Display module and electronic equipment

Abstract

The invention discloses a display module and electronic equipment, and belongs to the field of electronic equipment. The substrate comprises a first area and a second area which are distributed in the first direction and are connected with each other, a plurality of display signal lines are arranged in the first area, and a plurality of connecting lines which are mutually spaced in the first direction are arranged in the second area; any connecting line comprises a plurality of connecting sub-lines which are arranged at intervals in the second direction, one end of one display signal line is connected with one ends of the plurality of connecting sub-lines included in the same connecting line, and the other ends of the plurality of connecting sub-lines included in any connecting line are connected with the display driving part; in a second direction parallel to the thickness direction of the second region, the planarization structure covers the second region, and in the first direction, the first side edges of a plurality of planarization layers which are stacked in the second direction and comprise the planarization structure extend to the sides, away from the first region, of the plurality of connecting lines, and the second side edges of the plurality of planarization layers extend to the second region; the second side edge of any planarization layer extends to the side, close to the first area, of the connecting lines.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to a display module and an electronic device. Background Art

[0002] The display module is an important component of electronic devices such as mobile phones. In order to ensure that the display module can provide display functions normally, the display module usually includes display signal lines, connecting lines and display drivers. Among them, most areas of the display module are provided with display signal lines, and the display signal lines are connected to the display drivers through connecting lines, so that the display drivers transmit the display signals to the display signal lines through the connecting lines, thereby achieving the display purpose.

[0003] In order to achieve the packaging purpose of the display module, the bottom edge of the display module is usually provided with a black border area. This part of the area does not have display capabilities. Based on this, the connecting wires can be set in the black border area of ​​the bottom edge of the display module. However, since the number of display signal lines and connecting wires is relatively large, and in order to ensure that the impedance of the connecting wires is relatively small, each connecting wire usually has a certain width dimension, and multiple connecting wires are arranged in sequence in the width direction of the black border area. In layman's terms, the aforementioned width direction has at least a component of the distribution direction of the relative top and bottom edges of the display module. In this case, in order to accommodate the connecting wires distributed side by side, the size of the black border area at the bottom edge of the display screen in the aforementioned distribution direction is relatively large, which will have an adverse effect on the increase in the display area of ​​the display module. Summary of the Invention

[0004] The purpose of the embodiments of the present application is to provide a display module and an electronic device to solve the problem in current electronic devices that, due to the provision of connecting lines at the bottom edge of the display module, the black border size at the bottom edge of the display module is relatively large, which is not conducive to increasing the display area of ​​the display module.

[0005] In a first aspect, an embodiment of the present application provides a display module, which includes a substrate, display signal lines, connecting lines, a display driver, and a planarization structure, wherein: The substrate includes a first area and a second area distributed along a first direction and connected to each other, the first area is provided with a plurality of the display signal lines, the second area is provided with a plurality of the connection lines, and the plurality of the connection lines are spaced apart from each other in the first direction; Each of the connecting lines includes a plurality of connecting sub-lines spaced apart along a second direction, one end of one of the display signal lines is connected to one ends of the plurality of connecting sub-lines included in the same connecting line, and the other ends of the plurality of connecting sub-lines included in any of the connecting lines are connected to the display driver, and the second direction is parallel to a thickness direction of the second region; In the second direction, the planarization structure is arranged to cover the second area, and the planarization structure includes multiple planarization layers stacked along the second direction. In the first direction, the first side of each of the planarization layers extends to the side of the multiple connecting lines away from the first area, and the second side of each of the planarization layers extends to the side of the multiple connecting lines close to the first area.

[0006] In a second aspect, an embodiment of the present application further provides an electronic device comprising the above-mentioned display module.

[0007] The present application discloses a display module, wherein a first region and a second region of a substrate are distributed and connected along a first direction, a plurality of display signal lines are provided in the first region, and a plurality of connecting lines are provided in the second region, and the plurality of connecting lines are spaced apart from each other in the first direction. Each connecting line includes a plurality of connecting sub-lines spaced apart along the second direction, one end of a display signal line is connected to one end of each of the plurality of connecting sub-lines included in the same connecting line, and the other ends of each of the plurality of connecting sub-lines included in the same connecting line are connected to a display driver, so that when the display driver is in operation, the corresponding display signal line can be driven to provide a display function.

[0008] At the same time, in the display module disclosed in the embodiments of the present application, the multiple connecting sub-lines included in any connecting line are all distributed along the second direction. This can reduce the size of each connecting line in the first direction while ensuring that the overall cross-sectional area of ​​each connecting line remains relatively large, thereby ensuring that the impedance of each connecting line is relatively low, thereby improving the display performance of the display module. In addition, when each connecting line includes multiple connecting sub-lines spaced apart from each other along the second direction, the processing difficulty of each connecting sub-line can be reduced, thereby improving the yield rate of the entire display module.

