Air volume self-adaptive adjusting device based on memory alloy and case system and method of air volume self-adaptive adjusting device
By using an adaptive air volume adjustment device based on shape memory alloy, the size of the air outlet is dynamically adjusted, which solves the problem of uneven air volume distribution inside electronic equipment, realizes efficient adaptive air volume adjustment, and improves the heat dissipation effect.
Patent Information
- Application Number
- CN202511011827.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-22
- Publication Date
- 2025-09-16
AI Technical Summary
Existing technologies are unable to achieve adaptive adjustment of the air volume inside electronic equipment, resulting in uneven air volume distribution and failure to meet efficient heat dissipation requirements.
An adaptive air volume adjustment device based on shape memory alloy is adopted. The opening and closing angle of the adjustment plate is driven by a temperature-sensitive spring, the size of the air outlet is dynamically adjusted, and the adaptive adjustment of the air volume is achieved through the shape change of the memory alloy.
It realizes the adaptive adjustment of the air volume inside the electronic equipment, improves the rationality of air volume distribution, does not require external power, and is easy to operate.
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Figure CN120659300A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of heat dissipation of electronic equipment, and in particular relates to an air volume adaptive adjustment device based on memory alloy, a chassis system and a method thereof. Background Art
[0002] Air volume is a key factor affecting the heat dissipation of electronic equipment. How to efficiently distribute the air volume affects the overall heat dissipation effect of the electronic equipment. Common measures to adjust the air volume include adjusting the fan speed and adjusting the size of the air inlet and outlet of the electronic equipment. Adjusting the fan speed will affect the overall increase or decrease of the air volume of the entire electronic equipment module, and cannot solve the problem of uneven air volume distribution inside the electronic equipment. The measures to adjust the size of the air inlet and outlet of the electronic equipment are usually to design a fixed air inlet and outlet structure, which cannot dynamically adjust the air volume distribution of the internal modules of the electronic equipment. With the development trend of higher and higher requirements for heat dissipation of electronic equipment, how to solve the adaptive adjustment of the air volume inside the electronic equipment is a technical problem that needs to be solved urgently.
[0003] Chinese patent document CN215222759U proposes a modular data center with an air volume adjustment function, which relates to the field of modular data center equipment. The utility model includes a body device, a shockproof device, a detection mechanism, a heat dissipation device, and a monitoring device. The side surfaces of the two automatic doors are connected to the side surfaces of the outer shell, the side surfaces of the two door handles are respectively connected to the side surfaces of the two automatic doors, the lower surface of the shockproof pad is connected to the lower surface of the inner shell, the upper surface of the shockproof pad is connected to the lower surface of the host, the lower surfaces of the two shockproof plates are connected to the upper surface of the shockproof pad, and the side surfaces of the two support plates are connected to the outer surface of the host. The utility model is a modular data center with an air volume adjustment function. The temperature sensor monitors the internal temperature in real time. The staff turns on the air cooler according to the displayed temperature when the temperature is too high, inputs the cold air through the air inlet pipe, and then controls the venturi metering valve through the control key to adjust the air volume. The cold air is then ejected by the nozzle. In summary, the air volume adjustment still cannot achieve the adaptive adjustment function. Summary of the Invention
[0004] The present invention aims to provide a device for adaptively adjusting air volume based on memory alloy and its chassis system and method, so as to solve the problem of adaptively adjusting air volume of modules inside electronic equipment.
[0005] To achieve the purpose of the present invention, on the one hand, the present invention provides an air volume adaptive adjustment device based on a memory alloy, the air volume adjustment device comprising a base plate, an adjustment plate, a first cylindrical pin, an upper connecting plate, an adjustment mechanism, and a second cylindrical pin; the base plate is movably connected to the upper connecting plate via a plurality of adjustment plates, the adjustment plates are connected to the upper connecting plate via corresponding first cylindrical pins, the other end of the adjustment plate is connected to the base plate via corresponding first cylindrical pins, the end of the base plate is connected to the upper connecting plate via the adjustment mechanism, and the plurality of adjustment plates are parallel to each other;
[0006] The adjustment mechanism includes an outer slider, an inner slider, and a spring; the spring is connected to the inner end surfaces of the outer slider and the inner slider respectively, and after connection, the outer slider and the inner slider can slide relative to each other; the inner slider is connected to the base plate through the second cylindrical pin and can rotate around the second cylindrical pin; the outer slider is connected to the upper connecting plate through the first cylindrical pin.
[0007] The spring is made of a shape memory alloy whose shape is dependent on temperature.
