A polishing apparatus for a quartz shaft for a semiconductor

Abstract

The application relates to the technical field of quartz shaft processing, in particular to a quartz shaft polishing device for semiconductors, which comprises a polishing machine table, the top of the polishing machine table is fixedly connected with an electric sliding rail, the front side of the electric sliding rail is movably connected with a bottom frame, the top of the bottom frame is provided with an auxiliary frame, the top of the auxiliary frame is fixedly connected with a guide rail, the top of the front side of the auxiliary frame is fixedly connected with a supporting piece, the inner side of the guide rail is movably connected with a suspension frame, and the bottom of the suspension frame is provided with an upper clamping ring and a lower clamping ring. The quartz shaft polishing device for semiconductors can flexibly support an ultralong quartz shaft, reduces the risk of shaft body fracture, and effectively removes polishing liquid while avoiding liquid residue in polishing liquid treatment. In the structural design, the contact pad and the ball reduce friction and surface damage, and the universality and adaptability of the device to different sizes of quartz shafts are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of quartz shaft processing, in particular to a quartz shaft polishing device for semiconductor. BACKGROUND

[0002] It is known that the quartz shaft for semiconductor is a shaft component made of quartz material used in the process of semiconductor, and the quartz is a high-purity crystal form of silicon, which has good thermal stability, chemical stability and mechanical strength, and is widely used in the semiconductor industry. The polishing of the quartz shaft for semiconductor is a key process in the precision machining of the quartz shaft, which directly affects the surface quality, precision of the quartz shaft and stability of the semiconductor process.

[0003] The existing technology has the following problems: when the quartz shaft is polished, especially the long quartz shaft with large diameter, it is sometimes difficult to support the overlength part of the quartz shaft when it is driven to rotate by the chuck and other rotary parts to cooperate with the polishing disc for processing. Most of the existing polishing machines have two end clamps, and the adjustable range is low, so it is difficult to polish according to the actual situation. At the same time, the polishing liquid adheres to the surface of the quartz shaft during polishing, which can cause surface scratches, roughness or additional cleaning in the later stage, which is not convenient to use.

[0004] Based on the above-mentioned situation, we find that the existing quartz shaft polishing device is difficult to avoid the above problems at the same time, so we propose a quartz shaft polishing device for semiconductor, which can reasonably support the overlength quartz shaft material and reduce the probability of fracture, and can remove the polishing liquid. SUMMARY

[0005] In view of the shortcomings of the prior art, the present application provides a quartz shaft polishing device for semiconductor, which has the advantages of reasonable support processing of overlength quartz shaft material, reduction of fracture probability and removal of polishing liquid.

[0006] The above technical purpose of the present application is realized by the following technical scheme: a quartz shaft polishing device for semiconductor, comprising a polishing machine, the top of the polishing machine is fixedly connected with an electric sliding rail, the front side of the electric sliding rail is movably connected with a base frame, the top of the base frame is provided with an auxiliary frame, the top of the auxiliary frame is fixedly connected with a guide rail, the top of the front side of the auxiliary frame is fixedly connected with a support, the inner side of the guide rail is movably connected with a suspension, the bottom of the suspension is provided with an upper ring and a lower ring, the inner side of the upper ring and the lower ring is fixedly connected with a plurality of short shafts, the outer side of the short shaft is rotatably connected with a diagonal brace, the side away from the short shaft of the diagonal brace is rotatably connected with a sleeve frame, the top of the sleeve frame is rotatably connected with a rotating shaft, the side away from the sleeve frame of the rotating shaft is rotatably connected with a horizontal plate, the side away from the rotating shaft of the horizontal plate is connected with a soft pad through a bolt.

[0007] The support comprises a lower clamping frame and an upper clamping frame, the inner side of the lower clamping frame is rotationally connected with a connecting pin, the outer side of the connecting pin is rotationally connected with the upper clamping frame, the inner side of the lower clamping frame and the inner side of the upper clamping frame are fixedly connected with a contact sheet, the inner side of the contact sheet is movably connected with a ball, the inner side of the lower clamping frame is rotationally connected with a movable block, the rear side of the movable block is fixedly connected with an electric cylinder, the telescopic end of the electric cylinder penetrates through the movable block and is installed with a push-pull block, the outer side of the push-pull block is rotationally connected with the inner side of the upper clamping frame.

