Wafer developing solution spraying method and spraying system

Abstract

The invention provides a wafer developing solution spraying method and system, and relates to the technical field of semiconductor manufacturing, and the method comprises the following steps: S1, placing a plurality of storage boxes in a storage area of a machine table; s2, placing one of the storage boxes in the storage area on a card control unit of the machine table by a sheet feeding unit; s3, the card control unit judges the type of photoresist to be coated on the wafer in the storage box; and S4, according to the type of the photoresist, the machine table processes the storage box or processes the wafer in the storage box. According to the scheme provided by the invention, the waste of the developing solution caused by direct spraying of the developing solution into the waste discharge pipeline is avoided, and the productivity of the machine is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a method and system for spraying a wafer developer. Background Art

[0002] The development process is a critical step in the photolithography process of semiconductor manufacturing. Developer is sprayed onto the wafer surface through a nozzle to remove the exposed photoresist, thereby forming the desired pattern. However, when the developer nozzle is left idle for an extended period, the temperature of the developer inside the nozzle gradually approaches the ambient temperature. This causes a violent reaction when the nozzle is restarted, resulting in a more intense reaction when the developer contacts the wafer surface. This reaction generates more small-molecule resins that are difficult to rinse away, ultimately increasing the amount of photoresist residue and affecting yield.

[0003] To address this issue, the conventional approach is to increase the machine's lot head dummy time, spraying a certain amount of developer before actual development to stabilize the temperature. However, this practice causes the developer to be sprayed directly into the waste pipe, resulting in developer waste and reduced machine production capacity. Summary of the Invention

[0004] The present invention mainly provides a method and system for spraying a wafer developer, which is used to solve the technical problems proposed in the above background technology that the developer is directly sprayed into the waste pipe, causing waste of the developer and reducing the production capacity of the machine.

[0005] The technical solution adopted by the present invention to solve the above technical problems is: The present application provides a method for spraying a developer on a wafer, comprising the following steps: S1: placing a plurality of storage boxes in a storage area of ​​a machine; S2: a wafer feeding unit places one of the storage boxes in the storage area on a card control unit of the machine; S3: the card control unit determines the type of photoresist to be coated on the wafer in the storage box; S4: based on the type of photoresist, the machine processes the storage box or the wafer in the storage box.

[0006] Optionally, the types of the photoresist include non-temperature sensitive and temperature sensitive; S4 includes: S41: when the photoresist is the non-temperature sensitive type, the loading unit on the machine places the wafer in the storage box on the card control unit on the work station, and the machine coats the wafer with photoresist and sprays the developer; S42: when the photoresist is the temperature sensitive type, the feeding unit moves the storage box on the card control unit to the waiting area on the machine.

[0007] Optionally, before the film feeding unit in S42 moves the storage box on the card control unit to the waiting area on the machine, it also includes: S421: the machine determines whether the idle time of the nozzle is less than 5 minutes; S422: the machine processes the storage box according to the idle time of the nozzle.

[0008] Optionally, the S422 includes: S5: when the idle time of the nozzle is less than 5 minutes, the loading unit places the wafer in the storage box on the card control unit on the work station, and the machine coats the wafer with photoresist and sprays the developer; S6: when the idle time of the nozzle is greater than or equal to 5 minutes, the feeding unit moves the storage box on the card control unit to the waiting area on the machine.

[0009] Optionally, the wafers in the storage box on the card control unit of the loading unit in S5 are placed on the work station, and before the machine coats the wafers with photoresist and sprays the developer, the following steps are also included: S51: the machine determines the type of photoresist on the surface of the last batch of wafers sprayed with developer; S52: according to the type of photoresist on the surface of the last batch of wafers sprayed with developer, the machine processes the wafers in the storage box.

