Annular polishing monitoring method and system for precise special-shaped optical element

Abstract

The invention provides a precise special-shaped optical element ring throwing monitoring method and system, and belongs to the technical field of monitoring, and the method comprises the steps: firstly, obtaining an initial RMS value in a target ring throwing period based on a PMD dynamic interferometer, obtaining a corresponding initial compensation parameter based on the RMS value, determining the initial compensation pressure of ring throwing equipment based on the initial compensation parameter, and then carrying out the initial compensation of the ring throwing equipment based on the initial compensation pressure; first ring polishing logic of the ring polishing equipment is determined on the basis of the initial compensation pressure, the first ring polishing logic comprises the step that actual ring polishing pressure is applied to the element to be subjected to ring polishing in a first cyclic variable force mode, and finally, when the dynamic RMS value is smaller than a preset RMS value, ring polishing is stopped. Actual ring polishing pressure is applied to a to-be-ring-polished element in a first cyclic variable force form, so that the influence of the viscoelastic behavior of a workpiece material on the precision of the workpiece in a pressure increasing period and the influence of the viscoelastic behavior of the workpiece material on the precision of the workpiece in a pressure reducing period are mutually counteracted; and the influence of the viscoelastic behavior of the material on the precision is eliminated as far as possible.

Description

Technical Field

[0001] The present application relates to the field of monitoring technology, and in particular to a method and system for monitoring the ring polishing of precision special-shaped optical components. Background Art

[0002] Viscoelastic behavior is the simultaneous display of viscosity (time-dependent flow) and elasticity (instantaneous deformation recovery) in a material. This behavior is commonly seen in polishing pads (e.g., polyurethane, asphalt) and optical materials (e.g., fused silica, polymers). Its dynamic response during polishing directly impacts material removal uniformity, surface accuracy, and long-term stability.

[0003] Since the influence of viscoelastic behavior on the workpiece cannot be eliminated, how to minimize the influence of viscoelastic behavior on precision is an urgent problem to be solved during the processing of high-precision workpieces. Summary of the Invention

[0004] The embodiments of the present application provide a method and system for monitoring the ring polishing of precision special-shaped optical components to improve the above-mentioned problems.

[0005] To achieve the above objectives, this application adopts the following technical solutions: In the first aspect, the embodiments of the present application provide a method for monitoring the ring polishing of precision shaped optical components. The method is applicable to a device for monitoring the ring polishing of precision shaped optical components. The device includes a controller, a ring polishing device, and a monitoring device. The monitoring device includes a PMD dynamic interferometer. The method is applicable to the controller and includes: Obtaining an initial RMS value during a target ring-polishing cycle based on a PMD dynamic interferometer, obtaining a corresponding initial compensation parameter based on the RMS value, and determining an initial compensation pressure of the ring-polishing device based on the initial compensation parameter; Determining a first ring-throwing logic of the ring-throwing device based on the initial compensation pressure, the first ring-throwing logic comprising applying an actual ring-throwing pressure to the element to be ring-thrown in the form of a first cyclically variable force, wherein a maximum value of the actual ring-throwing pressure is equal to the initial compensation pressure; The ring-throwing device is controlled based on the first ring-throwing logic to perform ring-throwing on the element to be ring-thrown, and a dynamic RMS value is obtained. When the dynamic RMS value is less than a preset RMS value, the ring-throwing is stopped.

[0006] In conjunction with the first aspect, in some feasible implementations, controlling the ring-throwing device to perform ring-throwing on the element to be ring-thrown based on the first ring-throwing logic and obtaining a dynamic RMS value, and stopping the ring-throwing when the dynamic RMS value is less than a preset value, includes: Obtaining a ring-throwing duration. When the ring-throwing duration is greater than a preset ring-throwing time, obtaining a second cyclic variable force based on the initial compensation pressure, wherein the work done by the second cyclic variable force on the ring-throwing element per unit time period is greater than the work done by the first cyclic variable force on the ring-throwing element per unit time period. The ring-polishing device is controlled to polish the component to be ring-polished according to the second ring-polishing logic, wherein the second ring-polishing logic includes applying actual ring-polishing pressure to the component to be ring-polished in a second cyclic variable force manner.

