Display screen module and electronic equipment

Abstract

The invention relates to a display screen module and electronic equipment. The display screen module comprises a display panel, the display panel comprises a panel main body and a bending part connected with the panel main body, and the bending part is bent towards the non-display side of the display screen module relative to the panel main body; the circuit board comprises a main body part and a lap joint part protruding and extending from the main body part, the lap joint part is electrically connected with the bending part, the main body part is arranged on the non-display side of the panel main body, and the main body part is provided with an exposed electric connection area; and the chip is arranged in the electric connection area.

Description

Technical Field

[0001] The present disclosure relates to the field of terminal technology, and in particular to a display screen module and an electronic device. Background Art

[0002] COP (Chip On PI) screen packaging technology can achieve extremely narrow bezels and has become the mainstream packaging method used by major manufacturers. Conventional COP packaging technology involves bonding a portion of the screen to the driver IC and circuit board separately, then bending it to the non-display surface of the screen. Summary of the Invention

[0003] The present disclosure provides a display screen module and an electronic device to address the deficiencies in the related art.

[0004] According to a first aspect of an embodiment of the present disclosure, there is provided a display screen module, comprising:

[0005] A display panel, the display panel comprising a panel body and a bending portion connected to the panel body, the bending portion being bent relative to the panel body toward a non-display side of the display screen module;

[0006] a circuit board, the circuit board comprising a main body and a lap portion protruding from the main body, the lap portion being electrically connected to the bent portion, the main body being disposed on the non-display side of the panel body, and the main body being provided with an exposed electrical connection area;

[0007] A chip is arranged in the electrical connection area.

[0008] Optionally, the electrical connection area is arranged toward the panel body, or the electrical connection area is arranged away from the panel body.

[0009] Optionally, the electrical connection area is disposed toward the panel body;

[0010] The display screen module further includes a first pad, which is arranged between the main body and the panel body, and is arranged to avoid the electrical connection area.

[0011] Optionally, a second pad is further included, wherein the second pad is arranged between the panel body and the first pad, and the second pad covers the chip.

[0012] Optionally, the main body is divided into a plurality of wiring areas, and the plurality of wiring areas have different numbers of routing layers;

[0013] The electrical connection region is located in any one of the wiring regions, or the electrical connection region is located in a plurality of adjacent wiring regions.

[0014] Optionally, the plurality of wiring areas include a first wiring area adjacent to the overlapping portion and at least one second wiring area adjacent to the first wiring area;

[0015] On a side of the main body portion facing away from the panel body, the second wiring area is higher than the first wiring area.

[0016] Optionally, the first wiring area and the overlapping portion are located at the same height on a side facing away from the panel body, and the overlapping portion is higher than the first wiring area on a side facing the panel body.

[0017] Optionally, the number of routing layers at each position of the main body is the same.

[0018] Optionally, the main body further includes a first protective film, a second protective film, an insulating layer and at least one wiring layer, and the wiring layer and the insulating layer are arranged between the first protective film and the second protective film;

[0019] The main body includes a relief portion, which is recessed inward from the outer surface of the first protective film or the second protective film, so that a portion of any wiring layer is exposed to form the electrical connection area.

[0020] Optionally, the avoidance portion is a groove or the avoidance portion is sunken and communicated with the outer side of the side of the main body.

[0021] According to a second aspect of the embodiments of the present disclosure, an electronic device is provided, comprising the display screen module as described in any one of the above embodiments.

[0022] The technical solutions provided by the embodiments of the present disclosure may have the following beneficial effects:

[0023] It can be seen from the above embodiments that in the present disclosure, the chip is electrically connected to the circuit board, so each of the single-row routings of the bending portion can be arranged in a line segment style to avoid inclined routing, which is beneficial to saving length dimensions, and the circuit board can be designed as a multi-layer routing to further reduce the space occupied by the display module; at the same time, since the single-row routings of the bending portion are all arranged in a line segment style, it is beneficial for the routing ends of the bending portion to be used as connection ports to realize the reuse of the display panel.

[0024] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0026] Figure 1 This is a schematic diagram of the screen using COP packaging technology in related technology.

[0027] Figure 2 yes Figure 1 Schematic cross-section of .

[0028] Figure 3 yes Figure 1 A wiring diagram of the package area.

[0029] Figure 4 This is one of the structural schematic diagrams of a display screen module according to an exemplary embodiment.

