Package structure and thermally conductive resin composition

Abstract

The embodiment of the invention provides a packaging structure and a heat-conducting resin composition. The packaging structure comprises at least two stacked printed circuit boards, electronic elements arranged on the printed circuit boards, and a first resin composite material heat-conducting structure arranged in a gap between at least one adjacent two printed circuit boards, or, the packaging structure comprises a printed circuit board and a heat dissipation piece which are stacked, an electronic element arranged on the printed circuit board, and a first resin composite material heat conduction structure which is arranged in a gap between the printed circuit board and the heat dissipation piece and is in contact connection with the heat dissipation piece. According to the packaging structure, the gaps between the printed circuit boards or between the printed circuit board and the heat dissipation piece are filled with the resin composite material heat conduction structures, heat dissipation of the electronic elements on the printed circuit boards is facilitated, the overall heat dissipation capacity of the packaging structure is improved, and then the overall heat dissipation performance of the electronic equipment is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of semiconductor packaging technology, and in particular to a packaging structure and a thermally conductive resin composition. Background Art

[0002] With the development of high density and high integration of electronic devices, their power consumption is increasing. Therefore, it is crucial to improve the high performance heat dissipation capability of electronic devices. Generally speaking, the heat generated by the chip in the electronic device usually needs to be diffused to the outside with the help of a heat sink. Figure 1 and Figure 2 As shown, the traditional heat dissipation mode is unidirectional heat dissipation, and the heat-conducting material 3 is used only on the top of the heat-generating chip 1 in the shielding cover 2 for heat dissipation, and the back of the circuit board 4 cannot effectively dissipate heat; for the multi-layer stacked single board (i.e., circuit board) architecture, when stacked and packaged, there is a large stacking gap 5 between the single boards, and the air thermal resistance in the stacking gap 5 is large (the thermal conductivity coefficient of air is only 0.026W / (m·K)), and the heat-generating chip 1 can only dissipate heat through one end of the shielding cover 2, which is not conducive to the heat dissipation of the entire electronic device. Summary of the Invention

[0003] In view of this, embodiments of the present application provide a packaging structure and a thermally conductive resin composition. The packaging structure facilitates heat dissipation of electronic components on the printed circuit boards by filling the gaps between printed circuit boards, or between printed circuit boards and heat sinks, thereby improving the overall heat dissipation capacity of the packaging structure and thereby enhancing the overall heat dissipation performance of the electronic device.

[0004] A first aspect of an embodiment of the present application provides a packaging structure, comprising at least two stacked printed circuit boards, electronic components disposed on the printed circuit boards, and a first resin composite material heat-conducting structure disposed in a gap between at least two adjacent printed circuit boards;

[0005] Alternatively, the packaging structure includes a stacked printed circuit board and a heat sink, electronic components arranged on the printed circuit board, and a first resin composite material heat-conducting structure arranged in a gap between the printed circuit board and the heat sink and in contact with the heat sink.

[0006] The packaging structure of the embodiment of the present application facilitates heat dissipation of electronic components on the printed circuit boards by filling the gaps between printed circuit boards or between printed circuit boards and heat sinks with a resin composite material thermally conductive structure, thereby improving the overall heat dissipation capacity of the packaging structure and thereby enhancing the overall heat dissipation performance of the electronic device.

[0007] In an embodiment of the present application, the first resin composite material heat-conducting structure connects the two adjacent printed circuit boards to form a continuous heat-conducting channel between the two adjacent printed circuit boards; or the first resin composite material heat-conducting structure connects the first printed circuit board and the first heat sink to form a continuous heat-conducting channel between the first printed circuit board and the first heat sink. The formation of a continuous heat-conducting channel facilitates the rapid conduction of heat generated by electronic components on the printed circuit board along the thickness direction of the printed circuit board.

[0008] In an embodiment of the present application, the first resin composite thermally conductive structure completely covers the electronic component located between the two adjacent printed circuit boards; or the first resin composite thermally conductive structure completely covers the electronic component located between the first printed circuit board and the first heat sink. Completely covering the electronic component with the resin composite thermally conductive structure allows heat generated by the electronic component to be rapidly transferred from multiple directions to the resin composite thermally conductive structure, thereby improving the heat dissipation performance of the packaging structure.

[0009] In the embodiment of the present application, the orthographic projection of the electronic components on the printed circuit board in the thickness direction of the printed circuit board is located within the orthographic projection of the first resin composite material heat-conducting structure in the thickness direction of the printed circuit board. This arrangement can increase the heat dissipation area of ​​the packaging structure.

[0010] In an embodiment of the present application, the packaging structure further includes a support frame; the support frame is disposed between two adjacent printed circuit boards, the support frame and the two adjacent printed circuit boards enclose a receiving space, the first resin composite material heat-conducting structure is located in the receiving space, and the first resin composite material heat-conducting structure partially fills or completely fills the receiving space;

[0011] Alternatively, the support frame is disposed between the printed circuit board and the heat sink, the support frame, the printed circuit board, and the heat sink enclosing a receiving space, the first resin composite heat-conducting structure being located within the receiving space, and the first resin composite heat-conducting structure partially or completely filling the receiving space. The support frame can support two adjacent printed circuit boards to separate the two adjacent printed circuit boards and the electronic components disposed thereon, and to protect the electronic components. The support frame can support the printed circuit board and the heat sink to separate the printed circuit board and the electronic components disposed thereon from the heat sink, and to protect the electronic components.

[0012] In an embodiment of the present application, the at least two stacked printed circuit boards include a first printed circuit board and a second printed circuit board, the electronic components include a first type of electronic components and a second type of electronic components, the first printed circuit board includes a first surface and a second surface arranged opposite to each other, the second surface is arranged facing the second printed circuit board, and the first surface is provided with the first type of electronic components; the second printed circuit board includes a third surface and a fourth surface arranged opposite to each other, and the third surface and / or the fourth surface is provided with the second type of electronic components.

[0013] In an embodiment of the present application, the printed circuit board includes a first printed circuit board, the electronic components include a first type of electronic components and a second type of electronic components, the first printed circuit board includes a first surface and a second surface arranged opposite to each other, the first surface is provided with the first type of electronic components, and the second surface is arranged facing the heat sink.

[0014] In the embodiment of the present application, the first type of electronic components include heat-generating chips; the second type of electronic components include devices.

[0015] In an embodiment of the present application, the packaging structure further includes a shielding cover disposed on the first surface. The shielding cover and the first printed circuit board form a confined space. The heating chip is located within the confined space, and the confined space is filled with a thermally conductive material. The heating chip is the primary heat-generating component in an electronic device. Providing thermally conductive material around the heating chip facilitates the conduction of heat generated by the heating chip toward the shielding cover, and then through the electronic device housing to the external environment.

[0016] In an embodiment of the present application, the thermally conductive material includes a second resin composite thermally conductive structure, which is disposed in contact between the heating chip and the shielding cover. The second resin composite thermally conductive structure is made of the same material as the first resin composite thermally conductive structure. The second resin composite thermally conductive structure is disposed in contact between the heating chip and the shielding cover, thereby forming a continuous thermally conductive path between the heating chip and the shielding cover. This allows heat generated by the heating chip to be quickly transferred to one side of the shielding cover, thereby preventing localized heat accumulation in the heating chip.

[0017] In the embodiment of the present application, the locations of the heating chip not in contact with the first printed circuit board are all covered by the second resin composite material heat-conducting structure. Covering each exposed surface of the heating chip with the second resin composite material heat-conducting structure can disperse the heat generated by the heating chip in multiple directions and quickly conduct it upward or downward to the shielding cover and the second surface of the first printed circuit board, thereby preventing localized heat accumulation in the heating chip.

[0018] In the embodiment of the present application, the at least two stacked printed circuit boards further include another printed circuit board stacked on a side of the second printed circuit board away from the first printed circuit board.

[0019] In an embodiment of the present application, the packaging structure further includes a heat sink stacked on one side of the at least two stacked printed circuit boards. The gap between the printed circuit boards and the heat sink is filled with a third resin composite thermal conductive structure made of the same material as the first resin composite thermal conductive structure. Providing a resin composite thermal conductive structure between the multi-layer stack of printed circuit boards and the heat sink enables rapid heat transfer from the multi-layer stack of printed circuit boards to the heat sink.

[0020] In an embodiment of the present application, at least one of the two outermost printed circuit boards of the at least two stacked printed circuit boards, as well as the intermediate printed circuit board, has a through-hole configured to serve as a potting port for the resin composition forming the first resin composite material thermally conductive structure; or one of the printed circuit boards has a through-hole configured to serve as a potting port for the resin composition forming the first resin composite material thermally conductive structure. By employing potting and filling, the resin composite material thermally conductive structure avoids the challenges of high-temperature reflow soldering required for coating and preparing the resin composition. This not only reduces the high-temperature resistance requirements of the resin composite material thermally conductive structure, expands the range of resin options, and helps reduce costs, but also improves soldering reliability and the reliability of electronic components on the circuit board.

[0021] In an embodiment of the present application, the first resin composite thermally conductive structure includes a resin matrix and a thermally conductive filler distributed within the resin matrix. A shielding structure is provided at the through-hole on the outermost printed circuit board; or a shielding structure is provided at the through-hole on the first printed circuit board. The provision of the shielding structure can effectively prevent signal leakage and signal interference.

[0022] In an embodiment of the present application, the first resin composite thermally conductive structure includes a resin matrix, and thermally conductive and absorbing fillers distributed within the resin matrix. The absorbing fillers are used to absorb electromagnetic waves. Alternatively, the through-holes on the outermost printed circuit board are left unshielded and lack a shielding structure. Alternatively, the through-holes on the first printed circuit board are left unshielded and lack a shielding structure. This embodiment achieves high thermal conductivity and heat dissipation, effectively preventing signal leakage and crosstalk, and eliminates the need for shielding adhesive, saving assembly costs.

