Metal intelligent chip card packaging structure and manufacturing method thereof

Abstract

The invention discloses a metal intelligent chip card packaging structure which comprises a card base and a chip module connected to the card base, the card base at least comprises an upper structure layer, an antenna layer and a lower structure layer which are in a sheet shape and are sequentially stacked, a radio frequency antenna is arranged in the antenna layer, and the chip module is connected to the chip module. The radio frequency antenna is provided with at least two conductive contact parts, the card base is provided with a mounting groove which is positioned above the conductive contact parts and is used for accommodating the chip module, the bottom of the mounting groove is provided with a conductive connecting groove which extends downwards to the conductive contact parts, the bottom of the chip module is provided with a chip contact which is exposed after being packaged, and the chip contact is connected with the chip module through the conductive connecting groove. And a conductive material column of which the lower part is conductively connected with the conductive contact part and the upper part protrudes upwards and is conductively connected with the chip contact is arranged in the conductive connecting groove. The invention aims at overcoming the defects in the prior art and providing the metal intelligent chip card packaging structure which is compact in structure and high in stability and the manufacturing method of the metal intelligent chip card packaging structure.

Description

Technical Field

[0001] The present invention particularly relates to a metal smart chip card packaging structure and a manufacturing method thereof. Background Art

[0002] With the continuous development of smart card technology, metal materials are increasingly being used in smart chip cards due to their superior appearance, structural strength, and anti-counterfeiting properties. However, due to the inherently good electrical conductivity of metal materials, achieving a stable electrical connection between the chip and the RF antenna in metal cards presents a major technical challenge. Currently, existing metal smart chip cards face numerous challenges in chip packaging and electrical connections. First, traditional metal card chip packaging processes typically utilize welding and wiring to achieve the electrical connection between the chip and antenna. These processes are not only complex and difficult to operate, but also require high equipment precision and operator skills, resulting in low overall production efficiency and high manufacturing costs. Furthermore, due to issues such as unstable temperature control and small solder joint contact area during the welding process, quality defects such as cold solder joints, loose solder joints, and high contact resistance are prone to occur, which in turn affects the electrical stability between the chip and antenna and reduces product reliability. Second, because metal cards generally include a metal layer (such as stainless steel, copper, and aluminum), its excellent electrical conductivity makes it very easy for the chip's gold wires or conductive connection points to short-circuit with the metal layer. Especially when there are exposed wires or conductive adhesive layers between the chip and the antenna, if effective isolation or structural protection is not performed, it is very easy to cause a short circuit, resulting in the chip not being able to work properly, or even the entire card failing, seriously affecting the product's qualification rate and performance. In addition, in traditional technical solutions, although conductive adhesive has the advantages of simple connection process and strong adaptability, it has a certain fluidity before curing and is easy to overflow to the vicinity of the metal layer during dispensing or hot pressing, thereby causing a short circuit risk. Therefore, the application of conductive adhesive in metal card chip connection has always been limited and is regarded as an uncontrollable connection method, which limits its promotion and application in the field of metal smart cards.

[0003] To address these issues, several improvements have emerged in the prior art, such as the use of dual coupling to achieve contactless connection between the chip and antenna. However, while this approach avoids short-circuiting, it comes with high chip costs and poor contactless performance, making it difficult to meet the demands of high-frequency, long-distance card reading applications. Another approach, using continuous wire connections, achieves stable electrical conduction, but the production process is complex and the wires are prone to breakage or short-circuiting with the metal layer, resulting in low product yields and making large-scale production difficult.

[0004] The present invention is just produced based on above-mentioned deficiency. Summary of the Invention

[0005] The object of the present invention is to overcome the deficiencies of the prior art and to provide a metal smart chip card packaging structure with a compact structure and strong stability and a manufacturing method thereof.

