Wafer clamping device, conveying system and application method thereof

Abstract

The invention relates to the technical field of wafer preparation, and provides a wafer clamping device, a wafer conveying system and an application method thereof.The wafer clamping device comprises a clamp module, a connecting piece and a driving mechanism, the clamp module is provided with two clamp ends, and the two clamp ends are connected through a holder; the two clamp ends are arranged in a stacked mode and face the same side. The connecting piece is arranged on the retainer and is used for separating or butting the retainer, so that the two clamp ends are separated or butted; the driving mechanism is connected with the clamp module, and the driving mechanism is used for driving the clamp module to rotate or linearly displace and applying a force for separating or butting the two clamp ends. According to the invention, the two clamp ends are arranged on the clamp module, the two clamp ends are stacked, and relative position adjustment can be realized through separation or butt joint of the retainers, so that a wafer can be grabbed from a small space conveniently, and miniaturization of related equipment is facilitated; and meanwhile, feeding and discharging from the same side are facilitated, and equipment miniaturization is further facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer preparation, and in particular to a wafer clamping device, a conveying system and an application method thereof. Background Art

[0002] Wafers are silicon chips used to make semiconductor circuits. They are made by purifying polysilicon into silicon crystal rods, and then undergoing processes such as photoengraving, grinding, polishing, and slicing. During the wafer preparation process, residual particles from grinding, polishing, and slicing, as well as the number of particles in the air, will affect the quality and reliability of the wafer. Therefore, the wafer needs to be cleaned to ensure application quality and reliability.

[0003] The existing invention patent application with application publication number CN116936410A discloses a semi-automatic wafer cleaning machine and a wafer cleaning method, including a frame and an electrical control box and a human-computer interaction interface arranged on the frame. A cleaning mechanism is arranged in the cleaning area, and the cleaning mechanism includes a cleaning chamber, a spindle assembly, a brush swing arm, an N2 swing arm and a two-fluid swing arm. The rear end of the frame is provided with an exhaust duct connected to the interior of the cleaning chamber, and the exhaust duct is connected to a water vapor separation mechanism, which includes a strong exhaust fan and a water vapor separation box.

[0004] As in the above technical solution, a cleaning mechanism is installed inside the cleaning machine for cleaning wafers. Current wafer cleaning machines mostly use a dual-clamp structure, with one clamp used to place incoming wafers on the cleaning mechanism and the other clamp used to remove cleaned wafers. This structure makes the wafer cleaning machine relatively large. Especially for cleaning equipment or other processing equipment with unidirectional inflow and outflow, more space is required to arrange the clamp structure to avoid interference between inflow and outflow. In addition to the wafer clamping and transfer structure, a pushing device is also required to push the wafers onto the conveyor assembly, which further leads to the excessive size of the cleaning machine. Summary of the Invention

[0005] In view of this, the present invention proposes a wafer clamping device, a conveying system and an application method thereof with a compact structure and capable of realizing same-directional feeding and discharging, so as to solve the problem that the existing wafer cleaning machine uses two sets of clamps and requires a pushing mechanism, resulting in the wafer cleaning machine being too large.

[0006] The technical solution of the present invention is achieved as follows: In one aspect, the present invention provides a wafer clamping device, comprising a clamping module, a connecting member and a driving mechanism, wherein: The fixture module has two fixture ends, and the two fixture ends are connected by a retaining frame; The two clamp ends are stacked and face the same side; The connecting piece is provided on the retaining frame, and the connecting piece is used to separate or connect the retaining frame so as to separate or connect the two clamp ends; The driving mechanism is connected to the fixture module, and is used to drive the fixture module to rotate or linearly move, and apply a force to separate or dock the two fixture ends.

[0007] On the basis of the above technical solution, preferably, the retaining frame includes a transverse plate and a connecting rod, and each of the transverse plate and the connecting rod is provided with a clamp end, wherein, The horizontal plate is connected to the movable end of the driving mechanism; The connecting rod is arranged on the horizontal plate, and both ends of the connecting rod correspond to the horizontal plate; There are two connecting pieces on the horizontal plate. The connecting pieces are chucks that clamp the connecting rods, or, The connecting piece is a tightening shaft, which is inserted into the interior of the connecting rod and tightened.

[0008] On the basis of the above technical solution, preferably, the clamp end includes a cylinder, a movable end, a steering gear, a telescopic arm and a suction cup, wherein: The cylinder body is provided with one each on the cross plate and the connecting rod; The movable end is in sliding fit with the cylinder body; There are multiple servos on the movable end; One end of the telescopic arm is connected to the main shaft of the steering gear; the suction cup is arranged on the other end of the telescopic arm.

[0009] On the basis of the above technical solution, preferably, the driving mechanism includes a first linear driving member, a rotary driving member and a second linear driving member, wherein, A rotary driving member is mounted on the movable end of the first linear driving member; A second linear driving member is installed at the movable end of the rotary driving member; The movable end of the second linear driving component is connected to the clamp module.

