Electronic component structure convenient for contact welding

Abstract

The invention relates to the technical field of electronic components, and discloses an electronic component structure convenient for contact welding, which comprises a substrate and a heat conduction mechanism, and is characterized in that the substrate comprises a first insulating layer, a heat dissipation copper foil layer and a second insulating layer, the heat dissipation copper foil layer is located between the first insulating layer and the second insulating layer, and the heat conduction mechanism is located between the first insulating layer and the second insulating layer; and an asymmetric bonding pad mechanism is arranged on one side, far away from the heat dissipation copper foil layer, of the first insulating layer. Through the arrangement of the main bonding pad and the auxiliary bonding pad, the main bonding pad and the auxiliary bonding pad form a non-centrosymmetric layout, the surface tension balance is broken, the molten solder is guided to directionally fill the diversion hole and the stepped through hole, and the welding quality is improved. The step-shaped through holes are formed, the heat conduction coatings are electroplated in the step-shaped through holes, diffusion of welding heat towards the interior of the substrate is accelerated, local high temperature is reduced, the welding flux filling path is optimized through the step-shaped hole diameter design, air holes are reduced, it is ensured that welding spots are full, and the welding quality is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and in particular to an electronic component structure that is convenient for contact welding. Background Art

[0002] Contact soldering is a core process in the manufacturing and assembly of electronic components. Traditional soldering structures (such as through-hole pads or surface mount pads) suffer from the following issues: insufficient soldering precision, misalignment between the pad and the pin can easily lead to cold solder joints or short circuits, especially in high-density miniaturized components; concentrated thermal stress, resulting in localized high temperatures during soldering, which can easily cause delamination or deformation between the pad and the substrate; and uneven heat dissipation, with improper heat distribution potentially affecting the performance of adjacent components.

[0003] A Chinese patent with publication number CN222509609U discloses a solder pad with improved heat dissipation performance, including a substrate, wherein the substrate 1 is provided with a solder pad area, a plurality of solder holes and a heat dissipation area are provided on the solder pad area, the plurality of solder holes are evenly separated by the heat dissipation area, a separator is provided between the plurality of solder holes and the heat dissipation area, the separator is fixedly connected to the solder pad area, the solder holes are circular in shape, heat dissipation holes are evenly provided in the heat dissipation area, the heat dissipation holes are provided on one side of the heat dissipation area close to the solder holes, the shape of the heat dissipation holes is the same as the shape of the solder holes, soldering points are provided around the solder holes, and the soldering points are evenly provided on the outer diameter of the edge of the solder holes.

[0004] The aforementioned patented method for improving heat dissipation in a soldering pad partially alleviates soldering thermal stress concentration by optimizing the pad shape or increasing the heat dissipation area. However, it still does not completely resolve issues such as low soldering efficiency, poor soldering quality, and insufficient thermal management. To address this issue, we propose an electronic component structure that facilitates contact soldering. Summary of the Invention

[0005] The object of the present invention is to provide an electronic component structure that facilitates contact welding, so as to solve the problems raised in the above background technology.

[0006] To achieve the above objectives, the present invention provides the following technical solutions: an electronic component structure that facilitates contact soldering, comprising a substrate and a heat-conducting mechanism, the substrate comprising a first insulating layer, a heat-dissipating copper foil layer, and a second insulating layer, the heat-dissipating copper foil layer being located between the first insulating layer and the second insulating layer, and an asymmetric solder pad mechanism and a positioning and anti-deflection mechanism being provided on a side of the first insulating layer away from the heat-dissipating copper foil layer; The asymmetric pad mechanism includes a main pad and an auxiliary pad. The auxiliary pad is located on one side of the main pad. A guide hole is opened at the center of the main pad. The guide hole passes through the main pad. A detachable permanent magnet is fixedly connected to the inner wall of the guide hole.

[0007] Preferably, the main pad has a hexagonal shape, a 45° chamfer is provided on the edge of the main pad, a main annular groove and a secondary annular groove are provided on the side of the main pad away from the first insulating layer, the main annular groove and the secondary annular groove both take the geometric center of the main pad as the center of the circle, the main annular groove is located on the inner side of the secondary annular groove, a low-melting-point flux layer is provided inside the main annular groove, a high-activity flux layer is provided inside the secondary annular groove, a plurality of radial grooves are provided on the side of the main pad away from the first insulating layer, the radial grooves extend radially with the geometric center of the main pad as the starting point, a heat conducting plate is provided inside the radial groove, and the heat conducting plate is made of graphene.