[0007] In combination with the first aspect, in some feasible implementations, obtaining an initial RMS value in a target ring-polishing cycle based on a PMD dynamic interferometer, obtaining a corresponding initial compensation parameter based on the RMS value, and determining an initial compensation pressure of the ring-polishing device based on the initial compensation parameter include: At the beginning of the target polishing cycle, the PMD dynamic interferometer performs a full-field scan of the target component, projects multi-frequency fringes, and collects distorted images. The phase resolution algorithm is used to reconstruct the corresponding three-dimensional topography of the target component surface. Obtaining height deviation based on 3D topography , based on the height deviation Get the initial RMS value RMS and satisfy:

[0008] in, is the average height deviation, and N is the number of sampling points.

[0009] In combination with the first aspect, in some feasible implementations, obtaining an initial RMS value in a target ring-polishing cycle based on a PMD dynamic interferometer, obtaining a corresponding initial compensation parameter based on the RMS value, and determining an initial compensation pressure of the ring-polishing device based on the initial compensation parameter include: Get the preset RMS value , determine the initial compensation pressure based on the preset RMS value and the initial RMS value, and satisfy:

[0010] in, is the initial compensation pressure, is the scale parameter.

[0011] In conjunction with the first aspect, in some feasible implementations, a first ring-throwing logic of the ring-throwing device is determined based on the initial compensation pressure, the first ring-throwing logic including applying an actual ring-throwing pressure to the element to be ring-thrown in the form of a first cyclically variable force, wherein the maximum value of the actual ring-throwing pressure is equal to the initial compensation pressure, including: Obtain the first cycle variable force based on the initial compensation pressure, the instantaneous value of the first cycle variable force and The relationship between them satisfies:

[0012] Where k is a constant, is the current corresponding duration of the first cycle variable force.

[0013] In conjunction with the first aspect, in some feasible implementations, obtaining a ring-throwing duration, and when the ring-throwing duration is greater than a preset ring-throwing time, obtaining a second cyclic variable force based on the initial compensation pressure, wherein the work done by the second cyclic variable force on the ring-throwing element in a unit time period is greater than the work done by the first cyclic variable force on the ring-throwing element in a unit time period, includes: The second cycle variable force is obtained based on the initial compensation pressure and satisfies:

[0014] Where k is a constant, is the current corresponding duration of the second cycle variable force.

[0015] A second aspect of an embodiment of the present invention provides a precision special-shaped optical component ring polishing monitoring system, which is configured as follows: Obtaining an initial RMS value during a target ring-polishing cycle based on a PMD dynamic interferometer, obtaining a corresponding initial compensation parameter based on the RMS value, and determining an initial compensation pressure of the ring-polishing device based on the initial compensation parameter; Determining a first ring-throwing logic of the ring-throwing device based on the initial compensation pressure, the first ring-throwing logic comprising applying an actual ring-throwing pressure to the element to be ring-thrown in the form of a first cyclically variable force, wherein a maximum value of the actual ring-throwing pressure is equal to the initial compensation pressure; The ring-throwing device is controlled based on the first ring-throwing logic to perform ring-throwing on the element to be ring-thrown, and a dynamic RMS value is obtained. When the dynamic RMS value is less than a preset RMS value, the ring-throwing is stopped.

[0016] In conjunction with the second aspect, in some feasible implementations, the system is configured as follows: The ring-throwing device is controlled based on the first ring-throwing logic to perform ring-throwing on the element to be ring-thrown and obtain a dynamic RMS value. When the dynamic RMS value is less than a preset value, the ring-throwing is stopped, including: Obtaining a ring-throwing duration. When the ring-throwing duration is greater than a preset ring-throwing time, obtaining a second cyclic variable force based on the initial compensation pressure, wherein the work done by the second cyclic variable force on the ring-throwing element per unit time period is greater than the work done by the first cyclic variable force on the ring-throwing element per unit time period. The ring-polishing device is controlled to polish the component to be ring-polished according to the second ring-polishing logic, wherein the second ring-polishing logic includes applying actual ring-polishing pressure to the component to be ring-polished in a second cyclic variable force manner.

[0017] In conjunction with the second aspect, in some feasible implementations, the system is configured as follows: Obtaining an initial RMS value during a target ring-polishing cycle based on a PMD dynamic interferometer, obtaining corresponding initial compensation parameters based on the RMS value, and determining an initial compensation pressure of the ring-polishing device based on the initial compensation parameters, including: At the beginning of the target polishing cycle, the PMD dynamic interferometer performs a full-field scan of the target component, projects multi-frequency fringes, and collects distorted images. The phase resolution algorithm is used to reconstruct the corresponding three-dimensional topography of the target component surface. Obtaining height deviation based on 3D topography , based on the height deviation Get the initial RMS value RMS and satisfy:

[0018] in, is the average height deviation, and N is the number of sampling points.

