Chip heat dissipation packaging structure

Abstract

The application provides a chip heat dissipation packaging structure and belongs to the technical field of chip packaging. The chip heat dissipation packaging structure comprises a packaging substrate, a packaging cover plate and a chip. The bottom of the chip is provided with chip pins. The application further comprises a positioning frame and a heat dissipation assembly. A double electrical connection path is adopted to combine the chip side wall and the outgoing pin to be in contact. When the main connection fails, the standby path can maintain the circuit conduction. An upper and lower double-sided heat dissipation main channel is constructed, and the heat is uniformly distributed through the phase change material of the heat plate. In combination with the heat transfer frame and the external airflow, the chip and the pin are efficiently and comprehensively cooled. The condensing plate, the air bag and other components form a targeted heat dissipation cycle to solve the problem of local overheating of the pin and effectively reduce the temperature of the chip and the key parts. Through the cooperation of the positioning boss and the clamping groove, the automatic sealing of the air bag and other designs, multiple sealing is realized, a dustproof and waterproof closed loop protection is formed, the service life of the packaging structure is prolonged, and the application requirements in harsh environments are met.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and more specifically, to a chip heat dissipation packaging structure. Background Technology

[0002] Chips typically contain many delicate circuits. If these circuits are directly exposed to air, they will be corroded by impurities, harmful gases, and water vapor, leading to a decline in their electrical performance. Chip packaging technology is a process that encapsulates the delicate circuits inside a chip, preventing them from contacting the outside environment and effectively protecting these internal circuits.

[0003] Traditional packaging structures have a relatively simple heat dissipation path, typically relying solely on heat dissipation components at the top or bottom of the chip for heat conduction and dissipation. However, chip pins, as critical components connecting the chip to external circuits, generate Joule heat when transmitting high current or high-frequency signals. Traditional heat dissipation designs do not fully consider the special heat dissipation requirements of pins, making it difficult to quickly dissipate heat. This leads to continuous temperature accumulation in the pin area. For example, in high-performance CPUs (central processing units) used in servers, there are numerous pins and high current density. Traditional packaging cannot dissipate the heat from the pins in time, easily causing localized overheating in the pin area, leading to signal attenuation, solder joint failure, and other malfunctions, severely restricting chip performance. In addition, traditional packaging often uses simple glue sealing or gasket sealing methods. During long-term use, these sealing structures are prone to aging and cracking due to environmental factors such as temperature cycling and humidity changes. This allows external dust, moisture, and other contaminants to penetrate the package, corroding the chip and electrical connections, and shortening the chip's lifespan.

[0004] How to invent a chip heat dissipation packaging structure to solve these problems has become an urgent issue for those skilled in the art. Summary of the Invention

[0005] To overcome the above deficiencies, the present invention provides a chip heat dissipation packaging structure, which aims to solve the problems mentioned in the background.

[0006] This invention is implemented as follows:

[0007] This invention provides a chip heat dissipation packaging structure, including a packaging substrate, a packaging cover plate, and a chip. The chip has chip pins on its bottom, and the structure also includes:

[0008] Positioning frame: The positioning frame is disposed between the packaging substrate and the packaging cover plate, and the chip is installed inside the positioning frame;

[0009] Encapsulated heat dissipation component: The encapsulated heat dissipation component is disposed within the encapsulation substrate and the encapsulation cover plate.

[0010] Preferably, a plurality of lead-out pins are soldered to the upper side of the packaging substrate, and chip pin slots corresponding to the chip pins are opened on the upper side of the packaging substrate. The positioning frame is fastened to the packaging substrate, and a positioning post is provided on the lower side of the positioning frame. The packaging substrate is provided with positioning holes that match the positioning post. An upper slot and a lower slot are opened on the side frame of the positioning frame corresponding to the lead-out pins. A positioning boss and a connecting platform are fixedly connected to the lower side of the packaging cover. The positioning boss matches the upper slot, the outer side of the connecting platform is flush with the outer side of the packaging cover, and the inner side of the connecting platform is connected to the end of the positioning boss. A pad mounting groove is opened on the upper side of the packaging substrate corresponding to the short side of the positioning frame, and a pad is interference-fitted into the pad mounting groove.

[0011] Preferably, after the chip is fixed on the packaging substrate by the chip pins, its sidewall is in contact with the inner end of the lead-out pin; the upper sidewall of the lead-out pin is flush with the top wall of the packaging substrate; after the positioning frame is fixed on the packaging substrate, its bottom wall abuts against the upper surface of the lead-out pin and the pad.

[0012] Preferably, a mounting sleeve is fixedly connected to the lower side of the connecting platform, and a mounting hole is opened on the packaging substrate corresponding to the mounting sleeve. A washer and a screw are provided in the mounting hole. During assembly, the positioning frame is first fixed on the packaging substrate, then the chip is installed in the positioning frame, then the packaging cover is fastened on the packaging substrate, and finally the screw is screwed into the mounting sleeve to complete the assembly.

[0013] Preferably, a condenser plate is fixedly connected inside the lower slot, and several insertion holes are opened on the upper slot corresponding to the lead-out pins. The end of the insertion hole passes through the upper slot and the side wall of the condenser plate. An air bag is fixedly connected to the bottom of the condenser plate. The lower side wall of the air bag is flush with the bottom wall of the positioning frame. An installation cylinder is slidably connected inside the insertion hole. The lower end of the installation cylinder abuts against the upper side wall of the air bag. The air bag is made of thermally conductive silicone material.

[0014] Preferably, before the encapsulation cover is assembled, the upper end of the mounting cylinder is located above the bottom wall of the upper slot. When the encapsulation cover is assembled with the encapsulation substrate, the positioning boss squeezes the upper end of the mounting cylinder, causing the mounting cylinder to shift. At this time, its lower end acts on the upper wall of the airbag, causing the airbag to fully inflate, thereby increasing the sealing effect at the connection between the positioning frame and the lead-out pin.

