Preparation method of flexible pressure sensor, sensor and pulse feeling system

Abstract

The invention relates to the field of sensors, and discloses a preparation method of a flexible pressure sensor, the sensor and a pulse feeling system. The method comprises the following steps: coating a substrate with a layer of a first elastic material, patterning the surface of the first elastic material, and stripping the substrate on a flexible electrode support layer to obtain an elastic electrode layer; a plurality of protruding microstructures are arranged on the surface of the second-type elastic material thin film, and the second-type elastic material thin film is coated with the MXene composite material to form a sensitive layer; and aligning and attaching the elastic electrode layer and the sensitive layer to obtain the flexible pressure sensor. The elastic electrode layer of the sensor is prepared from the elastic material, so that the sensor has better deformation capability and can be bent and stretched at will; and the sensitive layer of the sensor is prepared by using the MXene composite material and the convex microstructure, so that the sensor also has good sensitivity, can capture very fine pressure change, and can be applied to scenes such as pulse feeling in traditional Chinese medicine and the like.

Description

Technical Field

[0001] The present application relates to the field of sensors, and in particular to a method for preparing a flexible pressure sensor, a sensor, and a pulse diagnosis system. Background Art

[0002] With the rapid development of flexible electronics, flexible pressure sensors are showing promising application prospects in wearable devices, medical monitoring, human-computer interaction, and other fields. Flexible pressure sensors typically consist of a flexible substrate, sensitive materials, and electrodes. They operate by deforming the sensor through external pressure, thereby changing its electrical properties (such as resistance and capacitance) to detect pressure. In practical applications, flexible pressure sensors must possess excellent deformability to adapt to complex curved surfaces and high sensitivity to accurately detect subtle pressure changes.

[0003] However, existing flexible pressure sensors often struggle to meet both the deformation capacity and sensitivity required for application. On the one hand, improving deformation capacity typically requires a thicker flexible substrate or low-modulus material, but this reduces the sensor's mechanical strength and shortens its service life. On the other hand, increasing sensitivity often requires highly sensitive materials or complex microstructure designs, but this can limit the sensor's deformation range and reduce its adaptability. Therefore, existing flexible pressure sensors lack both deformation capacity and sensitivity, limiting their application in a wider range of fields. Summary of the Invention

[0004] In view of this, in order to solve the problem in the prior art that flexible pressure sensors are difficult to meet the requirements of deformation capacity and sensitivity at the same time, the present application provides a method for preparing a flexible pressure sensor, a sensor and a pulse diagnosis system.

[0005] In a first aspect, the present application provides a method for preparing a flexible pressure sensor, comprising: Coating a layer of a first type of elastic material on a substrate, and patterning the surface of the first type of elastic material to form a flexible electrode support layer; peeling off the substrate on the flexible electrode support layer to obtain an elastic electrode layer; Arranging a plurality of protruding microstructures on the surface of the second type of elastic material film; coating the MXene composite material on the surface of the second type of elastic material having the plurality of protruding microstructures to form a sensitive layer; The elastic electrode layer is aligned and laminated with the sensitive layer to obtain a flexible pressure sensor.

[0006] In an optional embodiment, the preparation process of the MXene composite material comprises: Etching the MAX phase material to obtain MXene material; The MXene material and a target conductive material are mixed to form a MXene composite material; the target conductive material includes any one or more of copper, silver, gold, aluminum, nickel, zinc, platinum, titanium, vanadium, alloys, carbon black, graphite and / or conductive polymers.

[0007] In an optional embodiment, coating the MXene composite material on the surface of the second type of elastic material having the plurality of protruding microstructures comprises: The MXene composite material is uniformly coated on the surface of the second type of elastic material having the plurality of protruding microstructures through a target process; the target process includes any one or more of 3D printing, electroplating deposition or photolithography.

[0008] In an optional embodiment, the method further includes: Encapsulating the flexible pressure sensor with an elastic polymer; The elastic polymer includes one or more of silicone, polydimethylsiloxane, hydrogel, polyurethane, polyvinyl alcohol, rubber and / or elastic plastic.

