Frame for information processing device with modular panel sections

Abstract

A chassis includes: a base; and a modular panel section having a vertical support member, a horizontal support structure, a partitioned bracket, and a bracket mounting location. The vertical support members are coupled to the base to define an opening between a pair of vertical support members. The horizontal support structure extends between and is coupled to the vertical support members to divide the opening into a first region and a second region. The bracket mounting locations are defined in the first region and / or the second region, and each bracket mounting location includes mounting elements configured to connect one of the partitioned brackets to the base and / or the horizontal support structure. The partitioned brackets are disposed at respective bracket mounting locations and are removably coupled to the base and / or the horizontal support structure and divide the first region and / or the second region into compartments. Each compartment is configured to receive an electronic module and allow the electronic module to be electrically connected to an information processing device.

Description

Background Art

[0001] A chassis of an information processing device (such as a computer, networking device, etc.) may be configured to allow electronic modules (such as line cards, solid-state drives ("SSDs"), open computing program (OCP) modules, etc.) to be removably installed in the information processing device. For example, a rear panel of the chassis may have a plurality of openings to allow electronic modules to be removably installed through the rear panel into bays of the information processing device and connected to a main system board of the information processing device. Thus, the rear panel of the chassis facilitates installation and removal of electronic modules in the information processing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0002] Various examples will be described below with reference to the following figures.

[0003] Figure 1 Illustrated is a block diagram of a modular panel section according to an example of the present disclosure.

[0004] Figure 2A A block diagram of a first chassis in a first configuration according to an example of the present disclosure is illustrated, the first chassis comprising Figure 1 Modular panel sections.

[0005] Figure 2B A block diagram of a second chassis in a second configuration according to an example of the present disclosure is illustrated, the second chassis comprising Figure 1 Modular panel sections.

[0006] Figure 2C A block diagram of a third rack in a third configuration according to an example of the present disclosure is illustrated, the third rack comprising Figure 1 Modular panel sections.

[0007] Figure 2D A block diagram of a fourth rack in a fourth configuration according to an example of the present disclosure is illustrated, the fourth rack comprising Figure 1 Modular panel sections.

[0008] Figure 3A Illustrated is an exploded perspective view of a modular panel section according to an example of the present disclosure.

[0009] Figure 3B The example according to the present disclosure is shown Figure 3A An enlarged perspective view of the partition brackets of the modular panel section.

[0010] Figure 4 Illustrated is a perspective view of a first rack in a first configuration according to an example of the present disclosure, the first rack comprising Figure 3A Modular panel sections.

[0011] Figure 5 Illustrated is a perspective view of an electronic module having a first form factor according to examples of the present disclosure.

[0012] Figure 6 Illustrated is a perspective view of a plurality of second electronic modules, each having a second form factor, according to an example of the present disclosure.

[0013] Figure 7 A perspective view of an information processing device according to an example of the present disclosure is shown. Figure 4 The first rack and main system board, Figure 5 Electronic modules and Figure 6 The plurality of second electronic modules are mounted on Figure 4 The first main system board is located in the chassis and is electrically connected to the first main system board.

[0014] Figure 8 Illustrated is a perspective view of a second rack in a second configuration according to an example of the present disclosure, the second rack comprising Figure 3A Modular panel sections.

[0015] Figure 9 Illustrated is a perspective view of a third electronic module having a third form factor according to examples of the present disclosure.

[0016] Figure 10 A perspective view of a second information processing device according to an example of the present disclosure is shown. Figure 8 The second rack and the second main system board, Figure 5 Electronic modules and Figure 9 The third electronic modules are installed in Figure 8 The second chassis is electrically connected to the second main system board.

[0017] Figure 11 Illustrated is a perspective view of a third rack in a third configuration according to an example of the present disclosure, the third rack comprising Figure 3A Modular panel sections.

[0018] Figure 12 Illustrated is a perspective view of a fourth electronic module having a fourth form factor according to examples of the present disclosure.

[0019] Figure 13 A perspective view of a third information processing apparatus according to an example of the present disclosure is shown. Figure 11 The third rack and the third main system board, Figure 12 The fourth electronic module and Figure 6 The second electronic modules are installed in Figure 11The system is located in the third chassis and is electrically connected to the third main system board.

[0020] Figure 14 is a flowchart depicting a method of configuring a rack of information processing equipment through modular panel sections according to an example of the present disclosure. DETAILED DESCRIPTION

[0021] The following detailed description refers to the accompanying drawings. Figure 1-14 Certain examples are described using the components illustrated in the figures. However, the functions of the illustrated components may overlap and may be present in fewer or more elements and components. In addition, the disclosed examples can be implemented in various environments and are not limited to the illustrated examples. Whenever possible, the same reference numerals are used in the drawings and the following description to refer to the same or similar parts. However, it will be clearly understood that the drawings are for illustration and description purposes only. Although several examples are described in this document, modifications, adaptations and other implementations are possible. Therefore, the following detailed description does not limit the disclosed examples. Instead, the proper scope of the disclosed examples may be defined by the appended claims.

[0022] Typically, the rear panel is rigidly coupled to the side walls of the rack. The rear panel of an information processing device is often more than just a simple wall—instead, the rear panel may include various interconnected structures that perform various functions, including providing electromagnetic interference (EMI) shielding, providing electrical / optical connection interfaces for the information processing device, allowing air flow through the rack, and defining a rear accessible compartment to receive a removable module. The rear wall defined by the rear panel may have a plurality of openings in a predetermined arrangement that align with the compartments to allow electronic modules having a specific form factor to be installed in the compartments through the rear panel.

[0023] In particular, the compartments and the openings aligned therewith are each typically configured to receive an electronic module of a particular form factor and may be incompatible with other form factors. For example, one opening in the rear panel may be configured to receive an electronic module having a first height and a first width, another opening in the rear panel may be configured to receive an electronic module having a first height and a second width, yet another opening may be configured to receive an electronic module having a second height and a first width, yet another opening may be configured to receive an electronic module having a second height and a second width, and so on. Furthermore, even if an electronic module having the wrong form factor could physically fit within a given opening and compartment, it may still be incompatible with the compartment because the module may not properly engage with the compartment's accessory features or electronic connectors.

[0024] Therefore, once the rear panel is rigidly coupled to the rack, the configuration of electronic modules that can be used in the information handling device is essentially fixed. Consequently, users may be limited in the types of electronic modules that can be installed in a given rack. This reduces the flexibility of the information handling device and may also inhibit future upgrades or modifications to the information handling device. For example, if a user desires to modify an existing information handling device by upgrading from one electronic module to a newer electronic module with a different form factor, the user may not be able to perform this upgrade without obtaining an entirely new rack (or making substantial modifications to the existing rack) because the newer electronic module may not be compatible with the rear panel of the existing rack. Furthermore, manufacturers of information handling devices that want to offer electronic modules with a variety of different configuration options may have to design and manufacture multiple different racks to accommodate these different configurations, which imposes additional costs and may require multiple SKUs for various racks. Additionally, some rear panels are only rigidly coupled to the sidewalls of the rack. In such cases, the rear panels may not be robust enough to withstand shock and vibration and may have a low yield strength, resulting in sagging and / or permanent deformation of the rear panel when fully loaded with electronic modules.

[0025] A technical solution to the above-mentioned problem includes providing a customizable modular rear panel section that can be selectively changed between a plurality of different configurations defining different arrangements of rear accessible compartments. These different arrangements of rear accessible compartments can accommodate different types of form factors of electronic modules (e.g., different module widths) and / or different mounting locations of electronic modules. Furthermore, these differently configured modular rear panel sections can all be connected to the same main rack section, thereby together forming an integral rack for an information processing device. Thus, the same integral rack can be configured and / or reconfigured (by reconfiguring its modular rear panel sections) to allow the installation of one or more electronic modules with varying form factors (e.g., varying widths). In other words, the same rack can be used to form a plurality of different information processing system configurations having mutually different types and / or mounting locations of rear accessible electronic modules. The modular panel section can form or can be part of the rear panel of an information processing device.

[0026] In some examples, a rack can be configured and / or reconfigured between: a first configuration in which a full-width electronics module is housed; and a second configuration in which two half-width electronics modules are housed in the same general location that received the full-width electronics module in the first configuration. In particular, in some examples, a rack configured from modular panel sections can be configurable to allow installation of various combinations of Open Compute Project (OCP) electronics modules, such as an OCP Data Center Security Control Module (DC SCM), an SFF OCP NIC (Small Form Factor OCP Network Interface Card), a double-width or LFF (Large Form Factor) OCP NIC, and an OCP PCM (Platform Control Module). For example, in a first configuration, a rack can be capable of receiving a DC-SCM and an LFF OCP NIC, while in a second configuration, the rack can be capable of receiving a DC-SCM and two SFFOCP NICs.