[0015] Preferably, the heat dissipation assembly includes a heat spreader, a lower heat conduction plate, an upper heat conduction plate, and a receiving cavity inside the mounting cylinder. A heat transfer frame and a heat conduction pillar are fixedly connected to the upper sidewall of the heat spreader. The bottom wall of the packaging substrate has a plate groove matching the heat spreader and a frame groove matching the heat transfer frame. The upper sidewall of the packaging substrate has a positioning groove matching the lower heat conduction plate. Several through holes are formed between the positioning groove and the frame groove, and these through holes match the heat conduction pillars. The upper heat conduction plate is embedded inside the packaging cover plate. A heat conduction boss is fixedly connected to the upper side of the upper heat conduction plate. The upper side of the packaging cover plate has a through hole matching the heat conduction boss. An embedding groove is provided inside the packaging cover plate corresponding to the through hole. A sealing ring is interference-fitted into the embedding groove. Thermal grease is applied between the lower side of the upper heat conduction plate and the top wall of the chip. The upper sidewall of the lower heat conduction plate abuts against the bottom wall of the chip, and the lower sidewall of the lower heat conduction plate abuts against the top of the heat conduction pillar.

[0016] Preferably, a heat dissipation channel is provided inside the encapsulation cover plate corresponding to the mounting cylinder. A filter port is installed in the upper end of the heat dissipation channel. The filter port is configured with a small outer port and a large inner port. A plug-in port is fixedly connected to the lower end of the heat dissipation channel. When the encapsulation substrate and the encapsulation cover plate are assembled, the plug-in port is nested in the receiving cavity. The heat dissipation channel is configured in a bent inverted L shape. A tapered portion is provided on the outer wall of the mounting cylinder. When the encapsulation substrate and the encapsulation cover plate are assembled, the end of the tapered portion is engaged in the bottom plug hole. A plurality of air guide holes are provided on the mounting cylinder above the tapered portion. The end of the air guide holes penetrates the side wall of the mounting cylinder and the inner cavity of the receiving cavity.

[0017] Preferably, the side wall of the encapsulation cover is provided with a fin mounting groove, and a fin is inserted and installed in the fin mounting groove. The side wall of the fin located in the encapsulation cover abuts against the side wall of the upper heat-conducting plate. The upper heat-conducting plate, heat-conducting boss, fin, heat-spreading plate, heat transfer frame, heat-conducting column, and lower heat-conducting plate are all made of high thermal conductivity alloy material.

[0018] Preferably, the lower sidewall of the lower heat-conducting plate is connected to the top of the heat-conducting pillar by adhesive bonding. The width of the heat-spreading plate is less than the width of the packaging substrate, and the length of the heat-spreading plate is equal to the length of the packaging substrate. The length of the heat transfer frame is equal to the width of the packaging substrate. The heat transfer frame is directly opposite the distribution of the lead-out pins, and the inner cavity width of the heat transfer frame is greater than the width of the lead-out pins.

[0019] The beneficial effects of this invention are:

[0020] 1. This structure uses a slot-type connection between the chip pins and the substrate, forming a dual electrical connection path. When there is a problem with the connection between the chip pins and the slot, the side wall contact points can maintain circuit continuity, significantly improving reliability compared to traditional single soldering connections. The chip sidewall contacts the lead-out pins, expanding the heat dissipation path and allowing the lead-out pins to quickly dissipate heat. Components such as the condenser plate, airbag, and mounting cylinder work together to form an efficient heat dissipation cycle, specifically addressing heat from the pins and other parts. The airbag enhances sealing without affecting heat dissipation, achieving a dual function of sealing and heat dissipation. Compared to traditional packaging, the heat dissipation efficiency is significantly improved. This structure achieves multiple seals through the cooperation of the positioning boss and the upper slot, and the automatic inflation of the airbag to fill gaps. The sealing effect is excellent, effectively preventing external contaminants from entering and improving the sealing and protection performance of the packaging structure.

[0021] 2. The lower heatsink directly contacts the bottom of the chip and is connected to the vapor chamber via thermal pillars, forming the main bottom heat dissipation channel. The upper heatsink adheres to the top surface of the chip using thermal grease, and is equipped with thermal bumps and fins for top heat dissipation. This double-sided design significantly improves heat transfer efficiency compared to single-sided heat dissipation. The vapor chamber uses its internal phase change material to quickly and evenly distribute heat through solid-liquid conversion, reducing temperature differences on the chip surface. The heat transfer frame faces the lead-out pins, and its wide internal cavity design allows external airflow to enter. The airflow first contacts the thermal pillars for heat dissipation, and then is guided by the vapor chamber to the bottom and sides of the lead-out pins. Combined with the airbags cooling the top of the pins, this achieves all-round heat dissipation for the lead-out pins, solving the problem of local overheating caused by high current. The size difference between the heat transfer frame and the vapor chamber guides the airflow to precisely cover the pin area, effectively avoiding signal attenuation or solder joint failure caused by pin overheating.

