Power distribution integrated module and battery pack with same

Abstract

The invention discloses a power distribution integrated module and a battery pack with the same, and relates to the technical field of batteries. The power distribution integrated module comprises a circuit board, a first acquisition interface piece, two first conductive columns and a current sensor, and the first acquisition interface piece is arranged on the circuit board; the two first conductive columns are used for connecting external current; the sensing end of the current sensor is matched with the two first conductive columns to detect current passing through the first conductive columns, the signal output end of the current sensor is connected with the circuit board, and a detection signal is transmitted to the first acquisition interface piece through the circuit board. According to the power distribution integrated module, the number of wire harnesses is reduced, the risk of wiring errors is reduced, and modularization is facilitated.

Description

Technical Field

[0001] The present invention relates to the field of battery technology, and in particular to a power distribution integrated module and a battery pack having the same. Background Art

[0002] Some existing battery distribution modules use wiring harnesses to connect internal electrical components, complicating the assembly process. Furthermore, the numerous interfaces between the battery distribution module and external circuits and control systems further complicate the design and installation of the client's wiring harness, impacting overall assembly efficiency and system reliability.

[0003] Therefore, there is room for improvement in the battery power distribution module. Summary of the Invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, a first aspect of the present invention is to provide a power distribution integrated module that reduces the number of wiring harnesses, reduces the risk of wiring errors, and facilitates modularization.

[0005] The second aspect of the present invention aims to provide a battery pack having the above-mentioned power distribution integrated module.

[0006] According to an embodiment of the first aspect of the present invention, a power distribution integrated module includes: a circuit board, a first acquisition interface component, two first conductive posts, and a current sensor, wherein the first acquisition interface component is provided on the circuit board; the two first conductive posts are used to connect to an external current; the sensing end of the current sensor cooperates with the two first conductive posts to detect the current passing through the first conductive posts; the signal output end of the current sensor is connected to the circuit board, and the detection signal is transmitted to the first acquisition interface component through the circuit board.

[0007] The power distribution integrated module according to an embodiment of the present invention utilizes a first conductive column for introducing external current, reducing the need for traditional wiring harnesses and lowering the risk of wiring errors. The wiring harness is integrated by providing a circuit board, further simplifying its layout and improving assembly efficiency. The first acquisition interface provided on the circuit board allows the detection signal of the current sensor to be transmitted through the circuit board and the first acquisition interface, thus reducing wiring harnesses and further facilitating modularization.

[0008] According to some optional embodiments of the present invention, the power distribution integrated module further includes: a second collection interface component, which is provided on the circuit board; and a second conductive post, which has one end connected to the first conductive post and the other end connected to the circuit board, and transmits current to the second collection interface component through the circuit board.

[0009] In some optional embodiments, a first socket is provided on the circuit board, and the end of the second conductive column is inserted into the first socket.

[0010] Optionally, the first conductive pillar and the second conductive pillar are arranged in parallel and located on the same side of the circuit board.

[0011] Further optionally, a transfer bus is further included, the transfer bus is located on one side of the circuit board, and the first conductive column and the second conductive column are connected to the transfer bus.

[0012] According to some optional embodiments of the present invention, the power distribution integrated module further includes: a relay, which is connected in series with the first conductive column, the first conductive column is connected to the external circuit through the relay, and the signal end of the relay is connected to the circuit board to transmit the signal to the first acquisition interface component.

[0013] Furthermore, a second socket is provided on the circuit board, and the output end of the relay is inserted into the second socket.

[0014] Further optionally, the relay and the first conductive column are located on the same side of the circuit board; and the first acquisition interface component and the relay are located on two opposite sides of the circuit board.

[0015] According to some optional embodiments of the present invention, the power distribution integrated module further includes: two spaced-apart power bus bars, the power bus bars being located on one side of the circuit board, and each of the two first conductive columns being connected to the external current through one of the power bus bars.

[0016] In some specific embodiments, the first conductive column is welded to the power bus bar.

[0017] Specifically and optionally, it further includes: a protective shell, wherein a protective cavity is provided in the protective shell, and the circuit board, the first acquisition interface component, the first conductive column, and the current sensor are located in the protective cavity; and a first interface is provided on the protective shell, which is arranged opposite to the first acquisition interface component.

[0018] According to some optional embodiments, the protective shell has an opening and further includes a heat dissipation plate, and the heat dissipation plate is sealed at the opening.