[0009] As described above, in the display module disclosed in the embodiment of the present application, multiple connecting sub-lines of any connecting line spaced apart from each other along the second direction are all buried in the second area. In this case, since a substrate material layer is provided between any two adjacent connecting sub-lines along the second direction, the thickness of the position where the connecting sub-line is located in the substrate is greater than the thickness of other positions in the substrate. In this case, the top surface of the position where the connecting sub-line is located in the substrate is protruding compared to the top surfaces of other positions.

[0010] Based on the above situation, in order to prevent the poor bonding effect between the CVD Shadow formed by the deposition material of the encapsulation layer in the first area of ​​the substrate and the second area of ​​the substrate during the deposition process, in an embodiment of the present application, the side of the second area facing the display side of the display module is covered with a planarization structure, and in the thickness direction of the second area, the first side edges of the plurality of planarization layers stacked along the second direction included in the planarization structure are extended to the side of the plurality of connecting lines away from the first area, and the second side edges of any planarization layer are extended to the side of the plurality of connecting lines close to the first area, so that each planarization layer can cover the plurality of connecting lines on the second area of ​​the substrate, ensuring that each planarization layer can provide a planarization effect for the second area, so that the upper surface of the one farthest away from the second area in the planarization structure is relatively flat, so that the bonding stability between the CVD Shadow and the planarization structure is relatively high. In addition, by making the planarization structure include a plurality of stacked planarization layers, the processing difficulty of any planarization layer can be reduced, and the planarization effect of the entire planarization structure can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings: Figure 1 is a schematic structural diagram of a display module disclosed in an embodiment of the present application; Figure 2 yes Figure 1 A partial enlarged view of the display module is shown; Figure 3 is a cross-sectional schematic diagram of a structure of a display module disclosed in an embodiment of the present application; Figure 4 It is a cross-sectional schematic diagram of another structure of the display module disclosed in the embodiment of the present application.

[0012] The accompanying drawings are: 10-Display module, 100-substrate, 110-first region, 120-second region, 130-bending region, 210-display signal line, 220-connection line, 221-connection sub-line, 230-metal layer, 300-display driver, 410-planarization layer, 411-stacked region, 412-protruding region, 430-pixel layer, 510 - inorganic encapsulation layer, 511 - first inorganic encapsulation layer, 512 - second inorganic encapsulation layer, 520 - deposition thinning region, 530 - organic encapsulation layer, 540 - first dam, 550 - second dam. DETAILED DESCRIPTION

[0013] The following will be combined with the accompanying drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of this application.

[0014] The terms "first," "second," and the like in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of this application can be implemented in an order other than that illustrated or described herein, and that the objects distinguished by "first," "second," and the like are generally of the same type, and do not limit the number of objects; for example, the first object can be one or more. In addition, the term "and / or" in the specification and claims refers to at least one of the connected objects, and the character " / " generally indicates that the objects connected are in an "or" relationship.

[0015] like Figures 1-4 As shown, the embodiment of the present application discloses a display module 10 and an electronic device. The display module 10 can be applied to an electronic device, and the electronic device can be a mobile phone, a watch, or a tablet computer. Figure 1 As shown, the display module 10 disclosed in the embodiment of the present application includes a substrate 100, a display signal line 210, a connecting line 220, a display driver 300 and a planarization structure. Of course, the display module 10 may also include other structures such as a metal layer 230, a pixel layer 430 and an encapsulation layer, which will not be introduced one by one here.

[0016] Among them, the substrate 100 includes a first area 110 and a second area 120. In layman's terms, the first area 110 corresponds to an area in the display module 10 that can normally provide a display function, and the second area 120 corresponds to a part of the black border area in the display module 10 that cannot provide a display function. In the embodiment of the present application, the first area 110 is connected to the second area 120, and the first area 110 and the second area 120 are distributed along the first direction X. In addition, in the embodiment of the present application, the display driver 300 is located on the side of the second area 120 away from the first area 110.

[0017] It should be noted that during the processing and installation of the display module 10, the display module 10 is not always a flat structure. The display module 10 includes a display area and a black border area surrounding the display area. The bottom edge of the black border area can be connected to a bending area 130 with bending capability, and the other side of the bending area 130 can be provided with a display driver 300. At the same time, during the assembly process of the display module 10, the bending area 130 can usually be bent and deformed, and the display driver 300 can be flipped to the back of the display area, so that only the display area of ​​the display module 10 is exposed outside the frame of the electronic device, and the display driver 300 is surrounded by the display area, the frame and other components. On the one hand, this protects the display driver 300, and on the other hand, it can also reduce the area of ​​the exposed area in the display module 10, thereby improving the screen-to-body ratio of the display module 10.