[0008] Preferably, the auxiliary pads are two arc-shaped structures, which are respectively located on two adjacent side extension lines of a corner of the main pad, and their straight sides are arranged parallel to the corresponding sides of the main pad. The distance between the two straight sides of the auxiliary pads and the corresponding sides of the main pad is 0.15 mm, and the arc radius is 1 / 2 of the length of the corresponding side of the main pad. The auxiliary pads and the main pads are located in the same plane, and their arc surfaces are away from the geometric center of the main pad, and the two are electrically connected through a conductive bridging portion.

[0009] Preferably, the heat-conducting mechanism includes a stepped through hole and a cylindrical through hole that penetrate the first insulating layer and extend to the interior of the heat-dissipating copper foil layer. The inner wall of the stepped through hole is electroplated with a thermally conductive coating. One end of the thermally conductive coating is electrically connected to the side of the main pad close to the first insulating layer, and the other end is electrically connected to the interior of the heat-dissipating copper foil layer. The thermally conductive coating forms a heat conduction path with the main pad and the heat-dissipating copper foil layer. The interior of the cylindrical through hole is filled with a thermally conductive filling column. One end of the thermally conductive filling column is electrically connected to the side of the auxiliary pad close to the first insulating layer, and the other end of the thermally conductive filling column is electrically connected to the interior of the heat-dissipating copper foil layer. The thermally conductive filling column forms a heat conduction path with the auxiliary pad and the heat-dissipating copper foil layer. The stepped through hole and the cylindrical through hole are formed by a laser micro-hole processing process. The stepped through hole is located below the geometric center of the main pad, and the cylindrical through hole is located below the geometric center of the auxiliary pad.

[0010] Preferably, the stepped through hole is a two-layer channel that is wide at the top and narrow at the bottom, with an upper aperture of 0.2 mm and a lower aperture of 0.1 mm. The thermal conductive coating adopts a pulse electroplating process to form a copper layer with a gradient thickness, with an upper layer thickness of 18 microns and a lower layer thickness of 10 microns. The thermal conductive filling column is formed by injecting thermal conductive silicone into a specific mold, shaping it, and then allowing it to solidify naturally.

[0011] Preferably, the positioning and anti-deflection mechanism includes an annular groove arranged around the periphery of the main pad and covering the area where the auxiliary pad is located, two cross-shaped optical positioning marks and four V-shaped guide grooves. The depth of the annular groove is 1 / 3 of the thickness of the first insulating layer, and the interior is filled with a low-melting-point alloy layer. The two cross-shaped optical positioning marks are respectively located at two opposite corners of the first insulating layer. The annular groove, two cross-shaped optical positioning marks and four V-shaped guide grooves are all formed by laser etching on the first insulating layer.

[0012] Preferably, the low melting point alloy layer is made of InSn37 alloy with a melting point of 117° C., and the four V-shaped guide grooves are evenly distributed around the main pad, with an included angle of 60° and a depth of 1 / 2 of the first insulating layer.

[0013] Compared with the prior art, the present invention has the following beneficial effects: 1. This electronic component structure facilitates contact soldering by providing a non-center-symmetrical layout of primary and secondary pads. This breaks the surface tension balance of the liquefied solder, guiding the molten solder to fill the central guide hole and stepped through-holes of the primary pad, reducing solder overflow and bridging, and improving soldering quality.

[0014] 2. This electronic component structure facilitates contact welding. By setting the main annular groove and the auxiliary annular groove, the annular structure can evenly guide the liquid solder to spread toward the center, avoiding solder accumulation or voids caused by uneven tension at the edge of the main pad, reducing the risk of false solder joints, and improving welding quality. The flux material in the groove can reduce the interfacial tension between the pad and the solder, enhance wettability, and enable the solder to cover the welding area more quickly and evenly, thereby increasing the welding speed.

