressed between the heat dissipation cold plate 3 and the cover plate 6.

[0065] The features of the base plate 1 include a first threaded hole 11, a sealing groove 12, a second threaded hole 13, a cooling chamber 14, a liquid outlet 15, and a liquid inlet 16; wherein, several first threaded holes 11 are distributed around and in the middle of the base plate 1; a cooling chamber 14 is opened in the middle and lower part of the base plate 1, a sealing groove 12 is opened in the upper part of the cooling chamber 14, and several second threaded holes 13 are distributed around it, and a liquid outlet 15 and a liquid inlet 16 are opened on the side close to the cooling chamber 14, and the liquid outlet 15 and the liquid inlet 16 are connected to the cooling chamber 14, and the size of the cooling chamber 14 can be any size smaller than the outer contour size of the base plate 1.

[0066] The sealing ring 2 is provided with a plurality of first through holes 21 around its periphery;

[0067] The heat dissipation cold plate 3 includes a first countersunk hole 31, a cold plate inner wall 32, a micro-rib structure 33, and a cold plate outer wall 34. The first countersunk holes 31 are distributed around the heat dissipation cold plate 3, and the micro-rib structure 33 is provided on the cold plate inner wall 32.

[0068] The GPU motherboard 5 includes second through holes 51, a heat dissipation belt 52, a memory module 53, and a GPU core 54. Several second through holes 51 are provided on the GPU motherboard 5. The heat dissipation belt 52, the memory module 53, and the GPU core 54 are distributed on the GPU motherboard 5. A heat dissipation belt 52 is attached directly above the memory module 53.

[0069] The cover plate 6 is characterized in that a plurality of second countersunk holes 61 and circular bosses 62 are distributed on the cover plate 6, the countersunk surface of the second countersunk holes 61 is directly opposite to the circular bosses 62, and the through-hole size of the second countersunk holes 61 is smaller than the size of the circular bosses 62;

[0070] The sealing ring 2 is installed in the sealing groove 12 and all the first through holes 21 are aligned with the corresponding second threaded holes 13; the heat dissipation cold plate 3 is firmly installed on the base plate 1 by fastening screws 4 through the first countersunk holes 31 to ensure good sealing between the heat dissipation cold plate 3 and the base plate 1;

[0071] When installing the GPU motherboard 5, ensure that the GPU core 54 surface is well bonded to the outer wall 34 of the cold plate after being coated with heat-conducting material, and at the same time ensure that the heat dissipation belt 53 is well bonded to the memory module 53 and the base plate 1;

[0072] The cover plate 6 is installed on the outermost side of the entire device by means of countersunk screws 7 passing through the second countersunk hole 61, the second through hole 51 and the first threaded hole 11. During installation, the circular boss 62 is ensured to fit well with the GPU mainboard 5.

[0073] The heat conducting material between the GPU core 54 and the outer wall of the cold plate 34 is silicone grease, heat dissipation tape, liquid metal, or graphite heat conducting sheet;

[0074] The heat dissipation belt 53 can also be made of silicone grease, graphite heat conductive sheet, heat dissipation tape or graphite. The selection of different thermal conductive materials enables the heat dissipation device to adapt to different usage scenarios and provide a flexible heat dissipation solution.

[0075] like Figure 4 As shown, the liquid inlet 16 in the base plate 1 is always located below the liquid outlet 15 when the entire radiator is installed and in use. The liquid inlet 16 and the liquid outlet 15 are located on the same side or on opposite sides. It can be understood that when the entire radiator is in operation, the liquid inlet 16 is always located below the liquid outlet 15 in the direction of gravity acting on the working medium.

[0076] The heat dissipation cold plate 3 is provided with a micro-rib structure 33, whose coverage area is rectangular. The length dimension of the coverage area of ​​the micro-rib structure 33 is greater than or equal to the length dimension of the integrated heat dissipation top cover area of ​​the GPU core 54, and the width dimension of the coverage area of ​​the micro-rib structure 33 is greater than or equal to the length dimension of the integrated heat dissipation top cover area of ​​the GPU core 54.

[0077] The surface of the micro-rib structure 33 is provided with a natural surface, a hydrophilic modification layer, and / or a hydrophobic modification layer. Hydrophilic and hydrophobic modification of the surface of the micro-rib structure can further increase the boiling rate of the working fluid and improve the heat removal efficiency. The choice of hydrophilic or hydrophobic modification of the micro-rib structure is based on the heat flux density of the specific working conditions: hydrophobic modification has a better heat transfer effect under low heat flux density, while hydrophilic modification has a better heat transfer effect under high heat flux density. This is because, generally speaking, the heat transfer coefficient obtained by selecting a hydrophilic surface under high heat flux density is large, while the heat transfer coefficient obtained by selecting a hydrophobic surface under low heat flux density is large.

