Temperature control method and system and casting device

Abstract

The invention relates to the technical field of ceramic tape casting, in particular to a temperature control method and system and a tape casting device.The temperature control method comprises the steps that a PID control function model about preset temperature, heating plate temperature and PID control factors is established; determining a PID control factor based on a preset temperature, the collected temperature of the heating plate and a PID control function model; establishing a compensation function model about the heating plate temperature, the environment temperature and the temperature compensation factor; determining a temperature compensation factor based on the collected temperature of the heating plate, the environment temperature and the compensation function model; establishing a power function model about a PID control factor and a temperature compensation factor about feedback power; based on the determined PID control factor, the temperature compensation factor and the power function model, feedback power is determined; and performing temperature control adjustment on the heating plate based on the determined feedback power. Through PID intelligent regulation and control and temperature compensation, the technical effect of improving temperature control accuracy is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of ceramic tape casting, and in particular to a temperature control method, system and tape casting device. Background Art

[0002] In the ceramic tape casting process, temperature is the core factor affecting the density, thickness consistency and yield of the green body, and the heating temperature of the heating plate needs to be controlled with high precision.

[0003] In the prior art, a target temperature is preset in the casting equipment system, and the temperature of the heating plate is collected in real time. When a deviation between the actual temperature and the preset temperature is detected, the temperature of the heating plate is corrected to achieve precise temperature control. However, there is a certain deviation in the temperature correction, resulting in low temperature control accuracy.

[0004] Therefore, the technical problem of the prior art is that the temperature control accuracy is low. Summary of the Invention

[0005] The present application provides a temperature control method, system and casting device, which achieve the technical effect of improving temperature control accuracy through PID intelligent regulation and increased temperature compensation.

[0006] In the first aspect, the present application provides a temperature control method, which adopts the following technical solution:

[0007] A temperature control method is applicable to a ceramic casting device, wherein the ceramic casting device comprises: a heating box, wherein the heating box has a heating plate and a soaking plate, wherein the soaking plate is fixedly connected to the heating plate, and the soaking plate is used for heat conduction so that the heating plate uniformly heats the material through the soaking plate; the temperature control method comprises:

[0008] Establishing a PID control function model regarding a preset temperature, a heating plate temperature, and a PID control factor; determining the PID control factor based on the preset temperature, the collected heating plate temperature, and the PID control function model;

[0009] Establishing a compensation function model for the heating plate temperature, the ambient temperature, and the temperature compensation factor; determining the temperature compensation factor based on the collected heating plate temperature, the ambient temperature, and the compensation function model;

[0010] Establishing a power function model of the feedback power with respect to the PID control factor and the temperature compensation factor; determining the feedback power based on the determined PID control factor, the temperature compensation factor and the power function model;

[0011] The heating plate is temperature-controlled and regulated based on the determined feedback power.

[0012] As an advantage, it also includes:

[0013] Establish a thermal conductivity function model of the heating plate temperature and the heating plate input power with respect to the surface temperature of the heat sink;

[0014] Determine the surface temperature of the vapor chamber based on the collected heating plate temperature, heating plate input power, and thermal conductivity function model;

[0015] Determine the PID control factor based on the preset temperature, the determined vapor chamber surface temperature, and the PID control function model;

[0016] A temperature compensation factor is determined based on the determined vapor chamber surface temperature, the collected ambient temperature, and the compensation function model.

[0017] Preferably, the thermal conductivity function model is:

[0018]

[0019] Among them, T surface (t) is the surface temperature of the vapor chamber;

[0020] T heat (t) is the temperature of the heating plate;

[0021] δ is the thickness of the vapor chamber;

[0022] λ is the thermal conductivity of the vapor chamber;

[0023] A is the heating area of ​​the vapor chamber;

[0024] P input (t) is the input power of the heating plate.