[0015] 3. This electronic component structure, which is convenient for contact welding, guides the solder to spread evenly around by setting radial grooves and thermal conductive sheets, reducing local overheating. At the same time, the thermal conductive sheet inside the groove quickly transfers the heat on the main pad to the thermal conductive coating, reducing the impact of welding heat and improving welding quality.

[0016] 4. This electronic component structure that facilitates contact welding is equipped with a detachable permanent magnet. When the electronic component is welded on the substrate, the soft magnetic layer of the electronic component pin is attracted by the magnet and automatically aligns with the center of the guide hole, thereby improving the positioning accuracy and positioning speed of the electronic component during welding, thereby improving welding efficiency and welding quality.

[0017] 5. This electronic component structure, which facilitates contact welding, accelerates the diffusion of welding heat into the interior of the substrate by setting a stepped through-hole with a thermally conductive coating electroplated inside the stepped through-hole, reduces local high temperature, avoids delamination of the pad due to excessive welding heat, and improves welding quality. The stepped aperture design optimizes the solder filling path, reduces pores, ensures full solder joints, and further improves welding quality.

[0018] 6. The electronic component structure that facilitates contact welding is provided with an annular groove and a low-melting-point alloy layer. The low-melting-point alloy in the annular groove liquefies during welding, and the surface tension assists in positioning the pins of the electronic component, thereby accelerating positioning speed and accuracy.

[0019] 7. This electronic component structure, which facilitates contact welding, is equipped with a cross-shaped optical positioning mark and a V-shaped guide groove. The cross-shaped optical positioning mark cooperates with the machine vision system to achieve fast and high-precision placement. The V-shaped guide groove guides the pin to be inserted in the correct direction and works together with the cross-shaped optical positioning mark to improve the overall positioning speed and accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 For the present invention Figure 1 A magnified view of middle A; Figure 3 For the present invention Figure 2 Enlarged view of middle B; Figure 4 This is a cross-sectional view along the center of the main pad of the present invention; Figure 5 For the present invention Figure 4 Enlarged view of middle C; Figure 6 This is a cross-sectional view along the center of the auxiliary pad of the present invention; Figure 7 For the present invention Figure 6 Enlarged view of D in the middle.

[0021] In the figure: 1, substrate; 101, first insulating layer; 102, heat dissipation copper foil layer; 103, second insulating layer; 2. Asymmetric pad structure; 201. Main pad; 202. Auxiliary pad; 203. Removable permanent magnet; 204. Diversion hole; 205. Main annular groove; 206. Secondary annular groove; 207. Radial groove; 208. Low-melting-point flux layer; 209. High-activity flux layer; 210. Thermal pad; 211. Conductive bridge; 3. Heat conduction mechanism; 301. Stepped through hole; 302. Heat conduction coating; 303. Cylindrical through hole; 304. Heat conduction filling column; 4. Positioning and anti-deflection mechanism; 401. Annular groove; 402. Low-melting-point alloy layer; 403. Cross-shaped optical positioning mark; 404. V-shaped guide groove. DETAILED DESCRIPTION

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] For example 1, please refer to Figure 1-3 The present invention provides a technical solution: an electronic component structure that is convenient for contact welding, including a substrate 1, including a heat-conducting mechanism 3, the substrate 1 including a first insulating layer 101, a heat-dissipating copper foil layer 102, and a second insulating layer 103, the first insulating layer 101 and the second insulating layer 103 are made of FR-4 epoxy resin, and FR-4 epoxy resin has high mechanical strength, stable electrical properties, excellent heat resistance and flame retardancy, and high insulation resistance, which effectively prevents circuit short circuit and leakage. The heat-dissipating copper foil layer 102 is located between the first insulating layer 101 and the second insulating layer 103. The heat-dissipating copper foil layer 102 is used to direct the welding heat of the main soldering pad 201 and the auxiliary soldering pad 202 to the interior of the substrate 1, reducing local high temperature. An asymmetric soldering pad mechanism 2 and a positioning and anti-deflection mechanism 4 are provided on the side of the first insulating layer 101 away from the heat-dissipating copper foil layer 102; The asymmetric pad mechanism 2 includes a main pad 201 and an auxiliary pad 202. The auxiliary pad 202 is located on one side of the main pad 201. A guide hole 204 is opened at the center of the main pad 201. The guide hole 204 passes through the main pad 201. A detachable permanent magnet 203 is fixedly connected to the inner wall of the guide hole 204.