[0027] The ability of racks of different configurations to allow electronic modules of different form factors to be installed in information processing devices can be provided by one or more partition brackets of the modular panel section, the one or more partition brackets being arranged on the base of the rack and / or the horizontal support structure of the modular rear panel section to define a plurality of compartments for installing electronic modules of different form factors in the information processing device. In particular, the base and / or the horizontal support structure may include a plurality of bracket mounting locations, each bracket mounting location having one or more mounting elements, the one or more mounting elements being configured to connect the corresponding partition bracket to the base and / or the horizontal support structure when one of the partition brackets is positioned at the corresponding bracket mounting location. When the one or more partition brackets are attached to the corresponding bracket mounting location, they define the plurality of compartments, i.e., each of the spaces between a pair of adjacent partition brackets and each of the spaces between a partition bracket and the external support structure (corresponding to a compartment for installing electronic modules of different form factors). Thus, the arrangement of the compartments in the rear panel section can depend on how many partition brackets are attached and to which bracket mounting locations they are mounted. In other words, by changing the number of partition brackets or changing the bracket mounting position in which the partition bracket is mounted, at least one of the respective sizes of the compartments, the respective positions of the compartments, or the number of compartments can be reconfigured (or re-customized). In some examples, this can be done to account for changes in the form factors of electronic modules that can be installed in the information processing device by changing the compartment arrangement. In some examples, the partition brackets that are removably coupled to the base and / or horizontal support structure can define compartments with a honeycomb cross-section in the rack, making it more robust than a conventional back panel.

[0028] In some examples, the modular rear panel section includes: a pair of vertical support members coupled to a base and defining an opening therebetween; and a horizontal support structure extending between and coupled to the pair of vertical support members to divide the opening into a first region and a second region. In such examples, a partition bracket is disposed at a corresponding one of the plurality of bracket mounting positions defined in the first region and / or the second region and is removably coupled to the base and / or the horizontal support structure to divide the first region and / or the second region into the plurality of compartments. Further, each compartment is configured to receive an electronic module and allow the electronic module to be electrically connected to a main system board of the information processing device. In such examples, each vertical support member may include a first guide member, and each partition bracket may include a second guide member, wherein the first guide member and the second guide members may be configured to engage with third guide members of the electronic modules when the plurality of electronic modules are inserted into the plurality of compartments to mount the plurality of electronic modules to the information processing device. Additionally, each partition bracket and / or vertical support member may include a latching element configured to secure an electronic module received in a corresponding compartment.

[0029] Since the modular panel section provides the option of configuring (or reconfiguring) the rack to accommodate electronic modules of different form factors in the rack, it provides the flexibility to upgrade existing electronic modules with varying form factors without changing the rack. Since the rack can be reconfigured to support electronic modules with varying form factors, the next generation of electronic modules can be designed in any of the known form factors to be easily assembled into the existing rack. Therefore, the cost incurred by redesigning the rack based on the varying form factors of the electronic modules can be avoided. Furthermore, the designed rack can be extended to the life cycle of a single rack, thereby providing substantial cost savings for the next generation of electronic modules. Additionally, the rack can provide support for a wide range of electronic modules, such as OCP DC SCMs, SFF OCP NICs, double-width or LFF OCP NICs, and OCP PCMs. Additionally, because the modular panel sections are customized by coupling the one or more partition brackets to the base and horizontal support structure, the modular panel sections are robust enough to withstand shock and vibration and can have a high yield strength, thereby overcoming the problem of conventional racks having sagging rear panels and / or permanently deformed rear panels when the conventional rack is in a fully loaded configuration with electronic modules.

[0030] With reference to the accompanying drawings, Figure 1 A block diagram of a modular panel section 100 of a rack is depicted. It should be understood that Figure 1The specific shapes, sizes, or other structural details are not intended to be illustrated accurately or to scale, and embodiments of the modular panel section 100 may have different numbers and arrangements of the illustrated components and may also include other parts not illustrated. In some examples, the modular panel section 100 forms a rear panel of an information handling device, such as a computer (e.g., a server, a storage device), a networking device (e.g., a switch, an access point), etc. In some other examples, the modular panel section 100 may be a portion of the rear panel of the information handling device. In other words, the modular panel section forms a portion of the rear panel of the information handling device or is a portion of the rear panel of the information handling device. The modular panel section 100 includes a pair of vertical support members 102, a horizontal support structure 104, one or more partitioning brackets 106, and a plurality of bracket mounting locations 108.

[0031] Each vertical support member 102 is a support beam for the modular panel section 100. In some examples, each vertical support member 102 can be part of a corresponding component housing of the information processing device, or can be a discrete member that can be coupled to the component housing. In other words, one of the pair of vertical support members 102 is part of one of the component housings of the pair. Each vertical support member 102 includes: a first guide member 110 (e.g., a groove) configured to slidably receive a portion of an electronic module; and a latch element (e.g., a first latch element 112) configured to secure the received electronic module.

[0032] The horizontal support structure 104 is a load-bearing beam for the modular panel section 100. The horizontal support structure 104 extends horizontally between and is coupled to the vertical support members 102. The horizontal support structure 104 can be configured to cover electronic modules disposed on the base of the rack and / or can be additionally configured to accommodate electronic modules. Furthermore, the horizontal support structure 104 can vertically divide the rear panel section 100 into two regions, a lower region below the horizontal support structure 104 and an upper region above the horizontal support structure 104, and can separate electronic modules installed in one region from electronic modules installed in the other region.

[0033] Each partition bracket 106 is an intermediate support beam of the modular panel section 100. In some examples, each partition bracket 106 includes: a second guide member 116 (e.g., a guide groove) configured to slidably receive another portion of the electronic module; and another latch element (e.g., a second latch element 118) configured to secure the received electronic module. Further, each partition bracket 106 includes a bottom mounting feature 120 and a top mounting feature 122, each mounting feature configured to connect to the base and / or horizontal support structure 104 and thereby create one or more compartments for receiving and removably mounting the electronic module to the information processing device. In some examples, the bottom mounting feature 120 and the top mounting feature 122 of each partition bracket 106 may include holes (not labeled) to receive fasteners and connect the partition bracket 106 to the horizontal support structure 104 and the base and / or the cover of the rack.

[0034] At least some of the bracket mounting locations 108 are disposed in the horizontal support structure 104. In some examples, additional bracket mounting locations 108 may be disposed in the base and / or cover. In some of these examples, such additional bracket mounting locations may be configured to align with corresponding bracket mounting locations 108 in the horizontal support structure 104. Figure 1 In the example of , the modular panel section 100 is shown as including two bracket mounting locations 108A, 108B. In some other examples, the modular panel section 100 may include more than one bracket mounting location 108 in the horizontal support structure 104, the base, and / or the cover, and such bracket mounting locations 108 may be selected based on different form factors of the electronic modules. Further, the bracket mounting locations 108 are spaced apart from each other along the width of the horizontal support structure 104, which extends along the first direction 10 of the horizontal support structure 104. Similarly, each bracket mounting location 108 is spaced apart from the corresponding vertical support member 102 along the width of the horizontal support structure 104. Figure 1 In the example shown, first bracket mounting location 108A is spaced a distance "D1" from first vertical support member 102A, first bracket mounting location 108A and second bracket mounting location 108B are spaced a distance "D2" from each other, and second bracket mounting location 108B is spaced a distance "D3" from second vertical support member 102B. In some examples, distance "D1" is greater than each of distances "D2" and "D3." Further, in some examples, distances "D2" and "D3" are equal.

[0035] Each bracket mounting location 108 includes one or more mounting elements 114. Each mounting element 114 is configured to facilitate connecting the partition bracket 106 to the horizontal support structure 104 (either by engaging directly with the partition bracket 106 or by engaging with another element (such as a fastener 113) that in turn engages the partition bracket 106). An example of a mounting element 114 that directly engages the partition bracket 106 is a groove or protrusion that mates with a complementary protrusion or groove of the partition bracket 106 (e.g., such as in a dovetail joint). Another example of a mounting element 114 that directly engages the partition bracket 106 is a latch that engages the partition bracket 106. An example of a mounting element 114 that indirectly engages the partition bracket 106 via another element is a hole that receives a fastener (e.g., a screw) that extends downwardly through the hole of the mounting element 114 and engages the partition bracket 106. For example, Figure 1 An example is illustrated in which the partition bracket 106A is mounted to the mounting location 108A via fasteners 113 extending through mounting elements 114 and engaging top mounting features 120 of the partition bracket 106A.

[0036] In some examples, the modular panel section 100 is assembled by first mounting the pair of vertical support members 102 (which are spaced apart from each other) on a base of a rack of an information handling system and coupling the pair of vertical support members 102 to the base so as to define an opening 124 between the pair of vertical support members. Further, the horizontal support structure 104 is disposed in the opening 124 so that it extends between and is coupled to the pair of vertical support members 102 to divide the opening 124 into a first region 126 and a second region 128. Further, one or more partition brackets 106 are disposed at the plurality of bracket mounting locations 108. Figure 1 In the example shown, the first partition bracket 106A is positioned at the first bracket mounting location 108A. In some examples, the one or more mounting elements 114 are configured to connect the corresponding partition bracket 106 to the horizontal support structure 104 when one of the partition brackets 106 is positioned at the corresponding bracket mounting location 108. In particular, in some examples, the modular panel section 100 may include fasteners 113 that may extend through holes in the one or more mounting elements 114 and engage with either the top mounting feature 122 or the bottom mounting feature 120 of the corresponding partition bracket 106.