[0010] On the basis of the above technical solution, preferably, the first linear drive component includes a carrier plate, a slide rail, a slider, a connecting rod, a bearing seat, an end plate and a rodless cylinder, wherein, Both sides of the carrier plate are provided with slide rails and sliders that cooperate with each other in a sliding manner; Each slider is provided with two connecting rods, and the connecting rods and the sliders are connected through bearing seats; An end plate is provided on each end of the connecting rod; The rodless cylinder is arranged on the other side of the carrier plate; One of the end plates is connected to the movable end of the rodless cylinder, and the rotary driving member is arranged on the other end plate.

[0011] On the basis of the above technical solution, preferably, the rotary drive member includes a connecting frame, a locking frame and a motor, wherein: There are two connecting frames, each of which is slidably connected to two connecting rods, and the two connecting frames are clamped together; There are two locking frames, each of which is arranged on two connecting rods, and the locking frames are detachably connected to the connecting frames; The motor is clamped between the two connecting frames, and the main shaft of the motor passes through the end plate and is connected to the second linear drive component.

[0012] On the basis of the above technical solution, preferably, the second linear drive member includes a side plate, a connecting plate, a telescopic member and a guide shaft, wherein, A side plate is provided on each side of the connecting plate, and one of the side plates is connected to the main shaft of the motor; The telescopic member is arranged on the connecting plate, and the movable end of the telescopic member is connected to the clamp module; One end of the guide shaft is connected to the fixture module, and the other end is slidably matched with the connecting plate.

[0013] On the other hand, the present invention provides a conveying system, comprising the above-mentioned wafer clamping device, further comprising a pillar, a first conveyor belt, a cylinder, a second conveyor belt, a hanger and a pneumatic clamp, wherein: The pillar and the wafer clamping device are relatively fixed; One end of the first conveyor belt is rotatably connected to the support, and the other end is suspended; The cylinder is rotatably connected to the support, and the movable end of the cylinder is hinged to the first conveyor belt; The second conveyor belt is arranged on the upper side of the first conveyor belt, and one end of the second conveyor belt is connected to the support, and the other end is connected to the hanger, and the hanger is relatively fixed to the support; A pneumatic clamp is respectively provided on both sides of the second conveyor belt, a docking rod is provided on the retaining frame, and the pneumatic clamp clamps the docking rod.

[0014] On the basis of the above technical solution, preferably, it further includes a guide plate, a limiting shaft, a nozzle and a nozzle, wherein, One end of the guide plate is connected to the first conveyor belt, the other end is a free end, and a guide groove is provided on the guide plate; The limiting shaft is arranged on the second conveyor belt, and the limiting shaft is slidably matched with the guide groove; The nozzle is arranged on an end of the guide plate away from the first conveyor belt; The nozzle is connected with the nozzle pipe.

[0015] In another aspect, the present invention provides an application method of the above-mentioned conveying system, comprising the following steps: S1, the first conveyor belt conveys the uncleaned wafers, S2, the pneumatic gripper clamps the docking rod, the holder is in a separated state, and a part of the holder and a clamp end are fixed to the side of the second conveyor belt, S3, the other fixture moves to grab the uncleaned wafer, S4, the driving mechanism is activated, driving the connected fixture end and the uncleaned wafer to flip over, placing the uncleaned wafer at the cleaning station. S5, the driving mechanism moves, driving the connected fixture end to flip and reset, and then the two parts of the retainer are docked. S6. After cleaning is completed, the drive mechanism is activated to turn the fixture module and the connector over. The cleaned wafer is then grabbed by the fixture end near the cleaning station. S7, the driving mechanism is activated to drive the fixture module and the connector to flip over, so as to place the cleaned wafer on the second conveyor belt; S8, repeating the above steps S1 to S7 to achieve continuous cleaning of the wafer; Among them, when the driving mechanism is activated to drive the connected clamp end and the uncleaned wafer to flip, the cylinder is activated to drive the first conveyor belt to tilt to avoid interference between components; When the first conveyor belt is tilted, the second conveyor belt conveys the cleaned wafers. At the same time, high-temperature nitrogen is supplied into the nozzle and sprayed out by the nozzle to dry the cleaned wafers.