[0024] The detachable permanent magnet 203 is preferably a high temperature resistant AlNiCo magnet or a NdFeB magnet, and is further preferably an annular high temperature AlNiCo magnet or an annular NdFeB magnet.

[0025] By providing the detachable permanent magnet 203, when electronic components are welded on the substrate 1, the soft magnetic layer of the pin of the electronic component is attracted by the detachable permanent magnet 203 and automatically aligns with the center of the guide hole 204, thereby improving the positioning accuracy and positioning speed of the electronic component during welding, thereby improving the welding efficiency and welding quality.

[0026] The main pad 201 has a hexagonal shape, and a 45° chamfer is provided on the edge of the main pad 201. A main annular groove 205 and a secondary annular groove 206 are provided on the side of the main pad 201 away from the first insulating layer 101. The main annular groove 205 and the secondary annular groove 206 are both centered on the geometric center of the main pad 201. The main annular groove 205 is located inside the secondary annular groove 206. A low-melting-point flux layer 208 is provided inside the main annular groove 205, and a high-activity flux layer 209 is provided inside the secondary annular groove 206. By providing the main annular groove 205 and the secondary annular groove 206, the annular structure can evenly guide the liquid solder to diffuse toward the center, avoiding solder accumulation or voids caused by uneven tension at the edge of the main pad 201, reducing the risk of cold soldering, and improving the welding quality. The flux material in the groove can reduce the interfacial tension between the pad and the solder, enhance wettability, and enable the solder to cover the welding area more quickly and evenly, thereby improving the welding speed. A plurality of radial grooves 207 are formed on the side of the main solder pad 201 facing away from the first insulating layer 101. These grooves extend radially from the geometric center of the main solder pad 201. Heat-conducting pads 210 made of graphene are located within these grooves. These radial grooves 207 and heat-conducting pads 210 guide the solder to diffuse evenly around the pad, reducing local overheating. Furthermore, the heat-conducting pads 210 within the grooves quickly transfer heat from the main solder pad 201 to the thermally conductive coating 302, minimizing the effects of soldering heat and improving soldering quality.

[0027] The auxiliary pads 202 are two arc-shaped structures, located on two adjacent side extensions of a corner of the main pad 201. Their straight edges are parallel to the corresponding sides of the main pad 201. The distance between the straight edges of the two auxiliary pads 202 and the corresponding sides of the main pad 201 is 0.15 mm, and their arc radius is 1 / 2 the length of the corresponding side of the main pad 201. The auxiliary pads 202 and the main pad 201 are located in the same plane, with their arc surfaces facing away from the geometric center of the main pad 201. The two are electrically connected via a conductive bridge 211. By arranging the main pad 201 and the auxiliary pads 202, the main pad 201 and the auxiliary pads 202 form a non-centrally symmetrical layout. This disrupts the surface tension balance, guiding the molten solder to fill the central guide hole 204 and the stepped through-hole 301 of the main pad 201 in a targeted manner, reducing solder overflow or bridging and improving soldering quality.

[0028] Working Principle: Before soldering, the SMT machine accurately transports and positions electronic components to the soldering position based on pre-set procedures and a precise positioning system. Once the electronic component reaches the designated location, its pins are attracted by the magnetic force generated by the removable permanent magnet 203. This attraction automatically moves the pins until they are precisely aligned with the center of the guide hole 204. This automatic alignment mechanism significantly improves soldering accuracy and efficiency, reducing errors that could be caused by manual intervention.

[0029] During soldering, the heating device begins to heat the solder, gradually melting it. As the temperature rises, the low-melting-point flux layer 208 melts first. Its primary function is to activate the surface of the main solder pad 201, removing surface oxides and impurities, and providing a clean, active soldering interface for subsequent soldering. As the temperature continues to rise, the highly active flux layer 209 begins to melt, providing liquid metal that helps the solder better wet the main solder pad 201 and the pins of the electronic component, enhancing the soldering bond. This gradient flux release mechanism leverages the strengths of different fluxes at different soldering stages, significantly improving soldering quality.

