Upper and lower electrode anti-corrosion resonator, filter and electronic equipment

Abstract

The invention relates to the technical field of semiconductors, in particular to an upper and lower electrode anti-corrosion resonator, a filter and electronic equipment. The upper and lower electrode anti-corrosion resonator comprises a resonator main body; the resonator main body comprises a substrate, an acoustic mirror, a lower electrode, a piezoelectric layer film and an upper electrode which are stacked; wherein a first water vapor corrosion resistant layer is arranged on one side, far away from the substrate, of the upper electrode; and the first water vapor corrosion resistant layer is used for isolating water vapor.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to a resonator, a filter and an electronic device with upper and lower electrodes having corrosion resistance. Background Art

[0002] The rapid development of modern electronic technology has placed increasingly stringent demands on the performance, size, and cost of electronic devices. As an important electronic component, upper and lower electrode corrosion-resistant resonators are widely used in numerous fields, including communications, radar, and sensors. Traditionally, to ensure device reliability, upper and lower electrode corrosion-resistant resonators are typically sealed using a sealing ring and cap. This sealing method can, to a certain extent, protect the active area of ​​the device from environmental influences. For example, in reliability testing at 85°C and 85% humidity for 1000 hours, devices using this sealing method achieved a 100% pass rate. The metal sealing ring and cap play a crucial role in sealing and protecting the device. However, this sealing method has significant drawbacks. The metal sealing ring and cap account for a significant proportion of the production cost, approximately 20-40%. This makes it difficult to reduce the overall cost of the device, hindering market competitiveness. Furthermore, with the increasing demand for device miniaturization, the larger size required by this sealing method has become a limiting factor.

[0003] To address cost and size issues, removing the cap became a viable improvement. However, removing the cap allowed the device to be directly packaged onto the substrate, which provided far less sealing and moisture-proof protection than a metal sealing ring and cap combination. After 1000 hours of reliability testing at 85°C and 85% humidity, the product failed. Summary of the Invention

[0004] In view of this, the embodiments of the present application are dedicated to providing a resonator, filter and electronic device with corrosion-resistant upper and lower electrodes, so as to solve the problems of sealing and water vapor resistance of the device after removing the cap.

[0005] The present application provides a resonator with upper and lower electrodes having corrosion resistance, comprising: a resonator body;

[0006] The resonator body includes a stacked substrate, an acoustic mirror, a lower electrode, a piezoelectric layer film and an upper electrode;

[0007] Wherein, a first water vapor corrosion resistant layer is provided on the side of the upper electrode away from the substrate;

[0008] The first water vapor corrosion resistant layer is used to isolate water vapor.

[0009] In some embodiments, the upper electrode and the first water vapor corrosion resistant layer are adjacent to each other. In some embodiments, a passivation layer and a first water vapor corrosion resistant layer are sequentially stacked on a side of the upper electrode away from the substrate.

[0010] In some embodiments, a second water vapor corrosion resistant layer is provided on a side of the lower electrode close to the substrate.

[0011] In some embodiments, a second water vapor corrosion resistant layer is provided on a side of the substrate close to the lower electrode.

[0012] In some embodiments, the lower electrode includes: a seed layer and a lower electrode metal layer;

[0013] A second water vapor corrosion resistant layer is provided between the seed layer and the lower electrode metal layer, so that the second water vapor corrosion resistant layer and the piezoelectric layer film wrap the lower electrode metal layer; or a second water vapor corrosion resistant layer is provided between the seed layer and the substrate.

[0014] The material of the first water vapor corrosion resistant layer includes silicon nitride and silicon dioxide.

[0015] The present application also provides a resonator with upper and lower electrodes having corrosion resistance, comprising: a resonator body;

[0016] The resonator body includes a stacked substrate, an acoustic mirror, a lower electrode, a piezoelectric layer film and an upper electrode;

[0017] Wherein, a second water vapor corrosion resistant layer is provided on a side of the lower electrode close to the substrate, so that the second water vapor corrosion resistant layer and the piezoelectric layer film wrap the lower electrode.

[0018] In some embodiments, the material of the second water vapor corrosion resistant layer includes silicon nitride and silicon dioxide.

[0019] In some embodiments, further comprising: a cap;

[0020] The material of the cap includes polyimide glue, epoxy resin, unsaturated polyester resin, phenolic resin, polyacrylic resin, polyvinyl chloride resin, silicone rubber, polyurethane rubber, chloroprene rubber or butyl rubber.

[0021] The present application provides a filter, comprising the above-mentioned upper and lower electrode anti-corrosion resonators.

[0022] The present application provides an electronic device including the above-mentioned filter.