[0019] In conjunction with the second aspect, in some feasible implementations, the system is configured as follows: Obtaining an initial RMS value during a target ring-polishing cycle based on a PMD dynamic interferometer, obtaining corresponding initial compensation parameters based on the RMS value, and determining an initial compensation pressure of the ring-polishing device based on the initial compensation parameters, including: Get the preset RMS value , determine the initial compensation pressure based on the preset RMS value and the initial RMS value, and satisfy: -RMS)(N) in, is the initial compensation pressure, is the scale parameter.

[0020] In conjunction with the second aspect, in some feasible implementations, the system is configured as follows: Determining a first ring-throwing logic of the ring-throwing device based on the initial compensation pressure, the first ring-throwing logic comprising applying an actual ring-throwing pressure to the element to be ring-thrown in the form of a first cyclically variable force, wherein a maximum value of the actual ring-throwing pressure is equal to the initial compensation pressure, comprises: Obtain the first cycle variable force based on the initial compensation pressure, the instantaneous value of the first cycle variable force and The relationship between them satisfies:

[0021] Where k is a constant, is the current corresponding duration of the first cycle variable force.

[0022] In conjunction with the second aspect, in some feasible implementations, the system is configured as follows: Acquiring the ring-throwing duration. When the ring-throwing duration is greater than the preset ring-throwing time, acquiring a second cyclic variable force based on the initial compensation pressure, wherein the work done by the second cyclic variable force on the ring-throwing element in a unit time period is greater than the work done by the first cyclic variable force on the ring-throwing element in a unit time period, including: The second cycle variable force is obtained based on the initial compensation pressure and satisfies:

[0023] Where k is a constant, is the current corresponding duration of the second cycle variable force.

[0024] According to a third aspect of an embodiment of the present invention, an electronic device is provided, including: At least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the method proposed in the first aspect of the embodiment of the present invention.

[0025] A fourth aspect of an embodiment of the present invention provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the method provided in the first aspect of the embodiment of the present invention.

[0026] In summary, the above method and system have the following technical effects: The embodiment of the present application proposes a method and system for monitoring the polishing of precision special-shaped optical elements. First, an initial RMS value is obtained in a target polishing cycle based on a PMD dynamic interferometer, a corresponding initial compensation parameter is obtained based on the RMS value, and an initial compensation pressure of the polishing device is determined based on the initial compensation parameter. Then, the first polishing logic of the polishing device is determined based on the initial compensation pressure. The first polishing logic includes applying an actual polishing pressure to the element to be polished in the form of a first cyclic variable force, wherein the maximum value of the actual polishing pressure is equal to the initial compensation pressure. Finally, based on the first polishing logic, the polishing device is controlled to polish the element to be polished and obtain a dynamic RMS value. When the dynamic RMS value is less than the preset RMS value, the polishing is stopped. The embodiment of the present application proposes a method and system for monitoring the polishing of precision special-shaped optical elements. By applying an actual polishing pressure to the element to be polished in the form of a first cyclic variable force, the influence of the viscoelastic behavior of the workpiece material in the pressure increasing cycle on the workpiece accuracy and the influence of the viscoelastic behavior of the workpiece material in the pressure reducing cycle on the workpiece accuracy offset each other, thereby eliminating the influence of the viscoelastic behavior of the material on the accuracy as much as possible. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A flow chart of a method for monitoring the ring polishing of precision special-shaped optical components proposed in an embodiment of the present application. DETAILED DESCRIPTION

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0029] The embodiment of the present application proposes a method for monitoring the ring polishing of a precision special-shaped optical component, which is applicable to a ring polishing monitoring device for a precision special-shaped optical component. The device includes a controller, a ring polishing device, and a monitoring device. The monitoring device includes a PMD dynamic interferometer. The method is applicable to the controller. Figure 1 , the method comprises the following steps: S101: Obtain an initial RMS value in a target ring-polishing cycle based on a PMD dynamic interferometer, obtain a corresponding initial compensation parameter based on the RMS value, and determine an initial compensation pressure of the ring-polishing device based on the initial compensation parameter.

[0030] PMD systems are common in the industry. Generally, before the polishing cycle begins, a PMD system projects multi-frequency sinusoidal fringes (e.g., a three-frequency heterodyne method). A high-speed CMOS camera captures the distorted fringe image reflected from the workpiece surface. GPU-accelerated phase unwrapping algorithms (e.g., the Quality-Guided algorithm) are then used to reconstruct the 3D surface topography.

