A drying apparatus having a wafer clamping assembly

Abstract

The application discloses a drying device with a wafer clamping assembly, which comprises a water collecting seat, a clamping assembly, a waterproof cover and a clamping driving element. The clamping assembly comprises a support and a clamping piece which are connected with each other. The support is rotationally arranged in the water collecting seat and is used for placing a wafer. The clamping piece is rotationally arranged on the support and can move between a clamping position for clamping the wafer and an unlocking position for separating from the wafer. The waterproof cover is located at the outer periphery of the clamping assembly and is slidingly arranged relative to the water collecting seat. When the clamping piece is in the unlocking position and abuts against the waterproof cover, the clamping piece is in the clamping position under the action of the clamping driving element when the waterproof cover is separated from the clamping piece. The clamping driving element is arranged between the clamping piece and the support. The drying device with the wafer clamping assembly can stably keep the clamping state after the waterproof cover is separated, avoids the problem of insufficient stability, reduces the number of parts, reduces the complexity of the equipment, and reduces the manufacturing cost.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a drying apparatus having a wafer clamping assembly. Background Technology

[0002] In the semiconductor manufacturing field, the cleaning and drying process following the Chemical-Mechanical Polishing (CMP) process is crucial to chip yield. Currently, wafer drying equipment is mainly divided into two types: vertical drying and horizontal drying. Among them, horizontal drying technology achieves wafer surface drying by fixing the wafer on a rotating stage, making it rotate at high speed, and combining it with deionized water spraying and gas purging.

[0003] In existing technologies, wafers require a clamping mechanism to provide stable support during high-speed rotation, thereby overcoming centrifugal force and preventing the wafers from being thrown off the rotary table. Simultaneously, to facilitate wafer loading and unloading operations by the robotic arm, the clamping mechanism must release promptly during wafer handling. Furthermore, to prevent liquid splashing and contamination of the equipment during high-speed wafer rotation, a water shield higher than the wafer is required, and this water shield must be lowered during wafer handling to prevent interference with the robotic arm's movement.

[0004] However, current clamping mechanisms have technical drawbacks. For example, using the gravity of the clamping components to achieve clamping and releasing actions is affected by factors such as rotary table vibration and wafer placement deviation, making it difficult to guarantee clamping stability. This can easily lead to slight displacement of the wafer during high-speed rotation, affecting the drying effect and even causing safety hazards. Alternatively, adding a separate drive structure (such as an additional motor or cylinder) to control the clamping action can improve stability, but it significantly increases the structural complexity and number of parts of the equipment, driving up manufacturing costs and causing many inconveniences for later maintenance, which is not conducive to efficient operation and maintenance in large-scale production. Summary of the Invention

[0005] This application discloses a drying device with a wafer clamping assembly, which can provide continuous force through a clamping drive component, and stably maintain the clamping state after the waterproof cover is removed, avoiding the problem of insufficient stability. It can also reduce the number of parts, reduce equipment complexity, and reduce manufacturing costs.

[0006] To achieve the above objectives, this application discloses a drying apparatus with a wafer clamping assembly, comprising:

[0007] Water collection base, the water collection base having a receiving cavity;

[0008] A clamping assembly includes a support member and a clamping member connected to each other. The support member is rotatably disposed within the water collection base and is used to place the wafer. The clamping member is rotatably disposed on the support member and is movable between a clamping position for clamping the wafer and an unlocking position for disengaging from the wafer.

[0009] A waterproof cover is located on the outer periphery of the clamping assembly. The waterproof cover is slidably disposed relative to the water collection seat. When the waterproof cover is configured to abut against the clamping member, the clamping member is in the unlocked position. When the waterproof cover is disengaged from the clamping member, the clamping member is in the clamping position under the action of the clamping drive member. The clamping drive member is located between the clamping member and the support member.

[0010] In one possible implementation, the rotation center of the clamping member is located at the same position as the center of gravity of the clamping member.

[0011] In one possible implementation, the support includes a rotating disk and a rotating shaft located at the bottom of the rotating disk, the rotating shaft being rotatably mounted within the water collection seat, and a protective cover being fitted around the bottom of the rotating disk on the upper outer periphery of the rotating shaft.

[0012] In one possible implementation, the rotary disk has multiple extensions circumferentially along its rotation center, each extension having a wafer holder for placing the wafer, and multiple clamping members corresponding one-to-one with the multiple wafer holders and movably disposed on the corresponding wafer holders.

[0013] In one possible implementation, the wafer pedestal is provided with a mounting groove on the side away from the rotation center, and the clamping member is rotatably mounted in the mounting groove.

[0014] The clamping member includes jaws that extend out of the mounting slot, and a plurality of jaws are used to simultaneously clamp the outer periphery of the wafer.

[0015] In one possible implementation, the wafer pedestal is provided with a boss, the boss and the gripper are located in the same straight line along the radial direction of the rotating disk, and the boss is provided with a plurality of horizontal hydrophobic grooves that penetrate the upper surface of the boss.

[0016] In one possible implementation, the gripper has a clamping surface facing the center of rotation, the clamping surface being inclined, and the upper end of the clamping surface being closer to the center of rotation than the lower end of the clamping surface.

[0017] In one possible implementation, each wafer mount is provided with two guide posts, which are located on both sides of the mounting slot, and the guide posts are used to guide the wafer to be placed on the boss.

[0018] In one possible implementation, the surface of the wafer pedestal near the rotation center forms two inclined surfaces, which are symmetrically arranged in the vertical direction, and the junction of the two inclined surfaces is closer to the rotation center than other positions of the inclined surfaces.

[0019] In one possible implementation, the clamping member has an abutment portion, and the waterproof cover has an unlocking portion. The unlocking portion is arranged opposite to the abutment portion and is located above the abutment portion. When the unlocking portion abuts the abutment portion, the unlocking portion can drive the clamping member to rotate, so that the gripper moves in a direction away from the center of rotation.

[0020] In one possible implementation, the drying apparatus with wafer clamping assembly further includes a detection sensor, wherein the clamping member has a portion overlapping with the transmitter of the detection sensor in the clamping position, and the clamping member avoids the transmitter of the detection sensor in the unlocked position.

[0021] Compared with the prior art, the beneficial effects of this application are as follows:

[0022] The drying apparatus with a wafer clamping assembly provided in this application includes a water collection base, a clamping assembly, and a waterproof cover. The water collection base has a receiving cavity to provide space for the installation and operation of the clamping assembly. The clamping assembly includes a support member and a clamping member. The support member is rotatably installed in the water collection base and undertakes the function of placing the wafer. The clamping member is movably disposed on the support member and can switch between a clamping position and an unlocked position. The two are connected by a clamping drive member, which can provide a force to the clamping member to move towards the clamping position. The waterproof cover is located on the outer periphery of the clamping assembly and slides with the water collection base. When the waterproof cover slides and abuts against the clamping member, it applies a force to the clamping member, forcing the clamping member to move from the clamping position to the unlocked position, at which time the clamping member moves away from the wafer. When the waterproof cover moves in the opposite direction and disengages from the clamping member, it automatically returns from the unlocked position to the clamping position under the force of the clamping drive member, realizing a stable clamping of the wafer periphery.