[0008] The polishing machine is used for normal clamping, driving and polishing operation, the quartz shaft material can be directly clamped in the chuck of the polishing machine during use, and the unclamped part is supported by the support, after the clamping and fixing of the polishing machine and the quartz shaft material are completed, the auxiliary frame is moved upward, the inner side of the lower clamping frame is in contact with the quartz shaft material, then the electric cylinder is elongated, the push-pull block and the upper clamping frame connected with the push-pull block are rotated along the connecting pin and are clamped on the surface of the quartz shaft material, the upper clamping frame and the lower clamping frame support the quartz shaft through the balls on the inner side of the contact sheet, even if the quartz shaft material is too long, the position of the base frame can be moved through the electric sliding rail, so that the entire auxiliary frame is away from the chuck of the polishing machine, to support the position of the quartz shaft material away from the chuck, the balls roll during movement, so they will not have large friction with the quartz shaft material, when the chuck drives the quartz shaft to rotate, the quartz shaft will also roll between the balls, the balls will also rotate, so they will not affect the normal operation of the quartz shaft, the upper ring is matched with the lower ring, the polishing liquid will be attached to the surface of the quartz shaft during normal polishing, the upper ring and the lower ring clamp the quartz shaft material in the formed annular inner side, at this time, the inclined support is inclined due to the stress of the sleeve frame, the horizontal plate and the soft pad and the quartz shaft material, the sleeve frame rotates along the inclined support, so that the horizontal plate and the soft pad are attached to the surface of the quartz shaft material, the soft pad deforms after contact to increase the contact area between itself and the quartz shaft material, the inclined horizontal plate rotates along the rotating shaft, the soft pads contact each other to wrap around the surface of the quartz shaft, to further attach to the outer side of the quartz shaft, so that there is no gap between them, then the upper ring and the lower ring can be moved along the guide rail and the suspension to remove all the polishing liquid attached during the polishing process, to avoid the polishing liquid from being attached to the surface of the quartz shaft for a long time to dry and cause subsequent difficulty in processing.

[0009] The outer side of the rotating shaft is sleeved with a first torsional spring, the two ends of the first torsional spring are fixedly connected with the sleeve frame and the horizontal plate respectively, the inner side of the sleeve frame is fixedly connected with a second torsional spring, the side away from the sleeve frame of the second torsional spring is fixedly connected with the inclined support.

[0010] The technical scheme is adopted, the first torsional spring cooperates with the second torsional spring, the second torsional spring makes the sleeve frame and the inclined support be in a reset state when the horizontal plate and the soft pad do not contact the quartz shaft material stress, and is deformed to store power when stressed, and the first torsional spring is always in a power storage and expansion state, so as to press the horizontal plate and the soft pad to always abut against other soft pads, the interval distance is reduced, and the gap is avoided to be too large to achieve good wiping effect.

[0011] The technical scheme is adopted, the first torsional spring cooperates with the second torsional spring, the second torsional spring makes the sleeve frame and the inclined support be in a reset state when the horizontal plate and the soft pad do not contact the quartz shaft material stress, and is deformed to store power when stressed, and the first torsional spring is always in a power storage and expansion state, so as to press the horizontal plate and the soft pad to always abut against other soft pads, the interval distance is reduced, and the gap is avoided to be too large to achieve good wiping effect.

[0012] The technical scheme is adopted, the first torsional spring cooperates with the second torsional spring, the second torsional spring makes the sleeve frame and the inclined support be in a reset state when the horizontal plate and the soft pad do not contact the quartz shaft material stress, and is deformed to store power when stressed, and the first torsional spring is always in a power storage and expansion state, so as to press the horizontal plate and the soft pad to always abut against other soft pads, the interval distance is reduced, and the gap is avoided to be too large to achieve good wiping effect.

[0013] The technical scheme is adopted, the first torsional spring cooperates with the second torsional spring, the second torsional spring makes the sleeve frame and the inclined support be in a reset state when the horizontal plate and the soft pad do not contact the quartz shaft material stress, and is deformed to store power when stressed, and the first torsional spring is always in a power storage and expansion state, so as to press the horizontal plate and the soft pad to always abut against other soft pads, the interval distance is reduced, and the gap is avoided to be too large to achieve good wiping effect.

