Cutting apparatus using laser

Abstract

According to one embodiment of the present invention, an apparatus for cutting a material for a secondary battery using a laser comprises: a first laser light source that emits a first laser for cutting the material for the secondary battery; and the second laser light source emits second laser light used for heating the cut area of the material, and the first laser light and the second laser light irradiate the material in a synchronous state.

Description

Technical Field

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of Korean Patent Application No. 10-2023-0038716, filed on March 24, 2023, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety.

[0003] The present disclosure relates to a laser cutting apparatus, and more particularly, to a laser cutting apparatus in which a cut portion is neatly and cleanly processed during cutting of a material for a secondary battery using a laser, thereby improving the quality of the cut material. Background Art

[0004] In modern society, with the daily use of portable devices such as mobile phones, notebook computers, video cameras, and digital cameras, technological development in fields related to these mobile devices is also becoming increasingly active. In addition, rechargeable / dischargeable secondary batteries are used as power sources for electric vehicles (EVs), hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (P-HEVs), etc., in an attempt to solve the air pollution caused by the use of fossil fuels by existing gasoline vehicles. Therefore, the demand for the development of secondary batteries is growing.

[0005] Currently, commercial secondary batteries include nickel-cadmium batteries, nickel-metal hydride batteries, nickel-zinc batteries, lithium secondary batteries, etc. Among these batteries, lithium secondary batteries have attracted widespread attention due to their advantages such as almost no memory effect compared to nickel-based secondary batteries, free charge and discharge, extremely low self-discharge rate, and high energy density.

[0006] The manufacturing process of lithium secondary batteries is broadly divided into the electrode process, the assembly process, and the molding process. The electrode process is further divided into the active material mixing process, the electrode coating process, the rolling process, the slitting process, and the winding process. For example, when cutting the electrodes during the slitting process, a pressing device using a blade can be used, but laser cutting can also be used to minimize the generation of foreign matter and breakage.

[0007] Figure 1 FIG. 1 shows a laser cutting device according to conventional technology. The laser cutting device includes a laser light source 11 that irradiates laser light onto a secondary battery material 1 such as an electrode sheet, and may include a mirror (not shown) and / or a lens 12 located on the optical path to change and adjust the optical path of the laser light. According to this conventional technology, the laser light source 11 radiates infrared laser light. The pulse duration of the laser light may be, for example, in the order of picoseconds (ps, 10 -12 s).

[0008] When the material 1 for a secondary battery such as an electrode sheet is cut using such a laser cutting apparatus, a more efficient method for processing the cut portion neatly and cleanly is required. Summary of the Invention

[0009] Technical issues

[0010] An object of the present disclosure is to provide a laser cutting apparatus in which, in a process of cutting a material for a secondary battery using a laser, a cut portion is processed neatly and cleanly, thereby improving the quality of the cut material.

[0011] However, the technical problems to be solved by the embodiments of the present disclosure are not limited to the above-mentioned problems, and various extensions can be made within the scope of the technical concept included in the present disclosure.

[0012] Technical Solution

[0013] According to one embodiment of the present disclosure, a laser cutting device is provided, which uses laser to cut materials for secondary batteries. The laser cutting device includes: a first laser light source, which emits a first laser for cutting the material for secondary batteries; and a second laser light source, which emits a second laser for heating the cut portion of the material, wherein the first laser and the second laser are synchronized and irradiated onto the material in a state where the optical paths are combined into one optical path.

[0014] The second laser may heat the material, thereby increasing the reactivity of the material and removing byproducts produced by the cutting.

[0015] The first laser may have an ultraviolet wavelength band, the second laser may have an infrared wavelength band, and the output of the second laser may be smaller than the output of the first laser.

[0016] The pulse duration of the second laser may be longer than the pulse duration of the first laser.