[0010] Optionally, the S52 includes the following steps: S521: when the photoresist is temperature sensitive, the loading unit places the wafer in the storage box on the card control unit on the work station, and the machine coats the wafer with photoresist and sprays the developer; S522: when the photoresist is not temperature sensitive, the machine determines the number of the last batch of sprayed and developed liquid crystal circles; S523: based on the number of the last batch of sprayed and developed liquid crystal circles, the machine processes the storage box.

[0011] Optionally, the S523 includes the following steps: S5231: when the number of the previous batch of liquid crystal circles that were sprayed and developed is greater than or equal to 8 pieces, the loading unit places the wafers in the storage box on the card control unit on the work station, and the machine coats the wafers with photoresist and sprays the developer; S5232: when the number of the previous batch of liquid crystal circles that were sprayed and developed is less than 8 pieces, the feeding unit moves the storage box on the card control unit to the waiting area on the machine.

[0012] Optionally, after the film feeding unit moves the storage box on the card control unit to the waiting area on the machine, the following steps are also included: S7: the film feeding unit places one of the storage boxes in the storage area on the card control unit of the machine; S8: continue to execute S3 and subsequent steps.

[0013] Optionally, the method for the card control unit in S3 to determine the type of photoresist to be coated on the wafers in the storage box includes: presetting a type identification code on the storage box, and the card control unit identifying the type of photoresist to be coated on the wafers in the storage box according to the type identification code.

[0014] The present application also provides a wafer developer spraying system, which can implement the wafer developer spraying method as described above, and is characterized in that it includes: a machine platform, used to coat the wafer with photoresist and spray the developer; a storage area, arranged on the machine platform, used to place a storage box; a card control unit, arranged on the machine platform, used to determine the type of photoresist to be coated on the wafer in the storage box; a wafer feeding unit, used to move the storage box and place the storage box on the storage area or the card control unit.

[0015] The present application provides a method and system for spraying a wafer developer, which uses a card control unit to identify the type of photoresist to be coated on the wafer in the storage box, and the machine adopts different processing strategies according to the different types of photoresists, thereby avoiding the developer from being sprayed directly into the waste pipe, causing waste of the developer, and further improving the production capacity of the machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 Schematic diagram of the process of spraying the developer solution on the wafer of the present application; Figure 2 This is a logic diagram of the wafer developer spraying method of this application.

[0018] The technical problems solved by this application, the functional features and advantages will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0019] To make the technical problems, technical solutions, and advantages solved by the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0020] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0021] In this application, unless otherwise specified or limited, the terms "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can mean fixed connection, detachable connection, or integration; it can mean mechanical connection or electrical connection; it can mean direct connection or indirect connection through an intermediate medium; it can mean internal communication between two elements or interaction between two elements, unless otherwise specified. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0022] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the meaning of "and / or" appearing throughout the text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme in which A and B are satisfied at the same time. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement it. When the combination of technical solutions is mutually contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0023] To address the problem of violent reactions generating more small-molecule resins that are difficult to rinse, ultimately leading to increased photoresist residue, a conventional approach is to increase the machine's lot head dummy time, spraying a certain amount of developer before formal development to stabilize the temperature. However, this approach causes the developer to be sprayed directly into the waste pipe, resulting in developer waste and reducing the machine's production capacity. To address these issues, embodiments of the present invention provide the following technical solutions to overcome these problems.

[0024] Please refer to Figure 1 and Figure 2An embodiment of the present application provides a method for spraying a developer on a wafer, comprising the following steps: S1: placing a plurality of storage boxes in a storage area of ​​a machine; S2: a wafer feeding unit places one of the storage boxes in the storage area on a card control unit of the machine; S3: the card control unit determines the type of photoresist to be coated on the wafer in the storage box; S4: based on the type of photoresist, the machine processes the storage box or the wafer in the storage box.

[0025] Specifically, step S1 involves placing multiple storage boxes in the machine's storage area, each containing wafers to be processed. The storage area serves as a temporary storage area for the wafers, providing orderly storage and management for subsequent processing. The placement of the storage boxes ensures greater stability during wafer transport and processing, reducing the risk of damage during transport.

