Laminate and electromagnetic wave shielding film

Abstract

Provided is a laminate which has sufficiently high peelability of an adhesive layer and is low in manufacturing cost. This laminate is characterized by being provided with: a protective layer having a first main surface that is not subjected to a mold release treatment; and an adhesive layer that contains an adhesive component and a filler and is laminated so as to be in contact with the first main surface, the bulk density of the filler being 7-23 mL / g, and the adhesive layer containing 2-75 parts by weight of the filler when the weight of the adhesive component contained in the adhesive layer is taken as 100 parts by weight.

Description

Technical Field

[0001] The present invention relates to a laminate and an electromagnetic wave shielding film. Background Art

[0002] Flexible printed circuit boards (FPCs) are widely used in electronic devices such as mobile phones, camcorders, and laptop computers, which are rapidly becoming smaller and more advanced. These boards are used to integrate circuits into complex mechanisms. Furthermore, leveraging their excellent flexibility, they are also used to connect movable parts like printer heads with control units.

[0003] In such electronic devices, a bonding film including an adhesive layer for bonding components together is used.

[0004] Typically, a bonding film is produced by laminating an adhesive layer on a protective layer (separator) to form a laminate. The protective layer serves as a base for forming the adhesive layer and functions as a layer for protecting the adhesive layer during transportation after the laminate is produced.

[0005] Such a laminate is finally used by peeling the adhesive layer from the protective layer.

[0006] When the adhesive layer is peeled from the protective layer, there is a possibility that the adhesive layer may adhere to a portion of the protective layer, causing a double peel between the adhesive layer and the protective layer, preventing normal peeling, or the adhesive layer may be damaged during forced peeling.

[0007] In order to eliminate such a problem and improve the releasability of the adhesive layer, a release treatment may be applied to the surface of the protective layer on which the adhesive layer is laminated.

[0008] As a method for producing a laminate in which a protective layer (substrate) has been subjected to a release treatment, Patent Document 1 discloses a method for producing an active energy ray-curable adhesive film or sheet in which a release-treated substrate, an active energy ray-curable adhesive layer, and a release-treated substrate are sequentially formed.

[0009] Prior art literature

[0010] Patent Literature

[0011] Patent Document 1: Japanese Patent Application Laid-Open No. 2020-097660 Summary of the Invention

[0012] Problems to be solved by the invention

[0013] As disclosed in Patent Document 1, if a protective layer (base material) is subjected to a release treatment, the releasability is improved, but there is a problem that the release treatment is costly.

[0014] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a laminate having a sufficiently high releasability of an adhesive layer and low production cost.

[0015] Solutions for solving problems

[0016] The present inventors have discovered that by incorporating a predetermined amount of a filler having predetermined parameters into an adhesive layer, the adhesiveness of the adhesive layer is appropriately reduced, thereby improving the releasability, and have completed the present invention.

[0017] That is, the laminate of the present invention is characterized in that it comprises: a protective layer having a first main surface that has not been subjected to a demolding treatment; and an adhesive layer comprising an adhesive component and a filler and laminated in contact with the above-mentioned first main surface, wherein the bulk density of the above-mentioned filler is 7 to 23 mL / g, and when the weight of the above-mentioned adhesive component contained in the above-mentioned adhesive layer is set to 100 parts by weight, the above-mentioned adhesive layer contains 2 to 75 parts by weight of the above-mentioned filler.

[0018] In the laminate of the present invention, the adhesive layer contains a filler. If the adhesive layer contains a filler, the strength of the adhesive layer is enhanced and the adhesive layer becomes less susceptible to damage.

[0019] In addition, a portion of the filler is located on the surface of the adhesive layer. The adhesiveness of the adhesive layer depends on the adhesive component contained in the adhesive layer. If a portion of the filler is located on the surface of the adhesive layer, the area of ​​the adhesive component constituting the surface of the adhesive layer becomes smaller. Therefore, the adhesiveness of the adhesive layer becomes moderately lower, and the adhesive layer and the protective layer become easier to peel off.

[0020] The laminate of the present invention contains a filler, and the bulk density of the filler is 7 to 23 mL / g.

[0021] When the bulk density of the filler is within the above range, the filler has an appropriate size, and a portion of the filler is easily located on the surface of the adhesive layer.

[0022] If the bulk density of the filler is less than 7 mL / g, part of the filler is less likely to be located on the surface of the adhesive layer, the adhesiveness of the adhesive layer cannot be sufficiently reduced, and the adhesive layer becomes less likely to be peeled from the protective layer.