[0016] The wafer clamping device, conveying system and application method of the present invention have the following beneficial effects compared with the prior art: (1) By setting two clamp ends on the clamp module, they can be used for clamping uncleaned and cleaned wafers respectively, thereby avoiding contamination problems; since the two clamp ends are stacked and can be adjusted in relative position by separating or docking the retaining frame, it is convenient to grab wafers from a smaller space, which is conducive to the miniaturization of related equipment; at the same time, the clamp module can be flipped and adjusted in linear displacement by the drive mechanism, so it is convenient to load and unload materials from the same side, which is further conducive to the miniaturization of equipment; (2) The holder is equipped with a fixture end through the cross plate and the connecting rod, and a chuck or a tightening shaft is used as a connecting part to facilitate the connection or separation of the cross plate and the connecting rod, thereby making the two fixture ends separable, which has the advantages of simple structure and convenient application; (3) In the fixture end structure, the suction cup is mounted on the movable end of the cylinder through a telescopic arm and a servo. In this way, when working, the suction cup can be extended and rotated by the telescopic arm and the servo, which is convenient for adjusting the suction position of the wafer and also for storage, thereby avoiding interference between the fixture end and other components when the two fixture ends work at the same time; (4) In the driving mechanism structure, the first linear driving member is installed with the rotary driving member through a connecting rod, and the rotary driving member connects the motor and the connecting rod detachably through a locking frame, which is connected to the connecting frame provided on the connecting rod through the locking frame, so as to facilitate disassembly and maintenance; at the same time, the setting of the connecting frame can ensure the relative position of the two connecting rods to be stable, which is conducive to ensuring the movement stability and movement accuracy of the driving member; (5) In the structure of the conveying system, a first conveyor belt and a second conveyor belt of a stacked structure are provided, and the second conveyor belt is installed by a cylinder, which allows the second conveyor belt to swing, so that the two conveyor belts can be arranged more compactly. When the clamp module is in motion, the first conveyor belt can swing under the drive of the cylinder, thereby expanding the space, thus avoiding interference problems during the wafer transfer process, and having the advantage of reasonable structural design; (6) A guide plate is provided on the first conveyor belt, and a limit axis is provided on the second conveyor belt, which can ensure the stability of the movement when the first conveyor belt swings; at the same time, a nozzle and a nozzle are installed on the guide plate. As the first conveyor belt swings, the nozzle and the nozzle will move closer to the cleaned wafers on the second conveyor belt under the drive of the guide plate and perform nitrogen purge, which is conducive to the rapid drying of the wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 is a three-dimensional diagram of the wafer clamping device of the present invention; Figure 2 is an exploded view of the wafer clamping device of the present invention; Figure 3 It is a front view of the wafer clamping device of the present invention; Figure 4 A perspective view of the back structure of the wafer clamping device of the present invention; Figure 5 A three-dimensional diagram of the retracted structure of the second linear drive member of the wafer clamping device of the present invention; Figure 6 is a perspective view of the drive mechanism of the wafer clamping device of the present invention; Figure 7 is a perspective view of the conveying system of the present invention; Figure 8 It is a front view of the conveying system of the present invention; Figure 9is a side view of the conveying system of the present invention; Figure 10 A perspective view of the swing structure of the driving mechanism of the conveying system of the present invention; Figure 11 A schematic diagram of the wafer incoming material structure of the conveying system of the present invention; Figure 12 A schematic diagram of the structure of a fixture module for grabbing a wafer in the conveying system of the present invention; Figure 13 It is a schematic diagram of the swing structure of the first conveyor belt and the driving mechanism of the conveying system of the present invention; Figure 14 This is a schematic diagram of the structure of the conveying system of the present invention with wafers to be cleaned in place; Figure 15 Schematic diagram of the reset structure of the driving mechanism of the conveying system of the present invention; Figure 16 It is a schematic diagram of the synchronous action structure of the two clamp ends of the conveying system of the present invention; Figure 17 It is a schematic diagram of the structure of the conveying system of the present invention in which two clamp ends move synchronously into position; Figure 18 This is a schematic structural diagram of the conveying system of the present invention in which the wafers are transferred to the second conveyor belt after cleaning; In the figure: 1. Clamp module; 11. Clamp end; 111. Cylinder; 112. Movable end; 113. Servo; 114. Telescopic arm; 115. Suction cup; 12. Cage; 121. Cross plate; 122. Connecting rod; 123. Docking rod; 2. Connecting member; 3. Driving mechanism; 31. First linear driving member; 311. Carrier plate; 312. Slide rail; 313. Slider; 314. Connecting rod; 315. Bearing seat; 316. End plate; 317. Rodless cylinder; 32. Rotary drive member; 321. Connecting frame; 322. Locking frame; 323. Motor; 33. Second linear drive member; 331. Side plate; 332. Connecting plate; 333. Telescopic member; 334. Guide shaft; 4. Pillar; 5. First conveyor belt; 6. Cylinder; 7. Second conveyor belt; 8. Hanger; 9. Pneumatic gripper; 10. Guide plate; 1001. Guide groove; 13. Limiting shaft; 14. Nozzle; 15. Nozzle. DETAILED DESCRIPTION

[0019] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0020] like Figures 1 to 18 As shown, the wafer clamping device of the present invention includes a clamping module 1, a connecting part 2 and a driving mechanism 3. The conveying system of the present invention includes the above-mentioned wafer clamping device, and also includes a pillar 4, a first conveyor belt 5, a cylinder 6, a second conveyor belt 7, a hanger 8, a pneumatic clamp 9, a guide plate 10, a limiting shaft 13, a nozzle 14 and a nozzle 15.