[0022] 3. The inverted L-shaped structure of the heat dissipation channel, combined with the filter port, effectively intercepts small particles and prevents dust blockage. Even if a small amount of moisture enters, it will condense in the receiving cavity or be treated by the condensation plate, preventing the airbag from aging due to moisture and extending the life of the sealing components. Hot air is discharged through the air guide hole, receiving cavity, and heat dissipation channel, forming a convection circulation and effectively improving heat dissipation efficiency. The conical surface structure of the tapered part forms a guide, eliminating the need for precise alignment during assembly. Simply press vertically to allow the mounting cylinder to automatically slide into the lower slot and insertion hole. After the tapered part is fully pressed in, the lower end of the tapered part fills the mounting cylinder and insertion hole. The gaps in the holes block the path of water vapor to penetrate into the airbag, preventing airbag aging due to water vapor corrosion. Even if a small amount of water vapor enters the heat dissipation channel, the inverted L-shaped structure and the receiving cavity form a preliminary condensation cavity, allowing the water vapor to condense initially in the receiving cavity. The remaining water vapor enters the lower slot through the air guide hole and is adsorbed and condensed by the condensation plate. The cooling effect of the condensation plate on the condensed water droplets can additionally remove the heat from the surface of the airbag. At the same time, the heat generated by the chip operation is evaporated and discharged again, forming a closed-loop protection, achieving a two-way gain of protection and heat dissipation, and effectively alleviating the problem of local overheating at the lead-out pins. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0025] Figure 2 This is a schematic diagram of the bottom structure of the present invention;

[0026] Figure 3 This is a schematic diagram of the mounting hole structure of the present invention;

[0027] Figure 4 This is a schematic diagram of the left-side cross-sectional structure of the present invention;

[0028] Figure 5 This is the invention Figure 4 Enlarged structural diagram at point A in the middle;

[0029] Figure 6 This is a front cross-sectional structural diagram of the present invention;

[0030] Figure 7 This is the invention Figure 6 Enlarged structural diagram at point B;

[0031] Figure 8 This is an exploded structural diagram of the present invention;

[0032] Figure 9 This is a schematic diagram of the positioning frame and chip installation structure of the present invention;

[0033] Figure 10 This is the invention Figure 9 Enlarged structural diagram at point C;

[0034] Figure 11 This is a schematic diagram of the upper structure of the packaging substrate of the present invention;

[0035] Figure 12 This is a schematic diagram of the bottom structure of the packaging substrate of the present invention;

[0036] Figure 13 This is a schematic diagram of the upper structure of the encapsulation cover plate of the present invention;

[0037] Figure 14 This is a schematic diagram of the bottom structure of the encapsulation cover plate of the present invention;

[0038] Figure 15This is a schematic diagram of the upper structure of the positioning frame of the present invention;

[0039] Figure 16 This is a schematic diagram of the bottom structure of the positioning frame of the present invention;

[0040] Figure 17 This is a schematic diagram of the heat transfer frame and heat spreader of the present invention.

[0041] In the diagram: 1. Packaging substrate; 2. Packaging cover plate; 3. Positioning frame; 4. Heat sink; 5. Upper heat conduction plate; 6. Heat dissipation channel; 7. Mounting cylinder; 8. Chip; 9. Airbag; 10. Mounting hole; 11. Lead-out pin; 12. Pad mounting slot; 13. Positioning hole; 14. Chip pin slot; 21. Positioning boss; 22. Connecting platform; 23. Mounting sleeve; 24. Fin mounting slot; 25. Through hole; 26. Sealing ring; 31. Positioning post; 32. Upper slot; 33. Lower slot; 40. Plate slot; 41. Heat transfer frame; 42. Heat conduction column; 43. Lower heat conduction plate; 51. Heat conduction boss; 52. Fin; 53. Thermal grease; 61. Filter port; 62. Insertion port; 71. Conical part; 72. Receiving cavity; 73. Air vent; 81. Chip pin; 91. Condenser plate; 101. Gasket ring; 121. Gasket plate; 251. Embedding groove; 321. Insertion hole; 411. Frame groove; 421. Through hole; 431. Positioning groove. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] Example 1, refer to Figures 1-17 A chip heat dissipation packaging structure includes a packaging substrate 1, a packaging cover plate 2, and a chip 8. The chip 8 has chip pins 81 on its bottom. The structure also includes:

[0044] Positioning frame 3: Positioning frame 3 is disposed between the packaging substrate 1 and the packaging cover plate 2, and chip 8 is installed inside positioning frame 3;

[0045] Encapsulated heat dissipation component: The encapsulated heat dissipation component is disposed within the encapsulation substrate 1 and the encapsulation cover plate 2.

[0046] Furthermore, several lead-out pins 11 are soldered to the upper side of the packaging substrate 1 to realize the electrical connection between the chip 8 and the external circuit, ensuring that the chip 8 can receive power supply and transmit working signals. The upper side of the packaging substrate 1 has chip pin slots 14 corresponding to the chip pins 81, which facilitates the installation and removal of the chip 8. The slots can be provided with elastic contacts to provide a certain holding force to ensure good contact between the chip pins 81 and the slots, ensuring the reliability of the electrical connection. The positioning frame 3 is snapped onto the packaging substrate 1. The lower side of the positioning frame 3 is provided with a positioning post 31. The packaging substrate 1 has a positioning hole 13 that matches the positioning post 31. The matching design of the positioning post 31 and the positioning hole 13 can achieve fast and accurate positioning during assembly, and the error can be controlled within a very small range to prevent the chip 8 from being misaligned during installation. The cooperation of the two can also enhance the connection strength between the positioning frame 3 and the packaging substrate 1, and reduce structural loosening when subjected to external vibration and impact. To mitigate risks and ensure stable operation of chip 8 in complex environments, an upper slot 32 and a lower slot 33 are provided on the side frame of the positioning frame 3 corresponding to the lead-out pin 11. A positioning boss 21 and a connecting platform 22 are fixedly connected to the lower side of the packaging cover plate 2. The positioning boss 21 matches the upper slot 32. When the packaging cover plate 2 is fastened, the positioning boss 21 on its lower side will cooperate with the upper slot 32 and the side wall of the positioning frame 3 to improve the stability of the packaging structure. The outer side of the connecting platform 22 is flush with the outer side of the packaging cover plate 2, and the inner side of the connecting platform 22 is connected to the end of the positioning boss 21. A pad mounting groove 12 is provided on the upper side of the packaging substrate 1 corresponding to the short side of the positioning frame 3. A pad 121 is interference-fitted in the pad mounting groove 12. The pad 121 can provide uniform support force through elastic deformation to ensure the seal between the packaging substrate 1 and the bottom of the positioning frame 3. The airbag 9 is made of thermally conductive silicone material, which has good thermal conductivity while deforming and sealing.