[0019] Furthermore, the heat dissipation plate includes: a heat dissipation substrate; a thermal pad, which is arranged on the side of the heat dissipation substrate facing the inside of the protective cavity; an insulating layer, which is arranged on the side of the thermal pad away from the heat dissipation substrate, and the first conductive column is arranged on the insulating layer.

[0020] Specifically, the heat dissipation substrate is provided with heat dissipation fins.

[0021] According to some optional embodiments, the signal output end of the current sensor is connected to the circuit board through wiring harness welding; or the signal output end of the current sensor is provided with a pin needle, and the pin needle is plug-connected to the circuit board.

[0022] A battery pack according to an embodiment of the second aspect of the present invention includes the power distribution integrated module as described in the embodiment of the first aspect of the present invention.

[0023] Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0025] Figure 1 Schematic diagram of the principle of the power distribution integrated module in some embodiments of the present invention;

[0026] Figure 2 Schematic diagram of the structure of the power distribution integrated module in some embodiments of the present invention;

[0027] Figure 3 Schematic diagram of the structure of the circuit board in some embodiments of the present invention;

[0028] Figure 4 Schematic diagram of the structure of the protective shell in some embodiments of the present invention;

[0029] Figure 5 Schematic diagram of the structure of the heat dissipation plate in some embodiments of the present invention;

[0030] Figure 6 Schematic diagram of the structure of the power distribution integrated module in some other embodiments of the present invention.

[0031] Reference numerals:

[0032] Power distribution integrated module 100,

[0033] Circuit board 10,

[0034] First socket 11, second socket 12,

[0035] The first acquisition interface 21, the second acquisition interface 22,

[0036] The first conductive column 31, the second conductive column 32,

[0037] Current sensor 40, sensing end 41, signal output end 42, pin 43,

[0038] Relay 50,

[0039] Transfer bus 61, power bus 62,

[0040] Protective shell 70, protective cavity 701,

[0041] Upper housing 71, first interface 711, second interface 712,

[0042] Lower shell 72, opening 721,

[0043] Heat sink 80,

[0044] Heat dissipation substrate 81 , thermal pad 82 , and insulation layer 83 . DETAILED DESCRIPTION

[0045] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended only to explain the present invention and are not to be construed as limiting the present invention.

[0046] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction and be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the present invention. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0047] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0048] Reference below Figures 1-6 The power distribution integrated module 100 according to the first embodiment of the present invention is described.

[0049] The application field of the power distribution integrated module 100 of the embodiment of the present invention is not limited, and it can be used in transportation tools, such as electric vehicles, extended-range vehicles, etc., and can also be used in energy storage systems, such as solar energy and wind energy storage equipment. Figure 1 , Figure 1 The power distribution integrated module is a schematic diagram of the principle of the power distribution integrated module. Due to the circuit detection capability of the power distribution integrated module, the power distribution integrated module in this embodiment is not limited to the above-mentioned fields, but can also be applied to other fields that require real-time monitoring of circuits.

[0050] like Figure 1 As shown, the power distribution integrated module 100 according to the embodiment of the present invention includes: a circuit board 10 , a first acquisition interface component 21 , two first conductive pillars 31 and a current sensor 40 .

[0051] The first acquisition interface 21 is mounted on the circuit board 10. The circuit board 10 receives signal changes from the current sensor 40 and serves as a medium for signal transmission, feeding the processed information directly or after analysis to an external control system. The external control system communicates with the circuit board 10 via the first acquisition interface 21, ensuring smooth signal transmission.

[0052] The first acquisition interface 21 is directly connected to the circuit board 10, which simplifies the signal transmission path, reduces the risk of wiring errors, and improves the reliability and stability of the system.

[0053] In addition, the connection between the first acquisition interface 21 and the external control system can also avoid some communication problems or wiring failures such as complex wiring harness entanglement, wire pressing, loosening, etc.

[0054] The two first conductive columns 31 are used to connect external current. Specifically, the two first conductive columns 31 are electrically connected, wherein one first conductive column 31 is used for current inflow, and the other first conductive column 31 is used for current outflow. It is worth noting that the traditional partial wiring method uses wire connection, and there are many wires in the power distribution module, which is easy to connect incorrectly and the assembly workload is large. The present invention uses conductive columns instead of traditional wire connections to effectively prevent assembly errors, making the assembly process simpler and increasing the possibility of automated production. Not only that, the design of the first conductive column 31 is more obvious, which is convenient for identification and maintenance, further improving the maintainability of the power distribution integrated module 100.