[0014] The technical scheme is adopted, the first torsional spring cooperates with the second torsional spring, the second torsional spring makes the sleeve frame and the inclined support be in a reset state when the horizontal plate and the soft pad do not contact the quartz shaft material stress, and is deformed to store power when stressed, and the first torsional spring is always in a power storage and expansion state, so as to press the horizontal plate and the soft pad to always abut against other soft pads, the interval distance is reduced, and the gap is avoided to be too large to achieve good wiping effect.

[0015] The technical scheme is adopted, the first torsional spring cooperates with the second torsional spring, the second torsional spring makes the sleeve frame and the inclined support be in a reset state when the horizontal plate and the soft pad do not contact the quartz shaft material stress, and is deformed to store power when stressed, and the first torsional spring is always in a power storage and expansion state, so as to press the horizontal plate and the soft pad to always abut against other soft pads, the interval distance is reduced, and the gap is avoided to be too large to achieve good wiping effect.

[0016] The technical scheme is adopted, the first torsional spring cooperates with the second torsional spring, the second torsional spring makes the sleeve frame and the inclined support be in a reset state when the horizontal plate and the soft pad do not contact the quartz shaft material stress, and is deformed to store power when stressed, and the first torsional spring is always in a power storage and expansion state, so as to press the horizontal plate and the soft pad to always abut against other soft pads, the interval distance is reduced, and the gap is avoided to be too large to achieve good wiping effect.

[0017] The technical scheme is adopted, the first torsional spring cooperates with the second torsional spring, the second torsional spring makes the sleeve frame and the inclined support be in a reset state when the horizontal plate and the soft pad do not contact the quartz shaft material stress, and is deformed to store power when stressed, and the first torsional spring is always in a power storage and expansion state, so as to press the horizontal plate and the soft pad to always abut against other soft pads, the interval distance is reduced, and the gap is avoided to be too large to achieve good wiping effect.

[0018] By means of the above technical scheme, the vertical height of the upper clamping ring and the lower clamping ring is adjusted by the displacement sleeve and the vertical rod, so that the size of the quartz shaft is fitted for use, and the limiting protrusions can prevent the upper clamping ring from slipping off the bottom of the vertical rod.

[0019] The inner side of the guide rail is rotationally connected with a lead screw, the left side of the guide rail is externally connected with a control motor, the output end of the control motor is fixedly connected with the lead screw, and the outer side of the lead screw is threadedly connected with the suspension frame.

[0020] By means of the above technical scheme, the lead screw is driven to rotate forward or reversely by the control motor when the control motor is reversely or forwardly rotated, so that the suspension frame and the structure connected therewith are horizontally moved, the position of the upper clamping ring is adjusted, or the upper clamping ring is moved to follow the polishing piece.

[0021] The top of the base frame is fixedly connected with a telescopic cylinder, and the telescopic end of the telescopic cylinder is fixedly connected with the auxiliary frame.

[0022] By means of the above technical scheme, the telescopic cylinder is used to lift or lower the auxiliary frame, so that the structure is adaptively adjusted to the size of the quartz shaft.

[0023] The inner side of the lower clamping frame and the upper clamping frame is fixedly connected with a contact pad, and the contact pad is made of sponge material.

[0024] By means of the above technical scheme, when the upper clamping frame and the lower clamping frame contact the quartz shaft material, the contact pad is contacted first, so that damage to the surface of the quartz shaft material caused by excessive stress between rigid structures is avoided.

[0025] The bottom of the lower clamping frame is fixedly connected with the auxiliary frame, and the inner side of the upper clamping ring and the lower clamping ring is provided with a flow-through groove.

[0026] By means of the above technical scheme, when the polishing liquid flows into the lower clamping ring, the flow-through groove is used to discharge the polishing liquid, so that accumulation is avoided to facilitate cleaning in the later period.