[0018] Based on the above situation, in the display module 10 disclosed in the embodiment of the present application, the above-mentioned display driver 300 is located on the side of the second area 120 away from the first area 110, which means that when the display module 10 is a flat structure as a whole, the display driver 300, the second area 120 and the first area 110 are distributed along the first direction X as a whole, and the display driver 300 is located on the side of the second area 120 away from the first area 110. Correspondingly, after the display module 10 is installed in the frame of the electronic device, usually, the display driver 300 is located on the back of the first area 110. Among them, in the display module 10 disclosed in the embodiment of the present application, the first direction X can specifically be the length direction or the width direction of the display module 10, or the first direction X has at least a component parallel to the aforementioned length direction. More specifically, the first direction X and the second direction Y mentioned below are perpendicular to each other, and the second direction Y can specifically be the thickness direction of the display module 10. More intuitively, the first direction X and the second direction Y are as follows Figure 3 shown.

[0019] At the same time, the display signal line 210 is installed in the first area 110. In this case, when the display signal line 210 is in the energized state, the display signal line 210 can provide a display function, thereby enabling the first area 110 to be illuminated as a display area. That is, the first area 110 where the display signal line 210 is installed belongs to the display area of ​​the display module 10 disclosed in the embodiment of the present application. Correspondingly, the area in the display module 10 where the display signal line 210 is not installed is a non-display area, which may specifically include a black border area. More specifically, the second area 120, i.e., the black border area, includes a portion located between the first area 110 and the display driver 300, which may be referred to as a bottom black border.

[0020] In order to enable the display signal line 210 to be normally driven by the display driver 300, in the embodiment of the present application, as described above, the display module 10 includes a connecting line 220, and the connecting line 220 is arranged in the second area 120, and as described above, the second area 120 is located between the first area 110 and the display driver 300, so that the display signal line 210 can be connected to the display driver 300 through the connecting line 220.

[0021] More specifically, in the present application, there are multiple display signal lines 210, that is, multiple display signal lines 210 are provided in the first area 110, and correspondingly, multiple connection lines 220 are provided in the second area 120, wherein the multiple display signal lines 210 can correspond one-to-one with the multiple connection lines 220. Furthermore, in the embodiment of the present application, the multiple connection lines 220 are spaced apart from each other in the first direction, ensuring that any two adjacent connection lines 220 are relatively spaced apart. Accordingly, the aforementioned arrangement of the multiple connection lines 220 results in a relatively large overall space occupied by the multiple connection lines 220 in the first direction. As described above, the first direction has at least a component in the length direction or the width direction of the electronic device.

[0022] Due to the above situation, the second area 120 for mounting the connecting wires 220 is relatively large in the first direction, resulting in a relatively large black border at the bottom edge of the display module 10. Taking a typical rectangular display module 10 as an example, its length direction is the relative direction between the top and bottom edges of the display module 10, and its width direction is the relative direction between the left and right edges of the display module 10. Furthermore, in the embodiment of the present application, the first direction has at least a component parallel to the length direction of the display module. In this case, the second area 120 is located at the bottom edge of the first area 110.

[0023] To reduce the size of the second region 120 in the display module 10 in the first direction, the applicant, through creative effort, has provided a technical means in the embodiments of this application that can appropriately reduce the size of any connecting line 220 in the first direction. By adopting this technical solution, the size of a single connecting line 220 in the first direction can be reduced, thereby reducing the overall size of multiple connecting lines 220 in the first direction. This eliminates the need for the size of the second region 120 in the first direction to be excessively large. This achieves the goal of reducing the size of the second region 120 in the first direction, thereby making the size of the bottom black border of the display module 10 relatively smaller in the first direction.

[0024] After implementing the above technical solution, the applicant further discovered through creative work that although the above technical solution solves the problem of excessive black border size at the bottom of the display module to a certain extent, it is affected by the fact that the size of the connecting wire 220 in the first direction is reduced, resulting in an increase in the impedance of the connecting wire 220, which in turn causes the display performance of the display module to deteriorate. Therefore, in a further embodiment of the present application, if Figure 3 As shown, after further creative work, the applicant has provided a technical solution that enables any connecting line 220 to include multiple connecting sub-lines 221.

[0025] Among them, the multiple connecting sub-wires 221 included in each connecting line 220 are all spaced apart along the second direction. As described above, the connecting line 220 is located in the second region 120 of the substrate 100. More specifically, in the process of forming the connecting line 220, etching and deposition are generally used. First, corresponding grooves are formed in the second region 120 of the substrate 100 by etching, and then, metal connecting lines 220 are formed in the aforementioned grooves by deposition. Based on the above situation, in the embodiment of the present application, by making any connecting line 220 include multiple connecting sub-wires 221 spaced apart from each other along the second direction, the size of any connecting sub-wire 221 in the second direction can be reduced, thereby reducing the processing difficulty of the entire connecting line 220.