[0009] In an optional embodiment, the patterning of the surface of the first type of elastic material includes: The flexible electrode support layer is patterned using MEMS technology; The first type of elastic material includes one or more of polyimide, thermoplastic polyurethane TPU or polyethylene terephthalate.

[0010] In an optional embodiment, the parameter specification of the flexible pressure sensor is 2.5mm*2.5mm; If the number of the flexible pressure sensors prepared is multiple, the distance between two adjacent flexible pressure sensors in the same row is 3-4.5 mm; the distance between two adjacent flexible pressure sensors in the same column is 1-1.5 mm.

[0011] In an optional embodiment, the shape of the protrusions in the protrusion microstructure is hemispherical; The elasticity of the first type of elastic material is less than or equal to the elasticity of the second type of elastic material; The second type of elastic material includes one or more of polyimide, thermoplastic polyurethane TPU or polyethylene terephthalate.

[0012] In a second aspect, the present application provides a flexible pressure sensor comprising an aligned and laminated elastic electrode layer and a sensitive layer; wherein the sensitive layer comprises a plurality of protruding microstructures.

[0013] In an optional embodiment, the sensitive layer is used to be attached to the object to be measured to sense pressure information transmitted by the object to be measured, and based on the pressure information, the corresponding protruding microstructures are brought into contact with the elastic electrodes in the elastic electrode layer; The elastic electrode layer is used to generate corresponding electrical signal information according to the change in the contact area between the elastic electrode and the protruding microstructure, and transmit the electrical signal information to the outside.

[0014] In the third aspect, the present application provides a pulse diagnosis system based on a flexible pressure sensor, comprising a flexible pressure sensor and a processor as described above, wherein the flexible pressure sensor is prepared based on the preparation method of the flexible pressure sensor as described above; the flexible pressure sensor is attached to the surface of the user's skin, for sensing the pulse pressure of the user during pulse diagnosis, and converting the pulse pressure into electrical signal information, and transmitting the electrical signal information to the processor, which is used to receive and analyze the electrical signal information.

[0015] The embodiments of the present application have the following beneficial effects: The present application provides a method for preparing a flexible sensor. A flexible pressure sensor is prepared by using flexible materials and a special process. The combination of the MXene composite material and the raised microstructure in the flexible pressure sensor can more sensitively capture changes in pressure. The raised microstructure expands the contact area attached to the surface of the contact body, which can improve the sensitivity and response speed of the pressure sensor, thereby more sensitively capturing changes in pulse pressure. In addition, the use of elastic materials enables the sensor to adapt to larger deformations and has good deformation ability. When the sensor is used in Traditional Chinese Medicine pulse diagnosis scenarios, it can better meet the pulse diagnosis needs of different parts of the body. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more clearly illustrate the technical solution of this application, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of this application and should not be considered as limiting the scope of protection of this application. Those skilled in the art can also derive other relevant drawings based on these drawings without inventive effort.

[0017] Figure 1 A schematic flow chart of a method for preparing a flexible pressure sensor according to an embodiment of the present application is shown; Figure 2 A schematic structural diagram of a protruding microstructure on the sensitive layer in an embodiment of the present application is shown; Figure 3 A schematic diagram of an arrangement and setting of the flexible pressure sensor in the embodiment of the present application is shown; Figure 4Another schematic diagram of a process for preparing a flexible pressure sensor in an embodiment of the present application is shown; Figure 5a A schematic structural diagram of a flexible pressure sensor in an embodiment of the present application is shown; Figure 5b Another structural diagram of the flexible pressure sensor in an embodiment of the present application is shown; Figure 5c A schematic structural diagram of the flexible pressure sensor in an embodiment of the present application at a first viewing angle is shown; Figure 6 A structural schematic diagram of a pulse diagnosis system based on a flexible pressure sensor in an embodiment of the present application is shown. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0019] The components of the embodiments of the present application generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed application, but rather merely represents selected embodiments of the present application. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative effort are within the scope of protection of the present application.

[0020] Hereinafter, the terms "including", "having" and their cognates, which may be used in various embodiments of the present application, are intended only to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing items, and should not be understood as first excluding the existence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items or the possibility of adding one or more features, numbers, steps, operations, elements, components or combinations of the foregoing items.