[0023] If the bulk density of the filler exceeds 23 mL / g, part of the filler is likely to be located on the surface of the adhesive layer, and the adhesiveness of the adhesive layer is excessively reduced, making it easy for the filler to fall off from the protective layer.

[0024] In addition, in this specification, "bulk density of a filler" means the method measured by the following method.

[0025] First, prepare 5g of filler material. Next, inject the prepared filler material into the graduated cylinder without applying compaction stress. Next, carefully level the top surface of the filler layer injected into the graduated cylinder without compacting it, and read the sparse fill volume. Divide this sparse fill volume by 5g to obtain the value of the "filler bulk density."

[0026] In the laminate of the present invention, the adhesive layer contains 2 to 75 parts by weight of the filler, based on 100 parts by weight of the adhesive component contained in the adhesive layer.

[0027] When the content of the filler is within the above range, the content of the filler is appropriate, and the filler is easily located on a portion of the surface of the adhesive layer.

[0028] If the filler content is less than 2 parts by weight, part of the filler is less likely to be located on the surface of the adhesive layer, the adhesiveness of the adhesive layer is not sufficiently reduced, and the adhesive layer is less likely to be peeled from the protective layer.

[0029] If the content of the filler exceeds 75 parts by weight, the ratio of the adhesive component decreases, making it difficult to form an adhesive layer.

[0030] In the laminate of the present invention, the first main surface of the protective layer is not subjected to a release treatment. If an adhesive layer is laminated on the first main surface of such a protective layer, the adhesive layer becomes difficult to peel off.

[0031] However, in the laminate of the present invention, the adhesive layer contains the filler described above, and therefore the releasability of the adhesive layer is sufficiently improved.

[0032] Furthermore, since the first main surface of the protective layer is not subjected to a mold release treatment, the production cost of the laminate is reduced.

[0033] In the laminate of the present invention, the adhesive layer may further contain a conductive filler, and the adhesive layer may have conductivity.

[0034] The adhesive layer of such a laminate is useful for electrically connecting electronic components to each other.

[0035] In the laminate of the present invention, the particle size (D 50 ) is preferably 0.014 to 20 μm.

[0036] Filler particle size (D 50 If the thickness is less than 0.014 μm, the filler becomes smaller, so that a part of the adhesive layer becomes less likely to be located on the surface, the adhesiveness of the adhesive layer is not sufficiently reduced, and the adhesive layer becomes less likely to be peeled from the protective layer.

[0037] Filler particle size (D50 If the thickness exceeds 20 μm, part of the filler is likely to be located on the surface of the adhesive layer, and the adhesiveness of the adhesive layer is excessively reduced, so that the adhesive layer is likely to fall off from the protective layer.

[0038] It should be noted that in this specification, the particle size of the filler (D 50 ) can be measured by a laser diffraction particle size distribution measuring device.

[0039] In addition, the average diameter (D 50 ) is measured in the same way.

[0040] In the laminated body of the present invention, the filler particles may have insulating properties.

[0041] Furthermore, the filler particles are preferably at least one selected from the group consisting of silica, talc, mica, and organic fillers.

[0042] Filler particles made of these materials are suitable for achieving an effect of improving the releasability of the adhesive layer.

[0043] Furthermore, these materials are low in cost, and therefore, the production cost of the laminate can be reduced.

[0044] The laminate of the present invention can be used as a bonding film.

[0045] In the laminate of the present invention, the adhesive layer can be easily peeled from the protective layer, and therefore, the laminate can be suitably used as a bonding film.

[0046] The electromagnetic shielding film of the present invention comprises: the laminate of the present invention; and a shielding layer formed on the surface of the adhesive layer of the laminate not in contact with the protective layer.

[0047] Since the electromagnetic shielding film of the present invention includes the laminate of the present invention, the adhesive layer can be easily peeled from the protective layer.

[0048] Furthermore, since the first main surface of the protective layer is not subjected to a release treatment, the production cost of the electromagnetic shielding film is reduced.

[0049] Effects of the Invention

[0050] According to the present invention, it is possible to provide a laminate having a sufficiently high releasability of an adhesive layer and low production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 It is a cross-sectional view schematically showing an example of the laminated body according to the first embodiment of the present invention.