[0037] In some examples, different fasteners may be used to connect to the top mounting feature 122 and the bottom mounting feature 120. In such examples, if the partition bracket 106 is disposed below the horizontal support structure 104, the fastener 113 may extend downward through the mounting element 114 and engage the top mounting feature 122 to connect the corresponding partition bracket 106 to the horizontal support structure 104, and another fastener (not shown) may extend upward through the holes in the one or more mounting elements in the base and engage the bottom mounting feature 120 of the corresponding partition bracket 106 to connect the corresponding partition bracket 106 to the base. On the other hand, in these examples, if the partition bracket 106 is disposed above the horizontal support structure 104, the fastener 113 may extend upward through the mounting element 114 and engage the bottom mounting feature 120 to connect the corresponding partition bracket 106 to the horizontal support structure 104, and another fastener (not shown) may extend downward through the holes in the one or more mounting elements in the cover and engage the top mounting feature 122 of the corresponding partition bracket 106 to connect the corresponding partition bracket 106 to the cover.

[0038] In other examples, a single fastener (not shown) can connect the partition bracket 106 to both the horizontal support structure 104 and the base (if the partition bracket 106 is positioned below the horizontal support structure 104) or the cover (if the partition bracket 106 is positioned above the horizontal support structure 104). In these examples, the top mounting feature 122 and the bottom mounting feature 120 can be two parts of a single hole extending through the bracket 106, and the fastener can extend through the hole. That is, if the partition bracket 106 is positioned below the horizontal support structure 104, the fastener can extend downward through the hole in the mounting element 114, through the top mounting feature 122, through the bracket 106, out of the bottom mounting feature 120, and finally into the hole in the mounting element of the base. If the partition bracket 106 is positioned above the horizontal support structure 104, the fastener can extend upward through the mounting element 114, through the bracket 106, and into the hole in the cover.

[0039] For example, the first partition bracket 106A can be positioned at the first bracket mounting location 108A in the first region 126. Furthermore, a first fastener (not shown) can extend through holes in the first mounting element 114A and the top mounting feature 122, and a second fastener (not shown) can extend through holes in the first mounting element and the bottom mounting feature 120 in the base (not shown) to connect the first partition bracket 106A to the horizontal support structure 104 and the base. In some examples, when the partition bracket 106 is positioned at the corresponding bracket mounting location 108 and removably connected to the horizontal support structure 104 and the base, the partition bracket 106 divides the first region (and / or the second region) into a plurality of compartments 130. For example, the first partition bracket 106A can divide the first region 126 into the plurality of compartments 130. In particular, each of the plurality of compartments 130 has a width that can be complementary to a width of a corresponding electronic module. Thus, each of the plurality of bays 130 may be configured to receive an electronic module of a particular form factor (eg, complementary width) and allow the electronic module to be electrically connected to a main system board of the information processing device.

[0040] In some examples, at least one of the respective sizes of the compartments 130, the respective positions of the compartments 130, or the number of compartments 130 can be reconfigured by positioning the second partition bracket 106B at the second bracket mounting location 108B, removing the first partition bracket 106A from the first bracket mounting location 108A, or changing the first partition bracket 106A installed at the first bracket mounting location 108A to the second bracket mounting location 108B. Thus, the modular panel section 100 provides the option of configuring (or reconfiguring) the rack to accommodate electronic modules of different form factors within the rack. Furthermore, the modular panel section 100 provides the flexibility to upgrade existing electronic modules with varying form factors without changing the rack. Because the rack can be reconfigured to support electronic modules with varying form factors, next-generation electronic modules can be designed in any of the known form factors to easily fit into the existing rack. Thus, the cost of redesigning the rack based on the varying form factors of the electronic modules can be avoided. Furthermore, the designed rack can be extended to the life cycle of a single rack, thereby providing substantial cost savings for the next generation of electronic modules. Additionally, because the modular panel section 100 is customized by coupling the one or more partition brackets to the base and horizontal support structure, the modular panel section 100 is sufficiently robust to withstand shock and vibration and can have a high yield strength, thereby overcoming the problem of conventional racks having sagging rear panels and / or permanently deformed rear panels when the conventional rack is in a fully loaded configuration with electronic modules.

[0041] Figure 2AA block diagram depicts a first rack 200-1 in a first configuration, the first rack comprising Figure 1 The first rack 200-1 includes a pair of component housings 202-1, a base 204-1, and a modular panel section 100. A first configuration of the modular panel section 100 is a configuration in which two partition brackets 106A and 106B are mounted at bracket mounting locations 108A and 108B, respectively, and are disposed below the horizontal structure 104. The first rack 200-1 includes a pair of component housings 202-1, a base 204-1, and a modular panel section 100.

[0042] In some examples, each component housing 202-1 can be a cage configured to accommodate a corresponding electronic component (such as a power supply unit of an information processing device). The base 204-1 is a load-bearing component of the first rack 200-1. The base 204-1 can extend between the pair of component housings 202-1 via the modular panel section 100. The base 204-1 includes a plurality of bracket mounting locations 208, for example, a first bracket mounting location 208-1A and a second bracket mounting location 208-1B. In such examples, each of the plurality of bracket mounting locations 208-1 includes one or more mounting elements 214, for example, a first mounting element 214-1A and a second mounting element 214-1B, which can be similar to those provided in Figure 1 The first mounting element 114A and the second mounting element 114B are provided on the horizontal support structure 104 .

[0043] The modular panel section 100 is disposed between the pair of component housings 202-1. As discussed herein, the modular panel section 100 includes the pair of vertical support members 102, the horizontal support structure 104, the one or more partitioning brackets 106, and the plurality of bracket mounting locations 108. In the example of Figure 2, the pair of vertical support members 102 are part of the pair of component housings 202-1. In particular, the first vertical support member 102A is integrated into the first component housing 202-1A, and the second vertical support member 102B is integrated into the second component housing 202-1B. In some examples, the pair of vertical support members 102 are disposed to be spaced apart from each other and coupled to the base 204-1 such that an opening 124 (e.g., Figure 1 ). The horizontal support structure 104 extends between and is coupled to the pair of vertical support members 102 to divide the opening 124 into a first region 126 and a second region 128 (as shown in FIG. Figure 1). In such an example, the first bracket mounting location 108A and the second bracket mounting location 108B of the horizontal support structure 104 are vertically aligned with the first bracket mounting location 208-1A and the second bracket mounting location 208-1B of the base 204-1. The one or more partition brackets 106 are arranged at corresponding bracket mounting locations 108 in the first area 126. For example, the first partition bracket 106A is arranged at the first bracket mounting locations 108A and 208-1A, and the second partition bracket 106B is arranged at the second bracket mounting locations 108B and 208-1B, thereby dividing the first area 126 into a plurality of compartments 130. In the illustrated example, the rack includes three compartments, for example, a first compartment 130-1A and two second compartments 130-1B and 130-1C. In such an example, the first compartment 130-1A has a first width "W1", and each of the two second compartments 130-1B and 130-1C has a second width "W2". In some examples, the first width "W1" is greater than the second width "W2". In some examples, by extending the fastener 113A to the first mounting element 114A, the top mounting feature 122A (eg, Figure 1 ), bottom mounting feature 120A (as shown in Figure 1 ) and a hole in the first mounting element 214-1A, the first partition bracket 106A is removably connected to the horizontal support structure 104 and the base 204-1. Similarly, by extending another fastener 113B to the second mounting element 114B, the top mounting feature 122B (as shown in FIG. Figure 1 ), bottom mounting feature 120B (as shown in Figure 1 1B) and second mounting element 214-1B, the second partition bracket 106B is removably connected to the horizontal support structure 104 and the base 204-1.

