Temperature control device

Abstract

The invention relates to a temperature control device applied to an analyzer, and the temperature control device comprises a liquid storage mechanism which comprises a liquid pump and a liquid storage tank, and the liquid storage tank is used for storing refrigerant fluid; the bearing mechanism comprises a first refrigerator used for bearing a chip, and the hot end of the first refrigerator is provided with a first heat dissipation channel; the storage mechanism comprises a shell and a second refrigerator, the shell is provided with a containing cavity used for storing reagents, the second refrigerator is arranged in the containing cavity and refrigerates the containing cavity, and the hot end of the second refrigerator is provided with a second heat dissipation channel; the heat dissipation mechanism is provided with a third heat dissipation channel; when the liquid pump works, the refrigerant fluid circularly flows among the liquid storage tank, the first heat dissipation channel, the second heat dissipation channel and the third heat dissipation channel. The first refrigerator and the second refrigerator are subjected to serial heat dissipation through one path of refrigerant fluid, so that the use number of liquid storage tanks and heat dissipation mechanisms can be reduced, the structure of the temperature control device is simplified, and finally the manufacturing cost of the temperature control device is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of analyzers, and in particular to a temperature control device. Background Art

[0002] With the continuous advancement of science and technology, research on body fluid testing is also deepening. As an important technical means, it can help humans effectively analyze the substances contained in body fluids, thus having important significance for the study of human health and disease. Body fluid testing is performed using an analyzer, which includes a temperature control device for temperature control. However, traditional temperature control devices often have the disadvantage of being complex in structure, which affects the manufacturing cost of the temperature control device and analyzer. Summary of the Invention

[0003] A technical problem solved by this application is how to reduce the manufacturing cost of the temperature control device.

[0004] A temperature control device is applied to an analyzer, and the temperature control device comprises:

[0005] A liquid storage mechanism, comprising a liquid pump and a liquid storage tank, wherein the liquid storage tank is used to store refrigerant;

[0006] The carrying mechanism includes a first cooler for carrying the chip, wherein a hot end of the first cooler is provided with a first heat dissipation channel;

[0007] The storage mechanism includes a housing and a second refrigerator, wherein the housing is provided with a chamber for storing reagents, the second refrigerator is disposed in the chamber and cools the chamber, and a second heat dissipation channel is provided at a hot end of the second refrigerator; and

[0008] The heat dissipation mechanism is provided with a third heat dissipation channel;

[0009] When the liquid pump is working, the refrigerant circulates among the liquid storage tank, the first heat dissipation channel, the second heat dissipation channel and the third heat dissipation channel.

[0010] In one embodiment, the first heat dissipation channel extends along a curve.

[0011] In one embodiment, the storage mechanism further comprises a metal frame and a heat insulating member, wherein the metal frame is located within the housing, and the heat insulating member covers the metal frame.

[0012] In one embodiment, the storage mechanism further includes a blower, which is disposed in the accommodating cavity and is used to blow the air in the accommodating cavity toward the cold end of the second refrigerator.

[0013] In one embodiment, the storage mechanism is provided with a cache slot and includes a liquid conducting core, a portion of the liquid conducting core is located in the cache slot, and another portion of the liquid conducting core is located outside the accommodating cavity and extends to a position corresponding to the fan of the heat dissipation mechanism.

[0014] In one embodiment, the storage mechanism further includes a protective tube, which is located outside the accommodating cavity and is sleeved on the liquid conducting core. The free end of the liquid conducting core forms an evaporation end exposed outside the protective tube and corresponding to the fan of the heat dissipation mechanism.

[0015] In one embodiment, it further includes a polyurethane tube and a quick-connect connector, the quick-connect connector is arranged at the input and output ports of the first heat dissipation channel, the second heat dissipation channel and the third heat dissipation channel, and the polyurethane tube is connected to the quick-connect connector.

[0016] In one embodiment, at least one of the following options is also included:

[0017] The carrying mechanism further includes a first heat preservation switch and a first temperature sensor. One heat exchange end of the first refrigerator forms a heat exchange platform for carrying chips. The first heat preservation switch and two first temperature sensors are provided on the heat exchange platform. The first heat preservation switch and the first temperature sensor are provided on the other heat exchange end of the first refrigerator.

