Heat dissipation method of first equipment, first equipment and second equipment

Abstract

The invention discloses a heat dissipation method of first equipment, the first equipment and second equipment, and the heat dissipation method of the first equipment comprises the steps: switching the power consumption of a processing unit of the first equipment from first power consumption to second power consumption based on the condition that the second equipment is in a target state, and enabling the second power consumption to be greater than the first power consumption; the first power consumption comprises the maximum power consumption of the heat dissipation device of the first equipment capable of supporting the operation temperature of the processing unit of the first equipment at the target temperature, and the operation temperature of the processing unit of the first equipment capable of being supported by the heat dissipation device of the first equipment is smaller than or equal to the target temperature; the second equipment comprises equipment capable of dissipating heat to the first equipment, and when the second equipment is in the target state, the second equipment can dissipate heat to the first equipment; under the condition of the second power consumption, the second equipment can support the processing unit of the first equipment to operate at the target temperature, or the heat dissipation device of the first equipment and the second equipment can jointly support the processing unit of the first equipment to operate at the target temperature.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a heat dissipation method for a first device, a first device, and a second device. Background Art

[0002] The processing unit of the device must take into account factors such as heat dissipation, performance, and device thinness, and the specifications of the processing unit are limited. It is not possible to select a processing unit with more suitable performance based on factors such as heat dissipation and device thinness, resulting in the performance of some processing units not being maximized. Summary of the Invention

[0003] The purpose of the embodiments of the present application is to provide a heat dissipation method for a first device, a first device, and a second device.

[0004] In a first aspect, this embodiment provides a heat dissipation method for a first device, including:

[0005] Based on the second device being in the target state, switching the power consumption of the processing unit of the first device from a first power consumption to a second power consumption, the second power consumption being greater than the first power consumption;

[0006] The first power consumption includes the maximum power consumption that the heat dissipation device of the first device can support when the operating temperature of the processing unit of the first device is at a target temperature, and the heat dissipation device of the first device can support when the operating temperature of the processing unit of the first device is less than or equal to the target temperature;

[0007] The second device includes a device capable of dissipating heat to the first device, and the second device being in the target state indicates that the second device is capable of dissipating heat to the first device;

[0008] Under the second power consumption condition, the second device can support the processing unit of the first device to operate at the target temperature, or,

[0009] The heat dissipation device of the first device and the second device can jointly support the processing unit of the first device to operate at a target temperature.

[0010] In some embodiments, based on the second device being in the target state, at least one selected from the following group:

[0011] If a preset magnetic field is detected between the second device and the first device, determining that the second device is in the target state;

[0012] If a preset magnetic field is detected between the second device and the first device, a first identification signal is generated; if a preset communication connection is detected between the second device and the first device, a second identification signal is generated; if the first identification signal and the second identification signal are received, it is determined that the second device is in the target state;

[0013] If it is detected that the distance between the second device and the first device is less than a preset distance, determining that the second device is in the target state;

[0014] If it is detected that the distance between the second device and the first device is less than the preset distance, a third identification signal is generated; if it is detected that the temperature of the target area of ​​the first device has a downward trend within the target time, or the temperature decrease rate of the target area of ​​the first device within the target time is detected, and the heat dissipation capacity of the second device is determined based on the decrease rate; if the third identification signal is received and the downward trend is within the preset first threshold range or the heat dissipation capacity is within the preset second threshold range, it is determined that the second device is in the target state.

[0015] In some embodiments, based on the second device being in the target state, switching the power consumption of the processing unit of the first device from the first power consumption to the second power consumption includes:

[0016] In response to the second device being in the target state, generating an instruction option corresponding to a heat dissipation mode; the heat dissipation mode corresponds to a second power consumption;

[0017] In response to a selection instruction corresponding to the instruction option, the power consumption of the processing unit of the first device is switched from the first power consumption to the second power consumption.

[0018] In some embodiments, including:

[0019] In response to the power consumption of the processing unit of the first device being the second power consumption, the first fan of the first device and the second fan of the second device are controlled to operate at a rotational speed in a heat dissipation mode corresponding to the selection instruction to dissipate heat from the processing unit of the first device, so that the processing unit of the first device operates at a target temperature.

[0020] In some embodiments, including:

[0021] In response to the power consumption of the processing unit of the first device being the second power consumption, controlling the first fan of the first device to operate at a first speed in the heat dissipation mode corresponding to the selection instruction, and controlling the second fan of the second device to operate at a second speed in the heat dissipation mode corresponding to the selection instruction;

[0022] The first speed is greater than a first preset speed, and the second speed is greater than a second preset speed;

[0023] The first preset speed is a speed of the first fan of the first device when the power consumption of the processing unit of the first device is the first power consumption;

[0024] The second preset rotation speed is the rotation speed of the second fan of the second device when the power consumption of the processing unit of the first device is the first power consumption.

[0025] In some embodiments, including:

[0026] In response to the second device being in the target state, detecting an air outlet position of a second fan of the second device;

[0027] If the air outlet position of the second fan of the second device is not located in the air inlet area of ​​the first device, adjust the air outlet position of the second fan of the second device so that the air outlet position of the second fan is located in the air inlet area of ​​the first device.

[0028] In some embodiments, switching the power consumption of a processing unit of a first device from a first power consumption to a second power consumption includes:

[0029] In response to the power consumption of the processing unit of the first device being the second power consumption, generating prompt information; the prompt information is selected from at least one of the following combinations:

[0030] a second power consumption of a processing unit of the electronic device, a rotational speed of a first fan of the first device, and a rotational speed of a second fan of the second device.

[0031] In some embodiments, the second device can dissipate heat to the first device in the following manner:

[0032] The second device cools the processing unit of the first device by dissipating heat to a target area of ​​the first device;

[0033] The second device dissipates heat directly to the processing unit of the first device.

[0034] In a second aspect, an embodiment of the present application provides a first device, including a memory and a processor, wherein the memory stores an executable program, and the processor executes the executable program to implement the following steps:

[0035] Based on the second device being in the target state, switching the power consumption of the processing unit of the first device from a first power consumption to a second power consumption, the second power consumption being greater than the first power consumption;

[0036] The first power consumption includes the maximum power consumption that the heat dissipation device of the first device can support when the operating temperature of the processing unit of the first device is at a target temperature, and the heat dissipation device of the first device can support when the operating temperature of the processing unit of the first device is less than or equal to the target temperature;

[0037] The second device includes a device capable of dissipating heat to the first device, and the second device being in the target state indicates that the second device is capable of dissipating heat to the first device;

[0038] Under the second power consumption condition, the second device can support the processing unit of the first device to operate at the target temperature, or,

[0039] The heat dissipation device of the first device and the second device can jointly support the processing unit of the first device to operate at a target temperature.