[0031] Align the measured data with the theoretical surface shape (CAD model or Zernike polynomial fitting result), eliminate the clamping error, and calculate the global RMS value of the effective processing area.

[0032] Specifically, in this embodiment, at the beginning of the target polishing cycle, a full-field scan of the element to be polished is performed based on the PMD dynamic interferometer, and multi-frequency fringes are projected and distorted images are collected, and the phase solution algorithm is used to reconstruct the three-dimensional morphology corresponding to the surface of the element to be polished.

[0033] For example, a three-frequency heterodyne method (low, medium, and high frequency stripes) can be used to calculate the wrapping phase for each set of phase-shifted stripes using a four-step phase shift method:

[0034] Among them, to is the grayscale value of the four-step phase-shift image.

[0035] Then, the absolute phase Φ(x,y) is substituted into the phase-height mapping function established in the calibration phase:

[0036] Among them, to The calibration data is obtained by fitting the least squares method. After that, the measured point cloud can be aligned with the CAD model through the ICP (Iterative Closest Point) algorithm to eliminate clamping errors.

[0037] In this embodiment, the height deviation can be obtained based on the three-dimensional appearance , based on the height deviation Get the initial RMS value RMS and satisfy:

[0038] in, is the average height deviation, and N is the number of sampling points.

[0039] Then, get the preset RMS value , determine the initial compensation pressure based on the preset RMS value and the initial RMS value, and satisfy:

[0040] in, is the initial compensation pressure, is the scale parameter.

[0041] S102: Determine the first ring-throwing logic of the ring-throwing device based on the initial compensation pressure, the first ring-throwing logic includes applying actual ring-throwing pressure to the element to be ring-thrown in the form of a first cyclic variable force, wherein the maximum value of the actual ring-throwing pressure is equal to the initial compensation pressure.

[0042] It is understandable that during the actual ring polishing process, the pressure applied to the workpiece surface will inevitably cause the workpiece to deform within a certain range, resulting in a certain error between the dynamic RMS value obtained during the pressure application process and the actual instantaneous RMS value. Therefore, in this embodiment, a cyclic pressure method can be used during the pressure application process.

[0043] Specifically, in this embodiment, the first cycle variable force is obtained based on the initial compensation pressure, and the instantaneous value of the first cycle variable force is and The relationship between them satisfies:

[0044] Where k is a constant, is the current corresponding duration of the first cycle variable force.

[0045] After conventional polishing, perhaps after a sudden release of pressure, the material elastically deforms and returns to its original shape, resulting in a change in surface shape. Especially for high-precision optical components, this slight deformation can affect the final RMS value. The viscoelastic behavior of such materials cannot be eliminated. Therefore, in this embodiment, the applied pressure is not a continuous pressure, but a cyclic pressure that varies over time. At its maximum value, it is the same as the calculated initial compensation pressure, ensuring the continuity of the polishing process. At the same time, the polishing pressure periodically increases or decreases over time.

[0046] As can be understood from a microscopic perspective, during periods of increasing pressure, the workpiece deformation gradually increases. During this period, the amount of workpiece cut increases during polishing, and the amount of surface rebound also increases. During periods of decreasing pressure, the workpiece deformation gradually decreases due to elastic deformation. As pressure decreases, polishing accuracy gradually increases and approaches the value calculated in the above steps. The effects of viscoelastic behavior on workpiece progress during periods of increasing pressure offset those during periods of decreasing pressure, improving accuracy.

[0047] S103: Based on the first ring-throwing logic, the ring-throwing device is controlled to perform ring-throwing on the element to be ring-thrown, and a dynamic RMS value is obtained. When the dynamic RMS value is less than a preset RMS value, the ring-throwing is stopped.

[0048] According to the requirements of the workpiece, a preset RMS threshold is obtained. For example, in this embodiment, a target value is set according to the workpiece specifications (such as =5nm), and define the allowable fluctuation range (such as ±0.5nm). PMD can output local surface data every 0.1 seconds and calculate the current dynamic RMS value. When the N consecutive dynamic RMS values ​​meet the following conditions:

[0049] The surface shape can be judged to have converged, triggering a stop command. If the dynamic RMS value does not converge within the target time, it is judged to be a process failure, an emergency stop is executed, and an alarm is issued.