[0023] In the embodiment of the present application, the resin matrix comprises 1% to 20% by weight of the resin, 30% to 90% by weight of the thermally conductive filler, and 2% to 60% by weight of the absorbing filler. The appropriate proportions of these components help achieve a better balance of desired strength, adhesion, fluidity, thermal conductivity, and absorbing properties.

[0024] In the embodiments of the present application, the resin matrix includes one or more of silicone polymers, epoxy polymers, urethane polymers, phenolic polymers, polyimide polymers, acrylonitrile butadiene rubber, ethylene-propylene-diene rubber, ethylene-propylene rubber, natural rubber, polybutadiene rubber, polyisoprene rubber, polyester, polyurethane, polyacrylate, and derivatives thereof. These resins have good curability, low viscosity, suitable adhesion, and high bulk strength, facilitating potting and rework operations.

[0025] In an embodiment of the present application, the organosilicon polymer includes organopolysiloxane, and the organopolysiloxane includes alkenyl-containing organopolysiloxane and hydrogen-containing organopolysiloxane.

[0026] In the embodiment of the present application, in the resin matrix, the molar ratio of the hydrosilyl groups in the hydrogen-containing organopolysiloxane to the vinyl groups in the alkenyl-containing organopolysiloxane is 0.3 to 3. Proper control of the ratio is beneficial to improving the performance of the resin matrix.

[0027] In the embodiment of the present application, the thermally conductive filler includes one or more of carbides, nitrides, oxides, metal powders and compounds thereof. The thermally conductive filler has a high thermal conductivity coefficient and can effectively improve the thermal conductivity of the thermally conductive resin composition.

[0028] In the embodiment of the present application, in order to better achieve a balance between high thermal conductivity and high fluidity at a high thermal conductive filler filling fraction, the thermal conductive filler is a mixture of thermal conductive fillers having at least two average particle sizes.

[0029] In the embodiments of the present application, the absorbing filler includes one or more of Fe, Ni, Co, and their alloys, carbon-based materials, iron-based materials, transition metal carbides, transition metal nitrides, and transition metal carbonitrides. These materials have absorbing properties, enabling the resin composite thermally conductive structure to achieve absorbing properties.

[0030] In the embodiment of the present application, the absorbing filler includes a spherical powder absorbing filler and a non-spherical absorbing filler. Compounding absorbing fillers with different morphologies is conducive to obtaining better absorbing performance.

[0031] In the embodiment of the present application, the weight ratio of the non-spherical absorbing filler to the spherical powder absorbing filler is in the range of 0.05-0.2.

[0032] In the embodiment of the present application, the D50 particle size of the spherical powder absorbing filler is in the range of 1 μm to 50 μm; the maximum lateral dimension of the non-spherical absorbing filler is in the range of 3 μm to 50 μm. Both types of absorbing fillers have suitable particle sizes, which is beneficial for balancing absorbing performance and fluidity.

[0033] In embodiments of the present application, the thermal conductivity of the first resin composite thermally conductive structure is greater than 1 W / mk, and the interfacial adhesion between the first resin composite thermally conductive structure and the printed circuit board is less than 35 psi. The higher thermal conductivity facilitates heat dissipation, while the lower interfacial adhesion facilitates post-fill repair operations.

[0034] In this embodiment, the thermal resistance of the first resin composite thermally conductive structure changes by less than 15% after aging at 125°C, cyclic aging between -40°C and 125°C, and aging at 85°C and 85% relative humidity. This resin composite thermally conductive structure exhibits excellent aging resistance, improving reliability and extending service life.

[0035] In this embodiment of the present application, the magnetic loss tangent or dielectric loss tangent of the first resin composite thermally conductive structure is greater than 0.1, and the dielectric strength of the first resin composite thermally conductive structure is greater than 500V / mm. The resin composite thermally conductive structure has excellent insulation and voltage resistance, which is beneficial for improving the performance of the packaging structure.

[0036] A second aspect of an embodiment of the present application provides a thermally conductive resin composition, comprising a resin, a thermally conductive filler, and a wave-absorbing filler, wherein the wave-absorbing filler comprises a spherical powder wave-absorbing filler and a non-spherical wave-absorbing filler.

[0037] In the embodiment of the present application, the weight ratio of the non-spherical absorbing filler to the spherical powder absorbing filler is in the range of 0.05-0.2.

[0038] In the embodiment of the present application, the D50 particle size of the spherical powder absorbing filler is in the range of 1 μm-50 μm; the maximum lateral dimension of the non-spherical absorbing filler is in the range of 3 μm-50 μm.

[0039] In an embodiment of the present application, the absorbing filler includes one or more of Fe, Ni, Co and their alloys, carbon-based materials, iron-based materials, transition metal carbides, transition metal nitrides, and transition metal carbonitrides.

[0040] In an embodiment of the present application, the thermally conductive filler includes one or more of carbides, nitrides, oxides, metal powders and compounds thereof.

[0041] In an embodiment of the present application, the resin includes one or more of silicone polymers, epoxy polymers, urethane polymers, phenolic polymers, polyimide polymers, acrylonitrile butadiene rubber, ethylene-propylene-diene rubber, ethylene-propylene rubber, natural rubber, polybutadiene rubber, polyisoprene rubber, polyester, polyurethane, polyacrylate and their derivatives.

[0042] In an embodiment of the present application, the organosilicon polymer includes an organopolysiloxane, and the organopolysiloxane includes an alkenyl-containing organopolysiloxane and a hydrogen-containing organopolysiloxane; in the thermally conductive resin composition, the molar ratio of the hydrosilyl group in the hydrogen-containing organopolysiloxane to the vinyl group in the alkenyl-containing organopolysiloxane is 0.3-3.

[0043] In the embodiment of the present application, in the thermally conductive resin composition, the mass percentage of the resin is 1%-20%; the mass percentage of the thermally conductive filler is 30%-90%; and the mass percentage of the absorbing filler is 2%-60%.

[0044] In an embodiment of the present application, the thermally conductive resin composition further includes an auxiliary agent, which includes one or more of a filler treatment agent, a catalyst, an inhibitor, a coupling agent, an antioxidant, an anti-settling agent, and a color paste; the mass percentage of the auxiliary agent is less than 5%.

[0045] In the embodiment of the present application, the magnetic loss tangent value or the dielectric loss tangent value of the thermally conductive resin composition is greater than 0.1.

[0046] In an embodiment of the present application, the room temperature viscosity of the thermally conductive resin composition is in the range of 2000 cP-200000 cP; the extrusion rate of the thermally conductive resin composition is greater than 15 g / min; the thermal conductivity of the thermally conductive resin composition is greater than 1 W / mk; the interfacial adhesion between the thermally conductive resin composition and the printed circuit board is less than 35 psi; the thermal resistance change of the thermally conductive resin composition after high-temperature aging at 125°C, high and low temperature alternating cycle aging at -40°C to 125°C, and aging at 85°C and 85% relative humidity is less than 15%; the dielectric strength of the thermally conductive resin composition is greater than 500 V / mm.

[0047] An embodiment of the present application further provides an electronic device, comprising the packaging structure described in the first aspect, or using the thermally conductive resin composition described in the second aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 and Figure 2 This is a schematic diagram of the traditional heat dissipation mode structure of the heat-generating chip;

[0049] Figure 3 A schematic cross-sectional view of a packaging structure 100 provided in one embodiment of the present application;

[0050] Figure 4 A schematic cross-sectional view of a packaging structure 100 provided in another embodiment of the present application;

[0051] Figure 5 A schematic cross-sectional view of a packaging structure 100 provided in another embodiment of the present application;

[0052] Figure 6 A schematic cross-sectional view of a packaging structure 100 provided in another embodiment of the present application;

[0053] Figure 7 A schematic cross-sectional view of a packaging structure 100 provided in another embodiment of the present application;

[0054] Figure 8 A schematic cross-sectional view of a packaging structure 100 provided in another embodiment of the present application;

[0055] Figure 9 A schematic cross-sectional view of a packaging structure 100 provided in another embodiment of the present application;

[0056] Figure 10 A schematic cross-sectional view of a packaging structure 100 provided in another embodiment of the present application;

[0057] Figure 11 A schematic cross-sectional view of a packaging structure 100 provided in another embodiment of the present application;

[0058] Figure 12 This is a schematic cross-sectional structural diagram of a packaging structure 100 provided in another embodiment of the present application. DETAILED DESCRIPTION

[0059] The embodiments of the present application will be described below with reference to the accompanying drawings.

[0060] With the development of high density and high integration of electronic equipment, its power consumption continues to grow. Therefore, the improvement of high performance heat dissipation capability of electronic equipment becomes crucial. At present, the heat dissipation mode of the heat-generating chip in the electronic equipment is one-way heat dissipation, and the back of the circuit board where the heat-generating chip is located cannot effectively dissipate heat; and for the multi-layer stacked single board (i.e., circuit board) architecture, when stacked and packaged, there is a large stacking gap between the single boards, and the air thermal resistance in the stacking gap is large, which is not conducive to the heat dissipation of the entire electronic equipment. To this end, an embodiment of the present application provides a packaging structure, which is beneficial to the heat dissipation of electronic components on the printed circuit board by filling a resin composite material heat-conducting structure in the gap between the printed circuit board and the printed circuit board, or the printed circuit board and the heat sink, thereby improving the heat dissipation capability of the packaging structure as a whole, and then improving the heat dissipation performance of the entire electronic equipment.

[0061] For the convenience of description, the embodiment of the present application defines the thickness direction of the printed circuit board, that is, the stacking direction of the printed circuit board and the heat sink as the first direction.

[0062] See also Figure 3 , Figure 3 FIG. 1 is a schematic diagram of a cross-sectional structure of a packaging structure 100 provided in one embodiment of the present application. Figure 3 As shown, in this embodiment, the packaging structure 100 includes at least two stacked printed circuit boards (101a, 101b), electronic components (102a, 102b) provided on the printed circuit boards (101a, 101b), and a first resin composite material heat-conducting structure 103a provided in the gap between at least two adjacent printed circuit boards (101a, 101b). Signals are interconnected between at least two stacked printed circuit boards. The packaging structure of the embodiment of the present application, by filling the stacking gap between the adjacent printed circuit boards in the multi-layer stack, can quickly conduct the heat generated by the electronic components on the printed circuit board to both sides along the thickness direction, thereby facilitating the heat dissipation of the electronic components on the printed circuit board, improving the overall heat dissipation capacity of the packaging structure, and thereby improving the heat dissipation performance of the electronic device.