[0006] The present invention is achieved through the following technical solutions:

[0007] The present invention provides a metal smart chip card packaging structure, including a card base and a chip module connected to the card base, the card base at least including an upper structural layer, an antenna layer and a lower structural layer in the form of thin sheets and stacked in sequence, the antenna layer being provided with a radio frequency antenna, the radio frequency antenna having at least two conductive contact portions, the card base being provided with a mounting groove located above the conductive contact portion and for accommodating the chip module, the bottom of the mounting groove being provided with a conductive connection groove extending downward to the conductive contact portion, the bottom of the chip module having exposed chip contacts after packaging, the conductive connection groove being provided with a conductive material column having a lower portion conductively connected to the conductive contact portion and an upper portion protruding upward and conductively connected to the chip contact.

[0008] In the metal smart chip card packaging structure described above, the upper structural layer includes a stacked metal layer and a shielding layer, the shielding layer is sandwiched between the metal layer and the antenna layer, and the mounting groove passes through the metal layer and the shielding layer.

[0009] As described above, the metal smart chip card packaging structure, the upper structural layer includes an upper film layer and an upper plastic layer stacked together, the upper film layer covers the upper surface of the upper plastic layer, the mounting groove passes through the upper film layer and the upper plastic layer, and a metal sheet is embedded in the antenna layer.

[0010] In the metal smart chip card packaging structure described above, the lower structural layer includes a lower plastic layer and a lower covering layer stacked together, and a magnetic strip for storing information is connected to the lower surface of the lower covering layer.

[0011] In the metal smart chip card packaging structure described above, the conductive contact portion is a serpentine structure formed by winding, so that the conductive contact portion is composed of a plurality of straight segments and curved segments connected together, wherein at least two straight segments are exposed in the conductive connection groove.

[0012] In the metal smart chip card packaging structure described above, three straight segments are exposed in the conductive connection groove, the conductive connection groove is circular, and its diameter is D1, then 1.0mm≤D1≤2.0mm, the straight segment line thickness diameter is d2, then 0.07mm≤d2≤0.15mm, and the spacing between adjacent straight segments is L1, then 0.1mm≤L1≤0.25mm.

[0013] In the metal smart chip card packaging structure described above, the minimum distance between the groove wall of the conductive connection groove and the groove wall of the mounting groove is L2.

[0014] In the above-mentioned metal smart chip card packaging structure, the conductive material columns are conductive glue, solder paste or solder balls.

[0015] In the metal smart chip card packaging structure described above, the conductive material column is conductive glue, which is a mixture of epoxy resin and filler, and the filler is metal particles or conductive carbon particles.

[0016] The present invention also provides a method for manufacturing the aforementioned metal smart chip card packaging structure. The metal smart chip card includes a card base and a chip module connected to the card base. The card base includes at least five thin sheet material layers stacked from top to bottom: a metal layer, a shielding layer, an antenna layer, a lower plastic layer, and a lower covering film layer. The method comprises the following steps: A. encapsulating the chip module and exposing chip contacts at the bottom; B. sequentially stacking and pressing the thin sheet material layers to form a card base; C. defining a mounting groove on the top surface of the card base that matches the shape of the chip module; D. defining a conductive connection groove at the bottom of the mounting groove, the conductive connection groove being defined at a position corresponding to the conductive contact portion of the radio frequency antenna of the antenna layer, and extending downward until the conductive contact portion is exposed; E. applying conductive glue in the conductive connection groove using a glue dispenser so that the conductive glue protrudes upward; F. installing the chip module in the mounting groove so that the chip contacts of the chip module contact the conductive glue; and G. hot pressing the card base with the chip module installed to securely bond the chip module to the card base.

[0017] Compared with the prior art, the present invention has the following advantages:

[0018] 1. Effectively solve the short circuit risk between the metal layer and the chip contacts. By setting a mounting groove that penetrates the metal layer and the shielding layer in the card base and opening a conductive connection groove at the bottom of the groove, the chip module and the RF antenna are connected through conductive adhesive. This avoids the short circuit problem between the metal layer and the conductive line in traditional welding or wiring methods, significantly improving product reliability.