[0055] In some optional embodiments, the first conductive pillar 31 may be made of aluminum, copper, steel, or other metal materials. The present application does not impose any specific restrictions on the material of the first conductive pillar 31 and may be selected based on specific application requirements. For example, copper may be used for better conductivity, while aluminum may be used to reduce weight while maintaining good conductivity. Steel may be used for applications requiring higher strength and durability.

[0056] Further optionally, the first conductive column 31 adopts a long column structure. The present invention does not impose any specific restrictions on the shape of the cross section of the long column structure. For example, the cross section of the first conductive column 31 is designed to be Figure 2 The cross section of the first conductive column 31 can be designed as a circle as shown, or the cross section of the first conductive column 31 can be designed as a rectangle, or the cross section of the first conductive column 31 can be designed as a triangle or other polygon or other irregular shape. The first conductive column 31 with the above cross-sectional shape is set in the distribution integrated module 100, which can meet the needs of easy assembly and maintenance.

[0057] The sensing end 41 of the current sensor 40 cooperates with the two first conductive pillars 31 to detect the current passing through the first conductive pillars 31 .

[0058] The current sensor 40 can convert the detected current information into a low-voltage signal. This low-voltage signal is easy to process and transmit, reducing the risk of signal attenuation and interference during transmission and improving the accuracy and reliability of the signal.

[0059] Optionally, the current sensor 40 may sense the presence and intensity of current through electromagnetic induction or shunt principles, and convert this physical quantity into a corresponding voltage signal or digital signal.

[0060] Further optionally, the current sensor 40 may be a Hall current sensor or a shunt resistor.

[0061] The signal output terminal 42 of the current sensor 40 is connected to the circuit board 10 , and the detection signal is transmitted to the first acquisition interface component 21 through the circuit board 10 .

[0062] The signal output terminal 42 of the current sensor 40 transmits the detection signal directly through the circuit board 10, which also facilitates the installation of different types of current sensors 40 on the power distribution integrated module 100. Because the signal is processed directly on the circuit board 10, no complex external connections are required, simplifying the installation and replacement process and improving the versatility of the system. For example, in electric vehicles or energy storage systems, the power distribution integrated module 100 can adjust the configuration of the current sensor 40 according to different battery pack specifications and charging and discharging conditions. Manufacturers can choose the type and specifications of current sensor 40 suitable for specific application scenarios, and at the same time use the modular design of the power distribution integrated module 100 to simplify the installation and debugging process and ensure stable operation of the system.

[0063] Optionally, the circuit board 10 includes different types of input terminals to improve the adaptability to different current sensors 40. Figure 2The input terminal on the circuit board 10 includes a socket for connecting the wiring harness and a connector for inserting the pin. By setting different input terminals, the circuit board 10 can be equipped with multiple types of current sensors to meet different usage requirements and improve the versatility of the power distribution integrated module.

[0064] In summary, the power distribution integrated module 100 of the present embodiment, by providing a circuit board 10, not only achieves a high degree of integration of some electronic components and circuits within the module, but also further promotes modularization. The power distribution integrated module 100 of the present embodiment allows for compatibility with multiple different types of current sensors 40 within its framework, allowing the system to flexibly select and replace current sensors 40 according to specific needs.

[0065] like Figure 2-Figure 5 As shown, the power distribution integrated module 100 in some optional embodiments of the present invention further includes: a second acquisition interface 22 and a second conductive column 32. The second acquisition interface 22 and the second conductive column 32 are used to receive part of the current in the circuit.

[0066] The second collection interface 22 is provided on the circuit board 10. One end of the second conductive post 32 is connected to a first conductive post 31 and the other end is connected to the circuit board 10, and the current is transmitted to the second collection interface 22 through the circuit board 10.

[0067] In the above technical solution, the second conductive pillar 32 serves as a path for current transmission, guiding the current from the first conductive pillar 31 to the circuit board 10 , and further transmitting the current to the second acquisition interface 22 .

[0068] The second acquisition interface component 22 is provided on the circuit board 10 and is specifically used to collect high-voltage electrical signals.

[0069] Optionally, the second acquisition interface 22 is directly connected to an external control system, so that the external control system can directly acquire high-voltage signals from the circuit board 10. This approach helps provide more accurate data, better monitor circuit status, and ensure safe operation of the system.