[0063] In an embodiment of the present application, a first resin composite heat-conducting structure 103a connects two adjacent printed circuit boards (101a, 101b) to form a continuous heat-conducting channel between the two adjacent printed circuit boards (101a, 101b). The first resin composite heat-conducting structure 103a is in contact with and connected to the two adjacent printed circuit boards (101a, 101b). The formation of a continuous heat-conducting channel between the two adjacent printed circuit boards facilitates the rapid conduction of heat generated by electronic components on the printed circuit boards along the stacking direction of the printed circuit boards.

[0064] In an embodiment of the present application, the packaging structure 100 further includes a support frame 105 disposed between two adjacent printed circuit boards (101a, 101b), the support frame 105 and the two adjacent printed circuit boards (101a, 101b) enclose a receiving space 106, and the first resin composite material thermal conductive structure 103a is located in the receiving space 106.

[0065] The support frame 105 can be made of metal or polymer. The support frame 105 is used to support two adjacent printed circuit boards (101a, 101b) to separate the two adjacent printed circuit boards (101a, 101b) and the electronic components arranged thereon, and to protect the electronic components. The support frame 105 is a cylindrical structure having through holes in the stacking direction of the printed circuit boards (i.e., the first direction). The two ends of the support frame 105 along the first direction are respectively connected to the two adjacent printed circuit boards (101a, 101b). In some embodiments, the support frame 105 is a U-shaped cylindrical structure with a through hole in the middle. The electronic components located between the two adjacent printed circuit boards (101a, 101b), that is, the electronic components located on the facing surfaces of the two adjacent printed circuit boards (101a, 101b), are accommodated in the receiving space 106 surrounded by the support frame 105 and the two adjacent printed circuit boards (101a, 101b) to be protected.

[0066] In the embodiment of the present application, to better achieve timely heat dissipation of the electronic components, the first resin composite material heat-conducting structure 103a completely covers the electronic component 102b located between the two adjacent printed circuit boards (101a, 101b). That is, the surface of the electronic component 102b between the two adjacent printed circuit boards (101a, 101b) that is not in contact with the printed circuit boards (101a, 101b) is covered by the first resin composite material heat-conducting structure 103a. The complete covering of the electronic component by the first resin composite material heat-conducting structure 103a allows the heat generated by the electronic component to be quickly transferred to the first resin composite material heat-conducting structure 103a from multiple directions, thereby improving the heat dissipation performance of the packaging structure.

[0067] In an embodiment of the present application, in order to better achieve timely heat dissipation of electronic components, the orthographic projection of the electronic components (102a, 102b) on the printed circuit boards (101a, 101b) in the thickness direction (i.e., the first direction) of the printed circuit boards (101a, 101b) is located within the orthographic projection of the first resin composite material heat-conducting structure 103a in the thickness direction (i.e., the first direction) of the printed circuit boards (101a, 101b). This arrangement can increase the heat dissipation area of ​​the packaging structure. In some embodiments of the present application, the orthographic projection area of ​​the first resin composite material heat-conducting structure 103a in the first direction is equal to the orthographic projection area of ​​all electronic components (102a, 102b) on the printed circuit boards (101a, 101b) in the first direction, and the two completely overlap. In other embodiments of the present application, the orthographic projection area of ​​the first resin composite material heat-conducting structure 103a in the first direction is greater than the orthographic projection area of ​​all electronic components (102a, 102b) on the printed circuit boards (101a, 101b) in the first direction.

[0068] See also Figure 4 , Figure 4Schematic diagram of the cross-sectional structure of the packaging structure 100 in another embodiment of the present application. The first resin composite material heat-conducting structure 103a may partially fill the receiving space 106, that is, the gap between the two adjacent printed circuit boards (101a, 101b) is only partially filled by the first resin composite material heat-conducting structure 103a. However, since the gap portion not filled by the first resin composite material heat-conducting structure 103a still has a large air thermal resistance, in order to obtain better heat conduction and heat dissipation effects, the first resin composite material heat-conducting structure 103a may be completely filled with the receiving space 106. Figure 3 As shown, the first resin composite material heat-conducting structure 103a completely fills the receiving space 106, so that the gap between the two adjacent printed circuit boards (101a, 101b) is filled with the first resin composite material heat-conducting structure 103a.

[0069] Continue to see Figure 3 In an embodiment of the present application, at least two stacked printed circuit boards (101a, 101b) include a first printed circuit board 101a and a second printed circuit board 101b, and the electronic components (102a, 102b) include first-type electronic components 102a and second-type electronic components 102b. The first printed circuit board 101a includes a first surface S1 and a second surface S2 disposed opposite to each other, the second surface S2 facing the second printed circuit board 101b, and the first surface S1 is provided with the first-type electronic components 102a; the second printed circuit board 101b includes a third surface S3 and a fourth surface S4 disposed opposite to each other, the third surface S3 facing the second surface S2, and the third surface S3 and / or the fourth surface S4 are provided with the second-type electronic components 102b. The second surface S2 may also be provided with the second-type electronic components 102b. The third surface S3 and the fourth surface S4 may be provided with the second-type electronic components 102b on either or both surfaces. The first type of electronic components 102a include heat-generating chips, which can include various types of chips, such as system-on-chips (SOCs) and radio frequency chips. The second type of electronic components 102b can include devices, such as memory, inductors, and capacitors. The number and types of electronic components on the first and second printed circuit boards 101a, 101b can be designed based on actual needs.

[0070] See also Figure 5 , Figure 5 FIG. 1 is a schematic cross-sectional view of a packaging structure 100 provided in another embodiment of the present application. Figure 5As shown, in this embodiment, the packaging structure 100 includes a stacked printed circuit board 101a and a heat sink 104, electronic components (102a, 102b) disposed on the printed circuit board 101a, and a first resin composite material heat-conducting structure 103a disposed in the gap between the printed circuit board 101a and the heat sink 104 and in contact with the heat sink 104. The packaging structure of the embodiment of the present application, by filling the stacked gap between the stacked printed circuit boards and the heat sink with the resin composite material heat-conducting structure, can quickly conduct heat generated by the electronic components on the printed circuit board to the heat sink along the thickness direction, thereby facilitating the heat dissipation of the electronic components on the printed circuit board, improving the overall heat dissipation capacity of the packaging structure, and thus enhancing the overall heat dissipation performance of the electronic device.

[0071] In the embodiment of the present application, the first resin composite thermally conductive structure 103a connects the printed circuit board 101a and the heat sink 104 to form a continuous heat conduction path between the printed circuit board 101a and the heat sink 104. The first resin composite thermally conductive structure 103a is in contact with and connected to the printed circuit board 101a and the heat sink 104, respectively. The formation of a continuous heat conduction path between the printed circuit board 101a and the heat sink 104 facilitates the rapid conduction of heat generated by the electronic components on the printed circuit board to the heat sink along the stacking direction of the printed circuit boards.

[0072] In an embodiment of the present application, the packaging structure 100 further includes a support frame 105 disposed between the printed circuit board 101a and the heat sink 104. The support frame 105, the printed circuit board 101a, and the heat sink 104 form a receiving space 106. The first resin composite material thermal conductive structure 103a is located in the receiving space 106.

[0073] The support frame 105 can be made of metal or polymer material. The support frame 105 is used to support the printed circuit board 101a and the heat sink 104 to separate the printed circuit board 101a and the electronic components arranged thereon from the heat sink 104 and protect the electronic components. The support frame 105 is a cylindrical structure having a through hole in the thickness direction of the printed circuit board (i.e., the first direction). The two ends of the support frame 105 along the first direction are respectively connected to the printed circuit board 101a and the heat sink 104. In some embodiments, the support frame 105 is a U-shaped cylindrical structure passing through the middle. The electronic components between the printed circuit board 101a and the heat sink 104, that is, the electronic components on the surface of the printed circuit board 101a facing the heat sink 104, are accommodated in the receiving space 106 surrounded by the support frame 105, the printed circuit board 101a, and the heat sink 104 to be protected.

[0074] In the embodiment of the present application, to better achieve timely heat dissipation of the electronic components, the first resin composite material heat-conducting structure 103a completely covers the electronic component 102b located between the printed circuit board 101a and the heat sink 104. That is, the surface of the electronic component 102b between the printed circuit board 101a and the heat sink 104 that is not in contact with the printed circuit board 101a is covered by the first resin composite material heat-conducting structure 103a. The complete coverage of the electronic component by the first resin composite material heat-conducting structure 103a allows the heat generated by the electronic component to be quickly transferred to the first resin composite material heat-conducting structure 103a from multiple directions, thereby improving the heat dissipation performance of the packaging structure.

[0075] In an embodiment of the present application, in order to better achieve timely heat dissipation of electronic components, the orthographic projection of the electronic components (102a, 102b) on the printed circuit board 101a in the thickness direction (i.e., the first direction) of the printed circuit board 101a is located within the orthographic projection of the first resin composite material heat-conducting structure 103a in the thickness direction (i.e., the first direction) of the printed circuit board 101a. This arrangement can increase the heat dissipation area of ​​the packaging structure. In some embodiments of the present application, the orthographic projection area of ​​the first resin composite material heat-conducting structure 103a in the first direction is equal to the orthographic projection area of ​​all electronic components (102a, 102b) on the printed circuit board 101a in the first direction, and the two completely overlap. In other embodiments of the present application, the orthographic projection area of ​​the first resin composite material heat-conducting structure 103a in the first direction is greater than the orthographic projection area of ​​all electronic components (102a, 102b) on the printed circuit board 101a in the first direction.