[0026] In step S2, the wafer delivery unit places one of the wafer boxes in the storage area onto the machine's card control unit. The wafer delivery unit then transfers the box from the storage area to the card control unit using an automated robotic arm or conveyor belt. This process automates wafer transfer, improving production efficiency and reducing the errors and time costs associated with manual intervention.

[0027] Step S3: The card control unit determines the type of photoresist to be coated on the wafers in the storage box. The card control unit uses a preset type identification code (such as a barcode, QR code, or RFID tag) to identify the type of photoresist to be coated on the wafers in the storage box. This identification provides critical information for the subsequent development process.

[0028] In step S4, the machine processes the storage box or the wafers within the box, depending on the type of photoresist. Depending on the type of photoresist (e.g., temperature-sensitive or non-temperature-sensitive), the machine can employ different processing strategies. For example, for a non-temperature-sensitive photoresist, the process of applying the photoresist and spraying the developer can proceed directly. For a temperature-sensitive photoresist, the machine can employ post-processing measures, first applying the photoresist and spraying the developer on the wafers with the non-temperature-sensitive photoresist. This differentiated approach effectively improves the adaptability and reliability of the development process.

[0029] It is understandable that through classification management and differentiated processing, the machine can adopt the optimal development process parameters according to the type of photoresist, reduce the problem of photoresist residue caused by changes in developer temperature, improve the yield and stability of the development process, and by optimizing the use of developer, avoid the waste of developer caused by increasing the lot head dummy time (that is, spraying a certain amount of developer to stabilize the temperature before formal development), thereby reducing material costs.

[0030] The present application provides a method for spraying a wafer developer, which uses a card control unit to identify the type of photoresist to be coated on the wafer in the storage box, and the machine adopts different processing strategies according to the different types of photoresists, thereby avoiding the developer from being sprayed directly into the waste pipe, causing waste of the developer, and further improving the production capacity of the machine.

[0031] In one embodiment, the types of the photoresist include non-temperature sensitive and temperature sensitive types; S4 includes: S41: when the photoresist is the non-temperature sensitive type, the loading unit on the machine places the wafer in the storage box on the card control unit on the work station, and the machine coats the wafer with photoresist and sprays the developer; S42: when the photoresist is the temperature sensitive type, the feeding unit moves the storage box on the card control unit to the waiting area on the machine.

[0032] Specifically, step S41 processes non-temperature-sensitive photoresists. The card control unit identifies the photoresist type to be coated on the wafers in the storage box as non-temperature-sensitive. The loading unit transfers the wafers from the card control unit to a workstation for photoresist coating and developer spraying.

[0033] It should be noted that non-temperature-sensitive photoresists are not sensitive to temperature changes of the developer. Even if the temperature of the developer fluctuates greatly, it will not lead to increased photoresist residue or uneven development.

[0034] Step S42 processes temperature-sensitive photoresists. The card control unit identifies the temperature-sensitive photoresist to be coated on the wafers in the storage box. The wafer feed unit then moves the storage box from the card control unit to the waiting area. Once the waiting conditions are met (e.g., the printhead temperature stabilizes), the wafer feed unit transfers the storage box from the waiting area to the card control area, and the loading unit moves the wafers in the storage box to the workstation. The machine then coats the wafers with photoresist and sprays developer on their surfaces.

[0035] Understandably, temperature-sensitive photoresists are highly sensitive to changes in developer temperature. High developer temperatures can cause a violent reaction upon contact with the wafer surface, forming small, difficult-to-rinse resin molecules and ultimately increasing photoresist residue. For this type of photoresist, the storage box should be moved to a waiting area and allowed to stabilize before developing. This prevents development issues caused by temperature fluctuations.

[0036] In one embodiment, before the film feeding unit in S42 moves the storage box on the card control unit to the waiting area on the machine, it also includes: S421: the machine determines whether the idle time of the nozzle is less than 5 minutes; S422: the machine processes the storage box according to the idle time of the nozzle.