[0019] 2. This solution achieves stable application of conductive adhesive on metal cards and simplifies the packaging process. Through structural optimization design (such as size control of the conductive connection groove and safe spacing from the metal layer), this solution allows the safe use of conductive adhesive on metal cards, which originally had a short-circuit risk. This not only achieves a stable connection between the chip module and the antenna, but also abandons the traditional welding process, greatly simplifying the manufacturing process and improving production efficiency and yield rate.

[0020] 3. Improve connection stability and process fault tolerance, suitable for large-scale mass production. Through the serpentine conductive contact structure design, multi-point contact method and parameter optimization (such as copper wire width, spacing, conductive slot size, etc.), the stability and tolerance of the conductive connection are effectively enhanced. Even if there are slight deviations during the processing process, it can ensure a reliable connection between the chip and the antenna. It is suitable for high-precision high-end products and large-scale industrial production needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the decomposed structure of the first embodiment of the present invention;

[0022] Figure 2 1 is a schematic diagram of the cross-sectional structure principle of embodiment 1 of the present invention;

[0023] Figure 3 1 is a schematic planar structural diagram of the upper structural layer of the first embodiment of the present invention;

[0024] Figure 4 is a schematic diagram of the planar structure of the antenna layer according to the first embodiment of the present invention;

[0025] Figure 5 is a schematic top view of a chip module according to the first embodiment of the present invention;

[0026] Figure 6 is a side view of a chip module according to the first embodiment of the present invention;

[0027] Figure 7 is a bottom view schematic diagram of the chip module according to the first embodiment of the present invention;

[0028] Figure 8 It is a schematic diagram of the decomposed structure of the second embodiment of the present invention;

[0029] Figure 9 This is a schematic diagram of the cross-sectional structure principle of the second embodiment of the present invention;

[0030] Figure 10 is a schematic diagram of the planar structure of the antenna layer according to the second embodiment of the present invention;

[0031] Figure 11 It is a schematic diagram of the planar structure of the antenna layer of the third embodiment of the present invention. DETAILED DESCRIPTION

[0032] The invention will be further described below with reference to the accompanying drawings:

[0033] The directions described in the specification of the present invention, such as "up", "down", "left", "right", "front", "back", etc., are based on the directions in the accompanying drawings and are intended to facilitate the description of the relationship between the various components. They do not indicate the unique or absolute positional relationship between the various components. They are only one of the implementation methods of the invention and are not a limitation on its implementation method.