[0040] In a third aspect, an embodiment of the present application provides a second device, including a memory and a processor, wherein the memory stores an executable program, and the processor executes the executable program to implement the following steps:

[0041] Based on the second device being in the target state, enabling the first device to switch the power consumption of the processing unit of the first device from a first power consumption to a second power consumption, where the second power consumption is greater than the first power consumption;

[0042] The first power consumption includes the maximum power consumption that the heat dissipation device of the first device can support when the operating temperature of the processing unit of the first device is at a target temperature, and the heat dissipation device of the first device can support when the operating temperature of the processing unit of the first device is less than or equal to the target temperature;

[0043] The second device includes a device capable of dissipating heat to the first device, and the second device being in the target state indicates that the second device is capable of dissipating heat to the first device;

[0044] Under the second power consumption condition, the second device can support the processing unit of the first device to operate at the target temperature, or,

[0045] The heat dissipation device of the first device and the second device can jointly support the processing unit of the first device to operate at a target temperature.

[0046] In some embodiments, the second device is provided with a magnetic attraction component; or, the second device is provided with a magnetic attraction component and a wireless receiving module.

[0047] In some embodiments, including:

[0048] A support body, wherein the support body is provided with a control mainboard, a second fan and a target member; the second fan is capable of relative movement with the target member;

[0049] The control mainboard is electrically connected to the target part and the second fan respectively, and the control mainboard can control the relative position of the second fan and the target part, moving from a first position to a second position.

[0050] The second position indicates that the air discharged by the second fan can dissipate heat to the first device, and the first position is different from the second position. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 A schematic flow chart of a heat dissipation method for a first device provided in an embodiment of the present application;

[0052] Figure 2 A schematic flow chart of another heat dissipation method for a first device provided in an embodiment of the present application;

[0053] Figure 3A schematic diagram of the control mechanism principle of the first device provided in an embodiment of the present application;

[0054] Figure 4 A schematic top view of the layout of the second device provided in an embodiment of the present application;

[0055] Figure 5 A schematic side view of a second device provided in an embodiment of the present application;

[0056] Figure 6 A schematic diagram showing changes in the TDP power and temperature of a processing unit of a first device provided in an embodiment of the present application;

[0057] Figure 7 Schematic diagram of the thermal DTT (Dynamic Tuning Technology) setting of the first device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0058] Various aspects and features of the present application are described herein with reference to the accompanying drawings.

[0059] It should be understood that various modifications may be made to the embodiments of the present application. Therefore, the above description should not be considered as limiting, but merely as an example of an embodiment. Other modifications within the scope and spirit of the present application will occur to those skilled in the art.

[0060] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the present application and, together with the general description of the present application given above and the detailed description of the embodiments given below, serve to explain the principles of the present application.

[0061] These and other characteristics of the present application will become apparent from the following description of a preferred form of embodiment given as a non-limiting example with reference to the accompanying drawings.

[0062] It should also be understood that although the present application has been described with reference to certain specific examples, those skilled in the art will readily be able to implement many other equivalent forms of the present application.

[0063] The above and other aspects, features and advantages of the present application will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.

[0064] Specific embodiments of the present application will be described hereinafter with reference to the accompanying drawings; however, it should be understood that the embodiments described are merely examples of the present application and may be implemented in a variety of ways. Familiar and / or repetitive functions and structures are not described in detail to avoid obscuring the present application with unnecessary or redundant details. Therefore, the specific structural and functional details described herein are not intended to be limiting, but rather serve merely as a basis and representative basis for the claims to teach those skilled in the art to variously utilize the present application with substantially any suitable detailed structure.

[0065] This specification may use the phrases "in one embodiment," "in another embodiment," "in yet another embodiment," or "in other embodiments," which may all refer to one or more of the same or different embodiments according to the present application.

[0066] The processing unit of the device must take into account factors such as heat dissipation, performance, and device thinness, and the specifications of the processing unit are limited. It is not possible to select a processing unit with more suitable performance based on factors such as heat dissipation and device thinness, resulting in the performance of some processing units not being maximized.

[0067] For example, device 1 has a large heat dissipation space, which provides good heat dissipation for the processing unit and a 100% performance utilization rate for the processing unit. However, if device 1 is to be made thinner and lighter, the heat dissipation space will be reduced, and the heat dissipation for the processing unit will be worse. The performance utilization rate of the processing unit will drop to 60%, or it may be replaced by other processing units. However, it is difficult to maximize the utilization of other processing units based on the thinness of each device. It is difficult to select a processing unit with more suitable performance based on factors such as heat dissipation and device thinness, resulting in the processing unit's performance not being maximized.

[0068] For example, with the rapid development of AI (Artificial Intelligence) platform technology, the thin and light laptop market is facing unprecedented challenges. With the continuous increase in computing power and TDP (Thermal Design Power) requirements, most thin and light laptops have limited computing power, unable to fully utilize AI performance, and unable to meet user scenarios requiring higher computing power.

[0069] In addition to TDP limitations, heat dissipation is also a key factor limiting the AI ​​performance of thin and light laptops. Due to the design characteristics of thin and light laptops, the heat dissipation space is very limited. This makes it difficult for thin and light laptop processors (such as CPUs) to effectively dissipate heat when running high-load tasks. Prolonged operation may cause the processing unit to overheat, affecting performance and lifespan.

[0070] Taking laptops as an example, some solutions include:

[0071] (1) For ultra-thin laptops, due to their very limited heat dissipation space, there is no way to take performance factors into consideration. Therefore, some ultra-thin laptops do not have AI functions.

[0072] (2) Thin and light notebooks have a larger heat dissipation space than ultra-thin and light notebooks, but the TDP of their processing units can only be designed according to the lower limit required by AI (such as 12W), which cannot maximize AI performance;

[0073] (3) Increasing the system thickness of laptop computers. Implementing AI functions on some high-performance laptops does not necessarily mean taking into account both thinness and lightness.

[0074] To this end, the present application provides a heat dissipation method for a first device, which may be an electronic device, such as a laptop computer, a tablet computer, etc., which can maximize AI performance and solve heat dissipation problems while improving the performance of the processing unit of the first device (such as TDP, etc.).

[0075] The heat dissipation method of the first device of the present application is described in detail below with reference to the accompanying drawings. Figure 1 A schematic flow chart of a heat dissipation method for a first device provided in an embodiment of the present application is shown as follows: Figure 1 As shown, the heat dissipation method of the first device includes:

[0076] S100, based on the second device being in a target state, switching the power consumption of the processing unit of the first device from a first power consumption to a second power consumption, where the second power consumption is greater than the first power consumption;

[0077] The first power consumption includes the maximum power consumption that the heat dissipation device of the first device can support when the operating temperature of the processing unit of the first device is at a target temperature, and the heat dissipation device of the first device can support when the operating temperature of the processing unit of the first device is less than or equal to the target temperature;

[0078] The second device includes a device capable of dissipating heat to the first device, and the second device being in the target state indicates that the second device is capable of dissipating heat to the first device;

[0079] Under the second power consumption condition, the second device can support the processing unit of the first device to operate at the target temperature, or,

[0080] The heat dissipation device of the first device and the second device can jointly support the processing unit of the first device to operate at a target temperature.