[0021] Furthermore, the terms “first,” “second,” “third,” etc., are merely used for distinguishing descriptions and are not to be understood as indicating or implying relative importance.

[0022] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which the various embodiments of the present application belong. The terms (such as those defined in generally used dictionaries) will be interpreted as having the same meaning as in the context of the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning unless clearly defined in the various embodiments of the present application.

[0023] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments may be combined with each other.

[0024] MEMS manufacturing technology (Microelectromechanical systems, MEMS) is a general term for microstructure processing technology from nanometer scale to millimeter scale. It uses lithography, epitaxy, thin film deposition, oxidation, diffusion, implantation, sputtering, evaporation, etching, scribing and packaging as basic process steps to manufacture complex three-dimensional micro-machining technology.

[0025] MAX phase materials, a class of ternary layered ceramic compounds with a hexagonal crystal structure.

[0026] An embodiment of the present application provides a method for preparing a flexible sensor. By adopting flexible materials and special processes, a flexible pressure sensor that is both sensitive and durable is prepared, which can be well used in application scenarios requiring high precision, such as traditional Chinese medicine pulse diagnosis.

[0027] Existing pressure sensors are typically rigid and unsuitable for direct attachment to the human body for pulse detection. This application utilizes flexible and highly sensitive materials, enabling the resulting sensor to not only adhere well to the skin but also more accurately detect minute pressure changes. Furthermore, it exhibits excellent stretchability and heat dissipation, making it ideal for applications in healthcare.

[0028] For example, Figure 1 As shown, the method includes the following steps: S110, coating a layer of a first type of elastic material on the substrate, and patterning the surface of the first type of elastic material to form a flexible electrode support layer.

[0029] S120, peeling off the substrate on the flexible electrode support layer to obtain an elastic electrode layer.

[0030] In this embodiment, the substrate is used to provide physical support for the first type of elastic material, facilitating subsequent etching of the first type of elastic material. The substrate can be made of a semiconductor material such as silicon, silicon carbide, or a material such as metal or glass.

[0031] The first type of elastic material includes but is not limited to any one of polyimide, thermoplastic polyurethane TPU or polyethylene terephthalate. The selection of the substrate and the first type of elastic material can be based on actual needs and is not limited to this.

[0032] In an optional embodiment, the surface of the first type of elastic material is patterned using a MEMS manufacturing process to form a specific pattern or shape on the surface of the elastic material, wherein the specific implementation method of the patterning and the formed pattern or shape can be set according to actual needs, for example, a MEMS process such as photolithography can be used; the patterned pattern can be rectangular, circular, polygonal, etc., which is not limited in this embodiment.

[0033] Next, the substrate is peeled off from the flexible electrode support layer to obtain a separate patterned first type elastic material as an elastic electrode layer.

[0034] It is worth noting that this embodiment enhances the elasticity of the material by patterning the surface of the elastic material, so that the flexible pressure sensor prepared subsequently can adapt to larger deformations and thus be suitable for different needs; furthermore, when the prepared flexible pressure sensor is applied to the Traditional Chinese Medicine pulse diagnosis scenario, the flexible pressure sensor can adapt well to the curved surface of human skin due to the elasticity of its material, thereby providing a guarantee for accurate detection of pulse fluctuations.

[0035] S130, providing a plurality of protruding microstructures on the surface of the second type of elastic material film.

[0036] In this embodiment, a plurality of raised microstructures are provided on the surface of the second type of elastic material film by using any one of the processing techniques such as mechanical processing, chemical processing, and physical processing, or a combination of any two or three of the above three techniques. The mechanical processing technique includes but is not limited to embossing, roller embossing, laser engraving, etc.; the chemical processing technique includes but is not limited to chemical processing, swelling induction, photoinduced crosslinking, etc.; the physical processing includes but is not limited to plasma treatment, electron beam exposure, electrospinning, etc. Among them, the manufacturing process, morphology, quantity setting, arrangement mode, etc. of the raised microstructure can be customized according to actual needs, and this embodiment does not limit this. For example, the shape of the protrusions in the raised microstructure can be hemispherical, spherical, etc., and the arrangement mode can be multi-row and multi-column alignment or staggered arrangement, etc. The morphology of multiple raised microstructures can be the same or different, such as Figure 2 The raised microstructures shown are hemispherical and arranged in a staggered manner, wherein the raised microstructures are arranged opposite to the elastic electrodes in the elastic electrode layer so that the raised microstructures can contact the elastic electrodes.