[0052] Figure 2 It is a cross-sectional view schematically showing an example of the electromagnetic shielding film according to the second embodiment of the present invention. DETAILED DESCRIPTION

[0053] Hereinafter, the laminate and electromagnetic shielding film of the present invention will be described in detail. However, the present invention is not limited to the following embodiments, and can be applied with appropriate modifications within the scope of the present invention.

[0054] (First embodiment)

[0055] First, a laminated body according to a first embodiment of the present invention will be described with reference to the drawings.

[0056] Figure 1 It is a cross-sectional view schematically showing an example of the laminated body according to the first embodiment of the present invention.

[0057] like Figure 1 As shown, the laminate 10 includes a protective layer 20 having a first main surface 21 that has not been subjected to a release treatment, and an adhesive layer 30 that contains an adhesive component 31 and a filler 32 and is laminated so as to be in contact with the first main surface 21 .

[0058] As will be described later, the filler 32 has a predetermined bulk density and is contained in a predetermined amount in the adhesive layer 30 .

[0059] When the adhesive layer 30 includes the filler 32 , the adhesive layer 30 becomes stronger and less likely to be damaged.

[0060] In addition, if Figure 1 As shown, in the adhesive layer 30 , a portion of the filler 32 is located on the surface of the adhesive layer 30 .

[0061] Here, the adhesiveness of the adhesive layer 30 depends on the adhesive component 31 contained in the adhesive layer 30. If part of the filler 32 is located on the surface of the adhesive layer 30, the area of ​​the adhesive component 31 constituting the surface of the adhesive layer 30 is reduced. As a result, the adhesiveness of the adhesive layer 30 is moderately reduced, and the adhesive layer 30 and the protective layer 20 are easily peeled off.

[0062] In the laminate 10 , the bulk density of the filler 32 is 7 to 23 mL / g. The bulk density of the filler 32 is preferably 7.4 to 22 mL / g, and more preferably 12 to 22 mL / g.

[0063] When the bulk density of the filler 32 is within the above range, the filler 32 has an appropriate size, and a portion of the filler 32 is easily located on the surface of the adhesive layer 30 .

[0064] If the bulk density of the filler is less than 7 mL / g, part of the filler is less likely to be located on the surface of the adhesive layer, the adhesiveness of the adhesive layer is insufficiently reduced, and the adhesive layer is less likely to be peeled from the protective layer.

[0065] If the bulk density of the filler exceeds 23 mL / g, part of the filler is likely to be located on the surface of the adhesive layer, and the adhesiveness of the adhesive layer is excessively reduced, making it easy for the filler to fall off from the protective layer.

[0066] In the laminate 10, the adhesive layer 30 contains 2 to 75 parts by weight of the filler 32, based on 100 parts by weight of the adhesive component 31 contained in the adhesive layer 30. The content of the filler 32 is preferably 5 to 50 parts by weight, more preferably 10 to 50 parts by weight.

[0067] When the content of the filler 32 is within the above range, the content of the filler 32 is appropriate, and a portion of the filler 32 is easily located on the surface of the adhesive layer 30 .

[0068] If the content of the filler is less than 2 parts by weight, part of the filler is less likely to be located on the surface of the adhesive layer, the adhesiveness of the adhesive layer is insufficiently reduced, and the adhesive layer becomes less likely to be peeled from the protective layer.

[0069] If the content of the filler exceeds 75 parts by weight, the ratio of the adhesive component decreases, making it difficult to form an adhesive layer.

[0070] In the laminate 10, the first main surface 21 of the protective layer 20 is not subjected to a release treatment. When the adhesive layer 30 is laminated on the first main surface 21 of the protective layer 20, the adhesive layer 30 becomes difficult to peel off.

[0071] However, in the laminated body 10 , since the adhesive layer 30 contains the filler 32 , the releasability of the adhesive layer 30 is sufficiently improved.

[0072] Hereinafter, each structure of the laminated body of the present invention will be described in detail.

[0073] (Protective layer)

[0074] In the laminate of the present invention, the material constituting the protective layer is not particularly limited as long as it serves as a base when forming the adhesive layer and can protect the adhesive layer. For example, thermoplastic resin compositions such as styrene resin compositions, vinyl acetate resin compositions, polyester resin compositions, polyethylene resin compositions, polypropylene resin compositions, imide resin compositions, amide resin compositions, and acrylic resin compositions, as well as resins such as phenolic resin compositions, epoxy resin compositions, polyurethane resin compositions, melamine resin compositions, and alkyd resin compositions can be used.