[0008] When the ambient temperature is higher than the characteristic temperature corresponding to the existing shape of the spring, the spring stretches, driving the outer slider and the inner slider to slide relative to each other, driving the upper connecting plate to move, adjusting the opening and closing angle of the adjusting plate to increase the opening and closing angle; when the ambient temperature is lower than the characteristic temperature corresponding to the existing shape of the spring, the spring compresses, driving the outer slider and the inner slider to slide relative to each other, driving the upper connecting plate to move, adjusting the opening and closing angle of the adjusting plate to decrease the opening and closing angle.
[0009] Furthermore, the opening and closing angle of the adjustment plate ;in, is the distance between the centers of the rotating shafts of the adjustment plates, is the distance between the center of the rotation axis of the adjustment plate and the base plate connected to the outer slider and the center of the rotation axis of the inner slider and the base plate, is the distance between the center of the rotation axis of the outer slider and the adjustment plate and the center of the rotation axis of the inner slider and the base plate, where The size and temperature of the environment in which the spring is located Positive correlation.
[0010] Furthermore, the ambient temperature .
[0011] Furthermore, the fixing holes of the first cylindrical pins on the base plate and the upper connecting plate are equidistant, and a center line connecting the fixing holes of the first cylindrical pins on the base plate is parallel to a center line connecting the fixing holes of the first cylindrical pins on the upper connecting plate.
[0012] Furthermore, the number of the adjustment plates is set between 5 and 10.
[0013] On the other hand, the present invention also provides a chassis system for implementing the aforementioned air volume adaptive adjustment device based on memory alloy, comprising the following modules:
[0014] The box module is used to load the heating module, the cooling unit module, and the air volume adjustment device module;
[0015] The heating module is arranged inside the box module and is used as a functional computing module and is the main heat source;
[0016] The heat dissipation unit module is arranged on the top of the box module and is used for forced air cooling inside the chassis to provide power for air flow;
[0017] The air volume regulating device module is arranged at the air outlet of the heating module and is used to adjust the size of the module air outlet.
[0018] The fan of the heat dissipation unit module adopts the exhaust type, the bottom of the box module is the air inlet, and the axial fan of the heat dissipation unit module at the top is the air outlet; the width of the air volume regulating device can be adjusted according to the size of the air outlet corresponding to the heating module.
[0019] In addition, the present invention also provides a method for operating a chassis system of an air volume adaptive adjustment device based on a memory alloy, comprising the following steps:
[0020] Step 1: Install the air volume regulating device on the top of the heating module;
[0021] Step 2: The system starts running, and the air volume regulating device adjusts the opening and closing angle of the air outlet according to the initial ambient temperature;
[0022] Step 3: As the air temperature at the air outlet of the heating module continues to increase after the system is running, the air volume regulating device continuously adjusts the opening and closing angle until the state is stable.
[0023] Compared with the existing technology, the significant progress of the present invention is: (1) the present invention is based on a two-way shape memory alloy, which can realize adaptive adjustment of air volume and improve the rationality of module air volume distribution; (2) the present invention does not require external power and is easy to operate.
[0024] In order to more clearly illustrate the functional characteristics and structural parameters of the present invention, further description is given below with reference to the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of this application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:
[0026] Figure 1 It is a front view of the air volume regulating device of the present invention;
[0027] Figure 2 is a cross-sectional view of the air volume regulating device of the present invention;
[0028] Figure 3 is a top view of the air volume regulating device of the present invention;
[0029] Figure 4 is an axonometric view of the chassis system of the present invention;
[0030] Figure 5 is a front view of the chassis system of the present invention;
[0031] Figure 6 is a top view of the chassis system of the present invention;
[0032] Figure 7 It is a side view of the chassis system of the present invention.
[0033] The figures in the figure are marked as: 1. box body; 2. heating module; 3. heat dissipation unit; 4. air volume adjustment device; 41. base plate; 42. adjustment plate; 43. first cylindrical pin; 44. upper connecting plate; 45. outer slider; 46. inner slider; 47. spring; 48. second cylindrical pin. DETAILED DESCRIPTION
[0034] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.