[0026] Based on the above-mentioned structure of each connecting line 220, during the assembly process of the display module disclosed in the embodiment of the present application, it is necessary to connect one end of a display signal line 210 to one end of multiple connecting sub-lines 221 included in the same connecting line 220. At the same time, the other ends of the multiple connecting sub-lines 221 included in any connecting line 220 are connected to the display driver 300 to ensure that the display driver 300 can be connected to a corresponding display signal line 210 through the multiple connecting sub-lines 221 included in the same connecting line 220, so that the display driver 300 can achieve the purpose of driving the display signal line 210.

[0027] As described above, since each connecting line 220 includes multiple connecting sub-lines 221 spaced apart along the second direction, the thickness and width of each connecting sub-line 221 do not need to be relatively large. This ensures that the sum of the cross-sectional areas of the multiple connecting sub-lines 221 of the same connecting line 220 remains relatively large while also making the formation of each connecting sub-line 221 relatively easy. This can significantly improve the yield rate and further reduce the impedance of each connecting line 220, thereby improving display performance. The thickness of a connecting sub-line 221 is the dimension of the connecting sub-line 221 in the second direction, and the width of a connecting sub-line 221 is the dimension of the connecting sub-line 221 in the first direction.

[0028] Based on the above situation, in the embodiment of the present application, multiple connecting sub-lines 221 that are all connected to the display driver 300 and the same display signal line 210 are essentially still the same connecting line 220. Since the multiple connecting sub-lines 221 serve as the same connecting line 220, the cross-sectional area of ​​the connecting line 220 is relatively large, thereby effectively reducing the impedance of the entire connecting line 220, thereby achieving the purpose of improving the display performance of the display module 10. Accordingly, since the same connecting line 220 includes multiple connecting sub-lines 221 spaced apart along the second direction, the size of each connecting sub-line 221 of the same connecting line 220 in the first direction can be further reduced. In this case, the overall size occupied by the multiple connecting lines 220 in the first direction is relatively smaller, thereby further reducing the size of the entire second area 120 in the first direction, further reducing the size of the bottom black border in the display module 10, and achieving the purpose of improving the display area and screen-to-body ratio of the display module 10.

[0029] As described above, the display module 10 typically also includes an encapsulation layer, which is used to provide encapsulation for the pixel layer 430. The encapsulation layer includes an inorganic encapsulation layer 510 and an organic encapsulation layer 530. The inorganic encapsulation layer 510 is formed of an inorganic material, and the organic encapsulation layer 530 is formed of an organic material. To prevent overflow of the organic encapsulation layer 530, which could lead to encapsulation failure, a dam is typically provided on the outside of the organic encapsulation layer 530 to block the organic encapsulation layer 530, thereby ensuring relatively high encapsulation effectiveness. One side of the dam is the first region 110, and the other side of the dam is the second region 120. Typically, the second region 120 does not need to be provided with either the inorganic encapsulation layer 510 or the organic encapsulation layer 530.

[0030] More specifically, the inorganic encapsulation layer 510 may include a first inorganic encapsulation layer 511 and a second inorganic encapsulation layer 512, both of which are formed of inorganic materials. During the formation process, the first inorganic encapsulation layer 511 is located above the pixel layer 430, the organic encapsulation layer 530 is located on the side of the first inorganic encapsulation layer 511 facing away from the pixel layer 430, and the second inorganic encapsulation layer 512 is located on the side of the organic encapsulation layer 530 facing away from the first inorganic encapsulation layer 511. The dam may include a first dam 540 and a second dam 550, both of which are distributed along the first direction to further enhance the blocking effect and reliability of the organic encapsulation layer 530.

[0031] In detail, the inorganic encapsulation layer 510 is usually formed by a deposition process. Based on this, the applicant further discovered that in the process of depositing the inorganic encapsulation layer 510, a mask is needed to provide shielding for the area outside the organic encapsulation layer 530 so that the deposited material is only formed above the organic encapsulation layer 530. However, since the particle size of the deposited material is usually relatively small, a small amount of the deposited material will diffuse through the gap between the mask and the organic encapsulation layer 530 to the location of the second area 120 on the outside of the organic encapsulation layer 530 (or on the outside of the dam), thereby forming a CVD Shadow, that is, a chemical vapor deposition film layer with a gradually thinning film thickness, referred to as the deposition thinning area 520. Figure 3 and Figure 4 As shown, in the CVD Shadow, in the first direction, the farther away from the organic encapsulation layer 530 , the smaller the thickness thereof.