[0050] Of course, in other embodiments, failure of the dynamic RMS value to converge within the target time may also be due to insufficient total polishing work. Therefore, as an embodiment, the ring polishing duration is obtained. When the ring polishing duration is greater than the preset ring polishing time, a second cyclic variable force is obtained based on the initial compensation pressure. The work done by the second cyclic variable force on the ring polishing element per unit time period is greater than the work done by the first cyclic variable force on the ring polishing element per unit time period.

[0051] Specifically, the second cyclic variable force is obtained based on the initial compensation pressure and satisfies:

[0052] Then, the ring-polishing device is controlled to polish the component to be ring-polished according to the second ring-polishing logic, wherein the second ring-polishing logic includes applying actual ring-polishing pressure to the component to be ring-polished in a second cyclic variable force manner.

[0053] The embodiment of the present application proposes a method for monitoring the polishing of precision special-shaped optical elements. First, an initial RMS value is obtained in a target polishing cycle based on a PMD dynamic interferometer, a corresponding initial compensation parameter is obtained based on the RMS value, and an initial compensation pressure of the polishing device is determined based on the initial compensation parameter. Then, the first polishing logic of the polishing device is determined based on the initial compensation pressure. The first polishing logic includes applying an actual polishing pressure to the element to be polished in the form of a first cyclic variable force, wherein the maximum value of the actual polishing pressure is equal to the initial compensation pressure. Finally, the polishing device is controlled to polish the element to be polished based on the first polishing logic, and a dynamic RMS value is obtained. When the dynamic RMS value is less than a preset RMS value, the polishing is stopped. The embodiment of the present application proposes a method for monitoring the polishing of precision special-shaped optical elements. By applying an actual polishing pressure to the element to be polished in the form of a first cyclic variable force, the influence of the viscoelastic behavior of the workpiece material in the pressure increasing cycle on the workpiece accuracy and the influence of the viscoelastic behavior of the workpiece material in the pressure reducing cycle on the workpiece accuracy offset each other, thereby eliminating the influence of the viscoelastic behavior of the material on the accuracy as much as possible.

[0054] Based on the same inventive concept, the present application also proposes a precision special-shaped optical component ring polishing monitoring system, which is configured as follows: Obtaining an initial RMS value during a target ring-polishing cycle based on a PMD dynamic interferometer, obtaining a corresponding initial compensation parameter based on the RMS value, and determining an initial compensation pressure of the ring-polishing device based on the initial compensation parameter; Determining a first ring-throwing logic of the ring-throwing device based on the initial compensation pressure, the first ring-throwing logic comprising applying an actual ring-throwing pressure to the element to be ring-thrown in the form of a first cyclically variable force, wherein a maximum value of the actual ring-throwing pressure is equal to the initial compensation pressure; The ring-throwing device is controlled based on the first ring-throwing logic to perform ring-throwing on the element to be ring-thrown, and a dynamic RMS value is obtained. When the dynamic RMS value is less than a preset RMS value, the ring-throwing is stopped.

[0055] In conjunction with the second aspect, in some feasible implementations, the system is configured as follows: The ring-throwing device is controlled based on the first ring-throwing logic to perform ring-throwing on the element to be ring-thrown and obtain a dynamic RMS value. When the dynamic RMS value is less than a preset value, the ring-throwing is stopped, including: Obtaining a ring-throwing duration. When the ring-throwing duration is greater than a preset ring-throwing time, obtaining a second cyclic variable force based on the initial compensation pressure, wherein the work done by the second cyclic variable force on the ring-throwing element per unit time period is greater than the work done by the first cyclic variable force on the ring-throwing element per unit time period. The ring-polishing device is controlled to polish the component to be ring-polished according to the second ring-polishing logic, wherein the second ring-polishing logic includes applying actual ring-polishing pressure to the component to be ring-polished in a second cyclic variable force manner.

[0056] In conjunction with the second aspect, in some feasible implementations, the system is configured as follows: Obtaining an initial RMS value during a target ring-polishing cycle based on a PMD dynamic interferometer, obtaining corresponding initial compensation parameters based on the RMS value, and determining an initial compensation pressure of the ring-polishing device based on the initial compensation parameters, including: At the beginning of the target polishing cycle, the PMD dynamic interferometer performs a full-field scan of the target component, projects multi-frequency fringes, and collects distorted images. The phase resolution algorithm is used to reconstruct the corresponding three-dimensional topography of the target component surface. Obtaining height deviation based on 3D topography , based on the height deviation Get the initial RMS value RMS and satisfy:

[0057] in, is the average height deviation, and N is the number of sampling points.