[0023] The present application provides a resonator with upper and lower electrodes that are corrosion-resistant, including: a resonator body: the resonator body includes a stacked substrate, an acoustic mirror, a lower electrode, a piezoelectric layer film, and an upper electrode; wherein, a first water vapor corrosion-resistant layer is provided on the side of the upper electrode away from the substrate; the first water vapor corrosion-resistant layer is used to isolate water vapor. In this way, a first water vapor corrosion-resistant layer is provided on the side of the upper electrode of the resonator body away from the substrate, which adds a protective barrier specifically for water vapor to the resonator. After the cap of a traditional resonator is removed, water vapor can easily cause corrosion to the device, especially to key parts such as the upper electrode. The water vapor corrosion-resistant layer can directly isolate water vapor, reduce the chance of water vapor contact with the upper electrode and other internal structures, and thus greatly reduce the risk of water vapor corrosion. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The above and other purposes, features, and advantages of the present application will become more apparent through a more detailed description of the embodiments of the present application in conjunction with the accompanying drawings. The accompanying drawings are intended to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0025] Figure 1 It is a schematic diagram of the structure of a capped resonator.

[0026] Figure 2 It is a schematic diagram of the structure of the resonator packaged on the substrate with a cap.

[0027] Figure 3 It is a schematic diagram of the structure of the resonator after removing the cap.

[0028] Figure 4 It is a schematic diagram of the structure of the resonator after the cap is removed and packaged on the substrate.

[0029] Figure 5 It is a schematic structural diagram of a resonator provided in one embodiment of the present application.

[0030] Figure 6 It is a structural schematic diagram of a resonator provided in another embodiment of the present application.

[0031] Figure 7 It is a structural schematic diagram of a resonator provided in another embodiment of the present application.

[0032] Figure 8 It is a structural schematic diagram of a resonator provided in another embodiment of the present application.

[0033] Figure 9 It is a structural schematic diagram of a resonator provided in another embodiment of the present application.

[0034] Figure 10 It is a structural schematic diagram of a capped device resonator provided in another embodiment of the present application.

[0035] Reference numerals:

[0036] 110. Substrate; 120. Acoustic mirror; 130. Lower electrode; 130-A. Seed layer; 130-B. Lower electrode metal layer; 140. Piezoelectric layer film; 150. Upper electrode; 160. Passivation layer; 160-A. Water vapor corrosion resistant layer; 160-B. Hydrophobicity-maintaining passivation layer; 180. Release hole; 190. Metal sealing ring; 200. Electrode connection part; 210. Cap; 230. Substrate. DETAILED DESCRIPTION

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0038] With the rapid development of modern electronic technology, higher and higher requirements are being placed on the performance, size, and cost of electronic devices. As an important electronic component, resonators are widely used in many fields such as communications, radar, and sensors.

[0039] As technology advances, demands for device miniaturization, reduction in production costs, and increased device reliability are all increasing.

[0040] At present, the device is mainly sealed by adding a sealing ring and a cap, such as Figure 1 As shown, the metal sealing ring 190 and the cap 210 mainly play the role of sealing and protecting the effective area of ​​the device. Figure 2 As shown, in a reliability test at 85°C and 85% humidity for 1000 hours, the pass rate reached 100%. The metal sealing ring 190 and the cap 210 are mainly used to seal and protect the active area of ​​the device.

[0041] Since the metal sealing ring 190 and the cap 210 account for about 20-40% of the production cost, the most effective way to effectively reduce the overall cost of the device is to remove the cap 210, such as Figure 3 As shown, this not only reduces production costs but also effectively reduces device size.

[0042] After removing the cap 210, the device is directly packaged onto the substrate, such as Figure 4As shown, substrate 230 provides minimal sealing and moisture-proofing for the device. Consequently, the product failed after a 1000-hour reliability test at 85°C and 85% humidity. The cause of the failure is that the device's top surface passivation layer 160 is made of AlN, a readily hydrolyzable material. This layer decomposes in the presence of water vapor: AlN + 3H2O = Al(OH)3 + NH3.

[0043] The present invention addresses the problem of corrosion and hydrolysis during the reliability verification process after the cap is removed. This application proposes a structure in which a film layer is added to the surface of the resonator to prevent water and corrosion.

[0044] After introducing the basic principles of the present application, various non-limiting embodiments of the present application will be described in detail with reference to the accompanying drawings.

[0045] Reference Figure 5 The present application provides a resonator with upper and lower electrodes having corrosion resistance, comprising: a resonator body; the resonator body comprises a stacked substrate 110, an acoustic mirror 120, a lower electrode 130, a piezoelectric layer film 140 and an upper electrode 150; wherein a first water vapor corrosion resistant layer is provided on a side of the upper electrode 150 away from the substrate 110; the first water vapor corrosion resistant layer is used to isolate water vapor.