[0030] Figure 5 yes Figure 4 Cross-sectional diagram of the display module.

[0031] Figure 6 yes Figure 5 A partial enlarged view of .

[0032] Figure 7 This is a second structural schematic diagram of a display screen module according to an exemplary embodiment.

[0033] Figure 8 yes Figure 7 Cross-sectional diagram of the display module.

[0034] Figure 9 yes Figure 8 A partial enlarged view of .

[0035] Figure 10 This is a third structural schematic diagram of a display screen module according to an exemplary embodiment.

[0036] Figure 11 yes Figure 10 Cross-sectional diagram of the display module.

[0037] Figure 12 yes Figure 11 A partial enlarged view of .

[0038] Figure 13 This is a fourth structural schematic diagram of a display screen module according to an exemplary embodiment.

[0039] Figure 14 yes Figure 13 Cross-sectional diagram of the display module.

[0040] Figure 15 yes Figure 14 A partial enlarged view of .

[0041] Figure 16This is a fifth structural diagram of a display screen module according to an exemplary embodiment.

[0042] Figure 17 yes Figure 16 Cross-sectional diagram of the display module.

[0043] Figure 18 yes Figure 17 A partial enlarged view of .

[0044] Figure 19 This is the sixth structural schematic diagram of a display screen module according to an exemplary embodiment.

[0045] Figure 20 yes Figure 19 Cross-sectional diagram of the display module.

[0046] Figure 21 yes Figure 20 A partial enlarged view of .

[0047] Figure 22 is a schematic cross-sectional view of a display screen module according to an exemplary embodiment.

[0048] Figure 23 yes Figure 22 A partial enlarged view of . DETAILED DESCRIPTION

[0049] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements, unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all possible embodiments consistent with the present disclosure. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure, as detailed in the appended claims.

[0050] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. As used in this disclosure and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0051] It should be understood that although the terms first, second, third, etc. may be used in this disclosure to describe various information, such information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this disclosure, first information may also be referred to as second information, and similarly, second information may also be referred to as first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining."

[0052] Figure 1 This is a schematic diagram of the screen using COP packaging technology in related technology. Figure 2 yes Figure 1 Schematic diagram of the cross section. Figure 1 and Figure 2 As shown, the package area 102 of the screen 101 is bonded to the circuit board 103 after being bent, and the driver IC 104 is bonded to the package area 102. Usually, the traces after the package area 102 is bent to the back are usually single-row traces with a relatively large width M1. The driver IC 104 needs to be electrically connected to each trace, and the width of the driver IC 104 is usually smaller than the width of the single-row traces. Therefore, Figure 3 As shown, the distal traces of the packaging area 102 are typically tilted to achieve fan-shaped inward contraction, reducing the width M1 of the single-row traces to achieve connection with the driver IC 104. However, the tilt of the distal traces increases the length M2 of the single-row traces in the packaging area 102, which is not conducive to the miniaturization of the screen 101.

[0053] Based on this, the present disclosure provides a display screen module, such as Figure 4-Figure 6 As shown, the display screen module includes a display panel 1, a circuit board 2, and a chip 3. Specifically, in terms of composition and structure, the display panel 1 may include a substrate and a thin film transistor layer. In terms of location and area, the display panel 1 may include a panel body 11 and a bending portion 12 connected to the panel body 11. The bending portion 12 is located on the outside and may be bent toward the non-display side of the display screen module 00 relative to the edge of the panel body 11. A portion of the bending portion 12 is disposed toward the back of the panel body 11 and a portion is disposed parallel to the panel body 11.

[0054] The circuit board 2 includes a main body 21 and a lap portion 22 protruding from the main body 21. The lap portion 22 is electrically connected to the bending portion 12. The main body 21 is arranged on the non-display side of the panel body 11, and the main body 21 is provided with an exposed electrical connection area 211. The chip 3 can be arranged in the electrical connection area 211. For example, the chip 3 can be welded to the solder pad of the electrical connection area 211, so as to be connected to the internal circuit of the electrical connection area 211. The signal sent by the terminal device controller of the display screen module can be transmitted to the chip 3 through the circuit board 2, and further transmitted to the display panel 1 through the circuit board 2 to realize control of the screen.

