Semiconductor equipment shipment detection method and device, electronic equipment and storage medium

Abstract

The invention discloses a semiconductor equipment shipment detection method and device, electronic equipment and a storage medium, and relates to the technical field of semiconductors. The method comprises the following steps: reading a front-end file from a front-end processor in butt joint with a customer relationship system; wherein the front-end file is generated by the front-end processor based on a customer quotation request file pushed by the customer relationship system; analyzing the preposed file through a file analysis technology, and generating a first shipment detection standard according to an analysis result; copying the first shipment detection standard, and generating a second shipment detection standard in response to an adjustment operation of a detector on the copied first shipment detection standard; and in response to selection operation of the detection personnel on shipment detection standards, performing shipment detection on the semiconductor equipment according to the first shipment detection standard and / or the second shipment detection standard. By adopting the method, the effect of improving the shipment detection efficiency of the semiconductor equipment can be achieved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a method, device, electronic device and storage medium for detecting shipment of semiconductor equipment. Background Art

[0002] Semiconductors, the cornerstone of modern electronic devices, are widely used in a wide range of fields, including computers, communications, and consumer electronics. Their rapid development has significantly driven advancements and innovations in emerging technologies such as information technology, artificial intelligence, and the Internet of Things, fueling the rapid growth of the digital economy. In the rapidly evolving semiconductor industry, manufacturing speed has become a crucial competitive advantage. From the moment a customer places an order, the countdown to equipment shipment begins. During this time, every day demands a race against time, encompassing every stage of the process, including design, development, materials, production, and quality control. Each link is closely integrated and interconnected, developing in a sequential and interconnected manner. Shipping inspection serves as a touchstone for all efforts, ensuring that products meet quality standards before shipment, preventing substandard products from entering the market and reducing the risk of customer complaints and returns.

[0003] Currently, manual testing is often used for shipping inspections. This method has certain drawbacks: the large number and frequency of semiconductor device shipments make manual testing inefficient. Therefore, a more efficient method for shipping inspections of semiconductor devices is needed. Summary of the Invention

[0004] The present invention provides a semiconductor equipment shipment detection method, device, electronic equipment and storage medium.

[0005] According to one aspect of the present invention, a method for detecting shipment of a semiconductor device is provided, comprising:

[0006] Reading a pre-processor file from a front-end processor connected to a customer relationship system; wherein the pre-processor file is generated by the front-end processor based on a customer quotation request file pushed by the customer relationship system;

[0007] Through file parsing technology, the pre-installed file is parsed and the first shipment inspection standard is generated based on the parsing results;

[0008] Copying the first shipment inspection standard and generating a second shipment inspection standard in response to an inspection personnel adjusting the copied first shipment inspection standard;

[0009] In response to the inspection personnel's selection operation of the shipment inspection standard, the semiconductor device is subjected to shipment inspection according to the first shipment inspection standard and / or the second shipment inspection standard.

[0010] According to another aspect of the present invention, there is provided a semiconductor device shipment detection apparatus, comprising:

[0011] Reading a pre-processor file from a front-end processor connected to a customer relationship system; wherein the pre-processor file is generated by the front-end processor based on a customer quotation request file pushed by the customer relationship system;

[0012] Through file parsing technology, the pre-installed file is parsed and the first shipment inspection standard is generated based on the parsing results;

[0013] Copying the first shipment inspection standard and generating a second shipment inspection standard in response to an inspection personnel adjusting the copied first shipment inspection standard;

[0014] In response to the inspection personnel's selection operation of the shipment inspection standard, the semiconductor device is subjected to shipment inspection according to the first shipment inspection standard and / or the second shipment inspection standard.

[0015] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0016] at least one processor; and

[0017] a memory communicatively connected to at least one processor; wherein,

[0018] The memory stores a computer program that can be executed by at least one processor. The computer program is executed by the at least one processor so that the at least one processor can execute the semiconductor device shipment inspection method according to an embodiment of the present invention.

[0019] According to another aspect of the present invention, a computer-readable storage medium is provided. The computer-readable storage medium stores computer instructions, which are used to enable a processor to implement the semiconductor device shipment detection method according to an embodiment of the present invention when executed.

[0020] The technical solution of the embodiment of the present invention can effectively improve the efficiency and accuracy of semiconductor device shipment inspection compared to manual shipment inspection.