[0037] For example, the manufacturing process of the raised microstructure can be determined by the precision requirements and the production scale. For example, if the shape of the raised microstructure to be set is complex, a combined processing technology of photolithography and etching can be used. First, a mask pattern is formed on the surface of the second type of elastic material film by photolithography technology, and then a raised microstructure is formed by wet or dry etching, thereby ensuring the manufacturing accuracy of the raised microstructure. If it is necessary to mass-produce flexible pressure sensors, a combined processing technology of injection molding can be used. The second type of elastic material in a liquid state is injected into a mold with a raised pattern, and the film with a raised microstructure is demolded after cooling. In addition, if customized production of raised microstructures is required, 3D printing technology can also be used to directly stack materials layer by layer on the surface of the second type of elastic material film to form a raised microstructure.

[0038] It is worth noting that, in the subsequent application of flexible pressure sensors, the raised microstructure can increase the contact area with the elastic electrode, thereby improving the sensitivity of the sensor to pressure changes.

[0039] In some examples, the elasticity of the first type of elastic material is less than or equal to that of the second type of elastic material.

[0040] It should be noted that the first type of elastic material and the second type of elastic material may be of the same type or different types.

[0041] As a feasible implementation, the second type of elastic material includes but is not limited to any one of polyimide, thermoplastic polyurethane TPU or polyethylene terephthalate and the like. The selection of the second type of elastic material can be made according to actual needs and is not limited thereto.

[0042] S140, coating the MXene composite material on the surface of the second type of elastic material having a plurality of protruding microstructures to form a sensitive layer.

[0043] The MXene composite material is uniformly coated onto the second type of elastic material film with the raised microstructures through a targeted process, which can include one or more of 3D printing, electroplating deposition, or photolithography, to form the core sensitive layer of the pressure sensor.

[0044] Furthermore, the present embodiment can also prepare the MXene composite material in advance; in some examples, the preparation process can be to first prepare the MXene material through the MAX phase material, and then prepare the MXene composite material based on the MXene material.

[0045] For example, a wet etching or dry etching process is first used to selectively etch the MAX phase material to obtain the Mxene material. Among them, wet etching generally uses a hydrofluoric acid (HF) solution or other fluorine-containing reagents (such as a mixed solution based on organic fluorides such as fluoroborates or fluorosilicates) to selectively etch the A layer elements in the MAX phase material. During the etching process, ultrasonic waves can be used to assist in enhancing the etching effect and reducing the etching time. Dry etching uses gas or plasma to treat the MAX phase material.

[0046] It should be noted that MXene materials themselves possess high electrical conductivity and sensitivity. Due to their high specific surface area, excellent conductivity, and diverse chemical properties, they exhibit enormous application potential in energy storage, catalysis, sensors, and electronic devices. To further enhance their performance, conductive materials (such as copper, silver, and graphite) can be added to create MXene composite materials.

[0047] Furthermore, in this embodiment, the prepared MXene material and the target conductive material can be mixed to form a MXene composite material; wherein the target conductive material includes but is not limited to any one or more of copper, silver, gold, aluminum, nickel, zinc, platinum, titanium, vanadium, alloy, carbon black, graphite and / or conductive polymer.

[0048] As can be understood, MXene composite materials are made from a mixture of MXene and conductive materials, making them highly sensitive to pressure changes. Therefore, using this MXene composite material to create a flexible pressure sensor and applying it to Traditional Chinese Medicine pulse diagnosis can more sensitively capture pulse pressure changes, even the slightest pulse beat can be detected, thereby improving the reliability of pulse diagnosis.