[0025] Preferably, the “determining the temperature compensation factor based on the determined vapor chamber surface temperature, the collected ambient temperature, and the compensation function model” includes:

[0026] The compensation function model includes a first compensation function model, and the first compensation function model includes:

[0027]

[0028] Among them, Q rad (t) is the radiation heat loss;

[0029] T surface (t) is the surface temperature of the vapor chamber;

[0030] T env (t) is the ambient temperature;

[0031] σ is the Stefan constant;

[0032] ξ is the emissivity;

[0033] A is the heating area of ​​the vapor chamber;

[0034] The temperature compensation factor Y2 is:

[0035] Y2=Q rad ;

[0036] Alternatively, the step of “determining a temperature compensation factor based on the determined vapor chamber surface temperature, the collected ambient temperature, and the compensation function model” includes:

[0037] The compensation function model includes a second compensation function model, and the second compensation function model includes:

[0038] Q conv (t)=h·A·(T surface (t)-T env (t))

[0039] Among them, Q conv (t) is the convective heat loss;

[0040] T surface (t) is the surface temperature of the vapor chamber;

[0041] T env (t) is the ambient temperature;

[0042] h is the convective heat transfer coefficient;

[0043] A is the heating area of ​​the vapor chamber;

[0044] The temperature compensation factor Y2 is:

[0045] Y2=Q conv .

[0046] Preferably, the “determining the temperature compensation factor based on the determined vapor chamber surface temperature, the collected ambient temperature, and the compensation function model” includes:

[0047] The compensation function model includes a first compensation function model, and the first compensation function model includes:

[0048]

[0049] Among them, Q rad (t) is the radiation heat loss;

[0050] T surface (t) is the surface temperature of the vapor chamber;

[0051] T env (t) is the ambient temperature;

[0052] σ is the Stefan constant;

[0053] ξ is the emissivity;

[0054] A is the heating area of ​​the vapor chamber;

[0055] The compensation function model further includes a second compensation function model, and the second compensation function model includes:

[0056] Q conv (t)=h·A·(T surface (t)-T env (t))

[0057] Among them, Q conv (t) is the convective heat loss;

[0058] T surface (t) is the surface temperature of the vapor chamber;

[0059] T env (t) is the ambient temperature;

[0060] h is the convective heat transfer coefficient;

[0061] A is the heating area of ​​the vapor chamber;

[0062] The temperature compensation factor Y2 is:

[0063] Y2=Q rad +Q conv .

[0064] Preferably, the step of “establishing a power function model of the feedback power with respect to the PID control factor and the temperature compensation factor; and determining the feedback power based on the determined PID control factor, the temperature compensation factor, and the power function model” includes:

[0065] The PID control function model Q is:

[0066]

[0067] Where, e(t) is the surface temperature deviation of the vapor chamber;

[0068] K p is the proportionality coefficient;

[0069] K i is the integration coefficient;

[0070] K d is the differential coefficient;

[0071] PID control factor Y1=Q, feedback power u(t) is:

[0072] u(t)=Y1+Y2.

[0073] As a preference, a dynamic adjustment function model of the initial value of the proportional coefficient, the surface temperature gradient of the vapor chamber, and the proportional coefficient is established;

[0074] The proportional coefficient is determined based on the initial value of the proportional coefficient, the collected surface temperature gradient of the vapor chamber, and the dynamic adjustment function model.

[0075] Preferably, the dynamic adjustment function model is:

[0076]

[0077] Among them, K p0 is the initial value of the proportional coefficient;

[0078] β is the weight coefficient;

[0079] Surface temperature gradient of the vapor chamber.

[0080] In a second aspect, the present application provides a temperature control system, which adopts the following technical solutions:

[0081] A temperature control system, comprising:

[0082] A function establishment module, the function establishment module is used to establish a compensation function model about the heating plate temperature, the ambient temperature and the temperature compensation factor, and to establish a power function model about the PID control factor and the temperature compensation factor and the feedback power;

[0083] A confirmation module, wherein the confirmation module is used to determine the PID control factor based on the preset temperature, the collected heating plate temperature and the PID control function model, to determine the temperature compensation factor based on the collected heating plate temperature, the ambient temperature and the compensation function model, and to determine the feedback power based on the determined PID control factor, the temperature compensation factor and the power function model.

[0084] In a third aspect, the present application provides a ceramic tape casting device, which adopts the following technical solution:

[0085] A ceramic casting device comprises: a heating box, wherein the heating box has: a heating plate, wherein the heating plate is used to heat the material using the temperature control method; a heat spreader, wherein the heat spreader is fixedly connected to the heating plate, wherein the heat spreader is used to uniformly conduct heat, so that the heating plate is used to uniformly heat the material through the heat spreader.