[0037] Specifically, step S421 determines the idle time of the nozzle. Before moving the storage box to the waiting area, the machine first determines whether the idle time of the developer nozzle is less than 5 minutes. This determination is made using the machine's built-in timer, which records the time interval between the last use of the nozzle and the current use. It is understandable that the idle time of the nozzle is a key factor affecting the developer temperature. When the nozzle idle time is short (less than 5 minutes), the developer temperature in the nozzle changes little and remains close to the temperature at the time of last use. At this point, even when developing temperature-sensitive photoresists, the developer temperature in the nozzle can meet process requirements and will not cause an increase in photoresist residue.

[0038] Step S422 involves processing the storage box based on the idle time of the nozzle. Based on the determination of the idle time of the nozzle, the machine determines how to handle the storage box: If the idle time of the nozzle is less than 5 minutes, the wafers in the storage box can be directly transferred to the workstation for adhesive coating and development. If the idle time of the nozzle is greater than or equal to 5 minutes, the storage box is moved to a waiting area to wait for the nozzle temperature to stabilize before adhesive coating and development can be performed. It is understandable that when the nozzle idle time is greater than or equal to 5 minutes, the temperature of the developer in the nozzle may already be close to the ambient temperature. Direct development at this time may result in increased photoresist residue. Therefore, it is necessary to move the storage box to a waiting area to wait for the nozzle temperature to stabilize again through subsequent processing (such as processing wafers with non-temperature-sensitive photoresist) before development can be performed.

[0039] By adopting the above method and rationally arranging the processing order of the storage boxes, the waste of developer caused by the increase of the lot head dummy time due to the unstable nozzle temperature is avoided, the additional waiting time caused by the unstable nozzle temperature is reduced, the efficient operation of the machine is ensured, the overall production capacity is improved, the waste of developer and the production cost caused by the increased waiting time are reduced, and the economic benefits are improved.

[0040] In one embodiment, the S422 includes: S5: when the idle time of the nozzle is less than 5 minutes, the loading unit places the wafer in the storage box on the card control unit on the work station, and the machine coats the wafer with photoresist and sprays the developer; S6: when the idle time of the nozzle is greater than or equal to 5 minutes, the feeding unit moves the storage box on the card control unit to the waiting area on the machine.

[0041] Specifically, in step S5, the printhead idle time is less than 5 minutes, indicating that the developer temperature in the printhead has changed little and remains within a relatively stable temperature range. At this point, the loading unit transfers the wafers from the storage box to the workstation from the control unit. The machine then coats the wafer surface with photoresist, and the printhead sprays developer for the development process.

[0042] Step S6 indicates that the printhead has been idle for 5 minutes or longer, indicating that the developer temperature in the printhead may be close to the ambient temperature. Direct development at this point may result in increased photoresist residue. At this point, the film feed unit moves the storage box from the card control unit to the waiting area. The waiting area is used to store the storage box awaiting processing until the printhead temperature stabilizes again before development can proceed.

[0043] In one embodiment, the wafers in the storage box on the card control unit of the loading unit in S5 are placed on the work station, and before the machine coats the wafers with photoresist and sprays the developer, the following steps are also included: S51: the machine determines the type of photoresist on the surface of the last batch of wafers sprayed with developer; S52: according to the type of photoresist on the surface of the last batch of wafers sprayed with developer, the machine processes the wafers in the storage box.

[0044] Specifically, step S51 is to determine the photoresist type of the previous batch of wafers. Before operating the wafers in the current storage box, the machine first checks the photoresist type used by the previous batch of wafers that have completed development. Furthermore, the machine obtains the photoresist type information of the previous batch of wafers through a built-in recording system or sensor. Based on the obtained information, it is determined whether the photoresist of the previous batch of wafers is temperature-sensitive or non-temperature-sensitive.