[0076] See also Figure 6 , Figure 6 Schematic diagram of the cross-sectional structure of the packaging structure 100 in another embodiment of the present application. The first resin composite heat-conducting structure 103a may partially fill the receiving space 106, that is, the gap between the printed circuit board 101a and the heat sink 104 is only partially filled by the first resin composite heat-conducting structure 103a. However, since the gap portion not filled by the first resin composite heat-conducting structure 103a still has a large air thermal resistance, in order to obtain better heat conduction and heat dissipation effects, the first resin composite heat-conducting structure 103a may be made to completely fill the receiving space 106. Figure 5 As shown, the first resin composite material heat-conducting structure 103a completely fills the receiving space 106, so that the gap between the two adjacent printed circuit boards (101a, 101b) is filled with the first resin composite material heat-conducting structure 103a.

[0077] Continue to see Figure 5In the embodiment of the present application, the printed circuit board 101a is the first printed circuit board 101a, and the electronic components (102a, 102b) include a first type of electronic components 102a and a second type of electronic components 102b. The first printed circuit board 101a includes a first surface S1 and a second surface S2 arranged opposite to each other, the second surface S2 is arranged facing the heat sink 104, and the first surface S1 is provided with the first type of electronic components 102a. The second surface S2 can be provided with the second type of electronic components 102b. Among them, the first type of electronic components 102a include heat-generating chips; the heat-generating chips can include various types of chips, such as system on chip (SOC), radio frequency chips, etc. The second type of electronic components 102b can include devices; the devices can be memories, inductors, capacitors, etc. The number and types of electronic components on the first printed circuit board 101a can be designed according to actual needs.

[0078] See also Figure 7 and Figure 8 In the embodiment of the present application, the package structure 100 further includes a shielding cover 107 disposed on the first surface S1. The shielding cover 107 and the first printed circuit board 101a form a closed space. The first type of electronic component 102a (i.e., the heat generating chip) is located within the closed space, and the closed space is filled with a thermally conductive material. The heat generating chip is the main heat generating component in an electronic device. By providing a thermally conductive material around the heat generating chip, the heat generated by the heat generating chip is facilitated to be transferred to the shielding cover side, and then transferred to the surrounding environment through the electronic device housing.

[0079] In the embodiments of the present application, the thermally conductive material filled within the enclosed space formed by the shielding cover 107 can be any material having thermal conductivity. In some embodiments, the thermally conductive material includes a second resin composite thermal conductive structure 103b, which is provided in contact between the heating chip 102a and the shielding cover 107. The second resin composite thermal conductive structure 103b is provided in contact between the heating chip and the shielding cover, thereby forming a continuous thermal conductive channel between the heating chip and the shielding cover, thereby quickly transferring heat generated by the heating chip to one side of the shielding cover, thereby preventing localized heat accumulation in the heating chip.

[0080] To better dissipate heat from the heating chip, in the embodiment of the present application, the locations of the heating chip 102a that are not in contact with the first printed circuit board 101a are covered with a second resin composite material heat-conducting structure 103b. Covering each exposed surface of the heating chip with the second resin composite material heat-conducting structure disperses the heat generated by the heating chip in multiple directions and conducts it rapidly upward or downward to the shielding cover and the second surface of the first printed circuit board, thereby preventing localized heat accumulation in the heating chip.

[0081] In the embodiment of the present application, Figure 7 and Figure 8 In the embodiment, the second resin composite material heat conducting structure 103b is made of the same material as the first resin composite material heat conducting structure 103a.

[0082] See also Figure 9 In some embodiments of the present application, at least two stacked printed circuit boards (101a, 101b) may further include another printed circuit board, such as a third printed circuit board 101c, stacked on the side of the second printed circuit board 101b away from the first printed circuit board 101a. The gap between the second printed circuit board 101b and the third printed circuit board 101c may also be filled with a first resin composite material heat-conducting structure 103a. The design of the first resin composite material heat-conducting structure 103a in the gap between the second printed circuit board 101b and the third printed circuit board 101c may refer to the design of the first resin composite material heat-conducting structure 103a between the first printed circuit board 101a and the second printed circuit board 101b. Filling the gaps between the layers of the multi-layer stacked printed circuit boards with a conductive resin structure is beneficial to heat dissipation of electronic components on the printed circuit boards.

[0083] In some embodiments of the present application, in at least two stacked printed circuit boards (101a, 101b), a first resin composite material heat conducting structure 103a is provided in the gap between each two adjacent printed circuit boards (101a, 101b).

[0084] See also Figure 10 In some embodiments of the present application, the package structure 100 further includes a heat sink 104 stacked on one side of at least two stacked printed circuit boards (101a, 101b). The gap between the printed circuit boards 101b and the heat sink 104 is filled with a third resin composite heat-conducting structure 103c. The third resin composite heat-conducting structure 103c is made of the same material as the first resin composite heat-conducting structure 103a. Providing a resin composite heat-conducting structure between the stacked printed circuit boards and the heat sink 104 enables rapid heat transfer from the stacked printed circuit boards to the heat sink.

[0085] The heat sink 104 involved in the present application can specifically be various radiators, heat sinks, temperature averaging plates, etc. with heat dissipation functions.

[0086] Continue to see Figure 3In an embodiment of the present application, among at least two stacked printed circuit boards (101a, 101b), at least one of the two outermost printed circuit boards and the printed circuit board sandwiched in the middle have a through hole 108, which connects the receiving space 106 with the outside, and the through hole 108 is used as a potting port for the resin composition that forms the first resin composite material heat-conducting structure 103a. The number of through holes 108 on each printed circuit board may be one or more. In some embodiments, the number of through holes 108 is multiple (two or more), which can reduce the interface thermal resistance between the layers of the multi-layer stacked printed circuit boards and improve the heat dissipation effect. In an embodiment of the present application, Figure 3 The receiving space 106 is in a sealed state when the through hole 108 is not provided.

[0087] Continue to see Figure 5 In the embodiment of the present application, the printed circuit board 101a has a through hole 108, which connects the receiving space 106 with the outside world. The through hole 108 is used as a potting port for the resin composition that forms the first resin composite material heat-conducting structure 103a. The number of through holes 108 can be one or more. In some embodiments, the number of through holes 108 is multiple (two or more), which is beneficial to reducing the interface thermal resistance and improving the heat dissipation effect. In the embodiment of the present application, Figure 5 The receiving space 106 is in a sealed state when the through hole 108 is not provided.

[0088] The first resin composite thermal conductive structure 103a of the embodiment of the present application can avoid the problem of high-temperature reflow soldering challenges faced by coating the resin composition by adopting potting filling. This not only reduces the high-temperature resistance requirements of the resin composite thermal conductive structure, expands the range of resin options, and helps reduce costs, but also improves welding reliability and the reliability of electronic components on the circuit board.

[0089] In some embodiments of the present application, the first resin composite material thermal conductive structure 103a includes a resin matrix and a thermally conductive filler distributed in the resin matrix, and the first resin composite material thermal conductive structure 103a does not contain an absorbing filler; in this case, the through hole 108 on the outermost printed circuit board may be in a vacant state, without fillers, and without a shielding structure; or when there is a signal interference problem, a shielding structure may be provided as needed. In some embodiments of the present application, the first resin composite material thermal conductive structure 103a includes a resin matrix and a thermally conductive filler distributed in the resin matrix, and the first resin composite material thermal conductive structure 103a does not contain an absorbing filler. In this case, the through hole 108 on the printed circuit board 101a stacked with the heat sink 104 may be in a vacant state, without fillers, and without a shielding structure; or when there is a signal interference problem, a shielding structure may be provided as needed. The shielding structure may be, for example, shielding glue, a shielding cover, metal foil, copper tape, etc. As Figure 11 and Figure 12 As shown, the through hole 108 is filled with shielding glue 1081 to achieve a shielding effect. The setting of the shielding structure can effectively prevent signal leakage and signal interference.

[0090] In some embodiments of the present application, the first resin composite material heat-conducting structure 103a includes a resin matrix, and heat-conducting fillers and wave-absorbing fillers distributed in the resin matrix, and the wave-absorbing fillers are used to absorb electromagnetic waves; in this case, the through-hole 108 on the outermost printed circuit board can be in an empty state, without fillers, and without a shielding structure. In some embodiments of the present application, the first resin composite material heat-conducting structure 103a includes a resin matrix, and heat-conducting fillers and wave-absorbing fillers distributed in the resin matrix, and the wave-absorbing fillers are used to absorb electromagnetic waves; in this case, the through-hole 108 on the printed circuit board 101a stacked with the heat sink 104 can be in an empty state, without fillers, and without a shielding structure. Figure 3 and Figure 5 As shown, through-hole 108 is left empty, unfilled, and without a shielding structure. Instead, the absorbing filler in the first resin composite heat-conducting structure 103a absorbs electromagnetic waves, achieving a shielding effect. This embodiment achieves high thermal conductivity and heat dissipation, effectively preventing signal leakage and crosstalk, and eliminates the need for shielding adhesive filling, saving assembly costs. In some embodiments, a shielding structure can also be provided at through-hole 108 on the outermost printed circuit board.

[0091] In the embodiment of the present application, it can be understood that when the packaging structure includes two or more stacked printed circuit boards, the through hole 108 on the printed circuit board sandwiched between the two outermost printed circuit boards is used for the circulation of the resin composition forming the resin composite material thermal conductive structure, and is ultimately filled with the first resin composite material thermal conductive structure 103a.

[0092] In some embodiments of the present application, the thermal conductivity of the first resin composite material heat-conducting structure 103a is greater than 1W / mk. Thermal conductivity, also known as thermal conductivity or thermal conductivity, is an important physical quantity for measuring the thermal conductivity of a material. It is defined as: under stable heat transfer conditions, when the material thickness is 1 meter and the temperature difference between the two surfaces is 1 degree (K or ℃), the amount of heat transferred through an area of ​​1 square meter per unit time. The first resin composite material heat-conducting structure 103a has a higher thermal conductivity, which is conducive to faster heat dissipation. In some embodiments, the thermal conductivity of the first resin composite material heat-conducting structure 103a is greater than or equal to 2W / mk. In some embodiments, the thermal conductivity of the first resin composite material heat-conducting structure 103a is greater than or equal to 2.5W / mk. The thermal conductivity can be tested using the steady-state hot plate method (reference standard: ASTM D5470).