[0021] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present invention, nor is it intended to limit the scope of the present invention. Other features of the present invention will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 1 is a flow chart of a semiconductor device shipment inspection method provided according to an embodiment of the present invention;

[0024] Figure 2 1 is a flow chart of a semiconductor device shipment inspection method provided according to an embodiment of the present invention;

[0025] Figure 3 1 is a flow chart of a semiconductor device shipment inspection method provided according to an embodiment of the present invention;

[0026] Figure 4 2 is a schematic structural diagram of a semiconductor device shipment inspection device provided according to an embodiment of the present invention;

[0027] Figure 5 It is a structural diagram of an electronic device for implementing the semiconductor device shipment inspection method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0028] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0029] Example 1

[0030] Figure 1 A flowchart of a semiconductor device shipment inspection method provided in an embodiment of the present invention is applicable to scenarios in which semiconductor devices are automatically inspected for shipment. The method can be executed by a semiconductor device shipment inspection device, which can be implemented in the form of hardware and / or software. The semiconductor device shipment inspection device can be configured in an electronic device, such as a computer device or a mobile terminal.

[0031] like Figure 1 As shown, the semiconductor device shipment inspection method includes:

[0032] S101 : Reading a front-end file from a front-end processor connected to a customer relationship system, wherein the front-end file is generated by the front-end processor based on a customer quotation request file pushed by the customer relationship system.

[0033] The semiconductor equipment involved in the embodiments of the present invention refers to specialized equipment used for large-scale, high-efficiency chip production during the semiconductor manufacturing process. These devices run through all aspects of chip manufacturing, from wafer preparation to packaging and testing, and directly affect the performance, yield, and production capacity of the chips. These semiconductor equipment can be exemplified by wafer manufacturing equipment, such as photolithography machines and etching machines, or wafer test probe stations.

[0034] In an embodiment of the present invention, the customer relationship system refers to a CRM system, wherein CRM is the abbreviation of Customer Relationship Management, and the CRM system is a system for establishing, maintaining and improving the relationship between the enterprise and the customer through the collection, analysis and utilization of customer information, as well as effective communication and interaction with customers. Through the customer relationship system, the enterprise can record in detail the customer's special requirements for the technical specifications, performance parameters and other special requirements of the semiconductor equipment. Specifically, the customer's special requirements for the technical specifications, performance parameters and other special requirements of the semiconductor equipment can be recorded through the customer quotation request document (i.e., a double-signed RFQ (Request for Quotation) document). It can be understood that the customer quotation request document is an important carrier for the customer to put forward relevant requirements for semiconductor equipment. The document needs to be double-signed and contains the customer's minimum requirements for the performance of the purchased semiconductor equipment (such as the various basic performance indicators that the semiconductor equipment should have, etc.).

[0035] In an embodiment of the present invention, the front-end processor (FEP) can optionally be a server device connected to the customer relationship system and the shipment inspection system. It will be appreciated that the provision of a FEP can achieve security protection. Specifically, the FEP can perform security checks and filtering on data from the customer relationship system to prevent malicious data or viruses from invading the shipment inspection system, thereby protecting the security of the shipment inspection system. Furthermore, the shipment inspection system can restrict access rights to the customer relationship system, ensuring the security and confidentiality of customer relationship data. After a double-signed customer quotation request file is uploaded to the customer relationship system, the customer relationship system automatically generates a copy of the customer quotation request file and sends it to the FEP via a file transfer tool. Based on the received copy of the customer quotation request file, the FEP performs the following operations: It extracts key information from the copy, which may include basic customer information (such as customer name and contact information), equipment requirement information (such as equipment model, serial number, specifications, quantity), and quotation-related information (such as expected price and shipment time). The extracted key information is organized and converted according to the format specified in the FEP file. For example, convert the customer name from the file format in the copy to the specific character encoding format required by the pre-file to ensure the consistency and accuracy of the data when transmitted between different systems. Furthermore, verify the extracted and converted data to check the integrity and accuracy of the data. For example, verify whether the device model is in the list supported by the system, whether the quantity is a positive integer, etc. At the same time, clean up invalid or erroneous data, such as removing duplicate records, correcting obvious spelling errors, etc. Supplement and integrate the extracted data according to the company's internal business rules and relevant data. Fill in the processed data according to the template of the pre-file to generate the final pre-file. The pre-file can be in various formats, such as XML, JSON or a specific file format, depending on the interface agreement between the customer relationship system and the shipment inspection system. Store the generated pre-file in a designated location so that the shipment inspection system can access it.

[0036] Based on the above, the shipment inspection system can read the pre-generated front-end file by accessing the designated location of the front-end machine.

[0037] S102: parse the pre-file using file parsing technology, and generate a first shipment inspection standard based on the parsing result.

