Display module and display equipment

Abstract

The invention provides a display module and display equipment, the display module comprises a display panel and a flexible circuit board, and the display panel is used for image display; the flexible circuit board is connected with the display panel; the flexible circuit board comprises an insulating base layer, a conductive layer and a protective layer, the conductive layer is arranged on the insulating base layer, the protective layer is arranged on the conductive layer and at least partially covers the conductive layer, and the protective layer is an insulating protective layer; the protection layer is provided with a protection area, an anti-corrosion structure is formed in the protection area, the anti-corrosion structure is arranged in the protection area, corrosion of external media such as water vapor and corrosive ions to the conductive layer can be reduced, the stability and durability of the conductive layer in a severe environment can be improved, and the service life of the conductive layer is prolonged. And the problems of abnormal signal transmission, circuit failure and the like caused by corrosion are avoided, so that the overall reliability of the display module and the display equipment is enhanced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] Active-matrix organic light emitting diode (AMOLED) and flat panel display devices based on light emitting diode (LED) technologies have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream display devices.

[0003] However, the performance of current display products needs to be improved. Summary of the Invention

[0004] The purpose of this application is to provide a display module and a display device, aiming to solve the problem of low performance of display products in traditional technologies.

[0005] A first aspect of an embodiment of the present application provides a display module, comprising:

[0006] A display panel, wherein the display panel is used for displaying images;

[0007] A flexible circuit board connected to the display panel; the flexible circuit board includes an insulating base layer, a conductive layer and a protective layer, the conductive layer is arranged on the insulating base layer, the protective layer is arranged on the conductive layer and at least partially covers the conductive layer, and the protective layer is an insulating protective layer; the protective layer has a protective area, and an anti-corrosion structure is formed in the protective area.

[0008] In some embodiments of the present application, the anti-corrosion structure is an anti-corrosion layer; the anti-corrosion layer is arranged on a side of the protective layer close to the conductive layer.

[0009] In some embodiments of the present application, the anti-corrosion layer is formed by the reaction of an inorganic corrosion-inhibiting material and the conductive layer.

[0010] In some embodiments of the present application, the inorganic corrosion inhibition material is filled in the protective layer, and a portion of the inorganic corrosion inhibition material close to the conductive layer reacts with the conductive layer to form a metal oxide layer, and the metal oxide layer serves as the anti-corrosion layer;

[0011] Alternatively, the anti-corrosion layer is formed by reacting an inorganic corrosion-inhibiting material added to the conductive layer before the protective layer with the conductive layer.

[0012] In some embodiments of the present application, the inorganic corrosion inhibition material includes at least one of nitrite, phosphate, and silicate.

[0013] In some embodiments of the present application, the anti-corrosion structure is an anti-corrosion layer; the anti-corrosion layer is formed on a side of the protective layer away from the conductive layer.

[0014] In some embodiments of the present application, the anti-corrosion layer includes a ceramic coating.

[0015] In some embodiments of the present application, the protective layer is a solder resist layer.

[0016] A second aspect of the embodiments of the present application further provides a display device, comprising the display module as described above, a driver circuit board, and a housing, wherein the driver circuit board is configured to output a display control signal; a flexible circuit board of the display module is connected to the driver circuit board;

[0017] The driving circuit board is disposed in the housing, and the display module has a first state in which the display panel is in the housing and a second state in which the display panel extends out of the housing. In the second state, the flexible circuit board is at least partially exposed outside the housing.

[0018] The protection area is an area of ​​the flexible circuit board exposed outside the housing in the second state.

[0019] In some embodiments of the present application, the display panel is a flexible curling panel, the display panel is stretched to switch the display module from the first state to the second state, and the display panel is curled to switch the display module from the second state to the first state.