[0017] The pulse duration of the first laser may be from several picoseconds to several thousand picoseconds (ps, 10 -12 s) or from a few femtoseconds to several thousand femtoseconds (fs, 10 -15 s), and the pulse duration of the second laser may have a value from several nanoseconds to several thousand nanoseconds (ns, 10 -9 s) value.

[0018] The first laser and the second laser may be coaxially irradiated onto the material, and a light width of the second laser may be greater than a light width of the first laser.

[0019] The laser cutting equipment also includes a pulse synchronization unit connected to each of the first laser light source and the second laser light source, wherein the pulse synchronization unit can synchronize the first laser and the second laser emitted from the first laser light source and the second laser light source respectively, and can perform pulse width modulation (PWM).

[0020] The laser cutting apparatus includes a beam splitter that combines the first laser light and the second laser light emitted from the first laser light source and the second laser light source, respectively, into one optical path, wherein the combined first laser light and second laser light can be irradiated onto the material.

[0021] The beam splitter may transmit the first laser light and reflect the second laser light.

[0022] An angle between the first laser light entering the spectrometer and the first laser light extracted from the spectrometer may be 180 degrees, and an angle between the second laser light entering the spectrometer and the second laser light extracted from the spectrometer may be 90 degrees.

[0023] The beam splitter may be a planar beam splitter or a cubic beam splitter.

[0024] The plane beam splitter may be a mirror that transmits the first laser light and reflects the second laser light.

[0025] The laser cutting apparatus further includes a focusing lens disposed in an optical path between the beam splitter and the material, wherein the focusing lens can focus the first laser and the second laser so as to irradiate the material in a focused manner.

[0026] The focusing lens is provided as at least one and may include a plane convex lens, a biconvex lens, or a meniscus convex lens.

[0027] The laser cutting equipment may further include an aperture for adjusting a light width of the second laser.

[0028] The laser cutting device may further include a mirror disposed between the first laser light source and the beam splitter, wherein the mirror may adjust an optical path of the first laser light entering the beam splitter.

[0029] The laser cutting device further includes a mirror disposed between the second laser light source and the beam splitter, wherein the mirror adjusts an optical path of the second laser light entering the beam splitter.

[0030] The secondary battery material may include at least one of a positive electrode, a negative electrode, and a separator of the secondary battery.

[0031] Beneficial effects

[0032] According to the embodiment of the present disclosure, there is an advantage that the cut portion (the boundary portion of the cut surface, etc.) can be neatly and cleanly processed during the cutting of the secondary battery material.

[0033] Furthermore, by using the laser cutting apparatus according to an embodiment of the present disclosure, the quality of electrodes and / or separators manufactured by the laser cutting apparatus can be significantly improved, thereby improving the performance of the manufactured battery. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A laser cutting apparatus according to conventional technology is schematically shown.

[0035] Figure 2 A laser cutting device according to an embodiment of the present disclosure is schematically shown.

[0036] Figure 3 yes Figure 2 A partial enlarged view of the laser cutting equipment.

[0037] Figure 4 Shown Figure 2 A case where pulses of a first laser and a second laser of a laser cutting device are provided in synchronization with each other.

[0038] Figure 5 A laser cutting device according to another embodiment of the present disclosure is schematically shown.

[0039] Figure 6 A laser cutting device according to another embodiment of the present disclosure is schematically shown. DETAILED DESCRIPTION

[0040] Hereinafter, various embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily perform these embodiments. The present disclosure can be modified in various ways and is not limited to the embodiments set forth herein.

[0041] In order to clearly describe the present disclosure, parts irrelevant to the description will be omitted, and the same reference numerals denote the same elements throughout the specification.

[0042] In addition, in the drawings, the size and thickness of each element are arbitrarily enlarged or reduced for the convenience of description, so it is obvious that the present disclosure is not necessarily limited to those shown in the drawings. In the drawings, the thickness of some layers, regions, etc. are exaggerated for the sake of clarity. In the drawings, the thickness of some layers and regions are exaggerated for the sake of convenience of description.