[0078] like Figure 7As shown, the planar projection feature of the micro-rib structure 33 is an arbitrary polygon formed by the interlacing of multiple groups of parallel lines with the same spacing but different angles; the gap width of the micro-rib structure 33 depends on the line width of the parallel lines in the parallel line group, and the side length of the micro-rib structure 33 depends on the spacing of the parallel lines in the parallel line group; the present invention does not limit the shape of the micro-rib structure 33, and the shape of the micro-rib structure 33 depends on the number of parallel line groups and the relative angles between the parallel line groups. For example, when the spacing between the two groups of parallel line groups L1 and L2 is the same and the relative angle is 90°, square ribs with arbitrary spin angles can be formed.

[0079] like Figure 7 As shown, the size of the gap b of the micro-rib structure is 100 μm to 2000 μm, and the size of the side length a of the micro-rib structure is 100 μm to 2000 μm.

[0080] The micro-rib structure 33 can be a solid micro-rib structure 331, a micro-rib mixed structure 332, and a porous medium structure 333;

[0081] When the structure of the micro-rib structure 33 is a micro-rib mixed structure, the porous medium is coated on the surface of the solid structure, and its surface coverage is 0 to 100%. The position and thickness of different areas can be adjusted according to actual conditions; the pore size range of the porous medium is 0.1μm to 800μm.

[0082] The inner wall 32 of the cold plate can be covered with a porous medium layer, the thickness of the porous medium layer is 0.01 to 10 mm, the porosity of the porous medium is 5% to 99%, the pore size range is 0.1 μm to 800 μm, and the thickness at different positions or areas is adjusted differently according to design requirements.

[0083] The ratio of the height of the micro-rib structure 33 to the height of the heat exchange cavity formed by the inner wall 32 of the cold plate and the cooling chamber 14 on the bottom plate 1 is 0 to 1. When the ratio is 1, the upper end surface of the micro-rib structure 33 can fit the bottom surface of the cooling chamber 14.

[0084] The base plate 1 is made of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic or silicon;

[0085] The heat dissipation cold plate 3 is made of copper, aluminum, aluminum alloy, stainless steel, aluminum nitride, silicon carbide, gallium nitride, plastic or silicon;

[0086] The cover plate 6 is made of acrylic, glass, metal or plastic;

[0087] The sealing ring is made of fluorocarbon, rubber or plastic;

[0088] The material of the micro-rib structure 33 is selected from solid copper, powdered copper, silver, aluminum, stainless steel or graphene reinforced metal composite material, for example, Figure 8 The micro-rib structure 33 shown can be processed into a micro-rib solid structure 331, a micro-rib hybrid structure 332, and a porous medium structure 333 using appropriate processing methods as needed. The micro-rib hybrid structure 332 can be understood as a solid metal structure in which the lower portion of the micro-rib 33 is machined, and the upper portion is a porous structure processed by metal sintering or other methods. The porous medium structure 333 can be understood as a porous metal structure in which the micro-ribs 33 are entirely sintered, or a solid metal structure machined inside and a porous metal structure coated outside. Solid metal structures, due to their high thermal conductivity and stability, can quickly and efficiently conduct heat, ensuring uniform heat dissipation and mechanical strength of the heat sink, making them suitable for demanding heat dissipation applications. Sintered powder metal, on the other hand, utilizes its porous structure to increase surface area, improve heat exchange efficiency, and facilitate the flow of the cooling medium through the capillary effect. It is suitable for designs with complex geometries and weight-sensitive shapes, enhancing overall heat dissipation performance. The combination of solid metal and sintered powder metal can leverage their respective advantages to improve heat dissipation performance. Solid metal provides fast heat conduction and a stable structure, while sintered powder metal's porous structure increases heat dissipation surface area and promotes coolant circulation. The combination of the two achieves faster and more uniform heat dissipation, suitable for the cooling needs of high-performance equipment.

[0089] The cold plate inner wall 32 is a solid metal structure or a sintered metal structure.

[0090] The heat conducting material between the GPU core 54 and the outer wall of the cold plate 34 is silicone grease, heat dissipation tape, liquid metal, or graphite heat conducting sheet; the heat dissipation tape 53 can also be silicone grease, heat dissipation tape, or graphite heat conducting sheet.

[0091] The cooling medium introduced into the heat dissipation device when in use includes water, alcohols, ammonia, hydrocarbons, refrigerants, mineral oil, nanofluids, transformer oil or electronic fluorinated liquid.

[0092] Working Principle: First, install the heat sink cold plate 3 on the base plate 1 using the fastening screws 4. During installation, the sealing ring 2 needs to be installed between the heat sink cold plate 3 and the base plate 1 and the airtightness of the device needs to be checked through the liquid inlet 16 and the liquid outlet. After completion, apply thermal conductive material to the GPU core 54 and the memory module 53, and then connect the base plate 1, sealing ring 2, heat sink cold plate 3, GPU motherboard 5 and cover plate 6 into a whole using the countersunk screws 7. The liquid working medium enters the cooling chamber 14 through the liquid inlet 16 and fully combines with the micro-rib structure 33 to carry away the cooling working medium conducted from the GPU core 54 to the micro-rib structure 33. During the heat transfer process, the cooling working medium reaches its boiling point and changes phase into gaseous state, and is then discharged from the heat sink through the liquid outlet 15.