[0020] The beneficial effects of the embodiments of the present invention compared with the prior art are as follows: in the above-mentioned display module and display device, the display module includes a display panel and a flexible circuit board, the display panel is used to display images; the flexible circuit board is connected to the display panel; the flexible circuit board includes an insulating base layer, a conductive layer and a protective layer, the conductive layer is arranged on the insulating base layer, the protective layer is arranged on the conductive layer and at least partially covers the conductive layer, and the protective layer is an insulating protective layer; the protective layer has a protection area, and an anti-corrosion structure is formed in the protection area. In this application, the anti-corrosion structure is arranged in the protection area, which can reduce the corrosion of the conductive layer by external media such as water vapor and corrosive ions, which is beneficial to improving the stability and durability of the conductive layer in harsh environments, avoiding problems such as signal transmission abnormalities and circuit failures caused by corrosion, thereby enhancing the overall reliability of the display module and the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1A schematic structural diagram of a display device provided in one embodiment of the present application;

[0022] Figure 2 Another structural schematic diagram of a display device provided in one embodiment of the present application;

[0023] Figure 3 A schematic structural diagram of a display device provided in another embodiment of the present application;

[0024] Figure 4 A schematic structural diagram of a display module provided in one embodiment of the present application;

[0025] Figure 5 A schematic structural diagram of a pixel circuit provided in one embodiment of the present application.

[0026] Specific element symbol description: 100-driving circuit board, 200-display panel, 210-back protective film, 300-flexible circuit board, 310-conductive layer, 320-protective layer, 321-anti-corrosion structure, 330-insulating base layer, 400-soldering pad, 500-marking glue. DETAILED DESCRIPTION

[0027] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0028] It should be noted that when an element is referred to as being “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0029] It should be understood that the terms "length", "width", "up", "down", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0031] It's important to note that in recent years, active-matrix organic light-emitting diode (AMOLED) display technology has continued to advance and mature. This technology boasts high contrast, wide viewing angles, thinness, and flexibility. High contrast ensures distinct shades of light and dark, and accurate color reproduction; wide viewing angles ensure consistent image quality at varying viewing angles; thinness facilitates miniaturization and lightweight design of display devices; and flexibility expands its application scenarios. Leveraging these advantages, AMOLED display technology is becoming increasingly common in automotive displays, with widespread adoption in central control panels, rearview mirrors, and other in-vehicle display components. Flexible OLED roll-to-roll products, due to their deformable display capabilities, are becoming a key development direction for automotive displays.

[0032] In the design and manufacturing of flexible OLED roll-to-roll products, chip-on-film (COF) packaging technology achieves efficient connection between the display chip and the display panel. However, due to the unique form factor of the product, the COF cannot be folded over to the back of the module using traditional methods after bonding. This leaves the solder mask layer (an insulating protective layer formed by liquid photoresist, such as green ink) on the COF surface directly exposed to the external environment.

[0033] In the related art, the solder mask layer can provide insulation and protection for the COF conductive circuit. However, it has obvious deficiencies in blocking corrosive substances in the environment. When halogen-containing foreign matter, such as chlorine (Cl), sulfur (S) and other elements and their compounds, exists in the external environment, these substances easily adhere to the surface of the green oil. On the one hand, the solder mask layer cannot completely block the penetration of elements such as Cl and S; on the other hand, in the high temperature and high humidity environment commonly found in vehicles, the Cl and S elements work together with water vapor to easily induce electrochemical corrosion reactions in the copper (Cu) circuits of the conductive layer. Over time, electrochemical corrosion will cause Cu ion migration, which in turn causes display defects such as dark lines and bright lines on the display screen, seriously affecting the display image quality. At the same time, this corrosion problem will also reduce the stability of the display module signal transmission, significantly shorten the product life, increase after-sales maintenance costs, and fail to meet the strict requirements of vehicle-mounted display equipment for long-term stability and reliability.

[0034] Based on this, the present application improves the relevant display modules and display devices.

[0035] See also Figure 1 and Figure 2 , Figure 1 shows a schematic structural diagram of a display device provided in this embodiment, Figure 2A structural schematic diagram of the display device provided in this embodiment is shown; the display device of the embodiment of the present application includes a driving circuit board 100, a display module and a housing; the display module includes a display panel 200 and a flexible circuit board 300. The driver circuit board 100 is used to output display control signals; the flexible circuit board 300 controls the display panel 200 to display images based on the display control signals; one end of the flexible circuit board 300 is connected to the driver circuit board 100, and the other end is connected to the display panel 200; the flexible circuit board 300 includes an insulating base layer 330, a conductive layer 310 and a protective layer 320, the conductive layer 310 is arranged on the insulating base layer 330, and the protective layer 320 is arranged on the conductive layer 310 and at least partially covers the conductive layer 310, and the protective layer 320 is an insulating protective layer 320; the driver circuit board 100 is arranged in a housing, and the display device has a first state in which the display panel is arranged in the housing and a second state in which the display panel extends outside the housing. In the second state, the flexible circuit board 300 is at least partially exposed outside the housing; when the flexible circuit board 300 is at least partially exposed outside the housing, the protective layer 320 has a protective area exposed outside the housing, and an anti-corrosion structure 321 is formed in the protective area.