[0081] The first device may be an electronic device, such as a thin and light notebook computer, a tablet computer, etc. The second device may be a heat dissipation device, such as a heat dissipation bracket, etc.

[0082] The second device being in the target state may indicate that the second device is able to dissipate heat to the first device. For example, the first device is located on the second device, i.e., the first device and the second device are in contact, and the second device is able to dissipate heat to the first device. Alternatively, the second device may be close to the first device, i.e., the first device and the second device are not in contact, but the distance between the first device and the second device is less than a preset distance, and the second device is able to dissipate heat to the first device.

[0083] The processing unit may refer to the computing and control core of the first device, and is the final execution unit for information processing and program execution. For example, the processing unit may include a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), an NPU (Neural Network Processing Unit), etc.

[0084] The first power consumption and the second power consumption can be actual power consumption or TDP (Thermal Design Power). For processors of the same series, the larger the TDP of the processing unit, the better the performance; the greater the power consumption, the better the performance.

[0085] In some embodiments, the target temperature may be a factory-set temperature or a safety specification temperature; it is understandable that the target temperatures of the processing units of different devices may be different or the same when leaving the factory; the target temperatures of the processing units of different devices may also be the safety specification temperatures of the processing units when leaving the factory, or they may be a specified temperature value defined by the device manufacturer based on other factors of the device (such as thinness, heat dissipation factors, etc.).

[0086] For example, in some possible cases, the first power consumption of this embodiment may be 12W, and the target temperature may be 85°C; the first power consumption may be the maximum power consumption of 12W when the first device operates at a temperature of 85°C; the second power consumption may be 30W, and the second power consumption is greater than the first power consumption. The second device may be able to support an operating temperature of 85°C. That is, if there is no second device, in this case, the heat dissipation device of the first device cannot support the device operating at 85°C when the power consumption is 30W, and the heat dissipation device of the first device can only support the device operating at 85°C when the power consumption is 12W. However, the present disclosure does not specifically limit the specific values ​​of the first power consumption and / or the second power consumption, that is, those skilled in the art can set or adjust them according to actual conditions. The above situation is only an illustrative illustration of which values ​​the first power consumption, second power consumption, and target temperature in this application can be applied, but is not limited to the situations described in the above embodiments.

[0087] The first power consumption (such as the first TDP) may be an upper limit configured for the first device, such as 12 W. That is, the maximum value to which the TDP of the first device can be adjusted based on factors such as heat dissipation, TDP, and thinness.

[0088] The second power consumption (eg, the second TDP) is greater than the first power consumption (first TDP), such as 15W, 18W, 25W, 30W, and the like.

[0089] The operating temperature refers to the actual temperature of the processing unit in the electronic device when it operates at the target power consumption after the heat is dissipated by the heat dissipation device.

[0090] The target temperature can be any temperature below the processor's specification temperature. For example, if the specification temperature is 85°C, the target temperature could be 50°C, 60°C, or similar. The processor's specification temperature is the highest temperature the processor can withstand without permanent damage during extended operation. Exceeding this temperature may damage the processor or degrade its performance.

[0091] The target temperature can also be a maximum temperature set for the device at the factory. This maximum temperature can be any temperature lower than the safety specification temperature; it can also be a temperature lower than a portion of the specification temperature. For example, because some devices require thinness and lightness, without additional heat dissipation support, the target temperature can be set lower.

[0092] The heat dissipation device of the first device can support the operating temperature of the processing unit of the first device to be less than or equal to the target temperature. That is, the heat dissipation device of the first device can support the operating temperature of the processing unit of the first device to always be below the specification temperature of the processing unit, ensuring normal operation of the processing unit.

[0093] When the first device has the second power consumption, the second device can support the processing unit of the first device to operate at the target temperature. It can be understood that when the TDP of the processing unit of the first device is the second TDP, the first device dissipates heat to the first device through the second device, so that the processing unit of the first device operates at any temperature below the specification temperature, so that the processing unit always maintains normal operation.

[0094] The heat dissipation device of the first device and the second device can jointly support the processing unit of the first device to operate at the target temperature. It can be understood that: the heat dissipation device of the first device and the second device jointly dissipate heat to the processing unit of the first device, so that the processing unit of the first device operates at any temperature below the specification temperature, so that the processing unit always maintains normal operation.

[0095] In an embodiment of the present application, based on the second device being in a target state, the power consumption of the processing unit of the first device is switched from a first power consumption to a second power consumption, and the second power consumption is greater than the first power consumption, that is, when the second device is in the target state, the power consumption (TDP) of the processing unit of the first device is increased, and the second device includes a device capable of dissipating heat to the first device. In the case of the second power consumption, the second device can support the processing unit of the first device to operate at a target temperature, or the heat dissipation device of the first device and the second device can jointly support the processing unit of the first device to operate at the target temperature, that is, the heat dissipation performance of the first device can be further improved by using the second device, so that the performance of the first device can break through the limitations supported by the heat dissipation device of the first device, further release the performance of the processing unit, and solve the heat dissipation problem at the same time.

[0096] That is, by utilizing the second device to further enhance the heat dissipation performance of the first device, the embodiment of the present application can increase the power consumption (TDP) of the processing unit of the first device while ensuring that the processing unit of the first device always operates at any temperature below the specification temperature, ensuring the normal operation of the processing unit, solving the heat dissipation problem, thereby maximizing the performance of the processing unit and enabling the first device to also possess AI computing capabilities. Moreover, by utilizing the second device to further enhance the heat dissipation performance of the first device, the heat dissipation space required for the first device itself can be reduced, making it thinner and achieving a weight reduction effect.

[0097] In some embodiments, based on the second device being in the target state, at least one selected from the following group:

[0098] If a preset magnetic field is detected between the second device and the first device, the second device is determined to be in the target state. The preset magnetic field may be formed between a magnetic field sensor of the first device and a magnetic attraction component of the second device. When the magnetic field is detected between the second device and the first device, the second device is determined to be in the target state. Optionally, the magnetic field sensor may be a Hall effect sensor, etc., and the magnetic attraction component may be a magnet, etc.

[0099] Optionally, the first device may be provided with a magnetic field sensor, and the second device may be provided with a magnetic attraction component. The first device detects whether a preset magnetic field exists between the second device and the first device via the magnetic field sensor and the magnetic attraction component. If the presence of the preset magnetic field is detected between the second device and the first device, the second device is determined to be in the target state, i.e., the first device is positioned on the second device. For example, if the first device is a laptop and the second device is a heat sink, the second device being in the target state indicates that the laptop is positioned on the heat sink.

[0100] If a preset magnetic field is detected between the second device and the first device, a first identification signal is generated; if a preset communication connection is detected between the second device and the first device, a second identification signal is generated; if the first identification signal and the second identification signal are received, it is determined that the second device is in the target state; wherein the first identification signal indicates that a preset magnetic field is present between the second device and the first device, and the second identification signal indicates that a preset communication connection is established between the second device and the first device.