[0043] Furthermore, it should be understood that when an element, such as a layer, film, region, or plate, is referred to as being "on" or "over" another element, it can be directly on the other element, or intervening elements may be present. Conversely, when an element is referred to as being "directly on" another element, this means that no other intervening elements are present. Furthermore, a portion being "on" or "above" a reference portion means that the portion is above or below the reference portion, and does not specifically mean that the portion is "above" or "on" the reference portion in a direction opposite to the force of gravity. Furthermore, similar to the case where a portion is described as being formed or located "on" or "above" another portion, the case where a portion is described as being formed or disposed "below" or "beneath" another portion will be understood with reference to the above.

[0044] Furthermore, since the upper surface / lower surface of a specific member may be determined differently depending on which direction is used as a reference, throughout this specification, “upper surface” or “lower surface” is defined to mean two facing surfaces on the z-axis of the corresponding member.

[0045] In addition, throughout the specification, when a part is referred to as “including” or “comprising” a certain component, unless otherwise specified, it means that the part may further include other components, rather than excluding other components.

[0046] Furthermore, throughout the specification, when referred to as a “plane”, this means observing the target portion from the upper side, and when referred to as a “cross section”, this means observing the target portion from one side of a cross section cut vertically.

[0047] Now, a laser cutting apparatus according to one embodiment of the present disclosure will be described.

[0048] Figure 2 A laser cutting device 100 according to one embodiment of the present disclosure is schematically shown. Figure 3 yes Figure 2 A partially enlarged view of the laser cutting equipment 100. Figure 4 Shown Figure 2 A case where pulses of the first laser A and the second laser B of the laser cutting apparatus 100 are provided in synchronization with each other.

[0049] The laser cutting device 100 according to an embodiment of the present disclosure includes at least two laser light sources having different wavelength bands. Figure 2 A case is shown in which the laser cutting apparatus 100 as an embodiment of the present disclosure includes a first laser light source 110 and a second laser light source 120 .

[0050] First, the material 1 of the material for a secondary battery that can be cut using the material cutting device according to the embodiment of the present disclosure may be, for example, an electrode sheet and / or a diaphragm sheet. The electrode according to the present disclosure may be a positive electrode or a negative electrode. That is, the material cutting device according to the embodiment of the present disclosure is not particularly limited to the positive electrode and the negative electrode, and can even be easily applied to the cutting of any electrode, and different electrodes can be manufactured according to the material used in the manufacture of each electrode (for example, a positive electrode active material or a negative electrode active material). Similarly, the material cutting device according to the embodiment of the present disclosure can be applied without being particularly limited to the type of diaphragm (depending on the type of component, material, etc.), and can even be easily applied to the cutting of any diaphragm. In addition, the material cutting device according to the embodiment of the present disclosure is not limited to those mentioned above, and can be applied to various materials as long as they are used to manufacture secondary batteries.

[0051] The first laser light source 110 emits a first laser A for cutting the secondary battery material 1. The first laser light source 110 emits, for example, the first laser A in the ultraviolet band. The pulse duration of the first laser A can be, for example, picoseconds (ps, 10 -12 s) or femtoseconds (fs, 10 -15 That is, the pulse duration of the first laser A is from a few picoseconds to several thousand picoseconds (ps, 10 -12 s) or from a few femtoseconds to thousands of femtoseconds (fs, 10 -15 s) value.

[0052] For reference, a femtosecond laser is a laser with a very short pulse width (duration) of femtoseconds, while a picosecond laser is a laser with a very short pulse width (duration) of picoseconds. If the short pulse width and high peak output characteristics of such a femtosecond or picosecond laser are used for laser processing, the duration of the irradiated laser pulse is shorter than the thermal diffusion time of the material being processed, enabling non-thermal processing without thermal degradation of the material.

[0053] Furthermore, when such femtosecond lasers or picosecond lasers are used, they produce large peak outputs with relatively less energy than conventional continuous wave or nanosecond lasers, and therefore, the impact applied to the processed sample is low, which enables high-quality ultra-precision microprocessing.