[0038] In one optional implementation, key data related to device performance can be extracted from the pre-file using file parsing technology. This file parsing technology can include file extraction, syntax analysis, semantic understanding, and data format conversion. For example, when using file extraction technology to extract key data, a JSON parsing library can be used to extract the values ​​of fields representing device performance from a JSON-formatted pre-file, following JSON data structure rules. When parsing the file using syntax analysis technology, lexical analysis breaks the character stream in the pre-file into individual words or symbols, while syntactic analysis constructs a syntax tree for the file content based on grammatical rules. This helps understand the device performance requirements expressed in complex statements in the file, such as parsing complex descriptions of device operating parameters and clarifying the logical relationships between the various parameters. Furthermore, for vague or poorly formulated device performance requirements, semantic understanding technology, combined with industry knowledge bases and language models, can accurately infer the customer's true intent. For example, for ambiguous statements such as "the machine should respond quickly," semantic understanding and industry standards can be used to determine a reasonable range of response speed values. Through the above description, key data related to device performance can be obtained. These key data represent the customer's minimum performance requirements for semiconductor devices. Furthermore, the extracted key data is sorted to categorize and summarize the various performance requirements scattered throughout the pre-installed documentation, resulting in a complete system of device performance indicators. These indicators represent the minimum standards that semiconductor devices must meet for customer requirements. Based on this system of indicators, a standard framework for shipping inspection standards is constructed. This primarily involves clarifying key information, such as the placement of each performance indicator within the inspection standard and the corresponding test methods, to initially establish the overall structure of the first shipping inspection standard. Finally, the device performance indicators within the standard framework are converted into corresponding test item descriptions to obtain the first shipping inspection standard. For example, an abstract performance requirement can be refined into a specific test item, such as "At a specific ambient temperature, the operating speed of a certain component of the semiconductor device must reach X value." Furthermore, acceptance criteria are established for each test item, specifying the acceptable range or specific values ​​for the device performance indicator. This creates a complete and standardized first shipping inspection standard, ensuring that it meets the commitments made to the customer in the request for quotation document (i.e., the order contract).

[0039] S103: Copy the first shipment inspection standard, and generate a second shipment inspection standard in response to an inspection personnel's adjustment operation on the copied first shipment inspection standard.

[0040] In this embodiment of the present invention, upon detecting the generation of the first shipment inspection standard, the shipment inspection system automatically initiates a copy function. The shipment inspection system then creates a complete copy of all the contents of the generated first shipment inspection standard, including all inspection items, corresponding performance requirements, acceptance criteria, and related formats and structures. This copy process, based on the shipment inspection system's internal file copy mechanism, ensures that the copied content is completely consistent with the original first shipment inspection standard, providing a foundation for subsequent adjustments.

[0041] In an embodiment of the present invention, in response to the inspection personnel's adjustment operation on the copied first shipment inspection standard, generating the second shipment inspection standard includes the following steps: in response to the inspection personnel's adjustment operation on the copied first shipment inspection standard, verifying the inspection personnel's authority; after the inspection personnel's authority verification is passed, displaying the copied first shipment inspection standard in a visual interface; according to the inspection personnel's operation of adding inspection items or modifying the performance indicator requirements corresponding to the original inspection items, adjusting the displayed first shipment inspection standard to obtain the second shipment inspection standard.

[0042] Specifically, when an inspector attempts to adjust the copied first shipment inspection standard, the shipment inspection system will first perform permission verification. The inspector must enter their correct account name and strong password to log in to the system. The system then compares their account information with pre-set permission rules. Only inspectors with the appropriate adjustment permissions can proceed with the subsequent adjustment process. For example, only personnel in specific positions, such as senior quality inspectors or technical supervisors, who have been granted permission to modify the inspection standard are allowed to perform this operation. For inspectors who pass permission verification, the system presents the copied first shipment inspection standard to the inspector in a visual interface. In this interface, the inspector can adjust the equipment performance requirements corresponding to various inspection items, such as the acceptable range for equipment operating speed or equipment accuracy requirements. The system responds to each adjustment made by the inspector in real time, records the changes in values ​​before and after the adjustment, and temporarily stores the adjusted content in a temporary storage area. Inspectors can choose to add inspection items as needed, and the system provides the corresponding operation interface. In a designated area, the inspector can enter a detailed description of the new inspection item, such as the inspection content for new equipment functions or special customer requirements. Assign unique identifiers to newly added inspection items and incorporate them into the overall framework of the inspection standards. At the same time, the inspectors are also required to set corresponding performance index requirements and qualification criteria for the newly added inspection items, and the system also records this new information in real time. When the inspectors have completed all adjustment operations and confirmed the submission, the system generates a second shipment inspection standard based on the adjustments and new information recorded in the temporary storage area. The newly generated second shipment inspection standard not only includes the various inspection items and performance index requirements newly added by the inspectors, but also retains the key structure and necessary information of the first shipment inspection standard. The system can store the second shipment inspection standard in a designated database or file storage location for subsequent shipment inspection process calls. At the same time, the system continues to properly preserve the original version of the first shipment inspection standard for retrospective comparison when needed.