[0036] It should be explained that the driver circuit board 100 is the control center of the display device. It generates and outputs display control signals through internal circuit design to control the display content, color, brightness and other parameters of the display panel 200. The display panel 200 is the visual terminal of the display device. Based on the display control signals output by the driver circuit board 100, it realizes the display of text, images, video and other information through the internal display medium (such as liquid crystal, electronic paper, etc.). The flexible circuit board 300 is a component used to realize the electrical connection between the driver circuit board 100 and the display panel 200. The flexible circuit board 300 is composed of an insulating base layer 330, a conductive layer 310 and a protective layer 320. The chip of the flexible circuit board 300 is set on the protective layer 320 and is electrically connected to the conductive layer 310 through the protective layer 320. The housing refers to the physical carrier of the display device, providing a protective space for the driver circuit board 100, and at the same time providing a support and guiding structure for the state switching of the display panel 200, and playing a role in dust and collision prevention for the internal components.

[0037] The conductive layer 310 is responsible for transmitting the display control signal, while the insulating base layer 330 and the protective layer 320 play the role of protecting the conductive layer 310, preventing short circuits, and enhancing structural stability. The conductive layer 310 is a material layer with conductive properties in the flexible circuit board 300, usually made of metal (such as copper foil) or conductive polymer, and can stably transmit the electrical signal output by the driving circuit board 100 to the display panel 200. The insulating base layer 330 can be a PI layer (polyimide layer). The protective layer 320 refers to an insulating layer covering the conductive layer 310, which is made of insulating materials (such as polyimide, epoxy resin, etc.) to prevent the conductive layer 310 from direct contact with the external environment, avoiding problems such as short circuits and oxidation. The anti-corrosion structure 321 is arranged in a protective area where the protective layer 320 is exposed to the external environment. The structure formed by special process or material design can resist the erosion of the flexible circuit board 300 by external corrosive substances (such as halogen elements, acid and alkali gases, moisture), thereby improving the environmental adaptability and service life of the display module.

[0038] It is understandable that when the display device is in the second state, the flexible circuit board 300 is partially exposed. At this time, the anti-corrosion structure 321 in the protection area of ​​the protective layer 320 plays a role in resisting the erosion of the conductive layer 310 by external corrosive substances. Even if it is frequently used in harsh environments such as outdoor and industrial environments, it can avoid problems such as abnormal signal transmission and circuit failure caused by corrosion of the flexible circuit board 300, thereby extending the service life of the display module. Specifically, the display module in the embodiment of the present application is provided with an anti-corrosion structure 321 in the protection area of ​​the protective layer 320 of the flexible circuit board 300, which effectively resists the erosion of the conductive layer 310 by external media such as water vapor and corrosive ions. The anti-corrosion structure 321 can prevent external corrosive media from contacting the conductive layer 310, thereby avoiding faults such as unstable signal transmission and circuit breakage due to corrosion of the conductive layer 310. This not only improves the stability and durability of the conductive layer 310 under harsh conditions, but also ensures the reliable operation of the entire display module, reduces equipment failures and maintenance requirements caused by damage to the flexible circuit board 300, enhances the overall reliability of the display module and display device, and broadens the application scenarios of the product, enabling it to work stably in more complex environments.

[0039] In some embodiments, the flexible circuit board 300 is a chip-on-film (COF). In related technologies, the display driver circuit board 100 is typically integrated into the flexible printed circuit board (FPC) cable. Relying on the inherent bendability of the FPC material, the cable portion carrying the driver circuit is folded to the non-display area below the display panel. A high-precision thermal bonding process is then used to establish a reliable physical and electrical connection (bonding process) between the gold bumps on the surface of the driver circuit board and the inner leads in the flexible substrate circuit. However, this application targets display modules that are difficult to fold under the screen, such as in-vehicle displays with a roll-up form factor, foldable electronic devices, and the like.