[0021] like Figures 1 to 6 As shown, the clamp module 1 has two clamp ends 11, which are connected by a retaining frame 12; the two clamp ends 11 are stacked and face the same side; a connecting member 2 is provided on the retaining frame 12, and the connecting member 2 is used to separate or connect the retaining frame 12, thereby separating or connecting the two clamp ends 11; a driving mechanism 3 is connected to the clamp module 1, and the driving mechanism 3 is used to drive the clamp module 1 to rotate or linearly move, and apply a force to separate or connect the two clamp ends 11; As shown in the above structure, the clamp module 1 is provided with two clamp ends 11. Among the two clamp ends 11, one clamp end 11 is used to clamp the uncleaned wafer, and the other clamp end 11 is used to clamp the cleaned wafer. This can avoid contamination problems and thus ensure the cleaning quality of the wafer. The two clamp ends 11 are integrated on the retaining frame 12, and the retaining frame 12 can be separated or docked, specifically, the retaining frame 12 is divided into two parts, or the two parts of the retaining frame 12 are combined into one, and a clamp end 11 is provided on each part of the retaining frame 12; Among them, the connecting member 2 is used to realize the connection and separation of the two parts of the retaining frame 12; Specifically, during operation, the driving mechanism 3 can drive a portion of the holder 12 and one of the clamp ends 11 to clamp the wafer, and the driving mechanism 3 can also drive the entire holder 12 and the two clamp ends 11 to clamp the wafer; The drive mechanism 3 can drive the fixture module 1 and the connector 2 to achieve linear displacement and flipping, thereby facilitating the transfer of wafers between multiple workstations. At the same time, the driving mechanism 3 also applies a force to separate or connect the two clamp ends 11, which is also a force to connect or separate the retaining frame 12. Through this action, the connecting member 2 can be driven close to the part of the clamp module 1 that is separated; In this structure, since the two clamp ends 11 are stacked and can be adjusted in relative position by separating or docking the retaining frame 12, it is convenient to grab the wafer from a smaller space, which is beneficial to the miniaturization of related equipment; at the same time, the clamp module 1 can rely on the drive mechanism 3 to perform flipping and linear displacement adjustment, so it is convenient to load and unload materials from the same side, which is further beneficial to the miniaturization of the equipment.

[0022] like Figure 1As shown, the holder 12 includes a transverse plate 121 and a connecting rod 122. A clamp end 11 is provided on each of the transverse plate 121 and the connecting rod 122. The transverse plate 121 is connected to the movable end of the driving mechanism 3. The connecting rod 122 is provided on the transverse plate 121, and the two ends of the connecting rod 122 correspond to the transverse plate 121. Two connecting members 2 are provided on the transverse plate 121. The connecting member 2 is a chuck that clamps the connecting rod 122, or the connecting member 2 is an expansion shaft that is inserted into the interior of the connecting rod 122 and expands. As shown in the above structure, the two parts of the retaining frame 12 that can be separated or connected are the cross plate 121 and the connecting rod 122. The driving mechanism 3 is connected to the cross plate 121. In this way, when working, the driving mechanism 3 can drive the cross plate 121 and one clamp end 11 away from the connecting rod 122 and the other clamp end 11, or relatively close to each other; When the horizontal plate 121 and the connecting rod 122 are relatively close to each other, the connecting piece 2 is used to connect the connecting rod 122 to form a complete clamp module 1; The connecting member 2 is configured as a chuck. When the horizontal plate 121 approaches the connecting rod 122 under the drive mechanism 3, the chuck clamps the end of the connecting rod 122 to achieve connection. Alternatively, the connecting member 2 is configured as an expansion shaft. When the horizontal plate 121 approaches the connecting rod 122 under the drive mechanism 3, the expansion shaft is inserted into the connecting rod 122, and then the expansion shaft is tightened and fixed. The fixture module 1 can also be integrated, which has the advantages of simple structure and convenient application. Through the arrangement of the above structure, the shape and volume of the clamp module 1 can be changed, which is convenient for use in a narrow space.

[0023] like Figure 1 As shown, the fixture end 11 includes a cylinder 111, a movable end 112, a steering gear 113, a telescopic arm 114 and a suction cup 115, wherein the cylinder 111 is provided with one on each of the cross plate 121 and the connecting rod 122; the movable end 112 is slidably engaged with the cylinder 111; the steering gear 113 is provided with multiple on the movable end 112; one end of the telescopic arm 114 is connected to the main shaft of the steering gear 113; and the suction cup 115 is provided on the other end of the telescopic arm 114. As shown in the above structure, when the clamp end 11 is working, the cylinder 111 can drive the movable end 112 to retract or retract, thereby driving the wafer to achieve a small distance adjustment, and then relying on the driving mechanism 3 to drive the clamp module 1 to move, which can achieve a large distance adjustment; Specifically, when performing a grabbing or placing operation, the cylinder 111 can drive the movable end 112 to move closer to or away from the wafer, facilitating fine adjustment of the distance between the wafer grabbing and placement; Among them, the clamp end 11 relies on the suction cup 115 to grab the wafer or wafer carrier, thereby driving the wafer to move; Specifically, the suction cup 115 is a ceramic suction cup, which has the advantages of good stability and reliable application, and can avoid interference from factors such as static electricity and impurities affecting wafer quality; The suction cup 115 is extended and rotated by the telescopic arm 114 and the servo 113, which facilitates adjustment of the suction position of the wafer and facilitates storage, thereby avoiding interference between the clamp end 11 and other components when the two clamp ends 11 work simultaneously. Specific as Figure 5 As shown, when the two clamp ends 11 move synchronously, the telescopic arm 114 of the non-working clamp end 11 retracts, and the servo 113 drives the telescopic arm 114 and the suction cup 115 to rotate, so that the telescopic arm 114 is parallel to the horizontal plate 121, thereby reducing the volume to prevent interference problems; when processing different types of wafers, this structure can also adjust the grasping range of the clamp end to adapt to the transfer of wafers of different sizes.

