Pressure testing method, device and equipment for electronic system and storage medium

Abstract

The invention discloses an electronic component pressure testing method and device of an electronic system, equipment and a storage medium, and relates to the technical field of computers. The method comprises the steps of obtaining a to-be-tested electronic component of an electronic system; obtaining the number of available processor threads of the electronic system; generating a random pressure value according to the running state data of the electronic component in the electronic system; applying a random pressure value to the to-be-tested electronic component through the processor thread, and executing a pressure test on the to-be-tested electronic component; and obtaining a system log of the electronic system and a controller log of the electronic system, and determining a test result corresponding to the to-be-tested electronic component according to the system log of the electronic system and the controller log of the electronic system. By implementing the pressure test method, device and equipment and the storage medium, the extreme pressure load state of the electronic system is simulated through the generated random pressure value, the performance of the electronic system is tested, and the situation that a user encounters the extreme load state in the using process, and consequently the electronic system fails is avoided.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and in particular to a stress testing method, device, equipment and storage medium for an electronic system. Background Art

[0002] During actual operation, servers face various unexpected load conditions. Extreme loads can cause server downtime or device connectivity loss, resulting in the server failing to operate properly under these extreme load conditions. However, the existing test items in pre-delivery factory testing fail to effectively simulate the extreme load conditions faced by servers during actual operation, making it difficult to fully verify the server's ability to operate properly under these conditions. Summary of the Invention

[0003] The present application provides a method, apparatus, device and storage medium for stress testing of an electronic system, which at least solves the problem that it is difficult to fully cover extreme pressure load test conditions during factory stress testing of electronic systems.

[0004] In a first aspect, the present application provides a method for stress testing electronic components of an electronic system, comprising:

[0005] Obtaining an electronic component to be tested from an electronic system;

[0006] Obtaining the number of available processor threads of an electronic system;

[0007] generating a random pressure value according to the operating status data of any electronic component in the electronic system;

[0008] Applying random stress values ​​to the electronic component to be tested by a processor thread to perform a stress test on the electronic component to be tested, wherein the maximum value of the processor thread is the number of available processor threads;

[0009] A system log of the electronic system and a controller log of the electronic system are obtained, and a test result corresponding to the electronic component to be tested is determined according to the system log of the electronic system and the controller log of the electronic system.

[0010] In a second aspect, the present application further provides a device for pressure testing electronic components of an electronic system, comprising:

[0011] An electronic component acquisition module, used to acquire the electronic component to be tested of the electronic system;

[0012] A thread acquisition module, used to obtain the number of available processor threads of the electronic system;

[0013] A random generation module, used to generate a random pressure value according to the operating status data of any electronic component in the electronic system;

[0014] a pressure release module, configured to apply a random pressure value to the electronic component to be tested through a processor thread to perform a pressure test on the electronic component to be tested, wherein the maximum value of the processor thread is the number of available processor threads;

[0015] The result determination module is used to obtain the system log of the electronic system and the controller log of the electronic system, and determine the test result corresponding to the electronic component to be tested according to the system log of the electronic system and the controller log of the electronic system.

[0016] In a third aspect, the present application further provides a computer device comprising a memory, a processor, and an electronic system electronic component stress testing program stored in the memory and executable on the processor. When the processor executes the electronic system electronic component stress testing program, the electronic system electronic component stress testing method described in the first aspect is implemented, comprising:

[0017] Obtaining an electronic component to be tested from an electronic system;

[0018] Obtaining the number of available processor threads of an electronic system;

[0019] generating a random pressure value according to the operating status data of any electronic component in the electronic system;

[0020] Applying random stress values ​​to the electronic component to be tested by a processor thread to perform a stress test on the electronic component to be tested, wherein the maximum value of the processor thread is the number of available processor threads;

[0021] A system log of the electronic system and a controller log of the electronic system are obtained, and a test result corresponding to the electronic component to be tested is determined according to the system log of the electronic system and the controller log of the electronic system.

[0022] In a fourth aspect, the present application further provides a computer-readable storage medium having stored thereon a stress test program for electronic components of an electronic system. When the stress test program for electronic components of an electronic system is executed by a processor, the stress test method for electronic components of an electronic system described in the first aspect is implemented, including:

[0023] Obtaining an electronic component to be tested from an electronic system;

[0024] Obtaining the number of available processor threads of an electronic system;

[0025] generating a random pressure value according to the operating status data of any electronic component in the electronic system;

[0026] Applying random stress values ​​to the electronic component to be tested by a processor thread to perform a stress test on the electronic component to be tested, wherein the maximum value of the processor thread is the number of available processor threads;

[0027] A system log of the electronic system and a controller log of the electronic system are obtained, and a test result corresponding to the electronic component to be tested is determined according to the system log of the electronic system and the controller log of the electronic system.

[0028] In a fifth aspect, the present application further provides a computer program product, including a computer program. When the computer program is executed by a processor, the method for stress testing electronic components of an electronic system according to the first aspect is implemented, including:

[0029] Obtaining an electronic component to be tested from an electronic system;

[0030] Obtaining the number of available processor threads of an electronic system;

[0031] generating a random pressure value according to the operating status data of any electronic component in the electronic system;

[0032] Applying random stress values ​​to the electronic component to be tested by a processor thread to perform a stress test on the electronic component to be tested, wherein the maximum value of the processor thread is the number of available processor threads;

[0033] A system log of the electronic system and a controller log of the electronic system are obtained, and a test result corresponding to the electronic component to be tested is determined according to the system log of the electronic system and the controller log of the electronic system.