[0101] Optionally, the first device may be provided with a magnetic field sensor and a wireless transmission module, and the second device may be provided with a magnetic attraction component and a wireless receiving module. The first device detects whether a preset magnetic field exists between the second device and the first device through the magnetic field sensor and the magnetic attraction component, and detects whether a preset communication connection has been established between the second device and the first device through the wireless transmission module and the wireless receiving module. If it is detected that a preset magnetic field exists between the second device and the first device, and a preset communication connection has been established between the second device and the first device, it is determined that the second device is in the target state.

[0102] Exemplarily, the wireless transmitting module may be a wireless Bluetooth transmitting module, and the wireless receiving module may be a wireless Bluetooth receiving module.

[0103] The preset communication connection may be a Bluetooth communication connection. Furthermore, the Bluetooth communication connection may be an encrypted Bluetooth communication connection, which can protect the security of data transmitted between the first device and the second device.

[0104] For example, the first device is a laptop computer and the second device is a heat dissipation bracket. If it is detected that the laptop computer is located on the heat dissipation bracket and a Bluetooth communication connection has been established between the laptop computer and the heat dissipation bracket, it is determined that the heat dissipation bracket is in the target state.

[0105] If it is detected that the distance between the second device and the first device is less than the preset distance, it is determined that the second device is in the target state; the preset distance refers to a preset threshold distance. If it is detected that the distance between the second device and the first device is less than the preset threshold distance, it is determined that the second device is in the target device.

[0106] Optionally, a distance measuring sensor may be provided on the first device. The first device detects via the distance measuring sensor whether the distance between the second device and the first device is less than a preset distance. If the distance between the second device and the first device is less than the preset distance, the first device is determined to be in a target state, i.e., the first device is positioned on the second device. For example, if the first device is a laptop computer and the second device is a heat sink, the second device being in the target state indicates that the laptop computer is positioned on the heat sink.

[0107] If it is detected that the distance between the second device and the first device is less than the preset distance, a third identification signal is generated; if it is detected that the temperature of the target area of ​​the first device has a downward trend within the target time, or the temperature decrease rate of the target area of ​​the first device within the target time is detected, and the heat dissipation capacity of the second device is determined based on the decrease rate; if the third identification signal is received and the downward trend meets the first preset condition or the heat dissipation capacity meets the second preset condition, it is determined that the second device is in the target state.

[0108] Optionally, the first device may be provided with a distance sensor and a temperature sensor. The first device detects, via the distance sensor, whether the distance between the second device and the first device is less than a preset distance, and detects, via the temperature sensor, whether the temperature of a target area of ​​the first device has a decreasing trend within a target time. If it is detected that the distance between the second device and the first device is less than the preset distance and the decreasing trend is within a preset first threshold range, then the second device is determined to be in the target state.

[0109] For example, the first device is a laptop computer and the second device is a heat dissipation bracket. If it is detected that the laptop computer is located on the heat dissipation bracket and the downward trend is within a preset first threshold range, it is determined that the heat dissipation bracket is in the target state.

[0110] Optionally, the first device may be provided with a distance sensor and a temperature sensor. The first device detects whether the distance between the second device and the first device is less than a preset distance via the distance sensor, and detects the rate of decrease in temperature of a target area of ​​the first device within a target time via the temperature sensor. The heat dissipation capacity of the second device is determined based on the rate of decrease. If it is detected that the distance between the second device and the first device is less than the preset distance and the heat dissipation capacity is within a preset second threshold range, the second device is determined to be in the target state.

[0111] The target area may be a processor area on a mainboard inside the first device.

[0112] The target time may be a preset period of time.

[0113] The downward trend may be a trend in which the temperature of the target area of ​​the first device continues to decrease within a target time.

[0114] The rate of decrease may refer to the magnitude of temperature change per unit time.

[0115] The heat dissipation capability may refer to the capability of lowering the temperature of a target area of ​​the first device to a preset temperature.

[0116] For example, the first device is a laptop computer and the second device is a heat dissipation bracket. If it is detected that the laptop computer is located on the heat dissipation bracket and the heat dissipation capacity is within a preset second threshold range, it is determined that the heat dissipation bracket is in the target state.

[0117] In some embodiments, see Figure 2 , based on the second device being in the target state, switching the power consumption of the processing unit of the first device from the first power consumption to the second power consumption, including:

[0118] S101, in response to the second device being in a target state, generating an instruction option corresponding to a heat dissipation mode; the heat dissipation mode corresponds to a second power consumption;

[0119] The instruction option is an option for receiving a corresponding instruction. For example, the instruction option can be a button option on a laptop screen. The user generates a corresponding instruction by triggering the button option.

[0120] For example, in response to the second device being in the target state, the first device may display a generated instruction option corresponding to the heat dissipation mode to the user via a pop-up window for the user to select, allowing the user to independently select the heat dissipation mode. The user may select the heat dissipation mode displayed in the pop-up window according to their needs. When the user triggers the instruction option, it indicates that the user has selected the heat dissipation mode displayed in the pop-up window, and the first device performs heat dissipation according to the heat dissipation mode selected by the user.

[0121] S102 : In response to a selection instruction corresponding to an instruction option, switch the power consumption of a processing unit of the first device from a first power consumption to a second power consumption.

[0122] Exemplarily, the first device switches the TDP of the processing unit of the first device from the first TDP to the second TDP in response to the selection instruction corresponding to the instruction option, and subsequently, the first device dissipates heat according to the heat dissipation mode selected by the user.

[0123] In some embodiments, the heat dissipation method of the first device further includes:

[0124] In response to the power consumption of the processing unit of the first device being a second power consumption, controlling the first fan of the first device and the second fan of the second device to operate at a rotational speed in the heat dissipation mode corresponding to the selection instruction to dissipate heat from the processing unit of the first device, so that the processing unit of the first device operates at a target temperature;

[0125] Among them, the speed of the first fan of the first device corresponding to the second power consumption is greater than the speed of the first fan of the first device corresponding to the first power consumption; the speed of the second fan of the second device corresponding to the second power consumption is greater than the speed of the second fan of the second device corresponding to the first power consumption.

[0126] For example, in response to a user's selection instruction, the first device switches the TDP of the processing unit of the first device from the first TDP (e.g., 12W) to the second TDP (e.g., 30W). Then, in response to the TDP of the processing unit of the first device being the second TDP, the first fan of the first device and the second fan of the second device are controlled to operate at a speed in the heat dissipation mode corresponding to the selection instruction to dissipate heat from the processing unit of the first device, so that the operating temperature of the processing unit of the first device is below the specification temperature (e.g., 85°C), as shown in FIG. Figure 6 shown.

[0127] In some embodiments, in combination with the following Table 1 and Figure 6 As shown, the serial numbers 1 to 5 in Table 1 are Figure 6 1 to 5 in the table correspond one to one.

[0128] In sequence number 1, the first device is located on the second device. The second device is not in the target state. The processor unit's TDP is 12W (first TDP). The corresponding first fan speed of the first device is 8000 / 8000 RPM. The second fan of the second device is not used. The noise level is 35dBA. The temperature of the processor unit is approximately 70°C.