[0044] In some examples, the first compartment 130-1A is configured to slidably receive a first electronic module 250-1 having a first form factor (e.g., a first width "WE1"), and each of the two second compartments 130-1B, 130-1C is configured to slidably receive one second electronic module from a plurality of second electronic modules 252-1, each of which has a second form factor (e.g., a second width "WE2"). In particular, the first guide member 110A of the first vertical support member 102A and the second guide member 116A of the first partition bracket 106A are configured to engage with the third guide member 256-1A of the first electronic module 250-1 when the first electronic module 250-1 is inserted into the first compartment 130-1A to mount the first electronic module 250-1 to the first rack 200-1 of the information processing device. Similarly, the second guide member 116A of the first partition bracket 106A and the second guide member 116C of the third partition bracket 106C are configured to engage with the third guide member 256B of the second electronic module 252-1A when one of the plurality of second electronic modules 252-1 is inserted into one of the second compartments 130-1B, thereby mounting the second electronic module 250-1A in the first rack 200-1 of the information processing device. Furthermore, the second guide member 116B of the second partition bracket 106B and the first guide member 110B of the second vertical support member 102B are configured to engage with the third guide member 256-1C of another second electronic module 252-1B when another second electronic module 252-1 is inserted into another second compartment 130-1C, thereby mounting the other second electronic module 250-1B in the first rack 200-1 of the information processing device. In one or more examples, when the first electronic module 250-1 is inserted into the first compartment 130-1A, the first latch element 112A and the second latch element 118A are configured to engage with grooves (not labeled) in the first electronic module 250-1 and secure the first electronic module 250-1 to the first chassis 200-1. Further, when the first electronic module 250-1 is disposed in the first compartment 130-1A, the first electronic module 250-1 is electrically connected to the main system board of the information processing device. In particular, an electrical connector (not shown) of the first electronic module 250-1 is directly connected to another electrical connector (not shown) of the main system board. Similarly, when the second electronic module 252-1A is inserted into a second compartment 130-1B, the second latch element 118A of the first partition bracket 106A and the second latch element 118B of the second partition bracket 106B are configured to engage with a groove (unlabeled) in the second electronic module 252-1A and secure the second electronic module 252-1A to the first chassis 200-1.In some examples, when the second electronic module 252-1A is disposed in one second compartment 130-1B, the second electronic module 252-1A is electrically connected to the main system board of the information processing device. Specifically, an electrical connector (not shown) of the second electronic module 252-1A is directly connected to another electrical connector (not shown) of the main system board. Further, when another second electronic module 252-1B is inserted into another second compartment 130-1C, the second latch element 118B of the second partition bracket 106B and the first latch element 112B of the second vertical support member 102B are configured to engage with a groove (not labeled) in the other second electronic module 252-1B and secure the other second electronic module 252-1B to the first rack 200-1. In some examples, when the other second electronic module 252-1B is disposed in another second compartment 130-1C, the other second electronic module 252-1B is electrically connected to the main system board of the information processing device. In particular, an electrical connector (not shown) of another second electronic module 252-1B is directly connected to another electrical connector (not shown) of the main system board. In some examples, the first electronic module 250-1 may be an Open Compute Program (OCP) Data Center Security Control Module (DC SCM), and each of the plurality of second electronic modules 252-1 may be an SFF OCP NIC (Small Form Factor OCP Network Interface Card).

[0045] Figure 2B A block diagram depicts a second rack 200-2 in a second configuration, the second rack comprising Figure 1 The second configuration is a configuration in which the partition bracket 106A is mounted to the mounting position 108A below the structure 104, while the mounting position 108B below the structure 104 is unused. The second rack 200-2 includes a pair of component housings 202-2, a base 204-2, and a modular panel section 100.

[0046] In some examples, each component housing 202-2 can be a holder configured to accommodate a corresponding electronic component (such as a power supply unit of an information processing device). The base 204-2 is a load-bearing component of the second rack 200-2. The base 204-2 includes a plurality of bracket mounting locations 208-2, for example, a first bracket mounting location 208-2A and a second bracket mounting location 208-2B. In such examples, each of the plurality of bracket mounting locations 208-2 includes one or more mounting elements 214-2, for example, a first mounting element 214-2A and a second mounting element 214-2B, the first mounting element and the second mounting element being similar to the mounting elements provided on the second rack 200-2. Figure 1 The first mounting element 114A and the second mounting element 114B are provided on the horizontal support structure 104 .

[0047] The modular panel section 100 is disposed between the pair of component housings 202-2. As discussed herein, the modular panel section 100 includes the pair of vertical support members 102, the horizontal support structure 104, the one or more partitioning brackets 106, and the plurality of bracket mounting locations 108. In some examples, the pair of vertical support members 102 are disposed spaced apart from each other and coupled to the base 204-2 such that an opening 124 (e.g., Figure 1 ). The horizontal support structure 104 extends between and is coupled to the pair of vertical support members 102 to divide the opening 124 into a first region 126 and a second region 128 (as shown in FIG. Figure 1 ). In such examples, the first bracket mounting location 108A and the second bracket mounting location 108B of the horizontal support structure 104 are vertically aligned to the first bracket mounting location 208-2A and the second bracket mounting location 208-2B of the base 204-2. The one or more partitioning brackets 106 are arranged at corresponding bracket mounting locations 108 in the first area 126. For example, the first partitioning bracket 106A is arranged at the first bracket mounting locations 108A, 208-2A, thereby dividing the first area 126 into a plurality of compartments 130-2. In the illustrated example, the rack includes two compartments, for example, a first compartment 130-2A and a third compartment 130-2C. In such examples, the first compartment 130-2A has a first width "W1" and the third compartment 130-2C has a third width "W3". In some examples, the third width "W3" is greater than the first width "W1". In some examples, i) by extending a fastener 113A between the first mounting element 114A and the top mounting feature 122A (e.g., Figure 1 104, and ii) by extending another fastener 113B into holes in the first mounting element 214-2A and the bottom mounting feature 120A. In other words, the fastener 113A extends downwardly through the first mounting element 114A and engages the top mounting feature 122A to connect the first partition bracket 106A to the horizontal support structure 104, and the other fastener 113B extends upwardly through the hole in the first mounting element 214-2A and engages the bottom mounting feature 120A to connect the first partition bracket 106A to the base 204-2.

[0048] In some examples, the first compartment 130-2A is configured to slidably receive a first electronic module 250-2 having a first form factor (e.g., a first width "WE1"), and the third compartment 130-2C is configured to slidably receive a third electronic module 254-1 having a third form factor (e.g., a third width "WE3"). It is noted herein that the first electronic module 250-2 is similar to the first electronic module 250-1 (e.g., Figure 2A ). Further, the width of the first compartment 130-2A is Figure 1 The width of the first compartment 130-1A is the same as that of the first electronic module 250-2. Since the first electronic module 250-2 is arranged in the first compartment 130-2A, the first electronic module 250-2 is electrically connected to the main system board of the information processing device. In particular, the electrical connector (not shown) of the first electronic module 250-2 is directly connected to another electrical connector (not shown) of the main system board. Further, when the third electronic module 254-1 is arranged in the third compartment 130-2C, the third electronic module 254-1 is electrically connected to the main system board of the information processing device. In particular, the electrical connector (not shown) of the third electronic module 254-1 is directly connected to another electrical connector (not shown) of the main system board. In some examples, the first electronic module 250-2 can be an Open Compute Program (OCP) Data Center Security Control Module (DC SCM), and the third electronic module 252-2 can be a double-width or LFF (large form factor) OCP network interface card (NIC).

[0049] Figure 2C A block diagram depicts a third rack 200-3 in a third configuration, the third rack comprising Figure 1 The third configuration is a configuration in which the partition bracket 106B is mounted to the mounting position 108B below the structure 104, while the mounting position 108A below the structure 140 is unused. The third rack 200-3 includes a pair of component housings 202-3, a base 204-3, and a modular panel section 100.

[0050] In some examples, each component housing 202-3 can be a holder configured to accommodate a corresponding electronic component (such as a power supply unit of an information processing device). The base 204-3 is a load-bearing component of the third rack 200-3. The base 204-3 includes a plurality of bracket mounting locations 208-3, for example, a first bracket mounting location 208-3A and a second bracket mounting location 208-3B. In such examples, each of the plurality of bracket mounting locations 208-3 includes one or more mounting elements 214-3, for example, a first mounting element 214-3A and a second mounting element 214-3B, the first mounting element and the second mounting element being similar to those provided on the Figure 1 The first mounting element 114A and the second mounting element 114B are provided on the horizontal support structure 104 .

[0051] The modular panel section 100 is disposed between the pair of component housings 202-3. As discussed herein, the modular panel section 100 includes the pair of vertical support members 102, the horizontal support structure 104, the one or more partitioning brackets 106, and the plurality of bracket mounting locations 108. In some examples, the pair of vertical support members 102 are disposed spaced apart from each other and coupled to the base 204-3 such that an opening 124 (e.g., Figure 1 ). The horizontal support structure 104 extends between and is coupled to the pair of vertical support members 102 to divide the opening 124 into a first region 126 and a second region 128 (as shown in FIG. Figure 1 ). In such an example, the first bracket mounting location 108A and the second bracket mounting location 108B of the horizontal support structure 104 are vertically aligned to the first bracket mounting location 208-3A and the second bracket mounting location 208-3B of the base 204-3. The one or more partitioning brackets 106 are arranged at corresponding bracket mounting locations 108 in the first area 126. For example, the second partitioning bracket 106B is arranged at the second bracket mounting locations 108B, 208-3A, thereby dividing the first area 126 into a plurality of compartments 130-3. In the illustrated example, the rack includes two compartments, for example, a fourth compartment 130-3D and a second compartment 130-3B. In such an example, the fourth compartment 130-3D has a fourth width "W4" and the second compartment 130-3B has a second width "W2". In some examples, the fourth width "W4" is greater than the second width "W2". In some examples, by extending the fastener 113 to the second mounting element 114B, the top mounting feature 122A (eg, Figure 1 ), bottom mounting feature 120A (as shown in Figure 1 ) and the holes of the first mounting element 214-3B, the second partition bracket 106B is removably connected to the horizontal support structure 104 and the base 204-3.