[0043] S104 : In response to the inspection personnel selecting the shipment inspection standard, perform shipment inspection on the semiconductor device according to the first shipment inspection standard and / or the second shipment inspection standard.

[0044] After obtaining the first shipment inspection standard and the second shipment inspection standard through steps S101-S103, the two shipment inspection standards can be displayed through the visual selection interface of the shipment inspection system. That is, the relevant information and description of the first shipment inspection standard (i.e., the standard generated based on the customer's quotation request document, representing the minimum committed performance indicator for the customer in the order contract) and the second shipment inspection standard (a higher requirement standard formed after adjustment by the inspection personnel within the scope of authority on the basis of the first shipment inspection standard) are visually displayed. Optionally, the first shipment inspection standard is marked as "basic shipment inspection standard" and the second shipment inspection standard is marked as "custom PLUS version shipment inspection standard" to facilitate the inspection personnel to distinguish and understand.

[0045] Furthermore, the inspector can select the shipment inspection standard to be adopted on the visual selection interface by clicking the mouse or other input methods. The first shipment inspection standard or the second shipment inspection standard can be selected individually, or both can be selected for inspection at the same time according to the needs. The system monitors the inspection personnel's selection operation in real time. Once the inspection personnel completes the selection and confirms the submission, the system quickly identifies the selected standard type and related information. Then, the system starts the corresponding shipment inspection process based on the inspection personnel's selection. Specifically, if only the first shipment inspection standard is selected, the system calls the first shipment inspection standard content stored in the database, which contains detailed information such as various inspection items, corresponding performance index requirements, and qualified judgment standards. Then, for any inspection item, the actual value (i.e., the inspection value) of the performance index corresponding to the inspection item during the operation of the semiconductor equipment is determined, and the determined actual value is compared with the performance index requirement corresponding to the inspection item. For example, for the inspection item of chip manufacturing accuracy of semiconductor equipment, the system detects whether the chip accuracy actually produced by the semiconductor equipment is within this range based on the accuracy value range specified in the first shipment inspection standard. If only the second shipping inspection standard is selected, the system will also retrieve the second shipping inspection standard from the database, which already includes the inspection items and performance requirements adjusted by the inspectors. The system then inspects the semiconductor equipment according to these adjusted standards. For example, if the inspectors increase the operating speed requirement for a key component of semiconductor equipment in the second shipping inspection standard, the system will use this increased speed value as the standard to check whether the equipment's actual operating speed meets the standard. If both standards are selected, the system will first conduct a comprehensive inspection of the semiconductor equipment according to the first shipping inspection standard and record all test results. Then, it will conduct a second inspection according to the second shipping inspection standard, focusing on inspection items that have been adjusted or newly added in the second shipping inspection standard. For example, if the first shipping inspection standard specifies a certain electrical parameter of semiconductor equipment within range A, and the second shipping inspection standard adjusts it to the more stringent range B, the system will first inspect the parameter within range A and then recheck the parameter within range B to ensure that the equipment meets the requirements at different levels.

[0046] In an embodiment of the present invention, two standard shipping inspection standards are generated based on the customer quotation request file in the customer relationship system. Then, based on any of the shipping inspection standards, it is automatically detected whether the performance of the semiconductor device meets the shipping requirements. This achieves full-process automated shipping inspection, which improves the efficiency of shipping inspection compared to manual inspection. In addition, since the standard first shipping inspection standard is specified and cannot be changed, omissions, confusion or errors caused by manual operation can be prevented, and unqualified products can be prevented from entering the market, thereby improving the accuracy of inspection. Moreover, based on the first shipping standard, a second shipping inspection standard can be customized, which can achieve a shipping inspection standard higher than the customer's requirements.

[0047] Example 2

[0048] Figure 2 The present invention provides a flow chart of a method for detecting shipment of semiconductor equipment. Figure 2 , the method comprises the following steps:

[0049] S201: Read a pre-processor file from a front-end processor connected to a customer relationship system. The pre-processor file is generated by the front-end processor based on a customer quotation request file pushed by the customer relationship system.

[0050] S202: parse the pre-file using file parsing technology, and generate a first shipment inspection standard based on the parsing result.