[0129] In sequence number 2, the first device is located on the second device and no Bluetooth communication connection is established. The second device is not in the target state. The TDP of the processing unit is 12W (first TDP). The corresponding first fan speed of the first device is 8000 / 8000 RPM, and the second fan speed of the second device is 1200 / 1200 RPM. The noise level is 38dBA. The temperature of the processing unit has decreased.

[0130] In sequence number 3, the first device is located on the second device and a Bluetooth communication connection has been established. The second device is in the target state. The TDP of the processor unit is 30W (the second TDP). The corresponding first fan speed of the first device is 9300 / 9300 RPM, and the second fan speed of the second device is 2200 / 2200 RPM. The noise level is 40dBA. The temperature of the processor unit has increased slightly, but is below the specified temperature (e.g., 85°C).

[0131] In sequence number 4, the first device is located on the second device and no Bluetooth communication connection is established. The second device is not in the target state. The TDP of the processing unit is 12W (first TDP). The corresponding first fan speed of the first device is 8000 / 8000 RPM, and the second fan speed of the second device is 1200 / 1200 RPM. The noise level is 38dBA. The temperature of the processing unit has decreased.

[0132] In sequence number 1, the first device is located on the second device. The second device is not in the target state. The processor unit's TDP is 12W (first TDP). The corresponding first fan speed of the first device is 8000 / 8000 RPM. The second fan of the second device is not used. The noise level is 35dBA. The temperature of the processor unit is approximately 70°C.

[0133] Table 1: Relationship between fan speed and noise corresponding to the TDP of the processing unit in different states of the first device

[0134]

[0135]

[0136] In Table 1, the maximum noise level of the first device itself is set to 35dBA. The first device is equipped with a second device. The TDP of the first device's processor is 30W, and the maximum noise level at full load is 40dBA. 12W represents the first power consumption (first TDP), and 30W represents the second power consumption (second TDP). The first device can be a laptop, and the second device can be a heat sink.

[0137] Combine Figure 7 As shown, Figure 7 Schematic diagram of the thermal DTT (Dynamic Tuning Technology) setting of the first device provided in an embodiment of the present application.

[0138] In some embodiments, the thermal DTT setting logic may be as follows:

[0139] When the first device is detected as being on the second device and an encrypted Bluetooth communication connection has been established with the second device, DDT is activated to set OEM variable 5. Under OEM variable 5, PL1 Max (maximum long-term turbo power consumption) is set to 30,000mW, or 30W, and PL1 Min (minimum long-term turbo power consumption) is set to 30,000mW, or 30W. PL2 Power Limit (short-term turbo power consumption) is set to 37,000mW, or 37W. TCC Offset (adjustable temperature wall) is set to 0.

[0140] When the first device is detected as being on top of the second device and no encrypted Bluetooth communication connection has been established with the second device, DDT is activated to set OEM variable 0. Under OEM variable 0, PL1 Max (maximum long-term turbo power consumption) is set to 12000mW, or 12W, and PL1 Min (minimum long-term turbo power consumption) is set to 12000mW, or 12W. PL2 Power Limit (short-term turbo power consumption) is set to 37000mW, or 37W. TCC Offset (adjustable temperature wall) is set to 0.

[0141] In conjunction with Table 1, the following describes in detail the operation of the heat dissipation method for the first device provided in this embodiment. The first device may be a laptop computer, and the second device may be a heat dissipation bracket. The laptop computer may be equipped with a magnetic field sensor and a wireless transmitter module, while the heat dissipation bracket may be equipped with a magnetic attraction component and a wireless receiver module.

[0142] The laptop can detect whether there is a preset magnetic field between the laptop and the heat dissipation bracket through the magnetic field sensor and the magnetic attraction component, and can detect whether a Bluetooth communication connection has been established between the heat dissipation bracket and the laptop through the wireless transmitting module and the wireless receiving module.

[0143] If a preset magnetic field is detected between the heat sink bracket and the laptop (i.e., the laptop is on the heat sink bracket), and no Bluetooth communication connection is established between the heat sink bracket and the laptop, it can be determined that the heat sink bracket is not in the target state. The maximum TDP value that can be set for the laptop is 12W. The laptop can operate at a TDP of 12W. The user can choose to turn off the heat sink bracket fan to dissipate heat from the laptop's processing unit, or turn on the heat sink bracket fan to dissipate heat from the laptop's processing unit as needed, with a speed of 1200 / 1200 RPM.

[0144] If it is detected that there is a preset magnetic field between the heat dissipation bracket and the laptop computer, and a Bluetooth communication connection is established between the heat dissipation bracket and the laptop computer, it can be determined that the heat dissipation bracket is in the target state.

[0145] Then, in response to the heat dissipation bracket being in the target state, an instruction option corresponding to the heat dissipation mode is generated; the heat dissipation mode corresponds to the second TDP; in response to the selection instruction corresponding to the instruction option, the TDP of the processing unit of the laptop computer is switched from the first TDP (such as 12W) to the second TDP (such as 30W).

[0146] Then, in response to the TDP of the processing unit of the laptop being a second TDP (e.g., 30W), the fan of the laptop and the fan of the heat dissipation bracket are controlled to operate at a rotational speed in the heat dissipation mode corresponding to the selected instruction. As shown in Table 1, the fan of the laptop is controlled to operate at a rotational speed of 9300 / 9300 RPM and the fan of the heat dissipation bracket is controlled to operate at a rotational speed of 2200 / 2200 RPM to dissipate heat from the processing unit of the laptop, so that the operating temperature of the processing unit of the laptop is below the specification temperature (e.g., 85° C.).

[0147] Optionally, based on the second device being in the target state, switching the power consumption of the processing unit of the first device from the first power consumption to the second power consumption includes:

[0148] In response to the second device being in the target state, generating a selection interface displaying at least one heat dissipation mode and at least one instruction option;

[0149] In response to a selection instruction corresponding to an instruction option from a selection interface, switching the power consumption of a processing unit of the first device from a first power consumption to a second power consumption corresponding to the selection instruction;

[0150] The heat dissipation mode corresponds to the instruction option and the second power consumption.

[0151] Exemplarily, the first device is a laptop computer, and the second device is a heat dissipation bracket.

[0152] In response to the cooling bracket being in the target state, the laptop generates a selection interface displaying at least one cooling mode and at least one command option. The cooling modes and command options correspond one to one for the user to select. The user can select the cooling mode displayed on the display interface according to their needs. For example, the display interface displays multiple cooling modes and the command options corresponding to each cooling mode. Each cooling mode corresponds to a second TDP.

[0153] When the user triggers this command option, it indicates that the user has selected one of the multiple cooling modes displayed on the display interface, and the laptop computer is cooled according to the cooling mode selected by the user.