[0027] Compared with the prior art, the quartz shaft polishing device for semiconductor has the following beneficial effects:

[0028] The polishing device for semiconductor quartz shaft is characterized in that a polishing machine is arranged for normal clamping, driving and polishing operation, the quartz shaft material can be directly clamped in the chuck of the polishing machine during use, the unclamped part is assisted and supported by the supporting piece, the inner side of the lower clamping frame is contacted with the quartz shaft material after the clamping and fixing of the polishing machine and the quartz shaft material are completed, then the electric cylinder is elongated, the push-pull block and the upper clamping frame connected with the push-pull block are pushed and rotated along the connecting pin and clamped on the surface of the quartz shaft material, the quartz shaft is supported by the balls in the inner side of the contact piece of the upper clamping frame and the lower clamping frame, even if the quartz shaft material is too long, the position of the base frame can be moved by the electric sliding rail, the whole auxiliary frame is away from the chuck of the polishing machine, the position of the quartz shaft material away from the chuck is supported, the balls roll during movement, so that the quartz shaft material is not rubbed too much, the quartz shaft rolls between the balls during the driving of the quartz shaft by the chuck, the balls also rotate, so that the normal operation of the quartz shaft is not affected, the upper clamping ring is matched with the lower clamping ring, the polishing liquid is attached to the surface of the quartz shaft during normal polishing, the quartz shaft material is clamped in the inner side of the formed ring by the upper clamping ring and the lower clamping ring, at this time, the inclined support is inclined due to the stress of the sleeve frame, the horizontal plate and the soft pad and the quartz shaft material, the sleeve frame is rotated along the inclined support, so that the horizontal plate and the soft pad are attached to the surface of the quartz shaft material, the soft pad is deformed after being contacted to increase the contact area between the soft pad and the quartz shaft material, the horizontal plate is rotated along the rotating shaft, the soft pads are contacted with each other to wrap the surface of the quartz shaft, so as to be attached to the outer side of the quartz shaft without gap, then the upper clamping ring and the lower clamping ring are moved along the guide rail and the suspension to remove the polishing liquid attached during polishing, so as to avoid that the polishing liquid is dried on the surface of the quartz shaft for a long time to cause subsequent difficulty in processing. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 It is a schematic view of the structure in the application;

[0030] Figure 2 It is a position schematic view of the main structure in the application;

[0031] Figure 3 It is a connection schematic view of the lower clamping ring in the application;

[0032] Figure 4 It is a structure schematic view of the lower clamping ring in the application;

[0033] Figure 5 It is a structure schematic view of the supporting piece in the application;

[0034] Figure 6 It is a side view of the lower clamping frame in the application;

[0035] Figure 7The working schematic diagram of polishing the quartz shaft in the application.

[0036] In the figure: 1, polishing machine table; 2, electric sliding rail; 3, bottom frame; 4, auxiliary frame; 5, guide rail; 6, suspension; 7, support; 71, lower clamping frame; 72, upper clamping frame; 73, connecting pin; 74, contact sheet; 75, ball; 76, movable block; 77, electric cylinder; 78, push-pull block; 8, upper clamping ring; 9, lower clamping ring; 10, short shaft; 11, inclined strut; 12, sleeve frame; 13, rotating shaft; 14, cross plate; 15, soft pad; 16, first torsional spring; 17, second torsional spring; 18, third torsional spring; 19, rotating piece; 20, edge sleeve; 21, telescopic rod; 22, clamping plate; 23, tension spring; 24, displacement sleeve; 25, vertical rod; 26, lead screw; 27, telescopic cylinder; 28, contact pad; 29, flow-through groove. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the application will be clearly and completely described below with reference to the drawings in the embodiments of the application. Obviously, the described embodiments are only part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the application.

[0038] Embodiment 1

[0039] Please refer to Figures 1-7 A quartz shaft polishing device for semiconductor includes a polishing machine table 1, the top of the polishing machine table 1 is fixedly connected with an electric sliding rail 2, the front side of the electric sliding rail 2 is movably connected with a bottom frame 3, the top of the bottom frame 3 is provided with an auxiliary frame 4, the top of the auxiliary frame 4 is fixedly connected with a guide rail 5, the top of the front side of the auxiliary frame 4 is fixedly connected with a support 7, the inner side of the guide rail 5 is movably connected with a suspension 6, the bottom of the suspension 6 is provided with an upper clamping ring 8 and a lower clamping ring 9, the inner side of the upper clamping ring 8 and the lower clamping ring 9 is fixedly connected with a plurality of short shafts 10, the outer side of the short shaft 10 is rotatably connected with an inclined strut 11, the side away from the short shaft 10 of the inclined strut 11 is rotatably connected with a sleeve frame 12, the top of the sleeve frame 12 is rotatably connected with a rotating shaft 13, the side away from the sleeve frame 12 of the rotating shaft 13 is rotatably connected with a cross plate 14, the side away from the rotating shaft 13 of the cross plate 14 is connected with a soft pad 15 through bolts;