[0070] Here, the second acquisition interface 22 is directly connected to the circuit board 10, making the path for high-voltage electrical signals to be transmitted from the circuit board 10 to the external control system more direct and simple. This eliminates the need for complex wiring harness connections, reduces potential wiring errors, and improves the stability and reliability of the power distribution integrated module 100. This also reduces assembly difficulty and improves system stability.

[0071] In some optional embodiments, the second conductive pillar 32 may be made of aluminum, copper, steel, or other metal materials. The present application does not impose any specific restrictions on the material of the second conductive pillar 32 and may be selected based on specific application requirements. For example, copper may be used for better conductivity, while aluminum may be used to reduce weight while maintaining good conductivity. Steel may be used for applications requiring higher strength and durability.

[0072] Further optionally, the second conductive column 32 adopts a columnar structure. The present invention does not impose any specific restrictions on the cross-sectional shape of the columnar structure. For example, the cross-sectional shape of the second conductive column 32 is designed to be Figure 2 The cross-section of the second conductive column 32 can be designed as a circle as shown, or the cross-section of the second conductive column 32 can be designed as a rectangle, or the cross-section of the second conductive column 32 can be designed as a triangle or other polygon or other irregular shape. The second conductive column 32 with the above cross-sectional shape is set in the distribution integrated module 100, which can meet the needs of easy assembly and maintenance.

[0073] In some optional embodiments, such as Figure 2-Figure 5 As shown, a first socket 11 is provided on the circuit board 10 , and an end portion of the second conductive column 32 is inserted into the first socket 11 .

[0074] The plug-in method facilitates the installation of the second conductive post 32, simplifies wiring procedures, and improves assembly efficiency. Optionally, the first socket 11 and the second conductive post 32 can adopt a specific shape structure, such as an asymmetric or polygonal design, to prevent plugging errors and improve assembly accuracy and reliability. This plug-in method not only reduces the complexity of manual operation but also reduces the risk of poor contact or electrical failure caused by incorrect installation, further improving the overall performance and production consistency of the power distribution integrated module 100.

[0075] Specifically, the first conductive pillar 31 and the second conductive pillar 32 are arranged in parallel and located on the same side of the circuit board 10 .

[0076] By maintaining the parallel arrangement between the first conductive pillars 31 and the second conductive pillars 32, accidental conduction between the second conductive pillars 32 and the unconnected first conductive pillars 31 can be avoided, reducing the risk of electrical interference and short circuit, and ensuring the safety and reliability of the module.

[0077] Being installed on the same side of the circuit board 10 makes the internal space of the power distribution integrated module 100 more compact, improves the internal space of the module, and is conducive to realizing the miniaturization design of the module.

[0078] Not only that, the unified installation direction also simplifies the assembly process and makes operation convenient.

[0079] Specifically, the power distribution integrated module 100 further includes a transfer bus 61 . The transfer bus 61 is located on one side of the circuit board 10 . A first conductive column 31 and a second conductive column 32 are connected to the transfer bus 61 .

[0080] A first conductive post 31 and a second conductive post 32 are connected via the transfer bus 61 to achieve circuit conduction.

[0081] The transfer bus 61 can provide a wider contact area, thereby reducing resistance and heat generation, improving current transmission efficiency, and helping to improve the monitoring accuracy of the power distribution integrated module 100.

[0082] More specifically, the transfer busbar 61 may be a copper busbar, an aluminum busbar, or other conductive material that can pass high voltage and high current.

[0083] According to some optional embodiments of the present invention, combined with Figure 2 、 Figure 4 and Figure 5 The power distribution integrated module 100 further includes a relay 50 . The relay 50 is connected in series with a first conductive column 31 . The first conductive column 31 is connected to an external circuit via the relay 50 . The signal end of the relay 50 is connected to the circuit board 10 to transmit the signal to the first acquisition interface 21 .

[0084] First, the relay 50 is provided to automatically control high-voltage or high-current circuits, thereby improving the intelligence level of the power distribution integrated module 100. By controlling the on / off of the relay 50 through the circuit board 10, the on / off of the circuit can be precisely controlled to ensure the safety of system operation.

[0085] Secondly, the first conductive column 31 is connected to the external circuit through the relay 50 to realize on-off control. The signal end of the relay 50 is connected to the circuit board 10 to transmit the status signal of the relay 50 to the first acquisition interface 21, thereby realizing intelligent control and status feedback of the external circuit.

[0086] In addition, the series structure between the relay 50 and the first conductive column 31 is compact and the connection is reliable, which reduces the use of traditional wiring harnesses, reduces the risk of wrong wiring, and improves assembly efficiency and the reliability of the entire module.