[0054] The second laser light source 120 emits a second laser B for heating the cut portion (cut portion) of the secondary battery material 1. The second laser B is synchronized with the first laser A and irradiated onto the material 1 in a state where the optical paths are combined into one optical path (see Figure 4), as will be described later. By heating the material 1 with the second laser B, the reactivity (electron reactivity, etc.) is improved. In addition, the byproducts generated by the cutting of the first laser A are removed by the reaction with the second laser B, so that the cut portion of the material 1 is processed neatly and cleanly.

[0055] The second laser light source 120 emits a second laser B, for example, in the infrared wavelength band. The second laser B heats the cut portion of the material 1, and thus the second laser light source 120 has a lower output than the first laser light source 110 that emits the first laser A (which is the cutting laser). In addition, the pulse duration of the second laser B can be, for example, nanoseconds (ns, 10 -9 That is, the pulse duration of the second laser B is from a few nanoseconds to several thousand nanoseconds (ns, 10 -9 s) value.

[0056] In addition, in one embodiment of the present disclosure, the first laser light source 110 and the second laser light source 120 are respectively connected to a pulse synchronization unit 130. The pulse synchronization unit 130 delays and synchronizes the first laser A and the second laser B emitted from the first laser light source 110 and the second laser light source 120, respectively, and then inputs a pulse width modulation signal (PWM) to each of the first laser A and the second laser B. That is, an external trigger signal is input to each of the first laser A and the second laser B, and the first laser A and the second laser B are emitted in the form of a PWM signal. Thus, as Figure 4 As shown, pulses of the first laser light A and the second laser light B that are synchronized with each other can be obtained.

[0057] When such pulse-synchronized first laser A and second laser B are irradiated onto material 1, material 1 is cut by the first laser A. At the same time, byproducts caused by the cutting of material 1 are heated and removed by the second laser B, thereby improving the quality of the cut material 1.

[0058] Furthermore, as previously described, in order to ensure that the first laser A and the second laser B can be emitted synchronously and simultaneously irradiate the same portion of the material 1, it is necessary to combine the optical path of the first laser A and the optical path of the second laser B into one optical path. The laser cutting apparatus 100 according to an embodiment of the present disclosure includes a beam splitter 140 disposed on an optical path extending from the first laser light source 110 and the second laser light source 120 to the focusing lens 150, which will be described later.

[0059] The beam splitter 140 combines the first laser light A and the second laser light B emitted from the first laser light source 110 and the second laser light source 120 into one optical path, and irradiates the combined first laser light A and second laser light B onto the material 1 .

[0060] For example, the beam splitter 140 reflects the first laser A to cut the material 1 , and transmits the second laser B to heat the cut portion of the material 1 . Figure 2 1 shows a case where a planar beam splitter 140 is included. For example, the beam splitter 140 may be implemented as a mirror, and depending on the coating degree of the reflective surface, it may reflect the first laser A but may transmit the second laser B having a different wavelength band therefrom. Figure 3 As shown, the first laser A and the second laser B can be irradiated onto the same portion (portion to be cut) of the material 1 .

[0061] First, in order to transmit the second laser light B through the beam splitter 140, the angle between the path of the second laser light B entering the beam splitter 140 and the path of the second laser light B extracted from the beam splitter 140 is 180 degrees (i.e., a straight line). Furthermore, in order to ensure that the beam splitter 140 reflects the first laser light A and combines the optical paths with the second laser light B, the angle between the path of the first laser light A entering the beam splitter 140 and the path of the first laser light A extracted from the beam splitter 140 is 90 degrees (i.e., a right angle).

[0062] In addition, the laser cutting device 100 according to an embodiment of the present disclosure includes a focusing lens 150. The focusing lens 150 can be disposed in the optical path between the beam splitter 140 and the material 1. The focusing lens 150 allows the first laser A and the second laser B, whose optical paths are combined by the beam splitter 140, to be focused and irradiated onto the material 1.