[0046] This arrangement provides a first water vapor corrosion-resistant layer on the side of the upper electrode 150 of the resonator body away from the substrate 110, adding a protective barrier specifically against water vapor to the resonator. With the cap 210 removed from a conventional resonator, water vapor can easily corrode the device, especially critical components such as the upper electrode 150. This water vapor corrosion-resistant layer directly isolates water vapor, reducing its contact with the upper electrode 150 and other internal structures, thereby significantly reducing the risk of water vapor corrosion.

[0047] Specifically, the side of the upper electrode 150 away from the substrate 110 is sequentially stacked with a passivation layer 160 and a first water vapor corrosion resistant layer. Figure 5 , the resonator's passivation layer 160 is covered with a water vapor corrosion resistant layer 160-A (ie, the first water vapor corrosion resistant layer).

[0048] In some embodiments, the upper electrode 150 and the first water vapor corrosion resistant layer can be placed in close proximity. Figure 6 , the passivation layer 160 of the resonator is directly replaced with a hydrophobic passivation layer 160-B (ie, the first water vapor corrosion resistant layer).

[0049] It should be noted that after removing the cap 210, the device is directly packaged onto the substrate 110, such as Figure 4As shown, because the substrate 230 provided minimal sealing and moisture protection for the device, the product failed after a 1000-hour reliability test at 85°C and 85% humidity. Specifically, the failure may have been caused by corrosion and fracture of the lower electrode 130, caused by water vapor passing through the substrate 110 and along the release hole 180, corroding the lower electrode 130 film.

[0050] In some embodiments, a second water vapor corrosion resistant layer is provided on a side of the lower electrode 130 close to the substrate 110 , so that the second water vapor corrosion resistant layer and the piezoelectric layer film 140 wrap the lower electrode 130 .

[0051] Specifically, such as Figure 7 A corrosion-resistant layer 310 (i.e., a second water vapor corrosion-resistant layer) can be added under the lower electrode 130 of the conventional resonator to prevent Figure 4 The water vapor enters the cavity 120 along the release hole 180 through the substrate 230 and corrodes the film layer of the lower electrode 130. The release hole 180 is a channel reserved for removing the sacrificial layer in the cavity 120.

[0052] In some embodiments, a second water vapor corrosion resistant layer is provided on the side of the substrate 110 close to the lower electrode 130, so that the second water vapor corrosion resistant layer and the piezoelectric layer film 140 wrap the lower electrode 130, so that the second water vapor corrosion resistant layer and the substrate 110 wrap the acoustic mirror 120.

[0053] Specifically, refer to Figure 8 A corrosion-resistant layer 310 (i.e., a second water vapor corrosion-resistant layer) is added under the entire membrane layer of the conventional resonator, so that the second water vapor corrosion-resistant layer and the piezoelectric layer film 140 wrap the lower electrode 130, and the second water vapor corrosion-resistant layer and the substrate 110 wrap the acoustic mirror 120, preventing water vapor from entering the cavity 120 through the substrate 230 along the release hole 180 channel and corroding the membrane layer of the lower electrode 130. The release hole 180 is a channel reserved for removing the sacrificial layer in the cavity 120.

[0054] In some embodiments, a second water vapor corrosion resistant layer is disposed between the seed layer 130-A and the lower electrode metal layer 130-B, such that the second water vapor corrosion resistant layer and the piezoelectric layer film 140 wrap around the lower electrode metal layer 130-B. Alternatively, a second water vapor corrosion resistant layer is disposed between the seed layer 130-A and the substrate.

[0055] Specifically, such as Figure 9In the figure, lower electrode 130 is composed of seed layer 130-A and lower electrode 130 metal 130-B, with corrosion-resistant layer 310 (i.e., second water vapor corrosion-resistant layer) grown between 130-A and 130-B. Corrosion-resistant layer 310 and seed layer 130-A together prevent water vapor from entering cavity 120 through substrate 230 and along release hole 180, thereby corroding the lower electrode 130 metal 130-B film. Release hole 180 is a channel reserved for removing the sacrificial layer in cavity 120.

[0056] Specifically, the material of the first water vapor corrosion resistant layer includes silicon nitride and silicon dioxide. The material of the second water vapor corrosion resistant layer includes silicon nitride and silicon dioxide.

[0057] Silicon nitride has excellent chemical stability and is highly resistant to moisture, oxygen, and many chemicals. In a water vapor environment, silicon nitride does not chemically react, maintaining its structural integrity and effectively blocking the intrusion of moisture. This chemical stability makes it an ideal protective layer material, especially in electronic devices that require long-term protection against moisture corrosion. Silicon dioxide also has high chemical stability. It does not react with moisture at room temperature and forms a stable protective film. Silicon dioxide also has excellent insulating properties, which are crucial for electronic devices, preventing electrical performance degradation caused by moisture intrusion, such as short circuits. Using silicon nitride and silicon dioxide to create film layers ensures both moisture and corrosion resistance.