[0049] It should be noted that the execution order of steps S110-S120 and steps S130-S140 in the above embodiment is not limited. In other words, steps S110-S120 and steps S130-S140 can be executed simultaneously, or steps S110-S120 can be executed first and then steps S130-S140, or steps S130-S140 can be executed first and then steps S110-S120. The specific execution order of each step can be flexibly set according to actual needs.

[0050] S150, aligning and laminating the elastic electrode layer and the sensitive layer to obtain a flexible pressure sensor.

[0051] After the prepared elastic electrode layer and the sensitive layer are bonded together, a complete flexible pressure sensor can be obtained; in other words, a flexible pressure sensor includes multiple raised microstructures on the elastic electrode layer and the sensitive layer.

[0052] In one example, Figure 3 As shown, the parameter specification of the flexible pressure sensor can be 2.5mm*2.5mm, and the parameter specification can also be adjusted accordingly according to actual needs, which is not limited in this embodiment.

[0053] In this embodiment, since the flexible pressure sensor uses MXene composite materials and raised microstructures, the flexible pressure sensor can keenly capture slight pressure changes, such as pulse beating, and can be effectively used in scenarios such as Chinese medicine pulse diagnosis that require identifying subtle pressure changes; moreover, the flexible pressure sensor is flexible and can be bent and stretched at will, making it very suitable for use on human skin; in addition, special designs and technologies such as printing and etching are also used in the preparation of the flexible pressure sensor, which can allow the sensor to better dissipate heat during operation, extend its service life, and can be mass-produced at a relatively low cost.

[0054] In one embodiment, when preparing the elastic electrode layer, the parameters of the elastic electrode layer can be set so that the elastic electrode layer can meet the subsequent synchronous preparation of multiple flexible pressure sensors. In the process of preparing the sensitive layer, the raised microstructures for preparing multiple flexible pressure sensors can be arranged, and then after the elastic electrode layer and the sensitive layer are aligned and bonded, multiple flexible pressure sensors can be prepared.

[0055] In other words, in the above-mentioned preparation process, this embodiment sets the width, length, area and other parameters of the elastic electrode layer accordingly, and arranges the raised microstructures for preparing multiple flexible pressure sensors on the sensitive layer, thereby realizing the batch preparation of a number of flexible pressure sensors.

[0056] For example, if the number of flexible pressure sensors to be prepared simultaneously is multiple, among the multiple flexible pressure sensors prepared in batches, Figure 3 As shown, the distance between two adjacent flexible pressure sensors in the same row is 3~4.5mm; the distance between two adjacent flexible pressure sensors in the same column is 1~1.5mm.

[0057] In one embodiment, if Figure 4 As shown, this embodiment can also package the flexible pressure sensor prepared above to protect the flexible pressure sensor.

[0058] S160 , encapsulating the flexible pressure sensor with an elastic polymer.

[0059] In this embodiment, the elastic polymer includes one or more of silicone, polydimethylsiloxane, hydrogel, polyurethane, polyvinyl alcohol, rubber and / or elastic plastic.

[0060] This embodiment uses an elastic polymer (such as silicone or hydrogel) to encapsulate the flexible pressure sensor to protect the internal structure, and combines multiple sensors into an array to adapt to different application scenarios. At the same time, it prevents signal drift and device damage caused by external environmental interference, ensures the stability of pressure detection data, and increases the durability and reliability of the flexible pressure sensor.

[0061] In some examples, elastic polymers are used to uniformly package the plurality of flexible pressure sensors prepared in batches as described above, thereby obtaining a sensor array.

[0062] In addition, the arrangement of multiple flexible pressure sensors can be set accordingly so that the packaged sensor array can be better applied in actual application scenarios.

[0063] As an optional implementation, when packaging multiple flexible pressure sensors, each flexible pressure sensor is arranged according to the Cun, Guan, and Chi positions, so that each flexible pressure sensor can be better used in the TCM pulse diagnosis scenario and accurately monitor the pressure changes of the three acupoints of Cun, Guan, and Chi.