[0063] The focusing lens 150 focuses the first laser light source 110 and the second laser light source 120, as well as the first laser light A and the second laser light B emitted from the first laser light source 110 and the second laser light source 120, respectively, and irradiates the material 1. The focal length and size (shape) of the first laser light A and the second laser light B (their optical paths are combined into one optical path) to the material 1 can be adjusted by the focusing lens 150. In other words, not only can the optical width of the first laser light A and the second laser light B irradiated onto the material 1 by the focusing lens 150 be adjusted, but also the height of the laser spot focused by the focusing lens 150 relative to the material 1 can be adjusted.

[0064] The focusing lens 150 may be, for example, Figure 2 The focusing lens 150 may be a planar convex lens having one surface convex and the other surface planar, but the present disclosure is not limited to those shown in the figures, and various modifications and changes may be made. For example, the focusing lens may be a biconvex lens having both surfaces convex, or a meniscus convex lens having one surface convex and the other surface concave. Figure 2Although shown as provided in one quantity, various combinations are possible. For example, a plurality of focusing lenses of the same type may be provided to suit various environments for implementing the present invention, and different types of focusing lenses may also be provided in a plurality of quantities.

[0065] Furthermore, the present disclosure is not limited to those shown in the drawings, and in some cases, various modifications and changes may be made, such as being able to further include a concave lens and / or a lens in the optical path between the focusing lens 150 and the material 1 .

[0066] Figure 3 FIG1 shows a cross section of a laser spot where the first laser A and the second laser B irradiated onto the material 1 are focused. The optical width (cross section) of the second laser B used to heat the byproducts of the cut portion of the material 1 is greater than the optical width (cross section) of the first laser A used to cut the material 1. Preferably, the first laser A and the second laser B whose optical paths are combined into one optical path can be coaxially formed, as shown in FIG1 . Figure 3 shown.

[0067] The optical width of each of the first laser A and the second laser B can be determined only by the optical width when emitted from the first laser light source 110 and the second laser light source 120, but in some cases, the optical width can be adjusted by setting an aperture, a lens, etc. on a single optical path of each of the first laser A and the second laser B.

[0068] in this regard, Figure 2 The case where the aperture 160 is provided on a single optical path of the second laser light B, that is, the case where the optical width of the second laser light B is adjusted according to the optical width of the aperture of the aperture 160 is shown.

[0069] Figure 4 Shown Figure 2 The laser cutting apparatus 100 provides pulses of the first laser and the second laser in synchronization with each other.

[0070] More specifically, Figure 4 (a) shows a graph of the pulse of the first laser A versus time t, Figure 4 (b) shows a graph of the pulse of the second laser B versus time t, and Figure 4 (c) shows a graph of pulses versus time (t) when the first laser A and the second laser B are combined. Figure 4 (a) to Figure 4 In (c), the x-axis represents time t, and the y-axis represents amplitude. The pulse duration of the second laser light B is longer than the pulse duration of the first laser light A.

[0071] As above Figure 2 As mentioned in the above, the pulse duration of the first laser A can be, for example, picoseconds (ps, 10 -12s) or femtoseconds (fs, 10 -15 s). The pulse duration of the second laser B can be, for example, nanoseconds (ns, 10 -9 s) magnitude.

[0072] In addition, as described above, the pulse synchronization unit 130 delays and synchronizes the first laser light A and the second laser light B emitted from the first laser light source 110 and the second laser light source 120, respectively, and then inputs a pulse width modulation signal (PWM) to each of the first laser light A and the second laser light B. Figure 4 As shown, the first laser A and the second laser B pulses synchronized with each other can be obtained.

[0073] Figure 5 A laser cutting device according to another embodiment of the present disclosure is schematically shown.