[0075] The thickness of the protective layer is not particularly limited, but is preferably 5 to 60 μm, more preferably 10 to 50 μm.

[0076] When the thickness of the protective layer is within the above range, handling becomes easy.

[0077] If the thickness of the protective layer is less than 5 μm, the strength of the protective layer is weakened, making it difficult to protect the adhesive layer.

[0078] If the thickness of the protective layer exceeds 60 μm, the protective layer becomes excessively thick and becomes difficult to handle.

[0079] In the laminate of the present invention, the protective layer may further contain additives such as carbon black, silica, and organic fillers.

[0080] (Adhesive layer)

[0081] In the laminate of the present invention, the thickness of the adhesive layer is preferably 5 to 40 μm, more preferably 8 to 30 μm.

[0082] If the thickness of the adhesive layer is less than 5 μm, the strength of the adhesive layer will be low, and the adhesive layer will be easily damaged when being peeled from the protective layer.

[0083] If the thickness of the adhesive layer exceeds 40 μm, the adhesive layer becomes excessively thick and becomes difficult to handle. In addition, the flexibility of the adhesive layer decreases.

[0084] In the laminate of the present invention, the surface roughness (Ra) of the surface of the adhesive layer in contact with the protective layer is preferably 0.62 to 1.95 μm, more preferably 0.7 to 1.7 μm.

[0085] When the surface roughness (Ra) of the surface of the adhesive layer in contact with the protective layer is within the above range, the adhesion between the protective layer and the adhesive layer is moderate, and the protective layer and the adhesive layer are easily peeled off.

[0086] The surface roughness (Ra) of the surface of the adhesive layer in contact with the protective layer can be measured by peeling the protective layer from the laminate to expose the surface of the adhesive layer in contact with the protective layer.

[0087] The surface roughness (Ra) of the surface of the adhesive layer in contact with the protective layer is a value measured using a confocal microscope (OPTELICS HYBRID manufactured by Lasertec Corporation) at a magnification of 50.

[0088] In the laminate of the present invention, examples of the adhesive component contained in the adhesive layer include thermoplastic resin compositions such as styrene resin compositions, vinyl acetate resin compositions, polyester resin compositions, polyethylene resin compositions, polypropylene resin compositions, imide resin compositions, amide resin compositions, and acrylic resin compositions; and thermosetting resin compositions such as phenolic resin compositions, epoxy resin compositions, polyurethane resin compositions, melamine resin compositions, and alkyd resin compositions.

[0089] Although the details will be described later, in the laminate of the present invention, the adhesive layer may contain a conductive filler and the adhesive layer may have conductivity.

[0090] In this case, the relative dielectric constant of the adhesive component at a frequency of 1 GHz and 23° C. is preferably 1 to 5, more preferably 2 to 4.

[0091] Furthermore, the dielectric loss tangent of the adhesive component at a frequency of 1 GHz and 23° C. is preferably 0.0001 to 0.03, and more preferably 0.001 to 0.002.

[0092] Within such a range, when the laminate of the present invention is used as a bonding film for electrically connecting electronic components, the transmission characteristics can be improved.

[0093] In the laminate of the present invention, the shape of the filler contained in the adhesive layer is not particularly limited, and can be appropriately selected from spherical, flat, flaky, dendritic, rod-like, fibrous, and the like.

[0094] In the laminate of the present invention, the particle size of the filler (D 50 ) is preferably 0.014 to 20 μm, more preferably 1 to 9 μm, and further preferably 2 to 9 μm.

[0095] Filler particle size (D 50 If the thickness is less than 0.014 μm, the filler becomes smaller, and therefore, part of the filler becomes less likely to be located on the surface of the adhesive layer, the adhesiveness of the adhesive layer is insufficiently reduced, and the adhesive layer becomes less likely to be peeled from the protective layer.

[0096] Filler particle size (D 50 If the thickness exceeds 20 μm, part of the filler is likely to be located on the surface of the adhesive layer, and the adhesiveness of the adhesive layer is excessively reduced, so that the filler is likely to fall off from the protective layer.

[0097] In the laminated body of the present invention, the filler may have insulating properties.

[0098] The filler is preferably at least one selected from the group consisting of silica, talc, mica, and organic fillers. Among these, silica is preferred.

[0099] When the filler is formed of these materials, the effect of improving the releasability of the adhesive layer can be preferably obtained.