[0032] As described above, in the substrate 100 of the display module 10 , a connecting line 220 is disposed in the second region 120 , and the connecting line 220 includes a plurality of connecting sub-lines 221 distributed along the second direction. The connecting sub-lines 221 are formed of metal material and are also formed by a deposition process. Moreover, during the processing of the display module 10, based on the total number of connecting lines 220 and parameters such as the position and size of the connecting sub-lines 221 of each connecting line 220, it is necessary to first use etching to form grooves at corresponding positions in the second area 120 of the substrate 100, and then use deposition to form the bottom-layer connecting sub-lines 221 of each of the multiple connecting lines 220 in the grooves. Afterwards, substrate material can be further deposited on the aforementioned bottom-layer connecting sub-lines 221 by deposition, and then another connecting sub-line 221 is further deposited in the substrate material in the groove by deposition. Afterwards, a layer of substrate material needs to be deposited above the top-layer connecting sub-line 221 to ensure that the connecting sub-lines 221 of each of the multiple connecting lines 220 can be encapsulated in the substrate 100.

[0033] As described above, because multiple connecting sub-wires 221 and multiple substrate material layers are deposited within the trenches in the second region 120 of the substrate 100, the thickness of the substrate at the locations where the trenches (or connecting sub-wires 221) are located is relatively greater than that at other locations in the substrate 100, resulting in the top surface of the locations where the trenches (or connecting sub-wires 221) are located protruding relative to the top surface of other locations in the substrate 100. More specifically, in the display module disclosed in the embodiments of the present application, in the second direction, the thickness of the portion of the second region 120 where the connecting sub-wires 221 are embedded is a first thickness, and the thickness of the portion of the second region 120 where the connecting sub-wires 221 are not embedded is a second thickness. Obviously, the second thickness is less than the first thickness.

[0034] Based on the above situation, in order to make the top surface of the second region 120 relatively flat as a whole, so as to ensure that the CVD Shadow formed by the deposited material diffused into the second region 120 during the formation of the inorganic encapsulation layer 510 is relatively well combined with other layer structures in the second region 120, in an embodiment of the present application, the display module 10 also includes a planarization structure, which covers the top surface of the second region 120 to provide a planarization effect for the substrate 100, thereby ensuring that the connection reliability between the substrate 100 and the CVD Shadow is relatively good.

[0035] In more detail, the side of the second area 120 facing the display side of the display module is covered with a planarization structure, and the planarization structure includes a plurality of planarization layers 410 stacked along the second direction. The number of planarization layers 410 is two or three or more layers. In this case, the difficulty of forming each planarization layer 410 is relatively low, and the planarization effect of the plurality of planarization layers 410 can be ensured to be relatively good.

[0036] In one embodiment of the present application, the planarization structure includes two planarization layers. In this case, in the electronic device disclosed in the embodiment of the present application, two planarization layers 410 can be formed on the top surface of the second region 120 respectively and sequentially through two processes. Specifically, both planarization layers 410 can be formed of organic materials, and both can be formed on the second region 120 of the substrate 100 by coating. The top surface of the second region 120 is the side of the second region 120 facing away from its own back surface. More specifically, the top surface of the second region 120 is the side surface where the opening of the sink groove provided in the process of forming the connecting sub-line 221 is located.

[0037] Of course, in order to ensure that the planarization structure can provide a planarization effect for the connecting sub-lines 221 of each connecting line 220, in the display module 10 disclosed in the application embodiment, in the first direction, the first side edge of each planarization layer 410 extends to the side of the multiple connecting lines 220 away from the first area 110, and the second side edge of each planarization layer 410 extends to the side of the multiple connecting lines 220 close to the first area 110.

[0038] When the above technical solution is adopted, each planarization layer 410 can cover the top of the connecting sub-wire 221 of each connecting wire 220, so that the flatness of the surface of the side farthest from the second region 120 in the multiple planarization layers 410 is also relatively high. At the same time, it can also ensure that the bonding effect and stability between the CVD Shadow deposited on the other side of the planarization structure and the planarization structure are relatively high, thereby preventing the two from being easily separated and causing product failure. In addition, when the above technical solution is adopted, the spacing between the connecting sub-wire 221 and the CVD Shadow can be increased in the second direction, which can reduce the amount of heat generated by the connection sub-wire 221 being energized and conducted to the CVD Shadow, thereby further reducing the degree to which the heat weakens the bonding effect between the planarization structure and the CVD Shadow, so as to maximize the bonding stability between the planarization structure and the CVDShadow.

[0039] The embodiment of the present application discloses a display module 10, wherein the first region 110 and the second region 120 of the substrate 100 are distributed and connected along a first direction, a plurality of display signal lines 210 are provided in the first region 110, and a plurality of connecting lines 220 are provided in the second region 120, and the plurality of connecting lines 220 are spaced apart from each other in the first direction. Each connecting line 220 includes a plurality of connecting sub-lines 221 spaced apart along the second direction, one end of a display signal line 210 is connected to one end of the plurality of connecting sub-lines 221 included in the same connecting line 220, and the other ends of the plurality of connecting sub-lines 221 included in any connecting line 220 are connected to a display driver 300, so that when the display driver 300 is in operation, the corresponding display signal line 210 can be driven to provide a display function.