[0064] This embodiment uses the preparation method of the flexible pressure sensor to prepare the elastic electrode layer of the sensor using elastic material, so that the subsequently prepared sensor has good deformation ability and can be bent and stretched at will; and uses MXene composite materials and raised microstructures to prepare the sensitive layer of the sensor, so that the sensor also has good sensitivity and can capture very subtle pressure changes. It can be used in scenarios such as Traditional Chinese Medicine pulse diagnosis that require both high deformation ability and high sensitivity.

[0065] Please refer to Figure 5a 、 Figure 5b and Figure 5c , an embodiment of the present application further provides a flexible pressure sensor; for reference, the flexible pressure sensor includes an elastic electrode layer 510 and a sensitive layer 520 that are aligned and bonded; the sensitive layer 520 includes a plurality of protruding microstructures.

[0066] In this embodiment, the flexible pressure sensor is fabricated using the aforementioned method for fabricating a flexible pressure sensor. The sensitive layer 520 is attached to a target to be measured to sense pressure information transmitted by the target. Based on the pressure information, the corresponding raised microstructures are brought into contact with the elastic electrodes within the elastic electrode layer 510. The hemispherical surfaces of each raised microstructure can contact the elastic electrodes based on the pressure of the target.

[0067] The elastic electrode layer 510 is configured to undergo electrical changes according to changes in the contact area between the internal elastic electrodes and the protruding microstructures, thereby generating corresponding electrical signal information, and transmitting the electrical signal information outward through the elastic electrodes.

[0068] It can be understood that the sensitive layer can directly contact the target to be measured to detect changes in the target's response (such as pressure). After the changes detected by the sensitive layer are transmitted to the elastic electrode layer, they will trigger changes in the corresponding physical properties of the elastic electrode layer (such as current, resistance, capacitance, refractive index, etc.), thereby converting the pressure information sensed by the sensitive layer into an electrical signal that can be captured by subsequent circuit devices or systems. The elastic electrode has excellent ductility and flexibility, enabling it to withstand deformation such as bending, stretching, or compression without damage, allowing the sensor to operate stably in complex environments.

[0069] In the actual pulse diagnosis scenario, the sensitive layer is directly attached to the user's skin surface. The user's pulse beats, causing the contact area between the raised microstructure of the sensitive layer and the elastic electrode to change. That is, the sensitive layer is used to directly sense the pulse beat. Each beat of the pulse is similar to applying pressure to the sensitive layer. This pressure causes the raised microstructure of the sensitive layer to contact the elastic electrode, causing the corresponding electrical properties in the elastic electrode to change (such as changes in current, resistance and other characteristics). The elastic electrode can generate corresponding electrical signal information based on the electrical change, and the change in the contact area between the raised microstructure and the elastic electrode causes the change in the electrical property (such as the change in the current value, etc.). The processor can then detect the user's pulse beat according to the change in the electrical signal information transmitted by the elastic electrode to achieve pulse identification and analysis.

[0070] In the embodiment of the present application, the elastic electrode layer of the sensor is prepared by using an elastic material, so that the sensor has good deformation ability and can be bent and stretched at will. Compared with traditional hard pressure sensors, it is more flexible and can better adapt to the curve of the skin surface. And because MXene composite materials and raised microstructures are used to prepare the sensitive layer of the sensor, it can capture very subtle pressure changes, such as pulse beating, and can be applied to scenarios requiring high sensitivity such as traditional Chinese medicine pulse diagnosis. In addition, the prepared sensor can also be encapsulated by an elastic polymer, making the sensor more durable and not easy to damage.

[0071] Please refer to Figure 6 The embodiment of the present application also provides a pulse diagnosis system based on a flexible pressure sensor. Exemplarily, the pulse diagnosis system includes a flexible pressure sensor 610 and a processor 620; the flexible pressure sensor 610 is prepared by the aforementioned flexible pressure sensor preparation method.

[0072] In actual applications, taking the Traditional Chinese Medicine pulse diagnosis scenario as an example, the flexible pressure sensor 610 is attached to the user's skin surface. The flexible pressure sensor 610 is used to sense the user's pulse pressure during pulse diagnosis, and convert the pulse pressure into electrical signal information, and transmit the electrical signal information to the processor 620; the processor 620 is used to receive and analyze the electrical signal information to detect changes in the user's pulse pressure, and then output the analysis results to realize the recognition and analysis of the pulse.