[0047] It should be noted that after chip 8 is fixed to the packaging substrate 1 by chip pin 81, its sidewall contacts the inner end of lead pin 11. Traditionally, the pins of chip 8 are only connected to the substrate by solder joints, which poses a risk of poor contact. However, the contact between the sidewall of chip 8 and the inner end of lead pin 11 forms a dual electrical connection path. When the connection between chip pin 81 and the slot becomes loose or ages, the sidewall contact point can serve as a backup connection to maintain circuit conduction and improve connection reliability. The heat generated by chip 8 during operation is partly conducted to the substrate through the pins and partly transferred to lead pin 11 through the sidewall. Lead pin 11 is usually made of metal (such as copper alloy), and its large area is exposed inside the package, which can quickly dissipate heat. The upper sidewall of lead pin 11 is flush with the top wall of packaging substrate 1. After the positioning frame 3 is fixed to packaging substrate 1, its bottom wall abuts against the upper surface of lead pin 11 and pad 121, further improving the sealing effect of the packaging structure.

[0048] Furthermore, a mounting sleeve 23 is fixedly connected to the lower side of the connecting platform 22. A mounting hole 10 is provided on the packaging substrate 1 corresponding to the mounting sleeve 23. A washer 101 and a screw are provided in the mounting hole 10. The washer 101 plays a buffering role during the screw tightening process, preventing the screw from directly contacting the packaging substrate 1 and causing damage, thus protecting the integrity of the substrate. At the same time, the washer 101 can also fill the small gap between the mounting hole 10 and the screw, further enhancing the sealing of the connection and preventing external dust, moisture and other impurities from entering the packaging. During assembly, the positioning frame 3 is fixed first. On the packaging substrate 1, the chip 8 is then installed in the positioning frame 3, and the packaging cover 2 is then snapped onto the packaging substrate 1. Finally, the screws are screwed into the mounting sleeve 23 to complete the assembly. The mounting sleeve 23 serves as a guide, enabling the packaging cover 2 to be quickly and accurately snapped onto the packaging substrate 1, reducing assembly difficulty and errors. By screwing the screws into the mounting sleeve 23, a stable fastening force can be applied, firmly connecting the packaging cover 2, the positioning frame 3, and the packaging substrate 1 into one unit, ensuring the stability of the packaging structure during use, and enabling it to withstand certain external forces and vibrations without loosening.

[0049] A condenser plate 91 is fixedly connected inside the lower slot 33. Several insertion holes 321 are opened on the upper slot 32 corresponding to the lead-out pin 11. The end of the insertion hole 321 passes through the upper slot 32 and the side wall of the condenser plate 91. An air bag 9 is fixedly connected to the bottom of the condenser plate 91. The lower side wall of the air bag 9 is flush with the bottom wall of the positioning frame 3, ensuring that after the positioning frame 3 is assembled, the air bag 9 can effectively fill the gap between the positioning frame 3 and the lead-out pin 11. A mounting cylinder 7 is slidably connected inside the insertion hole 321. The lower end of the mounting cylinder 7 abuts against the upper side wall of the air bag 9. The air bag 9 can transfer the heat of the lead-out pin 11 to the condenser plate 91 and the mounting cylinder 7, and then dissipate it to the external environment of the package, forming an effective heat dissipation cycle.

[0050] It should be noted that before the encapsulation cover plate 2 is assembled, the upper end of the mounting cylinder 7 is located above the bottom wall of the upper slot 32. When the encapsulation cover plate 2 is assembled with the encapsulation substrate 1, the positioning boss 21 presses the upper end of the mounting cylinder 7, causing the mounting cylinder 7 to shift. At this time, its lower end acts on the upper wall of the airbag 9, causing the airbag 9 to fully inflate, thereby increasing the sealing effect at the connection between the positioning frame 3 and the lead pin 11. The automatic sealing enhancement is achieved by utilizing the power of the encapsulation cover plate 2 and the encapsulation substrate 1 assembly, without the need for additional sealing operations. The inflated airbag 9 can tightly fill the gap between the positioning frame 3 and the lead pin 11, effectively preventing external contaminants from entering and improving the sealing and protection performance of the encapsulation structure. While enhancing the sealing effect, the airbag 9 will not affect the heat dissipation function of the condenser plate 91. The airbag 9 is made of a flexible material with a certain thermal conductivity, which can still ensure that heat is conducted through the condenser plate 91 in the inflated state, achieving the dual functions of sealing and heat dissipation, and ensuring that the chip 8 works stably in a good environment.

[0051] In this embodiment, the positioning frame 3 is first aligned and fastened with the positioning hole 13 of the packaging substrate 1 via the positioning post 31. The high-precision matching between the positioning post 31 and the positioning hole 13 enables rapid and accurate positioning with the error controlled within a very small range. Compared with traditional manual assembly or no positioning structure, this significantly reduces assembly deviation. At the same time, the bottom wall of the positioning frame 3 abuts against the lead-out pin 11 and the upper surface of the pad 121. The elastic support force generated by the interference fit of the pad 121 ensures that the positioning frame 3 is stably fixed on the packaging substrate 1. Furthermore, the tight abutment between the bottom wall of the positioning frame 3 and the lead-out pin 11 and the pad 121 effectively fills any small gaps that may exist between them. If gaps exist, external contaminants such as dust, moisture, and corrosive gases may enter the package, affecting the performance and lifespan of the chip 8. The tight abutment structure, combined with the squeezing action generated by the interference fit of the pad 121, eliminates these gaps, prevents contaminants from entering, and achieves a good sealing effect.