[0023] Therefore, on the one hand, by applying force through the clamping drive, the clamping component can stably maintain its clamping state after the waterproof cover is detached, avoiding the instability problem caused by the reliance on gravity in traditional gravity-based clamping. When the wafer rotates at high speed, the force of the clamping drive ensures that the clamping component is tightly attached to the wafer periphery, effectively balancing centrifugal force, preventing the wafer from being thrown out, significantly reducing the risk of wafer damage due to unstable clamping, and ensuring the safety of the drying process. On the other hand, the clamping state switching is achieved by utilizing the contact or detachment relationship between the waterproof cover and the clamping component, combining the lifting action of the waterproof cover with the driving requirements of the clamping component. This eliminates the need for a separate clamping drive structure, and the entire process does not require additional control logic coordination, simplifying the automated operation steps, reducing the number of parts, reducing the complexity of the equipment structure, and lowering manufacturing costs. At the same time, it reduces the failure points caused by multiple drive components and improves the long-term stability of the equipment. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of a drying apparatus with a wafer clamping assembly provided in an embodiment of the present invention;

[0026] Figure 2 A schematic diagram of the lifting base of a drying device with a wafer clamping assembly provided in an embodiment of the present invention;

[0027] Figure 3 A cross-sectional view of a lifting base of a drying apparatus with a wafer clamping assembly provided in an embodiment of the present invention;

[0028] Figure 4 A schematic diagram of the structure of a water collection base for a drying device with a wafer clamping assembly provided in an embodiment of the present invention;

[0029] Figure 5 A cross-sectional view of a water collection base of a drying apparatus with a wafer clamping assembly provided in an embodiment of the present invention;

[0030] Figure 6 A schematic diagram of the structure of a waterproof cover for a drying device with a wafer clamping assembly provided in an embodiment of the present invention;

[0031] Figure 7 A front view of a waterproof cover for a drying apparatus with a wafer clamping assembly provided in an embodiment of the present invention;

[0032] Figure 8 A cross-sectional view of a drying apparatus with a wafer clamping assembly provided in an embodiment of the present invention;

[0033] Figure 9 A partial cross-sectional view of a drying apparatus with a wafer clamping assembly provided in an embodiment of the present invention;

[0034] Figure 10 A schematic diagram of the structure of a wafer holder in a drying apparatus with a wafer clamping assembly provided in an embodiment of the present invention;

[0035] Figure 11 This is a schematic diagram of the structure of a clamping component in a drying apparatus with a wafer clamping assembly, provided in an embodiment of the present invention.

[0036] Figure 12 This is a schematic diagram of the structure of the clamping member in the unlocked position of a drying device with a wafer clamping assembly provided in an embodiment of the present invention;

[0037] Figure 13 This is a schematic diagram of the clamping component of a drying apparatus with a wafer clamping assembly provided in an embodiment of the present invention, in the clamping position.

[0038] Explanation of reference numerals in the attached figures:

[0039] 10-Water collecting base; 11-Receiving cavity; 12-Fixing sleeve; 121-Second annular groove; 122-Second sealing ring;

[0040] 20-Lifting seat; 21-Sealed space; 22-Sliding sleeve; 221-First annular groove; 222-First sealing ring; 223-Threaded hole; 224-External connector; 23-Guide hole; 231-Flange hole; 24-Lifting flange; 25-Support arm; 251-Mounting groove;

[0041] 30-Clamping assembly; 31-Support member; 311-Rotating disk; 3111-Extension; 31111-Driver mounting hole; 31111a-Stepped surface; 31112-Push rod; 311121-Push rod head; 312-Rotating shaft; 313-Protective cover; 32-Clamping member; 321-Claw; 3211-Clamping surface; 322-Compensation hole; 33-Wafer seat; 331-Assembly slot; 332-Boss; 3321-Drainage groove; 333-Guide post; 334-Inclined surface; 335-Abutment part;

[0042] 40 - Waterproof cover; 41 - Socket; 42 - Unlocking part;

[0043] 50 - First reset component; 51 - First spring;

[0044] 60 - Guide component; 61 - Limit screw; 611 - Limit sleeve;

[0045] 70 - Connector;

[0046] 80 - Clamping drive component; 81 - Second spring;

[0047] 90 - Detection sensor; 91 - Transmitter. Detailed Implementation

[0048] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0049] In this application, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0050] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0051] In the semiconductor manufacturing field, the cleaning and drying process following the Chemical-Mechanical Polishing (CMP) process is crucial to chip yield. Currently, wafer drying equipment is mainly divided into two types: vertical drying and horizontal drying. Among them, horizontal drying technology achieves wafer surface drying by fixing the wafer on a rotating stage, making it rotate at high speed, and combining it with deionized water spraying and gas purging.

[0052] In existing technologies, wafers require a clamping mechanism to provide stable support during high-speed rotation, thereby overcoming centrifugal force and preventing the wafers from being thrown off the rotary table. Simultaneously, to facilitate wafer loading and unloading operations by the robotic arm, the clamping mechanism must release promptly during wafer handling. Furthermore, to prevent liquid splashing and contamination of the equipment during high-speed wafer rotation, a water shield higher than the wafer is required, and this water shield must be lowered during wafer handling to prevent interference with the robotic arm's movement.

[0053] However, current clamping mechanisms have technical drawbacks. For example, using the gravity of the clamping components to achieve clamping and releasing actions is affected by factors such as rotary table vibration and wafer placement deviation, making it difficult to guarantee clamping stability. This can easily lead to slight displacement of the wafer during high-speed rotation, affecting the drying effect and even causing safety hazards. Alternatively, adding a separate drive structure (such as an additional motor or cylinder) to control the clamping action can improve stability, but it significantly increases the structural complexity and number of parts of the equipment, driving up manufacturing costs and causing many inconveniences for later maintenance, which is not conducive to efficient operation and maintenance in large-scale production.

[0054] In view of this, some embodiments of this application provide a drying apparatus with a wafer clamping assembly, which provides continuous force through a clamping drive, and can stably maintain the clamping state after the waterproof cover is removed, avoiding the problem of insufficient stability. It can also reduce the number of parts, reduce equipment complexity, and reduce manufacturing costs.

[0055] The present application will be described in detail below through specific embodiments:

[0056] The drying apparatus with a wafer clamping assembly in the embodiments of this application, such as Figures 1 to 13 As shown, a drying apparatus with a wafer clamping assembly includes:

[0057] Water collection seat 10, water collection seat 10 has a receiving cavity 11.

[0058] The clamping assembly 30 includes a support member 31 and a clamping member 32 connected to each other. The support member 31 is rotatably disposed within the water collection base 10 and is used to place the wafer. The clamping member 32 is movably disposed on the support member 31 and can move between the clamping position for clamping the wafer and the unlocking position for releasing the wafer.