[0093] In some embodiments of the present application, the interfacial adhesion between the first resin composite thermally conductive structure 103a and the printed circuit board is less than 35 psi. A lower interfacial adhesion facilitates rework after filling. The interfacial adhesion test can be performed by performing a pull-out test with a bonding thickness of 1 mm and a double cross overlap. In some embodiments, the interfacial adhesion between the first resin composite thermally conductive structure 103a and the printed circuit board is less than 25 psi. In some embodiments, the interfacial adhesion between the first resin composite thermally conductive structure 103a and the printed circuit board is less than 15 psi.

[0094] In some embodiments of the present application, the first resin composite material heat-conducting structure 103a has a thermal resistance change of less than 15% after high-temperature aging at 125°C, high and low temperature alternating cycle aging at -40°C to 125°C, and aging at 85°C and 85% relative humidity. The aging time is, for example, 500 hours and 1000 hours. In some embodiments of the present application, the first resin composite material heat-conducting structure 103a has a thermal resistance change of less than 5% after high-temperature aging at 125°C, high and low temperature alternating cycle aging at -40°C to 125°C, and aging at 85°C and 85% relative humidity. The first resin composite material heat-conducting structure 103a has excellent anti-aging properties, which can improve its reliability and extend its service life.

[0095] In the embodiment of the present application, the first resin composite thermally conductive structure 103a includes an absorbing filler, and the magnetic loss tangent or dielectric loss tangent of the first resin composite thermally conductive structure 103a is greater than 0.1. The first resin composite thermally conductive structure 103a has strong absorbing ability, which helps improve electromagnetic shielding performance.

[0096] In an embodiment of the present application, the dielectric strength of the first resin composite thermally conductive structure 103a is greater than 500V / mm. In some embodiments, the dielectric strength is greater than 1000V / mm. In some embodiments, the dielectric strength is greater than 3000V / mm. The dielectric strength, or critical breakdown field strength, refers to the voltage at which the first resin composite thermally conductive structure 103a loses its dielectric properties and becomes a conductor. The dielectric strength can be tested according to the standard: ASTM D149. The first resin composite thermally conductive structure 103a has good insulation and voltage resistance, which is beneficial to improving the performance of the packaging structure.

[0097] In the embodiment of the present application, the resin matrix includes a curable polymer, and the curable polymer has a curable functional group in the molecule, and can be cured by an addition curing reaction or a moisture curing reaction by a catalyst. The curable polymer can be one or more of an organosilicon polymer, an epoxy polymer, an urethane polymer, a phenolic polymer, a polyimide polymer, acrylonitrile butadiene rubber, ethylene-propylene-diene rubber, ethylene-propylene rubber, natural rubber, polybutadiene rubber, polyisoprene rubber, polyester (saturated or unsaturated polyester), polyurethane, polyacrylate and its derivatives. The above resin has good curability, low viscosity, suitable bonding force, and high body strength, which is conducive to realizing potting operation and rework operation.

[0098] In some embodiments of the present application, the room temperature viscosity of the curable polymer is 10 cP (centipoise) to 2000 cP. For example, the room temperature viscosity of the curable polymer is 10 cP, 50 cP, 100 cP, 500 cP, 1000 cP, 1500 cP, or 2000 cP. Selecting a curable polymer with a lower viscosity facilitates potting operations.

[0099] In some embodiments of the present application, the resin matrix includes one or more polyurethanes; in some embodiments, the resin matrix includes one or more organic epoxy polymers; in some embodiments, the resin matrix includes one or more organic polysiloxanes; in some embodiments, the resin matrix includes one or more polyacrylates.

[0100] In some embodiments of the present application, based on the requirements of higher high temperature aging properties, low modulus, low stress concentration, low adhesion, and easy repair, the resin matrix may include an organopolysiloxane. The organopolysiloxane may have a structure shown in formula (1):

[0101] Wherein, each R can be independently selected from methyl, methoxy, ethyl, ethoxy, propyl, butyl, pentyl, hexyl, heptyl, octyl, phenyl, hydroxyl or vinyl; in some embodiments, one or more R is a hydrogen atom, and n represents the number of repetitions, which is a positive integer.

[0102] In some embodiments of the present application, the organopolysiloxane includes an addition reaction curable organopolysiloxane, and the addition reaction curable organopolysiloxane may include an alkenyl-containing organopolysiloxane and a hydrogen-containing organopolysiloxane.

[0103] The alkenyl-containing organopolysiloxane may be a terminal vinyl-containing organopolysiloxane, including but not limited to terminal vinyl-containing polydimethylsiloxane, terminal vinyl-containing polyphenylmethylsiloxane, terminal vinyl-containing dimethylsiloxane-diphenylsiloxane copolymer, terminal vinyl-containing dimethylsiloxane-phenylmethylsiloxane copolymer, terminal vinyl-containing dimethylsiloxane-diethylsiloxane copolymer, and other known terminal vinyl-containing organopolysiloxanes. The viscosity of the above-mentioned alkenyl-containing organopolysiloxane at 25° C. is greater than 5 cP and less than 10,000 cP. In some embodiments, the viscosity of the alkenyl-containing organopolysiloxane at 25° C. is greater than 30 cP and less than 500 cP.

[0104] The number of hydrogen atoms bonded to silicon atoms on the hydrogen-containing organopolysiloxane molecule is 2 or more. In some embodiments, the number of hydrogen atoms bonded to silicon atoms on the hydrogen-containing organopolysiloxane molecule is 2-50. For example, the hydrogen-containing organopolysiloxane can be a well-known hydrogen-containing organopolysiloxane such as a methylhydrogensiloxane-dimethylsiloxane copolymer, polymethylhydrogensiloxane, polyethylhydrogensiloxane, or a methylhydrogensiloxane-phenylmethylsiloxane copolymer. The viscosity of the above-mentioned hydrogen-containing organopolysiloxane at 25°C is not specifically limited. In some embodiments, the viscosity of the hydrogen-containing organopolysiloxane at 25°C is 1 cP or more and 1000 cP or less. Selecting a hydrogen-containing organopolysiloxane with a suitable viscosity can be mixed and cured with an alkenyl-containing organopolysiloxane to form a polymer with good physical properties. The viscosity of the organopolysiloxane can be measured using a rotational viscometer.

[0105] In the embodiments of the present application, in the resin matrix, the molar ratio of the hydrosilyl groups in the hydrogen-containing organopolysiloxane to the vinyl groups in the alkenyl-containing organopolysiloxane is 0.3-3. In some embodiments, the molar ratio may be 0.3, 0.5, 0.8, 1, 1.5, 2, 2.5, or 3. Proper control of the ratio is beneficial to improving the performance of the resin matrix.

[0106] In some embodiments of the present application, when the long-term operating temperature of the electronic device is lower than 65° C., the resin matrix may include polyurethane and / or polyacrylate.

[0107] In an embodiment of the present application, the first resin composite thermally conductive structure 103a may further include an additive dispersed in the resin matrix, and the total mass content of the additive may be less than 5%. The additive may include, for example, one or more of a filler treatment agent, a catalyst, an inhibitor, a coupling agent, an antioxidant, an anti-settling agent, and a color paste. In some embodiments, the additive includes a filler treatment agent, as well as one or more of a catalyst, an inhibitor, a coupling agent, an antioxidant, an anti-settling agent, and a color paste. In some embodiments, the additive includes a filler treatment agent, a catalyst, and an inhibitor, as well as one or more of a coupling agent, an antioxidant, an anti-settling agent, and a color paste. The filler treatment agent can improve the compatibility in the composition and the dispersibility of various fillers in the thermally conductive resin composition, making the filler dispersion more uniform. The filler treatment agent may be an organopolysiloxane, such as α-trimethylsiloxy-ω-(γ-trimethoxysilylethyl)dimethylsilyl-terminated polydimethylsiloxane or n-heptadecyltrimethoxysilane. The catalyst may be a precious metal catalyst, such as a platinum-based catalyst, a palladium-based catalyst, a rhodium-based catalyst, or the like. In some embodiments, a platinum-based catalyst is used. Examples of such catalysts include elemental platinum, oxyplatinic acid, platinum-olefin complexes, platinum-alcohol complexes, and platinum coordination compounds. Specifically, the platinum-based catalyst is, for example, 1,3-divinyl-1,1,3,3-tetramethyldisiloxane platinum complex, also known as Karstedt catalyst. The catalyst content in the first resin composite thermally conductive structure 103a can be 0.1 ppm to 300 ppm, and in some embodiments, 0.1 ppm to 200 ppm.

[0108] To extend the shelf life and pot life of the thermally conductive material and inhibit the hydrosilylation reaction at room temperature, an inhibitor may be added. The inhibitor may include acetylenic compounds such as 2-methyl-3-butyn-2-ol, 1-ethynyl-1-cyclohexanol, and 3-butyn-1-ol, various nitrogen compounds such as triallyl isocyanurate and triallyl isocyanurate derivatives, and organophosphorus compounds such as triphenylphosphine. The inhibitor content in the first resin composite thermally conductive structure 103a may be 0.005% to 1% by weight, in some embodiments, 0.05% to 0.8% by weight, and in some embodiments, 0.1% to 0.5% by weight.

[0109] In order to improve the anti-settling and agglomeration performance of the thermal conductive material and inhibit the sedimentation problem caused by the large difference in density between the thermal conductive powder and the resin, an anti-settling agent can be added. Examples of anti-settling agents include nano-fumed silica, nano-zinc oxide, nano-alumina, and polymer materials with higher hydroxyl values ​​such as polyvinyl alcohol and ethylene / vinyl acetate copolymer to improve the thixotropic properties of the thermal conductive material.