[0051] Optionally, through file parsing technology, key data related to equipment performance is extracted from the front-end file; the extracted key data related to equipment performance is sorted out to classify and summarize the various performance requirements scattered in the front-end file to obtain a complete equipment performance indicator system; based on the sorted equipment performance indicator system, a standard framework for shipment inspection standards is constructed; the equipment performance indicators in the standard framework are converted into corresponding inspection item descriptions to obtain the first shipment inspection standard.

[0052] S203: Copy the first shipment inspection standard, and generate a second shipment inspection standard in response to an inspection personnel's adjustment operation on the copied first shipment inspection standard.

[0053] Optionally, in response to the inspector's adjustment operation on the copied first shipment inspection standard, the inspector's authority is verified; after the inspector's authority verification is passed, the copied first shipment inspection standard is displayed in a visual interface; according to the inspector's operation of adding inspection items or modifying the performance indicator requirements corresponding to the original inspection items, the displayed first shipment inspection standard is adjusted to obtain the second shipment inspection standard.

[0054] S204 : In response to the inspection personnel selecting the shipment inspection standard, perform shipment inspection on the semiconductor device according to the first shipment inspection standard and / or the second shipment inspection standard.

[0055] Optionally, through a comparison algorithm, according to the inspection items and other contents included in the first shipment inspection standard and / or the second shipment inspection standard, the performance of the semiconductor equipment is collected one by one, and by comparing the standard values ​​of the items and the performance test values ​​obtained by the test, it is determined whether the shipment conditions are met.

[0056] After the semiconductor device is subjected to shipment inspection according to the first shipment inspection standard and / or the second shipment inspection standard, a quality report may be generated. For details, see step S205 .

[0057] S205. Generate a quality report based on the shipment inspection results, wherein the quality report at least includes the inspection personnel, inspection time, item standard value / standard range, item inspection value, and whether it passes.

[0058] In this embodiment of the present invention, the shipment inspection system fills in a pre-set quality report template based on collected information such as the inspector, inspection time, item standard value / standard range, and item test value. By comparing the test value of each item with the standard value / standard range, the system determines whether the item has passed the inspection. If the test value is within the standard range, the item is judged as "passed"; otherwise, it is judged as "failed." Finally, the system generates a quality report containing all this information and stores it in the system for subsequent review and use.

[0059] S206 : In response to at least one failed inspection item in the quality report, the failed inspection item is marked so that production personnel can determine problems with the semiconductor device and perform repairs based on the marked inspection item.

[0060] In an embodiment of the present invention, the shipment inspection system checks the generated quality report and checks the results of the "Pass" field line by line or item by item. When it is found that the result of at least one inspection item is "Failed", a marking operation is triggered. The system can use a specific marking method to mark the inspection items that failed. Common marking methods include color-coding the files of the failed items in the report (such as red), adding special symbols (such as asterisks), or displaying prompt information next to the items. For example, the font color of the failed inspection items is set to red to make them more eye-catching in the report, making it easier for production personnel to quickly identify them. After marking is completed, the system will push the quality report to relevant production personnel, such as equipment assembly workers, engineers, etc. After receiving the report, the production personnel can intuitively see the marked failed inspection items, and thus analyze the specific problems of the semiconductor equipment based on this information and perform targeted repair work. For example, production personnel can refer to the detailed information such as the standard value or standard value range of the item, the inspection value, etc. provided in the inspection report to conduct targeted inspections and improvements on the equipment. For example, if the test value shows that a certain parameter of the equipment deviates from the standard value, the production personnel will check whether the installation of the relevant parts is correct and whether the equipment operating parameters need to be re-debugged.

[0061] S207: In response to all the inspection items in the quality report being passed, a shipment inspection qualification report and label are generated.

[0062] In an embodiment of the present invention, after the system has conducted a comprehensive inspection of all inspection items in the quality report, if it determines that the results of the "Pass" field for each inspection item are all "Pass", the process of generating a qualified report and label will be entered. The system fills in the inspection personnel, inspection time, equipment-related information, and inspection results into the report according to the preset qualified report template to generate a shipment inspection qualified report. As a formal document that the semiconductor equipment meets the shipping standards, the report has a certain authority and certification function. At the same time, the system generates a shipping label containing key information of the equipment (such as model, serial number, qualified identification, etc.) according to relevant label design requirements. The label can be paper or electronic. The generated label will be associated with the qualified report, and in the subsequent shipment process, the label will be pasted or attached to the semiconductor equipment so that the qualified status of the equipment can be quickly identified during the logistics and delivery process.

[0063] In an embodiment of the present invention, after completing the shipment inspection, a quality report is automatically generated, which helps the enterprise to trace the product quality history, understand the quality status of the equipment at different stages, and provide data support for subsequent product improvements and quality enhancements; moreover, when there are failed inspection items in the quality report, relevant personnel can quickly locate the problem based on the detailed information recorded in the report.