[0018] The storage mechanism further includes a second heat preservation switch and a second temperature sensor, the hot end of the second refrigerator is provided with the second heat preservation switch and the second temperature sensor, and the cold end of the second refrigerator is provided with the second temperature sensor;

[0019] The heat dissipation mechanism includes a radiator and a fan, the third heat dissipation channel is arranged in the radiator, and the fan is connected to the radiator.

[0020] In one embodiment, both the first refrigerator and the second refrigerator are semiconductor refrigerators.

[0021] In one embodiment, the liquid storage mechanism further includes a float, and the float floats in the refrigerant.

[0022] A technical effect of an embodiment of the present application is: since the refrigerant circulates between the liquid storage tank, the first heat dissipation channel, the second heat dissipation channel and the third heat dissipation channel, that is, the first refrigerator and the second refrigerator are cooled in series through one path of refrigerant, the number of liquid storage tanks and heat dissipation mechanisms used can be reduced, thereby simplifying the structure of the temperature control device and ultimately reducing the manufacturing cost of the temperature control device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic plan view of the temperature control device according to an embodiment.

[0024] Figure 2 for Figure 1 Schematic diagram of the partial structure of the temperature control device shown.

[0025] Reference numerals: temperature control device 10, chip 20, reagent kit 30, liquid storage mechanism 100, liquid pump 110, liquid storage tank 120, float 130, carrying mechanism 200, first refrigerator 210, first hot end 211, first heat dissipation channel 201, first cold end 212, heat exchange platform 211a, first heat preservation switch 221, first temperature sensor 222, main body 234, receiving cavity 2341, first cavity 2341a, second cavity 2341b, first partition 231, second partition 232, third partition 23 3. Storage mechanism 300, housing 310, accommodating cavity 311, second refrigerator 320, second hot end 321, second heat dissipation channel 3211, second cold end 322, second insulation switch 331, second temperature sensor 332, third temperature sensor 333, blower 342, cache slot 351, inclined surface 3511, liquid guide core 352, evaporation end 3521, protective tube 353, heat dissipation mechanism 400, radiator 410, third heat dissipation channel 411, fan 420, polyurethane tube 510, quick plug connector 520. DETAILED DESCRIPTION

[0026] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0027] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0028] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0029] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0030] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0031] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0032] See Figure 1 and 2 In one embodiment of the present application, an analyzer includes a temperature control device 10. The temperature control device 10 can be understood as being applied to an analyzer for in vitro diagnosis. The temperature control device 10 includes a liquid storage mechanism 100, a support mechanism 200, a storage mechanism 300, and a heat dissipation mechanism 400.

[0033] In some embodiments, the liquid storage mechanism 100 includes a liquid pump 110 and a liquid storage tank 120. The liquid storage tank 120 is used to store refrigerant liquid. When the liquid pump 110 is operating, the refrigerant liquid can cyclically flow into and out of the liquid storage tank 120. The liquid storage mechanism 100 may also include a float 130 located within the liquid storage tank 120 and capable of floating on the refrigerant. The float 130 can monitor the refrigerant liquid level. When the refrigerant liquid level decreases due to depletion, the float 130 follows the refrigerant level. When refrigerant liquid is added to the liquid storage tank 120, the refrigerant level rises, and the float 130 rises with it. Therefore, when the float 130 drops to a critical height, indicating that the refrigerant liquid level has decreased to a critical value, the liquid storage mechanism 100 can generate an alarm, causing the temperature control device 10 to stop operating, thereby improving the safety of the temperature control device 10.

[0034] The carrier 200 is used to support and exchange heat with the chip 20. The chip 20 is used to hold the sample to be tested. After the sample is placed on the chip 20, reagents can be introduced into the chip 20 to produce a biochemical reaction between the reagents and the sample. Finally, the sample can be tested after the biochemical reaction. During the biochemical reaction between the sample and the reagents, the temperature of the carrier 200 needs to be periodically changed to meet the different temperature requirements of the biochemical reaction.