[0073] It is understood that when this flexible pressure sensor is applied to scenarios such as Traditional Chinese Medicine (TCM) pulse diagnosis, the sensor's elastic electrode layer and sensitive layer have the ability to deform well, allowing it to adhere to the user's skin. This solves the problem of traditional pressure sensors being unable to adapt to the curved surface of the skin, effectively measuring pulse pressure changes and converting this pressure information into electrical signals. The electrical signals are then transmitted to a processor (such as a computer chip) for analysis, ultimately outputting pulse characteristics (such as slippery pulse, stringy pulse, etc.). The pulse diagnosis system provided in the embodiments of this application can help doctors more accurately determine a patient's pulse condition, providing a scientific basis for TCM diagnosis.

[0074] The processor 620 may be an integrated circuit chip with signal processing capabilities. The processor may be a general-purpose processor, including at least one of a central processing unit (CPU), a graphics processing unit (GPU), a network processor (NP), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. The general-purpose processor may be a microprocessor or any conventional processor, and may implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of this application.

[0075] For reference, after receiving the electrical signal information, the processor 620 separates the pulse wave main frequency and harmonic components of the three acupoints of Cun, Guan and Chi from the electrical signal information based on the pre-established quantitative relationship between the pulse wave waveform (such as tidal wave and dicrotic wave) and the electrical signal parameters output by the sensor (characterizing the change in pulse pressure in the form of electrical signals, such as the resistance change rate and response time), and then combines algorithms such as LSTM networks to identify the characteristic patterns of different types of pulses such as slippery pulse and stringy pulse, so as to extract the pulse characteristics from the electrical signal information, and thus obtain the corresponding pulse diagnosis results (such as slippery pulse, stringy pulse, etc.) by combining the horizontal comparison of the pulse position of each acupoint and the analysis of the pulse characteristics.

[0076] In some examples, the processor 620 may also perform compensation calibration on the pulse diagnosis results or the electrical signal parameters output by the sensor according to a preset compensation algorithm (such as a temperature-humidity compensation algorithm) or a filtering algorithm (such as a Kalman filtering algorithm) before outputting the pulse diagnosis results, thereby eliminating signal drift caused by environmental interference and ensuring the stability of the pulse results.

[0077] It can be understood that the flexible pressure sensor of the pulse diagnosis system in this embodiment corresponds to the flexible pressure sensor in the above embodiment, and the optional items in the above embodiment are also applicable to this embodiment, so they will not be repeated here.

[0078] In some examples, the pulse diagnosis system further includes a memory, wherein the memory stores a computer program. The processor runs the computer program, thereby enabling the pulse diagnosis system to monitor and analyze pressure information received during pulse diagnosis and output analysis results.

[0079] The memory may be, but is not limited to, a random access memory (RAM), a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), etc. The memory is used to store a computer program, and the processor may execute the computer program accordingly after receiving an execution instruction.

[0080] The present application also provides a computer storage medium for storing the computer program used in the above-mentioned processor. The computer storage medium may be a readable storage medium, a non-volatile storage medium, or a volatile storage medium. For example, the computer storage medium may include, but is not limited to, various media capable of storing program code, such as a USB flash drive, a mobile hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk.

[0081] In the several embodiments provided in this application, it should be understood that the disclosed systems and methods can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the flowcharts and structure diagrams in the accompanying drawings show the possible architectures, functions and operations of the devices, methods and computer program products according to the multiple embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of the code, and the module, program segment or a part of the code contains one or more executable instructions for implementing the specified logical functions. It should also be noted that in an alternative implementation, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the structure diagram and / or flowchart, and the combination of boxes in the structure diagram and / or flowchart, can be implemented using a dedicated hardware-based system that performs the specified function or action, or can be implemented using a combination of dedicated hardware and computer instructions.

[0082] In addition, the functional modules or units in the various embodiments of the present application can be integrated together to form an independent part, or each module can exist independently, or two or more modules can be integrated to form an independent part.

[0083] If the functions are implemented in the form of software function modules and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes a number of instructions for enabling a computer device (which can be a smart phone, personal computer, server, or network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application.