[0059] A waterproof cover 40 is located on the outer periphery of the clamping assembly 30. The waterproof cover 40 is slidably disposed relative to the water collection base 10. When the waterproof cover 40 is configured to abut against the clamping member 32, the clamping member 32 is in the unlocked position. When the waterproof cover 40 is disengaged from the clamping member 32, the clamping member 32 is in the clamping position under the action of the clamping drive member 80. The clamping drive member 80 is disposed between the clamping member 32 and the support member 31.

[0060] The drying apparatus with a wafer clamping assembly provided in this application embodiment includes a water collection base 10, a clamping assembly 30, and a waterproof cover 40. The water collection base 10 has a receiving cavity 11 to provide space for the installation and operation of the clamping assembly 30. The clamping assembly 30 includes a support member 31 and a clamping member 32. The support member 31 is rotatably mounted in the water collection base 10 and performs the function of placing the wafer. The clamping member 32 is movably disposed on the support member 31 and can switch between a clamping position and an unlocked position. The two are connected by a clamping drive member 80. The waterproof cover 40 is located on the outer periphery of the clamping assembly 30 and slides in cooperation with the water collection base 10 in the first direction. When the waterproof cover 40 slides and comes into contact with the clamping member 32, it applies a force to the clamping member 32, forcing the clamping member 32 to move from the clamping position to the unlocking position. At this time, the clamping member 32 is away from the wafer. When the waterproof cover 40 moves in the opposite direction and disengages from the clamping member 32, it automatically returns to the clamping position from the unlocking position under the force applied by the clamping drive member 80, thus achieving a stable clamping of the wafer periphery.

[0061] Therefore, on the one hand, by providing a continuous force through the clamping drive component 80, the clamping component 32 can stably maintain the clamping state after the waterproof cover 40 is removed, avoiding the instability problem caused by the traditional gravity clamping relying on gravity characteristics. When the wafer rotates at high speed, the clamping component 32 closely fits the periphery of the wafer under this force, effectively balancing the centrifugal force, preventing the wafer from being thrown out, significantly reducing the risk of wafer damage caused by unstable clamping, and ensuring the safety of the drying process.

[0062] On the other hand, the clamping state switching is achieved by using the contact or disengagement relationship between the waterproof cover 40 and the clamping component 32. The lifting action of the waterproof cover 40 is combined with the driving requirements of the clamping component 30, eliminating the need for a separate clamping drive structure. The entire process does not require additional control logic coordination, which simplifies the automated operation steps, reduces the number of parts, reduces the complexity of the equipment structure, and also reduces manufacturing costs. At the same time, it reduces the failure points caused by multiple drive components and improves the long-term stability of the equipment.

[0063] Furthermore, the clamping drive 80 continuously applies a force to the clamping member 32, ensuring that the clamping member 32 remains oriented towards the clamping position. This force allows the clamping member 32 to adhere tightly to the wafer edge, and even with minute tolerances in the wafer dimensions, the clamping drive 80 can automatically compensate for any gaps, preventing the wafer from wobbling or falling off during rotation or transport.

[0064] The lifting seat 20 is slidably disposed relative to the water collection seat 10 along a first direction so that the lifting seat 20 rises and falls along the first direction. In the figure, the X direction is the first direction, which is also the vertical direction in this embodiment.

[0065] In some embodiments, such as Figure 1 andFigure 2 As shown, a fixed sleeve 12 is provided inside the receiving cavity 11. The drying device with wafer clamping assembly also includes a lifting seat 20. The lifting seat 20 is sleeved on the outer periphery of the fixed sleeve 12 along the first direction and is slidably arranged with the fixed sleeve 12 along the first direction. The lifting seat 20 and the fixed sleeve 12 form a sealed space 21. The sealed space 21 is connected to an external air source so that the lifting seat 20 can rise and fall along the first direction under the action of air pressure change in the sealed space 21.

[0066] The fixed sleeve 12 is installed inside the receiving cavity 11. The fixed sleeve 12 provides axial guidance for the lifting seat 20 and also serves as the mounting base for the clamping assembly 30, ensuring the center stability during wafer rotation. The lifting seat 20 is fitted around the fixed sleeve 12, forming a sealed space 21 between them. The lifting is driven by changes in air pressure controlled by an external air source. When the air pressure increases, the pressure in the sealed space 21 pushes the lifting seat 20 upward in the first direction; when the air pressure decreases, the lifting seat 20 descends under the action of gravity or a reset mechanism.

[0067] The support member 31 is rotatably mounted on the fixed sleeve 12, providing a support surface for placing the wafer. Its center position is the rotation center, ensuring balance when the wafer rotates at high speed. The clamping member 32 is movably connected to the support member 31 and can move between the "clamping position" (holding the wafer) and the "unlocking position" (releasing the wafer). Furthermore, the clamping and unlocking of the clamping member 32 is linked to the lifting and lowering of the waterproof cover 40. The waterproof cover 40 is fixed to the outer periphery of the lifting base 20 and rises and falls synchronously with the lifting base 20. When the waterproof cover 40 descends to abut against the clamping member 32, the clamping member 32 is in the unlocked position. When it is necessary to start the support member 31 to rotate to dry the wafer, the waterproof cover 40 rises and disengages from the clamping member 32, so that the clamping member 32 is in the clamping position, holding the wafer tightly and ensuring a good fixing effect.

[0068] Therefore, on the one hand, the fixed sleeve 12 is used for guidance and pneumatic uniform drive, replacing the traditional dual-drive mechanism with pneumatic drive. This reduces the number of mechanical parts, improves the smoothness of movement, and eliminates the left and right swaying during lifting, thus improving the movement accuracy of the waterproof cover 40 and preventing liquid splashing from contaminating the equipment. The pneumatic drive mechanism is integrated between the fixed sleeve 12 and the lifting seat 20, resulting in a compact structure, reduced vertical space occupation, and lower installation height requirements for the equipment.

[0069] On the other hand, the lifting of the waterproof cover 40 and the unlocking of the clamping component 32 are controlled by the same pneumatic source, eliminating the need for independent drive components and controllers, reducing the number of parts and manufacturing costs. Moreover, a single pneumatic drive replaces the coordination of multiple drive components, reducing vulnerable parts such as solenoid valves and air pipes, lowering the failure rate and reducing maintenance time. In addition, the mechanical linkage between the waterproof cover 40 and the clamping component 32 ensures synchronous operation, avoiding timing deviations that may occur with traditional independent drives, and reducing the wafer clamping defect rate.

[0070] The sealed space 21 is connected to an external air source via an air circuit. A solenoid valve is connected in series on the air circuit. The solenoid valve may include an on / off valve, an intake speed control valve, and an exhaust speed control valve. The air source provides compressed gas (dry air or nitrogen can be used). Other components such as safety valves and air compressors may also be connected in series on the air circuit.

[0071] In one possible implementation, such as Figures 2 to 5 As shown, the lifting seat 20 includes a sliding sleeve 22, the inner wall of the sliding sleeve 22 has a first annular groove 221, and the outer wall of the fixed sleeve 12 has a second annular groove 121. The first annular groove 221 and the second annular groove 121 are arranged opposite to each other to form a sealed space 21.