[0052] Next, place the chip 8 inside the positioning frame 3. Insert the chip pin 81 into the corresponding chip pin slot 14 on the packaging substrate 1. The elastic contact inside the slot provides holding force to ensure good contact between the pin and the slot. After the chip 8 is fixed, its side wall contacts the inner end of the lead-out pin 11 to form a dual electrical connection path.

[0053] Then, the encapsulation cover 2 is fastened onto the encapsulation substrate 1. The positioning boss 21 on the lower side of the encapsulation cover 2 matches the slot 32 on the positioning frame 3. The outer side of the connecting platform 22 is flush with the outer side of the encapsulation cover 2, and the inner side is connected to the positioning boss 21 to ensure that the cover is installed in an accurate position. The mounting sleeve 23 corresponds to the mounting hole 10 on the encapsulation substrate 1. The washer 101 and screw in the mounting hole 10 play a role. The mounting sleeve 23 plays a guiding role and reduces the assembly difficulty. After the screw is screwed into the mounting sleeve 23, a stable fastening force is applied to firmly connect the encapsulation cover 2, the positioning frame 3 and the encapsulation substrate 1.

[0054] During the assembly of the cover plate 2, the positioning boss 21 presses the upper end of the mounting cylinder 7, causing it to move downwards. The lower end of the mounting cylinder 7 acts on the upper wall of the airbag 9, causing the airbag 9 to fully inflate and tightly fill the gap between the positioning frame 3 and the lead pin 11, thus achieving automated sealing enhancement. The inflated airbag 9, with its flexible material properties, can adaptively fill the irregular gap between the positioning frame 3 and the lead pin 11, forming a tightly fitting sealing layer. Compared with traditional static sealing gaskets, the airbag 9 can dynamically adjust the filling degree according to assembly errors. Even with dimensional deviations, it can still maintain a good sealing effect. Combined with the bottom seal generated by the interference fit of the pad plate 121, it achieves double sealing protection of the upper and lower parts of the packaging structure. At the same time, the heat generated by the lead pin 11 is transferred to the condenser plate 91 and the mounting cylinder 7 through the airbag 9, and then dissipated to the external environment of the packaging, forming a heat dissipation cycle.

[0055] On the other hand, the cooperation between the positioning boss 21, the connecting platform 22 and the top of the positioning frame 3 can form a stepped structure, which changes the water vapor permeation path and reduces the possibility of water vapor entering through the gap between the encapsulation cover 2 and the positioning frame 3. In the traditional planar sealing structure, water vapor can quickly permeate along the straight gap; while the stepped structure forces water vapor to undergo multiple changes in direction and surface adhesion, increasing the permeation resistance. At the same time, the grooves formed by the stepped surface can intercept some condensed water and prevent it from further intruding into the encapsulation.

[0056] This structure employs a slot-type connection between the chip pin 81 and the substrate, forming a dual electrical connection path. When a problem occurs in the connection between the chip pin 81 and the slot, the sidewall contact points can maintain circuit continuity, significantly improving reliability compared to traditional single soldering connections. Traditional packaging relies on a single heat dissipation path, primarily on the top or bottom of the chip 8, which is insufficient for handling heat generated by the pins and other components, easily leading to localized overheating. In this structure, the sidewall of the chip 8 contacts the lead-out pin 11, expanding the heat dissipation path, allowing the lead-out pin 11 to quickly dissipate heat. The condenser plate 91, airbag 9, mounting cylinder 7, and other components work together to form an efficient heat dissipation cycle, effectively reducing heat loss. Heat from pins and other components is specifically addressed. The airbag 9 enhances sealing without compromising heat dissipation, achieving a dual function of sealing and heat dissipation. Compared to traditional packaging, the heat dissipation efficiency is significantly improved. Traditional packaging sealing methods are mostly simple glue sealing or gasket sealing, which have limited sealing effects. After long-term use, the sealing material is prone to aging, allowing external contaminants to enter the package and affect the performance of chip 8. This structure achieves multiple seals through the cooperation of the positioning boss 21 and the upper slot 32, and the automatic inflation of the airbag 9 to fill the gaps. The sealing effect is good, effectively preventing external contaminants from entering and improving the sealing and protection performance of the packaging structure.

[0057] Example 2, refer to Figures 3-17The heat dissipation assembly includes a heat spreader 4, a lower heat conduction plate 43, an upper heat conduction plate 5, and a receiving cavity 72 inside the mounting cylinder 7. A heat transfer frame 41 and a heat conduction pillar 42 are fixedly connected to the upper side wall of the heat spreader 4. The bottom wall of the encapsulation substrate 1 has a plate groove 40 matching the heat spreader 4 and a frame groove 411 matching the heat transfer frame 41. The upper side wall of the encapsulation substrate 1 has a positioning groove 431 matching the lower heat conduction plate 43. Several through holes 421 are opened between the positioning groove 431 and the frame groove 411, and the through holes 421 match the heat conduction pillars 42. The upper heat conduction plate 5 is embedded inside the encapsulation cover plate 2. A heat conduction boss 51 is fixedly connected to the upper side of the upper heat conduction plate 5. The upper side of the encapsulation cover plate 2 has a through hole 25 matching the heat conduction boss 51. An embedding groove 251 is provided inside the encapsulation cover plate 2 corresponding to the through hole 25. The upper heat-conducting plate 5 is fitted with an interference fit and a sealing ring 26. The upper heat-conducting plate 5 is embedded inside the packaging cover plate 2 and is positioned by the cooperation of the thermally conductive protrusion 51 and the through hole 25. The interference fit of the sealing ring 26 ensures the sealing performance. Thermal grease 53 is coated between the lower side of the upper heat-conducting plate 5 and the top wall of the chip 8. The upper side wall of the lower heat-conducting plate 43 abuts against the bottom wall of the chip 8, and the lower side wall of the lower heat-conducting plate 43 abuts against the top of the thermally conductive pillar 42. The lower heat-conducting plate 43 is tightly abutted against the bottom of the chip 8. It is connected to the heat spreader 4 (with phase change material inside) through the thermally conductive pillar 42, which quickly conducts the heat from the bottom to the outside of the packaging substrate 1. The upper heat-conducting plate 5 is attached to the top surface of the chip 8 by thermal grease 53. With the cooperation of the thermally conductive protrusion 51 and the fins 52, the heat from the top is dissipated to the outside. This double-sided heat dissipation design has a significantly improved efficiency compared to single-sided heat dissipation and can effectively reduce the temperature of the chip 8.