[0055] It can be seen from the above embodiments that in the present disclosure, the chip 3 is arranged on the circuit board 2, and the signal transmission between the chip 3 and the bending portion 12 can be realized through the internal routing of the circuit board 2. Therefore, by reasonably setting the width size of the circuit board 2, each routing in the single row of routings of the bending portion 12 can be set in a line segment style to avoid inclined routing, which is beneficial to saving length in the direction perpendicular to the arrangement direction of the single row of routings, and the circuit board 2 can be designed as multi-layer routing to further reduce the occupied space of the display screen module; at the same time, since the single row of routings of the bending portion 12 are all set in a line segment style, it is beneficial for the routing end of the bending portion 12 to serve as the connection port of the display panel 1, which is beneficial to realize the reuse of the display panel.

[0056] In some embodiments, as Figure 5 and Figure 6 As shown, the electrical connection area 211 is disposed away from the panel body 11, thereby avoiding interference between the panel body 11 and the chip 3 and reducing the gap requirement between the main body 21 and the panel body 11. In other embodiments, such as Figure 7-Figure 9 As shown, the electrical connection area 211 can also be set toward the panel body 11, so that the chip 3 can be set in the gap between the panel body 11 and the main body 21, which can avoid damage to the chip 3 when the parts are subsequently assembled on the non-display side of the display screen module, which is beneficial to protecting the chip 3.

[0057] Furthermore, the electrical connection area 211 is arranged toward the panel body 11, and the display screen module may also include a first pad 4, which is arranged between the main body 21 and the panel body 11, and the first pad 4 can avoid the electrical connection area 211. For example, the first pad 4 can be a whole pad with an opening or a groove, or the display screen module may also include multiple first pads 4, and the multiple first pads 4 are arranged around the electrical connection area 211. On the one hand, this prevents the display panel 1 from interfering with the chip 3, and on the other hand, the first pad 4 can buffer the impact on the display panel 1 and protect the chip 3.

[0058] The two sides of the first pad 4 can be directly bonded to the main body 21 and the panel body 11; in other embodiments, in order to further protect the chip 3, Figure 8 and Figure 9 As shown, the display screen module also includes a second pad 5, which is arranged between the first pad 4 and the panel body 11, and the second pad 5 covers the chip 3. On the one hand, the second pad 5 can further achieve cushioning. On the other hand, the second pad 5 can protect the chip 3 in the event of a fall or collision, preventing the chip 3 from being hit. The chip 3 and the circuit board 2 can be reused during subsequent maintenance, reducing maintenance costs. In the above embodiments, the first pad 4 and the second pad 5 can be flexible parts, such as foam, rubber, plastic, or silicone.

[0059] like Figure 10-15 As shown, the number of wiring layers at each position of the main body 21 is the same. In other words, the main body 21 is configured as a uniform thickness structure, which reduces the difficulty of processing the main body 21.

[0060] For example Figure 16-Figure 23 As shown, the main body 21 can be divided into multiple wiring areas, and the number of wiring layers in the multiple wiring areas is different. The electrical connection area 211 can be set in any wiring area, or the electrical connection area 211 can also be located in multiple adjacent wiring areas.

[0061] For example, Figure 18 As shown, the main body 21 is divided into a first wiring area 212 and a second wiring area 213. The number of routing layers in the first wiring area 212 is greater than the number of routing layers in the second wiring area 213. Therefore, when the first wiring area 212 and the second wiring area 213 share the same bottom routing layer, the height of the first wiring area 212 is higher than the height of the second wiring area 213. The electrical connection area 211 can be set on the side of the second wiring area 213 away from the panel body 11. In other implementations, the electrical connection area 211 can also be set in the first wiring area 212.

[0062] For example, Figure 21 As shown, the main body 21 is divided into a first wiring area 212 and a second wiring area 213, and the first wiring area 212 and the second wiring area 213 share the same bottom wiring layer. In this case, the electrical connection area 211 can be set on the side of the first wiring area 212 facing the panel body 11. Optionally, in other embodiments, Figure 21 The position of the electrical connection area 211 in FIG. 2 may be extended to the right, so that the electrical connection area 211 may be provided in the adjacent first wiring area 212 and the second wiring area 213 .