[0154] For example, the first power consumption (first TDP) is 12W, and the second power consumption (second TDP) is greater than 12W and less than 30W. The second power consumption can be 15W, 20W, 25W, 30W, etc. The display interface displays four cooling modes and the command options corresponding to each cooling mode. The four cooling modes correspond to the second TDP of 15W, 20W, 25W, and 30W, respectively. The speed of the fan of the laptop computer corresponding to each second TDP is different from the speed of the fan of the heat dissipation bracket. For example, the second TDP is 15W, and the speed of the fan of the corresponding laptop computer is 8200 / 8200, and the speed of the fan of the heat dissipation bracket is 1400 / 1400RPM. The second TDP is 20W, and the speed of the fan of the corresponding laptop computer is 8400 / 8400RPM, and the speed of the fan of the heat dissipation bracket is 1600 / 1600RPM. The second TDP is 25W, and the corresponding fan speed of the laptop is 9000 / 9000, and the fan speed of the heat dissipation bracket is 2000 / 2000RPM. The second TDP is 30W, and the corresponding fan speed of the laptop is 9300 / 9300RPM, and the fan speed of the heat dissipation bracket is 2200 / 2200RPM. The above is only an example to illustrate that the heat dissipation method of the first device provided in the embodiment of the present application can be set to a multi-stage heat dissipation mode, so that the user has a variety of options to achieve heat dissipation of the processing unit of the laptop and ensure that the temperature of the processing unit of the laptop is below the specification temperature during operation, which not only improves the AI ​​performance of the first device, but also solves the heat dissipation problem.

[0155] In some embodiments, as Figure 2 As shown, the heat dissipation method of the first device further includes:

[0156] S200, in response to the power consumption of the processing unit of the first device being a second power consumption, controlling a first fan of the first device to operate at a first speed in a heat dissipation mode corresponding to the selection instruction, and controlling a second fan of the second device to operate at a second speed in the heat dissipation mode corresponding to the selection instruction;

[0157] The first speed is greater than a first preset speed, and the second speed is greater than a second preset speed;

[0158] The first preset speed is a speed of the first fan of the first device when the power consumption of the processing unit of the first device is the first power consumption;

[0159] The second preset rotation speed is the rotation speed of the second fan of the second device when the power consumption of the processing unit of the first device is the first power consumption.

[0160] Exemplarily, in response to the power consumption of the processing unit of the first device being a second TDP (e.g., 30W), the first fan of the first device is controlled to operate at a first speed (e.g., 9300 / 9300 RPM) and the second fan of the second device is controlled to operate at a second speed (e.g., 2200 / 2200 RPM) to achieve heat dissipation of the processing unit of the first device.

[0161] By utilizing a second device to further enhance the heat dissipation performance of the first device, the embodiment of the present application can increase the power consumption (TDP) of the processing unit of the first device while ensuring that the processing unit of the first device always operates at any temperature below the specification temperature, ensuring the normal operation of the processing unit and solving the heat dissipation problem. This maximizes the performance of the processing unit and enables the first device to also possess AI computing capabilities. Furthermore, by utilizing a second device to further enhance the heat dissipation performance of the first device, the heat dissipation space required for the first device itself can be reduced, making it thinner and achieving a weight reduction effect.

[0162] In some embodiments, as Figure 2 As shown, the heat dissipation method of the first device further includes:

[0163] S301, in response to the second device being in the target state, detecting an air outlet position of a second fan of the second device;

[0164] S302: If the air outlet position of the second fan of the second device is not located in the air inlet area of ​​the first device, adjust the air outlet position of the second fan of the second device so that the air outlet position of the second fan is located in the air inlet area of ​​the first device.

[0165] Exemplarily, the first device is a laptop computer, the second device is a heat dissipation bracket, and the laptop computer is electrically connected to the heat dissipation bracket. The electrical connection may be a wired connection or a wireless connection.

[0166] For example, see Figure 2 and Figure 3If the second device is in the target state, the first device detects the air outlet position of the second fan of the second device in response to the second device being in the target state. If the air outlet position of the second fan of the second device is not located in the air inlet area of ​​the first device, the air outlet position of the second fan of the second device is adjusted so that the air outlet position of the second device is located in the air inlet area of ​​the first device. At the same time, the first fan of the first device is controlled to operate at the first speed (such as 9300 / 9300RPM) in the cooling mode corresponding to the selection instruction, and the second fan of the second device is controlled to operate at the second speed (such as 2200 / 2200RPM) in the cooling mode corresponding to the selection instruction, thereby improving the performance of the first device while achieving better heat dissipation. The second device is an AI second device, and the TDP of the processing unit of the first device is increased. The first device is an AI first device. If the second device is not in the target state, the second fan of the second device operates at the original fixed speed (such as 1200 / 1200). The second device is an ordinary second device.

[0167] For details, see Figure 5 The first device 1 can output a control signal to the control mainboard of the second device 2. The control mainboard of the second device 2 controls the second fan 23 to move along the track of the target part 22 based on the control signal, so that the air outlet position of the second fan 23 is located in the air inlet area of ​​the first device 1, so as to achieve better heat dissipation of the processing unit of the first device 1 and improve the heat dissipation effect of the processing unit of the first device 1.

[0168] In some embodiments, switching the power consumption of a processing unit of a first device from a first power consumption to a second power consumption includes:

[0169] In response to the power consumption of the processing unit of the first device being the second power consumption, a prompt message is generated; the prompt message is selected from at least one of the following combinations: the second power consumption of the processing unit of the electronic device, the rotational speed of the first fan of the first device, the rotational speed of the second fan of the second device, and the noise value.

[0170] For example, the first device is a laptop computer, and the second device is a heat dissipation bracket. The prompt information can be displayed to the user in a pop-up window or in other ways. The prompt information may include: the TDP value of the laptop computer's processing unit, such as 30W, the speed value of the laptop computer's fan, such as 9300 / 9300RPM. The speed of the heat dissipation bracket, such as 2200 / 2200RPM, and the noise value, such as 40dBA. The user can intuitively see some parameters of the selected heat dissipation mode, and can adjust the heat dissipation mode in time according to the parameters and the application scenario of the laptop computer.

[0171] In some embodiments, the second device can dissipate heat to the first device in the following manner:

[0172] The second device cools the processing unit of the first device by dissipating heat to a target area of ​​the first device. For example, the target area may be the housing of the first device's heat pipe. Water cooling can be used to cool the housing, thereby cooling the heat pipe and, in turn, the processing unit of the first device. Of course, other heat dissipation methods may also be used to cool the processing unit of the first device, and this application is not limited thereto.

[0173] The second device dissipates heat directly to the processing unit of the first device. For example, cold air is blown directly to the processing unit of the first device, or other heat dissipation methods may be used, which are not limited in this application.

[0174] Based on the same inventive concept, an embodiment of the present application provides a first device, which may be an electronic device such as a laptop computer. The first device may include a memory and a processor. The memory stores an executable program, and the processor executes the executable program to implement the following steps:

[0175] Based on the second device being in the target state, switching the power consumption of the processing unit of the first device from a first power consumption to a second power consumption, the second power consumption being greater than the first power consumption;

[0176] The first power consumption includes the maximum power consumption that the heat dissipation device of the first device can support when the operating temperature of the processing unit of the first device is at a target temperature, and the heat dissipation device of the first device can support when the operating temperature of the processing unit of the first device is less than or equal to the target temperature;

[0177] The second device includes a device capable of dissipating heat to the first device, and the second device being in the target state indicates that the second device is capable of dissipating heat to the first device;

[0178] Under the second power consumption condition, the second device can support the processing unit of the first device to operate at the target temperature, or,

[0179] The heat dissipation device of the first device and the second device can jointly support the processing unit of the first device to operate at a target temperature.