[0045] Understandably, by determining the photoresist type of the previous batch of wafers, the machine can determine whether the current nozzle temperature is suitable for processing the wafers in the current storage box. If the previous batch of wafers used a temperature-sensitive photoresist and the development process completed normally, the nozzle temperature is stable and suitable for processing wafers with temperature-sensitive photoresists.

[0046] Step S52 processes the current wafer based on the photoresist type of the previous batch. If the previous batch used a temperature-sensitive photoresist and the showerhead temperature is stable, the wafers in the current cassette (whether temperature-sensitive or non-temperature-sensitive) can proceed directly. If the previous batch used a non-temperature-sensitive photoresist, the machine will need to further determine the type of photoresist to be applied to the wafers in the current cassette to determine whether additional temperature stabilization measures are required.

[0047] Understandably, the tool can adopt different processing strategies based on the photoresist type of the previous batch of wafers to ensure the adaptability and reliability of the development process. If the previous batch of wafers was a non-temperature-sensitive photoresist, the nozzle temperature may need further stabilization. The tool can adjust the nozzle temperature by processing a certain number of non-temperature-sensitive wafers until it reaches conditions suitable for temperature-sensitive photoresists.

[0048] In one embodiment, the S52 includes the following steps: S521: when the photoresist is temperature sensitive, the loading unit places the wafer in the storage box on the card control unit on the work station, and the machine coats the wafer with photoresist and sprays the developer; S522: when the photoresist is not temperature sensitive, the machine determines the number of the last batch of sprayed and developed liquid crystal circles; S523: based on the number of the last batch of sprayed and developed liquid crystal circles, the machine processes the storage box.

[0049] Specifically, step S521 involves determining that the photoresist on the previous batch of wafers is temperature-sensitive (the machine, through the card control unit, identifies the wafers in the storage cassette as being coated with temperature-sensitive photoresist), indicating that the printhead temperature is stable and suitable for processing wafers with temperature-sensitive photoresist. At this point, the loading unit transfers the wafers from the storage cassette to the workstation via the card control unit. The machine then coats the wafers with photoresist, and the printhead sprays developer onto the wafer surfaces to initiate the development process.

[0050] Step S522 is when the photoresist of the previous batch of wafers is non-temperature sensitive, the machine determines the number of wafers sprayed with developer in the previous batch. By determining the number of wafers in the previous batch, the machine can decide whether to further process the wafers in the storage box.

[0051] Step S523 processes the storage box based on the number of wafers in the previous batch. The machine determines how to process the storage box based on the number of wafers sprayed with developer in the previous batch. If the number of wafers in the previous batch is greater than or equal to the preset number, the nozzle temperature has stabilized and development can proceed directly. If the number of wafers in the previous batch is less than the preset number, the nozzle temperature may be unstable and the storage box needs to be moved to a waiting area to wait for the nozzle temperature to stabilize before proceeding.

[0052] In one embodiment, the S523 includes the following steps: S5231: when the number of the last batch of liquid crystal circles that were sprayed and developed is greater than or equal to 8 pieces, the loading unit places the wafers in the storage box on the card control unit on the work station, and the machine coats the wafers with photoresist and sprays the developer; S5232: when the number of the last batch of liquid crystal circles that were sprayed and developed is less than 8 pieces, the feeding unit moves the storage box on the card control unit to the waiting area on the machine.

[0053] Specifically, step S5231 indicates that the number of wafers in the previous batch was greater than or equal to 8. The machine uses a built-in counter or recording system to determine whether the number of wafers sprayed with developer in the previous batch was greater than or equal to 8. If the number of wafers in the previous batch was greater than or equal to 8, it indicates that the printhead has reached a stable temperature when processing this batch of wafers. At this point, the loading unit transfers the wafers in the storage box from the card control unit to the workstation. The machine then coats the wafers with photoresist, and the printhead sprays developer onto the wafer surface to perform the development process.

[0054] It should be noted that when the number of wafers in the previous batch is large, the nozzle can maintain a stable temperature during the processing, and the temperature change of the developer is small. In this case, the nozzle temperature has stabilized and the wafers in the current storage box can be directly operated without causing an increase in photoresist residue.