[0063] For the solution in which the main body 21 includes multiple wiring areas, such as Figure 18 、 Figure 21 and Figure 23 As shown, the multiple wiring areas include at least a first wiring area 212 and a second wiring area 213. The first wiring area 212 is adjacent to the overlapping portion 22. The first wiring area 212 and the second wiring area 213 are adjacent to each other. On the side of the main body 21 away from the panel body 11, the height of the second wiring area 213 is higher than the height of the first wiring area 212. Therefore, a step can be formed based on the height difference between the first wiring area 212 and the second wiring area 213. When the display screen module is subsequently assembled with other parts, the step can be used to accommodate adhesive colloid or other structures, thereby improving the compactness of the terminal device.

[0064] Furthermore, the first wiring area 212 and the overlapping portion 22 are located at the same height on the side facing away from the panel body 11. On the side facing the panel body 11, the overlapping portion 22 can be higher than the first wiring area 212, so as to facilitate the complete bonding of the overlapping portion 22 to the bending portion 12. The first wiring area 212 is set as close to the bending portion 12 as possible to facilitate the miniaturization of the display screen module.

[0065] It should be noted that in Figure 18 and Figure 21 In the illustrated embodiments, the first wiring region 212 and the second wiring region 213 share a bottom wiring layer as an example for description. In other embodiments, the first wiring region 212 and the second wiring region 213 may also share a top wiring layer. In still other embodiments, Figure 23 As shown, the first wiring area 212 and the second wiring area 213 only share the middle wiring layer, which can be specifically designed as needed and will not be described in detail here; Figure 16-Figure 23 In the illustrated embodiments, the main body 21 is taken as an example including a first wiring area 212 and a second wiring area 213. In other embodiments, the main body 21 may include three or more wiring areas, and the wiring layer relationship between any two adjacent wiring areas may refer to any of the aforementioned embodiments.

[0066] In the aforementioned embodiment, no matter the main body 21 includes only a single wiring area or multiple wiring areas, the electrical connection area 211 located in any one or multiple wiring areas can be arranged away from the panel body 11 or toward the panel body 11. For example, Figure 18 As shown, the electrical connection area 211 is arranged away from the panel body 11, so that the chip 3 can also be away from the panel body 11. Figure 21 and Figure 23 As shown, the electrical connection area 211 is disposed toward the panel body 11 , and thus the chip 3 is disposed toward the panel body 11 .

[0067] Regarding the division of the wiring areas in the aforementioned embodiment, the division is actually performed in the horizontal direction based on the thickness of each area of ​​the main body 21. Regardless of whether the main body 21 is divided into multiple wiring areas or has a uniform thickness structure, in the vertical direction, the main body 21 also includes a first protective film 214, a second protective film 215, an insulating layer 216, and at least one routing layer 217. The insulating layer 216 and the at least one routing layer 217 are both disposed between the first protective film 214 and the second protective film 215. For example, as shown in the aforementioned figures, the main body 21 may include six routing layers, which may include a top routing layer, a bottom routing layer, and a middle routing layer. The top routing layer, the bottom routing layer, and the middle routing layer may be connected through metallized holes. An insulating layer 216 may be disposed between adjacent routing layers. An insulating layer is disposed between the first protective film 214 and the top routing layer, and an insulating layer is disposed between the second protective film 215 and the bottom routing layer.

[0068] When the main body 21 is divided into multiple wiring areas, the length of some routing layers 217 can be shortened to form multiple areas of different thicknesses in the main body 21. It should be understood that when the main body 21 has multiple wiring areas of different thicknesses, the definition of the top and bottom routing layers of each wiring area can be adaptively changed, for example Figure 23 As shown in , the top side routing layer of the second wiring region 213 may be the middle routing layer of the first wiring region 212 , and the top side routing layer of the first wiring region 212 is shortened relative to other routing layers, thereby forming a relatively thin second wiring region.

[0069] Furthermore, the main body 21 may further include an escape portion 218, which may be recessed inward from the outer surface of the first protective film 214, so that a portion of any wiring layer is exposed to form an electrical connection area 211. Figure 6 、 Figure 12 and Figure 18 As shown, the electrical connection area 211 is formed on the side of the main body 21 away from the panel body 11. Figure 3 and Figure 18 As shown, the avoidance portion 218 only recesses the first protection film 214 and the insulating layer adjacent to the first protection film 214, thereby exposing a portion of the top side wiring layer to form an electrical connection area; for example, Figure 12 As shown, the avoidance portion 218 may include the first protection film 214 , multiple insulation layers 216 and at least one wiring layer, so that a portion of the middle wiring layer is exposed to form the electrical connection area 211 .