[0100] Furthermore, these materials are low in cost, and therefore, the production cost of the laminate can be reduced.

[0101] In the laminate of the present invention, the adhesive layer further contains a conductive filler, and the adhesive layer may have conductivity.

[0102] The adhesive layer of such a laminate is useful for electrically connecting electronic components to each other.

[0103] The conductive filler is not particularly limited, and may be metal particles, carbon nanotubes, carbon fibers, metal fibers, or the like.

[0104] Among these, metal particles are preferred.

[0105] The metal particles are not particularly limited and may be silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder obtained by silver-plating copper powder, polymer fine particles, or particles obtained by coating glass beads with metal.

[0106] Among these, from the viewpoint of economic efficiency, copper powder or silver-coated copper powder that can be obtained at low cost is preferred.

[0107] The shape of the conductive filler is not particularly limited, and may be appropriately selected from spherical, flat, flaky, dendritic, rod-like, fibrous, and the like.

[0108] When the adhesive layer contains a conductive filler, the adhesive layer preferably contains 1 to 100 parts by weight of the conductive filler, more preferably 5 to 70 parts by weight, and even more preferably 20 to 40 parts by weight, based on 100 parts by weight of the adhesive component.

[0109] If the content of the conductive filler is less than 1 part by weight, the amount of the conductive filler that imparts conductivity to the adhesive layer decreases, and thus the conductivity of the entire adhesive layer decreases.

[0110] If the content of the conductive filler exceeds 100 parts by weight, the proportion of the adhesive component decreases, thereby reducing the flexibility and adhesion strength of the adhesive layer.

[0111] Particle size of conductive filler (D 50 ) is preferably 9 to 30 μm, more preferably 12 to 20 μm.

[0112] Particle size of conductive filler (D 50 ) If the thickness is less than 9 μm, the conductive filler is likely to be displaced, and the connection reliability is likely to be reduced.

[0113] Particle size of conductive filler (D 50 ) If it exceeds 30 μm, the adhesive layer becomes excessively thick.

[0114] When the adhesive layer contains a conductive filler and has conductivity, the adhesive layer may have isotropic conductivity or anisotropic conductivity.

[0115] Whether the adhesive layer has isotropic conductivity or anisotropic conductivity can be adjusted by adjusting the content and size of the conductive filler.

[0116] The adhesive layer may contain a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, a defoaming agent, a leveling agent, a filler, a flame retardant, a viscosity modifier, an anti-blocking agent, and the like as needed.

[0117] The laminate of the present invention can be used as a bonding film.

[0118] In the laminate of the present invention, the adhesive layer can be easily peeled from the protective layer, and therefore, the laminate can be suitably used as a bonding film.

[0119] (Second embodiment)

[0120] Next, an electromagnetic shielding film according to a second embodiment of the present invention will be described with reference to the drawings.

[0121] Figure 2 It is a cross-sectional view schematically showing an example of the electromagnetic shielding film according to the second embodiment of the present invention.

[0122] Figure 2 The electromagnetic shielding film 11 shown is characterized by comprising: the laminate 10 according to the first embodiment of the present invention; and a shielding layer 40 formed on the surface of the adhesive layer 30 on the side of the laminate 10 not in contact with the protective layer 20 .

[0123] Since the electromagnetic shielding film 11 includes the laminate 10, the adhesive layer 30 can be easily peeled off from the protective layer 20. Therefore, the electromagnetic shielding film 11 can be easily handled.

[0124] Furthermore, since the first main surface 21 of the protective layer 20 is not subjected to a mold release process, the manufacturing cost of the electromagnetic shielding film 11 is reduced.

[0125] In addition, when using the electromagnetic wave shielding film 11 , the protective layer 20 is peeled off and the film is attached so that the adhesive layer 30 comes into contact with an adherend such as a printed circuit board.

[0126] Since the electromagnetic wave shielding film 11 includes the shielding layer 40 , it is possible to protect an adherend from electromagnetic waves.

[0127] In the electromagnetic shielding film 11 , the preferred configuration and the like of the laminate 10 are the same as those of the laminate according to the first embodiment of the present invention, and therefore, description thereof will be omitted here.

[0128] In the electromagnetic wave shielding film 11 , the material of the shielding layer 40 is not particularly limited as long as it has a function of shielding electromagnetic waves.