[0072] Therefore, the inner wall of the sliding sleeve 22 of the lifting seat 20 is provided with a first annular groove 221, while the outer wall of the fixed sleeve 12 is provided with a corresponding second annular groove 121. The two annular grooves are arranged facing each other to form an annular sealed space 21. When an external air source fills the sealed space 21 with compressed gas, the air pressure acts evenly on the inner wall of the sliding sleeve 22. Due to the presence of the first annular groove 221, the gas pressure can effectively push the sliding sleeve 22 to rise axially along the fixed sleeve 12; when the air pressure decreases, the sliding sleeve 22 descends along the fixed sleeve 12 under its own weight or the action of the return spring, realizing the lifting movement of the lifting seat 20.

[0073] The first annular groove 221 is located on the inner wall of the sliding sleeve 22 and has an annular concave shape; the second annular groove 121 is on the outer wall of the fixed sleeve 12 and also has an annular concave shape. The two are arranged facing each other and, after assembly, form a closed space 21 with an annular cross-section. This space is like a gas chamber used to contain compressed gas.

[0074] Compared to the traditional dual-drive structure, integrating the drive mechanism between the fixed sleeve 12 and the sliding sleeve 22 eliminates the need for complex drive components, connecting rods, and other parts, reducing the number of components. This not only lowers the manufacturing cost of the equipment but also reduces potential failure points caused by component wear. Furthermore, the pneumatic drive method using the annular groove provides uniform driving force, reduces the swaying amplitude of the lifting seat 20 during movement, significantly improves the movement accuracy of the waterproof cover 40, effectively prevents liquid splashing and contamination of the equipment, and ensures the cleanliness of the wafer drying environment.

[0075] In some embodiments, such as Figure 8 and Figure 9 As shown, the inner wall of the sliding sleeve 22 is provided with a first sealing ring 222 above the first annular groove 221, and the outer wall of the fixed sleeve 12 is provided with a second sealing ring 122 below the second annular groove 121. The first sealing ring 222, the second sealing ring 122, the first annular groove 221 and the second annular groove 121 together form a sealed space 21.

[0076] The first sealing ring 222 and the second sealing ring 122 are respectively disposed above the first annular groove 221 and below the second annular groove 121, forming a sealing barrier with the annular groove to maintain the integrity of the sealed space 21 and reduce the risk of gas leakage. During the wafer drying process, complex conditions such as temperature fluctuations and vibrations may exist inside the equipment. The sealing rings have a certain degree of elasticity, and can provide cushioning during the lifting and lowering of the sliding sleeve 22. The first sealing ring 222 and the second sealing ring 122 can reduce the radial sway between the sliding sleeve 22 and the fixed sleeve 12, improve the movement accuracy of the lifting seat 20, reduce mechanical impact, and extend the service life of the fixed sleeve 12 and the sliding sleeve 22. Moreover, when the drying device is working, liquid splashes, and the sealed space 21 formed by the sealing rings and the annular groove can effectively prevent liquid from seeping into the pneumatic drive system.

[0077] The sealing ring can be either a lip seal or an O-ring; this application does not limit the choice. After the two annular grooves are arranged opposite each other, the sealing element is installed on the contact surface to ensure the airtightness of the space. The sealing groove is installed in the sealing groove of the annular groove. The depth and width of the sealing groove are precisely designed according to the specifications of the sealing ring to ensure that the sealing ring achieves reliable sealing under compression, preventing air pressure leakage from affecting the driving effect of the lifting seat 20.

[0078] In some embodiments, such as Figure 8 and Figure 9 As shown, the sealed space 21 is configured such that the lifting seat 20 can move in a first direction away from the water collection seat 10 when the air pressure in the sealed space 21 increases.

[0079] When an external air source fills the sealed space 21 with compressed gas, the air pressure will act evenly on the area below the first annular groove 221 on the inner wall of the sliding sleeve 22. Since the first annular groove 221 changes the force-bearing area of ​​the inner wall of the sliding sleeve 22, the gas pressure can be converted into an upward driving force, pushing the lifting seat 20 to move along the first direction (away from the water collection seat 10). When the air pressure in the sealed space 21 decreases, the lifting seat 20 falls back down along the fixed sleeve 12 under its own weight or the action of the return spring.

[0080] The lifting platform 20 rises along the first direction, which can quickly cover the outer periphery of the wafer with the waterproof cover 40, and can also quickly return to the position where the wafer protrudes from the waterproof cover 40. This facilitates wafer loading and unloading operations by the robotic arm, significantly shortening loading and unloading time and significantly improving production efficiency. At the same time, it makes the device structure more reasonable and compact, and can also avoid the risk of interference between the waterproof cover 40 and the water collection base 10, reducing the probability of wafer collision damage.

[0081] In some embodiments, such as Figure 8 and Figure 9As shown, a first reset member 50 is provided between the lifting seat 20 and the water collection seat 10. The first reset member 50 is used to provide a reset force for the lifting seat 20 to move toward the water collection seat 10 in a first direction.

[0082] A first reset element 50 is provided between the lifting seat 20 and the water collection seat 10. When the sealed space 21 is inflated, causing the lifting seat 20 to rise, the spring is compressed and stores elastic potential energy. When the air pressure decreases, the first reset element 50 releases energy, pushing the lifting seat 20 to smoothly fall back towards the water collection seat 10 in the first direction. During the reset process, the reset force of the first reset element 50 complements the air pressure, ensuring reliable reset of the lifting seat 20 even in the event of air source failure or sudden pressure loss, thus improving the reset success rate.

[0083] Moreover, the buffering effect of the first reset member 50 reduces the hard collision between the lifting seat 20 and the water collection seat 10, thereby reducing the wear rate of the first sealing ring 222 and the second sealing ring 122, reducing the vibration amplitude of the equipment, and ensuring the reliability of the lifting seat 20.

[0084] In other embodiments, a reset component may not be provided between the lifting seat 20 and the water collection seat 10, and the lifting seat 20 may directly achieve reset and descent under the action of gravity.

[0085] In some embodiments, such as Figure 2 and Figure 9 As shown, the lifting seat 20 is provided with a guide hole 23. The drying device with wafer clamping assembly also includes a guide member 60, which passes through the guide hole 23 so that the lifting seat 20 moves along a first direction under the reset force of the first reset member 50.

[0086] The guide member 60 forms a clearance fit with the guide hole 23, restricting the movement freedom of the lifting seat 20 in the first direction. This ensures that the lifting seat 20 moves along an absolutely straight line during rising and resetting, avoiding wafer position shifts caused by skewness. The rigid support of the guide member 60 effectively suppresses vibration and shaking during the resetting process. For example, when the first resetting member 50 releases energy, the unguided structure may generate amplitude due to inertia, while the guide structure, by constraining lateral displacement, controls the amplitude within a reasonable range, ensuring process stability.

[0087] In some embodiments, such as Figure 2 As shown, the lifting seat 20 is provided with a lifting flange 24, and the flange hole 231 of the lifting flange 24 is formed as a guide hole 23.