[0084] The above is only a specific implementation method of the present application, but the scope of protection of the present application is not limited thereto. Any technician familiar with this technical field can easily think of changes or replacements within the technical scope disclosed in this application, which should be covered by the scope of protection of the present application.

Claims

1. A method for preparing a flexible pressure sensor, characterized in that: include: Coating a layer of a first type of elastic material on a substrate, and patterning the surface of the first type of elastic material to form a flexible electrode support layer; peeling off the substrate on the flexible electrode support layer to obtain an elastic electrode layer; Arranging a plurality of protruding microstructures on the surface of the second type of elastic material film; coating the MXene composite material on the surface of the second type of elastic material having the plurality of protruding microstructures to form a sensitive layer; The elastic electrode layer is aligned and laminated with the sensitive layer to obtain a flexible pressure sensor.

2. The method for preparing a flexible pressure sensor according to claim 1, wherein: The preparation process of the MXene composite material comprises: Etching the MAX phase material to obtain MXene material; The MXene material and a target conductive material are mixed to form a MXene composite material; the target conductive material includes any one or more of copper, silver, gold, aluminum, nickel, zinc, platinum, titanium, vanadium, alloys, carbon black, graphite and / or conductive polymers.

3. The method for preparing the flexible pressure sensor according to claim 1, wherein: The step of coating the MXene composite material on the surface of the second type of elastic material having the plurality of protruding microstructures comprises: The MXene composite material is uniformly coated on the surface of the second type of elastic material having the plurality of protruding microstructures through a target process; the target process includes any one or more of 3D printing, electroplating deposition or photolithography.

4. The method for preparing a flexible pressure sensor according to claim 1, wherein: Also includes: Encapsulating the flexible pressure sensor with an elastic polymer; The elastic polymer includes one or more of silicone, polydimethylsiloxane, hydrogel, polyurethane, polyvinyl alcohol, rubber and / or elastic plastic.

5. The method for preparing a flexible pressure sensor according to claim 1, wherein: The surface patterning of the first type of elastic material includes: The flexible electrode support layer is patterned using MEMS technology; The first type of elastic material includes one or more of polyimide, thermoplastic polyurethane TPU or polyethylene terephthalate.

6. The method for preparing a flexible pressure sensor according to claim 1, wherein: The parameter specification of the flexible pressure sensor is 2.5mm*2.5mm; If the number of the flexible pressure sensors prepared is multiple, the distance between two adjacent flexible pressure sensors in the same row is 3-4.5 mm; the distance between two adjacent flexible pressure sensors in the same column is 1-1.5 mm.

7. The method for preparing a flexible pressure sensor according to claim 1, wherein: The shape of the protrusions in the protrusion microstructure is hemispherical; The elasticity of the first type of elastic material is less than or equal to the elasticity of the second type of elastic material; The second type of elastic material includes one or more of polyimide, thermoplastic polyurethane TPU or polyethylene terephthalate.

8. A flexible pressure sensor, characterized in that: It comprises an elastic electrode layer and a sensitive layer which are aligned and bonded together; wherein the sensitive layer comprises a plurality of protruding microstructures.

9. The flexible pressure sensor according to claim 8, characterized in that: The sensitive layer is used to be attached to the object to be measured to sense pressure information transmitted by the object to be measured, and based on the pressure information, the corresponding protruding microstructures are brought into contact with the elastic electrodes in the elastic electrode layer; The elastic electrode layer is used to generate corresponding electrical signal information according to the change in the contact area between the elastic electrode and the protruding microstructure, and transmit the electrical signal information to the outside.

10. A pulse diagnosis system based on a flexible pressure sensor, characterized in that: It includes a flexible pressure sensor and a processor as described in any one of claims 8-9, wherein the flexible pressure sensor is prepared based on the preparation method of the flexible pressure sensor as described in any one of claims 1-7; the flexible pressure sensor is attached to the surface of the user's skin, used to sense the user's pulse pressure during pulse diagnosis, and convert the pulse pressure into electrical signal information, and transmit the electrical signal information to the processor, which is used to receive and analyze the electrical signal information.

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