[0034] The beneficial effects of the technical solution provided by the embodiments of the present application are: by implementing a stress testing method, device, equipment and storage medium for an electronic system provided by the embodiments of the present application, by generating random pressure values, the extreme pressure load state of the electronic system is simulated, and the performance of the electronic system is tested under this state, thereby avoiding users encountering extreme load states during use, causing the electronic system to crash or lose connection with a certain electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0036] Figure 1 This is a schematic diagram of a stress testing method for an electronic system provided in an embodiment of the present application;

[0037] Figure 2 This is a schematic diagram of a processing sample curve provided by an embodiment of the present application;

[0038] Figure 3is a schematic diagram of a smoothed processed sample curve provided in an embodiment of the present application;

[0039] Figure 4 Schematic diagram of a pressure testing device for an electronic system provided in an embodiment of the present application;

[0040] Figure 5 This is a schematic diagram of a computer device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0041] To make the purpose, technical solutions, and advantages of this application more clear, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0042] Unless otherwise defined, technical or scientific terms used in this disclosure should have the ordinary meanings understood by persons of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar expressions used in this disclosure do not denote any order, quantity, or importance, but are simply used to distinguish between different components. Similarly, terms such as "a," "an," or "the" do not denote a quantitative limitation, but rather indicate the presence of at least one. The numbers in the drawings in this specification merely distinguish between various functional electronic components or modules and do not indicate a logical relationship between the electronic components or modules. Terms such as "include" or "comprising" mean that the element or object preceding the term encompasses the elements or objects listed following the term, and their equivalents, without excluding other elements or objects. Terms such as "connected" or "connected" are not limited to physical or mechanical connections but may include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0043] Hereinafter, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Note that, in the accompanying drawings, the same reference numerals are given to components having substantially the same or similar structures and functions, and repeated descriptions thereof will be omitted.

[0044] In view of the problem in the prior art that the test environment cannot fully cover the extreme pressure load test conditions during factory pressure testing of electronic systems, this application provides the following implementation methods:

[0045] In some embodiments, as Figure 1As shown, a method for stress testing electronic components of an electronic system includes:

[0046] In a first aspect, the present application provides a method for stress testing electronic components of an electronic system, comprising:

[0047] S100: Acquire an electronic component to be tested of an electronic system;

[0048] S200: Obtaining the number of available processor threads of the electronic system;

[0049] S300: Generate a random pressure value according to the operating status data of any electronic component in the electronic system;

[0050] S400: applying a random stress value to the electronic component to be tested through a processor thread to perform a stress test on the electronic component to be tested, wherein the maximum value of the processor thread is the number of available processor threads;

[0051] S500: Obtaining a system log of the electronic system and a controller log of the electronic system, and determining a test result corresponding to the electronic component to be tested according to the system log of the electronic system and the controller log of the electronic system.

[0052] An electronic system is a collection of interconnected electronic components that work together to perform specific functions. A server is an example of an electronic system. The main electronic components in a server include a central processing unit (CPU), memory, hard drive / solid-state drive (HDD), power supply unit (PSU), motherboard, network interface card (NIC), cooling system, and graphics processing unit (GPU).

[0053] Typically, before a server leaves the factory, the entire machine and its main electronic components need to be stress-tested to simulate the load conditions encountered by users as much as possible, to detect abnormal operating conditions that cause server crashes or disconnections of certain devices, and to investigate and debug the corresponding anomalies, thereby preventing abnormal server operation during user use.

[0054] The electronic component to be tested may be one or more of the aforementioned central processing unit, memory, hard disk drive / solid state drive, power supply unit, motherboard, network interface card, cooling system and graphics processing unit, and is not limited in this application.

[0055] Available processor threads refer to the idle processor threads that are unused before stress testing begins. Typically, stress loads are applied to the electronic component under test using available processor threads. Therefore, the number of available processor threads determines the maximum stress load that can be applied to the electronic component under test during testing.

[0056] System logs primarily record the behavior and status of the server operating system and the applications running on it. They typically include the following: startup and shutdown records, application errors, kernel messages, user login information, service status changes, hardware warnings and errors, security events, and permission changes.

[0057] Controller logs primarily record the server's physical health status data, typically including the following: temperature readings, fan speeds, power status, hardware failures, remote management operations, firmware updates, environmental alerts, and network connection status.

[0058] By analyzing the server's system log and controller log, you can identify any abnormalities in the server's electronic components. These two logs provide different levels of information, and when combined, they can comprehensively assess the server's status and help locate problems.

[0059] Executing the above steps once (steps S300-S500) completes a stress test of the electronic component under test based on the random pressure value. Preferably, repeating the above steps S300-S500 can achieve multiple random pressure values ​​to stress test the electronic component under test. The more times this is performed, the more stress conditions are covered, making it easier to test the server operating status under extreme load conditions. During a typical test, the above steps S300-S500 can be repeated continuously for up to 48 hours to meet testing requirements.

[0060] By implementing the above-mentioned stress testing method for electronic systems, the extreme stress load state of the electronic system is simulated by generating random stress values, and the performance of the electronic system is tested under this state. Due to the randomness of the generation of random stress values, it can cover the load stress state more comprehensively than fixed test scenarios. Even uncommon extreme load conditions can be simulated during the test process. In this way, the load state of the electronic system can be simulated more comprehensively, and then the electronic system can be debugged according to the test results, avoiding the situation where the user encounters extreme load conditions during use after delivery, causing the electronic system to crash or lose connection with an electronic component.

[0061] Random numbers, as the source of random pressure values, are mainly obtained in the following two ways: the first is generated by an external device, and the random numbers generated by the external device are obtained through a data transmission system; the second is generated internally. To obtain the random numbers generated by the external device, it is necessary to obtain the random numbers through the communication system. In this way, the accurate transmission of the random numbers involves the reliability of the communication system, and the processing of the random numbers requires waiting for the transmission time. The random numbers generated internally usually use the data obtained by the sensors in the electronic system as an entropy source and convert them into random numbers. However, due to the high similarity of sensor data under a certain load state of the server, the random numbers generated in this way have poor security and are vulnerable to attacks. Therefore, in the embodiment of the present application, the background noise during the operation of the electronic system is used as the entropy source of random numbers. Since the repeatability of the noise is poor and it is difficult to be attacked, the random numbers generated with noise as the entropy source are more secure.