[0093] Example 2

[0094] See also Figures 1 to 12 This embodiment provides a high-density GPU phase-change liquid cooling radiator, comprising a base plate 1, a sealing ring 2, a heat dissipation cold plate 3, a GPU motherboard 5, and a cover plate 6. The sealing ring 2 is pressed between the base plate 1 and the GPU motherboard, and the GPU motherboard 5 is pressed between the heat dissipation cold plate 3 and the cover plate 6. The base plate 1 and the heat dissipation cold plate 3 can be connected by welding instead of threaded connection. Figure 11-12 When the base plate 1 and the heat dissipation cold plate 3 are connected by welding, the entire structure will no longer contain the three structures of the fastening screw 4, the second threaded hole 13 and the first through hole 3, and solder is applied between the sealing groove 12 and the inner wall 32 of the cold plate.

[0095] Compared with threaded connections, welding (such as brazing) has better sealing properties, can effectively prevent coolant leakage, improve heat dissipation efficiency, reduce thermal resistance, and ensure efficient heat transfer; the welded structure is stronger and has a stronger ability to withstand mechanical and thermal stress, avoiding loosening and failure during long-term use. At the same time, it makes the cold head design more compact, reduces maintenance requirements, and thus improves the reliability of the overall system.

[0096] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any other manner. Any person skilled in the art may utilize the above-disclosed technical content to modify or modify the present invention into equivalent embodiments. However, any simple modifications, equivalent variations, and modifications to the above embodiments that do not depart from the technical content of the present invention and are based on the technical essence of the present invention remain within the scope of protection of the present invention.

Claims

1. A high-power GPU phase-change liquid cooling radiator, characterized in that: It comprises a base plate (1), a GPU mainboard (5) and a cover plate (6) stacked in sequence; A sealing groove (12) and a cooling chamber (14) are sequentially provided on one side of the bottom plate (1) near the cover plate (6) from the outside to the inside, and a liquid inlet (16) and a liquid outlet (15) are provided on the side of the bottom plate (1) respectively connected to the cooling chamber (14); The GPU phase-change liquid cooling radiator further comprises a sealing ring (2) and a heat dissipation cold plate (3); the sealing ring (2) is placed in the sealing groove (12); the heat dissipation cold plate (3) abuts against the sealing groove (12); and a micro-rib column structure (33) provided on the heat dissipation cold plate (3) is located in the cooling chamber (14).

2. The high-power GPU phase-change liquid cooling radiator according to claim 1, characterized in that: A heat dissipation belt (52), a video memory module (53) and a GPU core (54) are provided on one side of the GPU mainboard (5) near the base plate (1); the vertical projection of the micro-rib column structure (33) completely covers the GPU core (54).

3. The high-power GPU phase-change liquid cooling radiator according to claim 1, characterized in that: A solid heat-conducting medium layer is provided between the GPU core (54) and the heat dissipation cold plate (3).

4. The high-power GPU phase-change liquid cooling radiator according to claim 1, characterized in that: The micro-rib structure (33) is composed of micro-ribs arranged in an array on the heat dissipation cold plate (3); the micro-ribs are in the shape of a rectangle, a parallelogram, or a triangle, and the length of any side of the micro-ribs is 100 μm to 2000 μm.

5. The high-power GPU phase-change liquid cooling radiator according to claim 4, characterized in that: The surface of the micro-rib is provided with a hydrophilic modification layer and / or a hydrophobic modification layer.

6. The high-power GPU phase-change liquid cooling radiator according to claim 4, characterized in that: The micro-ribbed columns are solid columns, solid columns with a surface partially covered by a first porous medium layer, solid columns with a surface completely covered by a first porous medium layer, mixed columns with a partially solid and partially porous structure, and porous columns with a completely porous structure.

7. The high-power GPU phase-change liquid cooling radiator according to claim 1, characterized in that: The heat dissipation cold plate (3) is covered with a second porous medium layer on one side close to the bottom plate (1); the thickness of the second porous medium layer is 0.01 to 10 mm; the porosity of the second porous medium is 5% to 99%; and the pore size range is 0.1 μm to 800 μm.

8. The high-power GPU phase-change liquid cooling radiator according to claim 1, characterized in that: The base plate (1) and the heat dissipation cold plate (3) are connected by welding, threading or snapping.

9. The high-power GPU phase-change liquid cooling radiator according to claim 1, characterized in that: The liquid outlet (15) is located below the liquid inlet (16) along the direction of gravity, and the liquid outlet (15) and the liquid inlet (16) are arranged on the same side or opposite sides.

10. The high-power GPU phase-change liquid cooling radiator according to claim 1, characterized in that: The height of the micro-rib structure (33) is recorded as H1, the height of the heat exchange cavity formed by the heat dissipation cold plate (3) and the cooling chamber (14) on the bottom plate (1) is recorded as H2, and the ratio of H1 / H2 is 0-1.

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