[0040] In some embodiments of this application, please refer to Figure 3 , Figure 3 Schematic diagram of the structure of the display device provided by this embodiment is shown; the anti-corrosion structure 321 of this embodiment is an anti-corrosion layer; the anti-corrosion layer is arranged on the side of the protective layer 320 close to the conductive layer 310.

[0041] It should be explained that the anti-corrosion layer is a specific implementation of the anti-corrosion structure 321. It is a special functional layer formed on the side of the protective layer 320 close to the conductive layer 310. It is used to resist the erosion of the conductive layer 310 by corrosive media such as water vapor, chloride ions, and sulfur ions. In actual application scenarios, once these corrosive media come into contact with the conductive layer 310, they can easily trigger electrochemical corrosion reactions, causing the performance of the conductive layer to degrade or even fail. The anti-corrosion layer, through its special material properties and structural design, can isolate these destructive media from the conductive layer 310, thereby significantly improving the durability and stability of the display module in complex environments.

[0042] It is understandable that the anti-corrosion layer is formed in the protection area, and the protective layer 320 is attached to one side of the conductive layer 310. Specifically, a feasible implementation method is to add a specific reaction medium during the preparation process of the protective layer 320. These reaction media can react chemically with the material of the conductive layer 310 (such as copper) to form a dense passivation protective layer 320 on the surface of the conductive layer. For example, certain metal oxides or metal salt reaction media undergo redox reactions with copper under certain conditions to form a uniform and stable passivation film. The passivation film has good chemical stability and physical barrier properties, which can greatly reduce the probability of contact between external corrosive ions and the conductive layer 310, fundamentally suppressing the occurrence of corrosion reactions, thereby achieving the effect of protecting the conductive layer 310 from corrosion by external corrosive ions.

[0043] In some embodiments of the present application, the anti-corrosion layer is formed by the reaction of an inorganic corrosion-inhibiting material and the conductive layer 310 .

[0044] It is understandable that, for example, if the inorganic corrosion inhibition material is a nitrite corrosion inhibitor, it can prevent the conductive layer 310 from being corroded by the anodic inhibition effect. In the case where the material of the conductive layer 310 is Cu, the nitrite corrosion inhibitor undergoes an oxidation reaction with the copper surface. Nitrite will seize electrons on the copper surface, causing copper atoms to lose electrons and become copper ions, and then form a dense, thin and strong oxide film on the copper surface (the main component may be a substance similar to Cu2O, CuO). This oxide film adheres to the surface of copper, isolating the copper from the surrounding media that may cause corrosion (such as those containing Cl-, S 2 -Solutions with corrosive ions, etc.)

[0045] In some embodiments of the present application, the inorganic corrosion inhibition material is filled in the protective layer 320, and part of the inorganic corrosion inhibition material near the conductive layer 310 reacts with the conductive layer 310 to form a metal oxide layer, which is an anti-corrosion layer.

[0046] It is understandable that for anodic corrosion inhibitors (such as nitrites and chromates), if the oxide film on the surface of the conductive layer 310 is defective due to mechanical damage or erosion by corrosive media, such as corrosive media in the external environment, such as humid air containing chlorine and sulfides, and sweat, the oxide film will continue to erode. When defects occur in the oxide film, the conductive layer metal is directly exposed to the risk of corrosion, which can easily cause local corrosion, such as pitting and crevice corrosion. However, the corrosion inhibitor dispersed in the protective layer 320 can rely on its own oxidizing properties to diffuse to the defects on the surface of the conductive layer 310 in the form of ions or molecules through the pores, molecular gaps and other channels inside the protective layer. In the defective area, the corrosion inhibitor undergoes an oxidation-reduction reaction with the exposed metal atoms, reoxidizing the metal into a stable metal oxide, filling the damaged parts of the oxide film, and restoring the passivation film to its integrity. This repair mechanism can not only effectively inhibit the local corrosion that has already occurred, but also prevent the formation of new corrosion points, significantly improving the corrosion resistance of the conductive layer 310 in harsh environments, and ensuring the long-term stable operation of the display module.