[0087] Furthermore, a second socket 12 is provided on the circuit board 10 , and the output end of the relay 50 is plugged into the second socket 12 .

[0088] The output end of the relay 50 is inserted into the socket to achieve electrical connection with the circuit board 10. This plug-in method helps prevent wiring errors and reduces the risk of failure due to poor contact. At the same time, it simplifies the connection complexity between the relay 50 and the circuit board 10, improving assembly efficiency and connection reliability. Optionally, the second socket 12 adopts a standardized socket structure, which is conducive to modular production. At the same time, the specifications of the relay 50 can be adjusted according to the charging and discharging conditions provided by the customer to meet various usage requirements and improve the flexibility of the power distribution integrated module 100.

[0089] In some optional embodiments, combined with Figure 2 、 Figure 4 and Figure 5 The relay 50 and the first conductive column 31 are located on the same side of the circuit board 10 . The first acquisition interface 21 and the relay 50 are located on two opposite sides of the circuit board 10 .

[0090] First, placing the relay 50 and the first conductive post 31 on the same side simplifies the design of the current path, reduces unnecessary wiring complexity, and improves assembly efficiency. This arrangement not only makes electrical connections more intuitive and simple, but also reduces the risk of poor contact or short circuits caused by complex wiring.

[0091] Secondly, the first acquisition interface 21 and relay 50 are located on opposite sides of the circuit board 10, helping to optimize the signal transmission path. By separating the control signal and data acquisition interfaces, electromagnetic interference is reduced, thereby improving the quality and stability of signal transmission. Furthermore, this separate arrangement facilitates heat management, preventing local overheating that could impact module performance.

[0092] Furthermore, this layout also enhances the space utilization and flexibility of the power distribution integrated module 100. For example, when the relay 50 needs to be replaced or repaired, the operator can directly operate from one side without having to disassemble the entire module or affect the operation of other components.

[0093] According to some further optional embodiments of the present invention, Figure 2-Figure 5 As shown, the power distribution integrated module 100 further includes: two spaced-apart power bus bars 62 , the power bus bars 62 being located on one side of the circuit board 10 , and each of the two first conductive pillars 31 is connected to an external current via a power bus bar 62 .

[0094] By placing the current access point on one side of the circuit board 10 and employing spaced-apart busbars 62, the space within the module can be more efficiently utilized. This design avoids crowding between internal module components, resulting in a more compact and organized structure, and facilitating the miniaturization of the power distribution integrated module 100.

[0095] At the same time, the spaced-apart busbars 62 leave space between the two first conductive posts 31, allowing for installation of internal components such as the current sensor 40 and the circuit board 10. This layout not only improves space utilization but also facilitates the rational distribution of various functional components, further enhancing the overall integration and structural stability of the module.

[0096] In addition, each power bus bar 62 can be installed and replaced independently without disassembling the entire circuit board 10, thereby improving maintenance efficiency.

[0097] Specifically, the first conductive post 31 is welded to the electrical busbar 62. This welded connection ensures a stable electrical connection between the first conductive post 31 and the electrical busbar 62, preventing loosening due to vibration or long-term use. The welded connection also provides a large contact area, helping to reduce electrical resistance and heat buildup, thereby improving the safety and stability of current transmission.

[0098] Furthermore, the welded structure is robust, ensuring long-term stable operation in high-voltage, high-current environments, offering durability and reduced maintenance. This robust connection not only enhances the overall performance of the PDM 100 but also simplifies the assembly process, improving production standardization and consistency, and facilitating automated production.

[0099] like Figure 4 As shown, in some optional embodiments, the power distribution integrated module 100 further includes a protective housing 70. A protective cavity 701 is defined within the protective housing 70. The circuit board 10, the first acquisition interface 21, the first conductive column 31, and the current sensor 40 are located within the protective cavity 701. The protective housing 70 integrates and protects the overall structure.

[0100] The protective shell 70 is provided with a first interface 711 disposed opposite to the first acquisition interface 21. Here, the first interface 711 is used for signal connection between an external control system and the power distribution integrated module 100.

[0101] By directly setting the first interface 711 on the protective shell 70, the traditional wiring harness connection method is replaced, thereby avoiding problems such as entanglement, wire pressing, loosening, etc. caused by complex wiring harnesses, solving the risk of communication failure or system misjudgment caused by poor wiring, and improving the stability and reliability of the module.