[0030] Furthermore, the main pad 201 and auxiliary pad 202 are designed with a non-centrally symmetrical layout. This unique layout disrupts the balance of solder surface tension. After the solder melts, due to the imbalance in surface tension, the molten solder is directed to fill the guide hole 204 at the center of the main pad 201 and the stepped through-hole 301. This design effectively reduces soldering defects such as solder overflow and bridging, thereby improving soldering reliability.

[0031] The soldering process generates a significant amount of heat, so radial grooves 207 and thermal pads 210 are provided on the main solder pad 201. The radial grooves 207 guide the melted solder to diffuse evenly around the pad, preventing excessive solder accumulation in localized areas and thus reducing localized overheating. Furthermore, the thermal pads 210 within the grooves offer excellent thermal conductivity, quickly transferring heat generated on the main solder pad 201 to the thermally conductive coating 302. The thermally conductive coating 302 further transfers the heat to the heat-dissipating copper foil layer 102, ensuring uniform temperature distribution during soldering and improving soldering stability and quality.

[0032] The second embodiment is different from the first embodiment in that: Figure 4-5The heat-conducting mechanism 3 includes a stepped through-hole 301 and a cylindrical through-hole 303 that penetrate the first insulating layer 101 and extend into the heat-dissipating copper foil layer 102. The inner wall of the stepped through-hole 301 is electroplated with a thermally conductive coating 302. The stepped through-hole 301 is a two-layer channel, wide at the top and narrow at the bottom, with an upper aperture of 0.2 mm and a lower aperture of 0.1 mm. The thermally conductive coating 302 is formed using a pulse electroplating process to form a copper layer with a gradient thickness of 18 microns at the top and 10 microns at the bottom. By providing the stepped through-hole 301 and electroplating the thermally conductive coating 302 inside the stepped through-hole 301, the diffusion of welding heat into the interior of the substrate 1 is accelerated, localized high temperatures are reduced, and delamination of the solder pad caused by excessive welding heat is avoided, thereby improving welding quality. The stepped aperture design optimizes the solder filling path, reduces air holes, ensures full solder joints, and further improves welding quality. One end of the thermally conductive coating 302 is electrically connected to the side of the main solder pad 201 near the first insulating layer 101, and the other end is electrically connected to the interior of the heat-dissipating copper foil layer 102. The thermally conductive coating 302 forms a heat conduction path with the main solder pad 201 and the heat-dissipating copper foil layer 102. The interior of the cylindrical through-hole 303 is filled with a thermally conductive filling column 304. The thermally conductive filling column 304 is formed by injecting thermally conductive silicone into a specific mold, shaping it, and then allowing it to solidify naturally. In practice, the thermally conductive filling column 304 can also be a copper column or a copper-plated graphite column, fixed to the interior of the cylindrical through-hole 303 by press-fitting. Compared with thermally conductive silicone, thermally conductive filling columns have a higher thermal conductivity coefficient and thus better thermal conductivity performance.

[0033] One end of the thermally conductive filling column 304 is electrically connected to the side of the auxiliary pad 202 close to the first insulating layer 101, and the other end of the thermally conductive filling column 304 is electrically connected to the inside of the heat dissipation copper foil layer 102. The thermally conductive filling column 304 forms a heat conduction path with the auxiliary pad 202 and the heat dissipation copper foil layer 102. The stepped through hole 301 and the cylindrical through hole 303 are formed by a laser micro-hole processing process. The stepped through hole 301 is located below the geometric center of the main pad 201, and the cylindrical through hole 303 is located below the geometric center of the auxiliary pad 202.

[0034] Working Principle: The main pad 201 forms a low-resistance interface with the heat-dissipating copper foil layer 102 through the thermally conductive coating 302, enhancing heat conduction efficiency. The stepped via 301 features a tapered aperture structure that widens at the top and narrows at the bottom, creating a thermal focusing effect through a sudden change in cross-sectional area. The thermally conductive filler pillars 304 vertically direct heat from the auxiliary pad 202 into the heat dissipation layer, creating a dual-channel heat flow path.