[0058] Furthermore, a heat dissipation channel 6 is provided inside the encapsulation cover plate 2 corresponding to the mounting cylinder 7. A filter port 61 is installed in the upper end of the heat dissipation channel 6. The filter port 61 is designed with a small outer port and a large inner port, which can intercept small particles and prevent dust from entering. A plug-in port 62 is fixedly connected to the lower end of the heat dissipation channel 6. When the encapsulation substrate 1 and the encapsulation cover plate 2 are assembled, the plug-in port 62 is nested in the receiving cavity 72. The cooperation between the plug-in port 62 and the receiving cavity 72 facilitates assembly and improves the sealing at the connection between the two.

[0059] The heat dissipation channel 6 is arranged in an inverted L-shape with a bend. Combined with the filter port 61, this reduces the probability of moisture entering the packaging structure through the heat dissipation channel 6. The outer wall of the mounting cylinder 7 has a tapered portion 71. When the packaging substrate 1 and the packaging cover plate 2 are assembled, the end of the tapered portion 71 engages with the bottom insertion hole 321. The tapered portion 71 facilitates the assembly of the mounting cylinder 7; simply pressing it down will push the tapered portion 71 into the lower retaining groove 33, where it engages with the insertion hole 321 for positioning. Furthermore, the lower end of the tapered portion 71 fills the gap between the mounting cylinder 7 and the bottom insertion hole 321, preventing moisture from passing through this gap. The gap between the airbag 9 and the airbag 9 effectively prevents its aging. The mounting cylinder 7 located above the conical part 71 has several air guide holes 73. The end of the air guide hole 73 penetrates the side wall of the mounting cylinder 7 and the inner cavity of the receiving cavity 72. The hot air generated in the lower slot 33 will pass through the air guide hole 73, the receiving cavity 72 and the heat dissipation channel 6 in sequence to exchange heat with the outside. Even if water vapor enters the heat dissipation channel 6, it will accumulate inside the receiving cavity 72. When some water vapor enters the lower slot 33 along the air guide hole 73, it will condense into water droplets under the action of the condensing plate 91. This can better provide heat dissipation for the airbag 9. At the same time, these water droplets will gradually evaporate under the action of heat.

[0060] Furthermore, the side wall of the encapsulation cover plate 2 is provided with a fin mounting groove 24, and a fin 52 is inserted into the fin mounting groove 24. The fin 52 is inserted into the fin mounting groove 24 (the insertion structure of the fin mounting groove 24 and the fin 52 is designed with anti-loosening buckles, which can withstand a certain amount of tension without falling off, ensuring a stable connection even in harsh environments such as vibration and impact). This facilitates disassembly and maintenance, and different specifications of fins 52 can be replaced according to heat dissipation requirements. The side wall of the fin 52 located in the encapsulation cover plate 2 abuts against the side wall of the upper heat conduction plate 5, ensuring that the heat of the upper heat conduction plate 5 can be effectively transferred to the fin 52. The upper heat conduction plate 5, the heat conduction boss 51, the fin 52, the heat spreader plate 4, the heat transfer frame 41, the heat conduction pillar 42, and the lower heat conduction plate 43 are all made of high thermal conductivity alloy material (such as copper-based alloy), which has high thermal conductivity and can ensure efficient heat transfer.

[0061] It should be noted that the lower sidewall of the lower heat-conducting plate 43 is connected to the top of the heat-conducting pillar 42 by adhesive. During installation, the heat transfer frame 41, the heat spreader plate 4, and the heat-conducting pillar 42 are pre-connected. Adhesive is applied to the positioning groove 431, and then the lower heat-conducting plate 43 is installed in the positioning groove 431. Finally, the heat-conducting pillar 42 is inserted to complete the connection between it and the lower heat-conducting plate 43. The width of the heat spreader plate 4 is smaller than the width of the packaging substrate 1, and the length of the heat spreader plate 4 is equal to the length of the packaging substrate 1. The heat spreader plate 4 can connect multiple heat transfer frames 41 and heat-conducting pillars 42 in series to ensure uniform heat dissipation. The length of the heat transfer frame 41 is equal to the width of the packaging substrate 1, and the heat transfer frame 41 is directly opposite the lead pin 11. The airflow is designed to effectively act on the corresponding lead-out pins 11. The inner width of the heat transfer frame 41 is greater than the width of the lead-out pins 11. Combined with the setting that the width of the heat spreader 4 is less than the width of the packaging substrate 1, the external airflow entering the heat transfer frame 41 (this external airflow is generally generated by the fan inside the device with this packaging structure) will contact the heat-conducting pillars 42 inside the heat transfer frame 41, prolonging its residence time in the heat transfer frame 41. When it flows out from the other end of the heat transfer frame 41, since the width of the heat spreader 4 is less than the width of the packaging substrate 1, this part of the airflow will be guided to the bottom and sides of the lead-out pins 11. Combined with the cooling of the top of the lead-out pins 11 by the airbag 9, it is ensured that the lead-out pins 11 can be fully cooled.