[0062] Specifically, S300: generating a random pressure value includes:

[0063] S310: Acquire operating status data of any electronic component in the electronic system;

[0064] S320: Determine processing sample data corresponding to the electronic system according to the operating status data;

[0065] S330: Fitting the processed sample data to obtain a fitting curve corresponding to the processed sample data;

[0066] S340: determining an entropy source based on the operating status data and the processed sample data, wherein the entropy source is used to generate a random pressure value for the electronic system;

[0067] S350: Generate a random pressure value for the electronic system based on the entropy source.

[0068] Preferably, before S310: obtaining the operating status data of any electronic component in the electronic system, the method further includes:

[0069] S301: Setting at least one preset load value of the electronic system, wherein the preset load value corresponds to an operating state of the electronic system;

[0070] S302: Obtain operating state data of the electronic system operating in a load state corresponding to any one of at least one preset load value as state sample data.

[0071] Specifically, S302: obtaining operating state data of the electronic system operating under a load state corresponding to any one of at least one preset load value as state sample data, including:

[0072] A cyclic sampling process is performed until the operating status data corresponding to any preset load value of at least one preset load value is obtained, and the cyclic sampling process includes:

[0073] S3021: Setting the load level of the electronic system to a load level corresponding to any unsampled preset load value;

[0074] S3022: Waiting for the electronic system to operate stably at the preset load value;

[0075] S3023: Acquire a monitoring value from a sensor of any electronic component in the electronic system as operating status data corresponding to a preset load value.

[0076] In the following, the sampling process is described with the server as the electronic system and the central processing unit as the electronic component. Under each load state of the central processing unit, the temperature data of the central processing unit is obtained at a preset frequency; for example, under the load states of 25%, 50%, and 75%, the dimension data of the central processing unit is obtained at a frequency of 1 time per second. Here, the collection of temperature data is taken as an example, and parameters such as the input voltage and input current of the central processing unit can also be collected, which is not limited in this application. The sampled electronic component is also not limited to the central processing unit. For example, the collection of power supply output voltage data can be carried out under different power supply load states. Increasing the power supply power can be achieved by increasing the power of the central processing unit, fan power, hard disk power, etc., thereby increasing the power consumption of the entire machine. Generally, real-time sampling requires waiting for the server to stabilize before data collection. Indicatively, data collection is performed after the server maintains a certain load state for 5 minutes.

[0077] Specifically, S320: determining the processing sample data corresponding to the electronic system according to the operating status data, including:

[0078] S321: Determine the type of the running status data according to the source of the running status data;

[0079] S322: Obtaining the actual load value of the electronic system;

[0080] S323: Match the operating status data corresponding to the closest preset load value in the status sample data with the actual load value as the processing sample data.

[0081] The type of operating status data and the electronic component to which the operating status data corresponds can be determined based on the type of sensor acquiring the data and the electronic component monitored by the sensor. For example, if the sensor acquiring the data is a CPU temperature sensor, the type of operating status data is temperature, and the electronic component to which the data corresponds is the CPU.

[0082] Specifically, S330: fitting the processed sample data to obtain a fitting curve corresponding to the processed sample data includes:

[0083] S331: Connecting adjacent data points at sampling times in the processed sample data to obtain a processed sample curve;

[0084] S332: Determine the extreme value points in the sample curve;

[0085] S333: Divide and process the sample data according to the extreme points to obtain at least one neighborhood curve;

[0086] S334: performing a smoothing process on at least one neighborhood curve until a neighborhood smooth curve corresponding to any neighborhood curve is obtained;

[0087] S335: splicing the neighborhood smooth curves to obtain a smooth curve of the processed sample curve;

[0088] The step of performing smoothing on any one of the at least one neighborhood until obtaining a neighborhood smooth curve corresponding to any neighborhood curve includes:

[0089] S3341: Obtain any neighborhood curve that has not been smoothed;

[0090] S3342: Copy neighborhood curve;

[0091] S3343: splicing the copied neighborhood curve and the original neighborhood curve to the curve to be transformed that is connected at the first position;

[0092] S3344: According to the following formula:

[0093]

[0094] in:

[0095]

[0096] Convert the curve to be transformed into a smooth periodic curve, where f(t) is a smooth periodic curve, a0 is a constant term coefficient, and a n is the cosine function coefficient, b n is the coefficient of the sine function, n is an integer, t0 is the starting time of integration, T is the period, and ω is the angular frequency corresponding to the period T;

[0097] S3345: intercepting a period in the smooth periodic curve as a neighborhood smooth curve of the corresponding neighborhood curve.

[0098] Specifically, S340: determining an entropy source based on the operating status data and the processed sample data, wherein the entropy source is used to generate a random pressure value for the electronic system, including:

[0099] The entropy source is determined based on the following formula:

[0100] E S (t) = S(t) - g(t),

[0101] Among them, E S (t) represents the entropy source, which is a function of time t, S(t) represents the sampling curve obtained by connecting the sampling points, which is a function of time t, and g(t) is the smoothed post-processing sample curve, which is a function of time t.

[0102] Extreme points refer to maximum or minimum points. The types of extreme points used to divide neighborhoods are the same. In principle, neighborhoods are divided by maximum points, or by minimum points. Figure 2 Part (a) shows a curve of the change of current over time. After dividing the neighborhood by the minimum value, the results are as follows: Figure 2 As shown in part (b).