[0035] The wide section of the stepped via 301 rapidly absorbs heat from the main pad 201 by increasing the heat conduction area. The narrow section utilizes a thermal resistance gradient in the via wall material to achieve targeted heat conduction. The aperture contraction ratio creates a heat flow velocity gradient, preventing excessive heat accumulation in the pad area.

[0036] The wide diameter section of the stepped through hole 301 allows the molten solder to fill the pad guide hole 204 at a higher flow rate; the narrow diameter section reduces the amount of solder seepage through the capillary effect.

[0037] The third embodiment is different from the first embodiment in that: Figure 6-7 The positioning and anti-deflection mechanism 4 includes an annular groove 401 arranged around the periphery of the main pad 201 and covering the area where the auxiliary pad 202 is located, two cross-shaped optical positioning marks 403, and four V-shaped guide grooves 404. The depth of the annular groove 401 is 1 / 3 of the thickness of the first insulating layer 101, and the interior is filled with a low-melting-point alloy layer 402. The low-melting-point alloy layer 402 is made of an InSn37 alloy with a melting point of 117°C. By providing the annular groove 401 and the low-melting-point alloy layer 402, the low-melting-point alloy layer 402 in the annular groove 401 liquefies during welding, assisting the positioning of the pins of the electronic components through surface tension, thereby accelerating positioning speed and accuracy. The four V-shaped guide grooves 404 are evenly distributed circumferentially about the main pad 201, with an included angle of 60° and a depth of 1 / 2 of the first insulating layer 101. Two cross-shaped optical positioning marks 403 are located at two opposite corners of the first insulating layer 101. The annular groove 401, the two cross-shaped optical positioning marks 403, and the four V-shaped guide grooves 404 are all formed by laser etching on the first insulating layer 101. By providing the cross-shaped optical positioning marks 403 and the V-shaped guide grooves 404, the cross-shaped optical positioning marks 403 cooperate with the machine vision system to achieve fast and high-precision placement. The V-shaped guide grooves 404 guide the pins to be inserted in the correct direction, and work together with the cross-shaped optical positioning marks 403 to improve overall positioning speed and accuracy.

[0038] Working Principle: Before soldering, the SMT machine's camera captures an image of the cross-shaped optical positioning mark 403 and compares it with a standard template to calculate the global position offset, rotation angle, and local deformation. The system then converts these parameters into compensation values, dynamically correcting the motion trajectory of the component nozzle. Finally, the nozzle accurately places the electronic component on the main solder pad 201 based on the calibrated coordinates. Throughout this movement, the V-shaped guide groove 404 guides the electronic component pins into the correct direction. During soldering, the low-melting-point alloy layer 402 liquefies before the flux. The liquefied low-melting-point alloy uses surface tension to assist in positioning the electronic component pins, accelerating positioning speed and accuracy.

[0039] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An electronic component structure that facilitates contact welding, comprising a substrate (1), characterized in that: Comprising a heat conduction mechanism (3), the substrate (1) comprises a first insulating layer (101), a heat dissipation copper foil layer (102), and a second insulating layer (103); the heat dissipation copper foil layer (102) is located between the first insulating layer (101) and the second insulating layer (103); an asymmetric pad mechanism (2) is provided on a side of the first insulating layer (101) away from the heat dissipation copper foil layer (102); The asymmetric pad mechanism (2) comprises a main pad (201) and an auxiliary pad (202), wherein the auxiliary pad (202) is located on one side of the main pad (201), a guide hole (204) is provided at the center of the main pad (201), the guide hole (204) passes through the main pad (201), and a detachable permanent magnet (203) is movably inserted into the inner wall of the guide hole (204).

2. The electronic component structure for facilitating contact welding according to claim 1, characterized in that: The main pad (201) has a hexagonal shape, and a 45° chamfer is provided on the edge of the main pad (201). A main annular groove (205) and a secondary annular groove (206) are provided on the side of the main pad (201) away from the first insulating layer (101). The main annular groove (205) and the secondary annular groove (206) are both centered on the geometric center of the main pad (201). The main annular groove (205) is located inside the secondary annular groove (206). A low melting point soldering flux layer (208) is provided, a high activity soldering flux layer (209) is provided inside the secondary annular groove (206), a plurality of radial grooves (207) are provided on a side of the main soldering pad (201) away from the first insulating layer (101), the radial grooves (207) extend radially with the geometric center of the main soldering pad (201) as a starting point, a heat conducting sheet (210) is provided inside the radial grooves (207), and the heat conducting sheet (210) is made of graphene.