[0035] In some embodiments, the support mechanism 200 includes a first cooler 210, which can be a semiconductor cooler. The first cooler 210 has two heat exchange ends, which can be designated as a first heat exchange end and a second heat exchange end. When current flows through the first cooler 210 in the forward direction, the first heat exchange end can be the hot end, and the second heat exchange end can be the cold end. Obviously, the temperature of the hot end is significantly higher than that of the cold end. The first heat exchange end can transfer heat from the cold end to the hot end, thereby lowering the cold end temperature and raising the hot end temperature. When the direction of the circuit is reversed, so that the current flows through the first cooler 210 in the reverse direction, the first heat exchange end switches from a hot end to a cold end, and the second heat exchange end switches from a cold end to a hot end. Therefore, depending on the direction of the current, the hot and cold ends of the first cooler 210 can alternate. One of the heat exchange ends of the first cooler 210 forms a heat exchange platform 211a, which is used to support the chip 20. The temperature of the heat exchange platform 211a is equal to the required temperature of the chip 20, so the heat exchange platform 211a can control the temperature of the chip 20. When the temperature required for the biochemical reaction is higher than the ambient temperature, the heat exchange platform 211a needs to form a hot end that can heat the chip 20; when the temperature required for the biochemical reaction is lower than the ambient temperature, the heat exchange platform 211a needs to form a cold end that can cool the chip 20.

[0036] In some embodiments, the support mechanism 200 may further include a first heat preservation switch 221 and a first temperature sensor 222. One first heat preservation switch 221 and two first temperature sensors 222 may be provided on the heat exchange platform 211a. The temperatures of the two first temperature sensors 222 may be averaged, thereby improving the accuracy of temperature detection of the heat exchange platform 211a and the chip 20. Of course, if one first temperature sensor 222 fails to operate normally due to an open circuit or short circuit, the temperature may be detected by another normally functioning first temperature sensor 222. This avoids the situation where the heat exchange platform 211a cannot be detected due to a failure of the first temperature sensor 222, thereby improving the reliability of the support mechanism 200. When the temperature of the heat exchange platform 211a exceeds a set value, such as 75°, the first heat preservation switch 221 may control the entire temperature control device 10 to stop operating.

[0037] In some embodiments, a first insulation switch 221 and a first temperature sensor 222 can be provided on the other heat exchange end of the first refrigerator 210 opposite to the heat exchange platform 211a. The first temperature sensor 222 can perform real-time detection of the temperature on the heat exchange end. When the temperature on the heat exchange end exceeds the set value, for example, the set value can be 75°, the first insulation switch 221 can control the entire temperature control device 10 to stop working. For the convenience of description, the hot end of the first refrigerator 210 can be recorded as the first hot end 211, and the cold end of the first refrigerator 210 can be recorded as the first cold end 212. For example, the first hot end 211 can form a heat exchange platform 211a. At this time, the heat exchange platform 211a heats the chip 20, and the other heat exchange end opposite to the heat exchange platform 211a is the first cold end 212. Therefore, a first insulation switch 221 and two first temperature sensors 222 are set on the first hot end 211, and a first insulation switch 221 and a first temperature sensor 222 are set on the first cold end 212.

[0038] In some embodiments, when the heat exchange platform 211a cools the chip 20, Figure 1The first hot end 211 in the first refrigerator 210 is converted into a cold end, and the first cold end 212 is converted into a hot end. At this time, a first heat dissipation channel 201 is provided in the hot end of the first refrigerator 210. The liquid pump 110 can input the refrigerant from the liquid storage tank 120 into the first heat dissipation channel 201 from the input port of the first heat dissipation channel 201, so that the refrigerant in the first heat dissipation channel 201 exchanges heat with the hot end of the first refrigerator 210. The refrigerant after absorbing heat is then output from the output port of the first heat dissipation channel 201 to the outside of the first heat dissipation channel 201, thereby achieving heat dissipation of the hot end of the first refrigerator 210 by the refrigerant. For example, when the cold end of the first refrigerator 210 cools the chip 20, that is, when the heat exchange platform 211a cools the chip 20, the refrigerant can quickly absorb the heat from the hot end of the first refrigerator 210, thereby improving the cooling effect of the cold end of the first refrigerator 210 on the chip 20, that is, improving the cooling effect of the heat exchange platform 211a on the chip 20. The first heat dissipation channel 201 extends along a curve, which can reasonably increase the length of the first heat dissipation channel 201, thereby reasonably extending the heat exchange time between the refrigerant and the hot end of the first refrigerator 210, and ultimately improving the heat dissipation effect of the refrigerant on the hot end of the first refrigerator 210.