[0103] After splicing any neighborhood, a periodic function image is formed. Since the value forming this image comes from the monitoring value of the sensor, the monitoring value cannot be infinite. According to:

[0104]

[0105] After the transformation, a smoothed image of the periodic image generated by the neighborhood can be obtained; a period in the smoothed image is taken as the transformed image of the neighborhood; the transformed images of each neighborhood are spliced ​​together to obtain the smoothed post-processing sample curve g(t) of the sampling data, as shown in Figure 3 The smoothing process of the sampled data can also use the fft function of the numpy module in Python, which is not limited in this application.

[0106] S350: Generate a random pressure value for the electronic system based on the entropy source, specifically including:

[0107] S351: converting the entropy source into a binary number to obtain a binary entropy source;

[0108] S352: Fill the binary entropy source so that its bit number reaches a preset number of bits to obtain the entropy source to be divided into blocks;

[0109] S353: Acquire and initialize at least one register for generating a random pressure value;

[0110] S354: Divide the entropy source to be divided into blocks according to the number of at least one register, and process the divided entropy source to be divided one by one by the at least one register to obtain at least one data to be spliced;

[0111] S355: Splicing the data to be spliced ​​to obtain a random pressure value.

[0112] Take the example of obtaining a random pressure value through a hash algorithm:

[0113] Convert the input data into binary form (if it is a string, it needs to be encoded into a byte stream, such as using UTF-8 encoding). Make sure the input data is in a form suitable for SHA-256 processing (usually a byte stream or binary data).

[0114] According to the SHA-256 padding rules, the input data is padded to a length of (n*512)-64 bits. A 1-bit (i.e., 0x80 bytes) is added to the end of the data. Several 0 bits are added until the data length is 64 bits short of an integer multiple of 512. The last 64 bits are used to store the length of the original data (in bits).

[0115] Initialize eight 32-bit registers (H0-H7) as the base values ​​for hash calculation.

[0116] The padded data is divided into several blocks of 512 bits (64 bytes) and processed block by block. For each block: the block is further divided into 16 32-bit words (W[0] to W

[15] ).

[0117] An additional 48 32-bit words (W

[16] to W

[63] ) are generated by the expansion algorithm, for a total of 64 words.

[0118] Initialize 8 working variables (a, b, c, d, e, f, g, h) and assign them values ​​​​H0-H7 respectively; perform a compression function (including bit operations, logical functions and modular addition operations) on each word to update the working variables; add the updated working variables to the original hash values ​​​​(H0-H7) to obtain a new hash value as the random pressure value.

[0119] When all data blocks have been processed, the final H0-H7 values ​​are concatenated to form a 256-bit hash value.

[0120] The random number generation process can also use Python's hashlib, and the time obfuscation algorithm calls the time package, which is not limited in this application.

[0121] It should be understood that although Figure 1 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. In addition, Figure 1At least part of the steps may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least part of the sub-steps or stages of other steps.

[0122] In other embodiments, Figure 4 As shown, the present application also provides an electronic component pressure testing device for an electronic system, comprising:

[0123] An electronic component acquisition module, used to acquire the electronic component to be tested of the electronic system;

[0124] A thread acquisition module, used to obtain the number of available processor threads of the electronic system;

[0125] A random generation module, for generating a random pressure value according to the operating status data of any electronic component in the electronic system;

[0126] a pressure release module, configured to apply a random pressure value to the electronic component to be tested through a processor thread to perform a pressure test on the electronic component to be tested, wherein the maximum value of the processor thread is the number of available processor threads;

[0127] The result determination module is used to obtain the system log of the electronic system and the controller log of the electronic system, and determine the test result corresponding to the electronic component to be tested according to the system log of the electronic system and the controller log of the electronic system.

[0128] Among them, generating a random pressure value includes: obtaining operating status data of any electronic component in the electronic system; determining processing sample data corresponding to the electronic system based on the operating status data; fitting the processing sample data to obtain a fitting curve corresponding to the processing sample data; determining an entropy source based on the operating status data and the processing sample data, wherein the entropy source is used to generate a random pressure value for the electronic system; and generating a random pressure value for the electronic system based on the entropy source.

[0129] Before obtaining the operating status data of any electronic component in the electronic system, the following steps are also included:

[0130] Setting at least one preset load value for the electronic system, wherein the preset load value corresponds to an operating state of the electronic system;

[0131] Operation state data of the electronic system operating under a load state corresponding to any one of at least one preset load value is acquired as state sample data.

[0132] The step of obtaining the operating state data of the electronic system operating under a load state corresponding to any one of at least one preset load value as the state sample data includes:

[0133] A cyclic sampling process is performed until the operating status data corresponding to any preset load value of at least one preset load value is obtained, and the cyclic sampling process includes:

[0134] Setting the load level of the electronic system to a load level corresponding to any unsampled preset load value;

[0135] Wait for the electronic system to operate stably at the preset load value;

[0136] A monitoring value is obtained by a sensor of any electronic component in the electronic system as operating status data corresponding to a preset load value.

[0137] Determining the processing sample data corresponding to the electronic system based on the operating status data includes:

[0138] Determine the type of the running status data based on the source of the running status data;

[0139] Get the actual load value of the electronic system;

[0140] The actual load value is used to match the operating state data corresponding to the preset load value closest to the state sample data, and the processing sample data is used as the processing sample data.