[0102] Furthermore, the protective shell 70 is optionally made of an insulating material. The insulating protective shell 70 is used to mount electrical components, thereby preventing electrical leakage from the module and ensuring safety and reliability during use of the module. Preferably, the protective shell 70 is a plastic shell.

[0103] Optionally, the protective shell 70 has an opening 721 and further includes a heat dissipation plate 80 , and the heat dissipation plate 80 is sealed at the opening 721 .

[0104] By installing a heat sink 80 at the opening 721 of the protective shell 70, heat generated by the heating elements within the module can be effectively conducted away. Optionally, the heat sink 80 can be made of a highly thermally conductive material. For example, an aluminum alloy plate can quickly absorb and dissipate heat, keeping the module's internal components within a suitable operating temperature range and extending the module's service life.

[0105] According to some Figure 4 In the illustrated embodiment, the protective housing 70 comprises an upper housing 71 and a lower housing 72. These two housings are connected using a snap-fit ​​mechanism to simplify assembly, facilitate installation and removal, and ensure a tight connection between the two. Furthermore, this snap-fit ​​mechanism reduces the need for additional fasteners such as bolts, further optimizing production efficiency.

[0106] Optionally, the circuit board 10 is close to the upper housing 71. The upper housing 71 is provided with a first interface 711 facing the first collection interface 21 and a second interface 712 facing the second collection interface 22. This makes external line connection more convenient and direct.

[0107] Optionally, the lower housing 72 is a plastic part. Furthermore, the lower housing 72 is integrally injection molded with the transfer bus 61 and the power bus 62. During the manufacturing process, the bus and lower housing 72 are combined by injection molding to form a single unit, making the structure more stable, reducing assembly steps, improving production efficiency, and contributing to improved module reliability.

[0108] Further optionally, the opening 721 is provided on a side of the lower shell 72 away from the upper shell 71 .

[0109] Specifically, if Figure 5 As shown, the heat sink 80 includes a heat sink substrate 81, a thermal pad 82, and an insulating layer 83. The thermal pad 82 is disposed on the side of the heat sink substrate 81 facing the interior of the protective cavity 701. The insulating layer 83 is disposed on the side of the thermal pad 82 away from the heat sink substrate 81, and the first conductive pillar 31 is disposed on the insulating layer 83.

[0110] The thermal pad 82 is located on the side of the heat sink 81 facing the interior of the protective cavity 701. Its main function is to conduct the heat generated by the module during operation to the heat sink 81, which then dissipates the heat to the external environment. Preferably, the heat sink 81 can be a plate with high thermal conductivity, such as an aluminum plate or an aluminum alloy plate.

[0111] The thermal pad 82 is close to the heat generating components, such as the bus, etc., which improves the heat conduction efficiency, allows the heat to be quickly transferred to the heat dissipation substrate 81 and dissipated to the external environment, helps control the internal temperature of the module, and enhances the operational stability of the module.

[0112] The insulating layer 83 is located on the side of the thermal pad 82 away from the heat sink 81, providing electrical isolation and preventing electrical connection between the first conductive pillars 31 and the heat sink 81. This prevents short circuits and improves module operational stability. More optimally, the insulating layer 83 is adhered to the large flat surface of the busbar and lower housing 72 using adhesive, shielding the busbar and achieving insulation.

[0113] Optionally, the thermal pad 82 is assembled with the insulating layer 83 and the lower housing 72 in a limited manner, and is simultaneously extruded and assembled onto the lower housing 72 via the heat dissipation substrate 81. Furthermore, optionally, the heat dissipation substrate 81 has studs or openings at both ends, which can be assembled with corresponding holes in the lower housing 72 via bolts.

[0114] The first conductive pillar 31 is disposed on the insulating layer 83 and serves as a conductive pillar for current input or output. This arrangement has a simple structure and is convenient for connection and fixation.

[0115] The heat dissipation plate 80 structure of the present application has multiple functions of heat dissipation, insulation and mechanical support, which helps to improve the overall performance of the power distribution integrated module 100.

[0116] More specifically, heat dissipation fins are provided on the heat dissipation substrate 81. The heat dissipation fins are used to increase the heat dissipation area, helping heat to diffuse to the external environment more quickly, thereby reducing the operating temperature of the module, allowing the power distribution integrated module 100 to maintain stable operation even under certain high load conditions, and improving reliability.