[0040] At the same time, in the display module 10 disclosed in the embodiment of the present application, the multiple connecting sub-lines 221 included in any connecting line 220 are all distributed along the second direction. This can reduce the size of each connecting line 220 in the first direction while ensuring that the overall cross-sectional area of ​​each connecting line 220 is still relatively large, thereby ensuring that the impedance of each connecting line 220 is relatively low, thereby improving the display performance of the display module 10. In addition, when each connecting line 220 includes multiple connecting sub-lines 221 spaced apart from each other along the second direction, the processing difficulty of each connecting sub-line 221 can be reduced, thereby improving the yield rate of the entire display module 10.

[0041] As described above, in the display module 10 disclosed in the embodiment of the present application, multiple connecting sub-lines 221 of any connecting line 220 that are spaced apart from each other along the second direction are all buried in the second area 120. In this case, since a substrate material layer is provided between any two adjacent connecting sub-lines 221 along the second direction, the thickness of the position where the connecting sub-line 221 is located in the substrate is greater than the thickness of other positions in the substrate 100. In this case, the top surface of the position where the connecting sub-line 221 is located in the substrate 100 is protruding compared to the top surfaces of other positions.

[0042] Based on the above situation, in order to prevent the poor bonding effect between the CVD Shadow formed by the deposition material of the encapsulation layer in the first area 110 of the substrate 100 diffusing to the second area 120 during the deposition process and the second area 120 of the substrate 100, in an embodiment of the present application, the side of the second area 120 facing the display side of the display module is covered with a planarization structure, and in the second direction, the first side edges of the multiple planarization layers 410 stacked along the second direction included in the planarization structure are extended to the side of the multiple connecting lines 220 away from the first area 110, and the second side edges of any planarization layer 410 are extended to the side of the multiple connecting lines 220 close to the first area 110, so that each planarization layer 410 can cover the multiple connecting lines 220 on the second area 120 of the substrate 100, ensuring that each planarization layer 410 can provide a planarization effect for the second area 120, so that the upper surface of the one farthest away from the second area in the planarization structure is relatively flat, and the bonding stability between the CVD Shadow and the planarization structure is relatively high. In addition, by making the planarization structure include a plurality of stacked planarization layers 410 , the difficulty of processing any planarization layer can be reduced, and the planarization effect of the entire planarization structure can be improved.

[0043] In a specific embodiment of the present application, the number of connecting sub-lines 221 included in each connecting line 220 can be at least three, that is, any connecting line 220 includes at least three connecting sub-lines 221 distributed along the second direction. In this case, the size of each connecting sub-line 221 of each connecting line 220 in the first direction can be further appropriately reduced, thereby further reducing the overall size of the multiple connecting lines 220 in the first direction. At the same time, the size of the bottom black border of the display module 10 can also be further reduced. Of course, in order to ensure that the planarization layer 410 can provide a good planarization effect for the multiple connecting lines 220 on the substrate 100, the number of connecting sub-lines 221 of each connecting line 220 cannot be increased indefinitely. In a specific embodiment of the present application, each connecting line 220 includes three connecting sub-lines 221 distributed along the second direction.

[0044] As described above, in the second direction, the thickness of the portion of the second region 120 where the connecting sub-wires 221 are embedded can be made to be the first thickness, and the thickness of the portion of the second region 120 where the connecting sub-wires 221 are not embedded can be made to be the second thickness. In more detail, the difference between the first thickness and the second thickness is a preset difference. In order to maximize the planarization performance of the planarization structure as a whole, in a specific embodiment of the present application, in the second direction, the sum of the thicknesses of the planarization layer 410 can be made greater than or equal to 5 times the preset difference. In this case, it can be basically ensured that the flatness of the surface of the side of the planarization structure away from the second region 120 is relatively good, thereby ensuring that the bonding reliability between the CVD Shadow and the planarization structure is relatively high.

[0045] Of course, in order to prevent the thickness of the planarization structure from being too large and thus hindering the packaging process of the display module, in the display module disclosed in the embodiment of the present application, the thickness of the planarization structure can be made less than or equal to 10 times the preset difference.

[0046] In a specific embodiment of the present application, in the second direction, the sum of the thicknesses of the planarization layer 410 can be greater than or equal to 3um. Further, the sum of the thicknesses of the planarization layer 410 can be greater than or equal to 4um. In this case, the flattening degree of the surface of the planarization structure away from the second region 120 can be further improved.