[0141] The step of fitting the processed sample data to obtain a fitting curve corresponding to the processed sample data includes:

[0142] Connecting adjacent data points at sampling moments in the processed sample data to obtain a processed sample curve;

[0143] Determine the extreme points in the processed sample curve;

[0144] Divide and process the sample data according to the extreme points to obtain at least one neighborhood curve;

[0145] Performing smoothing processing on at least one neighborhood curve until a neighborhood smooth curve corresponding to any neighborhood curve is obtained;

[0146] The smooth curve of the processed sample curve is obtained by splicing the neighborhood smooth curves;

[0147] The step of performing smoothing on any one of the at least one neighborhood until obtaining a neighborhood smooth curve corresponding to any neighborhood curve includes:

[0148] Get any neighborhood curve that has not been smoothed;

[0149] Copy the neighboring curve;

[0150] Splice the copied neighborhood curve and the original neighborhood curve to the curve to be transformed that is connected at the first position;

[0151] According to the following formula:

[0152]

[0153] in:

[0154]

[0155] Convert the curve to be transformed into a smooth periodic curve, where f(t) is a smooth periodic curve, a0 is a constant term coefficient, and a n is the cosine function coefficient, b n is the coefficient of the sine function, n is an integer, t0 is the starting time of integration, T is the period, and ω is the angular frequency corresponding to the period T;

[0156] A period in the smooth periodic curve is intercepted as the neighborhood smooth curve of the corresponding neighborhood curve.

[0157] Specifically, an entropy source is determined based on the operating status data and the processed sample data, wherein the entropy source is used to generate a random pressure value for the electronic system, including:

[0158] The entropy source is determined based on the following formula:

[0159] E S (t) = S(t) - g(t),

[0160] Among them, E S (t) represents the entropy source, which is a function of time t, S(t) represents the sampling curve obtained by connecting the sampling points, which is a function of time t, and g(t) is the smoothed post-processing sample curve, which is a function of time t.

[0161] For the specific definition of the stress testing device for the electronic system described above, please refer to the definition of the stress testing method for the electronic system described above, and will not be repeated here. The various modules in the stress testing device for the electronic system described above can be implemented in whole or in part through software, hardware, or a combination thereof. The above modules can be embedded in or independent of the processor in the computer device in hardware form, or can be stored in the memory of the computer device in software form, so that the processor can call and execute the operations corresponding to the above modules.

[0162] In other embodiments, Figure 5As shown, the present application also provides a computer device, including a memory, a processor, and an electronic system electronic component stress test program stored in the memory and executable on the processor. When the processor executes the electronic system electronic component stress test program, the electronic system electronic component stress test method described in the first aspect is implemented, specifically including:

[0163] S100: Acquire an electronic component to be tested of an electronic system;

[0164] S200: Obtaining the number of available processor threads of the electronic system;

[0165] S300: Generating a random pressure value based on the operating status data of any electronic component in the electronic system, specifically including:

[0166] S310: Acquire operating status data of any electronic component in the electronic system;

[0167] S320: Determining the processing sample data corresponding to the electronic system based on the operating status data, specifically including:

[0168] S321: Determine the type of the running status data according to the source of the running status data;

[0169] S322: Obtaining the actual load value of the electronic system;

[0170] S323: Match the operating status data corresponding to the closest preset load value in the status sample data with the actual load value as the processing sample data.

[0171] S330: Fitting the processed sample data to obtain a fitting curve corresponding to the processed sample data, specifically including:

[0172] S331: Connecting adjacent data points at sampling times in the processed sample data to obtain a processed sample curve;

[0173] S332: Determine the extreme value points in the sample curve;

[0174] S333: Divide and process the sample data according to the extreme points to obtain at least one neighborhood curve;

[0175] S334: Smoothing the at least one neighborhood curve until a neighborhood smooth curve corresponding to any neighborhood curve is obtained, specifically including:

[0176] S3341: Obtain any neighborhood curve that has not been smoothed;

[0177] S3342: Copy neighborhood curve;

[0178] S3343: splicing the copied neighborhood curve and the original neighborhood curve to the curve to be transformed that is connected at the first position;

[0179] S3344: According to the following formula:

[0180]

[0181] in:

[0182]

[0183] Convert the curve to be transformed into a smooth periodic curve, where f(t) is a smooth periodic curve, a0 is a constant term coefficient, and a n is the cosine function coefficient, b n is the coefficient of the sine function, n is an integer, t0 is the starting time of integration, T is the period, and ω is the angular frequency corresponding to the period T;

[0184] S3345: intercepting a period in the smooth periodic curve as a neighborhood smooth curve of the corresponding neighborhood curve.

[0185] S335: splicing the neighborhood smooth curves to obtain a smooth curve of the processed sample curve;

[0186] S340: Determine an entropy source based on the operating status data and the processed sample data, specifically including:

[0187] The entropy source is determined based on the following formula:

[0188] E S (t) = S(t) - g(t),

[0189] Among them, E S (t) represents the entropy source, which is a function of time t, S(t) represents the sampling curve obtained by connecting the sampling points, which is a function of time t, and g(t) is the smoothed post-processing sample curve, which is a function of time t.

[0190] S350: Generate a random pressure value for the electronic system based on the entropy source.

[0191] Preferably, before S310: obtaining the operating status data of any electronic component in the electronic system, the method further includes:

[0192] S301: Setting at least one preset load value of the electronic system, wherein the preset load value corresponds to an operating state of the electronic system;

[0193] S302: Obtain operating state data of the electronic system operating in a load state corresponding to any one of at least one preset load value as state sample data.

[0194] S302: Acquiring operating state data of the electronic system operating under a load state corresponding to any one of at least one preset load value as state sample data, specifically including:

[0195] A cyclic sampling process is performed until the operating status data corresponding to any preset load value of at least one preset load value is obtained, and the cyclic sampling process includes:

[0196] S3021: Setting the load level of the electronic system to a load level corresponding to any unsampled preset load value;

[0197] S3022: Waiting for the electronic system to operate stably at the preset load value;

[0198] S3023: Acquire a monitoring value from a sensor of any electronic component in the electronic system as operating status data corresponding to a preset load value.