[0040] The upper clamping ring 8 cooperates with the lower clamping ring 9, and when normal polishing is performed, polishing liquid will adhere to the surface of the quartz shaft. The upper clamping ring 8 and the lower clamping ring 9 clamp the quartz shaft material on the inner side of the formed ring. At this time, the inclined support 11 is inclined due to the stress of the sleeve frame 12, the horizontal plate 14 and the soft pad 15 pressing against the quartz shaft material. At the same time, the sleeve frame 12 rotates along the inclined support 11, so that the horizontal plate 14 and the soft pad 15 are attached to the surface of the quartz shaft material. The soft pad 15 deforms after being contacted to increase the contact area between itself and the quartz shaft material. The inclined horizontal plate 14 rotates along the rotating shaft 13, and the multiple soft pads 15 contact each other to wrap around the surface of the quartz shaft to further adhere to the outside of the quartz shaft so that there is no gap between them. Then, the upper clamping ring 8 and the lower clamping ring 9 can be moved along the guide rail 5 and the suspension frame 6 to follow the polishing path to completely remove the polishing liquid adhered during the polishing process, thereby avoiding the subsequent difficulty in processing caused by the long-term adhesion of the polishing liquid to the surface of the quartz shaft and drying.

[0041] The outer side of the rotating shaft 13 is sleeved with a first torsion spring 16, both ends of the first torsion spring 16 are fixedly connected with the sleeve frame 12 and the horizontal plate 14 respectively, the inner side of the sleeve frame 12 is fixedly connected with a second torsion spring 17, the side, away from the sleeve frame 12, of the second torsion spring 17 is fixedly connected with the inclined support 11, by arranging the first torsion spring 16 cooperating with the second torsion spring 17, when the horizontal plate 14 and the soft pad 15 do not contact the quartz shaft material and are not stressed, the second torsion spring 17 makes the sleeve frame 12 and the inclined support 11 be in a reset state, and is deformed to store power when stressed, and the first torsion spring 16 is always in a state of storing power and expanding outward, so as to press the horizontal plate 14 and the soft pad 15 to always abut against other soft pads 15, thereby reducing the interval distance and avoiding that the gap is too large to achieve good wiping effect, the inner sides of the upper clamping ring 8 and the lower clamping ring 9 are fixedly connected with third torsion springs 18, the side, close to the inclined support 11, of the third torsion spring 18 is fixedly connected with the inclined support 11, the third torsion spring 18 is sleeved on the outer side of the short shaft 10, by arranging the third torsion spring 18, the inclined support 11 is always in an inclined state, and when the soft pad 15 abuts against the quartz shaft material and receives force, the short shaft 10 rotates, at this time, the third torsion spring 18 is deformed to store power, so as to reset after stopping contacting, the left side of the upper clamping ring 8 is rotatably connected with a rotating piece 19, the inner side of the rotating piece 19 is rotatably connected with the lower clamping ring 9, the right side of the upper clamping ring 8 is rotatably connected with a side sleeve 20, the bottom of the side sleeve 20 is fixedly connected with an extension rod 21, the bottom of the extension rod 21 is fixedly connected with a clamping plate 22, the clamping plate 22 is arranged at the bottom of the lower clamping ring 9, by arranging the rotating piece 19, the upper clamping ring 8 and the lower clamping ring 9 are connected, so that they can be relatively opened or closed, so as to clamp the upper clamping ring 8 and the lower clamping ring 9 on the surface of the quartz shaft material, by arranging the side sleeve 20 cooperating with the extension rod 21, the clamping plate 22 is connected, clamping the clamping plate on the bottom of the lower clamping ring 9 can avoid the upper clamping ring 8 and the lower clamping ring 9 being opened without external force, the right sides of the upper clamping ring 8 and the lower clamping ring 9 are provided with recesses, the side sleeve 20 is rotatably connected in the inner side of the recess, the outer side of the extension rod 21 is sleeved with a tension spring 23, the top and the bottom of the tension spring 23 are fixedly connected with the side sleeve 20 and the clamping plate 22 respectively, by arranging the tension spring 23, the clamping plate 22 is always clamped on the bottom of the lower clamping ring 9 and is not easy to be loosened, by limiting the side sleeve 20 and the clamping plate 22 through the extension rod 21, the clamping plate 22 can be avoided from being inclined and the like, the recess provides the extension rod 21 and the tension spring 23 with a space for movement, the top of the upper clamping ring 8 is fixedly connected with a displacement sleeve 24, the inner side of the displacement sleeve 24 is slidably connected with a vertical rod 25, the top of the vertical rod 25 is fixedly connected with the suspension 6, the bottom of the vertical rod 25 is provided with a limiting protrusion, by arranging the displacement sleeve 24 cooperating with the vertical rod 25, the vertical height of the upper clamping ring 8 and the lower clamping ring 9 is adjusted, so as to be used by fitting the size of the quartz shaft, the limiting protrusion arranged can avoid the upper clamping ring from slipping along the bottom of the vertical rod 25, the inner side of the guide rail 5 is rotatably connected with a lead screw 26, the left side of the guide rail 5 is externally connected with a control motor, the output end of the control motor is fixedly connected with the lead screw 26, the outer side of the lead screw 26 is screw-connected with the suspension 6, by arranging the lead screw 26,When the control motor is reversed, the driving screw 26 is reversed to control the horizontal movement of the suspension 6 and the structure connected thereto, so as to adjust the position of the upper clamping ring 8 or make it move with the polishing piece. The top of the base frame 3 is fixedly connected with a telescopic cylinder 27, and the telescopic end of the telescopic cylinder 27 is fixedly connected with the auxiliary frame 4. By arranging the telescopic cylinder 27, the auxiliary frame 4 can be lifted or lowered, so as to adapt to the size of the structure fitted on the quartz shaft. The bottom of the lower clamping frame 71 is fixedly connected with the auxiliary frame 4. The inner sides of the upper clamping ring 8 and the lower clamping ring 9 are provided with flow-through grooves 29. By arranging the flow-through grooves 29, the polishing liquid flowing into the lower clamping ring 9 can be discharged through the flow-through grooves 29, so as to avoid accumulation and make it difficult to clean later.