[0180] By utilizing a second device to further enhance the heat dissipation performance of the first device, the embodiment of the present application can increase the power consumption (TDP) of the processing unit of the first device while ensuring that the processing unit of the first device always operates at any temperature below the specification temperature, ensuring the normal operation of the processing unit and solving the heat dissipation problem. This maximizes the performance of the processing unit and enables the first device to also possess AI computing capabilities. Furthermore, by utilizing a second device to further enhance the heat dissipation performance of the first device, the heat dissipation space required for the first device itself can be reduced, making it thinner and achieving a weight reduction effect.

[0181] Based on the same inventive concept, see Figure 4 and Figure 5 As shown, an embodiment of the present application provides a second device 2, which can be a heat dissipation device, such as a heat dissipation bracket. The second device 2 includes a memory and a processor. The memory stores an executable program, and the processor executes the executable program to implement the following steps:

[0182] Based on the second device 2 being in the target state, the first device 1 is enabled to switch the power consumption of the processing unit of the first device 1 from the first power consumption to the second power consumption, where the second power consumption is greater than the first power consumption;

[0183] The first power consumption includes the maximum power consumption that the heat dissipation device of the first device 1 can support so that the operating temperature of the processing unit of the first device 1 is at a target temperature, and the heat dissipation device of the first device 1 can support so that the operating temperature of the processing unit of the first device 1 is less than or equal to the target temperature;

[0184] The second device 2 includes a device capable of dissipating heat to the first device 1 , and the second device 2 being in the target state indicates that the second device 2 is capable of dissipating heat to the first device 1 ;

[0185] Under the second power consumption condition, the second device 2 can support the processing unit of the first device 1 to operate at the target temperature, or,

[0186] The heat dissipation device of the first device 1 and the second device 2 can jointly support the processing unit of the first device 1 to operate at a target temperature.

[0187] By utilizing a second device to further enhance the heat dissipation performance of the first device, the embodiment of the present application can increase the power consumption (TDP) of the processing unit of the first device while ensuring that the processing unit of the first device always operates at any temperature below the specification temperature, ensuring the normal operation of the processing unit and solving the heat dissipation problem. This maximizes the performance of the processing unit and enables the first device to also possess AI computing capabilities. Furthermore, by utilizing a second device to further enhance the heat dissipation performance of the first device, the heat dissipation space required for the first device itself can be reduced, making it thinner and achieving a weight reduction effect.

[0188] In some embodiments, the second device 2 is provided with a magnetic attraction component (not shown); or, the second device 2 is provided with a magnetic attraction component and a wireless receiving module (not shown).

[0189] The first device 1 is provided with a magnetic field sensor (not shown); or, the first device 1 is provided with a magnetic field sensor and a wireless transmission module (not shown);

[0190] A preset magnetic field can be formed between the magnetic attraction component and the magnetic field sensor;

[0191] A preset communication connection can be established between the wireless transmitting module and the wireless receiving module.

[0192] The first device 1 uses a magnetic field sensor and a magnetic attraction component to detect whether a preset magnetic field exists between the second device 2 and the first device 1, thereby determining whether the first device 1 is located on the second device 2. The first device 1 uses a wireless transmission module and a wireless reception module to detect whether a preset communication connection has been established between the second device 2 and the first device 1. If the presence of a preset magnetic field between the second device 2 and the first device 1 is detected, and a preset communication connection has been established between the second device 2 and the first device 1, the second device 2 is determined to be in the target state.

[0193] In some embodiments, see Figure 4 and Figure 5 As shown, the second device 2 includes:

[0194] The support body 21 is provided with a control main board (not shown), a second fan 23 and a target member 22; the second fan 23 can move relative to the target member 22;

[0195] The control main board is electrically connected to the target part 22 and the second fan 23 respectively. The control main board can control the relative position of the second fan 23 and the target part 22, moving from the first position to the second position.

[0196] The second position indicates that the air discharged by the second fan 23 can dissipate heat to the first device 1 , and the first position is different from the second position.

[0197] The support body 21 may be used to support components of the first device 1 , and the first device 1 may be placed on the support body 21 .

[0198] Among them, the control mainboard can be the core hardware of the second device 2, responsible for processing the input signal (such as the signal output by the first device 1, or the signal triggered by the user, etc.) and outputting the control signal to drive the execution component (such as the second fan 23 of the second device 2) to work.

[0199] The target component can be a device capable of supporting, fixing, and guiding movement. For example, in this embodiment, the target component can support, fix, and guide the second fan 23 from a first position to a second position. The first position can be the initial position of the second fan 23. The second position can be the position of the second fan 23 after movement, which can be the air inlet area of ​​the first device 1.

[0200] The control board can control the second fan 23 to move from a first position to a second position on the target element 22. The first position is the initial position of the second fan 23, and the second position is the position of the second fan 23 after the movement. The second position can be the air inlet area of ​​the first device 1, so that the second fan 23 can dissipate heat to the first device 1. Of course, the second position can also be other areas, as long as the air outlet of the second fan 23 can dissipate heat to the first device 1. This application is not limited to this.

[0201] The first position and the second position may be the same or different.

[0202] For example, the first device 1 is placed on the support body of the second device 2. When the first device 1 detects that the air outlet of the second fan 23 of the second device 2 is already located in the air inlet area of ​​the first device 1, the first position and the second position are the same.

[0203] For example, the first device 1 is placed on the support body of the second device 2. When the first device 1 detects that the air outlet of the second fan 23 of the second device 2 is not located in the air inlet area of ​​the first device 1, the first device 1 outputs a control signal to the control main board of the second device 2 to control the second fan 23 to move from a first position to a second position on the target part 22, and the first position is different from the second position.

[0204] Optionally, the target member 22 may be a linear guide rail, and the second fan 23 is slidably connected to the linear guide rail.

[0205] The control main board is electrically connected to the linear guide rail and the second fan 23 respectively. The control main board can control the second fan 23 to move along the track of the linear guide rail so that the air outlet position of the second fan 23 is located in the air inlet area of ​​the first device 1, so as to achieve better heat dissipation of the processing unit of the first device 1 and improve the heat dissipation effect of the processing unit of the first device 1.

[0206] Optionally, the wireless transmitting module may be a wireless Bluetooth transmitting module, and the wireless receiving module may be a wireless Bluetooth receiving module. The preset communication connection may be a Bluetooth communication connection, and further, the Bluetooth communication connection may be an encrypted Bluetooth communication connection, which can protect the security of data transmitted between the first device 1 and the second device 2.