[0034] Example 1

[0035] This embodiment introduces a metal smart chip card packaging structure, including a card base 1 and a chip module 11 connected to the card base 1. The card base 1 is composed of an upper structural layer 12, an antenna layer 13 and a lower structural layer 14. Generally, the lower structural layer 14 is composed of a lower plastic layer 141 and a lower coating layer 142, which are used to support the overall structure and provide a certain degree of flexibility and printing adaptability. The magnetic strip 18 for information storage is generally attached to the lower surface of the lower coating layer 142 for compatibility with traditional magnetic card reading and writing equipment. The upper structural layer 12 is composed of a metal layer 121 and a shielding layer 122. The shielding layer 122 is usually made of a magnetic conductive material such as ferrite, which has the function of enhancing the surrounding magnetic field and improving the efficiency of radio frequency identification. At the same time, it can also effectively shield external electromagnetic interference. Its shielding effect refers to the shielding of the metal layer 121 to block and interfere with the signal, thereby ensuring the stability and reliability of chip communication. In addition, functional structures such as a printing layer and a printing protective layer can be set on the upper surface of the metal layer 121 to meet the needs of appearance design, brand identification, anti-counterfeiting identification, etc. Similarly, the lower structure layer 14 can also add a printing layer or a protective layer as needed. Overall, the upper structure layer 12 and the lower structure layer 14 are composed of two or more layers, forming a composite card base structure that is functional, structural, and aesthetically pleasing. Figures 1 to 7As shown, in this embodiment, the card base 1 includes at least a metal layer 121, a shielding layer 122, an antenna layer 13, a lower plastic layer 141, and a lower cover film layer 142, all in the form of thin sheets, stacked in order from top to bottom. An RF antenna 15 is located within the antenna layer 13. This RF antenna 15 has at least two conductive contact portions 150 for electrically connecting to the chip module 11. The card base 1 defines a mounting recess 16 located above the conductive contact portions 150 and for accommodating the chip module 11. This recess 16 penetrates the metal layer 121 and the shielding layer 122, forming a transparent mounting cavity. A conductive connection slot 160 is defined at the bottom of the recess 16, extending downward to the conductive contact portions 150, leaving the conductive contact portions 150 exposed within the recess 160. A conductive material column 17 is disposed within the recess 160. Its lower portion is electrically connected to the conductive contact portions 150, while its upper portion protrudes upward to form a contact terminal with the chip module 11. The chip module 11 has exposed chip contacts 111 after encapsulation, which are electrically connected to the top of the conductive material pillar 17 after being installed in the mounting groove 16. The chip module 11 utilizes a novel encapsulation process, retaining only the chip contacts 111 while the rest of the chip is encapsulated and protected. The number of chip contacts 111 is typically two, but multiple can be designed depending on functional requirements to ensure stable communication with the RF antenna 15. Through the above structural design, the connection between the chip module 11 and the RF antenna 15 is achieved using a gel-like conductive material, eliminating the traditional complex processes of wire picking and bonding, significantly simplifying the manufacturing process while effectively avoiding common problems such as short circuits and poor soldering. The gel-like conductive material can be selected from, but is not limited to, conductive adhesives, solder paste, and solder balls. Conductive adhesives solidify after melting to form a stable connection, while solder paste does not require curing. Solder balls are attached using AFC tape. Conductive adhesives are made from a mixture of epoxy resin and fillers such as metal particles or conductive carbon particles. They exhibit excellent conductivity and adhesion, as well as a certain degree of deformation adaptability, making them suitable for connecting small gaps. Through the combination of the above structure and process, not only the high-integration design of the metal smart chip card is achieved, but also its structural compactness, connection stability and manufacturing efficiency are significantly improved, and it has broad application prospects.

[0036] As a preferred solution, Figures 1 to 4As shown, the conductive contact portion 150 is a coiled, serpentine structure composed of several straight segments 151 and curved segments 152, typically formed from bent copper wire. This structural design offers the following advantages: the serpentine structure increases the length of the conductive contact portion 150, thereby increasing the contact area with the conductive material pillar 17 and enhancing conductive stability. Because the machining of the conductive connection groove 160 may result in positional deviations, the serpentine structure distributes the multiple straight segments 151 at different locations. Even with local deviations, effective contact between at least two straight segments 151 and the conductive material pillar 17 is ensured. The serpentine design allows for more conductive paths within a limited space, improving overall space utilization.

[0037] Furthermore, in this embodiment, three straight segments 151 are preferably exposed in the conductive connection groove 160. The conductive connection groove 160 is circular, with a diameter D1 satisfying 1.0mm≤D1≤2.0mm; the straight segment 151 has a wire thickness diameter d2 satisfying 0.07mm≤d2≤0.15mm; and the spacing between adjacent straight segments 151 is L1 satisfying 0.1mm≤L1≤0.25mm. The purpose of the above parameter design is to: ensure connection stability: even if there is a slight deviation in the slot position or the copper wire installation position, it can ensure that at least three copper wires are located in the conductive connection groove 160, thereby achieving stable conduction; optimize connection tolerance: by reasonably controlling the thickness and spacing of the copper wires, the contact area between the conductive adhesive and the copper wires can be increased, while avoiding short circuits caused by too small spacing; and facilitate manufacturing control: this parameter range is easy to achieve under existing process conditions and is suitable for large-scale production.