[0042] The working principle of the embodiment is as follows: first, one end of the quartz shaft is fixed on the chuck of the polishing machine 1. The base frame 3 is adjusted by the electric sliding rail 2 to make the auxiliary frame 4 below the position to be supported. The upper clamping ring 8 and the lower clamping ring 9 are sleeved outside the quartz shaft and locked. The height of the displacement sleeve 24 is adjusted to make the soft pad 15 lightly touch the shaft body. During polishing, the quartz shaft rotates. The control motor drives the screw 26 to make the suspension 6 move with the upper clamping ring 8 and the lower clamping ring 9. The soft pad 15 contacts and scrapes off the polishing liquid attached to the surface of the quartz shaft. The inclined support 11, the sleeve frame 12 and the rotating shaft 13 are elastically deformed by the first torsional spring 16, the second torsional spring 17 and the third torsional spring 18 under the pressure to make the soft pad 15 self-adaptively fit the curved surface of the shaft body. They are pressed against each other without gap to wipe off the polishing liquid. The wiped-off liquid is discharged through the flow-through grooves 29.

[0043] Embodiment 2

[0044] On the basis of embodiment 1, reference is made to Figures 1-6 The quartz shaft polishing device for semiconductor further comprises a support 7, wherein the support 7 comprises a lower clamping frame 71 and an upper clamping frame 72. The inner side of the lower clamping frame 71 is rotatably connected with a connecting pin 73. The outer side of the connecting pin 73 is rotatably connected with the upper clamping frame 72. The inner sides of the lower clamping frame 71 and the upper clamping frame 72 are fixedly connected with contact sheets 74. The inner sides of the contact sheets 74 are movably connected with rolling balls 75. The inner side of the lower clamping frame 71 is rotatably connected with a movable block 76. The rear side of the movable block 76 is fixedly connected with an electric cylinder 77. The telescopic end of the electric cylinder 77 penetrates through the movable block 76 and is installed with a push-pull block 78. The outer side of the push-pull block 78 is rotatably connected with the inner side of the upper clamping frame 72.