[0055] Step S5232 indicates that the previous batch of wafers contained fewer than eight wafers. Similarly, the machine uses a built-in counter or recording system to determine whether the previous batch of wafers sprayed with developer contained fewer than eight wafers. If the previous batch contained fewer than eight wafers, this indicates that the printhead may not have reached a stable operating temperature when processing this batch of wafers. The wafer feeder moves the storage boxes from the card control unit to the waiting area. This area is used to store boxes awaiting processing until the printhead temperature stabilizes before resuming operation.

[0056] Understandably, when the number of wafers in the previous batch is small, the nozzle may not be able to reach a stable operating temperature during the processing, and the temperature of the developer is close to the ambient temperature. At this time, the storage box is moved to the waiting area and the nozzle is allowed to stabilize the temperature again after processing more wafers before operating again, thereby avoiding development problems caused by temperature changes.

[0057] In one embodiment, after the film feeding unit moves the storage box on the card control unit to the waiting area on the machine, the following steps are also included: S7: the film feeding unit places one of the storage boxes in the storage area on the card control unit of the machine; S8: continue to execute S3 and subsequent steps.

[0058] Specifically, step S7 involves the wafer feeder unit placing the storage boxes in the storage area onto the card control unit. In this implementation, after moving one storage box to the waiting area, the wafer feeder unit removes the next storage box from the storage area. The removed storage box is placed on the machine's card control unit, ready for further processing. The wafer feeder unit transfers the storage boxes from the storage area to the card control unit using an automated robotic arm or conveyor belt. This process reduces manual intervention and improves operational accuracy and efficiency. By placing the storage boxes on the card control unit, the machine can continuously process wafers, maintaining production continuity.

[0059] Step S8 continues with S3 and subsequent steps. The machine continues with the subsequent steps starting with S3, including determining the type of photoresist to be coated on the wafers in the cassette (S3). Based on the photoresist type, the machine decides whether to proceed directly (S41) or move the cassette to a waiting area (S42). If waiting is required, the machine determines the idle time of the printhead (S421) and, based on this, decides whether to proceed (S5) or continue waiting (S6).

[0060] As you can see, by continuing to execute S3 and subsequent steps, the tool can process each storage box according to the preset logic cycle, ensuring that each wafer is developed under the appropriate conditions. The tool dynamically adjusts the processing strategy based on the photoresist type of the wafers in each storage box and the current status of the printhead, ensuring the adaptability and reliability of the development process.

[0061] In one embodiment, the method for the card control unit in S3 to determine the type of photoresist to be coated on the wafers in the storage box includes: presetting a type identification code on the storage box, and the card control unit identifying the type of photoresist to be coated on the wafers in the storage box according to the type identification code.

[0062] Specifically, a type identification code is placed on the storage box. This code can be a barcode, QR code, RFID tag, or other recognizable mark to identify the type of photoresist applied to the wafers within the box. The card control unit is equipped with a corresponding reading device (such as a barcode scanner or RFID reader). When the storage box is placed on the card control unit, the type identification code is read. Based on the read type identification code, the card control unit determines the type of photoresist (e.g., temperature-sensitive or non-temperature-sensitive) to be applied to the wafers within the box.

[0063] The embodiment of the present application also provides a wafer developer spraying system, which can implement the wafer developer spraying method as described above, and is characterized in that it includes: a machine for coating the wafer with photoresist and spraying the developer; a storage area, arranged on the machine, for placing a storage box; a card control unit, arranged on the machine, for determining the type of photoresist on the surface of the wafer in the storage box; a wafer feeding unit, for moving the storage box and placing the storage box on the storage area or the card control unit.