[0024] like Figure 4 As shown, the driving mechanism 3 includes a first linear driving member 31, a rotary driving member 32, and a second linear driving member 33, wherein the movable end of the first linear driving member 31 is mounted with the rotary driving member 32; the movable end of the rotary driving member 32 is mounted with the second linear driving member 33; the movable end of the second linear driving member 33 is connected to the clamp module 1; As shown in the above structure, the driving mechanism 3 is provided with three driving parts, thereby realizing multi-degree-of-freedom adjustment of the clamp module 1; Among them, the first linear drive member 31 is used to drive the clamp module 1 to move linearly, thereby realizing the position adjustment of the clamp module 1, so that the clamp end 11 can place the wafer on the cleaning station or the conveyor belt; The rotary drive member 32 is used to drive the fixture module 1 to flip so as to move the wafer between the cleaning station and the conveyor belt. This structure allows adjustment by simply rotating it in place, which is conducive to miniaturization of the structure and increases the transfer speed. The second linear drive member 33 is also used to drive the clamp module 1 to move linearly, thereby adjusting the distance between the clamp end 11 and the wafer, and the distance between the wafer and the cleaning station and the loading and unloading station; At the same time, this structure can adjust the distance between the clamp end 11 and the work station, so that the two stacked clamp ends 11 can selectively clamp the wafer at the same position through any one of them, thereby improving the convenience of application.

[0025] like Figure 2 and Figure 6As shown, the first linear drive member 31 includes a carrier plate 311, a slide rail 312, a slider 313, a connecting rod 314, a bearing seat 315, an end plate 316 and a rodless cylinder 317, wherein the two sides of the carrier plate 311 are provided with slide rails 312 and sliders 313 that cooperate with each other in a sliding manner; each slider 313 is correspondingly provided with two connecting rods 314, and the connecting rods 314 and the sliders 313 are connected through the bearing seat 315; an end plate 316 is provided on each end of the connecting rod 314; the rodless cylinder 317 is provided on the other side of the carrier plate 311; one of the end plates 316 is connected to the movable end of the rodless cylinder 317, and the rotary drive member 32 is provided on the other end plate 316; As in the above structure, the carrier plate 311 is a supporting base, which is used to connect with the frame of the equipment, thereby supporting the driving mechanism 3, the connecting member 2 and the clamp module 1; The connecting rod 314 is slidably engaged with the slide rail 312 on the carrier plate 311 through the slider 313. An end plate 316 is provided at the end of the connecting rod 314. One of the end plates 316 is connected to the movable end of a rodless cylinder 317 mounted on the carrier plate 311. In this way, the rodless cylinder 317 can drive the connecting rod 314 to slide. The other end of the connecting rod 314 is also provided with an end plate 316 for mounting the rotary drive member 32. In this way, driven by the rodless cylinder 317, both the rotary drive member 32 and the second linear drive member 33 can be moved, thereby achieving lateral position adjustment, which is beneficial for adjusting the wafer position. Specifically, four connecting rods 314 are provided and arranged on both sides of the carrier plate 311. In this way, the end plate 316 is connected to the four connecting rods 314, playing the role of integrating the connecting rods 314. In conjunction with the installation and fixation of the bearing seat 315 on the slider 313, the overall structure can be ensured to be stable. Specifically, the connecting rod 314 and the end plate 316 are connected by fasteners such as bolts to facilitate disassembly, assembly and replacement, thereby improving operation and maintenance convenience.

[0026] like Figure 2 and Figure 6 As shown, the rotary drive member 32 includes a connecting frame 321, a locking frame 322 and a motor 323, wherein two connecting frames 321 are provided, each connecting frame 321 is slidably connected to two connecting rods 314, and the two connecting frames 321 are clamped together; two locking frames 322 are provided, each locking frame 322 is set on two connecting rods 314, and the locking frames 322 and the connecting frames 321 are detachably connected; the motor 323 is clamped between the two connecting frames 321, and the main shaft of the motor 323 passes through the end plate 316 and is connected to the second linear drive member 33; As described above, the rotary drive member 32 is connected to the connecting rod 314 by means of the connecting frame 321 and the locking frame 322; The two connecting frames 321 are slidably fitted with the two connecting rods 314 to facilitate assembly and disassembly on the connecting rods 314. The connecting frames 321 are used to mount the motor 323. Since the connecting frames 321 are provided with two parts that can be engaged with each other, it is convenient to assemble the motor 323 and has good structural stability. The locking frame 322 is connected to the two connecting rods 314, which can ensure the relative position of the two connecting rods 314 is stable, thereby facilitating the stable and precise operation of the driving member. At the same time, the locking frame 322 and the connecting frame 321 are detachably connected, specifically by bolts for connection and locking, so as not to interfere with the disassembly work of the connecting frame 321 and the motor 323, thereby facilitating operation and maintenance work.