[0039] In some embodiments, the storage mechanism 300 includes a housing 310 and a second refrigerator 320. The housing 310 defines a receiving cavity 311 for receiving reagents. For example, the reagents can be received in a reagent kit 30, which is then received in the receiving cavity 311. The first refrigerator 210 can be a semiconductor refrigerator, meaning that the operating principles of the second refrigerator 320 and the first refrigerator 210 can be similar. The second cooler 320 is disposed within the accommodating chamber 311 and can cool the accommodating chamber 311. A second heat dissipation channel 3211 is defined within the hot end of the second cooler 320. The refrigerant flowing out of the output port of the first heat dissipation channel 201 can enter the second heat dissipation channel 3211 through the input port of the second heat dissipation channel 3211, thereby allowing the refrigerant to exchange heat with the hot end of the second cooler 320 within the second heat dissipation channel 3211. Specifically, the refrigerant absorbs heat from the hot end of the second cooler 320 and is then discharged from the output port of the second heat dissipation channel 3211, thereby achieving heat dissipation from the hot end of the second cooler 320. Of course, the second heat dissipation channel 3211 can also extend along a curve, which can reasonably increase the length of the second heat dissipation channel 3211, thereby reasonably extending the heat exchange time between the refrigerant and the hot end of the second cooler 320, and ultimately improving the heat dissipation effect of the refrigerant on the hot end of the second cooler 320.

[0040] During operation, the cold end of the second refrigerator 320 absorbs heat from the accommodating chamber 311, transferring the heat to the hot end of the second refrigerator 320. The refrigerant dissipates heat from the hot end of the second refrigerator 320, thereby achieving the cooling effect of the second refrigerator 320 on the accommodating chamber 311. In reality, body fluid testing takes a relatively long time, so the reagents need to be refrigerated. The second refrigerator 320 cools the accommodating chamber 311, thus providing an excellent refrigerated environment for the reagents.

[0041] In some embodiments, the storage mechanism 300 also includes a second insulation switch 331 and a second temperature sensor 332. The hot end of the second refrigerator 320 is provided with a second insulation switch 331 and a second temperature sensor 332. The second temperature sensor 332 can perform real-time detection of the temperature of the hot end of the second refrigerator 320. When the temperature of the hot end exceeds the set value, for example, the set value can be 75°, the second insulation switch 331 can control the entire temperature control device 10 to stop working.

[0042] For ease of description, the hot end of the second refrigerator 320 can be referred to as the second hot end 321, and the cold end of the second refrigerator 320 can be referred to as the second cold end 322. The first hot end 211 is provided with a first heat preservation switch 221 and a first temperature sensor 222, and the first cold end 212 can be provided with a second temperature sensor 332. The second temperature sensor 332 on the second hot end 321 can detect the temperature of the second hot end 321 in real time. When the temperature of the second hot end 321 exceeds a set value, for example, the set value can be 75°, the second heat preservation switch 331 can control the entire temperature control device 10 to stop working. Similarly, the second temperature sensor 332 on the second cold end 322 can detect the temperature of the second cold end 322 in real time.

[0043] The storage mechanism 300 further includes a third temperature sensor 333 , which may be provided on the housing 310 . The third temperature sensor 333 is configured to detect the temperature within the accommodating cavity 311 in real time, thereby ensuring that the reagent is within a reasonable refrigeration temperature range.