[0086] In summary, this application includes at least one of the following beneficial technical effects:

[0087] This application uses PID temperature control combined with temperature compensation to achieve precise temperature control through multi-model collaboration; it not only solves the problem of temperature response lag, but also quickly suppresses the temperature fluctuation of the heating plate through proportional-differential control; it also converts the surface temperature deviation of the heat sink and the environmental compensation amount into real-time power regulation to improve temperature control accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0088] Figure 1 It is a schematic diagram of the temperature control method described in this application;

[0089] Figure 2 It is a schematic diagram of the temperature control system described in this application;

[0090] Figure 3 It is a schematic diagram of the ceramic casting device described in this application.

[0091] Description of reference numerals:

[0092] 100. Heating box; 110. Heating plate; 120. Heat soaking plate. DETAILED DESCRIPTION

[0093] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application include direct and indirect connections (couplings) unless otherwise specified. In the description of this application, it should be understood that the orientations or positional relationships indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0094] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0095] The present application provides a temperature control method, system and casting device, which achieve the technical effect of improving temperature control accuracy through PID intelligent regulation and increased temperature compensation.

[0096] In order to better understand the above technical solution, the following will be described in detail with reference to the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0097] In the ceramic tape-casting process, the temperature control accuracy of the heating plate 110 has a decisive impact on product quality, directly affecting the green body's compactness, thickness consistency, and yield rate. Therefore, high-precision control of the heating temperature is essential. During the tape-casting process, the slurry undergoes critical stages on the heating plate 110, including solvent volatilization and solidification. Temperature fluctuations within a ±1°C range can cause bubbles, cracks, or thickness deviations in the green body, potentially rendering the entire batch of products scrapped. Therefore, the industry places stringent demands on the temperature control accuracy of the heating system.

[0098] Casting equipment systems typically achieve temperature control by presetting a target temperature, collecting the heating plate temperature in real time, and making corrections when deviations are detected. Specifically, this technology uses thermocouples or infrared sensors to obtain the surface temperature of the heating plate 110, compares it with the preset value, and then adjusts the heating power through an algorithm to form a closed-loop control. However, in actual applications, there is a significant deviation between the heating plate temperature and the actual material temperature, resulting in insufficient temperature control accuracy. The main reasons include:

[0099] The heat spreader 120 covering the surface of the heating plate 110 has a heat conduction hysteresis due to the difference in materials. For example, the thermal response time of the metal heat spreader 120 and the ceramic heat spreader 120 can differ by 2-3 seconds; air convection in the heating box 100 will cause heat loss, especially under conditions of unstable ventilation, the heat loss rate can reach 5%-15%; the thermal resistance of the heat spreader 120 itself will cause energy loss, and the difference in thermal resistance of heat spreaders 120 of different materials (such as aluminum alloy and copper alloy) can lead to a temperature decay of 2-5°C.

[0100] In order to solve the above problems, the applicant further adopted a temperature steady-state compensation method: after the temperature reaches a steady state, the temperature difference between the heating plate 110 and the surface of the heat-equalizing material is measured respectively, and the temperature difference is compensated to the real-time measured temperature or the target temperature. For example, if the temperature difference measured at a certain process temperature is 3°C, the target temperature of the heating plate 110 is increased by 3°C to offset the heat loss. However, due to the nonlinear characteristics of heat loss at different temperatures, such as the temperature difference is 2°C at 50°C and the temperature difference rises to 7°C at 100°C (nonlinear growth), this method is only effective in a specific temperature range. When the process needs to be dynamically adjusted within the range of 30-150°C, the error of the existing compensation method can reach more than ±3°C, and it cannot adapt to multiple temperature scenarios. In addition, this method needs to wait for the temperature to stabilize after each startup, which usually takes 30-60 minutes, significantly reducing production efficiency. While the aforementioned compensation method improves temperature control accuracy to a certain extent (test data shows the error can be reduced from ±5°C to ±2°C), its applicability and accuracy are limited because it does not take into account the nonlinear relationship between temperature and heat loss (e.g., heat loss in the low-temperature range is primarily due to conduction, while heat loss in the high-temperature range is primarily due to radiation and convection). In scenarios where the ceramic tape casting process requires frequent switching of temperature parameters (such as the gradient heating requirements of multi-layer co-fired products), it is difficult to meet high-precision temperature control requirements. Therefore, a dynamic compensation solution that can adapt to the entire temperature range is urgently needed.