[0035] The invention relates to an air volume adaptive adjustment device based on memory alloy, Figure 1-Figure 3 The air volume adjustment device 4 includes a base plate 41, an adjustment plate 42, a first cylindrical pin 43, an upper connecting plate 44, an adjustment mechanism, and a second cylindrical pin 48; the base plate 41 is movably connected to the upper connecting plate 44 through a plurality of adjustment plates 42, the adjustment plates 42 are connected to the upper connecting plate 44 through corresponding first cylindrical pins 43, the other end of the adjustment plate 42 is connected to the base plate 41 through the corresponding first cylindrical pin 43, and the end of the base plate 41 is connected to the upper connecting plate 44 through the adjustment mechanism, and the plurality of adjustment plates 42 are parallel to each other;
[0036] The adjustment mechanism includes an outer slider 45, an inner slider 46, and a spring 47; the spring 47 is connected to the inner end surfaces of the outer slider 45 and the inner slider 46 respectively, and after connection, the outer slider 45 and the inner slider 46 can slide relative to each other; the inner slider 46 is connected to the base plate 41 through the second cylindrical pin 48 and can rotate around the second cylindrical pin 48; the outer slider 45 is connected to the upper connecting plate 44 through the first cylindrical pin 43.
[0037] The spring 47 is made of a shape memory alloy whose shape is dependent on temperature.
[0038] When the ambient temperature is higher than the characteristic temperature corresponding to the existing shape of the spring 47, the spring 47 stretches, driving the outer slider 45 and the inner slider 46 to slide relative to each other, driving the upper connecting plate 44 to move, and adjusting the opening and closing angle of the adjustment plate 42 to increase the opening and closing angle; when the ambient temperature is lower than the characteristic temperature corresponding to the existing shape of the spring 47, the spring 47 compresses, driving the outer slider 45 and the inner slider 46 to slide relative to each other, driving the upper connecting plate 44 to move, and adjusting the opening and closing angle of the adjustment plate 42 to decrease the opening and closing angle.
[0039] The opening and closing angle of the adjustment plate 42 ;in, is the distance between the centers of the rotating shafts of the adjustment plates 42, is the distance between the center of the rotation axis of the adjustment plate 42 connected to the outer slider 45 and the base plate 41 and the center of the rotation axis of the inner slider 46 and the base plate 41, is the distance between the center of the rotation axis of the outer slider 45 and the adjustment plate 42 and the center of the rotation axis of the inner slider 46 and the base plate 41, where The size and the ambient temperature of the spring 47 Positive correlation.
[0040] The ambient temperature .
[0041] The fixing holes of the first cylindrical pins 43 on the base plate 41 and the upper connecting plate 44 are equidistant, and a center line connecting the fixing holes of the first cylindrical pins 43 on the base plate 41 is parallel to a center line connecting the fixing holes of the first cylindrical pins 43 on the upper connecting plate 44 .
[0042] The number of the adjustment plates 42 is set between 5 and 10.
[0043] The present invention also includes a chassis system for realizing the aforementioned air volume adaptive adjustment device based on memory alloy, Figure 4-Figure 7 , including the following modules:
[0044] The box 1 module is used to load the heating module 2, the cooling unit 3 module, and the air volume adjustment device 4 module;
[0045] The heating module 2 is arranged inside the box 1 module and is used as a functional computing module and is the main heat source;
[0046] The heat dissipation unit 3 module is arranged on the top of the box body 1 module and is used for forced air cooling inside the chassis 1 to provide power for air flow;
[0047] The air volume regulating device 4 module is arranged at the air outlet of the heating module 2 and is used to adjust the size of the air outlet of the module 2.
[0048] The fan of the heat dissipation unit 3 module adopts the exhaust type, the bottom of the box body 1 module is the air inlet, and the axial flow fan of the heat dissipation unit 3 module at the top is the air outlet; the width of the air volume adjustment device 4 can be adjusted according to the size of the air outlet corresponding to the heating module 2.
[0049] In addition, a method for operating a chassis system of a memory alloy-based air volume adaptive adjustment device of the present invention comprises the following steps:
[0050] Step 1: Install the air volume regulating device 4 on the top of the heating module 2;
[0051] Step 2: The system starts running, and the air volume regulating device 4 adjusts the opening and closing angle of the air outlet according to the initial ambient temperature;
[0052] Step 3: As the air temperature at the air outlet of the heating module 2 continues to increase after the system is running, the air volume regulating device 4 continuously adjusts the opening and closing angles until the state is stable.
[0053] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.
[0054] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.