[0088] like Figure 8 and Figure 9As shown, the guide member 60 is a limiting screw 61. The limiting screw 61 passes through the flange hole 231 of the lifting flange and is fixed to the bottom of the water collection seat 10. The limiting screw 61 is provided with a limiting sleeve 611 with the opening facing downward. The first reset member 50 is a first spring 51. The first spring 51 is sleeved on the limiting screw 61 and is partially located inside the limiting sleeve 611. One end of the first spring 51 abuts against the lifting flange 24, and the other end of the first spring 51 abuts against the bottom wall of the limiting sleeve 611.

[0089] Therefore, the flange hole 231 of the lifting flange 24 directly serves as the guide hole 23. The limiting screw 61 not only functions as a guide component 60 (restraining the lifting seat 20 to move along the screw axis), but also is fixed to the water collection seat 10 via threads, achieving both positioning and connection functions. Furthermore, since the lifting flange 24 has multiple flange holes 231, evenly distributed around the center circumference, each flange hole 231 can correspond to one limiting screw 61, making the structure more stable and the lifting of the lifting seat 20 more reliable.

[0090] The limiting sleeve 611 is coaxially arranged with the limiting screw 61. The first spring 51 is sleeved on the limiting screw 61 and embedded in the limiting sleeve 611. The radial constraint of the limiting sleeve 611 on the first spring 51 can suppress the lateral bending of the first spring 51 when compressed, shorten the reset force transmission path to a straight distance, avoid torque loss caused by eccentric transmission, reduce the sway amplitude of the lifting seat 20 during the reset process, improve energy utilization, maintain the stability of movement, and at the same time protect the first spring 51.

[0091] In some embodiments, such as Figure 1 and Figure 8 As shown, the lifting seat 20 also includes a support arm 25 disposed on the outer periphery of the sliding sleeve 22, and the waterproof cover 40 is fixed on the support arm 25.

[0092] The support arm 25 is located on the outer periphery of the sliding sleeve 22, so that the installation position of the waterproof cover 40 is far away from the movement trajectory of the lifting seat 20. This ensures that the waterproof cover 40 maintains a safe distance from the guide mechanism when it rises and falls with the support arm 25, avoiding scratches or jamming caused by movement interference and improving the reliability of movement.

[0093] The support arm 25 adopts a cantilever structure, which distributes the weight of the waterproof cover 40 to the circumference of the sliding sleeve 22, keeping the eccentric load of the lifting seat 20 within a reasonable range and avoiding affecting the verticality of the lifting movement. After the waterproof cover 40 is fixed by the support arm 25, it can completely cover the sliding sleeve 22, guide member 60, return spring and other key components, forming a side-enclosed protective structure.

[0094] In some embodiments, such as Figure 1As shown, there are multiple support arms 25, which are evenly arranged around the outer periphery of the sliding sleeve 22. The support arms 25 are provided with mounting grooves 251, and the side wall of the waterproof cover 40 is provided with insertion holes 41.

[0095] like Figure 8 As shown, the drying device with wafer clamping assembly also includes a connector 70. The bottom edge of the waterproof cover 40 is inserted into the mounting groove 251. The connector 70 is fixed to the support arm 25 and inserted into the insertion hole 41 to fix the waterproof cover 40 and the support arm 25.

[0096] Multiple support arms 25 are arranged circumferentially around the sliding sleeve 22, so that the weight of the waterproof cover 40 is evenly transferred to the sliding sleeve 22 through the support arms 25, avoiding the tilting of the lifting seat 20 caused by single-point force. The support arms 25 and the sliding sleeve 22 form a ring support frame. When the waterproof cover 40 is subjected to external impact, the impact force is dispersed and transferred through the multiple support arms 25, avoiding local deformation.

[0097] The bottom edge of the waterproof cover 40 is inserted into the mounting groove 251 for pre-positioning. The waterproof cover 40 is also provided with a plug hole 41 to form a connection node. A connector 70 is then passed through the plug hole 41 for fixation. The connector 70 can then be fixed to the support arm 25 with screws or other fasteners to achieve a good fixing effect and also to enable disassembly. When the lifting seat 20 moves up and down, the multiple support arms 25 synchronously drive the waterproof cover 40 to move. Since the support arms 25 are arranged around the circumference of the sliding sleeve 22 and each support arm 25 is provided with a connector 70, the waterproof cover 40 will not tilt, ensuring structural stability and sealing.

[0098] The number of support arms 25 can be two, three, four, or other different quantities. This application does not limit the number of support arms 25. Multiple support arms 25 can be arranged around the outer periphery of the sliding sleeve 22.

[0099] In some embodiments, such as Figure 6 and Figure 7 As shown, the waterproof cover 40 has a cylindrical structure with openings at both ends, and the upper diameter of the cylinder gradually decreases relative to the lower diameter.

[0100] Specifically, the water shield is cylindrical, with its upper cross-sectional diameter gradually decreasing at a certain arc to form an arc surface. When liquid flying outward from the wafer surface impacts the inner surface of the water shield, the liquid rebounds obliquely downward, preventing it from bouncing back onto the wafer surface. Furthermore, a hydrophobic material can be sprayed onto the upper inner surface of the waterproof shield 40. When liquid is thrown onto the inner surface of the water shield, it falls quickly downward without accumulating. The inner wall of the waterproof shield 40 guides airflow and liquid to diffuse evenly radially, preventing eddies caused by abrupt changes in cross-section, which would otherwise cause condensate or splashing droplets to slide rapidly down the wall surface.

[0101] In some embodiments, such as Figure 1 and Figure 8 As shown, the water collection base 10 includes an outer cylinder, the outer diameter of the waterproof cover 40 is smaller than the inner diameter of the outer cylinder of the water collection base 10, and the gap between the waterproof cover 40 and the water collection base 10 is 5mm~10mm.

[0102] Since the waterproof cover 40 needs to move up and down within the water collection base 10, its outer diameter is smaller than the inner diameter of the outer cylinder of the water collection base 10, allowing it to move freely up and down within the outer cylinder. However, an excessively large gap between the waterproof cover 40 and the water collection base 10 will affect the ventilation effect inside the water collection base 10. Therefore, the ventilation inside the water collection base 10 should draw as much clean air as possible from the space between the wafer and the water cover to prevent atomized liquid from splashing upwards and falling above the wafer.

[0103] Therefore, the gap between the waterproof cover 40 and the water collection base 10 is 5mm to 10mm. Within this range, the waterproof cover 40 is provided with radial movement space to avoid rigid contact with the outer cylinder of the water collection base 10, ensuring smooth lifting and lowering movements. At the same time, it prevents excessive diffusion of the exhaust airflow. The negative pressure difference formed during exhaust causes air to flow from the outside of the gap to the inside, forming a self-sealing effect. External dust-laden gas cannot enter the interior of the waterproof cover 40 through the gap.

[0104] The gap between the waterproof cover 40 and the water collection base 10 can be 5mm, 7.5mm or 10mm, and this application does not limit it.