[0117] Optionally, the signal output terminal 42 of the current sensor 40 is connected to the circuit board 10 via wire harness welding. Using wire harness welding provides higher connection stability, avoids problems such as loosening or poor contact due to long-term use, and improves signal transmission accuracy and long-term stability. Specifically, if the current sensor 40 is a Hall effect current sensor, the Hall effect current sensor can be connected to the circuit board 10 via wire harness welding to achieve low-voltage signal detection.

[0118] Or, as Figure 6 As shown, the signal output terminal 42 of the current sensor 40 is provided with a pin 43, which is plugged into the circuit board 10. Using pins 43 for plug-in connection facilitates assembly and maintenance, streamlining the installation process and improving production efficiency. Furthermore, the plug-in structure allows for quick assembly and disassembly, facilitating subsequent replacement or repair of the current sensor 40 and reducing maintenance costs.

[0119] In addition, the present application can also flexibly adjust the specifications of the current sensor 40 according to the charging and discharging conditions provided by the customer to meet the performance requirements of different application scenarios. This modular design not only improves the adaptability and compatibility of the product, but also enhances the scalability of the system.

[0120] The battery pack according to the second embodiment of the present invention includes the power distribution integrated module 100 according to the first embodiment of the present invention.

[0121] By using the battery pack of the embodiment of the present invention and the improved power distribution integrated module 100 , the adaptability and reliability of the battery pack in different application scenarios are improved.

[0122] Reference below Figure 2 - Figure 6 The power distribution integrated module 100 according to the embodiment of the present invention will be described in detail with reference to a specific embodiment. It should be understood that the following description is merely an illustrative illustration and does not specifically limit the present invention.

[0123] Example 1

[0124] Reference Figure 2 The power distribution integrated module 100 includes: a circuit board 10, a first acquisition interface component 21, a second acquisition interface component 22, a first conductive column 31, a second conductive column 32, a current sensor 40, a relay 50, a transfer bus 61, a power bus 62, a protective shell 70 and a heat sink 80.

[0125] Reference Figure 3 A first socket 11 and a second socket 12 are provided on the circuit board 10 , and the end of the second conductive column 32 is inserted into the first socket 11 .

[0126] Reference Figure 4 , the output end of the relay 50 is plugged into the second socket 12 .

[0127] The first collection interface component 21 and the second collection interface component 22 are provided on the circuit board 10 .

[0128] There are two first conductive pillars 31 . One end of the second conductive pillar 32 is connected to one of the first conductive pillars 31 , and the other end is connected to the circuit board 10 , so as to transmit current to the second collection interface 22 through the circuit board 10 .

[0129] The sensing end 41 of the current sensor 40 cooperates with the two first conductive pillars 31 to detect the current passing through the first conductive pillars 31. The signal output end 42 of the current sensor 40 is connected to the circuit board 10 through a wiring harness welding, and the detection signal is transmitted to the first acquisition interface component 21 through the circuit board 10.

[0130] The first conductive pillar 31 and the second conductive pillar 32 are arranged in parallel.

[0131] The first conductive pillar 31 , the second conductive pillar 32 , the transfer bus 61 , the relay 50 , and the power bus 62 are all located on the same side of the circuit board 10 .

[0132] A first conductive post 31 and a second conductive post 32 are connected to the transfer bus 61 .

[0133] The relay 50 is connected in series with a first conductive column 31 . The first conductive column 31 is connected to an external circuit via the relay 50 . The signal end of the relay 50 is connected to the circuit board 10 to transmit the signal to the first acquisition interface 21 .

[0134] The first acquisition interface 21 and the relay 50 are located on two opposite sides of the circuit board 10 .

[0135] There are two power bus bars 62 spaced apart. Each of the two first conductive posts 31 is connected to an external current via a power bus bar 62. The first conductive posts 31 are connected to the power bus bars 62 by welding.

[0136] Reference Figure 4 The protective shell 70 includes an upper shell 71 and a lower shell 72. A protective cavity 701 is formed between the upper shell 71 and the lower shell 72, and the upper shell 71 and the lower shell 72 are connected by snap-fitting.

[0137] The circuit board 10 , the first acquisition interface component 21 , the first conductive pillar 31 , and the current sensor 40 are located in the protective cavity 701 .

[0138] The circuit board 10 is close to the upper housing 71 . The upper housing 71 is provided with a first interface 711 facing the first collection interface 21 and a second interface 712 facing the second collection interface 22 .

[0139] The lower housing 72 , the transfer bus 61 and the power bus 62 are integrally injection molded.