[0129] For example, the shielding layer 40 may be formed of a metal layer, a conductive adhesive layer, or the like.

[0130] When the shield layer 40 is formed of a metal layer, the metal layer is preferably formed of gold, silver, copper, aluminum, nickel, tin, palladium, chromium, titanium, zinc, etc. Among these, copper is more preferred.

[0131] Alternatively, the metal layer may be formed of an alloy thereof.

[0132] Such a metal layer can be formed by sputtering, chemical plating, electrolytic plating or the like, or can be formed by rolling a metal.

[0133] The thickness of the shielding layer 40 is preferably 0.01 to 10 μm.

[0134] When the thickness of the shielding layer is less than 0.01 μm, it is difficult to obtain a sufficient shielding effect.

[0135] If the thickness of the shielding layer exceeds 10 μm, the flexibility will be reduced.

[0136] In the electromagnetic shielding film of the present invention, an insulating protective layer may be further formed on the surface of the shielding layer opposite to the adhesive layer.

[0137] If the insulating protective layer is formed, the shielding layer can be protected.

[0138] The insulating protective layer is not particularly limited, but is preferably composed of a thermoplastic resin composition, a thermosetting resin composition, an active energy ray-curable composition, or the like.

[0139] The thermoplastic resin composition is not particularly limited, and examples thereof include styrene resin compositions, vinyl acetate resin compositions, polyester resin compositions, polyethylene resin compositions, polypropylene resin compositions, imide resin compositions, and acrylic resin compositions.

[0140] The thermosetting resin composition is not particularly limited, and examples thereof include at least one resin composition selected from the group consisting of epoxy resin compositions, polyurethane resin compositions, polyurethane urea resin compositions, styrene resin compositions, phenolic resin compositions, melamine resin compositions, acrylic resin compositions, and alkyd resin compositions.

[0141] The active energy ray-curable composition is not particularly limited, and examples thereof include polymerizable compounds having at least two (meth)acryloyloxy groups in the molecule.

[0142] The thickness of the insulating protective layer is preferably 1 to 12 μm.

[0143] The insulating protective layer may contain a curing accelerator, a tackifier, an antioxidant, a pigment, a dye, a plasticizer, an ultraviolet absorber, a defoaming agent, a leveling agent, a filler, a flame retardant, a viscosity modifier, an anti-blocking agent, and the like as needed.

[0144] The following matters are described in this manual.

[0145] The present disclosure (1) is a laminate, characterized in that it comprises: a protective layer having a first main surface that has not been subjected to a demolding treatment; and an adhesive layer comprising an adhesive component and a filler material and laminated in a manner contacting the above-mentioned first main surface, wherein the bulk density of the above-mentioned filler material is 7 to 23 mL / g, and when the weight of the above-mentioned adhesive component contained in the above-mentioned adhesive layer is set to 100 parts by weight, the above-mentioned adhesive layer contains 2 to 75 parts by weight of the above-mentioned filler material.

[0146] The present disclosure (2) is the laminated body described in the present disclosure (1), wherein the adhesive layer further contains a conductive filler, and the adhesive layer has conductivity.

[0147] The present disclosure (3) is the laminated body according to the present disclosure (1) or (2), wherein the particle size (D 50 ) is 0.014~20μm.

[0148] The present disclosure (4) is the laminate according to any one of the present disclosures (1) to (3), wherein the filler has insulating properties.

[0149] The present disclosure (5) is the laminate according to any one of the present disclosures (1) to (4), wherein the filler is at least one selected from the group consisting of silica, talc, mica, and organic fillers.

[0150] The present disclosure (6) is the laminate according to any one of the present disclosures (1) to (5), which is used as a bonding film.

[0151] The present disclosure (7) is an electromagnetic wave shielding film characterized by comprising: a laminate according to any one of the present disclosures (1) to (5); and a shielding layer formed on a surface of the adhesive layer on a side of the laminate not in contact with the protective layer. Specific embodiments

[0153] Hereinafter, although the Example which demonstrates this invention more concretely is shown, this invention is not limited to these Examples.

[0154] (Example 1)

[0155] First, a protective layer made of polypropylene resin having a size of 300 mm × 200 mm × 40 μm was prepared.

[0156] It should be noted that the protective layer was not subjected to a release treatment.

[0157] Next, 100 parts by weight of a polyester resin, which is a thermoplastic resin, as a binder component and silica particles (bulk density: 7.0 mL / g, particle size (D 50 ):2.7μm) 10 parts by weight and nickel particles (particle size (D 50 ): 10.6 μm) were mixed to prepare a conductive adhesive composition.