[0101] This application proposes a temperature control method suitable for ceramic casting devices, such as Figure 1 As shown, the ceramic casting device includes: a heating box 100; the heating box 100 includes a heating plate 110 and a heat spreader 120, the heat spreader 120 is fixedly connected to the heating plate 110, and the heat spreader 120 is used to conduct heat so that the heating plate 110 uniformly heats the material through the heat spreader 120; Figure 2 As shown, the temperature control methods include:

[0102] S1: Establishing a PID control function model regarding a preset temperature, a heating plate temperature, and a PID control factor; determining the PID control factor based on the preset temperature, the collected heating plate temperature, and the PID control function model;

[0103] S2: Establishing a compensation function model for the heating plate temperature, the ambient temperature, and the temperature compensation factor; determining the temperature compensation factor based on the collected heating plate temperature, the ambient temperature, and the compensation function model;

[0104] S3: Establishing a power function model of the feedback power with respect to the PID control factor and the temperature compensation factor; determining the feedback power based on the determined PID control factor, the temperature compensation factor and the power function model;

[0105] S4: The heating plate 110 is temperature-controlled and regulated based on the determined feedback power.

[0106] Specifically, this application establishes the preset temperature, heating plate temperature and PID parameters (K p , K i , K d ) model, calculates the feedback adjustment amount, namely the PID control factor, which is used to deal with the current value, historical accumulation and change trend of the heat spreader surface temperature deviation e(t); at the same time, through the temperatures of the heating plate 110 and the heat conduction plate, and based on the quantified heat dissipation loss of radiation and convection, a feedforward compensation amount, namely the temperature compensation factor, is formed; and then by constructing the PID control factor and the temperature compensation factor, the feedback power is established based on the PID control factor and the temperature compensation factor, thereby realizing the dynamic adjustment of the power of the heating plate 110; through feedback adjustment and feedforward heat dissipation compensation, the hysteresis of the single feedback control is realized, thereby improving the temperature control accuracy.

[0107] Furthermore, it also includes:

[0108] Establish a thermal conductivity function model of the heating plate temperature and the heating plate input power with respect to the surface temperature of the heat sink;

[0109] Determine the surface temperature of the vapor chamber based on the collected heating plate temperature, heating plate input power, and thermal conductivity function model;

[0110] Determine the PID control factor based on the preset temperature, the determined vapor chamber surface temperature, and the PID control function model;

[0111] A temperature compensation factor is determined based on the determined vapor chamber surface temperature, the collected ambient temperature, and the compensation function model.

[0112] It should be noted that since the heat spreader 120 needs to be kept flat, it is difficult to set a temperature sensor on the heat spreader 120. Therefore, only the temperature of the heating plate can be collected. This application derives the surface temperature of the heat spreader through the heating plate temperature and indirectly calculates the temperature compensation factor. Specifically, the surface temperature of the heat spreader is indirectly calculated and characterized by the heating plate temperature, thereby quantifying the heat dissipation loss. Specifically, a thermal conductivity function model is established to determine the heating plate temperature T heat (t), heating plate input power P input (t) and the surface temperature of the heat sink T surface (t), thereby solving the temperature measurement problem of the surface of the heat plate 120 without a temperature sensor; based on the real-time collected heating plate temperature T heat (t) and heating plate input power P input (t), the surface temperature of the heat sink T is calculated by the thermal conductivity function model surface(t), in other words, in the above-mentioned "establishing a compensation function model about the heating plate temperature, ambient temperature and temperature compensation factor; determining the temperature compensation factor based on the collected heating plate temperature, ambient temperature and compensation function model", the heating plate temperature is used as the collection parameter, the surface temperature of the heat spreader is obtained after calculation, and the temperature compensation factor is determined based on the determined surface temperature of the heat spreader, the collected ambient temperature and the compensation function model. It can be understood that the heating plate temperature is used as an indirect parameter in the process of calculating the temperature compensation factor.

[0113] Similarly, the heating plate temperature is also used as an indirect parameter in the calculation of the PID compensation factor, which will not be repeated here.