[0110] In embodiments of the present application, thermally conductive fillers may include one or more of carbides, nitrides, oxides, metal powders, and their compounds. Carbides, nitrides, and oxides are suitable for applications requiring insulation, while metal powders and their compounds are suitable for applications without insulation. Carbides include, but are not limited to, silicon carbide; nitrides include, but are not limited to, aluminum nitride, silicon nitride, and boron nitride; oxides include, but are not limited to, aluminum oxide, zinc oxide, and iron oxide; and metal powders and their compounds include, but are not limited to, aluminum, silver, gold, tin, copper, indium, and other metals and their compounds. In some embodiments, the thermally conductive filler may include one or more of submicron aluminum oxide, nano-zinc oxide, nano-boron nitride, and nano-silicon nitride. In some embodiments, the thermally conductive filler is an oxide with a high surface content of hydroxyl groups, which is more conducive to surface treatment with a filler treatment agent. For example, the filler may include at least one of aluminum oxide, zinc oxide, and iron oxide. In some embodiments, the surface oxygen content of the oxide particles is greater than 30%, and the surface oxygen content can be measured using X-ray photoelectron spectroscopy. The thermally conductive filler has a relatively high thermal conductivity coefficient and can effectively improve the thermal conductivity of the thermally conductive resin composition.

[0111] In the embodiment of the present application, the thermally conductive filler is evenly distributed in the resin matrix, and the particle size of the thermally conductive filler may be less than 200 μm.

[0112] In order to obtain a higher thermal conductivity, in addition to using a thermally conductive filler technology with a higher thermal conductivity, it is also necessary to achieve a higher thermally conductive filler packing density. The higher the packing density of the thermally conductive filler, the more thermally conductive fillers are added per unit space, and the more effective thermal conductive paths formed by the mutual contact between the thermally conductive fillers. According to the filling theory calculation of thermally conductive fillers with a variety of particle size combinations, the higher the particle size ratio of large particle size fillers to small particle size fillers, the more conducive it is to achieve a higher filler packing density. In order to better achieve a balance between high thermal conductivity and high fluidity at a high thermal conductive filler filling fraction, in an embodiment of the present application, the thermally conductive filler is a mixture of thermally conductive fillers including at least two average particle sizes D50. When two thermally conductive fillers with an average particle size D50 are included, the average particle size D50 of the small particle size thermally conductive filler can be 0.5μm-10μm; the average particle size D50 of the other large particle size thermally conductive filler can be 20μm-150μm. In some embodiments, the average particle size D50 of the small-particle thermally conductive filler may be 0.5 μm, 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, or 10 μm. In some embodiments, the average particle size D50 of the large-particle thermally conductive filler may be 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, or 50 μm. The average particle size D50 of the large-particle thermally conductive filler may be 4 times or more than the average particle size D50 of the small-particle thermally conductive filler. For example, the average particle size D50 of the large-particle thermally conductive filler may be 4 times, 5 times, 6 times, 8 times, 10 times, 15 times, or 20 times the average particle size D50 of the small-particle thermally conductive filler. In some embodiments, the thermally conductive filler is a mixture of thermally conductive fillers having three or more average particle sizes.

[0113] In the embodiments of the present application, the thermally conductive filler is a particle, and the particle morphology can be flake, needle-shaped, fibrous, spherical, or quasi-spherical. In some embodiments, the thermally conductive filler is a spherical particle. To improve the flow properties of the resin composition, the sphericity of the thermally conductive filler is greater than 0.8, and in some embodiments, the sphericity is greater than 0.9.

[0114] In the embodiment of the present application, the absorbing filler is uniformly distributed in the resin matrix, and the particle size of the absorbing filler can be less than 100 μm. The absorbing filler can include one or more of Fe, Ni, Co and their alloys, carbon-based materials, iron-based materials, transition metal carbides, transition metal nitrides, and transition metal carbonitrides. The above materials have absorbing functions and can enable the resin composite material thermal conductive structure to achieve absorbing functions. Carbon-based materials can be, for example, graphene, carbon nanotubes, carbon black, etc. Iron-based materials can be, for example, carbonyl iron. The morphology of the absorbing filler can be spherical or non-spherical. The non-spherical absorbing filler can specifically be a needle-shaped absorbing filler, a fibrous absorbing filler, a sheet-shaped absorbing filler, or an ellipsoidal absorbing filler. The sphericity of the spherical absorbing filler can be greater than 0.8.

[0115] In some embodiments of the present application, to better achieve full-band electromagnetic wave absorption, the absorbing filler may include spherical powder absorbing filler and non-spherical absorbing filler. In some embodiments, the weight ratio of the non-spherical absorbing filler to the spherical powder absorbing filler is in the range of 0.05-0.2. In some examples, the weight ratio of the non-spherical absorbing filler to the spherical powder absorbing filler is 0.05, 0.06, 0.07, 0.1, 0.12, 0.15, 0.18, or 0.2.

[0116] In embodiments of the present application, the D50 particle size of the spherical powder absorbing filler is in the range of 1 μm to 50 μm, for example, 1 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, or 50 μm. In embodiments of the present application, the maximum lateral dimension of the non-spherical absorbing filler is in the range of 3 μm to 50 μm, for example, 3 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, or 50 μm. In some embodiments, the maximum lateral dimension of the non-spherical absorbing filler is greater than the D50 particle size of the spherical powder absorbing filler. In some embodiments, the maximum lateral dimension of the non-spherical absorbing filler is 2-6 times the D50 particle size of the spherical powder absorbing filler.

[0117] In the embodiment of the present application, the mass proportion of the resin matrix in the first resin composite material heat conducting structure 103a is 1%-20%. In some embodiments, the mass proportion of the resin matrix can be 1%, 5%, 10%, 12%, 15%, or 20%.

[0118] In the embodiment of the present application, the mass percentage of the thermally conductive filler in the first resin composite heat-conducting structure 103a is 30%-90%. In some embodiments, the mass percentage of the thermally conductive filler can be 30%, 35%, 40%, 45%, 50%, 60%, 70%, 80%, or 90%.

[0119] In the embodiment of the present application, the mass percentage of the absorbing filler in the first resin composite material heat-conducting structure 103a is 2%-60%. In some embodiments, the mass percentage of the absorbing filler can be 2%, 5%, 10%, 20%, 30%, 40%, 50%, or 60%.

[0120] In embodiments of the present application, the room temperature viscosity of the resin composition forming the first resin composite heat-conducting structure 103a may be in the range of 2000 cP to 200,000 cP. In some embodiments, the room temperature viscosity of the resin composition forming the first resin composite heat-conducting structure 103a is in the range of 2000 cP, 3000 cP, 5000 cP, 8000 cP, 10,000 cP, 15,000 cP, 20,000 cP, 30,000 cP, 40,000 cP, 50,000 cP, 80,000 cP, 100,000 cP, 150,000 cP, or 200,000 cP. The viscosity may be measured at a shear rate of 1 inverse second. The resin composition has a suitable room temperature viscosity, that is, it has suitable fluidity at room temperature, which is conducive to its potting operation and realizes efficient and high-quality filling, avoiding the problem of high-temperature reflow soldering challenges faced in coating and preparing the resin composition. It not only reduces the high-temperature resistance requirements of the resin composite material thermal conductive structure, expands the range of resin options, is conducive to reducing costs, but also improves welding reliability.

[0121] In an embodiment of the present application, the extrusion rate of the resin composition forming the first resin composite material heat-conducting structure 103a is greater than 15 g / min. In some embodiments, the extrusion rate of the resin composition forming the first resin composite material heat-conducting structure 103a is greater than 20 g / min. In some embodiments, the extrusion rate of the resin composition forming the first resin composite material heat-conducting structure 103a is greater than 50 g / min. In some embodiments, the extrusion rate of the resin composition forming the first resin composite material heat-conducting structure 103a is greater than 80 g / min. In some embodiments, the extrusion rate of the resin composition forming the first resin composite material heat-conducting structure 103a is greater than 120 g / min. A higher extrusion rate is beneficial to improving the potting efficiency.

[0122] The present application also provides a thermally conductive resin composition comprising a resin, a thermally conductive filler, and an absorbing filler, wherein the absorbing filler comprises both a spherical powder absorbing filler and a non-spherical absorbing filler. The inclusion of both spherical powder absorbing filler and non-spherical absorbing filler in the thermally conductive resin composition improves its absorbing performance and resistance to electromagnetic interference.

[0123] In the embodiment of the present application, the mass percentage of the resin in the thermally conductive resin composition is 1%-20%. In some embodiments, the mass percentage of the resin can be 1%, 5%, 10%, 12%, 15%, or 20%.

[0124] In the embodiment of the present application, the mass percentage of the thermally conductive filler in the thermally conductive resin composition is 30%-90%. In some embodiments, the mass percentage of the thermally conductive filler can be 30%, 35%, 40%, 45%, 50%, 60%, 70%, 80%, or 90%.

[0125] In the embodiment of the present application, the mass percentage of the absorbing filler in the thermally conductive resin composition is 2%-60%. In some embodiments, the mass percentage of the absorbing filler can be 2%, 5%, 10%, 20%, 30%, 40%, 50%, or 60%.

[0126] In the embodiment of the present application, the weight ratio of the non-spherical absorbing filler to the spherical powder absorbing filler is in the range of 0.05-0.2. In some embodiments, the weight ratio of the non-spherical absorbing filler to the spherical powder absorbing filler is 0.05, 0.06, 0.07, 0.1, 0.12, 0.15, 0.18, or 0.2.

[0127] In the embodiment of the present application, the particle size, material, etc. of the spherical powder absorbing filler and the non-spherical absorbing filler are as described above and will not be repeated here.

[0128] In the embodiment of the present application, the specific selection of the thermally conductive filler is as described above, and the selection of the resin is as described above, and the curable polymer corresponding to the resin matrix is ​​selected, which will not be repeated here.

[0129] In the embodiments of the present application, the thermally conductive resin composition may further include an auxiliary agent, and the weight percentage of the auxiliary agent may be less than 5%. The selection of the auxiliary agent is as described above. The content of the catalyst in the thermally conductive resin composition may be 0.1ppm-300ppm, and in some embodiments, 0.1ppm-200ppm. The weight content of the inhibitor in the thermally conductive resin composition may be 0.005%-1%, in some embodiments, the weight content may be 0.05%-0.8%, and in some embodiments, the weight content may be 0.1%-0.5%.