[0207] Optionally, the magnetic attraction component can be set at the center position of the second fan 23 of the second device 2, the magnetic field sensor can be set in the preset area of ​​the first device 1, and the center position of the second fan of the second device 23 can correspond to the preset area of ​​the first device 1.

[0208] Optionally, the wireless receiving module may be provided on a control mainboard of the second device 2 .

[0209] For example, the magnetic field sensor may be a Hall sensor, the wireless transmission module may be a Bluetooth wireless transmission module, the first device 1 may be a laptop computer, and the Hall sensor may be arranged on the D-shell surface of the laptop computer.

[0210] Exemplarily, the magnetic attraction component may be a magnet, and the magnet may be disposed at the center of the second fan of the second device 2 .

[0211] In some embodiments, combined Figure 4 and Figure 5 As shown, the second device 2 further includes foam 24;

[0212] The foam 24 is arranged between the support body 21 and the first device 1, and the foam 24 is arranged around the second fan 23 of the second device 2 to prevent the cold air generated by the second fan 23 of the second device 2 from leaking when working, so as to better dissipate the heat of the processing unit of the first device 1 and improve the heat dissipation effect of the processing unit of the first device 1.

[0213] The above embodiments are merely exemplary embodiments of the present application and are not intended to limit the scope of the present application. The scope of protection of the present application is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present application within the essence and scope of protection of the present application, and such modifications or equivalent substitutions shall also be deemed to fall within the scope of protection of the present application.

Claims

1. A heat dissipation method for a first device, comprising: Based on the second device being in the target state, switching the power consumption of the processing unit of the first device from a first power consumption to a second power consumption, where the second power consumption is greater than the first power consumption; The first power consumption includes a maximum power consumption that a heat dissipation device of the first device can support so that the operating temperature of the processing unit of the first device is at a target temperature, and the heat dissipation device of the first device can support so that the operating temperature of the processing unit of the first device is less than or equal to the target temperature; The second device includes a device capable of dissipating heat to the first device, and the second device being in the target state indicates that the second device is capable of dissipating heat to the first device; In the case of the second power consumption, the second device can support the processing unit of the first device to operate at the target temperature, or, The heat dissipation device of the first device and the second device can jointly support the processing unit of the first device to operate at the target temperature.

2. The method according to claim 1, wherein the second device being in the target state is selected from at least one of the following groups: If a preset magnetic field is detected between the second device and the first device, determining that the second device is in a target state; If a preset magnetic field is detected between the second device and the first device, generating a first identification signal; If it is detected that a preset communication connection has been established between the second device and the first device, generating a second identification signal; If the first identification signal and the second identification signal are received, determining that the second device is in the target state; If it is detected that the distance between the second device and the first device is less than a preset distance, determining that the second device is in the target state; If it is detected that the distance between the second device and the first device is less than a preset distance, generating a third identification signal; If it is detected that the temperature of the target area of ​​the first device has a downward trend within the target time, or if the temperature of the target area of ​​the first device decreases at a rate within the target time, and the heat dissipation capacity of the second device is determined based on the rate of decrease; If the third identification signal is received and the downward trend is within a preset first threshold range or the heat dissipation capability is within a preset second threshold range, it is determined that the second device is in the target state.

3. The method according to claim 1 , wherein, based on the second device being in the target state, switching the power consumption of the processing unit of the first device from the first power consumption to the second power consumption comprises: In response to the second device being in the target state, generating an instruction option corresponding to the heat dissipation mode; The heat dissipation mode corresponds to the second power consumption; In response to a selection instruction corresponding to the instruction option, the power consumption of the processing unit of the first device is switched from a first power consumption to a second power consumption.

4. The method according to claim 3, comprising: In response to the power consumption of the processing unit of the first device being a second power consumption, controlling the first fan of the first device to operate at a first speed in the heat dissipation mode corresponding to the selection instruction, and controlling the second fan of the second device to operate at a second speed in the heat dissipation mode corresponding to the selection instruction; The first speed is greater than a first preset speed, and the second speed is greater than a second preset speed; The first preset speed is a speed of the first fan of the first device when the power consumption of the processing unit of the first device is the first power consumption; The second preset rotation speed is the rotation speed of the second fan of the second device when the power consumption of the processing unit of the first device is the first power consumption.

5. The method according to claim 1, switching the power consumption of the processing unit of the first device from a first power consumption to a second power consumption, comprising: generating prompt information in response to the power consumption of the processing unit of the first device being the second power consumption; The prompt information is selected from at least one of the following combinations: The second power consumption of the processing unit of the electronic device, the rotation speed of the first fan of the first device, and the rotation speed of the second fan of the second device.

6. The method according to claim 1, wherein the second device is capable of dissipating heat to the first device in a manner comprising: The second device cools down the processing unit of the first device by dissipating heat to a target area of ​​the first device; The second device directly dissipates heat to the processing unit of the first device.

7. A first device comprising a memory and a processor, wherein the memory stores an executable program, and the processor executes the executable program to implement the following steps: Based on the second device being in the target state, switching the power consumption of the processing unit of the first device from a first power consumption to a second power consumption, where the second power consumption is greater than the first power consumption; The first power consumption includes a maximum power consumption that a heat dissipation device of the first device can support so that the operating temperature of the processing unit of the first device is at a target temperature, and the heat dissipation device of the first device can support so that the operating temperature of the processing unit of the first device is less than or equal to the target temperature; The second device includes a device capable of dissipating heat to the first device, and the second device being in the target state indicates that the second device is capable of dissipating heat to the first device; In the case of the second power consumption, the second device can support the processing unit of the first device to operate at the target temperature, or, The heat dissipation device of the first device and the second device can jointly support the processing unit of the first device to operate at the target temperature.

8. A second device comprising a memory and a processor, wherein the memory stores an executable program, and the processor executes the executable program to implement the following steps: Based on the second device being in the target state, enabling the first device to switch the power consumption of the processing unit of the first device from a first power consumption to a second power consumption, where the second power consumption is greater than the first power consumption; The first power consumption includes a maximum power consumption that a heat dissipation device of the first device can support so that the operating temperature of the processing unit of the first device is at a target temperature, and the heat dissipation device of the first device can support so that the operating temperature of the processing unit of the first device is less than or equal to the target temperature; The second device includes a device capable of dissipating heat to the first device, and the second device being in the target state indicates that the second device is capable of dissipating heat to the first device; In the case of the second power consumption, the second device can support the processing unit of the first device to operate at the target temperature, or, The heat dissipation device of the first device and the second device can jointly support the processing unit of the first device to operate at the target temperature.

9. The second device according to claim 8, The second device is provided with a magnetic attraction component; or, the second device is provided with a magnetic attraction component and a wireless receiving module.

10. The second device according to claim 9, comprising: A support body, wherein the support body is provided with a control mainboard, a second fan and a target member; The second fan is capable of relative movement with the target part; The control mainboard is electrically connected to the target part and the second fan respectively, and the control mainboard can control the relative position of the second fan and the target part, moving from a first position to a second position. The second position indicates that the air discharged by the second fan can dissipate heat to the first device, and the first position is different from the second position.

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