[0044] In some embodiments, the storage mechanism 300 further includes a metal frame, which is housed in the accommodating cavity 311. The metal frame can be made of aluminum material, so the metal frame is an aluminum frame. The second cold end 322 of the second refrigerator 320 is spaced apart from the metal frame to avoid direct contact between the second cold end 322 and the metal frame, thereby reducing the condensed water generated on the second cold end 322. Of course, the storage mechanism 300 can also include a thermal insulation member, which can be thermal insulation cotton, and the thermal insulation member is covered on the metal frame, thereby further reducing the heat exchange between the second cold end 322 and the metal frame, thereby further reducing the generation of condensed water on the second cold end 322. Of course, a thermal insulation member can also be provided between the second hot end 321 and the outer shell 310 to prevent the heat of the second hot end 321 from being conducted to the outer shell 310.

[0045] In some embodiments, the storage mechanism 300 further includes a blower 342, which is disposed in the accommodating chamber 311 and is configured to blow the air in the accommodating chamber 311 toward the second cold end 322 of the second refrigerator 320. This can, on the one hand, accelerate the heat exchange efficiency between the accommodating chamber 311 and the second cold end 322, thereby improving the cooling effect of the second refrigerator 320. On the other hand, it can accelerate the circulation of cold air in the accommodating chamber 311, thereby ensuring the uniformity of the temperature distribution in the accommodating chamber 311 and ultimately improving the cooling effect of the accommodating chamber 311. At the same time, the action of the blower 342 can reduce the generation of condensed water, and the airflow can also evaporate the condensed water on the second cold end 322, thereby further reducing the generation of condensed water.

[0046] In some embodiments, the storage mechanism 300 is provided with a buffer tank 351, and the storage mechanism 300 further includes a liquid conducting core 352. The buffer tank 351 can be located below the second cold end 322, so that condensed water falling from the second cold end 322 can be collected in the buffer tank 351. A portion of the liquid conducting core 352 is located in the buffer tank 351, and another portion of the liquid conducting core 352 is located outside the accommodating cavity 311 and extends to a position corresponding to the heat dissipation mechanism 400. The liquid conducting core 352 can produce a capillary action on the condensed water in the buffer tank 351, so that the liquid conducting core 352 absorbs the condensed water in the buffer tank 351 and transports it to the portion of the liquid conducting core 352 located outside the accommodating cavity 311, thereby achieving the discharge of the condensed water in the buffer tank 351 by the liquid conducting core 352. The heat dissipation mechanism 400 can generate airflow to the liquid-conducting core 352. Under the action of the airflow, the condensed water transferred to the liquid-conducting core 352 outside the accommodating chamber 311 will be evaporated, so that the condensed water in the buffer tank 351 is continuously transported to the portion of the liquid-conducting core 352 outside the accommodating chamber 311 and evaporated, thereby achieving effective discharge of the condensed water. Of course, the buffer tank 351 has an inclined surface 3511, which is arranged at an angle to the falling direction of the condensed water, so that the inclined surface 3511 plays a diversion role, ensuring that the condensed water is collected in the buffer tank 351 under the action of gravity at a position corresponding to the inclined surface 3511, and the liquid-conducting core 352 is located at a position corresponding to the inclined surface 3511, ensuring that the liquid-conducting core 352 effectively absorbs and discharges the condensed water.

[0047] In some embodiments, the storage mechanism 300 further includes a protective tube 353, which is located outside the accommodating cavity 311 and sleeved over the liquid-conducting core 352. The free end of the liquid-conducting core 352 forms an evaporation end 3521, which is exposed outside the protective tube 353 and corresponds to the heat dissipation mechanism 400. The protective tube 353 protects the liquid-conducting core 352 and allows the liquid-conducting core 352 to extend along the path defined by the protective tube 353, thereby extending the evaporation end 3521 to a designated position. The airflow generated by the heat dissipation mechanism 400 can directly act on the evaporation end 3521, causing the airflow to evaporate the condensed water within the evaporation end 3521.