[0199] S400: applying a random stress value to the electronic component to be tested through a processor thread to perform a stress test on the electronic component to be tested, wherein the maximum value of the processor thread is the number of available processor threads;

[0200] S500: Obtaining a system log of the electronic system and a controller log of the electronic system, and determining a test result corresponding to the electronic component to be tested according to the system log of the electronic system and the controller log of the electronic system.

[0201] In other embodiments, the present application further provides a computer-readable storage medium having stored thereon a stress test program for electronic components of an electronic system. When the stress test program for electronic components of an electronic system is executed by a processor, the stress test method for electronic components of an electronic system described in the first aspect is implemented, specifically including:

[0202] S100: Acquire an electronic component to be tested of an electronic system;

[0203] S200: Obtaining the number of available processor threads of the electronic system;

[0204] S300: Generating a random pressure value based on the operating status data of any electronic component in the electronic system, specifically including:

[0205] S310: Acquire operating status data of any electronic component in the electronic system;

[0206] S320: Determining the processing sample data corresponding to the electronic system based on the operating status data, specifically including:

[0207] S321: Determine the type of the running status data according to the source of the running status data;

[0208] S322: Obtaining the actual load value of the electronic system;

[0209] S323: Match the operating status data corresponding to the closest preset load value in the status sample data with the actual load value as the processing sample data.

[0210] S330: Fitting the processed sample data to obtain a fitting curve corresponding to the processed sample data, specifically including:

[0211] S331: Connecting adjacent data points at sampling times in the processed sample data to obtain a processed sample curve;

[0212] S332: Determine the extreme value points in the sample curve;

[0213] S333: Divide and process the sample data according to the extreme points to obtain at least one neighborhood curve;

[0214] S334: Smoothing the at least one neighborhood curve until a neighborhood smooth curve corresponding to any neighborhood curve is obtained, specifically including:

[0215] S3341: Obtain any neighborhood curve that has not been smoothed;

[0216] S3342: Copy neighborhood curve;

[0217] S3343: splicing the copied neighborhood curve and the original neighborhood curve to the curve to be transformed that is connected at the first position;

[0218] S3344: According to the following formula:

[0219]

[0220] in:

[0221]

[0222] Convert the curve to be transformed into a smooth periodic curve, where f(t) is a smooth periodic curve, a0 is a constant term coefficient, and a n is the cosine function coefficient, b n is the coefficient of the sine function, n is an integer, t0 is the starting time of integration, T is the period, and ω is the angular frequency corresponding to the period T;

[0223] S3345: intercepting a period in the smooth periodic curve as a neighborhood smooth curve of the corresponding neighborhood curve.

[0224] S335: splicing the neighborhood smooth curves to obtain a smooth curve of the processed sample curve;

[0225] S340: Determine an entropy source based on the operating status data and the processed sample data, specifically including:

[0226] The entropy source is determined based on the following formula:

[0227] E S (t) = S(t) - g(t),

[0228] Among them, E S (t) represents the entropy source, which is a function of time t, S(t) represents the sampling curve obtained by connecting the sampling points, which is a function of time t, and g(t) is the smoothed post-processing sample curve, which is a function of time t.

[0229] S350: Generate a random pressure value for the electronic system based on the entropy source.

[0230] Preferably, before S310: obtaining the operating status data of any electronic component in the electronic system, the method further includes:

[0231] S301: Setting at least one preset load value of the electronic system, wherein the preset load value corresponds to an operating state of the electronic system;

[0232] S302: Obtain operating state data of the electronic system operating in a load state corresponding to any one of at least one preset load value as state sample data.

[0233] S302: Acquiring operating state data of the electronic system operating under a load state corresponding to any one of at least one preset load value as state sample data, specifically including:

[0234] A cyclic sampling process is performed until the operating status data corresponding to any preset load value of at least one preset load value is obtained, and the cyclic sampling process includes:

[0235] S3021: Setting the load level of the electronic system to a load level corresponding to any unsampled preset load value;

[0236] S3022: Waiting for the electronic system to operate stably at the preset load value;

[0237] S3023: Acquire a monitoring value from a sensor of any electronic component in the electronic system as operating status data corresponding to a preset load value.

[0238] S400: applying a random stress value to the electronic component to be tested through a processor thread to perform a stress test on the electronic component to be tested, wherein the maximum value of the processor thread is the number of available processor threads;

[0239] S500: Obtaining a system log of the electronic system and a controller log of the electronic system, and determining a test result corresponding to the electronic component to be tested according to the system log of the electronic system and the controller log of the electronic system.

[0240] In other embodiments, the present application further provides a computer program product, including a computer program. When the computer program is executed by a processor, the method for stress testing electronic components of an electronic system according to the first aspect is implemented, specifically including:

[0241] S100: Acquire an electronic component to be tested of an electronic system;

[0242] S200: Obtaining the number of available processor threads of the electronic system;

[0243] S300: Generating a random pressure value based on the operating status data of any electronic component in the electronic system, specifically including:

[0244] S310: Acquire operating status data of any electronic component in the electronic system;

[0245] S320: Determining the processing sample data corresponding to the electronic system based on the operating status data, specifically including:

[0246] S321: Determine the type of the running status data according to the source of the running status data;

[0247] S322: Obtaining the actual load value of the electronic system;

[0248] S323: Match the operating status data corresponding to the closest preset load value in the status sample data with the actual load value as the processing sample data.