Claims
1. An air volume adaptive adjustment device based on memory alloy, characterized in that: The air volume regulating device (4) comprises a base plate (41), an regulating plate (42), a first cylindrical pin (43), an upper connecting plate (44), an regulating mechanism, and a second cylindrical pin (48); The base plate (41) is movably connected to the upper connecting plate (44) through a plurality of adjusting plates (42), the adjusting plates (42) are connected to the upper connecting plate (44) through corresponding first cylindrical pins (43), the other end of the adjusting plate (42) is connected to the base plate (41) through corresponding first cylindrical pins (43), the end of the base plate (41) is connected to the upper connecting plate (44) through an adjusting mechanism, and the plurality of adjusting plates (42) are parallel to each other; The adjustment mechanism includes an outer slider (45), an inner slider (46), and a spring (47); the spring (47) is respectively connected to the inner end surfaces of the outer slider (45) and the inner slider (46), and after the connection, the outer slider (45) and the inner slider (46) can slide relative to each other; the inner slider (46) is connected to the base plate (41) through the second cylindrical pin (48) and can rotate around the second cylindrical pin (48); the outer slider (45) is connected to the upper connecting plate (44) through the first cylindrical pin (43).
2. The air volume adaptive adjustment device based on memory alloy according to claim 1, characterized in that: The spring (47) is made of a shape memory alloy whose shape is dependent on temperature.
3. The air volume adaptive adjustment device based on memory alloy according to claim 2, characterized in that: When the ambient temperature is higher than the characteristic temperature corresponding to the existing shape of the spring (47), the spring (47) stretches, drives the outer slider (45) and the inner slider (46) to slide relative to each other, drives the upper connecting plate (44) to move, adjusts the opening and closing angle of the adjusting plate (42), and makes the opening and closing angle larger; when the ambient temperature is lower than the characteristic temperature corresponding to the existing shape of the spring (47), the spring (47) compresses, drives the outer slider (45) and the inner slider (46) to slide relative to each other, drives the upper connecting plate (44) to move, adjusts the opening and closing angle of the adjusting plate (42), and makes the opening and closing angle smaller.
4. The air volume adaptive adjustment device based on memory alloy according to claim 1, characterized in that: The opening and closing angle of the adjustment plate (42) ;in, is the distance between the centers of the rotating shafts of the adjustment plates (42), is the distance between the center of the rotation axis of the adjustment plate (42) connected to the outer slider (45) and the base plate (41) and the center of the rotation axis of the inner slider (46) and the base plate (41), is the distance between the center of the rotation axis of the outer slider (45) and the adjustment plate (42) and the center of the rotation axis of the inner slider (46) and the base plate (41), wherein The size of the spring (47) is related to the ambient temperature Positive correlation.
5. The air volume adaptive adjustment device based on memory alloy according to claim 4, characterized in that: The ambient temperature .
6. The air volume adaptive adjustment device based on memory alloy according to claim 1, characterized in that: The fixing holes of the first cylindrical pin (43) on the base plate (41) and the upper connecting plate (44) are equally spaced, and a center line connecting the fixing holes of the first cylindrical pin (43) on the base plate (41) and a center line connecting the fixing holes of the first cylindrical pin (43) on the upper connecting plate (44) are parallel.
7. The air volume adaptive adjustment device based on memory alloy according to claim 1, characterized in that: The number of the adjustment plates (42) is set between 5 and 10.
8. A chassis system for implementing the air volume adaptive adjustment device based on memory alloy according to any one of claims 1 to 7, characterized in that: Includes the following modules: The box (1) module is used to load the heating module (2), the heat dissipation unit (3) module, and the air volume adjustment device (4) module; The heating module (2) is arranged inside the box (1) module and is used as a functional computing module and is the main heat source; The heat dissipation unit (3) module is arranged on the top of the box (1) module and is used for forced air cooling inside the box (1) to provide power for air flow; The air volume regulating device (4) module is arranged at the air outlet of the heating module (2) and is used to regulate the size of the air outlet of the module (2).
9. The chassis system for implementing an air volume adaptive adjustment device based on a memory alloy according to claim 8, characterized in that: The fan of the heat dissipation unit (3) module adopts an exhaust type, the bottom of the box body (1) module is an air inlet, and the axial flow fan of the heat dissipation unit (3) module at the top is an air outlet; the width of the air volume adjustment device (4) can be adjusted according to the size of the air outlet corresponding to the heating module (2).
10. A method for operating a chassis system of a memory alloy-based air volume adaptive adjustment device according to any one of claims 8 to 9, characterized in that: The following steps are involved: Step 1: Install the air volume regulating device (4) on the top of the heating module (2); Step 2: The system starts to operate, and the air volume regulating device (4) adjusts the opening and closing angle of the air outlet according to the initial ambient temperature; Step 3: As the air temperature at the air outlet of the heating module (2) continues to increase after the system is running, the air volume regulating device (4) continuously adjusts the opening and closing angle until the state is stable.
Citation Information
Patent Citations
Modularized data center with air volume adjusting function
CN215222759U