[0048] In some embodiments, the heat dissipation mechanism 400 includes a radiator 410 and a fan 420. A third heat dissipation channel 411 is disposed within the radiator 410, and the fan 420 is connected to the radiator 410. The radiator 410 defines the third heat dissipation channel 411. Refrigerant flowing out of the output port of the second heat dissipation channel 3211 can enter the third heat dissipation channel 411 through the input port of the third heat dissipation channel 411. This allows the refrigerant to exchange heat with the radiator 410 within the third heat dissipation channel 411, allowing the radiator 410 to absorb heat from the refrigerant within the third heat dissipation channel. This allows the refrigerant to release heat within the third heat dissipation channel and cool down. The cooled refrigerant is then discharged from the output port of the third heat dissipation channel 411 and ultimately fed into the liquid storage tank 120. Therefore, the radiator 410 absorbs heat from the refrigerant and cools it. The fan 420 will generate airflow, which will flow to the radiator 410, so that the heat absorbed by the radiator 410 from the refrigerant is quickly discharged to the outside, thereby improving the heat dissipation effect of the radiator 410. At the same time, the airflow generated by the fan 420 will also evaporate the liquid in the evaporation end 3521 of the liquid-conducting core 352.

[0049] In some embodiments, the temperature control device 10 further includes a polyurethane tube 510 and a quick connector 520. The polyurethane tube 510 is also known as a PU (polyurethane tubing) tube. The quick connector 520 is disposed at the input and output ports of the first heat dissipation channel 201, the second heat dissipation channel 3211, and the third heat dissipation channel 411. The polyurethane tube 510 is connected to the quick connector 520. Specifically, the polyurethane tube 510 is disposed between the quick connector 520 at the input port of the first heat dissipation channel 201 and the liquid pump 110; the polyurethane tube 510 is disposed between the quick connector 520 at the output port of the first heat dissipation channel 201 and the quick connector 520 at the input port of the second heat dissipation channel 3211; the polyurethane tube 510 is disposed between the quick connector 520 at the output port of the second heat dissipation channel 3211 and the quick connector 520 at the input port of the third heat dissipation channel 411; and the polyurethane tube 510 is disposed between the quick connector 520 at the output port of the third heat dissipation channel 411 and the liquid storage tank 120. By connecting the polyurethane tube 510 with the quick-connect connector 520, on the one hand, the assembly efficiency and assembly reliability of the polyurethane tube 510 can be improved, and the polyurethane tube 510 can be prevented from loosening; on the other hand, the polyurethane tube 510 can withstand high temperatures, avoiding the polyurethane tube 510 from softening at high temperatures and causing refrigerant leakage.

[0050] When the liquid pump 110 is operating, the refrigerant in the liquid storage tank 120 flows through the polyurethane tube 510 into the first heat dissipation channel 201, where it initially absorbs heat from the hot end of the first cooler 210, dissipating heat away from the first cooler 210. After initially absorbing heat, the refrigerant then flows through the polyurethane tube 510 into the second heat dissipation channel 3211, where it again absorbs heat from the hot end of the second cooler 320, dissipating heat away from the second cooler 320. After absorbing heat again, the refrigerant then flows through the polyurethane tube 510 into the third heat dissipation channel 411. The radiator 410 absorbs heat from the refrigerant in the third heat dissipation channel 411, causing the refrigerant to release heat and cool down. After releasing heat and cooling down, the refrigerant returns to the liquid storage tank 120 for recycling. Therefore, through the action of the liquid pump 110, the refrigerant can circulate between the liquid storage tank 120, the first heat dissipation channel 201, the second heat dissipation channel 3211 and the third heat dissipation channel 411, thereby achieving heat dissipation for the first refrigerator 210 and the second refrigerator 320. Figure 1 The thick dashed arrows represent the flow trajectory of the refrigerant.

[0051] If multiple liquid storage tanks 120, multiple polyurethane tubes 510 and multiple heat dissipation mechanisms 400 are used to dissipate heat for the first refrigerator 210 and the second refrigerator 320 respectively, that is, heat is dissipated through multiple refrigerant channels, this will increase the material cost of the temperature control device 10, making the structure of the temperature control device 10 more complicated, and ultimately increasing the manufacturing cost of the temperature control device 10.