[0064] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions within the technical scope disclosed in the present invention should be included in the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A method for spraying a wafer developer, characterized in that: The following steps are involved: S1: Place multiple storage boxes in the storage area of ​​the machine; S2: The film feeding unit places one of the storage boxes in the storage area on the card control unit of the machine; S3: The card control unit determines the type of photoresist to be coated on the wafers in the storage box; S4: According to the type of the photoresist, the machine processes the storage box or processes the wafers in the storage box.

2. The method for spraying a wafer developer according to claim 1, wherein: The types of the photoresist include non-temperature sensitive type and temperature sensitive type; The S4 includes: S41: When the photoresist is the non-temperature sensitive type, the loading unit on the machine places the wafer in the storage box on the card control unit on the work station, and the machine coats the wafer with photoresist and sprays developer; S42: When the photoresist is temperature-sensitive, the sheet feeding unit moves the storage box on the card control unit to a waiting area on the machine platform.

3. The method for spraying a wafer developer according to claim 2, wherein: Before the film feeding unit in S42 moves the storage box on the card control unit to the waiting area on the machine, the following steps are further included: S421: The machine determines whether the idle time of the print head is less than 5 minutes; S422: The machine processes the storage box according to the idle time of the print head.

4. The method for spraying a wafer developer according to claim 3, wherein: The S422 includes: S5: When the idle time of the nozzle is less than 5 minutes, the loading unit places the wafer in the storage box on the card control unit on the work station, and the machine coats the wafer with photoresist and sprays developer; S6: When the print head is idle for more than or equal to 5 minutes, the film feeding unit moves the storage box on the card control unit to the waiting area on the machine table.

5. The method for spraying a wafer developer according to claim 4, wherein: The wafers in the storage box on the card control unit of the loading unit in S5 are placed on the work station. Before the photoresist coating and developer spraying operations are performed on the wafers on the machine, the following steps are also included: S51: The machine determines the type of photoresist on the surface of the last batch of wafers sprayed with developer; S52: The machine processes the wafers in the storage box according to the type of the photoresist on the surface of the wafers sprayed with the developer in the previous batch.

6. The method for spraying a wafer developer according to claim 5, wherein: The S52 includes the following steps: S521: When the photoresist is temperature-sensitive, the loading unit places the wafer in the storage box on the card control unit on a work station, and the machine coats the wafer with photoresist and sprays developer; S522: When the photoresist is non-temperature sensitive, the machine determines the number of liquid crystal circles sprayed and developed in the previous batch; S523: The machine processes the storage boxes according to the number of the last batch of sprayed and developed liquid crystal circles.

7. The method for spraying a wafer developer according to claim 6, wherein: The S523 includes the following steps: S5231: When the number of the last batch of wafers sprayed and developed is greater than or equal to 8, the loading unit places the wafers in the storage box on the card control unit on the work station, and the machine coats the wafers with photoresist and sprays developer; S5232: When the number of the last batch of sprayed and developed liquid crystal circles is less than 8, the sheet feeding unit moves the storage box on the card control unit to a waiting area on the machine table.

8. The method for spraying a wafer developer according to any one of claims 2 to 7, wherein: After the film feeding unit moves the storage box on the card control unit to the waiting area on the machine table, the following steps are further included: S7: The film feeding unit places one of the storage boxes in the storage area on the card control unit of the machine; S8: Continue to execute the steps S3 and thereafter.

9. The method for spraying a wafer developer according to claim 1, wherein: The method for the card control unit in S3 to determine the type of photoresist to be coated on the wafers in the storage box includes: A type identification code is preset on the storage box, and the card control unit identifies the type of photoresist to be coated on the wafers in the storage box according to the type identification code.

10. A wafer developer spraying system, characterized in that: The method for spraying a wafer developer according to claims 1 to 9 may be implemented, characterized in that it comprises: Machine, used for coating wafers with photoresist and spraying developer; A storage area, provided on the machine platform, for placing storage boxes; A card control unit, provided on the machine platform, for determining the type of photoresist to be coated on the wafers in the storage box; The film feeding unit is used to move the storage box and place the storage box on the storage area or the card control unit.

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