[0062] In this embodiment, the lower heat-conducting plate 43 is in direct contact with the bottom of the chip 8 and is connected to the heat-dissipating plate 4 through the heat-conducting pillar 42 to form the main heat dissipation channel at the bottom; the upper heat-conducting plate 5 is attached to the top surface of the chip 8 with the help of thermal grease 53, and is equipped with thermal protrusions 51 and fins 52 to achieve top heat dissipation. Compared with single-sided heat dissipation, this double-sided design greatly improves the heat transfer efficiency.

[0063] The heat spreader 4 rapidly and evenly distributes heat through solid-liquid conversion using its internal phase change material, reducing the temperature difference on the surface of the chip 8. The heat transfer frame 41 faces the lead-out pin 11, and its wide internal cavity design allows external airflow (such as fan drive) to enter. The airflow first contacts the heat conduction pillar 42 for heat dissipation, and then is guided by the heat spreader 4 to the bottom and sides of the lead-out pin 11. Combined with the cooling of the top of the pin by the airbag 9, it achieves all-round heat dissipation of the lead-out pin 11, solving the problem of local overheating caused by high current. The size difference between the heat transfer frame 41 and the heat spreader 4 (the width of the heat spreader 4 is smaller than that of the substrate) guides the airflow to accurately cover the pin area, effectively avoiding signal attenuation or solder joint failure caused by pin overheating.

[0064] The inverted L-shaped structure of the heat dissipation channel 6, combined with the filter port 61 (funnel-shaped with a smaller outer diameter and a larger inner diameter), effectively intercepts small particles and prevents dust blockage. Even if a small amount of water vapor enters, it will condense in the receiving cavity 72 or be treated by the condensation plate 91, preventing the airbag 9 from getting damp and aging, and extending the life of the sealing components. Hot air is discharged through the air guide hole 73, the receiving cavity 72, and the heat dissipation channel 6, forming a convection circulation, which effectively improves the heat dissipation efficiency.

[0065] The conical structure of the conical part 71 forms a guide, eliminating the need for precise alignment during assembly. Simply pressing vertically allows the mounting cylinder 7 to automatically slide into the lower slot 33 and the insertion hole 321. Once the conical part 71 is fully pressed in, its lower end fills the gap between the mounting cylinder 7 and the insertion hole 321, blocking the path of moisture penetration into the airbag 9 and preventing aging of the airbag 9 due to moisture corrosion (the lifespan of conventional rubber airbags is significantly shortened under high humidity). Even if a small amount of moisture enters the heat dissipation channel 6, the inverted L-shaped structure and the receiving cavity 72 form a preliminary condensation cavity, allowing the moisture to condense initially in the receiving cavity 72. The remaining moisture enters the lower slot 33 through the air guide hole 73 and is absorbed and condensed by the condensing plate 91. The cooling effect of the condensing plate 91 on the condensed water droplets can additionally remove heat from the surface of the airbag 9. At the same time, the heat generated by the operation of the chip 8 is evaporated and discharged, forming a closed-loop protection and achieving a two-way gain of protection and heat dissipation, effectively alleviating the local overheating problem of the lead-out pin 11 and the airbag 9.

[0066] Fin 52 adopts plug-in installation, which is convenient for users to replace. The specifications of fin 52 can be dynamically adjusted according to the load of chip 8: thin fins are used for low load (reducing cost and thickness), and dense toothed fins are used for high load to increase heat dissipation area and meet the needs of different working conditions.

[0067] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the invention by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the invention should be included within the scope of protection of the invention.