[0052] In some examples, the fourth compartment 130-3D is configured to slidably receive a fourth electronic module 258-1 having a fourth form factor (e.g., a fourth width "WE4"), and the second compartment 130-3B is configured to slidably receive a second electronic module 252-1C having a second form factor (e.g., a second width "WE2"). It is noted herein that the second electronic module 252-1C is similar to the second electronic modules 252-1A, 252-1B (e.g., Figure 2AFurther, the width of the second compartment 130-3B is Figure 1 The widths of the second compartments 130-1B and 130-1C are the same. Since the fourth electronic module 258-1 is arranged in the fourth compartment 130-3D, the fourth electronic module 258-1 is electrically connected to the main system board of the information processing device. In particular, the electrical connector (not shown) of the fourth electronic module 258-1 is directly connected to another electrical connector (not shown) of the main system board. Further, when the second electronic module 252-1C is arranged in the second compartment 130-3B, the second electronic module 252-1C is electrically connected to the main system board of the information processing device. In particular, the electrical connector (not shown) of the second electronic module 252-1C is directly connected to another electrical connector (not shown) of the main system board. In some examples, the fourth electronic module 258-1 can be an OCP PCM (Platform Control Module), and the second electronic module 252-1C can be an SFF OCP NIC (Small Form Factor OCP Network Interface Card).

[0053] Figure 2D A block diagram depicts a fourth rack 200-4 in a fourth configuration, the fourth rack consisting of Figure 1 The fourth configuration is a configuration in which the partition bracket 106A is mounted to the bracket mounting position 106A above the structure 104. The fourth rack 200-4 includes a pair of component housings 202-4, a base 204-4, a cover 284-4, and a modular panel section 100.

[0054] In some examples, each component housing 202-4 can be a holder configured to accommodate a corresponding electronic component (such as a power supply unit of an information processing device). The base 204-4 is a load-bearing component of the fourth rack 200-4, and the cover 284-4 is a protective cover for the fourth rack 200-4. The cover 204-4 includes a plurality of bracket mounting locations 288-4, such as a first bracket mounting location 288-4A and a second bracket mounting location 288-4B. In such examples, each of the plurality of bracket mounting locations 288-4 includes one or more mounting elements 294-4, such as a first mounting element 294-4A and a second mounting element 294-4B, the first mounting element and the second mounting element being similar to those provided in Figure 1 The first mounting element 114A and the second mounting element 114B are provided on the horizontal support structure 104 .

[0055] The modular panel section 100 is disposed between the pair of component housings 202-4. As discussed herein, the modular panel section 100 includes the pair of vertical support members 102, the horizontal support structure 104, the one or more partitioning brackets 106, and the plurality of bracket mounting locations 108. In some examples, the pair of vertical support members 102 are disposed spaced apart from one another and coupled to the cover 284-4 such that an opening 124 is defined between the pair of vertical support members 102. The horizontal support structure 104 extends between and is coupled to the pair of vertical support members 102 to divide the opening 124 into a first region 126 and a second region 128 (e.g., Figure 1 ). In such an example, the first bracket mounting location 108A and the second bracket mounting location 108B of the horizontal support structure 104 are vertically aligned with the first bracket mounting location 288-4A and the second bracket mounting location 288-4B of the cover 284-4. The one or more partitioning brackets 106 are arranged at corresponding bracket mounting locations 108 in the second area 128. For example, the first partitioning bracket 106A is arranged at the first bracket mounting locations 108B, 288-4A, thereby dividing the second area 128 into a plurality of compartments 130-4. In the illustrated example, the rack includes two compartments, for example, the fifth compartment 130-4E and the sixth compartment 130-4F. In such an example, the fifth compartment 130-4E has a first width "W1" and the sixth compartment 130-4F has a third width "W3". In some examples, the third width "W3" is greater than the first width "W1". In some examples, i) by extending a fastener 113A between the first mounting element 114A and the bottom mounting feature 120A (e.g., Figure 1 ) by removably attaching the first partition bracket 106A to the horizontal support structure 104 by extending another fastener 113B between the first mounting element 294-4A and the top mounting feature 122A (as shown in FIG. Figure 1 106A is removably connected to the cover 284-4 by inserting a fastener 113A into a hole in the first mounting element 114A (shown in FIG. 106A ). In other words, a fastener 113A extends upward through the first mounting element 114A and engages the bottom mounting feature 120A to connect the first partition bracket 106A to the horizontal support structure 104, and another fastener 113A extends downward through a hole in the first mounting element 294-4A and engages the top mounting feature 122A to connect the first partition bracket 106A to the cover 284-4.

[0056] In some examples, the fifth compartment 130-4E is configured to slidably receive a first electronic module 250-3 having a first form factor (e.g., a first width "WE1"). It is noted herein that the first electronic module 250-3 is similar to the first electronic module 250-1 (e.g., Figure 2A ). Further, the width of the sixth compartment 130-4F is Figure 2B The width of the third compartment 130-2C is the same as that of the first electronic module 250-3. After the first electronic module 250-3 is set in the fifth compartment 130-4E, the first electronic module 250-3 is electrically connected to the main system board of the information processing device. In particular, the electrical connector (not shown) of the first electronic module 250-3 is connected to another electrical connector (not shown) of the main system board via a cable. Since the first electronic module 250-3 is set in the second area 128, the electrical connector of the first electronic module 250-3 may not be directly connected to the electrical connector of the main system board, so a cable may have to be used to connect the first electronic module 250-3 to the main system board. In some examples, the first electronic module 250-3 can be an Open Compute Program (OCP) Data Center Security Control Module (DC SCM). The sixth compartment 130-4F can receive a third electronic module 254-2, such as a double-width or LFF (large form factor) OCP network interface card (NIC).

[0057] Refer to the attached figure ( Figures 2A-2D ), in one or more examples, at least one of the respective sizes of the compartments 130, the respective positions of the compartments 130, or the number of compartments among the plurality of compartments 130 is reconfigurable (or recustomizable) to allow installation of the one or more electronic modules having a varying form factor by at least one of: i) disposing an additional partitioning bracket 106 at one of the plurality of bracket mounting locations 108 or removing one of the partitioning brackets 106, or ii) changing the bracket mounting location of the plurality of bracket mounting locations 108 at which the one or more partitioning brackets 106 are installed. Thus, the modular panel section 100 provides the option of configuring (or reconfiguring) the rack to accommodate electronic modules of different form factors within the rack, thereby providing the flexibility to upgrade existing electronic modules of varying form factors without changing the rack. Because the rack can be reconfigured to support electronic modules of varying form factors, next-generation electronic modules can be designed in any of the known form factors to easily fit into an existing rack. Thus, the cost of redesigning the rack based on the varying form factors of the electronic modules can be avoided. Furthermore, the designed rack can be extended to the lifecycle of a single rack, thereby providing substantial cost savings for the next generation of electronic modules. Additionally, because the modular panel sections are customized by coupling the one or more partition brackets to the base, lid, and horizontal support structure, the modular panel sections are robust enough to withstand shock and vibration and can have a high yield strength, thereby overcoming the problem of conventional racks having sagging rear panels and / or permanently deformed rear panels when the conventional rack is in a fully loaded configuration with electronic modules.

[0058] Figure 3A and Figure 3B A modular panel section 300 is depicted. Figure 3A Depicts an exploded perspective view of a modular panel section 300, and Figure 3B An enlarged perspective view of the partition bracket 306 of the modular panel section 300 is depicted. In the following description, for ease of illustration, the following description is made simultaneously. Figure 3A and Figure 3B The modular panel section 300 includes a pair of vertical support members 302, a horizontal support structure 304, one or more partition brackets 306, a plurality of bracket mounting locations 308, 408 (and / or 808, 1008, 1308), one or more mounting elements 314, and one or more fasteners 392. It may be noted herein that for ease of explanation of the present disclosure, in Figure 3A In the example of FIG, a portion of the base 404 (and / or 804, 1004, 1304) of the rack is also shown, and such disclosure of the base 404 and the modular panel section 300 should not be construed as limiting the present disclosure. Further, it is noted herein that for ease of illustration, the one or more fasteners 392 for removably connecting the one or more partition brackets 306 to the horizontal support structure 304 are only shown in FIG. Figure 3A 4 and / or the cover, and one or more other fasteners that can be used to removably connect the one or more partition brackets 306 to the base 404 and / or the cover are not shown in the example. Figure 3A , and such non-illustration of such one or more fasteners should not be construed as a limitation of the present disclosure.