[0058] In some possible implementations, the system is configured to: Obtaining an initial RMS value during a target ring-polishing cycle based on a PMD dynamic interferometer, obtaining corresponding initial compensation parameters based on the RMS value, and determining an initial compensation pressure of the ring-polishing device based on the initial compensation parameters, including: Get the preset RMS value , determine the initial compensation pressure based on the preset RMS value and the initial RMS value, and satisfy:

[0059] in, is the initial compensation pressure, is the scale parameter.

[0060] In some possible implementations, the system is configured to: Determining a first ring-throwing logic of the ring-throwing device based on the initial compensation pressure, the first ring-throwing logic comprising applying an actual ring-throwing pressure to the element to be ring-thrown in the form of a first cyclically variable force, wherein a maximum value of the actual ring-throwing pressure is equal to the initial compensation pressure, comprises: Obtain the first cycle variable force based on the initial compensation pressure, the instantaneous value of the first cycle variable force and The relationship between them satisfies:

[0061] Where k is a constant, is the current corresponding duration of the first cycle variable force.

[0062] In some possible implementations, the system is configured to: Acquiring the ring-throwing duration. When the ring-throwing duration is greater than the preset ring-throwing time, acquiring a second cyclic variable force based on the initial compensation pressure, wherein the work done by the second cyclic variable force on the ring-throwing element in a unit time period is greater than the work done by the first cyclic variable force on the ring-throwing element in a unit time period, including: The second cycle variable force is obtained based on the initial compensation pressure and satisfies:

[0063] Where k is a constant, is the current corresponding duration of the second cycle variable force.

[0064] The embodiment of the present application proposes a precision special-shaped optical element ring polishing monitoring system. First, based on the PMD dynamic interferometer, an initial RMS value is obtained in the target ring polishing cycle, a corresponding initial compensation parameter is obtained based on the RMS value, and an initial compensation pressure of the ring polishing device is determined based on the initial compensation parameter. Then, based on the initial compensation pressure, a first ring polishing logic of the ring polishing device is determined. The first ring polishing logic includes applying an actual ring polishing pressure to the element to be polished in the form of a first cyclic variable force, wherein the maximum value of the actual ring polishing pressure is equal to the initial compensation pressure. Finally, based on the first ring polishing logic, the ring polishing device is controlled to perform ring polishing on the element to be polished and obtain a dynamic RMS value. When the dynamic RMS value is less than the preset RMS value, the ring polishing is stopped. The embodiment of the present application proposes a precision special-shaped optical element ring polishing monitoring system. By applying an actual ring polishing pressure to the element to be polished in the form of a first cyclic variable force, the influence of the viscoelastic behavior of the workpiece material in the pressure increasing period on the workpiece accuracy and the influence of the viscoelastic behavior of the workpiece material in the pressure reducing period on the workpiece accuracy offset each other, thereby eliminating the influence of the viscoelastic behavior of the material on the accuracy as much as possible.

[0065] Based on the same inventive concept, an embodiment of the present application further provides an electronic device, the electronic device comprising: At least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to execute the ring-polishing monitoring method for precision special-shaped optical elements of an embodiment of the present application.

[0066] In addition, to achieve the above-mentioned purpose, an embodiment of the present application also proposes a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the ring polishing monitoring method of the precision special-shaped optical element of the embodiment of the present application is implemented.

[0067] The following is a detailed introduction to the various components of electronic equipment: The term "processor" refers to the control center of an electronic device and can be a single processor or a collective term for multiple processing elements. For example, the processor can be one or more central processing units (CPUs), an application-specific integrated circuit (ASIC), or one or more integrated circuits configured to implement embodiments of the present invention, such as one or more digital signal processors (DSPs) or one or more field programmable gate arrays (FPGAs).

[0068] Optionally, the processor can perform various functions of the electronic device by running or executing a software program stored in the memory, and calling data stored in the memory.

[0069] The memory is used to store the software program for executing the solution of the present invention, and the execution is controlled by the processor. The specific implementation method can refer to the above method embodiment and will not be repeated here.

[0070] Alternatively, the memory may be a read-only memory (ROM) or other type of static storage device capable of storing static information and instructions, a random access memory (RAM) or other type of dynamic storage device capable of storing information and instructions, an electrically erasable programmable read-only memory (EEPROM), a compact disc read-only memory (CD-ROM) or other optical disc storage, an optical disc storage (including a compact disc, laser disc, optical disc, digital versatile disc, Blu-ray disc, etc.), a magnetic disk storage medium or other magnetic storage device, or any other medium capable of carrying or storing desired program code in the form of instructions or data structures and accessible by a computer, but is not limited thereto. The memory may be integrated with the processor or exist independently and be coupled to the processor via an interface circuit of the electronic device, and this is not specifically limited in the embodiments of the present invention.