[0158] Next, a conductive adhesive composition was applied to the main surface of the protective layer to form an adhesive layer having a thickness of 20 μm.

[0159] The laminated body of Example 1 was manufactured through the above steps.

[0160] (Example 2) to (Example 9) and (Comparative Example 1) to (Comparative Example 8)

[0161] Laminated bodies of Examples 2 to 9 and Comparative Examples 1 to 8 were produced in the same manner as in Example 1 except that the type and content of the filler were changed as shown in Table 1.

[0162] [Table 1]

[0163]

[0164] (Measurement of Surface Roughness (Ra) of Adhesive Layer Surface in Contact with Protective Layer)

[0165] In the laminates of each Example and Comparative Example, the protective layer was peeled off, and the surface roughness (Ra) of the adhesive layer in contact with the protective layer was measured using a confocal microscope (Optilics Hybrid, manufactured by Lasertec Corporation). The measurement was performed using a 50x objective lens. The results are shown in Table 1.

[0166] (Evaluation of peeling properties: observation of zipping)

[0167] A portion of the adhesive layer at the end portion of the laminate of each Example and each Comparative Example was peeled off with fingers, and then the peeled portion of the adhesive layer was grasped with fingers to peel the adhesive layer and the protective layer.

[0168] Thereafter, the peeled adhesive layer was visually observed to see if any tearing occurred. The results are shown in Table 1.

[0169] In addition, the evaluation criteria are as follows.

[0170] ◎: No tearing occurred.

[0171] ○: Although some tearing occurred, it was not a problem in practical use.

[0172] ×: Tearing occurred, which was problematic in practical use.

[0173] (Peelability Evaluation: Measurement of Peel Force)

[0174] The electromagnetic shielding film was pressed using a press at 170°C for 30 minutes at a pressure of 2-3 MPa. After the electromagnetic shielding film returned to room temperature, the peel strength of the transferred film was measured using a peel strength tester (PFT50S, manufactured by PALMEC Co., Ltd.). The test was performed at room temperature, at a tensile speed of 1000 mm / min, and at a peel angle of 170°. Five measurements were performed, and the maximum value was determined.

[0175] As shown in Table 1, in the laminated body of each Example, tearing did not occur and the peeling force was sufficiently low.

[0176] In addition, when the bulk density of the filler is less than 7 mL / g, or when the filler content is less than 2 parts by weight relative to 100 parts by weight of the adhesive component, tearing is determined to have occurred. Furthermore, the peel force is determined to be excessively high. This is believed to be due to excessive adhesion between the protective layer and the adhesive layer.

[0177] On the other hand, when the content of the filler exceeds 75 parts by weight relative to 100 parts by weight of the adhesive component, it is considered that the adhesive strength of the adhesive layer is reduced and a laminate cannot be formed.

[0178] Description of Reference Numerals

[0179] 10 laminate

[0180] 11. Electromagnetic wave shielding film

[0181] 20 protective layer

[0182] 21 Main side 1

[0183] 30 Adhesive layer

[0184] 31 Adhesive components

[0185] 32 Filling material

[0186] 40 shielding layer.

Claims

1. A laminated body, characterized in that: have: a protective layer having a first main surface that is not subjected to a release treatment; and an adhesive layer comprising an adhesive component and a filler and laminated so as to be in contact with the first main surface; The bulk density of the filling material is 7 to 23 mL / g, The adhesive layer contains 2 to 75 parts by weight of the filler, based on 100 parts by weight of the adhesive component contained in the adhesive layer.

2. The laminate according to claim 1, wherein The adhesive layer further includes a conductive filler, and the adhesive layer has conductivity.

3. The laminate according to claim 1 or 2, wherein The particle size of the filler material (D 50 ) is 0.014~20μm.

4. The laminate according to any one of claims 1 to 3, wherein The filling material has insulating properties.

5. The laminate according to any one of claims 1 to 4, wherein The filler is at least one selected from the group consisting of silica, talc, mica, and organic fillers. 6 . The laminate according to claim 1 , which is used as a bonding film.

7. An electromagnetic wave shielding film, characterized in that: have: The laminate according to any one of claims 1 to 5; and The shielding layer is formed on the surface of the adhesive layer on the side of the laminate that is not in contact with the protective layer.

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