[0027] like Figure 2 and Figure 6 As shown, the second linear drive member 33 includes a side plate 331, a connecting plate 332, a telescopic member 333 and a guide shaft 334, wherein one side plate 331 is provided on each side of the connecting plate 332, and one of the side plates 331 is connected to the main shaft of the motor 323; the telescopic member 333 is provided on the connecting plate 332, and the movable end of the telescopic member 333 is connected to the clamp module 1; one end of the guide shaft 334 is connected to the clamp module 1, and the other end is slidably engaged with the connecting plate 332; As in the above structure, the second linear drive member 33 is used to drive the clamp module 1 to move linearly; The connecting plate 332 is used as a carrier, on which the telescopic member 333 and the guide shaft 334 are installed. The telescopic member 333 adopts a multi-stage telescopic cylinder, which can reduce the volume and avoid interference problems during assembly. During adjustment, the telescopic member 333 drives the clamp module 1 and the wafer to move so as to transfer them between the conveying station and the cleaning station, while the guide shaft 334 simultaneously telescopes to play a guiding role, thereby ensuring stable movement; The connecting plate 332 is provided with side plates 331 on both sides. One of the side plates 331 is connected to the main shaft of the motor 323 so that the rotary drive member 32 can be driven to rotate. The other side plate 331 is used to connect the supporting component. The supporting component is rotatably connected to the side plate 331 so that the suspended second linear drive member 33 can ensure stable movement. Specifically, the support component is slidably matched with the equipment frame to avoid interfering with the movement of the first linear drive member 31.

[0028] like Figures 7 to 18As shown, the pillar 4 is relatively fixed to the wafer clamping device; one end of the first conveyor belt 5 is rotatably connected to the pillar 4, and the other end is suspended; the cylinder 6 is rotatably connected to the pillar 4, and the movable end of the cylinder 6 is hinged to the first conveyor belt 5; the second conveyor belt 7 is arranged on the upper side of the first conveyor belt 5, and one end of the second conveyor belt 7 is connected to the pillar 4, and the other end is connected to the hanger 8, and the hanger 8 is relatively fixed to the pillar 4; a pneumatic clamp 9 is provided on each side of the second conveyor belt 7, and a docking rod 123 is provided on the retaining frame 12, and the pneumatic clamp 9 clamps the docking rod 123; As shown in the above structure, the support 4 is used to connect the equipment frame to support the first conveyor belt 5 and the second conveyor belt 7. The second conveyor belt 7 is also connected to the hanger 8, which is also connected to the equipment frame, so that the second conveyor belt 7 is installed and fixed. Since one end of the first conveyor belt 5 is rotatably connected to the support 4, a cylinder 6 is provided to connect the support 4 to the first conveyor belt 5, thereby ensuring that the position of the first conveyor belt 5 is fixed; during operation, the cylinder 6 can drive the first conveyor belt 5 to swing, thereby adjusting the distance between the suspended end of the first conveyor belt 5 and the second conveyor belt 7, which facilitates the removal of wafers and avoids the problem of wafer transfer interference; Specifically, during operation, the first conveyor belt 5 conveys the uncleaned wafers. At this time, the pneumatic clamp 9 on the second conveyor belt 7 clamps the docking rod 123, so that the connecting rod 122 and one clamp end 11 are fixed on the second conveyor belt 7. At this time, the connection between the connecting member 2 and the connecting rod 122 is disconnected. Then, driven by the second linear drive member 33, the cross plate 121 and the other clamp end 11 will move to separate the holding frame 12. Subsequently, driven by the rotary drive member 32, the clamp end 11 will flip over to facilitate clamping the wafer and sending it to the cleaning station. During this flipping process, the cylinder 6 synchronously drives the first conveyor belt 5 to swing to adjust the distance with the second conveyor belt 7, and the second linear drive member 33 synchronously retracts to prevent the wafer from interfering with the other clamp end 11 and the first conveyor belt 5; After the wafer is transferred to the cleaning station, the rotary drive member 32 drives the clamp end 11 to flip and reset, and relies on the second linear drive member 33 to drive the cross plate 121 to move closer to the connecting rod 122, so that it can be connected to the connecting rod 122 again through the connecting member 2.