[0045] By setting the polishing machine 1 for normal clamping, driving and polishing operation, the quartz shaft material can be directly clamped in the chuck of the polishing machine 1 during use, and the unclamped part is supported by the support 7. After the clamping and fixing of the polishing machine 1 and the quartz shaft material are completed, the auxiliary frame 4 is moved upward, the inner side of the lower clamping frame 71 is in contact with the quartz shaft material, then the electric cylinder 77 is elongated, the push-pull block 78 and the upper clamping frame 72 connected therewith are pushed and rotated along the connecting pin 73, and are clamped on the surface of the quartz shaft material. The upper clamping frame 72 and the lower clamping frame 71 are supported by the balls 75 inside the contact piece 74. Even if the quartz shaft material is too long, the position of the bottom frame 3 can be moved by the electric sliding rail 2, so that the entire auxiliary frame 4 is away from the chuck of the polishing machine 1 to support the position of the quartz shaft material away from the chuck. When moving, the balls 75 roll, so they will not have much friction with the quartz shaft material. When the chuck drives the quartz shaft to rotate, the quartz shaft also rolls between the balls 75, and the balls 75 also rotate, so they will not affect the normal operation of the quartz shaft.

[0046] The inner side of the lower clamping frame 71 and the upper clamping frame 72 is fixedly connected with the contact pad 28 made of sponge material. By setting the contact pad 28, when the upper clamping frame 72 and the lower clamping frame 71 are in contact with the quartz shaft material, they can first contact the contact pad 28 to avoid damage to the surface of the quartz shaft material caused by excessive force between rigid structures.

[0047] The working principle of the embodiment is as follows: first, the telescopic cylinder 27 lifts the auxiliary frame 4 to make the lower clamping frame 71 contact the quartz shaft, and the sponge contact pad 28 buffers to avoid rigid collision. Then the electric cylinder 77 is elongated to push the push-pull block 78 to drive the upper clamping frame 72 to rotate around the connecting pin 73 and adhere to the surface of the quartz shaft. The upper clamping frame 72 and the lower clamping frame 71 are supported by the balls 75 inside the contact piece 74. If the quartz shaft is too long, the support position can be adjusted by the electric sliding rail 2. When polishing, the quartz shaft rotates, the balls 75 roll synchronously to reduce friction, the support 7 drives the upper clamping frame 72 to open and close by the electric cylinder 77, the lower clamping frame 71 forms a stable base, and the embedded balls 75 replace sliding friction with rolling friction to ensure smooth rotation of the shaft body. The sponge contact pad 28 disperses stress to protect the surface of the shaft body, and the balls 75 can also adjust the contact point with the shaft body vibration, and cooperate with the electric sliding rail 2 to realize dynamic stable support for the super-long shaft body.

[0048] The specific embodiments are only an explanation of the present application, which is not a limitation of the present application, and the person skilled in the art can make modifications to the embodiments according to the needs without creative contribution after reading the specification. Although the embodiments of the present application have been shown and described, it can be understood by those of ordinary skill in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A polishing apparatus for a quartz shaft for a semiconductor, comprising a polishing machine table (1), characterized by: The top of the polishing machine (1) is fixedly connected with an electric sliding rail (2), the front side of the electric sliding rail (2) is movably connected with a chassis (3), the top of the chassis (3) is provided with an auxiliary frame (4), the top of the auxiliary frame (4) is fixedly connected with a guide rail (5), the top of the front side of the auxiliary frame (4) is fixedly connected with a support (7), the inner side of the guide rail (5) is movably connected with a suspension (6), the bottom of the suspension (6) is provided with an upper ring (8) and a lower ring (9), the inner side of the upper ring (8) and the lower ring (9) is fixedly connected with a plurality of short shafts (10), the outer side of the short shaft (10) is rotatably connected with a diagonal brace (11), the side away from the short shaft (10) of the diagonal brace (11) is rotatably connected with a sleeve frame (12), the top of the sleeve frame (12) is rotatably connected with a rotating shaft (13), the side away from the sleeve frame (12) of the rotating shaft (13) is rotatably connected with a horizontal plate (14), the side away from the rotating shaft (13) of the horizontal plate (14) is connected with a soft pad (15) through a bolt. The support (7) comprises a lower clamping frame (71) and an upper clamping frame (72), the inner side of the lower clamping frame (71) is rotatably connected with a connecting pin (73), the outer side of the connecting pin (73) and the upper clamping frame (72) are rotatably connected, the inner side of the lower clamping frame (71) and the upper clamping frame (72) is fixedly connected with a contact sheet (74), the inner side of the contact sheet (74) is movably connected with a ball (75), the inner side of the lower clamping frame (71) is rotatably connected with a movable block (76), the rear side of the movable block (76) is fixedly connected with an electric cylinder (77), the telescopic end of the electric cylinder (77) penetrates through the movable block (76) and is provided with a push-pull block (78), the outer side of the push-pull block (78) and the inner side of the upper clamping frame (72) are rotatably connected.