[0038] In addition, the minimum distance between the groove wall of the conductive connection groove 160 and the groove wall of the mounting groove 16 is L2, which satisfies L2≥D1. This design has the following advantages: Preventing conductive glue from overflowing and short-circuiting: Since the conductive glue has a certain fluidity when it is not solidified, by setting The distance between the conductive adhesive and the metal layer 121 can effectively limit the diffusion of the conductive adhesive to the surrounding areas, preventing it from contacting the metal layer 121 and causing a short circuit; improving structural reliability: considering that the deformation range of the conductive adhesive is usually less than one-fifth of the diameter of the conductive connection groove, this spacing design can completely avoid the risk of accidental contact; facilitating assembly tolerance control: reserving sufficient space can adapt to different assembly precision requirements and improve the yield rate.

[0039] The manufacturing method of the above-mentioned metal smart chip card packaging structure includes the following steps:

[0040] A. Encapsulate the chip module 11 and expose the chip contacts 111 at the bottom. A packaging process is used to encapsulate the customized strip, chip, etc., leaving only two chip contacts 111 exposed. This step can use flip-chip packaging, wire bonding, and other processes. The appropriate packaging method is selected based on the chip's functional requirements.

[0041] B. The various sheet material layers are sequentially stacked and pressed together to form a card base 1. From top to bottom, the five sheet material layers are stacked in order: metal layer 121, shielding layer 122, antenna layer 13, lower plastic layer 141, and lower covering film layer 142. Heat pressing and lamination processes are used to achieve a tight bond between the materials, ensuring the stability and mechanical strength of the overall structure.

[0042] C. A mounting groove 16 having a shape matching that of the chip module 11 is provided on the upper surface of the card base 1. A groove cavity having a shape matching that of the chip module 11 is milled out using a high-precision CNC or a small milling machine. The groove cavity can be a through groove running through the upper and lower parts, or a countersunk groove segmented into upper and lower parts, and can be flexibly designed according to actual needs.

[0043] D. Create a conductive connection groove 160 at the bottom of the mounting groove 16. This groove 160 is located at a position corresponding to the conductive contact portion 150 of the RF antenna 15 on the antenna layer 13, and its depth is sufficient to expose the conductive contact portion 150. In this step, parameters such as the thickness of the RF antenna 15 copper wire, the bend spacing of the copper wires in the conductive contact portion 150, and the diameter of the conductive connection groove 160 are pre-set to ensure that at least two copper wires are exposed in the conductive connection groove 160.

[0044] E. Use a glue dispenser to apply conductive glue in the middle of the conductive connection groove 160. The conductive glue is in a gel-like state before curing. The glue dispenser controls the glue amount and shape so that the conductive glue protrudes upward to form a conductive material column 17. The top of the conductive material column 17 protruding upward needs to be higher than the position of the chip contact 111 after the chip module 11 is installed. This step requires controlling the glue dispensing accuracy to ensure that the conductive glue is evenly distributed and in good contact with the copper wire.

[0045] F. Install the chip module 11 in the mounting groove 16 so that the chip contacts 111 of the chip module 11 are in contact with the conductive adhesive. This step should be completed before the conductive adhesive solidifies to ensure a good conductive connection.

[0046] G. Hot pressing the card base 1 with the chip module 11 installed to securely bond the chip module 11 to the card base 1, forming a finished product. The temperature, pressure, and time of the hot pressing process must be controlled to ensure that the conductive adhesive is fully cured while not affecting the chip's functionality.

[0047] Subsequent steps may include but are not limited to the following processes: coating or printing out printed patterns, texts, etc., setting up magnetic strips 18, testing, packaging, etc.

[0048] Example 2

[0049] This embodiment introduces a metal smart chip card packaging structure, which is different from the first embodiment in that the composition structure of the upper structural layer 12 is different.

[0050] like Figures 8 to 10As shown, in this embodiment, the upper structural layer 12 includes an upper film layer 123 and an upper plastic layer 124 stacked together, the upper film layer 123 covers the upper surface of the plastic layer, and the mounting groove 16 passes through the upper film layer 123 and the upper plastic layer 124.