[0105] In some embodiments, such as Figure 8 and Figure 9 As shown, the support member 31 includes a rotating disk 311 and a rotating shaft 312 located at the bottom of the rotating disk 311. The rotating disk 311 is used to place the wafer. The rotating shaft 312 is rotatably mounted in the fixed sleeve 12. The bottom of the rotating disk 311 is located on the upper outer periphery of the rotating shaft 312 and a protective cover 313 is provided. The bottom of the protective cover 313 is lower than the top of the sliding sleeve 22.

[0106] During the high-speed rotating drying process of the wafer, deionized water and chemical liquids are thrown out along the edge of the rotating disk 311. The bottom of the protective cover 313 is lower than the top of the sliding sleeve 22, forming a labyrinth-like sealing structure, which effectively prevents the splashed liquid from entering the interior of the fixed sleeve 12. A bearing seat is provided inside the fixed sleeve 12, and the rotating shaft 312 is mounted on the bearing seat through the rotation of the bearing, which reduces the erosion of the bearing grease by the liquid, reduces the risk of bearing corrosion, and extends the service life of the transmission system.

[0107] The relative motion between the rotating shaft 312 and the fixed sleeve 12 may generate frictional particles. The protective cover 313 acts as a physical barrier to prevent these particles from rising with the airflow and contaminating the wafer surface, thereby reducing the particle defect rate on the wafer surface and improving the chip manufacturing yield. During high-speed rotation, the protective cover 313 guides the airflow along its outer surface, forming an annular airflow barrier, reducing turbulence below the wafer, avoiding liquid residue caused by airflow disturbance, and improving drying uniformity.

[0108] In some embodiments, such as Figure 1 and Figure 9 As shown, the rotating disk 311 has multiple extensions 3111 around its rotation center. Each extension 3111 is provided with a wafer holder 33 for placing wafers. There are multiple clamping members 32, which correspond one-to-one with the multiple wafer holders 33 and are movably disposed on the corresponding wafer holders 33.

[0109] The rotating disk 311 is driven by the rotating shaft 312 to achieve circumferential motion. Multiple extensions 3111 are arranged circumferentially, and a wafer holder 33 is provided at the end of each extension 3111, forming a multi-station layout. Multiple wafer holders 33 are used to support wafers at the same time. Each wafer holder 33 is equipped with a clamping member 32, which can clamp and release the wafer radially from multiple directions.

[0110] Because multiple extensions 3111 are spaced apart, an open space is formed at the bottom of the wafer. Liquid can be discharged directly downwards along the edge of the wafer under the action of centrifugal force. The heat generated by the high-speed rotation during wafer drying, as well as the heat carried by the drying gas, can be quickly dissipated through the open space at the bottom of the wafer.

[0111] In some embodiments, such as Figure 10 As shown, a mounting groove 331 is provided on the side of the wafer holder 33 away from the rotation center, and the clamping member 32 is rotatably mounted in the mounting groove 331. The clamping member 32 includes jaws 321 that extend out of the mounting groove 331, and multiple jaws 321 are used to simultaneously clamp the outer periphery of the wafer.

[0112] The grippers 321 clamp synchronously from multiple points on the outer periphery, achieving self-centering using the principle of circumferential force balance to ensure concentricity between the wafer and the rotation center. The grippers 321 are connected to the mounting slot 331 via a rotating shaft, allowing for quick disassembly and replacement without complex calibration. During high-speed rotation, liquid on the surface of the grippers 321 flows away through the mounting slot 331, without affecting their clamping effect. Furthermore, the grippers 321 extend from the mounting slot 331, with the rotating parts located within the slot, saving space and resulting in a compact structure.

[0113] In some embodiments, such as Figure 10As shown, the rotation center of the clamping member 32 is located at the same position as the center of gravity of the clamping member 32, so that the force of the clamping member 32 clamping the wafer comes only from the force of the clamping drive member 80, that is, the force of the clamping member 32 clamping the wafer is always stable when the support member 31 rotates.

[0114] During the rotation of the clamping member 32 around its rotation center, if the rotation center does not coincide with the center of gravity, the clamping member 32's own weight will generate an additional torque. This torque may fluctuate with changes in the rotation angle of the clamping member 32, thereby interfering with the stability of the force provided by the clamping drive member 80. However, when the two positions coincide, gravity will not generate an additional torque, and the force state of the clamping member 32 during rotation is simpler. When the clamping member 32 switches to the clamping position, the force applied by the clamping drive member 80 is evenly applied to the periphery of the wafer, avoiding the problem of unstable force caused by gravitational torque interference. Especially when the wafer rotates at high speed, it can reduce the risk of small wafer displacement caused by fluctuations.

[0115] The clamping component 32 needs to rotate when switching between unlocking and clamping states. If the center of rotation deviates from the center of gravity, a large centrifugal inertial force will be generated during the movement, which may cause uneven rotation speed or lag in the clamping component 32. When the two coincide, the rotational inertia distribution of the clamping component 32 is more balanced, and it can respond more quickly to changes in external force at the moment when the waterproof cover 40 comes into contact with or disengages, reducing action delay.

[0116] Furthermore, in some embodiments, such as Figure 11 As shown, the clamping member 32 is provided with a compensation hole 322 so that the rotation center of the clamping member 32 and the center of gravity of the clamping member 32 are located at the same position.

[0117] During the manufacturing process, the clamping component 32 may experience a misalignment between its center of gravity and the preset rotation center due to uneven material density and structural asymmetry (such as local protrusions or openings). The compensation hole 322 can adjust the position of the center of gravity by removing excess material from the clamping component 32. If the center of gravity is biased to one side, a compensation hole 322 can be opened on the corresponding side to reduce the mass, or a hole can be opened on the opposite side to balance the torque by reducing weight, ultimately ensuring that the center of gravity falls precisely at the rotation center.

[0118] After the rotation center coincides with the center of gravity, the force exerted on the wafer by the clamping component 32 during rotation is more stable and the stress distribution is more uniform. This can reduce mechanical wear and fatigue damage, reduce the maintenance frequency and replacement cost of the clamping component 30, and also ensure the dynamic balance of the clamping component 32, reduce vibration sources during rotation, reduce the overall vibration amplitude and noise level of the equipment, provide a more stable operating environment for wafer drying, and indirectly ensure the consistency of the drying process and the chip yield.

[0119] In some embodiments, such as Figure 10As shown, the wafer pedestal 33 is provided with a boss 332. The boss 332 and the gripper 321 are located on the same straight line along the radial direction of the rotating disk 311. Multiple horizontal drainage grooves 3321 are provided on the boss 332 and penetrate the upper surface of the boss 332.

[0120] The wafer is placed on the boss 332 of the wafer holder 33, further reducing the contact area with the wafer and increasing the bottom space of the wafer, which is beneficial for rotational drying. The boss 332 is provided with multiple horizontal drainage grooves 3321 that extend through the upper surface of the boss 332. The drainage grooves 3321 can promptly drain the liquid between the wafer and the contact surface of the boss 332. When the rotating disk 311 rotates at high speed, the residual liquid on the wafer surface is thrown towards the edge by centrifugal force. The drainage grooves 3321 of the boss 332 act as drainage channels, guiding the liquid to quickly drain radially through the grooves. The boss 332 and the gripper 321 are radially collinear, forming a radial constraint force of support from the boss 332 and clamping from the gripper 321, suppressing radial displacement of the wafer during high-speed rotation.