[0059] Each vertical support member 302 includes a first guide member 310 (e.g., a groove) for slidably receiving a portion of an electronic module and a latching element (e.g., a first latching element 312) for securing the received electronic module. The horizontal support structure 304 covers and / or accommodates an electronic module disposed on the base 404 of the rack. Each partition bracket 306 includes a second guide member 316 (e.g., a guide groove) for slidably receiving another portion of the electronic module and a latching element (e.g., a second latching element 318) for securing the received electronic module. Each partition bracket 306 further includes a bottom mounting feature 320 and a top mounting feature 322, each of which is configured to connect to the horizontal support structure 304 and the base 404 and / or cover, thereby creating a plurality of compartments 330 to allow electronic modules to be removably mounted to the information processing device. In some examples, the bottom mounting feature 320 and the top mounting feature 322 of each partition bracket 306 include holes 311. Further, each partition bracket 306 has a semi-U-shaped space height.

[0060] In some examples, some bracket mounting locations 308 are located in the horizontal support structure 304, and other bracket mounting locations 408 are located in the base 404. Furthermore, the modular panel section 300 may additionally include bracket mounting locations in the cover of the rack. In such examples, the bracket mounting locations 308 in the horizontal support structure 304 and the base 404 and / or cover are vertically aligned with each other. Each bracket mounting location 308 in the horizontal support structure 304 includes one or more mounting elements 314. In some examples, each of the one or more mounting elements 314 has a hole 313. Similarly, the bracket mounting locations 408 in the base 404 include one or more mounting elements 414 (and / or 814, 1014, 1314). In some examples, each of the one or more mounting elements 414 has a hole 415 (and / or 815, 1015, 1315).

[0061] In some examples, the modular panel section 300 is assembled by first mounting the pair of vertical support members 302 on the base 404 and coupling the pair of vertical support members 302 to the base 404 such that an opening 324 is defined between the pair of vertical support members. Furthermore, the horizontal support structure 304 is positioned within the opening 324 such that it extends between and is coupled to the pair of vertical support members 302 to divide the opening 324 into a first region 326 and a second region 328. Furthermore, one or more partition brackets 306 may be positioned at the plurality of bracket mounting locations 308, 408 in the first region 326 and / or the second region 328. In such examples, the one or more mounting elements 314, 414 are configured to connect the corresponding partition bracket 306 to the horizontal support structure 304 and the base 404 and / or the cover when one of the partition brackets 306 is positioned at the corresponding bracket mounting location 308, 408. For example, the modular panel section 300 includes fasteners 392 that can extend through holes 313 in one or more mounting elements 314 and holes 311 in top mounting features 322 to connect the top portion of the corresponding partition bracket 306 to the horizontal support structure 304. Similarly, the modular panel section 300 includes other fasteners that can extend through holes 415 in one or more mounting elements 414 and holes (not shown) in bottom mounting features 320 to connect the bottom portion of the corresponding partition bracket 306 to the base 404. In some examples, when the partition bracket 306 is positioned at the corresponding bracket mounting locations 308, 408 and removably connected to the horizontal support structure 304 and the base 404, the partition bracket 306 can divide the first area 326 (and / or the second area 328) into the plurality of compartments 330.

[0062] Figure 4 Depicted is a perspective view of a first rack 400 in a first configuration, the first rack consisting of Figure 3A The first frame 400 includes a pair of component housings 402 , a base 404 and the modular panel sections 300 .

[0063] In some examples, each component housing 402 can be a holder configured to accommodate a corresponding electronic component (such as a power supply unit of an information processing device). The base 404 can extend between the pair of component housings 402 via the modular panel section 300. In other words, the modular panel section 300 is disposed between the pair of component housings 402 and is configured to removably receive the electronic component. In particular, the pair of vertical support members 302 are disposed to be spaced apart from each other and coupled to the base 404 so that an opening 324 (such as a plurality of vertical support members) is defined between the pair of vertical support members 302. Figure 1). The horizontal support structure 304 extends between and is coupled to the pair of vertical support members 302 to divide the opening 324 into a first region 326 and a second region 328 (as shown in FIG. Figure 1 ).

[0064] Further, the first partition bracket 306A is provided at the first bracket mounting position 308A, 408A, for example, in the first area 326, and the second partition bracket 306B is also provided at the second bracket mounting position 308B, 408B, for example, in the first area 326, thereby dividing the first area 326 into a plurality of compartments 330. In the illustrated example, the first rack 400 includes three compartments, for example, a first compartment 330A and two second compartments 330B. In such an example, the first compartment 330A has a first width, and each second compartment 330B has a second width. In some examples, the first width is greater than the second width. In some examples, the fastener 392 is extended into the hole 313 (e.g., Figure 3A ) and hole 311 in top mounting feature 322A (as shown in Figure 3B ), the first partition bracket 306A is removably connected to the horizontal support structure 304 and is secured to the horizontal support structure 304 by extending fasteners (not shown) into holes 415 (as shown) in the first mounting element 414A. Figure 3A ) and a hole (not shown) in the bottom mounting feature 320A, the first partition bracket is removably connected to the base 404. In one or more examples, the second partition bracket 306B is also removably connected to the horizontal support structure 304 and the base 404, as discussed above.

[0065] Figure 5 A perspective view of a first electronic module 550 is depicted. In some examples, the first electronic module 550 is an Open Compute Program (OCP) Data Center Security Control Module (DC SCM). Since the OCP DC SCM is a standard electronic module, it will not be discussed in further detail. The first electronic module 550 includes one or more first electrical connectors 576 disposed at a rear sub-panel, and a plurality of ports 578 located at a front sub-panel. Further, the first electronic module 550 includes a third guide member 556 extending along a peripheral side wall of the first electronic module 550. In some examples, a groove 580 is formed on each of the third guide members 556 to allow the first electronic module 550 to be secured by a latch element. In one or more examples, the first electronic module 550 has a first form factor, such as a first width, which may be substantially equal to the first compartment 330A (e.g., Figure 4 ) of the first width.

[0066] Figure 6 A perspective view of a plurality of second electronic modules 650 is depicted. In some examples, each of the plurality of second electronic modules 650 is a SFF OCP NIC (Small Form Factor OCP Network Interface Card). Since the SFF OCP NIC is a standard electronic module, it will not be discussed in further detail. Each second electronic module 650 includes one or more first electrical connectors 676 disposed at a rear sub-panel, and a third guide member 656 extending along a peripheral side wall of the second electronic module 650. In some examples, a groove 680 is formed on each of the third guide members 656 to allow the second electronic module 650 to be secured by a latch element. In one or more examples, each second electronic module 650 has a second form factor, such as a second width, which may be substantially equal to the width of the second compartment 330B (e.g., Figure 4 The second width of each of the ).

[0067] Figure 7 A perspective view of an information processing device 700 is depicted, which has Figure 4 The first rack 400, the main system board 702, Figure 5 The first electronic module 550, and Figure 6 The plurality of second electronic modules 650.

[0068] In some examples, the first compartment 330A is configured to slidably receive a first electronic module 550 having a first form factor, and each second compartment 330B is configured to slidably receive a second electronic module from a plurality of second electronic modules 650, each second electronic module having a second form factor. Figure 3A ) of the first guide member 310A (as shown in Figure 3A ) and the first partition bracket 306A (as shown in Figure 3A ) of the second guide member 316A (as shown in Figure 3A ) is configured to contact the third guide member 556 (as shown in FIG) of the first electronic module 550 when the first electronic module 550 is inserted into the first compartment 330A. Figure 5 ) to mount the first electronic module 550 to the first chassis 400 of the information processing device 700. In one or more examples, each of the plurality of second electronic modules 650 is also inserted into a corresponding second compartment of the plurality of second compartments 330B to mount the corresponding second electronic module 650 to the first chassis 400 of the information processing device 700, as discussed above.

[0069] In one or more examples, when the first electronic module 550 is inserted into the first compartment 330A, the first latch element 312A and the second latch element 318A are configured to engage with the groove 580 (eg, Figure 5 4. The first electronic module 550 is secured to the first chassis 400 by a latching element (shown in FIG. 4 ). In one or more examples, each of the plurality of second electronic modules 650 is also secured to the first chassis 400 by a corresponding latching element, as discussed above. Further, when the first electronic module 550 is disposed in the first compartment 330A, the first electronic module 550 is electrically connected to the main system board 702. In particular, the one or more first electrical connectors 576 of the first electronic module 550 are directly connected to one or more second electrical connectors 776 of the main system board 702. In one or more examples, the one or more first electrical connectors 676 of each second electronic module 650 are also directly connected to corresponding one or more second electrical connectors 778 of the main system board 702, as discussed above.

[0070] Figure 8 Depicted is a perspective view of a second rack 800 in a second configuration, the second rack consisting of Figure 3A The second frame 800 includes a pair of component housings 802 , a base 804 and a modular panel section 300 .