[0029] like Figures 7 to 10 As shown, one end of the guide plate 10 is connected to the first conveyor belt 5, and the other end is a free end, and a guide groove 1001 is formed on the guide plate 10; a limiting shaft 13 is provided on the second conveyor belt 7, and the limiting shaft 13 is slidably engaged with the guide groove 1001; a nozzle 14 is provided on the end of the guide plate 10 away from the first conveyor belt 5; a nozzle 15 is connected and communicated with the nozzle 14; As shown in the above structure, when the cylinder 6 synchronously drives the first conveyor belt 5 to swing, the guide plate 10 will slide and guide with the limit shaft 13 through the guide groove 1001, thereby ensuring the stability of the movement; At the same time, since the first conveyor belt 5 drives the guide plate 10 to move, the guide plate 10 will drive the nozzle 14 and the nozzle 15 to move so that the nozzle 15 is close to the cleaned wafer. At this time, high-temperature nitrogen is supplied to the inside of the nozzle 14 and sprayed out by the nozzle 15 to dry the cleaned wafer. It has the advantages of reasonable structure and good function.

[0030] The application method of the conveying system of the present invention comprises the following steps: S1, such as Figure 11 As shown, the uncleaned wafers are transported by the first conveyor belt 5. S2, such as Figure 12 As shown, the pneumatic clamp 9 clamps the docking rod 123, the retaining frame 12 is in a separated state, and a part of the retaining frame 12 and a clamp end 11 are fixed to the side of the second conveyor belt 7. S3, the other clamp end 11 moves to grab the uncleaned wafer, S4, such as Figure 13 and Figure 14 As shown, the driving mechanism 3 is activated, driving the connected clamp end 11 and the uncleaned wafer to flip over, placing the uncleaned wafer at the cleaning station. S5, such as Figure 15 As shown, the driving mechanism 3 is activated, driving the clamp end 11 connected thereto to flip and reset, and then the two parts of the retaining frame 12 are docked. S6, such as Figure 16 and Figure 17 As shown, after cleaning is completed, the drive mechanism 3 is activated, driving the clamp module 1 and the connector 2 to flip, and then the clamp end 11 close to the cleaning station grabs the cleaned wafer. During this process, the clamp end 11 grabbing the uncleaned wafer does not move, and the suction cup 115 is extended and rotated by the telescopic arm 114 and the steering gear 113 to achieve storage. At the same time, the second linear drive member 33 retracts to avoid interference problems. S7, such as Figure 18 As shown, the driving mechanism 3 is actuated to drive the clamp module 1 and the connecting member 2 to flip over, so as to place the cleaned wafer on the second conveyor belt 7; S8, repeating the above steps S1 to S7 to achieve continuous cleaning of the wafer; Among them, when the driving mechanism 3 is activated to drive the connected clamp end 11 and the uncleaned wafer to flip, the cylinder 6 is activated to drive the first conveyor belt 5 to tilt to avoid interference between components; When the first conveyor belt 5 is tilted, the second conveyor belt 7 conveys the cleaned wafers. At the same time, high-temperature nitrogen is supplied into the nozzle 14 and sprayed out by the nozzle 15 to dry the cleaned wafers.

[0031] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer clamping device, characterized in that: It comprises a clamp module (1), a connecting member (2) and a driving mechanism (3), wherein: The clamp module (1) has two clamp ends (11), and the two clamp ends (11) are connected via a retaining frame (12); The two clamp ends (11) are stacked and face the same side; The connecting member (2) is arranged on the retaining frame (12), and the connecting member (2) is used to separate or dock the retaining frame (12), so as to separate or dock the two clamp ends (11); The driving mechanism (3) is connected to the clamp module (1), and the driving mechanism (3) is used to drive the clamp module (1) to rotate or linearly move, and to apply a force to separate or dock the two clamp ends (11).

2. The wafer clamping device according to claim 1, wherein: The retaining frame (12) comprises a transverse plate (121) and a connecting rod (122), wherein each of the transverse plate (121) and the connecting rod (122) is provided with a clamp end (11), wherein: The transverse plate (121) is connected to the movable end of the driving mechanism (3); The connecting rod (122) is arranged on the transverse plate (121), and both ends of the connecting rod (122) correspond to the transverse plate (121); Two connecting members (2) are provided on the transverse plate (121), and the connecting members (2) are chucks that clamp the connecting rod (122), or, The connecting piece (2) is a tightening shaft, which is inserted into the interior of the connecting rod (122) and tightened.

3. The wafer clamping device according to claim 2, wherein: The clamp end (11) includes a cylinder (111), a movable end (112), a steering gear (113), a telescopic arm (114) and a suction cup (115), wherein: The cylinder (111) is provided with one on each of the transverse plate (121) and the connecting rod (122); The movable end (112) is in sliding engagement with the cylinder body (111); The servos (113) are provided with a plurality of them on the movable end (112); One end of the telescopic arm (114) is connected to the main shaft of the steering gear (113); The suction cup (115) is arranged on the other end of the telescopic arm (114).

4. The wafer clamping device according to any one of claims 1 to 3, wherein: The driving mechanism (3) comprises a first linear driving member (31), a rotary driving member (32) and a second linear driving member (33), wherein: The rotary driving member (32) is mounted on the movable end of the first linear driving member (31); The second linear driving member (33) is installed at the movable end of the rotary driving member (32); The movable end of the second linear drive member (33) is connected to the clamp module (1).

