Automatic chip mounter for surface-mounted buzzer

Abstract

The invention belongs to the technical field of manufacturing of special equipment for the electronic industry, and particularly relates to an automatic chip mounter for a surface-mounted buzzer, which comprises a machine table, a working table is arranged at the upper end of the machine table, a three-axis industrial manipulator is arranged on the working table, a chip mounting head is arranged on the three-axis industrial manipulator, and a transfer mechanism is arranged below the three-axis industrial manipulator. A material storage cup is arranged in front of the transfer mechanism, the material storage cup is connected with a material carrying block in a sliding mode, an air cylinder used for driving the material carrying block is fixedly installed on the workbench, the transfer mechanism comprises a fixing column, the fixing column is fixedly installed on the workbench, and a transfer disc is rotatably installed on the fixing column. According to the device, a worker can place the next group of dies in the group of material placing frames at the material placing point position and take down the dies after surface mounting processing from the corresponding material placing frames, so that surface mounting and material taking and placing are carried out at the same time, the material taking and placing time is saved, and the surface mounting processing efficiency of the surface mounting type buzzer is improved.

Claims

1. A chip-type buzzer automatic placement machine, comprising a machine (1), characterized in that: A workbench (2) is provided at the upper end of the machine (1), a three-axis industrial robot (3) is provided on the workbench (2), a patch head (4) is provided on the three-axis industrial robot (3), a transfer mechanism (8) is provided below the three-axis industrial robot (3), a material storage cup (5) is provided in front of the transfer mechanism (8), the material storage cup (5) is slidably connected to a material moving block (6), and a cylinder (7) for driving the material moving block (6) is fixedly installed on the workbench (2); The transfer mechanism (8) comprises a fixed column (801), and the fixed column (801) is fixedly mounted on the workbench (2); Rotating the transfer plate (802) mounted on the fixed column (801); A limiting ring (803) sleeved on the transfer plate (802); A material placing rack (804) for placing the mold is installed at an equal angle on the transfer plate (802); a gear ring (805), the gear ring (805) being rotatably sleeved on the lower end of the fixed column (801); Three sets of angle brackets (806) are mounted on the gear ring (805) at equal angles, and the upper ends of the angle brackets (806) are fixedly connected to the transfer plate (802); A first gear (807) meshing with the gear ring (805) is fixedly mounted on one side of the machine (1) and is used to drive a motor (808) for the first gear (807).

2. The automatic chip placement machine for a chip-type buzzer according to claim 1, characterized in that: The material storage cup (5) is fixedly mounted on the workbench (2); a loading slot (61) for placing patches is provided on the material moving block (6); the first gear (807) is rotatably mounted on the workbench (2); and the limiting ring (803) is fixedly connected to the workbench (2).

3. The automatic chip placement machine for a chip-type buzzer according to claim 2, characterized in that: The unloading rack (804) includes a profile rack (8041), and the profile rack (8041) is fixedly mounted on the transfer tray (802); Two sets of first correction plates (8042) and one set of second correction plates (8043) are movably mounted in the inner ring of the molded frame (8041); Two sets of linkage plates (8044) are symmetrically and movably mounted in the molded frame (8041), with two sets of linkage plates (8044) at both ends of the second correction plate (8043); an L-shaped plate (8045) fixedly mounted on the second correction plate (8043); The bottom of the mold frame (8041) is provided with a bracket (8046) for supporting the mold; A first U-shaped elastic bar (4067) is provided at one end of the first correction plate (8042).

4. The automatic chip placement machine for chip-type buzzers according to claim 3, characterized in that: Two groups of first guide holes (411) and one group of second guide holes (412) are provided in the inner ring of the mold frame (8041); the first correction plate (8042) is slidably connected to the first guide holes (411); and the second correction plate (8043) is slidably connected to the second guide holes (412).

5. The automatic chip placement machine for chip-type buzzers according to claim 4, characterized in that: Two groups of oblique grooves (441) are provided on the linkage plate (8044), and two groups of pins (421) are provided on the first correction plate (8042), wherein the pins (421) are located in the oblique grooves (441).

6. The automatic chip placement machine for chip-type buzzers according to claim 5, characterized in that: A first roller (451) is rotatably mounted on the end of the L-shaped plate (8045), an arc-shaped guide bar (8011) is fixedly mounted on the fixed column (801), and an inclined surface (8012) for pushing the first roller (451) is provided at the end of the arc-shaped guide bar (8011).

7. The automatic chip placement machine for chip-type buzzers according to claim 6, characterized in that: The bracket (8046) includes three groups of supporting plates (461), and the three groups of supporting plates (461) are hinged on the lower end surface of the profile frame (8041); a second gear (462) fixedly mounted on the end of the support plate (461); a rack (463) meshing with the second gear (462), wherein the three sets of racks (463) are all fixedly mounted on a movable frame (464); Two groups of second U-shaped elastic bars (465) are symmetrically distributed on both sides of the movable frame (464).

8. The automatic chip placement machine for chip-type buzzers according to claim 7, characterized in that: A second roller (64) is rotatably mounted on the movable frame (464), and a protrusion (8013) for pushing the second roller (64) is also provided on the fixed column (801).

9. The automatic chip placement machine for chip-type buzzers according to claim 8, characterized in that: Two groups of guide grooves (41) are symmetrically provided on the movable frame (464), the guide grooves (41) are slidably connected to guide rails (42), and the guide rails (42) are fixedly connected to the lower end surface of the movable frame (464).

10. The automatic chip placement machine for chip-type buzzers according to claim 9, characterized in that: The second roller (64) is rollingly connected to the outer ring of the fixed column (801), and a conveyor belt mechanism (9) for conveying the mold is provided below a group of the brackets (8046).

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