[0121] In some embodiments, such as Figure 10 As shown, the gripper 321 has a gripping surface 3211 facing the center of rotation. The gripping surface 3211 is inclined, and the upper end of the gripping surface 3211 is closer to the center of rotation than the lower end of the gripping surface 3211.

[0122] The upper end of the inclined clamping surface 3211 is closer to the rotation center than the lower end of the clamping surface 3211. This makes the part of the clamping jaw 321 located on the upper side of the wafer closer to the rotation center after clamping, so that the wafer can no longer move upward. When the rotating disk 311 accelerates, the wafer generates centrifugal force due to inertia. The inclined clamping surface 3211 will be decomposed into a downward force along the inclined surface and a positive force that squeezes the clamping surface 3211. The vertical component force presses the wafer down to the boss 332. With the support of the hydrophobic groove 3321, the axial runout of the wafer during high-speed rotation can be suppressed.

[0123] In some embodiments, such as Figure 10 As shown, each wafer holder 33 is provided with two guide posts 333, which are located on both sides of the assembly slot 331. The guide posts 333 are used to guide the wafer to be placed on the boss 332.

[0124] Wafers are typically very fragile and expensive; any scratches, wear, or cracks on their surface can render them unusable or degrade their performance. Guide pillars 333 provide a clear guiding path for the wafer, allowing it to be placed more precisely on the bosses 332. This helps ensure the wafer is in the correct position during processing or handling, reducing process problems or product quality degradation caused by positional deviations. Guide pillars 333 also prevent the wafer from colliding or rubbing against other components during placement, thus reducing the risk of surface damage.

[0125] In some embodiments, such as Figure 10 As shown, the surface of the wafer pedestal 33 near the rotation center forms two inclined surfaces 334. The two inclined surfaces 334 are symmetrically arranged along the first direction, and the junction of the two inclined surfaces 334 is closer to the rotation center than other positions of the inclined surfaces 334.

[0126] In semiconductor manufacturing, liquid residues may carry impurities or contaminants. If these accumulate at the bottom front of the wafer pedestal 33, they may come into contact with the wafer in subsequent processes, contaminating the wafer surface and affecting its performance and quality. The design of two inclined surfaces 334 allows the liquid to be thrown out along the inclined surfaces during rotation, effectively preventing liquid accumulation, reducing the risk of wafer contamination, and helping to improve product yield.

[0127] Furthermore, if liquid accumulates at the bottom of the wafer holder 33, it may affect the stability of the wafer during rotation, causing slight changes in the wafer's position during processing, which in turn affects the stability and consistency of the process. The design of two inclined surfaces 334 allows the liquid to be thrown out along the inclined surfaces during rotation, ensuring that the wafer holder 33 maintains a relatively stable state during rotation, which helps to improve the repeatability of the process and the consistency of product quality.

[0128] In some embodiments, such as Figure 11 and Figure 12 As shown, the clamping member 32 has an abutment portion 335, and the waterproof cover 40 has an unlocking portion 42. Along the first direction, the unlocking portion 42 is arranged opposite to the abutment portion 335, and the unlocking portion 42 is located above the abutment portion 335. When the unlocking portion 42 abuts against the abutment portion 335, the unlocking portion 42 can drive the clamping member 32 to rotate, so that the gripper 321 moves in a direction away from the center of rotation.

[0129] With the unlocking part 42 and the abutting part 335 arranged relative to each other, the unlocking part 42 is located above the abutting part 335. When the two abut, the clamping part 32 can be rotated by the downward pressure or displacement of the unlocking part 42, so that the gripper 321 automatically opens (away from the center of rotation). No additional power source is required. Unlocking can be triggered by the descent of the waterproof cover 40, which reduces the complexity and cost of the automated equipment.

[0130] Since the waterproof cover 40 needs to be raised and lowered within the water collection base 10, the gripper 321 needs to be in the clamping position when it rises and in the unlocked position when it falls. Therefore, the raising and lowering of the waterproof cover 40 is linked to the opening and closing of the gripper 321, so that the wafer release and the lowering of the waterproof cover 40 are completed synchronously. At the same time, the unlocking part 42 and the abutment part 335 are arranged opposite each other along the first direction (vertical direction), which occupies little radial space of the equipment, resulting in a compact structure and space saving.

[0131] In some embodiments, such as Figure 12 and Figure 13 As shown, the extension 3111 has a drive member mounting hole 31111 on the side away from the rotation center. A push rod 31112 is provided in the drive member mounting hole 31111. The clamping drive member 80 is disposed between the push rod 31112 and the drive member mounting hole 31111. The force of the clamping drive member 80 is used to push the push rod 31112 against the clamping member 32 so that the clamping member 32 is kept in the clamping position.

[0132] The clamping drive unit 80 holds the clamping member 32 in the clamping position through the push rod 31112, which can ensure the positional accuracy of the clamping member 32. Since the drive unit mounting hole 31111 plays a positioning role for the push rod 31112, the movement direction of the push rod 31112 is stabilized, thereby ensuring that the clamping member 32 can accurately return to the preset clamping position during the reset process, improving the consistency and accuracy of wafer clamping.

[0133] The drive component mounting hole 31111 provides a stable mounting structure for the push rod 31112 and the clamping drive component 80, making the force transmission of the entire clamping assembly 30 more stable. The push rod 31112 is constrained within the drive component mounting hole 31111, making it less prone to shaking or displacement. It can more reliably transmit the force of the clamping drive component 80 to the clamping component 32, reducing the possibility of force changes or accidental loosening of the clamping component 32 due to structural instability, and improving the stability and reliability of equipment operation.

[0134] The clamping drive 80 automatically holds the clamping member 32 in the clamping position, eliminating the need for operators to manually adjust the position of the clamping member 32 after each operation. This reduces the number of manual operation steps, lowers the probability of operational errors caused by human factors, and improves the automation level and efficiency of wafer loading, unloading, and processing.

[0135] In some embodiments, such as Figure 12 and Figure 13 As shown, the drive component mounting hole 31111 is a stepped countersunk hole, which corresponds to the clamping component 32. The push rod 31112 has a push rod head 311121 protruding from the stepped countersunk hole. The diameter of the push rod head 311121 is larger than the outer diameter of the push rod body 31112. The clamping drive component 80 is a second spring 81, which is sleeved on the push rod 31112. One end of the second spring 81 abuts against the push rod head 311121, and the other end of the second spring 81 abuts against the stepped surface 31111a of the stepped countersunk hole.

[0136] When the unlocking part 42 abuts against the abutting part 335, the unlocking part 42 can drive the clamping member 32 to rotate, so that the push rod 31112 continues to move towards the stepped countersunk hole, and the gripper 321 is in the unlocked position. When the unlocking part 42 moves away from the clamping member 32, the second spring 81 returns to its original position, and the push rod head 311121 pushes the clamping member 32 to keep the clamping member 32 in the clamping position. The second spring 81 is sleeved on the push rod 31112 and installed using the stepped countersunk hole. This structural design makes the layout of the entire clamping mechanism more compact and occupies less space.