[0071] A transceiver is used to communicate with network devices or terminal devices.

[0072] Optionally, the transceiver may include a receiver and a transmitter, wherein the receiver is used to implement a receiving function, and the transmitter is used to implement a sending function.

[0073] Optionally, the transceiver may be integrated with the processor, or may exist independently and be coupled to the processor via an interface circuit of the router, which is not specifically limited in the embodiment of the present invention.

[0074] In addition, the technical effects of the electronic device can refer to the technical effects of the data transmission method in the above method embodiment, and will not be repeated here.

[0075] It should be understood that the processor in the embodiments of the present invention may be a central processing unit (CPU), but may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field programmable gate arrays (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor, etc.

[0076] It should also be understood that the memory in the embodiments of the present invention may be volatile memory or non-volatile memory, or may include both volatile and non-volatile memory. The non-volatile memory may be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. The volatile memory may be random access memory (RAM), which is used as an external cache. By way of example and not limitation, many forms of random access memory (RAM) are available, such as static RAM (SRAM), dynamic random access memory (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), and direct rambus RAM (DR RAM).

[0077] The above embodiments can be implemented in whole or in part via software, hardware (e.g., circuits), firmware, or any other combination thereof. When implemented using software, the above embodiments can be implemented in whole or in part in the form of a computer program product. A computer program product comprises one or more computer instructions or computer programs. When the computer instructions or computer program are loaded or executed on a computer, the processes or functions according to the embodiments of the present invention are fully or partially generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. Computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired means (e.g., infrared, wireless, microwave, etc.). A computer-readable storage medium can be any available medium accessible by a computer or a data storage device such as a server or data center that contains a collection of one or more available media. Available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., DVDs), or semiconductor media. Semiconductor media can be solid-state drives.

[0078] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. A and B can be singular or plural. Furthermore, the character " / " as used herein generally indicates an "or" relationship between the associated objects, but it may also indicate an "and / or" relationship. For specific understanding, please refer to the context.

[0079] In this disclosure, "at least one" means one or more, and "plurality" means two or more. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, "at least one of a, b, or c" can mean: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or plural.

[0080] It should be understood that in various embodiments of the present invention, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0081] Those skilled in the art will appreciate that the units and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present invention.

Claims

1. A method for monitoring the ring polishing of precision special-shaped optical components, characterized in that: The method is applicable to a ring-polishing monitoring device for precision special-shaped optical elements, the device comprising a controller, a ring-polishing device, and a monitoring device, the monitoring device comprising a PMD dynamic interferometer, the method being applicable to the controller, and comprising: Obtaining an initial RMS value during a target ring-polishing cycle based on the PMD dynamic interferometer, obtaining a corresponding initial compensation parameter based on the RMS value, and determining an initial compensation pressure of the ring-polishing device based on the initial compensation parameter; Determining a first ring-throwing logic of the ring-throwing device based on the initial compensation pressure, wherein the first ring-throwing logic includes applying an actual ring-throwing pressure to the element to be ring-thrown in the form of a first cyclically variable force, wherein a maximum value of the actual ring-throwing pressure is equal to the initial compensation pressure; Based on the first polishing logic, the polishing device is controlled to polish the component to be polished, and a dynamic RMS value is obtained. When the dynamic RMS value is less than a preset RMS value, the polishing is stopped.

2. A method for monitoring ring polishing of precision special-shaped optical components according to claim 1, characterized in that: Controlling the polishing device to polish the component to be polished based on the first polishing logic and obtaining a dynamic RMS value, and stopping the polishing when the dynamic RMS value is less than a preset value, including: Acquire a ring-throwing duration. When the ring-throwing duration is greater than a preset ring-throwing time, acquire a second cyclic variable force based on the initial compensation pressure, wherein the work done by the second cyclic variable force on the element to be thrown per unit time period is greater than the work done by the first cyclic variable force on the element to be thrown per unit time period. The ring-polishing device is controlled to polish the component to be ring-polished according to a second ring-polishing logic, wherein the second ring-polishing logic includes applying actual ring-polishing pressure to the component to be ring-polished in a second cyclically variable force manner.