[0249] S330: Fitting the processed sample data to obtain a fitting curve corresponding to the processed sample data, specifically including:

[0250] S331: Connecting adjacent data points at sampling times in the processed sample data to obtain a processed sample curve;

[0251] S332: Determine the extreme value points in the sample curve;

[0252] S333: Divide and process the sample data according to the extreme points to obtain at least one neighborhood curve;

[0253] S334: Smoothing the at least one neighborhood curve until a neighborhood smooth curve corresponding to any neighborhood curve is obtained, specifically including:

[0254] S3341: Obtain any neighborhood curve that has not been smoothed;

[0255] S3342: Copy neighborhood curve;

[0256] S3343: splicing the copied neighborhood curve and the original neighborhood curve to the curve to be transformed that is connected at the first position;

[0257] S3344: According to the following formula:

[0258]

[0259] in:

[0260]

[0261] Convert the curve to be transformed into a smooth periodic curve, where f(t) is a smooth periodic curve, a0 is a constant term coefficient, and a n is the cosine function coefficient, b n is the coefficient of the sine function, n is an integer, t0 is the starting time of integration, T is the period, and ω is the angular frequency corresponding to the period T;

[0262] S3345: intercepting a period in the smooth periodic curve as a neighborhood smooth curve of the corresponding neighborhood curve.

[0263] S335: splicing the neighborhood smooth curves to obtain a smooth curve of the processed sample curve;

[0264] S340: Determine an entropy source based on the operating status data and the processed sample data, specifically including:

[0265] The entropy source is determined based on the following formula:

[0266] E S (t) = S(t) - g(t),

[0267] Among them, E S (t) represents the entropy source, which is a function of time t, S(t) represents the sampling curve obtained by connecting the sampling points, which is a function of time t, and g(t) is the smoothed post-processing sample curve, which is a function of time t.

[0268] S350: Generate a random pressure value for the electronic system based on the entropy source.

[0269] Preferably, before S310: obtaining the operating status data of any electronic component in the electronic system, the method further includes:

[0270] S301: Setting at least one preset load value of the electronic system, wherein the preset load value corresponds to an operating state of the electronic system;

[0271] S302: Obtain operating state data of the electronic system operating in a load state corresponding to any one of at least one preset load value as state sample data.

[0272] S302: Acquiring operating state data of the electronic system operating under a load state corresponding to any one of at least one preset load value as state sample data, specifically including:

[0273] A cyclic sampling process is performed until the operating status data corresponding to any preset load value of at least one preset load value is obtained, and the cyclic sampling process includes:

[0274] S3021: Setting the load level of the electronic system to a load level corresponding to any unsampled preset load value;

[0275] S3022: Waiting for the electronic system to operate stably at the preset load value;

[0276] S3023: Acquire a monitoring value from a sensor of any electronic component in the electronic system as operating status data corresponding to a preset load value.

[0277] S400: applying a random stress value to the electronic component to be tested through a processor thread to perform a stress test on the electronic component to be tested, wherein the maximum value of the processor thread is the number of available processor threads;

[0278] S500: Obtaining a system log of the electronic system and a controller log of the electronic system, and determining a test result corresponding to the electronic component to be tested according to the system log of the electronic system and the controller log of the electronic system.

[0279] The beneficial effects brought about by the technical solution provided by the embodiments of the present application are: by implementing a stress testing method, device, equipment and storage medium for an electronic system provided by the embodiments of the present application, the extreme pressure load state of the electronic system is simulated by generating random pressure values, and the performance of the electronic system is tested under this state, thereby avoiding users encountering extreme load states during use, causing the electronic system to crash or lose connection with a certain electronic component; the random pressure values ​​generated based on the noise environment in which the electronic components inside the electronic system are operating have stronger unpredictability, and the security of the test data can be effectively guaranteed.

[0280] Professionals may further appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of the two. In order to clearly illustrate the interchangeability of hardware and software, the above description has generally described the components and steps of each example according to their functions. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0281] In particular, according to an embodiment of the present application, the process described above with reference to the flowchart can be implemented as steps executed by a computer software program control. For example, an embodiment of the present application includes a computer program product, which includes a computer program loaded on a computer-readable medium, and the computer program includes a program code for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from a network via a communication device, or installed from a memory, or installed from a ROM. When the computer program is executed by an external processor, the above-mentioned functions defined in the method of the embodiment of the present application are executed.

[0282] It should be noted that the computer-readable medium of the embodiments of the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the two. The computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or component, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the embodiments of the present application, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system, device or device. In the embodiments of the present application, the computer-readable signal medium may include a data signal propagated in baseband or as part of a carrier wave, which carries a computer-readable program code. This propagated data signal may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium that can transmit, propagate, or convey a program for use by or in conjunction with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium may be transmitted using any suitable medium, including but not limited to wires, optical cables, RF (Radio Frequency), etc., or any suitable combination thereof.

[0283] The computer-readable medium may be included in the server or may exist independently and not incorporated into the server. The computer-readable medium carries one or more programs that, when executed by the server, cause the server to: in response to detecting that the terminal's peripheral mode is inactive, obtain the frame rate of applications on the terminal; when the frame rate meets a screen-off condition, determine whether the user is currently accessing the terminal's screen information; and, in response to determining that the user is not accessing the terminal's screen information, control the screen to enter an immediate dimming mode.

[0284] Computer program code for performing the operations of embodiments of the present application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving a remote computer, the remote computer can be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0285] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system or system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment. The system and system embodiments described above are merely schematic, wherein the units described as separate electronic components may or may not be physically separated, and the electronic components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the scheme of this embodiment. A person of ordinary skill in the art can understand and implement it without paying any creative work.

[0286] The above is a detailed introduction to the technical solutions provided by this application. Specific examples are used herein to illustrate the principles and implementation methods of this application. The description of the above embodiments is only intended to help understand the method and core concept of this application. At the same time, for those skilled in the art, based on the concept of this application, there may be changes in the specific implementation methods and application scope. In summary, the contents of this specification should not be understood as limiting this application.