[0058] Furthermore, due to the high cost of the original cap 210 due to its material, the present application provides a new cap 210. The cap 210 may be made of a material such as polyimide glue, epoxy resin, unsaturated polyester resin, phenolic resin, polyacrylic resin, polyvinyl chloride resin, silicone rubber, polyurethane rubber, chloroprene rubber, or butyl rubber. This configuration replaces the cap 210 with a less expensive material, effectively protecting the resonator from moisture erosion while saving costs.

[0059] It should be noted that the present application also provides an upper and lower electrode corrosion-resistant resonator, including: a resonator body; the resonator body includes a stacked substrate, an acoustic mirror, a lower electrode, a piezoelectric layer film and an upper electrode; wherein, a second water vapor corrosion-resistant layer is provided on the side of the lower electrode close to the substrate, so that the second water vapor corrosion-resistant layer and the piezoelectric layer film wrap the lower electrode.

[0060] It should be noted that the main idea of ​​the solution in this embodiment is to only perform anti-corrosion treatment on the lower electrode. In some cases where the lower electrode is more important, this arrangement can further reduce costs while ensuring the effect. Based on this embodiment, the resonators provided in the other embodiments mentioned above can be combined and improved.

[0061] As can be understood by those skilled in the art, the upper and lower electrode anti-corrosion resonator according to the present invention can be used to form a filter or an electronic device.

[0062] The electronic equipment here includes but is not limited to intermediate products such as RF front-ends, filter amplification modules, as well as terminal products such as mobile phones, WIFI, and drones.

[0063] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0064] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0065] The terms "first," "second," "third," "fourth," and so on (if any) in the specification and claims of this application and the drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the application described herein can, for example, be implemented in an order other than those illustrated or described herein.

[0066] In addition, the terms "comprises" and "having" and any variations thereof are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, product or apparatus.

[0067] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A resonator with anti-corrosion of upper and lower electrodes, characterized in that: include: resonator body; The resonator body includes a stacked substrate, an acoustic mirror, a lower electrode, a piezoelectric layer film and an upper electrode; Wherein, a first water vapor corrosion resistant layer is provided on the side of the upper electrode away from the substrate; The first water vapor corrosion resistant layer is used to isolate water vapor.

2. The upper and lower electrode anti-corrosion resonator according to claim 1, characterized in that: The upper electrode is adjacent to the first water vapor corrosion resistant layer.

3. The upper and lower electrode anti-corrosion resonator according to claim 1, characterized in that: A passivation layer and a first water vapor corrosion resistant layer are sequentially stacked on the side of the upper electrode away from the substrate.

4. The upper and lower electrode anti-corrosion resonator according to claim 1, characterized in that: A second water vapor corrosion resistant layer is provided on a side of the lower electrode close to the substrate, so that the second water vapor corrosion resistant layer and the piezoelectric layer film wrap the lower electrode.

5. The upper and lower electrode anti-corrosion resonator according to claim 1, characterized in that: A second water vapor corrosion resistant layer is provided on a side of the substrate close to the lower electrode, so that the second water vapor corrosion resistant layer and the piezoelectric layer film wrap the lower electrode, and the second water vapor corrosion resistant layer and the substrate wrap the acoustic mirror.

6. The upper and lower electrode anti-corrosion resonator according to claim 1, characterized in that: The lower electrode comprises: a seed layer and a lower electrode metal layer; A second water vapor corrosion resistant layer is provided between the seed layer and the lower electrode metal layer, so that the second water vapor corrosion resistant layer and the piezoelectric layer film wrap the lower electrode metal layer; or, A second water vapor corrosion resistant layer is provided between the seed layer and the substrate.

7. The upper and lower electrode anti-corrosion resonator according to claim 1, characterized in that: The material of the first water vapor corrosion resistant layer includes silicon nitride and silicon dioxide.

8. A resonator with upper and lower electrodes having corrosion resistance, characterized in that: include: resonator body; The resonator body includes a stacked substrate, an acoustic mirror, a lower electrode, a piezoelectric layer film and an upper electrode; Wherein, a second water vapor corrosion resistant layer is provided on a side of the lower electrode close to the substrate, so that the second water vapor corrosion resistant layer and the piezoelectric layer film wrap the lower electrode.

9. The upper and lower electrode anti-corrosion resonator according to claim 8, characterized in that: The material of the second water vapor corrosion resistant layer includes silicon nitride and silicon dioxide.

10. A filter, characterized in that: A resonator comprising upper and lower electrodes with anti-corrosion properties according to any one of claims 1 to 9.

11. An electronic device, characterized in that: Comprising the filter according to claim 10.

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