[0047] In some embodiments, the anti-corrosion layer is formed by reacting an inorganic corrosion-inhibiting material added to the conductive layer 310 before the protective layer 320 with the conductive layer 310 .

[0048] Specifically, during the preparation process, an inorganic corrosion inhibition material may be added to the conductive layer 310 first, and after the inorganic corrosion inhibition material and the conductive layer 310 react to form an oxide film layer, the protective layer 320 may be provided on the oxide film layer.

[0049] In some embodiments of the present application, the inorganic corrosion inhibition material includes at least one of nitrite, phosphate, and silicate.

[0050] It is understandable that phosphates (such as sodium phosphate, potassium phosphate) and silicates (such as sodium silicate) have different mechanisms of action in the anti-corrosion process. Taking phosphates as an example, when the display module is in a corrosive environment, phosphate ions will chemically react with copper ions on the copper surface to form insoluble basic copper phosphate or other types of phosphate compounds. These compounds gradually deposit on the copper surface to form a dense and highly adhesive phosphate protective film. This protective film can effectively cover the active sites on the copper surface, blocking the anodic dissolution process in which copper atoms lose electrons and are converted into copper ions, thereby reducing the corrosion rate of copper.

[0051] As for silicates, sodium silicate will hydrolyze in aqueous solution to produce silicate ions. These silicate ions can react with copper ions produced by corrosion on the copper surface to form a gel-like or glass-like film with a three-dimensional network structure. This film has good flexibility and chemical stability, can fit tightly on the copper surface, act as a physical barrier, and significantly increase the resistance of corrosive media (such as chloride ions, oxygen and water molecules) to diffuse to the copper surface. In addition, the film can also regulate the charge distribution on the metal surface, inhibit the electrochemical reaction process of the corrosion reaction, and further enhance the protective effect of the conductive layer.

[0052] In some embodiments, the inorganic corrosion-inhibiting material may further include at least one of nitrite, phosphate, silicate, molybdate, and borate.

[0053] It is understandable that molybdates (such as sodium molybdate) play a role in the anti-corrosion process through multiple mechanisms. When molybdate is dissolved in trace moisture or corrosive solutions in the environment, molybdate ions migrate to the copper surface. On the one hand, molybdate ions have strong oxidizing properties and can promote the oxidation reaction of copper atoms on the copper surface to form a dense copper oxide film. The film has good chemical stability and barrier properties, which can effectively prevent corrosive media from directly contacting the copper matrix. On the other hand, molybdate ions can react with copper ions to form stable copper molybdate complexes. These complexes are deposited on the copper surface to form a protective film, filling the tiny pores or defects of the oxide film and further enhancing the integrity of the protective film. Through the dual effects of the above-mentioned oxidation film and complex film, molybdate can significantly inhibit the oxidation reaction of copper and slow down the corrosion rate of the conductive layer 310.

[0054] The anti-corrosion mechanism of borates (such as sodium borate) is mainly based on their film-forming properties on metal surfaces. In aqueous solution, borates will hydrolyze to generate borate ions and a series of boron-containing hydroxyl compounds. These compounds have strong surface activity and can be quickly adsorbed on the copper surface to form a thin and continuous adsorption film. As the reaction proceeds, the boron-containing compound can react chemically with the metal ions on the copper surface to form a borate compound film with a certain hardness and chemical stability. This film layer has good physical barrier properties and can effectively prevent corrosive media such as water molecules, oxygen, and chloride ions from penetrating the copper surface. In addition, the protective film formed by borates also has a certain self-repairing ability. When the film layer is slightly damaged, the borate ions in the surrounding environment can quickly migrate to the damaged area and re-form a protective film, thereby continuing to play an anti-corrosion role.