[0070] In some other embodiments, the avoidance portion 218 may be recessed from the outer surface of the second protective film 215 so that a portion of any wiring layer is exposed to form the electrical connection area 211. Figure 9 、 Figure 15 、 Figure 22 and Figure 23 , at this time the electrical connection area 211 is formed on the side of the main body 21 facing the panel body 11, further, as Figure 9 、 Figure 21 and Figure 23 As shown, the avoidance portion 218 only recesses the second protective film 215 and the insulating layer adjacent to the second protective film 215, thereby exposing a portion of the bottom wiring layer to form the electrical connection area 211; for example, Figure 15 As shown, the avoidance portion 218 can be internally arranged within the second protective film 215, multiple insulating layers 216, and at least one routing layer, thereby exposing a portion of the intermediate routing layer to form an electrical connection area 211. The specific design can be customized and is not limited in this disclosure. The solution in which the electrical connection area 211 is located in multiple adjacent routing areas is primarily applicable when the adjacent routing areas share at least one top or bottom routing layer.

[0071] In the above embodiment, if Figure 6 、 Figure 9 、 Figure 12 、 Figure 15 、 Figure 18 、 Figure 21 and Figure 23 The avoidance portion 218 may be provided as a groove structure, or in other embodiments, the avoidance portion 218 may be recessed and communicate with the outer side of the side of the main body 21. The specific design can be as needed.

[0072] Based on the display screen modules provided in the above embodiments, the present disclosure further provides an electronic device, which includes the display screen module described in any of the above embodiments. The electronic device may include a mobile phone terminal, a tablet terminal, or a wearable terminal.

[0073] Other embodiments of the present disclosure will readily occur to those skilled in the art after considering the specification and practicing the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present disclosure being indicated by the following claims.

[0074] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes can be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. A display screen module, characterized in that: include: A display panel, the display panel comprising a panel body and a bending portion connected to the panel body, the bending portion being bent relative to the panel body toward a non-display side of the display screen module; a circuit board, the circuit board comprising a main body and a lap portion protruding from the main body, the lap portion being electrically connected to the bent portion, the main body being disposed on the non-display side of the panel body, and the main body being provided with an exposed electrical connection area; A chip is arranged in the electrical connection area.

2. The display screen module according to claim 1, wherein: The electrical connection area is disposed toward the panel body, or the electrical connection area is disposed away from the panel body.

3. The display screen module according to claim 2, wherein: The electrical connection area is disposed toward the panel body; The display screen module further includes a first pad, which is arranged between the main body and the panel body, and is arranged to avoid the electrical connection area.

4. The display screen module according to claim 3, wherein: The device further includes a second pad, which is arranged between the panel body and the first pad, and covers the chip.

5. The display screen module according to claim 1, wherein: The main body is divided into a plurality of wiring areas, and the number of routing layers in the plurality of wiring areas is different; The electrical connection region is located in any one of the wiring regions, or the electrical connection region is located in a plurality of adjacent wiring regions.

6. The display screen module according to claim 5, characterized in that: The plurality of wiring areas include a first wiring area adjacent to the overlapping portion and at least one second wiring area adjacent to the first wiring area; On a side of the main body portion facing away from the panel body, the second wiring area is higher than the first wiring area.

7. The display screen module according to claim 6, wherein: The first wiring area and the overlapping portion are located at the same height on a side facing away from the panel body, and the overlapping portion is higher than the first wiring area on a side facing the panel body.

8. The display screen module according to claim 1, wherein: The number of routing layers at each position of the main body is the same.

9. The display screen module according to claim 1, wherein: The main body further includes a first protective film, a second protective film, an insulating layer and at least one wiring layer, wherein the wiring layer and the insulating layer are arranged between the first protective film and the second protective film; The main body includes a relief portion, which is recessed inward from the outer surface of the first protective film or the second protective film, so that a portion of any wiring layer is exposed to form the electrical connection area.

10. The display screen module according to claim 9, characterized in that: The avoidance portion is a groove or the avoidance portion is sunken and communicated with the outer side of the side of the main body.

11. An electronic device, characterized in that: The invention comprises a display screen module as claimed in any one of claims 1 to 10.

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