Claims

1. A chip heat dissipation packaging structure, comprising a packaging substrate (1), a packaging cover plate (2), and a chip (8), wherein chip pins (81) are disposed on the bottom of the chip (8), characterized in that, Also includes: Positioning frame (3): The positioning frame (3) is disposed between the packaging substrate (1) and the packaging cover plate (2), and the chip (8) is installed inside the positioning frame (3); a number of lead-out pins (11) are soldered to the upper side of the packaging substrate (1), and chip pin slots (14) corresponding to the chip pins (81) are opened on the upper side of the packaging substrate (1). The positioning frame (3) is fastened to the packaging substrate (1), and a positioning post (31) is provided on the lower side of the positioning frame (3). The packaging substrate (1) is provided with positioning holes (13) that match the positioning posts (31) and correspond to the lead-out pins. (11) The positioning frame (3) has an upper slot (32) and a lower slot (33) on its side frame. The lower side of the encapsulation cover (2) is fixedly connected to a positioning boss (21) and a connecting platform (22). The positioning boss (21) matches the upper slot (32). The outer side of the connecting platform (22) is flush with the outer side of the encapsulation cover (2). The inner side of the connecting platform (22) is connected to the end of the positioning boss (21). The upper side of the encapsulation substrate (1) corresponding to the short side of the positioning frame (3) has a pad mounting groove (12). The pad mounting groove (12) is interference-fitted with a pad (121). Encapsulated heat dissipation assembly: The encapsulated heat dissipation assembly is disposed within the encapsulation substrate (1) and the encapsulation cover plate (2); the encapsulated heat dissipation assembly includes a heat spreader plate (4), a lower heat conduction plate (43), an upper heat conduction plate (5), and a receiving cavity (72) disposed inside the mounting cylinder (7). The upper side wall of the heat spreader plate (4) is fixedly connected with a heat transfer frame (41) and a heat conduction column (42). The bottom wall of the encapsulation substrate (1) is provided with a plate groove (40) matching the heat spreader plate (4) and a frame groove (411) matching the heat transfer frame (41). The upper side wall of the encapsulation substrate (1) is provided with a groove matching the lower heat conduction plate (43). A matching positioning groove (431) is provided, and several through holes (421) are provided between the positioning groove (431) and the frame groove (411). The through holes (421) are matched with the heat-conducting pillars (42). The upper heat-conducting plate (5) is embedded in the encapsulation cover plate (2). A heat-conducting boss (51) is fixedly connected to the upper side of the upper heat-conducting plate (5). The upper side of the encapsulation cover plate (2) is provided with a through hole (25) that matches the heat-conducting boss (51). The encapsulation cover plate (2) is provided with an embedding groove (251) corresponding to the through hole (25). The embedding groove (251) is fitted with a sealing seal. In the ring (26), thermal grease (53) is applied between the lower side of the upper heat-conducting plate (5) and the top wall of the chip (8). The upper side wall of the lower heat-conducting plate (43) abuts against the bottom wall of the chip (8), and the lower side wall of the lower heat-conducting plate (43) abuts against the top of the heat-conducting pillar (42). A heat dissipation channel (6) is provided inside the encapsulation cover plate (2) corresponding to the mounting cylinder (7). A filter port (61) is installed in the upper end of the heat dissipation channel (6). The filter port (61) is configured with a small outer port and a large inner port. A plug-in port (62) is fixedly connected to the lower end of the heat dissipation channel (6). When the encapsulation substrate (1) and the encapsulation cover plate (2) are assembled, the insertion port (62) is nested in the receiving cavity (72). The heat dissipation channel (6) is arranged in a bent inverted L shape. The outer wall of the mounting cylinder (7) is provided with a tapered part (71). When the encapsulation substrate (1) and the encapsulation cover plate (2) are assembled, the end of the tapered part (71) is engaged in the insertion hole (321) at the bottom. The mounting cylinder (7) located above the tapered part (71) is provided with a plurality of air guide holes (73). The end of the air guide hole (73) penetrates the side wall of the mounting cylinder (7) and the inner cavity of the receiving cavity (72).

2. The chip heat dissipation packaging structure according to claim 1, characterized in that, After the chip (8) is fixed on the packaging substrate (1) by the chip pin (81), its sidewall is in contact with the inner end of the lead-out pin (11); the upper sidewall of the lead-out pin (11) is flush with the top wall of the packaging substrate (1); after the positioning frame (3) is fixed on the packaging substrate (1), its bottom wall abuts against the upper surface of the lead-out pin (11) and the pad (121).

3. The chip heat dissipation packaging structure according to claim 1, characterized in that, The lower side of the connecting platform (22) is fixedly connected to the mounting sleeve (23). The packaging substrate (1) corresponding to the mounting sleeve (23) is provided with mounting holes (10). The mounting holes (10) are provided with washers (101) and screws. During assembly, the positioning frame (3) is first fixed on the packaging substrate (1), then the chip (8) is installed in the positioning frame (3), then the packaging cover plate (2) is snapped on the packaging substrate (1), and finally the screws are screwed into the mounting sleeve (23) to complete the assembly.

4. The chip heat dissipation packaging structure according to claim 1, characterized in that, A condenser plate (91) is fixedly connected inside the lower slot (33). Several insertion holes (321) are provided on the upper slot (32) corresponding to the lead-out pin (11). The end of the insertion hole (321) passes through the upper slot (32) and the side wall of the condenser plate (91). An air bag (9) is fixedly connected to the bottom of the condenser plate (91). The lower side wall of the air bag (9) is flush with the bottom wall of the positioning frame (3). An installation cylinder (7) is slidably connected inside the insertion hole (321). The lower end of the installation cylinder (7) abuts against the upper side wall of the air bag (9). The air bag (9) is made of thermally conductive silicone material.

5. The chip heat dissipation packaging structure according to claim 1, characterized in that, Before the encapsulation cover (2) is assembled, the upper end of the mounting cylinder (7) is located above the bottom wall of the upper slot (32). When the encapsulation cover (2) is assembled with the encapsulation substrate (1), the positioning boss (21) squeezes the upper end of the mounting cylinder (7), causing the mounting cylinder (7) to move. At this time, its lower end acts on the upper wall of the airbag (9), causing the airbag (9) to fully inflate, thereby increasing the sealing effect at the connection between the positioning frame (3) and the lead-out pin (11).

6. The chip heat dissipation packaging structure according to claim 1, characterized in that, The side wall of the encapsulation cover (2) is provided with a fin mounting groove (24), and a fin (52) is inserted and installed in the fin mounting groove (24). The side wall of the fin (52) located in the encapsulation cover (2) abuts against the side wall of the upper heat-conducting plate (5). The upper heat-conducting plate (5), heat-conducting boss (51), fin (52), heat-spreading plate (4), heat transfer frame (41), heat-conducting column (42), and lower heat-conducting plate (43) are all made of high thermal conductivity alloy material.

7. A chip heat dissipation packaging structure according to claim 6, characterized in that, The lower sidewall of the lower heat-conducting plate (43) is connected to the top of the heat-conducting column (42) by adhesive. The width of the heat-spreading plate (4) is smaller than the width of the packaging substrate (1), and the length of the heat-spreading plate (4) is equal to the length of the packaging substrate (1). The length of the heat transfer frame (41) is equal to the width of the packaging substrate (1). The heat transfer frame (41) is distributed opposite to the lead-out pin (11). The inner cavity width of the heat transfer frame (41) is greater than the width of the lead-out pin (11).

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