5. The wafer holding device according to claim 4, wherein: The first linear drive member (31) includes a carrier plate (311), a slide rail (312), a slider (313), a connecting rod (314), a bearing seat (315), an end plate (316) and a rodless cylinder (317), wherein: The two side surfaces of the carrier plate (311) are provided with the slide rail (312) and the slider (313) that cooperate with each other in a sliding manner; Each slider (313) is correspondingly provided with two connecting rods (314), and the connecting rods (314) are connected to the slider (313) via the bearing seat (315); The end plates (316) are each provided at both ends of the connecting rod (314); The rodless cylinder (317) is arranged on the other side of the carrier plate (311); One of the end plates (316) is connected to the movable end of the rodless cylinder (317), and the rotary drive member (32) is arranged on the other end plate (316).

6. The wafer clamping device according to claim 5, wherein: The rotary drive member (32) includes a connecting frame (321), a locking frame (322) and a motor (323), wherein: Two connecting frames (321) are provided, each connecting frame (321) is slidably connected to two connecting rods (314), and the two connecting frames (321) are clamped together; Two locking frames (322) are provided, each locking frame (322) is provided on two connecting rods (314), and the locking frame (322) is detachably connected to the connecting frame (321); The motor (323) is clamped between the two connecting frames (321), and the main shaft of the motor (323) passes through the end plate (316) and is connected to the second linear drive member (33).

7. The wafer holding device according to claim 6, wherein: The second linear drive member (33) comprises a side plate (331), a connecting plate (332), a telescopic member (333) and a guide shaft (334), wherein: One side plate (331) is provided on each side of the connecting plate (332), and one of the side plates (331) is connected to the main shaft of the motor (323); The telescopic member (333) is arranged on the connecting plate (332), and the movable end of the telescopic member (333) is connected to the clamp module (1); One end of the guide shaft (334) is connected to the clamp module (1), and the other end is slidably engaged with the connecting plate (332).

8. A conveying system, characterized in that: The wafer clamping device according to any one of claims 1 to 7 further comprises a support (4), a first conveyor belt (5), a cylinder (6), a second conveyor belt (7), a hanger (8) and a pneumatic clamp (9), wherein: The pillar (4) is fixed relative to the wafer clamping device; One end of the first conveyor belt (5) is rotatably connected to the support (4), and the other end is suspended; The cylinder (6) is rotatably connected to the support (4), and the movable end of the cylinder (6) is hinged to the first conveyor belt (5); The second conveyor belt (7) is arranged on the upper side of the first conveyor belt (5), and one end of the second conveyor belt (7) is connected to the pillar (4), and the other end is connected to the hanger (8), and the hanger (8) is relatively fixed to the pillar (4); The pneumatic clamping jaws (9) are each provided on both sides of the second conveyor belt (7), a docking rod (123) is provided on the retaining frame (12), and the pneumatic clamping jaws (9) clamp the docking rod (123).

9. The conveying system according to claim 8, wherein: It also includes a guide plate (10), a limiting shaft (13), a nozzle (14) and a nozzle (15), wherein: One end of the guide plate (10) is connected to the first conveyor belt (5), and the other end is a free end, and a guide groove (1001) is provided on the guide plate (10); The limiting shaft (13) is arranged on the second conveyor belt (7), and the limiting shaft (13) is slidably matched with the guide groove (1001); The nozzle (14) is arranged on an end of the guide plate (10) away from the first conveyor belt (5); The nozzle (15) is connected to and communicates with the nozzle (14).

10. A method for using the conveying system according to claim 9, characterized in that: The following steps are involved: S1, conveying uncleaned wafers by the first conveyor belt (5), S2, the pneumatic clamp (9) clamps the docking rod (123), the retaining frame (12) is in a separated state, and a part of the retaining frame (12) and one of the clamp ends (11) are fixed to the side of the second conveyor belt (7), S3, the other clamp end (11) moves to grab the uncleaned wafer, S4, the driving mechanism (3) is activated to drive the connected clamp end (11) and the uncleaned wafer to flip over, and the uncleaned wafer is placed in the cleaning station. S5, the driving mechanism (3) is actuated to drive the connected clamp end (11) to flip and reset, and then the two parts of the retaining frame (12) are docked. S6. After cleaning is completed, the driving mechanism (3) is activated to drive the clamp module (1) and the connecting member (2) to flip over, and then the clamp end (11) near the cleaning station grabs the cleaned wafer. S7, the driving mechanism (3) is actuated to drive the clamp module (1) and the connecting member (2) to flip over, so as to place the cleaned wafer on the second conveyor belt (7); S8, repeating the above steps S1 to S7 to achieve continuous cleaning of the wafer; When the driving mechanism (3) is actuated to drive the connected clamp end (11) and the uncleaned wafer to flip, the cylinder (6) is actuated to drive the first conveyor belt (5) to tilt to avoid interference between components; When the first conveyor belt (5) is tilted, the second conveyor belt (7) conveys the cleaned wafers. At the same time, high-temperature nitrogen is supplied into the nozzle (14) and sprayed out by the nozzle (15) to dry the cleaned wafers.

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