[0287] The above is a detailed introduction to the stress testing method, device, equipment and storage medium for an electronic system provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The above embodiments are only preferred embodiments of the present application, which are used to help understand the method and core ideas of the present application and are not intended to limit the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application, these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A method for stress testing electronic components of an electronic system, characterized in that: include: obtaining an electronic component to be tested from the electronic system; Obtaining the number of available processor threads of the electronic system; generating a random pressure value according to the operating status data of any electronic component in the electronic system; Applying the random stress value to the electronic component to be tested by a processor thread to perform a stress test on the electronic component to be tested, wherein the maximum value of the processor thread is the number of available processor threads; A system log of the electronic system and a controller log of the electronic system are obtained, and a test result corresponding to the electronic component to be tested is determined according to the system log of the electronic system and the controller log of the electronic system.

2. The electronic component stress testing method of an electronic system according to claim 1, characterized in that: Generating a random pressure value according to the operating status data of any electronic component in the electronic system includes: Acquiring operating status data of any electronic component in the electronic system; determining, according to the operating status data, processing sample data corresponding to the electronic system; Fitting the processed sample data to obtain a fitting curve corresponding to the processed sample data; determining an entropy source based on the operating status data and the processed sample data, wherein the entropy source is used to generate a random pressure value for the electronic system; Based on the entropy source, a random pressure value is generated for the electronic system.

3. The electronic component stress testing method of an electronic system according to claim 2, wherein: Before obtaining the operating status data of any electronic component in the electronic system, the method further includes: Setting at least one preset load value of the electronic system, wherein the preset load value corresponds to an operating state of the electronic system; Operation state data of the electronic system operating under a load state corresponding to any one of the at least one preset load value is acquired as state sample data.

4. The electronic component stress testing method of an electronic system according to claim 3, wherein: Acquiring, as state sample data, operating state data of the electronic system operating under a load state corresponding to any one of the at least one preset load value, includes: A cyclic sampling process is performed until the operating status data corresponding to any preset load value of the at least one preset load value is obtained, the cyclic sampling process comprising: Setting the load level of the electronic system to a load level corresponding to any unsampled preset load value; Waiting for the electronic system to stably operate at a set preset load value; A monitoring value is obtained by a sensor of any electronic component in the electronic system as operating status data corresponding to the preset load value.

5. The electronic component stress testing method of an electronic system according to claim 2, wherein: Determining the processing sample data corresponding to the electronic system according to the operating status data includes: determining the type of the operating status data according to a source of the operating status data; Obtaining an actual load value of the electronic system; The actual load value is used to match the operating state data corresponding to the preset load value closest to the state sample data as the processing sample data.

6. The electronic component stress testing method of an electronic system according to claim 2, wherein: The fitting of the processed sample data to obtain a fitting curve corresponding to the processed sample data includes: Connecting data points adjacent to each other at sampling moments in the processed sample data to obtain a processed sample curve; determining extreme points in the processed sample curve; Dividing the processed sample data according to the extreme value points to obtain at least one neighborhood curve; Performing smoothing processing on the at least one neighborhood curve until a neighborhood smooth curve corresponding to any neighborhood curve is obtained; and splicing the neighborhood smooth curves to obtain a smooth curve of the processed sample curve; The step of performing smoothing on any one of the at least one neighborhood until a neighborhood smooth curve corresponding to any neighborhood curve is obtained includes: Get any neighborhood curve that has not been smoothed; copying the neighborhood curve; Splice the copied neighborhood curve and the original neighborhood curve to the curve to be transformed that is connected at the first position; According to the following formula: in: The curve to be transformed is converted into a smooth periodic curve, where f(t) is a smooth periodic curve, a0 is a constant term coefficient, and a n is the cosine function coefficient, b n is the coefficient of the sine function, n is an integer, t0 is the starting time of integration, T is the period, and ω is the angular frequency corresponding to the period T; A period in the smooth periodic curve is intercepted as a neighborhood smooth curve of the corresponding neighborhood curve.

7. The electronic component stress testing method of an electronic system according to claim 2, wherein: Determining an entropy source based on the operating status data and the processed sample data, wherein the entropy source is used to generate a random pressure value for the electronic system, includes: The entropy source is determined based on the following formula: E S (t)=S(t)-g(t), Among them, E S (t) represents the entropy source, which is a function of time t, S(t) represents the sampling curve obtained by connecting the sampling points, which is a function of time t, and g(t) is the smoothed post-processing sample curve, which is a function of time t.

8. A pressure testing device for electronic components of an electronic system, characterized in that: include: An electronic component acquisition module, used to acquire the electronic component to be tested of the electronic system; A thread acquisition module, configured to acquire the number of available processor threads of the electronic system; a random generation module, configured to generate a random pressure value based on the operating status data of any electronic component in the electronic system; a pressure release module, configured to apply the random pressure value to the electronic component to be tested through a processor thread to perform a pressure test on the electronic component to be tested, wherein the maximum value of the processor thread is the number of available processor threads; The result determination module is configured to obtain a system log of the electronic system and a controller log of the electronic system, and determine a test result corresponding to the electronic component to be tested according to the system log of the electronic system and the controller log of the electronic system.

9. Computer device, characterized in that The invention comprises a memory, a processor and an electronic component stress testing program of an electronic system stored in the memory and executable on the processor. When the processor executes the electronic component stress testing program of the electronic system, the electronic component stress testing method of the electronic system according to any one of claims 1 to 7 is implemented.

10. A computer-readable storage medium, characterized in that An electronic component stress test program of an electronic system is stored thereon, and when the electronic component stress test program of the electronic system is executed by a processor, the electronic component stress test method of the electronic system according to any one of claims 1 to 7 is implemented.

Images