[0130] In the embodiment of the present application, the room temperature viscosity of the thermally conductive resin composition is within the range of 2000cP (centipoise)-200000cP. In some embodiments, the room temperature viscosity of the thermally conductive resin composition is within the range of 2000cP, 3000cP, 5000cP, 8000cP, 10000cP, 15000cP, 20000cP, 30000cP, 40000cP, 50000cP, 80000cP, 100000cP, 150000cP, and 200000cP. The thermally conductive resin composition has a suitable room temperature viscosity, that is, it has suitable fluidity at room temperature, which is conducive to its potting operation, achieving efficient and high-quality filling, avoiding the problem of facing the challenge of high-temperature reflow soldering when coating the thermally conductive resin composition, not only reducing the high temperature resistance demand of the resin composite thermal conductive structure, but also expanding the range of resin options, which is conducive to reducing costs and also improving welding reliability.

[0131] In embodiments of the present application, the extrusion rate of the thermally conductive resin composition is greater than 15 g / min. In some embodiments, the extrusion rate of the thermally conductive resin composition is greater than 20 g / min. In some embodiments, the extrusion rate of the thermally conductive resin composition is greater than 50 g / min. In some embodiments, the extrusion rate of the thermally conductive resin composition is greater than 80 g / min. In some embodiments, the extrusion rate of the thermally conductive resin composition is greater than 120 g / min. A higher extrusion rate is beneficial for improving potting efficiency.

[0132] In the embodiments of the present application, the thermal conductivity of the thermally conductive resin composition is greater than 1 W / mk. The thermal conductivity of the thermally conductive resin composition can be tested using the steady-state hot plate method (reference standard: ASTM D5470) or the transient plane heat source method (reference standard: ISO22007-2). In some embodiments, the thermal conductivity of the thermally conductive resin composition is greater than or equal to 2 W / mk. In some embodiments, the thermal conductivity of the thermally conductive resin composition is greater than or equal to 2.5 W / mk.

[0133] In some embodiments of the present application, the interfacial adhesion between the thermally conductive resin composition and the printed circuit board is less than 35 psi. A smaller interfacial adhesion is beneficial for rework operations after filling.

[0134] In some embodiments of the present application, the thermal resistance change of the thermally conductive resin composition after aging at high temperature of 125°C, aging at high and low temperature alternating cycles of -40°C to 125°C, and aging at 85°C and 85% relative humidity is less than 15%. In some embodiments of the present application, the thermal resistance change of the thermally conductive resin composition after aging at high temperature of 125°C, aging at high and low temperature alternating cycles of -40°C to 125°C, and aging at 85°C and 85% relative humidity is less than 5%. The aging time can be, for example, 500 hours or 1000 hours. The thermally conductive resin composition has excellent anti-aging properties, which can improve reliability and extend service life.

[0135] In the embodiment of the present application, the magnetic loss tangent or dielectric loss tangent of the thermally conductive resin composition is greater than 0.1. The thermally conductive resin composition has strong wave absorbing ability, which is beneficial to improving electromagnetic shielding performance.

[0136] In embodiments of the present application, the thermally conductive resin composition has a dielectric strength greater than 500 V / mm. In some embodiments, the dielectric strength is greater than 1000 V / mm. In some embodiments, the dielectric strength is greater than 3000 V / mm. The dielectric strength can be tested according to ASTM D149. The thermally conductive resin composition has excellent insulation and withstand voltage properties, which can improve the performance of the packaging structure.

[0137] The present application also provides embodiments of the thermally conductive resin composition for use in thermal bonding and semiconductor packaging. The thermally conductive resin composition can be made into materials such as thermally conductive adhesives, thermally conductive potting compounds, and thermally conductive adhesive films, and is used for bonding thermally conductive structures, thermally conductive potting compounds, thermally conductive bonding of semiconductor chips, and thermally conductive bonding of components within circuit boards. In some embodiments, the thermally conductive resin composition is used in the aforementioned packaging structure, specifically to form a resin composite thermally conductive structure such as the first resin composite thermally conductive structure 103a.

[0138] The present application also provides an electronic device comprising the packaging structure described above, or employing the thermally conductive resin composition described above. By employing the packaging structure or the thermally conductive resin composition described above, the electronic device according to the present application can effectively improve the heat dissipation performance of the electronic device, enhance the long-term operational stability and lifespan of the electronic device, and improve user experience and product competitiveness.

[0139] The embodiments of the present application are further described below with reference to a number of embodiments.

[0140] Example

[0141] Organopolysiloxanes (a-1, a-2), filler treatment agents (b-1, b-2), small-particle thermally conductive fillers (c-1, c-2), large-particle thermally conductive fillers (c-3, c-4, c-5), microwave-absorbing fillers (d-1, d-2), catalyst (e-1), and inhibitor (f-1) were mixed using a homogenizer to obtain a resin composition. The homogenizer mixing parameters may be 1500 rpm for 30 seconds, followed by 2000 rpm for 30 seconds. A sample of the resulting resin composition was left at room temperature overnight before testing.

[0142] The material components involved are shown in Table 1:

[0143] Table 1

[0144]

[0145] Performance testing:

[0146] Thermal Conductivity Test 1: Tested according to ISO 22007 using a Hot Disk thermal conductivity meter with a heating time of 2-5 seconds and a power of 500 mW. The result is recorded as thermal conductivity TC-1.

[0147] Thermal conductivity test 2: The test was conducted according to ASTM 5470 using a steady-state thermal resistance meter. Each resin composition was measured at three thicknesses: 0.5 mm, 1 mm, and 1.5 mm. The thermal conductivity TC-2 was fitted based on the measured thermal resistance values ​​at the three thicknesses.

[0148] Dielectric strength test: Tested according to ASTM D149.

[0149] Flowability Testing: Extrusion rate is measured using a dispensing device. Sample material is encapsulated in a 50mL twin syringe, fitted with a 21-section two-component mixing hose, and dispensed at a pressure of 0.62 MPa. The sample weight dispensed in 1 minute is used as the extrusion rate.

[0150] Reliability testing: A sandwich-structure thermal resistance fixture was used to simulate real-world application scenarios. The thermal resistance changes were compared after 500 hours of aging at 125°C, 500 hours of cycling between -40°C and 125°C, and 500 hours of aging at 85°C and 85% relative humidity. The sandwich structure can be composed of two glass panels with a cured resin composition sandwiched between them.

[0151] Wave absorption performance test: The test is carried out using a complete mobile phone tooling.

[0152] The mass ratios of the components in Examples 1-8 and the above test results are shown in Table 2.

[0153] Table 2

[0154]

[0155] As shown in Table 2, the resin compositions of Examples 1-8 all have good thermal conductivity. By adjusting the filling amount and type of thermally conductive filler, the thermal conductivity of the resin composition can be improved. The resin compositions of Examples 1-8 all have a dielectric strength of >500. Compared with Examples 7 and 8, the resin compositions of Examples 1-6 can obtain more excellent anti-interference capabilities due to the simultaneous addition of spherical powder absorbing fillers and non-spherical absorbing fillers. Comparing Example 1 and Example 4, it can also be seen that controlling the small-particle thermally conductive filler in a smaller amount is beneficial to improving the extrusion rate of the resin composition.

[0156] It should be understood that the first, second and various numerical numbers involved in this document are only distinguished for the convenience of description and are not intended to limit the scope of this application.

[0157] In this application, "and / or" describes the relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, and B exists alone. A and B can be singular or plural. The character " / " generally indicates that the related objects are in an "or" relationship.

[0158] In this application, "at least one" means one or more, and "more than one" means two or more. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, "at least one of a, b, or c", or "at least one of a, b, and c" can all mean: a, b, c, ab (i.e., a and b), ac, bc, or abc, where a, b, and c can be single or multiple.

[0159] In this application, “-” represents a range value, including the endpoint values ​​at both ends. For example, the value of a can be 0.5-15, which means that the value of a can be between 0.5 and 15, and includes the endpoint values ​​0.5 and 15.

[0160] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. Some or all of the steps can be executed in parallel or sequentially. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. A packaging structure, characterized in that: The packaging structure includes at least two stacked printed circuit boards, electronic components arranged on the printed circuit boards, and a first resin composite material heat-conducting structure arranged in a gap between at least two adjacent printed circuit boards; Alternatively, the packaging structure includes a stacked printed circuit board and a heat sink, electronic components arranged on the printed circuit board, and a first resin composite material heat-conducting structure arranged in a gap between the printed circuit board and the heat sink and in contact with the heat sink.

2. The packaging structure according to claim 1, wherein: The first resin composite material thermal conductive structure connects the two adjacent printed circuit boards to form a continuous thermal conductive channel between the two adjacent printed circuit boards; or, the first resin composite material thermal conductive structure connects the one printed circuit board and the one heat sink to form a continuous thermal conductive channel between the one printed circuit board and the one heat sink.

3. The packaging structure according to claim 2, wherein: The first resin composite material heat-conducting structure completely covers the electronic component located between the two adjacent printed circuit boards; or the first resin composite material heat-conducting structure completely covers the electronic component located between the printed circuit board and the heat sink.

4. The packaging structure according to any one of claims 1 to 3, wherein: The orthographic projection of the electronic components on the printed circuit board in the thickness direction of the printed circuit board is located within the orthographic projection of the first resin composite material heat-conducting structure in the thickness direction of the printed circuit board.

5. The packaging structure according to any one of claims 1 to 4, wherein: The packaging structure further includes a support frame; the support frame is disposed between two adjacent printed circuit boards, the support frame and the two adjacent printed circuit boards enclose a receiving space, the first resin composite material heat-conducting structure is located in the receiving space, and the first resin composite material heat-conducting structure partially fills or completely fills the receiving space; Alternatively, the support frame is arranged between the printed circuit board and the heat sink, and the support frame, the printed circuit board and the heat sink form a receiving space. The first resin composite material thermal conductive structure is located in the receiving space, and the first resin composite material thermal conductive structure partially fills or completely fills the receiving space.