[0047] As described above, due to the processing method of the inorganic encapsulation layer 510 in the first region 110, a CVD shadow will be formed on the surface of the planarization structure facing away from the second region 120. In the embodiment of the present application, by providing a planarization structure, the bonding effect between the CVD shadow and the planarization structure (and the substrate 100) can be improved. In order to further improve the bonding stability between the substrate 100 and the CVD shadow, in another embodiment of the present application, the deposition range of the inorganic encapsulation layer 510 can be appropriately expanded, so that the inorganic encapsulation layer 510 is also deposited on the partial structure of the planarization layer close to the first region 110. In this case, since the inorganic encapsulation layer 510 and the CVD shadow are essentially deposited at the same time, even if the thickness of the CVD shadow is not a normal size, the connection reliability between the CVD shadow and the inorganic encapsulation layer 510 can be ensured to be relatively good, thereby making the connection stability between the CVD shadow and the planarization structure relatively high.

[0048] That is, in the embodiment of the present application, a deposition thinning region 520 is provided on the side of the planarization structure away from the second region 120, and the side of the deposition thinning region 520 close to the first region 110 is connected to the inorganic encapsulation layer 510, and the inorganic encapsulation layer 510 covers a portion of the second planarization layer 410. It should be noted that, as described above, the CVD Shadow and the inorganic encapsulation layer 510 are both formed by deposition of deposition materials. For this reason, the two are essentially the same structure. The difference is that the positions they cover are different. The CVD Shadow covers the second region 120, and the inorganic encapsulation layer 510 covers the first region 110. For this reason, in essence, the CVD Shadow and the inorganic encapsulation layer 510 belong to different parts of the same structure.

[0049] In detail, in an embodiment of the present application, one of the multiple planarization layers 410 includes a stacking region 411 and a protruding region 412, wherein the stacking region 411 is stacked with other planarization layers 410, that is, in an embodiment of the present application, the stacking region 411 included in one of the multiple planarization layers 410 is in a stacked state with several other planarization layers 410, and accordingly, the protruding region 412 included in the aforementioned planarization layer 410 protrudes as a whole on the side of the other planarization layers 410 close to the first region 110, and the protruding region 412 is connected to the side of the stacking region 411 close to the first region 110, and accordingly, in an embodiment of the present application, the side of the protruding region 412 facing away from the second region 120 can be covered with an inorganic encapsulation layer 510.

[0050] During the specific processing, the size of the area covered by the inorganic encapsulation layer 510 in the protruding area 412 can be determined based on actual conditions, with the direction of the aforementioned size being the first direction. In a specific embodiment of the present application, in the first direction, the size of the area covered by the inorganic encapsulation layer 510 in the protruding area 412 can be greater than or equal to a preset size d, which is related to the accuracy of forming the inorganic encapsulation layer 510 and the CVD shadow.

[0051] As described above, in the process of forming the inorganic encapsulation layer 510, a mask is required to provide a covering effect to prevent the formation of the inorganic encapsulation layer 510 above the second area. However, affected by the processing accuracy of the mask, the position of the pattern structure of the mask actually formed may deviate from the position of the mask pattern structure initially designed, which will cause the actual boundary of the inorganic encapsulation layer formed on the upper surface of the first area 110 to differ from the preset boundary. For this reason, in an embodiment of the present application, the aforementioned preset dimension d is the distance between the preset boundary and the actual boundary of the inorganic encapsulation layer in the distribution direction.

[0052] Furthermore, based on current processing accuracy, in a specific embodiment of the present application, the preset size can be set to 30 μm, so that the portion of the inorganic encapsulation layer 510 covering the second planarization layer 410 can provide an effective reinforcement of the connection reliability of the CVD Shadow. In order to further enhance the effect of the inorganic encapsulation layer 510 on the reinforcement of the connection reliability between the CVD Shadow and the planarization structure, in a specific embodiment of the present application, in the first direction, the size of the area of ​​the protruding area 412 covered by the inorganic encapsulation layer 510 can be greater than or equal to 40 μm.

[0053] Of course, when the inorganic packaging layer 510 covers part of the protruding area 412, the protruding size of the protruding area 412 relative to the stacking area 411 cannot be too large, so as to prevent the size of the planarization structure in the first direction from being too large, resulting in the size of the second area 120 being too large, which is not conducive to reducing the size of the bottom black border of the display module 10.

[0054] As described above, one of the multiple planarization layers 410 includes a stacking region 411 and a protruding region 412, and the stacking region 411 is stacked with the other planarization layers 410, and the side of the protruding region 412 facing away from the second region 120 is covered with an inorganic encapsulation layer 510. As described above, since there are multiple planarization layers 410, in this case, the planarization layer 410 including the stacking region 411 and the protruding region 412 can be any one of the multiple planarization layers 410. In a specific embodiment of the present application, in the second direction, the stacking region can be located on the side of the other planarization layers close to the second region, or the stacking region can be located on the side of the other planarization layers facing away from the second region. Intuitively speaking, in this embodiment of the present application, the planarization layer 410 including the stacking region 411 and the protruding region 412 can be located at the bottom or top of the multiple planarization layers 410. When adopting the above technical solution, while reducing the difficulty of forming multiple planarization layers 410, the thickness of the planarization layer 410 including the stacking area 411 and the protruding area 412 can be ensured to be equivalent to the thickness of other planarization layers 410, thereby ensuring that the thickness of the planarization structure is relatively small while enabling the planarization structure to provide a reliable and uniform planarization effect.