[0064] Example 3

[0065] Figure 3 The present invention provides a flow chart of a method for detecting shipment of semiconductor equipment. Figure 3 , the method comprises the following steps:

[0066] S301: Read a pre-processor file from a front-end processor connected to a customer relationship system. The pre-processor file is generated by the front-end processor based on a customer quotation request file pushed by the customer relationship system.

[0067] The specific implementation process of step S301 can be found in the description of the above embodiment and will not be repeated here.

[0068] In an embodiment of the present invention, a customer may modify some content in a customer quotation request document due to practical needs. In this case, the front-end processor needs to regenerate the pre-file. Specifically, the front-end processor is further configured to: receive a modified customer quotation request document from the customer relationship system; generate a new pre-file based on the newly received customer quotation request document; and replace the old pre-file with the new pre-file.

[0069] S302: parse the pre-file using file parsing technology, and generate a first shipment inspection standard based on the parsing result.

[0070] The process of generating the first shipment inspection standard can refer to the description of the above embodiment and will not be repeated here. In the embodiment of the present invention, after the pre-file is parsed by file parsing technology, it also includes: arranging the extracted shipment information in ascending order according to the shipment time for easy search; wherein the shipment information includes at least the customer name, equipment serial number, equipment type, and shipment time; according to the urgency of the shipment time, the shipment information is marked with different levels; for example, shipments within 15 working days are indicated in red, which means that the shipment time is urgent. The specific time can be set according to actual needs. In addition, a separate Tab page that has exceeded the planned shipment date is used for statistical management; further, the shipment information is displayed in the display interface to facilitate inspection personnel to identify and understand customer needs and equipment information.

[0071] S303: Copy the first shipment inspection standard, and generate a second shipment inspection standard in response to the inspection personnel's adjustment operation on the copied first shipment inspection standard.

[0072] S304: Send the second shipment inspection standard to the designated personnel for approval, and after obtaining the approval message, execute step S305.

[0073] In an embodiment of the present invention, the shipment inspection system can, based on preset rules or configurations, identify designated personnel authorized to review the second shipment inspection standard. These designated personnel can include personnel such as quality managers and technical directors. The system then sends an approval request to the designated reviewer via an internal enterprise notification mechanism, such as an email system, instant messaging tool, or system push notifications. The message clearly states that this is a request for approval of the second shipment inspection standard and provides links or instructions for reviewing and approving the request. After receiving the approval request, the reviewer clicks the link in the message or follows the instructions to enter the system's approval interface. In this interface, the reviewer can review the details of the second shipment inspection standard, including differences from the first shipment inspection standard, adjusted indicators, and newly added inspection items. The reviewer evaluates the second shipment inspection standard based on their professional knowledge and judgment. If they believe the standard is reasonable and meets the requirements, they select the "Approve" option. If they find any issues or require further revisions, they select the "Reject" option and provide specific comments and suggestions in the corresponding feedback area.

[0074] S305 : In response to the inspection personnel selecting the shipment inspection standard, perform shipment inspection on the semiconductor device according to the first shipment inspection standard and / or the second shipment inspection standard.

[0075] In the embodiment of the present invention, the second shipment inspection standard can be reviewed and approved to ensure the accuracy of the customized second shipment inspection standard, thereby avoiding shipment inspection based on incorrect standards.

[0076] Example 4

[0077] Figure 4 This is a schematic diagram of the structure of a semiconductor device shipment inspection device provided by an embodiment of the present invention. Figure 4 As shown, the device includes:

[0078] The file acquisition module 401 is used to read the front-end file from the front-end processor connected to the customer relationship system; wherein the front-end file is generated by the front-end processor based on the customer quotation request file pushed by the customer relationship system;

[0079] A first standard generating module 402 is configured to parse the pre-file using a file parsing technique and generate a first shipment inspection standard based on the parsing result;

[0080] The second standard generating module 403 is configured to copy the first shipment inspection standard and generate a second shipment inspection standard in response to an inspection personnel adjusting operation on the copied first shipment inspection standard;

[0081] The shipment inspection module 404 is configured to perform shipment inspection on the semiconductor device according to the first shipment inspection standard and / or the second shipment inspection standard in response to the inspection personnel selecting the shipment inspection standard.