[0055] Specifically, the alkaline nature of some inorganic corrosion inhibitors (such as borates and silicates) provides unique advantages in corrosion protection. In practical applications, carbonic acid, formed when carbon dioxide dissolves in water, or other acidic pollutants, can lower the pH of the local environment, accelerating metal corrosion. After hydrolysis in protective layer 320, borates and silicates release alkaline substances such as hydroxide ions. These alkaline substances can neutralize the acidic components in the environment and increase the pH of the local area. Hydrogen evolution corrosion typically occurs in acidic environments. When the pH increases, the hydrogen ion concentration decreases, significantly reducing the rate of the hydrogen evolution reaction. Furthermore, a higher pH value also changes the electrode potential of the oxygen reduction reaction, inhibiting the oxygen reduction process on the metal surface, thereby effectively slowing the cathodic reaction of corrosion. The corrosion inhibitors dispersed in protective layer 320 continuously and slowly release alkaline ions, creating a stable alkaline microenvironment within protective layer 320 and near its interface with conductive layer 310. This modifies the thermodynamic and kinetic conditions of the corrosion reaction, reduces the corrosion driving force, and ultimately achieves long-term protection for conductive layer 310.

[0056] In some embodiments of this application, please continue to refer to Figure 2 In this embodiment, the anti-corrosion structure 321 is an anti-corrosion layer; the anti-corrosion layer is formed on a side of the protective layer 320 away from the conductive layer 310 .

[0057] It should be explained that the anti-corrosion layer is a specific implementation form of the anti-corrosion structure 321. It is a special functional layer formed on the side of the protective layer 320 away from the conductive layer 310, which is used to resist the erosion of the conductive layer 310 by external media such as water vapor and corrosive ions. The anti-corrosion layer works through the dual mechanisms of physical barrier and chemical protection. From a physical perspective, its dense structure can directly block the contact between the external corrosive medium and the protective layer 320, reducing the possibility of the medium penetrating into the conductive layer 310; from a chemical perspective, the anti-corrosion layer material can react chemically with potential corrosive substances, converting them into harmless or low-activity substances, thereby avoiding damage to the conductive layer. For example, when there are chloride-containing corrosive ions in the environment, certain components in the anti-corrosion layer material can combine with chloride ions to form stable compounds, thereby eliminating the threat of chloride ions to the conductive layer.

[0058] It is understandable that in the embodiment of the present application, after preparing the original protective layer 320, the anti-corrosion layer can be prepared on the protected area of ​​the protective layer 320. This step-by-step preparation method has significant process advantages. On the one hand, in the existing display module production process, the preparation process of the protective layer 320 is relatively mature. On this basis, the anti-corrosion layer preparation step is added without the need for large-scale transformation of the original production line. It can be achieved by adding specific coating, deposition or curing equipment, which greatly reduces the cost of process improvement. On the other hand, step-by-step preparation allows the materials and process parameters of the anti-corrosion layer and the protective layer to be optimized separately. For example, a material with stronger weather resistance can be selected to prepare the anti-corrosion layer according to the actual application scenario, and the existing mature formula can be used to prepare the protective layer 320. This not only ensures the anti-corrosion performance, but also ensures the compatibility between the two-layer structure, avoids problems such as delamination and peeling caused by material mismatch, and ultimately achieves a balance between process complexity and protection effect.

[0059] In some embodiments of the present application, the anti-corrosion layer includes a ceramic coating.

[0060] It is understandable that the ceramic coating, as an anti-corrosion layer, helps improve the environmental adaptability and service life of the display module. Ceramic materials themselves are extremely chemically inert and can effectively resist erosion by corrosive substances such as water vapor, acids and alkalis. In harsh environments such as high humidity and strong acids and alkalis, it provides long-term protection for the conductive layer 310, significantly improving the corrosion resistance of the conductive layer 310 compared to traditional protection methods. At the same time, the ceramic coating has high hardness and wear resistance, and can withstand external mechanical friction and collisions, avoiding corrosion failure due to surface damage, and ensuring the reliability of the display module in complex usage scenarios.

[0061] Specifically, the corrosion resistance of ceramic coatings stems from their unique microstructure and chemical composition. Most ceramic materials are composed of inorganic compounds such as metal oxides, nitrides or carbides, and their atoms are bonded by ionic bonds or covalent bonds to form a highly stable crystal structure. This structure makes the ceramic coating almost non-reactive with external chemical substances, effectively isolating the contact between the corrosive medium and the conductive layer 310. Taking alumina ceramic coating as an example, its dense crystal structure can prevent water molecules from penetrating and inhibit the occurrence of electrochemical corrosion; while silicon nitride ceramic coating has excellent tolerance to acidic environments, can neutralize acidic substances in the environment, and maintain the chemical stability of the surface of the conductive layer. In addition, the thickness and uniformity of the ceramic coating can be precisely controlled through processes such as physical vapor deposition (PVD), chemical vapor deposition (CVD) or thermal spraying to ensure that a continuous and defect-free protective barrier is formed on the surface of the protective layer, further enhancing the anti-corrosion effect.