[0055] Based on the above embodiment, in the embodiment of the present application, by making the connecting line 220 include the above-mentioned connecting sub-lines 221 distributed along the second direction, the overall space occupied by the multiple connecting lines 220 in the first direction is reduced. When the size of each connecting line 220 in the first direction is correspondingly reduced, the size of the black border of the second area 120 is greatly reduced. Based on this, even if the inorganic encapsulation layer 510 partially covers the side of the protruding area 412 away from the second area 120, compared with the related art, the space occupied by the second area 120 in the first direction will not be larger. From a quantitative point of view, using the technical solution disclosed in the embodiment of the present application, the size of each connecting line 220 in the first direction can be reduced by at least 2um, and the number of connecting lines 220 is relatively large, so that the overall size reduction of the multiple connecting lines 220 in the first direction is much greater than the size of the area covered by the inorganic encapsulation layer 510 in the protruding area 412 of the planarization structure.

[0056] Based on the display module 10 disclosed in any of the above embodiments, the embodiments of the present application further disclose an electronic device, which includes any of the above display modules 10. Of course, the electronic device may also include other devices and mechanisms such as a housing and a battery, which will not be introduced one by one here.

[0057] It should be noted that, in this article, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device comprising the element. In addition, it should be noted that the scope of the methods and devices in the embodiments of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved. For example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0058] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. A display module, characterized in that: It comprises a substrate (100), a display signal line (210), a connecting line (220), a display driving component (300) and a planarization structure, wherein: The substrate (100) comprises a first region (110) and a second region (120) distributed along a first direction (X) and connected to each other, a plurality of display signal lines (210) being provided in the first region (110), a plurality of connection lines (220) being provided in the second region (120), and the plurality of connection lines (220) being spaced apart from each other in the first direction; Any of the connecting lines (220) comprises a plurality of connecting sub-lines (221) spaced apart along a second direction (Y), one end of one of the display signal lines (210) is connected to one end of the plurality of connecting sub-lines (221) included in the same connecting line (220), and the other ends of the plurality of connecting sub-lines (221) included in any of the connecting lines (220) are connected to the display driving component (300), and the second direction is parallel to the thickness direction of the second region (120); In the second direction, the planarization structure is arranged to cover the second region (120), and the planarization structure includes a plurality of planarization layers (410) stacked along the second direction. In the first direction, the first side of each of the planarization layers (410) extends to a side of the plurality of connecting lines (220) away from the first region, and the second side of each of the planarization layers (410) extends to a side of the plurality of connecting lines (220) close to the first region (110).

2. The display module according to claim 1, wherein: The size of the portion of the second region in which the connecting sub-line (221) is embedded in the second direction is a first size, the size of the portion of the second region in which the connecting sub-line (221) is not embedded in the second direction is a second size, the difference between the first size and the second size is a preset difference, and the size of the planarization structure in the second direction is greater than or equal to 5 times the preset difference.

3. The display module according to claim 2, wherein: The size of the planarization structure in the second direction is less than or equal to 10 times the preset difference.

4. The display module according to claim 1, wherein: In the second direction, a deposition thinning region (520) is provided on a side of the planarization structure facing away from the second region (120), and a side of the deposition thinning region (520) close to the first region (110) is connected to the inorganic encapsulation layer (510), and the inorganic encapsulation layer (510) covers a portion of the planarization structure.

5. The display module according to claim 4, wherein: One of the plurality of planarization layers includes a stacking region (411) and a protruding region (412), wherein the stacking region (411) and the other planarization layers are stacked in the second direction, the protruding region (412) is connected to a side of the stacking region (411) close to the first region (110), and in the second direction, a side of the protruding region (412) facing away from the second region (120) is covered with an inorganic encapsulation layer (510).

6. The display module according to claim 5, wherein: In the first direction, the size of the area of ​​the protruding region (412) covered by the inorganic encapsulation layer (510) is greater than or equal to a preset size, and the preset size is the distance between the preset boundary and the actual boundary of the inorganic encapsulation layer in the first direction.

7. The display module according to claim 5, wherein: In the second direction, the stacking region is located on a side of each of the other planarization layers close to the second region; Alternatively, in the second direction, the stacked region is located on a side of each of the other planarization layers away from the second region.

8. The display module according to claim 1, wherein: Any of the connecting lines (220) comprises at least three connecting sub-lines (221) spaced apart along the second direction.

9. The display module according to claim 1, wherein: The planarization structure includes at least two planarization layers.

10. An electronic device, characterized in that: A display module comprising any one of claims 1 to 9.

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