[0082] In some embodiments, the first standard generating module 402 is specifically configured to:

[0083] Through file parsing technology, key data related to device performance is extracted from the pre-file;

[0084] Sorting out the extracted key data related to equipment performance to categorize and summarize the various performance requirements scattered in the pre-files to obtain a complete equipment performance indicator system;

[0085] Based on the well-organized equipment performance indicator system, a standard framework for shipment inspection standards is established;

[0086] The equipment performance indicators in the standard framework are converted into corresponding inspection item descriptions to obtain the first shipment inspection standard.

[0087] In some embodiments, the second standard generating module 403 is specifically configured to:

[0088] In response to the inspection personnel's adjustment operation on the copied first shipment inspection standard, performing authority verification on the inspection personnel;

[0089] After the inspection personnel's authority is verified, the copied first shipment inspection standard will be displayed in the visual interface;

[0090] According to the inspection personnel's operation of adding inspection items or modifying the performance indicator requirements corresponding to the original inspection items, the displayed first shipment inspection standard is adjusted to obtain the second shipment inspection standard.

[0091] In some embodiments, the apparatus further comprises:

[0092] a report generation module, configured to generate a quality report based on the shipment inspection results after the semiconductor device is shipped according to the first shipment inspection standard and / or the second shipment inspection standard, wherein the quality report at least includes the inspection personnel, the inspection time, the item standard value / standard range, the item inspection value, and whether it passes;

[0093] a marking module, configured to mark, in response to at least one failed test item in the quality report, the failed test item so that production personnel can determine problems with the semiconductor equipment and perform repairs based on the marked test item;

[0094] The shipping module is used to generate a shipping inspection qualified report and label in response to all inspection items in the quality report being passed.

[0095] In some embodiments, a post-parsing processing module is further included, which is used to:

[0096] Arrange the extracted shipping information in ascending order according to shipping time; wherein the shipping information at least includes customer name, device serial number, device type, and shipping time;

[0097] According to the urgency of the shipment time, the shipment information is marked at different levels;

[0098] Display the shipping information on the display interface to facilitate inspection personnel to identify and understand customer needs and equipment information.

[0099] In some embodiments, it further includes:

[0100] The approval processing module is used to send the second shipment inspection standard to the designated personnel for approval, and after obtaining the approval message, execute the shipment inspection operation of the semiconductor equipment according to the first shipment inspection standard and / or the second shipment inspection standard in response to the inspection personnel's selection operation of the shipment inspection standard.

[0101] In some embodiments, the front-end processor is further configured to:

[0102] Receive changed customer quotation request files sent by the customer relationship system;

[0103] Generate a new preamble file based on the newly received customer quotation request file, and use the new preamble file to replace the old preamble file.

[0104] The semiconductor device shipment inspection apparatus provided by the embodiment of the present invention can execute the semiconductor device shipment inspection method provided by any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0105] Example 5

[0106] Figure 5 A schematic diagram of the structure of an electronic device 10 that can be used to implement an embodiment of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or claimed herein.

[0107] like Figure 5As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., which is communicatively connected to the at least one processor 11. The memory stores a computer program that can be executed by the at least one processor. The processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 into the random access memory (RAM) 13. Various programs and data required for the operation of the electronic device 10 can also be stored in the RAM 13. The processor 11, ROM 12, and RAM 13 are connected to each other via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0108] Multiple components in the electronic device 10 are connected to the I / O interface 15, including an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a magnetic disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0109] Processor 11 can be any general-purpose and / or specialized processing component with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various specialized artificial intelligence (AI) computing chips, various processors that run machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 executes the various methods and processes described above, such as executing a semiconductor device shipment inspection method.

[0110] In some embodiments, the semiconductor device shipment detection method can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as the storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the semiconductor device shipment detection method described above can be performed. Alternatively, in other embodiments, the processor 11 can be configured to execute the semiconductor device shipment detection method in any other appropriate manner (for example, by means of firmware).

[0111] Various embodiments of the systems and techniques described above can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0112] Computer programs for implementing the methods of the present invention can be written in any combination of one or more programming languages. These computer programs can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable semiconductor device shipment inspection device, so that when executed by the processor, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The computer programs can be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0113] In the context of the present invention, computer-readable storage media can be tangible media that can contain or store a computer program for use with an instruction execution system, device or equipment or used in combination with an instruction execution system, device or equipment. Computer-readable storage media can include but are not limited to electronic, magnetic, optical, electromagnetic, infrared or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, computer-readable storage media can be machine-readable signal media. More specific examples of machine-readable storage media can include electrical connections based on one or more lines, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0114] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0115] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0116] A computing system may include clients and servers. The clients and servers are typically remote from each other and typically interact via a communication network. This client-server relationship arises through computer programs running on the respective computers, creating a client-server relationship. The server may be a cloud server, also known as a cloud computing server or cloud host. This server is a hosting product within the cloud computing service ecosystem that addresses the management difficulties and limited scalability of traditional physical hosting and VPS services.