3. The electronic component structure for facilitating contact welding according to claim 1, characterized in that: The auxiliary pads (202) are two arc-shaped structures, respectively located on two adjacent side extension lines of a corner of the main pad (201), and their straight sides are arranged parallel to the corresponding sides of the main pad (201). The distance between the straight sides of the two auxiliary pads (202) and the corresponding sides of the main pad (201) is 0.15 mm, and the arc radius is 1 / 2 of the length of the corresponding side of the main pad (201). The auxiliary pads (202) and the main pad (201) are located in the same plane, and the arc surface is away from the geometric center of the main pad (201). The two are electrically connected via the conductive bridge portion (211).

4. The electronic component structure for facilitating contact welding according to claim 1, characterized in that: The heat conduction mechanism (3) comprises a stepped through hole (301) and a cylindrical through hole (303) which penetrates the first insulating layer (101) and extends to the interior of the heat dissipation copper foil layer (102); the inner wall of the stepped through hole (301) is electroplated with a heat conductive coating (302); one end of the heat conductive coating (302) is electrically connected to a side of the main soldering pad (201) close to the first insulating layer (101), and the other end is electrically connected to the interior of the heat dissipation copper foil layer (102); the heat conductive coating (302) forms a heat conduction path with the main soldering pad (201) and the heat dissipation copper foil layer (102); the interior of the cylindrical through hole (303) is filled with a heat conductive filling column (304) ), one end of the thermally conductive filling column (304) is electrically connected to a side of the auxiliary pad (202) close to the first insulating layer (101), and the other end of the thermally conductive filling column (304) is electrically connected to the inside of the heat dissipation copper foil layer (102). The thermally conductive filling column (304), the auxiliary pad (202) and the heat dissipation copper foil layer (102) form a heat conduction path. The stepped through hole (301) and the cylindrical through hole (303) are formed by a laser micro-hole processing process. The stepped through hole (301) is located below the geometric center of the main pad (201), and the cylindrical through hole (303) is located below the geometric center of the auxiliary pad (202).

5. The electronic component structure for facilitating contact welding according to claim 4, characterized in that: The stepped through hole (301) is a two-layer channel with a width at the top and a width at the bottom, the aperture of the upper layer is 0.2 mm, and the aperture of the lower layer is 0.1 mm. The thermal conductive coating (302) is formed by a pulse electroplating process to form a copper layer with a gradient thickness, the thickness of the upper layer is 18 microns, and the thickness of the lower layer is 10 microns. The thermal conductive filling column (304) is formed by injecting thermal conductive silicone into a specific mold, shaping it, and then allowing it to solidify naturally.

6. The electronic component structure for facilitating contact welding according to claim 1, characterized in that: A positioning and anti-deflection mechanism (4) is further provided on a side of the first insulating layer (101) away from the heat dissipation copper foil layer (102); the positioning and anti-deflection mechanism (4) comprises an annular groove (401) arranged around the periphery of the main solder pad (201) and covering the area where the auxiliary solder pad (202) is located, two cross-shaped optical positioning marks (403) and four V-shaped guide grooves (404); the depth of the annular groove (401) is 1 / 3 of the thickness of the first insulating layer (101), and the interior is filled with a low-melting-point alloy layer (402); the two cross-shaped optical positioning marks (403) are respectively located at two opposite corners of the first insulating layer (101); the annular groove (401), the two cross-shaped optical positioning marks (403) and the four V-shaped guide grooves (404) are all formed by laser etching on the first insulating layer (101).

7. The electronic component structure for facilitating contact welding according to claim 6, characterized in that: The low melting point alloy layer (402) is made of InSn37 alloy with a melting point of 117°C. The four V-shaped guide grooves (404) are evenly distributed circumferentially about the main pad (201), with an included angle of 60° and a depth of 1 / 2 of the first insulating layer (101).

Images