[0062] In some embodiments of the present application, the protection layer 320 is a solder resist layer.

[0063] It should be explained that the solder resist layer can specifically be a green oil layer. The green oil layer (Surface Resist, SR) is a layer of material covering the surface of the conductive layer 310. Its main function is to protect the internal conductive circuits, act as an insulator, prevent short circuits between circuits, and ensure the stability and reliability of the circuit.

[0064] In some embodiments of the present application, the display panel 200 is a flexible curling panel, and the display device is configured such that the display panel can be switched from a first state to a second state when stretched, and can be switched from a second state to a first state when curled.

[0065] It is understandable that for a flexible curling panel, after the screen is pulled out, the flexible circuit board 300 therein will be at least partially exposed to the external environment and may be stained with corrosive media such as sweat. The traditional solder mask layer cannot provide sufficient anti-corrosion effect. Therefore, in the embodiment of the present application, an anti-corrosion structure 321 is added to the area that is easily corroded to achieve the effect of protecting the conductive layer 310 from corrosion. In actual use scenarios, the frequent curling and stretching of the flexible curling panel will produce continuous mechanical stress on the flexible circuit board 300, causing micro cracks or peeling of the solder mask. Especially in scenarios with frequent human contact, components such as sodium chloride and urea in sweat, as well as corrosive substances such as moisture in the environment and sulfides in industrial waste gas, will penetrate into the surface of the conductive layer 310 through these tiny defects. These corrosive media will not only cause electrochemical corrosion of the conductive layer 310, but may also react with metal ions to accelerate the migration of copper ions, resulting in dark lines, flowery screens and other faults on the display screen. The addition of anti-corrosion structure 321 effectively addresses these issues through a dual mechanism of physical barrier and chemical protection. For example, when anti-corrosion structure 321 utilizes a dense ceramic coating, its highly stable crystal structure prevents the penetration of corrosive media. If a coating containing a corrosion inhibitor is used, when corrosive media intrude, the inhibitor undergoes a redox reaction or complexation with the metal, forming a protective film on the surface of conductive layer 310. This significantly improves the reliability and service life of the display module in complex environments.

[0066] In some embodiments, the display device may be a mobile phone, a tablet, a desktop computer, a laptop computer, a wearable device, a car screen, a sensor device, etc.

[0067] Specifically, the display device is a flexible curled vehicle-mounted screen, such as a central control instrument panel, a rearview mirror, etc.

[0068] Further, see Figure 4 , Figure 4 A schematic diagram of the structure of the display module provided by this embodiment is shown. The present application also discloses a display module comprising a display panel 200 and a flexible circuit board. The display panel 200 is used for displaying images. The flexible circuit board 300 is connected to the display panel 200. The flexible circuit board 300 comprises an insulating base layer 330, a conductive layer 310, and a protective layer 320. The conductive layer 310 is disposed on the insulating base layer 330. The protective layer 320 is disposed on the conductive layer 310 and at least partially covers the conductive layer 310. The protective layer 320 is an insulating protective layer 320. The protective layer 320 has a protective region, and an anti-corrosion structure 321 is formed within the protective region.

[0069] In an embodiment of the present application, the insulating base layer 330 is a polyimide (PI) layer. The conductive layer 310 is made of Cu material and serves as a conductive circuit layer for transmitting electrical signals. The protective layer 320 is an SR surface coating layer. The conductive layer 310 is connected to the display panel 200 through an anisotropic conductive film (ACF) and a pad 400. Under processes such as hot pressing, the conductive particles in the ACF will realize electrical connection between the chip and the pad 400 (PAD) in the vertical direction, while maintaining insulation in the horizontal direction, accurately ensuring the stable transmission of electrical signals between the chip and the substrate. A back protective film 210 (BPF, Back Protect Film) is also provided on the back of the display panel 200. The marking glue 500 is used to fix the structure of each layer, enhance the overall mechanical strength and stability, and prevent separation or displacement between layers.