[0117] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in the present invention can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solution of the present invention can be achieved. This is not limited herein.

[0118] The above specific embodiments do not limit the scope of protection of the present invention. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

Claims

1. A method for detecting shipment of semiconductor equipment, characterized in that: include: Reading a pre-processor file from a front-end processor connected to a customer relationship system; wherein the pre-processor file is generated by the front-end processor based on a customer quotation request file pushed by the customer relationship system; Parsing the pre-file using file parsing technology, and generating a first shipment inspection standard based on the parsing result; Copying the first shipment inspection standard and generating a second shipment inspection standard in response to an inspection personnel adjusting the copied first shipment inspection standard; In response to the inspection personnel's selection of the shipment inspection standard, the semiconductor device is subjected to shipment inspection according to the first shipment inspection standard and / or the second shipment inspection standard.

2. The method according to claim 1, characterized in that The method of parsing the pre-installed file by using a file parsing technology and generating a first shipment inspection standard according to the parsing result includes: Extracting key data related to device performance from the pre-file using file parsing technology; Sorting out the extracted key data related to equipment performance, classifying and summarizing the various performance requirements scattered in the pre-installation documents, and obtaining a complete equipment performance indicator system; Based on the well-organized equipment performance indicator system, a standard framework for shipment inspection standards is established; The equipment performance indicators in the standard framework are converted into corresponding inspection item descriptions to obtain the first shipment inspection standard.

3. The method according to claim 1 or 2, characterized in that The generating of the second shipment inspection standard in response to the inspection personnel's adjustment operation on the copied first shipment inspection standard includes: In response to the inspection personnel's adjustment operation on the copied first shipment inspection standard, performing authority verification on the inspection personnel; After the inspection personnel's authority is verified, the copied first shipment inspection standard is displayed in the visual interface; According to the inspection personnel's operation of adding inspection items or modifying the performance indicator requirements corresponding to the original inspection items, the displayed first shipment inspection standard is adjusted to obtain the second shipment inspection standard.

4. The method according to claim 1, wherein After performing shipment inspection on the semiconductor device according to the first shipment inspection standard and / or the second shipment inspection standard, the method further includes: Generate a quality report based on the shipment inspection results, where the quality report includes at least the inspection personnel, inspection time, item standard value / standard range, item inspection value, and whether it passes; In response to at least one failed test item in the quality report, marking the failed test item so that production personnel can determine the problem of the semiconductor device and repair it according to the marked test item; In response to all the inspection items in the quality report being passed, a shipment inspection qualification report and label are generated.

5. The method according to claim 1, wherein After parsing the pre-file using the file parsing technology, the method further includes: Arrange the extracted shipping information in ascending order according to shipping time; wherein the shipping information at least includes customer name, device serial number, device type, and shipping time; According to the urgency of the shipping time, the shipping information is marked with different levels; The shipment information is displayed on the display interface to facilitate inspection personnel to identify and understand customer needs and equipment information.

6. The method according to claim 1, wherein After generating the second shipment inspection standard, it also includes: The second shipment inspection standard is sent to the designated personnel for approval, and after obtaining the approval message, the shipment inspection operation of the semiconductor equipment is performed in response to the inspection personnel's selection operation of the shipment inspection standard according to the first shipment inspection standard and / or the second shipment inspection standard.

7. The method according to claim 1, characterized in that The front-end processor is also used for: receiving a changed customer quotation request file sent by the customer relationship system; A new pre-file is generated according to the newly received customer quotation request file, and the new pre-file is used to replace the old pre-file.

8. A semiconductor device shipment inspection device, characterized in that: include: A file acquisition module is configured to read a pre-processor file from a front-end processor connected to a customer relationship system; wherein the pre-processor file is generated by the front-end processor based on a customer quotation request file pushed by the customer relationship system; A first standard generating module, configured to parse the pre-file using a file parsing technique and generate a first shipment inspection standard based on the parsing result; A second standard generating module is configured to copy the first shipment inspection standard and generate a second shipment inspection standard in response to an inspection personnel adjusting the copied first shipment inspection standard; The shipment inspection module is configured to perform shipment inspection on the semiconductor device according to the first shipment inspection standard and / or the second shipment inspection standard in response to the inspection personnel's selection operation on the shipment inspection standard.

9. An electronic device, characterized in that: include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores a computer program executable by the at least one processor. The computer program is executed by the at least one processor to enable the at least one processor to perform the method according to any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer instructions, and the computer instructions are used to enable a processor to implement the method according to any one of claims 1 to 7 when executed.

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