6. The packaging structure according to any one of claims 1 to 5, wherein: The at least two stacked printed circuit boards include a first printed circuit board and a second printed circuit board, the electronic components include a first type of electronic components and a second type of electronic components, the first type of electronic components include heat-generating chips, and the second type of electronic components include devices; the first printed circuit board includes a first surface and a second surface arranged opposite to each other, the second surface is arranged facing the second printed circuit board, and the first surface is provided with the first type of electronic components; the second printed circuit board includes a third surface and a fourth surface arranged opposite to each other, and the third surface and / or the fourth surface is provided with the second type of electronic components.

7. The packaging structure according to any one of claims 1 to 5, wherein: The printed circuit board includes a first printed circuit board, the electronic components include a first type of electronic components and a second type of electronic components, the first type of electronic components include a heat-generating chip, and the second type of electronic components include a device; the first printed circuit board includes a first surface and a second surface arranged opposite to each other, the first surface is provided with the first type of electronic components, and the second surface is arranged facing the heat sink.

8. The packaging structure according to claim 6 or 7, wherein: The packaging structure further includes a shielding cover disposed on the first surface. The shielding cover and the first printed circuit board form a closed space. The heating chip is located in the closed space, and the closed space is filled with heat-conducting material.

9. The packaging structure according to claim 8, wherein: The thermally conductive material includes a second resin composite material thermally conductive structure, which is provided in contact between the heat generating chip and the shielding cover. The second resin composite material thermally conductive structure is made of the same material as the first resin composite material thermally conductive structure.

10. The packaging structure according to claim 9, wherein: The positions of the heat generating chip that are not in contact with the first printed circuit board are all covered by the second resin composite material heat conducting structure.

11. The packaging structure according to claim 6, wherein: The at least two stacked printed circuit boards further include another printed circuit board stacked on a side of the second printed circuit board away from the first printed circuit board.

12. The packaging structure according to claim 1, wherein: The packaging structure also includes a heat sink stacked on one side of the at least two stacked printed circuit boards, and the gap between the printed circuit boards and the heat sink is filled with a third resin composite material heat-conducting structure, and the third resin composite material heat-conducting structure is made of the same material as the first resin composite material heat-conducting structure.

13. The packaging structure according to any one of claims 1 to 12, wherein: Among the at least two stacked printed circuit boards, at least one of the two outermost printed circuit boards and the printed circuit board sandwiched in the middle have through holes, and the through holes are used to serve as potting ports for the resin composition forming the first resin composite material thermal conductive structure; or one of the printed circuit boards has a through hole, and the through hole is used to serve as a potting port for the resin composition forming the first resin composite material thermal conductive structure.

14. The packaging structure according to claim 13, wherein: The first resin composite material heat-conducting structure includes a resin matrix and heat-conducting fillers distributed in the resin matrix; a shielding structure is provided at the through hole on the outermost printed circuit board; or a shielding structure is provided at the through hole on the first printed circuit board.

15. The packaging structure according to claim 13, wherein: The first resin composite material thermal conductive structure includes a resin matrix, and a thermally conductive filler and a wave-absorbing filler distributed in the resin matrix, wherein the wave-absorbing filler is used to absorb electromagnetic waves; the through hole on the outermost printed circuit board is in a vacant state and no shielding structure is provided; or the through hole on the first printed circuit board is in a vacant state and no shielding structure is provided.

16. The packaging structure according to any one of claims 14 or 15, characterized in that: In the resin matrix, the mass percentage of the resin is 1%-20%; the mass percentage of the thermal conductive filler is 30%-90%; and the mass percentage of the wave absorbing filler is 2%-60%.

17. The packaging structure according to any one of claims 14 to 16, wherein: The resin matrix includes one or more of silicone polymers, epoxy polymers, urethane polymers, phenolic polymers, polyimide polymers, acrylonitrile butadiene rubber, ethylene-propylene-diene rubber, ethylene-propylene rubber, natural rubber, polybutadiene rubber, polyisoprene rubber, polyester, polyurethane, polyacrylate and derivatives thereof.

18. The packaging structure according to claim 17, wherein: The organosilicon polymer includes organopolysiloxane, which includes alkenyl-containing organopolysiloxane and hydrogen-containing organopolysiloxane. In the resin matrix, the molar ratio of the hydrosilyl group in the hydrogen-containing organopolysiloxane to the vinyl group in the alkenyl-containing organopolysiloxane is 0.3-3.

19. The packaging structure according to any one of claims 14 to 18, wherein: The thermally conductive filler includes one or more of carbides, nitrides, oxides, metal powders and compounds thereof.

20. The package structure according to claim 19, wherein: The thermally conductive filler is a mixture of thermally conductive fillers having at least two average particle sizes.

21. The packaging structure according to any one of claims 15 to 20, wherein: The wave-absorbing filler includes one or more of Fe, Ni, Co and alloys thereof, carbon-based materials, iron-based materials, transition metal carbides, transition metal nitrides, and transition metal carbonitrides.

22. The packaging structure according to any one of claims 15 to 21, wherein: The wave-absorbing filler includes a spherical powder wave-absorbing filler and a non-spherical wave-absorbing filler.

23. The package structure according to claim 22, wherein: The weight ratio of the non-spherical wave-absorbing filler to the spherical powder wave-absorbing filler is in the range of 0.05-0.

2.

24. The packaging structure according to claim 22 or 23, wherein: The D50 particle size of the spherical powder wave-absorbing filler is in the range of 1 μm to 50 μm; the maximum transverse size of the non-spherical wave-absorbing filler is in the range of 3 μm to 50 μm.

25. The packaging structure according to any one of claims 1 to 24, characterized in that: The thermal conductivity of the first resin composite material thermal conductive structure is greater than 1 W / mk; and the interface adhesion between the first resin composite material thermal conductive structure and the printed circuit board is less than 35 psi.

26. The packaging structure according to any one of claims 1 to 25, wherein: The thermal resistance change of the first resin composite material thermal conductive structure after high-temperature aging at 125°C, high and low temperature alternating cycle aging at -40°C to 125°C, and aging at 85°C and 85% relative humidity is less than 15%; the magnetic loss tangent value or dielectric loss tangent of the first resin composite material thermal conductive structure is greater than 0.1; the dielectric strength of the first resin composite material thermal conductive structure is greater than 500V / mm.

27. A thermally conductive resin composition, characterized in that The invention comprises resin, heat-conducting filler and wave-absorbing filler, wherein the wave-absorbing filler comprises spherical powder wave-absorbing filler and non-spherical wave-absorbing filler.

28. The thermally conductive resin composition according to claim 27, wherein The weight ratio of the non-spherical wave-absorbing filler to the spherical powder wave-absorbing filler is in the range of 0.05-0.

2.

29. The thermally conductive resin composition according to claim 27 or 28, wherein The D50 particle size of the spherical powder wave-absorbing filler is in the range of 1 μm to 50 μm; the maximum transverse size of the non-spherical wave-absorbing filler is in the range of 3 μm to 50 μm.

30. The thermally conductive resin composition according to any one of claims 27 to 29, wherein The wave-absorbing filler includes one or more of Fe, Ni, Co and alloys thereof, carbon-based materials, iron-based materials, transition metal carbides, transition metal nitrides, and transition metal carbonitrides.

31. The thermally conductive resin composition according to any one of claims 27 to 30, wherein The thermally conductive filler includes one or more of carbides, nitrides, oxides, metal powders and compounds thereof.

32. The thermally conductive resin composition according to any one of claims 27 to 31, wherein The resin includes one or more of silicone polymers, epoxy polymers, urethane polymers, phenolic polymers, polyimide polymers, acrylonitrile butadiene rubber, ethylene-propylene-diene rubber, ethylene-propylene rubber, natural rubber, polybutadiene rubber, polyisoprene rubber, polyester, polyurethane, polyacrylate and derivatives thereof.

33. The thermally conductive resin composition according to claim 32, wherein The organosilicon polymer includes organopolysiloxane, and the organopolysiloxane includes alkenyl-containing organopolysiloxane and hydrogen-containing organopolysiloxane. In the thermal conductive resin composition, the molar ratio of the hydrosilyl group in the hydrogen-containing organopolysiloxane to the vinyl group in the alkenyl-containing organopolysiloxane is 0.3-3.

34. The thermally conductive resin composition according to any one of claims 27 to 33, wherein In the thermally conductive resin composition, the mass percentage of the resin is 1%-20%; the mass percentage of the thermally conductive filler is 30%-90%; and the mass percentage of the wave-absorbing filler is 2%-60%.

35. The thermally conductive resin composition according to any one of claims 27 to 34, wherein The invention also includes auxiliary agents, which include one or more of filler treatment agents, catalysts, inhibitors, coupling agents, antioxidants, anti-settling agents, and color pastes; and the mass percentage of the auxiliary agents is less than 5%.

36. The thermally conductive resin composition according to any one of claims 27 to 35, wherein The magnetic loss tangent value or dielectric loss tangent value of the thermally conductive resin composition is greater than 0.

1.

37. The thermally conductive resin composition according to any one of claims 27 to 36, wherein The room temperature viscosity of the thermally conductive resin composition is within the range of 2000 cP-200000 cP; the extrusion rate of the thermally conductive resin composition is greater than 15 g / min; the thermal conductivity of the thermally conductive resin composition is greater than 1 W / mk; the interfacial adhesion between the thermally conductive resin composition and the printed circuit board is less than 35 psi; the thermal resistance change of the thermally conductive resin composition after high-temperature aging at 125°C, high- and low-temperature alternating cycle aging at -40°C to 125°C, and aging at 85°C and 85% relative humidity is less than 15%; and the dielectric strength of the thermally conductive resin composition is greater than 500 V / mm.

38. An electronic device, characterized in that: The packaging structure comprises the packaging structure according to any one of claims 1 to 26, or the thermally conductive resin composition according to any one of claims 27 to 37.

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