[0052] In the temperature control device 10 of the aforementioned embodiment, heat is dissipated from the first cooler 210 and the second cooler 320 via a single heat dissipation mechanism 400 and a single liquid storage tank 120. This can be understood as a serial heat dissipation system for the first cooler 210 and the second cooler 320, i.e., heat is dissipated via a single refrigerant. This reduces the number of liquid storage tanks 120, polyurethane tubes 510, and heat dissipation mechanisms 400, thereby simplifying the structure of the temperature control device 10 and ultimately reducing its manufacturing cost.

[0053] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0054] The above-described embodiments merely represent several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, and these modifications and improvements fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A temperature control device, applied to an analyzer, characterized in that: The temperature control device comprises: A liquid storage mechanism, comprising a liquid pump and a liquid storage tank, wherein the liquid storage tank is used to store refrigerant; The carrying mechanism includes a first cooler for carrying the chip, wherein a hot end of the first cooler is provided with a first heat dissipation channel; The storage mechanism includes a housing and a second refrigerator, wherein the housing is provided with a chamber for storing reagents, the second refrigerator is disposed in the chamber and cools the chamber, and a second heat dissipation channel is provided at a hot end of the second refrigerator; and The heat dissipation mechanism is provided with a third heat dissipation channel; When the liquid pump is working, the refrigerant circulates among the liquid storage tank, the first heat dissipation channel, the second heat dissipation channel and the third heat dissipation channel.

2. The temperature control device according to claim 1, characterized in that: The first heat dissipation channel extends along a curve.

3. The temperature control device according to claim 1, characterized in that: The storage mechanism further comprises a metal frame and a heat insulating member, wherein the metal frame is located in the shell, and the heat insulating member covers the metal frame.

4. The temperature control device according to claim 1, characterized in that: The storage mechanism further includes a blower, which is disposed in the accommodating cavity and is used to blow the air in the accommodating cavity toward the cold end of the second refrigerator.

5. The temperature control device according to claim 1, characterized in that: The storage mechanism is provided with a cache slot and includes a liquid conducting core, a portion of the liquid conducting core is located in the cache slot, and another portion of the liquid conducting core is located outside the accommodating cavity and extends to a position corresponding to the fan of the heat dissipation mechanism.

6. The temperature control device according to claim 5, characterized in that: The storage mechanism further includes a protection tube, which is located outside the accommodating cavity and sleeved on the liquid guiding core. The free end of the liquid guiding core forms an evaporation end exposed outside the protection tube and corresponding to the fan of the heat dissipation mechanism.

7. The temperature control device according to claim 1, characterized in that: It also includes a polyurethane tube and a quick-plug connector. The quick-plug connector is arranged at the input and output ports of the first heat dissipation channel, the second heat dissipation channel and the third heat dissipation channel, and the polyurethane tube is connected to the quick-plug connector.

8. The temperature control device according to claim 1, characterized in that: Also includes at least one of the following options: The carrying mechanism further includes a first heat preservation switch and a first temperature sensor. One heat exchange end of the first refrigerator forms a heat exchange platform for carrying chips. The first heat preservation switch and two first temperature sensors are provided on the heat exchange platform. The first heat preservation switch and the first temperature sensor are provided on the other heat exchange end of the first refrigerator. The storage mechanism further includes a second heat preservation switch and a second temperature sensor, the hot end of the second refrigerator is provided with the second heat preservation switch and the second temperature sensor, and the cold end of the second refrigerator is provided with the second temperature sensor; The heat dissipation mechanism includes a radiator and a fan, the third heat dissipation channel is arranged in the radiator, and the fan is connected to the radiator.

9. The temperature control device according to claim 1, characterized in that: The first refrigerator and the second refrigerator are both semiconductor refrigerators.

10. The temperature control device according to claim 1, characterized in that: The liquid storage mechanism further includes a float, and the float floats in the refrigerant.

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