[0070] It is understandable that if the conductive layer 310 corrodes, short circuits may easily occur between the multiple wiring structures within the conductive layer 310, thereby causing a short circuit in the corresponding pads 400, which in turn may cause bright or dark lines to appear on the display panel 200. However, in the embodiment of the present application, the protective layer 320 is provided to reduce the possibility of corrosion of the conductive layer 310, which helps reduce the risk of circuits between the pads 400, thereby improving the bright and dark line problems of the display panel 200 and improving the reliability of the display module.

[0071] Specifically, see Figure 5 , Figure 5 The schematic diagram of the pixel circuit provided in this embodiment shows the structure of the Vdata signal. The Vdata signal is involved in the control of the OLED device. If a short circuit occurs between the pads 400 on the flexible circuit board 300, the Vdata signal will be interfered with, thereby affecting the on / off of the OLED device and further affecting the appearance of bright or dark lines on the display panel 200.

[0072] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0073] The basic concepts have been described above. It will be apparent to those skilled in the art that the detailed disclosure above is merely illustrative and does not limit the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and amendments to the present application. Such modifications, improvements, and amendments are suggested in the present application and remain within the spirit and scope of the exemplary embodiments of the present application.

[0074] At the same time, this application uses specific terms to describe the embodiments of this application. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "one embodiment," "an embodiment," or "an alternative embodiment" mentioned twice or multiple times in different locations in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application may be appropriately combined.

[0075] Similarly, it should be noted that, in order to simplify the presentation of this application and thus facilitate understanding of one or more embodiments of the invention, the foregoing descriptions of the embodiments of this application sometimes combine multiple features into a single embodiment, figure, or description thereof. However, this disclosure method does not mean that the subject matter of this application requires more features than those recited in the claims. In fact, an embodiment may have fewer features than all of the features of a single embodiment disclosed above.

[0076] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A display module, characterized in that: The display module includes: A display panel, wherein the display panel is used for displaying images; A flexible circuit board connected to the display panel; the flexible circuit board includes an insulating base layer, a conductive layer and a protective layer, the conductive layer is arranged on the insulating base layer, the protective layer is arranged on the conductive layer and at least partially covers the conductive layer, and the protective layer is an insulating protective layer; the protective layer has a protective area, and an anti-corrosion structure is formed in the protective area.

2. The display module according to claim 1, wherein: The anti-corrosion structure is an anti-corrosion layer; the anti-corrosion layer is arranged on a side of the protective layer close to the conductive layer.

3. The display module according to claim 2, wherein: The anti-corrosion layer is formed by the reaction of an inorganic corrosion-inhibiting material and the conductive layer.

4. The display module according to claim 3, wherein: The inorganic corrosion inhibition material is filled in the protective layer, and a portion of the inorganic corrosion inhibition material close to the conductive layer reacts with the conductive layer to form a metal oxide layer, which serves as the anti-corrosion layer; Alternatively, the anti-corrosion layer is formed by reacting an inorganic corrosion-inhibiting material added to the conductive layer before the protective layer with the conductive layer.

5. The display module according to claim 4, wherein: The inorganic corrosion inhibition material includes at least one of nitrite, phosphate and silicate.

6. The display module according to claim 2, wherein: The anti-corrosion structure is an anti-corrosion layer; the anti-corrosion layer is formed on a side of the protective layer away from the conductive layer.

7. The display module according to claim 5, wherein: The anti-corrosion layer includes a ceramic coating.

8. The display module according to any one of claims 1 to 7, wherein: The protective layer is a solder resist layer.

9. A display device, characterized in that: The display module comprises a display module according to any one of claims 1 to 8, a driver circuit board, and a housing, wherein the driver circuit board is used to output a display control signal; and a flexible circuit board of the display module is connected to the driver circuit board; The driving circuit board is disposed in the housing, and the display module has a first state in which the display panel is in the housing and a second state in which the display panel extends out of the housing. In the second state, the flexible circuit board is at least partially exposed outside the housing. The protection area is an area of ​​the flexible circuit board exposed outside the housing in the second state.

10. The display device according to claim 9, wherein The display panel is a flexible curling panel. The display panel is stretched to switch the display module from the first state to the second state. The display panel is curled to switch the display module from the second state to the first state.

Images