[0137] The stepped countersunk hole provides a precise installation position and movement guide for the push rod 31112, ensuring that the push rod 31112 can only move along the axial direction of the stepped countersunk hole. The stepped surface 31111a of the stepped countersunk hole provides stable support and positioning points for the second spring 81. One end of the second spring 81 abuts against the stepped surface 31111a, and the other end abuts against the push rod head 311121, allowing the spring to maintain a stable posture during compression and reset, preventing tilting or displacement. This ensures that the spring force can be accurately transmitted to the push rod 31112 and the clamping member 32, effectively realizing the reset function of the clamping member 32. At the same time, this structure also facilitates the installation and replacement of the spring, reducing the difficulty of equipment maintenance.

[0138] The diameter of the push rod head 311121 is larger than the outer diameter of the rod body, forming a shoulder structure that provides a mounting point for the second spring 81. When the second spring 81 is compressed and reset, the push rod head 311121 can better withstand the spring force and evenly transmit the force to the clamping member 32. Through the cooperation of the unlocking part 42 and the abutment part 335, when the unlocking part 42 abuts against the abutment part 335, it can drive the clamping member 32 to rotate, causing the push rod 31112 to move into the stepped countersunk hole, thereby unlocking the gripper 321. When the unlocking part 42 moves away from the clamping member 32, the second spring 81 resets and pushes the push rod head 311121, causing the clamping member 32 to return to the clamping position, thus realizing flexible control over the unlocking and clamping states of the gripper 321.

[0139] In other embodiments, the clamping drive 80 can also be a tension spring. The tension spring is placed between the wafer mount and the clamping member. When the clamping member 32 rotates from the clamping position to the unlocking position, the tension spring is stretched and accumulates elastic force. When the constraint is released (the waterproof cover is removed), the tension spring contracts and drives the clamping member 32 to return to the clamping position.

[0140] In some embodiments, such as Figure 12 and Figure 13 As shown, the drying apparatus with wafer clamping assembly also includes a detection sensor 90. When the clamping member 32 is in the clamping position, it overlaps with the transmitter 91 of the detection sensor 90. When the clamping member 32 is in the unlocked position, it avoids the transmitter 91 of the detection sensor 90.

[0141] By detecting the overlap and avoidance relationship between the sensor 90 and the clamping member 32 at different positions, it is possible to accurately determine whether the clamping member 32 is in the clamping position or the unlocked position. This helps to ensure that the equipment operates according to the predetermined program and avoids process errors or equipment damage caused by misjudgment of the clamping state.

[0142] During the wafer drying process, accurately knowing whether the wafer is correctly clamped is crucial to ensuring process quality. The detection sensor 90 can provide real-time feedback on the status of the clamping component 32. Once a clamping abnormality is detected, such as the clamping component 32 not being in the correct clamping position, the equipment can immediately stop operation or issue an alarm, thereby preventing the wafer from shifting or falling during the drying process. This improves the reliability and stability of the entire process and reduces the defect rate caused by wafer clamping problems.

[0143] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A drying apparatus with a wafer clamping assembly, characterized in that, include: Water collection base, the water collection base having a receiving cavity; A clamping assembly includes a support member and a clamping member connected to each other. The support member is rotatably disposed within the water collection base and is used to place the wafer. The clamping member is rotatably disposed on the support member and is movable between a clamping position for clamping the wafer and an unlocking position for disengaging from the wafer. A waterproof cover is located on the outer periphery of the clamping assembly. The waterproof cover is slidably disposed relative to the water collection seat. When the waterproof cover is configured to abut against the clamping member, the clamping member is in the unlocked position. When the waterproof cover is disengaged from the clamping member, the clamping member is in the clamping position under the action of the clamping drive member. The clamping drive member is located between the clamping member and the support member. The clamping member is provided with a compensation hole so that the rotation center of the clamping member and the center of gravity of the clamping member are located at the same position; The support includes a rotating disk with multiple extensions circumferentially arranged around its rotation center. Each extension has a drive member mounting hole on its side away from the rotation center. A push rod is disposed in the drive member mounting hole. The clamping drive member is disposed between the push rod and the drive member mounting hole, and the force of the clamping drive member is used to push the push rod toward the clamping member so that the clamping member is held in the clamping position.

2. The drying apparatus with a wafer clamping assembly according to claim 1, characterized in that, The support includes a rotating shaft located at the bottom of the rotating disk. The rotating shaft is rotatably assembled inside the water collection seat, and a protective cover is fitted around the bottom of the rotating disk on the upper outer periphery of the rotating shaft.

3. The drying apparatus with a wafer clamping assembly according to claim 2, characterized in that, Each of the extensions is provided with a wafer holder for placing the wafer. There are multiple clamping members, each corresponding to one of the multiple wafer holders, and each clamping member is movably disposed on the corresponding wafer holder.

4. The drying apparatus with a wafer clamping assembly according to claim 3, characterized in that, The wafer pedestal is provided with an assembly groove on the side away from the rotation center, and the clamping member is rotatably assembled in the assembly groove. The clamping member includes jaws that extend out of the mounting slot, and a plurality of jaws are used to simultaneously clamp the outer periphery of the wafer.

5. The drying apparatus with a wafer clamping assembly according to claim 4, characterized in that, The wafer pedestal is provided with a boss, and the boss and the gripper are located on the same straight line along the radial direction of the rotating disk. The boss is provided with a plurality of horizontal hydrophobic grooves that penetrate the upper surface of the boss.

6. The drying apparatus with a wafer clamping assembly according to claim 4, characterized in that, The gripper has a gripping surface facing the center of rotation, the gripping surface is inclined, and the upper end of the gripping surface is closer to the center of rotation than the lower end of the gripping surface.

7. The drying apparatus with a wafer clamping assembly according to claim 5, characterized in that, Each wafer mount is provided with two guide posts, which are located on both sides of the mounting slot. The guide posts are used to guide the wafer to be placed on the boss.

8. The drying apparatus with a wafer clamping assembly according to claim 4, characterized in that, The surface of the wafer pedestal near the rotation center forms two inclined surfaces, which are symmetrically arranged in the vertical direction. The junction of the two inclined surfaces is closer to the rotation center than other positions of the inclined surfaces.

9. The drying apparatus with a wafer clamping assembly according to claim 5, characterized in that, The clamping member has an abutment portion, and the waterproof cover has an unlocking portion. The unlocking portion is arranged opposite to the abutment portion and is located above the abutment portion. When the unlocking portion abuts the abutment portion, the unlocking portion can drive the clamping member to rotate, so that the gripper moves in a direction away from the rotation center.

10. The drying apparatus with a wafer clamping assembly according to any one of claims 1-9, characterized in that, The drying apparatus with a wafer clamping assembly further includes a detection sensor, wherein the clamping member has a portion overlapping with the transmitter of the detection sensor when in the clamping position, and the clamping member avoids the transmitter of the detection sensor when in the unlocked position.

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