[0074] Figure 5 The laser cutting device 100' is Figure 2 The laser cutting apparatus 100 is partially modified and may include a mirror 170 for adjusting (changing) an optical path of the first laser A and / or the second laser B between each of the first laser light source 110 and / or the second laser light source 120 and the beam splitter 140.

[0075] As described above, in order for the second laser light B to be transmitted through the beam splitter 140, the second laser light B entering the beam splitter 140 and the second laser light B extracted from the beam splitter 140 must form an angle of 180 degrees (i.e., a straight line). Furthermore, in order for the beam splitter 140 to reflect the first laser light A and combine the optical path with the second laser light B, the first laser light A entering the beam splitter 140 and the first laser light A extracted from the beam splitter 140 must form an angle of 90 degrees (i.e., a right angle).

[0076] If the first laser light source 110 and / or the second laser light source 120 are not located on an extension of the optical path entering the beam splitter 140, it is necessary to change the optical path entering the beam splitter 140. Therefore, a mirror or the like for changing the optical path may be included between the optical path between the first laser light source 110 and the beam splitter 140 and / or between the second laser light source 120 and the beam splitter 140.

[0077] Figure 5 The case where the mirror 170 for changing the path of the second laser light B emitted from the second laser light source 120 is included is exemplarily shown because the second laser light source 120 is not located on the extension of the optical path entering the beam splitter 140. However, the present disclosure is not limited to Figure 2 Those cases shown, and when the first laser light source 110 and / or the second laser light source 120 are not located on an extension of the optical path entering the beam splitter 140 as described above, the present disclosure can be applied by making various modifications and changes.

[0078] Figure 6 A laser cutting device according to another embodiment of the present disclosure is schematically shown.

[0079] Figure 6 The laser cutting equipment 100" is Figure 2 The laser cutting apparatus 100 is partially modified, which shows a case where a cubic beam splitter 140 is included instead of a plane beam splitter 140.

[0080] The cubic beam splitter 140 differs from the plane beam splitter 140 only slightly in shape, but the principle is the same as that of the plane beam splitter 140. Therefore, for details on the optical paths of the first laser light A and the second laser light B emitted from the first laser light source 110 and the second laser light source 120, respectively, which are combined by the cubic beam splitter 140' and moved to the focusing lens 150, refer to the above. Figure 2 Those described in and their modified examples ( Figure 3 ).

[0081] about Figure 6 The remaining components are described above in Figure 2 Those components described in the Figure 2 .

[0082] According to an embodiment of the present disclosure, during the process of cutting a secondary battery material, the reactivity (electron reactivity, etc.) of the material is increased by heating the material with a heating laser (second laser B), and the byproducts generated by the cutting are removed by heating. This has the advantage of being able to neatly and cleanly process the cut portion (the boundary portion of the cut surface, etc.). In addition, the quality of the electrode and / or separator thus manufactured can be significantly improved, thereby improving the performance of the manufactured battery.

[0083] Terms indicating directions such as front, back, left, right, upper, and lower have been used in this embodiment, but the terms used are provided only for the convenience of description and may vary depending on the position of the object, the position of the observer, etc.

[0084] The electrodes manufactured by applying the control method of the electrode manufacturing apparatus according to the present embodiment can be included in a secondary battery, and a plurality of such secondary batteries can be assembled together to form a battery module. The battery module can be installed together with various control and protection systems such as a BMS (battery management system) module and a cooling system to form a battery pack.

[0085] Secondary batteries, battery modules, or battery packs can be used in various devices. Specifically, they can be used in vehicle devices such as electric bicycles, electric vehicles, hybrid electric vehicles, or ESS (Energy Storage System), and can also be used in various devices that can use secondary batteries, but are not limited thereto.

[0086] Although the present invention has been described in detail with reference to the preferred embodiments thereof, the scope of the present disclosure is not limited thereto, and those skilled in the art may make various modifications and improvements using the basic concepts of the present disclosure defined in the appended claims, which also fall within the scope of the present disclosure.