[0071] In some examples, each component housing 802 may be a holder configured to accommodate a corresponding electronic component (such as a power supply unit of an information processing device). The base 804 may extend between the pair of component housings 802 via the modular panel section 300. In other words, the modular panel section 300 is disposed between the pair of component housings 802. In particular, the pair of vertical support members 302 are disposed to be spaced apart from each other and coupled to the base 804 so as to define an opening 324 (such as a plurality of vertical support members) between the pair of vertical support members 302. Figure 1 ). The horizontal support structure 304 extends between and is coupled to the pair of vertical support members 302 to divide the opening 324 into a first region 326 and a second region 328 (as shown in FIG. Figure 1 ).

[0072] Further, the first partition bracket 306A is provided at the first bracket mounting location 308A, 808A, for example, in the first area 326, thereby dividing the first area 326 into a plurality of compartments 330. In the illustrated example, the second rack 800 includes two compartments, for example, a first compartment 330A and a third compartment 330C. In such an example, the first compartment 330A has a first width, and the third compartment 330C has a third width. In some examples, the third width is greater than the first width. In some examples, the fastener 392 is extended into the hole 313 (e.g., Figure 3A ) and hole 311 in top mounting feature 322A (as shown in Figure 3B ), the first partition bracket 306A is removably connected to the horizontal support structure 304 and is secured to the horizontal support structure 304 by extending fasteners (not shown) into holes 815 (as shown) in the first mounting element 814A. Figure 3A The first partition bracket is removably connected to the base 804 by inserting a first partition bracket into the base 804 (shown in FIG. 8 ) and a hole (not shown) in the bottom mounting feature 320A.

[0073] Figure 9 A perspective view of a third electronic module 950 is depicted. In some examples, the third electronic module 950 is a double-width or LFF (large form factor) OCP NIC. Since double-width or LFF OCP NICs are standard electronic modules, they will not be discussed in further detail. The third electronic module 950 includes one or more first electrical connectors 976 disposed at the rear sub-panel, and a plurality of ports 978 located at the front sub-panel. Further, the third electronic module 950 includes a third guide member 956 extending along a peripheral side wall of the third electronic module 950. In some examples, a groove 980 is formed on each of the third guide members 956 to allow the third electronic module 950 to be secured by a latch element. In one or more examples, the third electronic module 950 has a third form factor, such as a third width, that is greater than the first compartment 330A (e.g., Figure 4 ) and is equal to the third width of the third compartment 330C.

[0074] Figure 10 A perspective view of an information processing device 1000 is depicted, which has Figure 8 The second rack 800, and the main system board 1002, Figure 5 The first electronic module 550 and Figure 9 The third electronic module 950.

[0075] In some examples, the first compartment 330A is configured to slidably receive a first electronic module 550 having a first form factor, and the third compartment 330C is configured to slidably receive a third electronic module 950 having a third form factor. Figure 3A ) of the first guide member 310A (as shown in Figure 3A ) and the first partition bracket 306A (as shown in Figure 3A ) of the second guide member 316A (as shown in Figure 3A ) is configured to contact the third guide member 556 (as shown in FIG) of the first electronic module 550 when the first electronic module 550 is inserted into the first compartment 330A. Figure 5 ) are engaged to mount the first electronic module 550 to the second chassis 800 of the information processing device 700. In one or more examples, the third electronic module 950 is also inserted into the third compartment 330C to mount the third electronic module 950 to the second chassis 800, as discussed above.

[0076] In one or more examples, when the first electronic module 550 is inserted into the first compartment 330A, the first latch element 312A and the second latch element 318A are configured to engage with the groove 580 (eg, Figure 5 ) engages and secures the first electronic module 550 to the second chassis 800. In one or more examples, the third electronic module 950 is also secured to the second chassis 800 by corresponding latching elements, as discussed above. Further, when the first electronic module 550 is disposed in the first compartment 330A, the first electronic module 550 is electrically connected to the main system board 1002. In particular, the one or more first electrical connectors 576 of the first electronic module 550 are directly connected to the one or more second electrical connectors 1076 of the main system board 1002. In one or more examples, the one or more first electrical connectors 976 of the third electronic module 950 are also directly connected to the one or more second electrical connectors 1078 of the main system board 1002, as discussed above.

[0077] Figure 11 Depicted is a perspective view of a third rack 1100 in a third configuration, the third rack consisting of Figure 3A The third frame 1100 includes a pair of component housings 1102 , a base 1104 and modular panel sections 300 .

[0078] In some examples, each component housing 1102 may be a holder configured to accommodate a corresponding electronic component (such as a power supply unit of an information processing device). The base 1104 may extend between the pair of component housings 1102 via the modular panel section 300. In other words, the modular panel section 300 is disposed between the pair of component housings 1102. In particular, the pair of vertical support members 302 are disposed to be spaced apart from each other and coupled to the base 1104 so as to define an opening 324 (e.g., a plurality of vertical support members) between the pair of vertical support members 302. Figure 1 ). The horizontal support structure 304 extends between and is coupled to the pair of vertical support members 302 to divide the opening 324 into a first region 326 and a second region 328 (as shown in FIG. Figure 1 ).

[0079] Further, the second partition bracket 306B is provided at the second bracket mounting position 308B, 1108B in the first area 326, for example, thereby dividing the first area 326 into a plurality of compartments 330. In the illustrated example, the third rack 1100 includes two compartments, for example, a fourth compartment 330D and a second compartment 330B. In such an example, the fourth compartment 330D has a fourth width, and the second compartment 330B has a second width. In some examples, the fourth width is greater than the second width. In some examples, the fastener 392 is extended into the hole 313 (e.g., Figure 3A ) and holes 311 in top mounting feature 322B (as shown in Figure 3A ), the second partition bracket 306B is removably connected to the horizontal support structure 304 and is secured to the horizontal support structure 304 by extending fasteners (not shown) into the holes 815 (as shown) in the first mounting element 1114B. Figure 3A The second partition bracket is removably connected to the base 1104 by inserting a hole (not shown) in the bottom mounting feature 320B (shown in FIG. 110B ).

[0080] Figure 12A perspective view of the fourth electronic module 1250 is depicted. In some examples, the fourth electronic module 1250 is an OCP PCM (Platform Control Module). Since the OCP PCM is a standard electronic module, it will not be discussed in further detail. The fourth electronic module 1250 includes one or more first electrical connectors 1276 disposed at the rear sub-panel, and a plurality of ports 1278 located at the front sub-panel. Further, the fourth electronic module 1250 includes a third guide member 1256 extending along the peripheral side wall of the fourth electronic module 1250. In some examples, a groove 1280 is formed on each of the third guide members 1256 to allow the fourth electronic module 1250 to be secured by a latch element. In one or more examples, the fourth electronic module 1250 has a fourth form factor, such as a fourth width, which is greater than the second compartment 330B (e.g., Figure 4 ) of the second width.

[0081] Figure 13 A perspective view of an information processing device 1300 is depicted, which has Figure 11 The third rack 1100 and the main system board 1302, Figure 12 The fourth electronic module 1250 and Figure 6 The second electronic module 650.

[0082] In some examples, the first compartment 330A is configured to slidably receive a fourth electronics module 1250 having a fourth form factor, and the second compartment 330B is configured to slidably receive a second electronics module 650 having a second form factor. Figure 3A ) of the first guide member 310A (as shown in Figure 3A ) and the first partition bracket 306A (as shown in Figure 3A ) of the second guide member 316A (as shown in Figure 3A ) is configured to engage with the third guide member 1256 (as shown in FIG. 11 ) of the fourth electronic module 1250 when the fourth electronic module 1250 is inserted into the fourth compartment 330D. Figure 12 ) to mount the fourth electronic module 1250 to the third chassis 1100 of the information processing device 1300. In one or more examples, the second electronic module 650 is also inserted into the second compartment 330B to mount the second electronic module 650 to the third chassis 1100, as discussed above.

[0083] In one or more examples, when the fourth electronic module 1250 is inserted into the fourth compartment 330D, the first latch element 312A and the second latch element 318A are configured to engage with the groove 1280 (eg, Figure 12330D) engages and secures the fourth electronic module 1250 to the third chassis 1100. In one or more examples, the second electronic module 650 is also secured to the third chassis 1100 via corresponding latching elements, as discussed above. Further, when the fourth electronic module 1250 is disposed in the fourth compartment 330D, the fourth electronic module 1250 is electrically connected to the main system board 1302. In particular, the one or more first electrical connectors 1276 of the fourth electronic module 1250 are directly connected to the one or more second electrical connectors 1376 of the main system board 1302. In one or more examples, the one or more first electrical connectors 676 of the second electronic module 650 are also directly connected to the one or more second electrical connectors 1378 of the main system board 1302, as discussed above.

[0084] Figure 14 The flow of the method 1400 for configuring a rack of information processing equipment by modular panel sections is described. It is noted herein that, for example, the method 1400 is combined with Figure 1 and Figures 2A-2D ,as well as Figures 3A-3B and Figure 4-13 The method 1400 starts at block 1402 and continues to block 1404.