2. The apparatus for polishing a quartz spindle for a semiconductor according to claim 1, wherein: The outer side of the rotating shaft (13) is sleeved with a first torsional spring (16), the two ends of the first torsional spring (16) are fixedly connected with the sleeve frame (12) and the horizontal plate (14) respectively, the inner side of the sleeve frame (12) is fixedly connected with a second torsional spring (17), the side away from the sleeve frame (12) of the second torsional spring (17) and the diagonal brace (11) are fixedly connected.

3. The apparatus for polishing a quartz shaft for a semiconductor as set forth in claim 1, wherein: The inner side of the upper ring (8) and the lower ring (9) is fixedly connected with a third torsional spring (18), the side close to the diagonal brace (11) of the third torsional spring (18) and the diagonal brace (11) are fixedly connected, the third torsional spring (18) is sleeved on the outer side of the short shaft (10).

4. The apparatus for polishing a quartz spindle for a semiconductor according to claim 1, wherein: The left side of the upper ring (8) is rotatably connected with a rotating piece (19), the inner side of the rotating piece (19) and the lower ring (9) are rotatably connected, the right side of the upper ring (8) is rotatably connected with a side sleeve (20), the bottom of the side sleeve (20) is fixedly connected with a telescopic rod (21), the bottom of the telescopic rod (21) is fixedly connected with a clamping plate (22), the clamping plate (22) is arranged at the bottom of the lower ring (9).

5. The apparatus for polishing a quartz spindle for a semiconductor according to claim 4, wherein: The right side of the upper clamping ring (8) and the lower clamping ring (9) is provided with a groove, the edge cover (20) is rotatably connected to the inner side of the groove, the outer side of the telescopic rod (21) is provided with a tension spring (23), and the top and bottom of the tension spring (23) are fixedly connected with the edge cover (20) and the clamping plate (22) respectively.

6. The apparatus for polishing a quartz shaft for a semiconductor as set forth in claim 1, wherein: The top of the upper clamping ring (8) is fixedly connected with a displacement cover (24), the inner side of the displacement cover (24) is slidably connected with a vertical rod (25), the top of the vertical rod (25) is fixedly connected with the suspension (6), and the bottom of the vertical rod (25) is provided with a limiting protrusion.

7. The apparatus for polishing a quartz shaft for a semiconductor as set forth in claim 1, wherein: The inner side of the guide rail (5) is rotatably connected with a lead screw (26), the left side of the guide rail (5) is externally connected with a control motor, the output end of the control motor is fixedly connected with the lead screw (26), and the outer side of the lead screw (26) is screw-connected with the suspension (6).

8. The apparatus for polishing a quartz shaft for a semiconductor as set forth in claim 1, wherein: The top of the bottom frame (3) is fixedly connected with a telescopic cylinder (27), and the telescopic end of the telescopic cylinder (27) is fixedly connected with the auxiliary frame (4).

9. The apparatus for polishing a quartz shaft for a semiconductor as set forth in claim 1, wherein: The inner side of the lower clamping frame (71) and the upper clamping frame (72) is fixedly connected with a contact pad (28), and the contact pad (28) is made of sponge material.

10. The apparatus for polishing a quartz shaft for a semiconductor as set forth in claim 1, wherein: The bottom of the lower clamping frame (71) is fixedly connected with the auxiliary frame (4), and the inner side of the upper clamping ring (8) and the lower clamping ring (9) is provided with a flow-through groove (29).

Images