[0087] [Explanation of Reference Numerals]

[0088] A: First Laser

[0089] B: Second laser

[0090] 100, 100', 100": Laser cutting equipment

[0091] 110: First laser light source

[0092] 120: Second laser light source

[0093] 130: Pulse synchronization unit

[0094] 140, 140': Optical Splitter

[0095] 150: Focusing lens

[0096] 160: Aperture

[0097] 170: Mirror

Claims

1. A laser cutting device for cutting secondary battery materials using laser, comprising: a first laser light source, which emits a first laser for cutting the secondary battery material; as well as a second laser light source that emits a second laser for heating the portion of the material being cut, The first laser and the second laser are synchronized and irradiated onto the material in a state where their optical paths are combined into one optical path.

2. The laser cutting device according to claim 1, wherein: The second laser heats the material, thereby increasing the reactivity of the material and removing byproducts produced by the cutting.

3. The laser cutting device according to claim 1, wherein: The first laser has an ultraviolet wavelength. The second laser has an infrared wavelength band, and The output of the second laser is smaller than the output of the first laser.

4. The laser cutting device according to claim 3, wherein: The pulse duration of the second laser is longer than the pulse duration of the first laser.

5. The laser cutting device according to claim 4, wherein: The pulse duration of the first laser is from several picoseconds to several thousand picoseconds (ps, 10 -12 s) or from a few femtoseconds to several thousand femtoseconds (fs, 10 -15 s), and The pulse duration of the second laser is from a few nanoseconds to several thousand nanoseconds (ns, 10 -9 s) value.

6. The laser cutting apparatus according to claim 1, wherein: The first laser and the second laser are coaxially irradiated onto the material, and the optical width of the second laser is greater than the optical width of the first laser.

7. The laser cutting apparatus according to claim 1 , further comprising a pulse synchronization unit coupled to each of the first laser light source and the second laser light source, in, The pulse synchronization unit synchronizes the first laser light and the second laser light emitted from the first laser light source and the second laser light source, respectively, and performs pulse width modulation (PWM).

8. The laser cutting device according to claim 1, comprising: a beam splitter that combines the first laser light and the second laser light emitted from the first laser light source and the second laser light source, respectively, into one optical path; The combined first laser and second laser are irradiated onto the material.

9. The laser cutting apparatus according to claim 8, wherein: The beam splitter transmits the first laser light and reflects the second laser light.

10. The laser cutting apparatus according to claim 8, wherein: The angle between the first laser light entering the beam splitter and the first laser light extracted from the beam splitter is 180 degrees, and The angle between the second laser light entering the beam splitter and the second laser light extracted from the beam splitter is 90 degrees.

11. The laser cutting apparatus according to claim 8, wherein: The beam splitter is a plane beam splitter or a cubic beam splitter.

12. The laser cutting apparatus according to claim 11, wherein: The plane beam splitter is a mirror that transmits the first laser light and reflects the second laser light.

13. The laser cutting device according to claim 8, further comprising a focusing lens disposed in an optical path between the beam splitter and the material. in, The focusing lens focuses the first laser and the second laser so as to irradiate the material in a focused manner.

14. The laser cutting apparatus according to claim 13, wherein: The focusing lens is provided in at least one form and includes a planar convex lens, a biconvex lens or a meniscus convex lens. 15 . The laser cutting equipment according to claim 1 , further comprising an aperture for adjusting a light width of the second laser light.

16. The laser cutting device according to claim 1, further comprising a mirror disposed between the first laser light source and the beam splitter. in, The mirror adjusts the optical path of the first laser light entering the beam splitter.

17. The laser cutting device according to claim 1, further comprising a mirror disposed between the second laser light source and the beam splitter. in, The mirror adjusts the optical path of the second laser light entering the beam splitter.

18. The laser cutting apparatus according to claim 1, wherein: The secondary battery material includes at least one of a positive electrode, a negative electrode, and a separator of the secondary battery.

Images