[0140] An opening 721 is provided on a side of the lower housing 72 away from the upper housing 71 . The heat sink 80 is sealed at the opening 721 .

[0141] Reference Figure 5 The heat dissipation plate 80 includes a heat dissipation substrate 81, a thermal pad 82 and an insulating layer 83 connected in sequence from the outside to the inside.

[0142] Heat dissipation fins are provided on the heat dissipation substrate 81 .

[0143] Example 2

[0144] like Figure 6 As shown, the structure of this embodiment is basically the same as that of the first embodiment, except that the signal output terminal 42 of the current sensor 40 is provided with a pin 43 , which is plugged into the circuit board 10 .

[0145] Other components of the power distribution integrated module 100 according to the embodiment of the present invention, such as the battery pack, and operations are known to those skilled in the art and will not be described in detail here.

[0146] Throughout this specification, reference to terms such as "embodiment" or "example" indicates that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. In this specification, schematic representations of these terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0147] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims

1. A power distribution integrated module, characterized in that: include: circuit boards; a first acquisition interface component, wherein the first acquisition interface component is provided on the circuit board; Two first conductive pillars, the two first conductive pillars are used to connect external current; A current sensor, wherein the sensing end of the current sensor cooperates with the two first conductive pillars to detect the current passing through the first conductive pillars, and the signal output end of the current sensor is connected to the circuit board, and the detection signal is transmitted to the first acquisition interface component through the circuit board.

2. The power distribution integrated module according to claim 1, characterized in that: Also includes: a second acquisition interface component, wherein the second acquisition interface component is provided on the circuit board; A second conductive post, one end of which is connected to the first conductive post, and the other end of which is connected to the circuit board, transmits current to the second acquisition interface component through the circuit board.

3. The power distribution integrated module according to claim 2, characterized in that: The circuit board is provided with a first socket, and the end of the second conductive column is inserted into the first socket.

4. The power distribution integrated module according to claim 2, characterized in that: The first conductive pillar and the second conductive pillar are arranged in parallel and located on the same side of the circuit board.

5. The power distribution integrated module according to claim 2, characterized in that: It also includes a transfer bus, which is located on one side of the circuit board, and the first conductive column and the second conductive column are connected to the transfer bus.

6. The power distribution integrated module according to claim 1, characterized in that: Also includes: A relay is connected in series with the first conductive column, the first conductive column is connected to the external circuit through the relay, and the signal end of the relay is connected to the circuit board to transmit the signal to the first acquisition interface component.

7. The power distribution integrated module according to claim 6, characterized in that: The circuit board is provided with a second socket, and the output end of the relay is plugged into the second socket.

8. The power distribution integrated module according to claim 6, characterized in that: The relay and the first conductive column are located on the same side of the circuit board; The first acquisition interface component and the relay are located on two opposite sides of the circuit board.

9. The power distribution integrated module according to claim 1, characterized in that: It also includes: two spaced-apart power bus bars, the power bus bars being located on one side of the circuit board, and each of the two first conductive pillars being connected to the external current through one of the power bus bars.

10. The power distribution integrated module according to claim 9, characterized in that: The first conductive column is welded to the power bus bar.

11. The power distribution integrated module according to any one of claims 1 to 10, characterized in that: Also includes: A protective shell, wherein a protective cavity is provided in the protective shell, and the circuit board, the first acquisition interface component, the first conductive column, and the current sensor are located in the protective cavity; The protective shell is provided with a first interface arranged opposite to the first collection interface component.

12. The power distribution integrated module according to claim 11, characterized in that: The protective shell has an opening and further comprises a heat dissipation plate, and the heat dissipation plate is sealed at the opening.

13. The power distribution integrated module according to claim 12, characterized in that: The heat dissipation plate comprises: heat dissipation substrate; a thermal pad, the thermal pad being arranged on a side of the heat dissipation substrate facing the interior of the protective cavity; An insulating layer is provided on a side of the thermal pad away from the heat dissipation substrate, and the first conductive column is provided on the insulating layer.

14. The power distribution integrated module according to claim 13, characterized in that: The heat dissipation substrate is provided with heat dissipation fins.

15. The power distribution integrated module according to any one of claims 1 to 10, characterized in that: The signal output end of the current sensor is connected to the circuit board through wiring harness welding; Alternatively, a pin is provided at the signal output end of the current sensor, and the pin is plug-connected to the circuit board.

16. A battery pack, characterized in that: Comprising the power distribution integrated module according to any one of claims 1 to 15.

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