[0114] More specifically, the thermal conductivity function model is:

[0115]

[0116] Among them, T surface (t) is the surface temperature of the vapor chamber;

[0117] T heat (t) is the heating plate temperature; the heating plate temperature can be obtained by a temperature sensor provided on the heating plate 110;

[0118] δ is the thickness of the vapor chamber 120;

[0119] λ is the thermal conductivity of the vapor chamber 120;

[0120] A is the heating area of ​​the vapor chamber 120;

[0121] P input (t) is the input power of the heating plate.

[0122] The thermal conductivity function model calculates the vapor chamber surface temperature based on the heating plate temperature, vapor chamber 120 thickness, vapor chamber 120 thermal conductivity, heating area, and heating plate input power. This model considers the effect of thermal resistance on temperature, making the vapor chamber surface temperature calculation calculable and reproducible, overcoming the limitations of hardware temperature measurement. In one embodiment, vapor chamber 120 can be made of aluminum, aluminum alloy, copper, or a copper-graphene composite. Vapor chamber 120 has high thermal conductivity to minimize heat transfer delays.

[0123] In one embodiment, the temperature compensation factor takes into account the compensation for radiation loss in the processing environment, converting the nonlinear radiation loss into a calculable physical quantity as part of the feedforward compensation to offset the temperature drop caused by radiation in advance and reduce temperature control lag. Specifically, "determining the temperature compensation factor based on the determined vapor chamber surface temperature, the collected ambient temperature, and the compensation function model" includes:

[0124] The compensation function model includes a first compensation function model, and the first compensation function model includes:

[0125]

[0126] Among them, Q rad (t) is the radiation heat loss;

[0127] T surface (t) is the surface temperature of the vapor chamber;

[0128] T env (t) is the ambient temperature; the ambient temperature can be obtained by a temperature sensor provided inside the heating box 100;

[0129] σ is the Stefan constant;

[0130] ξ is the emissivity;

[0131] A is the heating area of ​​the vapor chamber 120;

[0132] The temperature compensation factor Y2 is:

[0133] Y2=Q rad .

[0134] In another embodiment, the temperature compensation factor takes into account the compensation for convection losses within the processing environment, quantitatively calculates the convection heat dissipation losses, covers the main heat dissipation paths of the vapor chamber 120, and improves the comprehensiveness of the feedforward compensation. Specifically, "determining the temperature compensation factor based on the determined vapor chamber surface temperature, the collected ambient temperature, and the compensation function model" includes:

[0135] The compensation function model includes a second compensation function model, and the second compensation function model includes:

[0136] Q conv (t)=h·A·(T surface (t)-T env (t))

[0137] Among them, Q conv (t) is the convective heat loss;

[0138] T surface (t) is the surface temperature of the vapor chamber;

[0139] T env (t) is the ambient temperature;

[0140] h is the convective heat transfer coefficient;

[0141] A is the heating area of ​​the vapor chamber 120;

[0142] The temperature compensation factor Y2 is:

[0143] Y2=Q conv .

[0144] In other embodiments, the temperature compensation factor takes into account compensation for radiation loss and flow loss within the processing environment. Heat dissipation from the vapor chamber 120 is achieved through the combined effects of radiation and convection. Through the comprehensive compensation of "radiation + convection", all quantifiable heat dissipation pathways of the vapor chamber 120 are covered, making the feedforward compensation more accurate and further reducing the temperature control error. Specifically, "determining the temperature compensation factor based on the determined vapor chamber surface temperature, the collected ambient temperature, and the compensation function model" includes:

[0145] The compensation function model includes a first compensation function model and a second compensation function model, and the first compensation function model includes:

[0146]

[0147] Among them, Q rad (t) is the radiation heat loss;

[0148] T surface (t) is the surface temperature of the vapor chamber;

[0149] T env (t) is the ambient temperature; the ambient temperature can be obtained by a temperature sensor provided inside the heating box 100;

[0150] σ is the Stefan constant;

[0151] ξ is the emissivity;

[0152] A is the heating area of ​​the vapor chamber 120;

[0153] The second compensation function model includes:

[0154] Q conv (t)=h·A·(T surface (t)-T env (t))

[0155] Among them, Q conv (t) is the convective heat loss;

[0156] T surface (t) is the surface temperature of the vapor chamber;

[0157] T env (t) is the ambient temperature; the ambient temperature can be obtained by a temperature sensor provided inside the heating box 100;

[0158] h is the convective heat transfer coefficient;

[0159] A is the heating area of ​​the vapor chamber 120;

[0160] The heat dissipation of the vapor chamber 120 is a combination of radiation and convection. The two are independent and occur simultaneously, so the total heat dissipation loss needs to be calculated superimposed. Therefore, the temperature compensation factor Y2 is:

[0161] Y2=Q rad +Q conv .