3. The method for monitoring the ring polishing of precision special-shaped optical components according to claim 1, characterized in that: Acquiring an initial RMS value in a target ring-polishing cycle based on the PMD dynamic interferometer, acquiring a corresponding initial compensation parameter based on the RMS value, and determining an initial compensation pressure of the ring-polishing device based on the initial compensation parameter, including: At the beginning of the target polishing cycle, the PMD dynamic interferometer is used to perform a full-field scan of the target polishing element, project multi-frequency fringes, collect distorted images, and use a phase resolution algorithm to reconstruct the three-dimensional topography corresponding to the surface of the target polishing element; Obtaining a height deviation based on the three-dimensional topography , based on the height deviation Obtain the initial RMS value RMS and satisfy: ； in, is the average height deviation, and N is the number of sampling points.

4. A method for monitoring ring polishing of precision special-shaped optical components according to claim 3, characterized in that: Acquiring an initial RMS value in a target ring-polishing cycle based on the PMD dynamic interferometer, acquiring a corresponding initial compensation parameter based on the RMS value, and determining an initial compensation pressure of the ring-polishing device based on the initial compensation parameter, including: Get the preset RMS value , determining the initial compensation pressure based on the preset RMS value and the initial RMS value, and satisfying: ； in, is the initial compensation pressure, is the scale parameter.

5. The method for monitoring ring polishing of precision special-shaped optical components according to claim 1, characterized in that: Determining a first ring-throwing logic of the ring-throwing device based on the initial compensation pressure, wherein the first ring-throwing logic includes applying an actual ring-throwing pressure to the element to be ring-thrown in the form of a first cyclically variable force, wherein a maximum value of the actual ring-throwing pressure is equal to the initial compensation pressure, includes: A first cyclic variable force is obtained based on the initial compensation pressure, and the instantaneous value of the first cyclic variable force is With the The relationship between them satisfies: ； Where k is a constant, is the current corresponding duration of the first cyclic variable force.

6. The ring polishing monitoring method for precision special-shaped optical components according to claim 2, characterized in that: Acquiring a ring-throwing duration, and when the ring-throwing duration is greater than a preset ring-throwing time, acquiring a second cyclic variable force based on the initial compensation pressure, wherein the work done by the second cyclic variable force on the to-be-thrown element within a unit time period is greater than the work done by the first cyclic variable force on the to-be-thrown element within a unit time period, including: A second cyclic variable force is obtained based on the initial compensation pressure, and satisfies: ； Where k is a constant, is the current corresponding duration of the second cyclic variable force.

7. A precision special-shaped optical component ring polishing monitoring system, characterized in that: The system is configured to: Obtaining an initial RMS value during a target ring-polishing cycle based on the PMD dynamic interferometer, obtaining a corresponding initial compensation parameter based on the RMS value, and determining an initial compensation pressure of the ring-polishing device based on the initial compensation parameter; Determining a first ring-throwing logic of the ring-throwing device based on the initial compensation pressure, wherein the first ring-throwing logic includes applying an actual ring-throwing pressure to the element to be ring-thrown in the form of a first cyclically variable force, wherein a maximum value of the actual ring-throwing pressure is equal to the initial compensation pressure; Based on the first polishing logic, the polishing device is controlled to polish the component to be polished, and a dynamic RMS value is obtained. When the dynamic RMS value is less than a preset RMS value, the polishing is stopped.

8. The precision special-shaped optical component ring polishing monitoring system according to claim 7, characterized in that: The system is configured to: Acquire a ring-throwing duration. When the ring-throwing duration is greater than a preset ring-throwing time, acquire a second cyclic variable force based on the initial compensation pressure, wherein the work done by the second cyclic variable force on the element to be thrown per unit time period is greater than the work done by the first cyclic variable force on the element to be thrown per unit time period. The ring-polishing device is controlled to polish the component to be ring-polished according to a second ring-polishing logic, wherein the second ring-polishing logic includes applying actual ring-polishing pressure to the component to be ring-polished in a second cyclically variable force manner.

9. An electronic device, characterized in that: The electronic device comprises: at least one processor; and, a memory communicatively coupled to at least one of the processors; The memory stores instructions that can be executed by at least one of the processors, and the instructions are executed by at least one of the processors to enable the at least one processor to execute the method according to any one of claims 1 to 6.

10. A computer-readable storage medium, characterized in that A computer program is stored thereon, and when the program is executed by a processor, the method according to any one of claims 1 to 6 is implemented.

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