[0085] At block 1404, method 1400 includes coupling a pair of vertical support members of the modular panel section to a base of the rack to define an opening between the pair of vertical support members. Method 1400 continues to block 1406. At block 1406, method 1400 includes coupling a horizontal support structure of the modular panel section to the pair of vertical support members to divide the opening into a first region and a second region, wherein the first region and / or the second region includes a plurality of bracket mounting locations, each bracket mounting location including one or more mounting elements. Method 1400 continues to block 1408. At block 1408, method 1400 includes positioning partition brackets of the modular panel section at corresponding bracket mounting locations of the plurality of bracket mounting locations. Method 1400 continues to block 1410. At block 1410, method 1400 includes removably coupling the partition brackets to the base and / or the horizontal support structure using the one or more mounting elements to divide the first region and / or the second region into a plurality of compartments of the rack. Each of the plurality of bays is configured to receive one of the plurality of electronic modules, and to removably mount the electronic module to the chassis and electrically connect the electronic module to a main system board of the information processing device.

[0086] In some examples, method 1400 further includes reconfiguring the rack using the modular panel sections. For example, at least one of the respective sizes of the bays, the respective positions of the bays, or the number of bays in the plurality of bays can be reconfigured by: placing an additional partition bracket in one of the plurality of bracket mounting locations, removing a partition bracket, or changing a bracket mounting location in the plurality of bracket mounting locations where a partition bracket is mounted. The method ends at block 1412.

[0087] In the foregoing description, numerous details are set forth to provide an understanding of the subject matter disclosed herein. However, embodiments may be practiced without some or all of these details. Other embodiments may include modifications, combinations, and variations of the details discussed above. The following claims are intended to cover such modifications and variations.

Claims

1. A rack of an information processing device, comprising: base; A modular panel section comprising: a pair of vertical support members coupled to the base and defining an opening therebetween; a horizontal support structure extending between and coupled to the pair of vertical support members to divide the opening into a first area and a second area; One or more partition brackets; and a plurality of bracket mounting locations in the first area and / or the second area, wherein each of the bracket mounting locations comprises one or more mounting elements configured to connect the corresponding partition bracket to the base and / or the horizontal support structure when one of the partition brackets is positioned at the corresponding bracket mounting location, wherein the partition bracket is disposed at a corresponding bracket mounting position among the plurality of bracket mounting positions and is removably coupled to the base and / or the horizontal support structure and divides the first area and / or the second area into a plurality of compartments, and Each of the plurality of compartments is configured to receive one of the plurality of electronic modules and allow the electronic module to be electrically connected to a main system board of the information processing device.

2. The rack according to claim 1, wherein: At least one of the respective sizes of the compartments, the respective positions of the compartments, or the number of compartments among the plurality of compartments can be reconfigured by: placing an additional partition bracket at one of the plurality of bracket mounting locations or removing one of the partition brackets; or The bracket installation position in which the one or more partition brackets are installed among the plurality of bracket installation positions is changed.

3. The rack according to claim 1, wherein: Each vertical support member of the pair of vertical support members includes a first guide member, wherein each partition bracket includes a second guide member, wherein the first guide member and the second guide member are configured to engage with the third guide member of the electronic module when the multiple electronic modules are inserted into the multiple compartments to install the multiple electronic modules to the information processing device.

4. The rack according to claim 3, wherein: A first compartment among the multiple compartments is defined between a first vertical support member and a first partition bracket, and wherein the first guide member of the first vertical support member and the second guide member of the first partition bracket are configured to engage with the third guide member of the first electronic module among the multiple electronic modules to mount the first electronic module to the information processing device.

5. The rack according to claim 4, wherein: A second compartment among the multiple compartments is defined between the first partition bracket and the second partition bracket, and wherein the second guide members of the first partition bracket and the second partition bracket are configured to engage with the third guide member of the second electronic module among the multiple electronic modules to install the second electronic module to the information processing device.

6. The rack according to claim 1, further comprising a pair of component housings, each component housing being configured to house electronic components of the information processing device, and wherein One of the pair of vertical support members is part of one of the pair of component housings.

7. The rack according to claim 1, wherein: Each partition bracket and / or vertical support member includes a latch element configured to secure a corresponding one of the plurality of electronic modules received in a corresponding one of the plurality of compartments.

8. The rack according to claim 1, wherein: The modular panel section forms part of or is part of a rear panel of the information handling device.

9. The rack according to claim 1, wherein: Each partition bracket has a semi-U-shaped space height, and wherein each compartment formed in the second area allows the electronic module to be electrically connected to the main system board via one or more cables.

10. An information processing device comprising: a rack comprising a base and modular panel sections; a plurality of electronic modules configured to be removably mounted in the rack via the modular panel sections, each electronic module including one or more first electrical connectors; as well as a main system board coupled to the base and comprising one or more second electrical connectors, Wherein, the modular panel section includes: a pair of vertical support members coupled to the base and defining an opening therebetween; a horizontal support structure extending between and coupled to the pair of vertical support members to divide the opening into a first area and a second area; One or more partition brackets; and a plurality of bracket mounting locations in the first area and / or the second area, wherein each of the bracket mounting locations comprises one or more mounting elements configured to connect the corresponding partition bracket to the base and / or the horizontal support structure when one of the partition brackets is positioned at the corresponding bracket mounting location, wherein the partition bracket is disposed at a corresponding bracket mounting position among the plurality of bracket mounting positions and is removably coupled to the base and / or the horizontal support structure and divides the first area and / or the second area into a plurality of compartments, and wherein each of the plurality of compartments located in one of the first area or the second area is aligned to the one or more second electrical connectors and is configured to receive a corresponding electronic module of the plurality of electronic modules and allow the one or more first electrical connectors to be electrically connected to the corresponding one or more second electrical connectors. The information processing apparatus according to claim 10 , wherein: At least one of the respective sizes of the compartments, the respective positions of the compartments, or the number of compartments among the plurality of compartments can be reconfigured by: placing an additional partition bracket at one of the plurality of bracket mounting locations or removing one of the partition brackets; or The bracket installation position in which the one or more partition brackets are installed among the plurality of bracket installation positions is changed.

12. The information processing apparatus according to claim 10, wherein: Each vertical support member of the pair of vertical support members includes a first guide member, wherein each partition bracket includes a second guide member, wherein the first guide member and the second guide member are configured to engage with the third guide member of the corresponding electronic module when the multiple electronic modules are inserted into the multiple compartments to install the multiple electronic modules to the information processing device.

13. The information processing apparatus according to claim 12, wherein: A first compartment among the multiple compartments is defined between a first vertical support member and a first partition bracket, and wherein the first guide member of the first vertical support member and the second guide member of the first partition bracket are configured to engage with the third guide member of the first electronic module among the multiple electronic modules to mount the first electronic module to the information processing device. The information processing apparatus according to claim 13 , wherein: A second compartment among the multiple compartments is defined between the first partition bracket and the second partition bracket, and wherein the second guide members of the first partition bracket and the second partition bracket are configured to engage with the third guide member of the second electronic module among the multiple electronic modules to install the second electronic module to the information processing device.

15. The information processing apparatus according to claim 10, wherein: The rack further includes a pair of component housings configured to removably receive electronic components, and wherein each vertical support member of the pair of vertical support members is part of a corresponding component housing.

16. The information processing apparatus according to claim 10, wherein: Each partition bracket and / or vertical support member includes a latch element configured to secure a corresponding electronic module received in a corresponding compartment of the plurality of compartments.

17. The information processing apparatus according to claim 10, wherein: The modular panel section forms part of or is part of a rear panel of the information handling device.

18. The information processing apparatus according to claim 10, wherein: Each partition bracket has a semi-U-shaped space height, and wherein each compartment formed in the second area allows the corresponding electronic module to be electrically connected to the main system board via one or more cables.

19. A method for configuring a rack of information processing equipment using modular panel sections, the method comprising: coupling a pair of vertical support members of the modular panel section to a base of the frame to define an opening between the pair of vertical support members; coupling a horizontal support structure of the modular panel section to the pair of vertical support members to divide the opening into a first area and a second area, wherein the first area and / or the second area includes a plurality of bracket mounting locations, each bracket mounting location including one or more mounting elements; positioning partition brackets of the modular panel section at respective bracket mounting locations among the plurality of bracket mounting locations; and removably coupling the partition bracket to the base and / or the horizontal support structure using the one or more mounting elements to divide the first area and / or the second area into a plurality of compartments of the rack, Each of the plurality of compartments is configured to receive an electronic module from among the plurality of electronic modules, and is configured to removably mount the electronic module to the chassis and electrically connect the electronic module to a main system board of the information processing device.

20. The method according to claim 19, wherein At least one of the respective sizes of the compartments, the respective positions of the compartments, or the number of compartments among the plurality of compartments can be reconfigured by: placing an additional partition bracket at one of the plurality of bracket mounting locations or removing one of the partition brackets; or The bracket installation position where the partition bracket is installed among the plurality of bracket installation positions is changed.

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