[0162] More specifically, “establishing a PID control function model regarding a preset temperature, a heating plate temperature, and a PID control factor; and determining the PID control factor based on the preset temperature, the collected heating plate temperature, and the PID control function model” includes:

[0163] The PID control function model Q is:

[0164]

[0165] Where, e(t) is the surface temperature deviation of the vapor chamber;

[0166] K p is the proportionality coefficient;

[0167] K i is the integration coefficient;

[0168] K d is the differential coefficient;

[0169] e(t) is the difference between the preset temperature and the heating plate temperature. Based on the above PID control function model Q, a controllable deviation response is achieved. K p , K i , K d Three parameters are independently adjustable to optimize dynamic performance.

[0170] Among them, the PID control factor Y1 = Q, and the feedback power u(t) is:

[0171] u(t)=Y1+Y2

[0172] Right now

[0173]

[0174] It should be noted that the feedback power is determined based on the PID control factor and the temperature compensation factor. The PID control factor and the temperature compensation factor are not a simple numerical superposition, but a combination of feedback adjustment to deal with the surface temperature deviation of the heat spreader and feedforward compensation to compensate for heat loss. Although a single PID control factor can handle the surface temperature deviation of the heat spreader, there may be a problem of adjustment lag for the heat loss caused by radiation and convection of the heat spreader 120, because it will not react until the temperature deviates. Although a single temperature compensation factor can consider heat loss in advance, it cannot deal with those unexpected surface temperature deviations of the heat spreader caused by other factors. Combining the two into a total feedback power can enable the heating plate 110 to quickly respond to and correct the existing surface temperature deviation of the heat spreader when adjusting the power, and can also compensate for the inevitable heat loss in advance.

[0175] Feedback power combines the advantages of feedback regulation and feedforward compensation, making power regulation of heating plate 110 more precise and timely. This not only reduces temperature fluctuations caused by heat loss, but also speeds up the response to surface temperature deviations of the vapor chamber. This significantly improves the stability and accuracy of vapor chamber 120 temperature control, ensuring smooth execution of processes such as ceramic tape casting and enhancing product quality consistency.

[0176] Furthermore, the temperature control method also includes: establishing an initial value of the proportional coefficient, the surface temperature gradient of the heat spreader 120, and a dynamic adjustment function model of the proportional coefficient; determining the proportional coefficient based on the initial value of the proportional coefficient and the collected surface temperature gradient of the heat spreader 120 and the dynamic adjustment function model.

[0177] Specifically, the dynamic adjustment function model is:

[0178]

[0179] Among them, K p0 The initial value of the proportional coefficient is the basic adjustment parameter when the surface temperature of the vapor chamber is evenly distributed. It is used to ensure the temperature control accuracy of the system in a steady state and avoid overshoot caused by an excessively large proportional coefficient or slow response caused by an excessively small proportional coefficient.

[0180] β is a weight coefficient used to control the surface temperature gradient of the heat plate 120 to K p The value of β can be determined by experimental calibration. If β is too large, the surface temperature gradient of the heat plate 120 will have a negative impact on K p The impact of β will be too severe and may cause system oscillation; if β is too small, the dynamic adjustment function cannot be fully exerted. Therefore, the setting of β needs to balance the response speed and stability.

[0181] is the surface temperature gradient of the vapor chamber 120. The surface temperature gradient of the vapor chamber 120 (x is the spatial coordinate of the surface of the vapor chamber 120, such as the position in the length or width direction) reflects the rate of temperature change at different locations on the surface of the vapor chamber 120. A larger absolute value of the surface temperature gradient of the vapor chamber 120 indicates a more uneven temperature distribution on the surface of the vapor chamber 120 (e.g., a local area heats up too quickly or has a significant temperature difference from other areas).

[0182] K p The surface temperature gradient of the heat plate 120 Related: When the surface temperature gradient of the vapor chamber 120 increases, K p In K p0 The product of β and gradient is superimposed on the basis, so that the proportional coefficient increases synchronously with the degree of uneven temperature distribution, that is, the more uneven the temperature is, the stronger the adjustment force is, and the local temperature difference is quickly suppressed; when the surface temperature gradient of the heat plate 120 decreases, K p Automatically fall back to close to K p0 , ensuring the stability of steady-state temperature control.

[0183] This application also provides a temperature control system, such as Figure 3 As shown, it includes a function establishment module and a confirmation module, the function establishment module includes a first function establishment module, a second function establishment module and a third function establishment module, the first function establishment module is used to establish a compensation function model about the heating plate temperature, the ambient temperature and the temperature compensation factor; the second function establishment module is used to establish a compensation function model about the heating plate temperature, the ambient temperature and the temperature compensation factor; the third function establishment module is used to establish a power function model about the PID control factor, the temperature compensation factor and the feedback power;

[0184] The confirmation module includes a first confirmation module, a second confirmation module and a third confirmation module. The first confirmation module is used to determine the PID control factor based on the preset temperature, the collected heating plate temperature and the PID control function model; the second confirmation module is used to determine the temperature compensation factor based on the collected heating plate temperature, the ambient temperature and the compensation function model; the third confirmation module is used to determine the feedback power based on the determined PID control factor, the temperature compensation factor and the power function model.

[0185] The present application also provides a ceramic casting device, such as Figure 1As shown, the heating box 100 includes a heating plate 110 and a vapor chamber 120. The heating plate 110 is used to heat the material using the temperature control method described above. The vapor chamber 120 is fixedly connected to the heating plate 110 and is used to evenly conduct heat so that the heating plate 110 can evenly heat the material through the vapor chamber 120. In other words, the heating box 100 has the heating plate 110 and the vapor chamber 120 built in. The vapor chamber 120 is tightly attached to the heating plate 110. The material is placed on the vapor chamber 120. The heating plate 110 acts on the vapor chamber 120 to evenly heat the material. Generally, the heating plate 110 refers to the heating film of the ceramic casting device.

[0186] Although the preferred embodiments of the present application have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present application.

[0187] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A temperature control method, characterized in that: The invention is applicable to a ceramic casting device, the ceramic casting device comprising: a heating box (100), wherein a heating plate (110) and a soaking plate (120) are provided in the heating box (100), the soaking plate (120) is fixedly connected to the heating plate (110), and the soaking plate (120) is used for heat conduction, so that the heating plate (110) uniformly heats the material through the soaking plate (120); the temperature control method comprises: Establishing a PID control function model regarding a preset temperature, a heating plate temperature, and a PID control factor; determining the PID control factor based on the preset temperature, the collected heating plate temperature, and the PID control function model; Establishing a compensation function model for the heating plate temperature, the ambient temperature, and the temperature compensation factor; determining the temperature compensation factor based on the collected heating plate temperature, the ambient temperature, and the compensation function model; Establishing a power function model of the feedback power with respect to the PID control factor and the temperature compensation factor; determining the feedback power based on the determined PID control factor, the temperature compensation factor and the power function model; The heating plate (110) is temperature-controlled and regulated based on the determined feedback power.

2. The temperature control method according to claim 1, characterized in that: Also includes: Establishing a heat conduction function model of the heating plate temperature and the heating plate (110) input power with respect to the surface temperature of the heat sink; Determining the surface temperature of the vapor chamber based on the collected heating plate temperature, the input power of the heating plate (110) and the thermal conductivity function model; Determine the PID control factor based on the preset temperature, the determined surface temperature of the heat sink, and the PID control function model A temperature compensation factor is determined based on the determined vapor chamber surface temperature, the collected ambient temperature, and the compensation function model.

3. The temperature control method according to claim 2, characterized in that: The thermal conductivity function model is: Among them, T surface (t) is the surface temperature of the vapor chamber; T heat (t) is the temperature of the heating plate; δ is the thickness of the heat sink (120); λ is the thermal conductivity of the vapor chamber (120); A is the heating area of ​​the heat sink (120); P input (t) is the input power of the heating plate (110).

4. The temperature control method according to claim 2, characterized in that: The “determining the temperature compensation factor based on the determined vapor chamber surface temperature, the collected ambient temperature, and the compensation function model” includes: The compensation function model includes a first compensation function model, and the first compensation function model includes: Among them, Q rad (t) is the radiation heat loss; T surface (t) is the surface temperature of the vapor chamber; T env (t) is the ambient temperature; σ is the Stefan constant; ξ is the emissivity; A is the heating area of ​​the heat sink (120); The temperature compensation factor Y2 is: Y2=Q rad ; Alternatively, the “determining a temperature compensation factor based on the determined vapor chamber surface temperature, the collected ambient temperature, and the compensation function model” includes: The compensation function model includes a second compensation function model, and the second compensation function model includes: Q conv (t)=h·A·(T surface (t)-T env (t)) Among them, Q conv (t) is the convective heat loss; T surface (t) is the surface temperature of the vapor chamber; T env (t) is the ambient temperature; h is the convective heat transfer coefficient; A is the heating area of ​​the heat sink (120); The temperature compensation factor Y2 is: Y2=Q conv 。 5. The temperature control method according to claim 2, characterized in that: The “determining the temperature compensation factor based on the determined vapor chamber surface temperature, the collected ambient temperature, and the compensation function model” includes: The compensation function model includes a first compensation function model, and the first compensation function model includes: Among them, Q rad (t) is the radiation heat loss; T surface (t) is the surface temperature of the vapor chamber; T env (t) is the ambient temperature; σ is the Stefan constant; ξ is the emissivity; A is the heating area of ​​the heat sink (120); The compensation function model further includes a second compensation function model, and the second compensation function model includes: Q conv (t)=h·A·(T surface (t)-T env (t)) Among them, Q conv (t) is the convective heat loss; T surface (t) is the surface temperature of the vapor chamber; T env (t) is the ambient temperature; h is the convective heat transfer coefficient; A is the heating area of ​​the heat sink (120); The temperature compensation factor Y2 is: Y2=Q rad +Q conv 。 6. The temperature control method according to claim 5, characterized in that: The step of “establishing a power function model of the feedback power with respect to the PID control factor and the temperature compensation factor; and determining the feedback power based on the determined PID control factor, the temperature compensation factor, and the power function model” includes: The PID control function model Q is: Where, e(t) is the surface temperature deviation of the vapor chamber; K p is the proportionality coefficient; K i is the integration coefficient; K d is the differential coefficient; PID control factor Y1=Q, feedback power u(t) is: u(t)=Y1+Y2.

7. The temperature control method according to claim 6, characterized in that: Establishing a dynamic adjustment function model of the initial value of the proportional coefficient, the surface temperature gradient of the heat sink (120), and the proportional coefficient; The proportional coefficient is determined based on an initial value of the proportional coefficient, a collected surface temperature gradient of the vapor chamber (120), and a dynamic adjustment function model.

8. The temperature control method according to claim 7, characterized in that: The dynamic adjustment function model is: Among them, K p0 is the initial value of the proportional coefficient; β is the weight coefficient; The surface temperature gradient of the heat spreader (120).

9. A temperature control system, characterized in that: include: A function establishment module, the function establishment module is used to establish a compensation function model about the heating plate temperature, the ambient temperature and the temperature compensation factor, and to establish a power function model about the PID control factor and the temperature compensation factor and the feedback power; A confirmation module, wherein the confirmation module is used to determine the PID control factor based on the preset temperature, the collected heating plate temperature and the PID control function model, to determine the temperature compensation factor based on the collected heating plate temperature, the ambient temperature and the compensation function model, and to determine the feedback power based on the determined PID control factor, the temperature compensation factor and the power function model.

10. A ceramic casting device, characterized in that: include: A heating box (100), wherein the heating box (100) comprises: A heating plate (110), the heating plate (110) being used to heat a material using the temperature control method according to any one of claims 1 to 8; A soaking plate (120) is fixedly connected to the heating plate (110), and the soaking plate (120) is used for uniform heat conduction, so that the heating plate (110) is used to uniformly heat the material through the soaking plate (120).

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