[0051] Furthermore, a metal sheet 131 is embedded within the antenna layer 13. Specifically, the card base 1 comprises at least an upper film layer 123, an upper plastic layer 124, an antenna layer 13, a lower plastic layer 141, and a lower film layer 142, all in the form of thin sheets stacked in order from top to bottom. This structure uses metal material that doesn't cover the entire antenna layer but is embedded within it via the metal sheet 131. This preserves the metal material for added structural strength while minimizing the impact on the antenna signal.

[0052] As a preference, Figure 10 As shown, the RF antenna 15 in the antenna layer 13 surrounds the edge of the antenna layer 13, while the metal sheet 131 is placed in two areas: one inside the area surrounded by the RF antenna 15 to enhance the compressive strength of the central area; and the other outside the RF antenna 15, forming the edges of the antenna layer 13, to enhance the edge's resistance to deformation. This structure provides high deformation resistance while preventing the metal material from shielding the RF signal, resulting in an optimized design that balances structural strength and communication performance.

[0053] Example 3

[0054] This embodiment introduces a metal smart chip card packaging structure, which differs from the second embodiment in that the arrangement of the metal sheet 131 in the antenna layer 13 is different.

[0055] like Figure 11 As shown, in this embodiment, the RF antenna 15 in the antenna layer 13 also surrounds the edge area of ​​the antenna layer 13, while the metal sheet 131 is only provided in the inner area surrounded by the RF antenna 15. This structural design further simplifies the arrangement of the metal sheets while retaining the structural strength, reduces the manufacturing complexity, and is suitable for application scenarios with moderate requirements for structural strength and high requirements for process simplification. The advantages of this structure include: only arranging the metal sheet inside the RF antenna, reducing material usage and processing steps; simplifying the process, eliminating the need to embed the metal sheet in the edge area, and improving production efficiency; low signal interference, avoiding interference of the metal sheet on the signal path in the edge area of ​​the antenna; suitable for large-scale mass production: suitable for products such as transportation cards and access control cards that do not require high metal texture but are sensitive to cost and efficiency.

[0056] The above is only an embodiment of the present invention, and the common knowledge such as the specific structure and characteristics of the scheme is not described in detail here. It should be pointed out that for those skilled in the art, without departing from the structure of the present invention, several variations and improvements can be made, which should also be regarded as the scope of protection of the present invention, and these will not affect the effect of the implementation of the present invention and the practicality of the patent. The scope of protection required by this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A metal smart chip card packaging structure, comprising a card base (1) and a chip module (11) connected to the card base (1), wherein the card base (1) comprises at least an upper structural layer (12), an antenna layer (13) and a lower structural layer (14) in a thin sheet shape and stacked in sequence, and characterized in that: The antenna layer (13) is provided with a radio frequency antenna (15), and the radio frequency antenna (15) has at least two conductive contact parts (150). The card base (1) is provided with a mounting groove (16) located above the conductive contact part (150) and used to accommodate the chip module (11). The bottom of the mounting groove (16) is provided with a conductive connection groove (160) extending downward to the conductive contact part (150). The bottom of the chip module (11) has a chip contact (111) exposed after packaging. The conductive connection groove (160) is provided with a conductive material column (17) with a lower portion conductively connected to the conductive contact part (150) and an upper portion protruding upward and conductively connected to the chip contact (111).

2. The metal smart chip card packaging structure according to claim 1, characterized in that: The upper structural layer (12) comprises a stacked metal layer (121) and a shielding layer (122); the shielding layer (122) is sandwiched between the metal layer (121) and the antenna layer (13); and the mounting groove (16) passes through the metal layer (121) and the shielding layer (122).

3. The metal smart chip card packaging structure according to claim 1, wherein: The upper structural layer (12) comprises an upper film layer (123) and an upper plastic layer (124) which are stacked, the upper film layer (123) covering the upper surface of the upper plastic layer (124), the mounting groove (16) passing through the upper film layer (123) and the upper plastic layer (124), and a metal sheet (131) embedded in the antenna layer (13).

4. The metal smart chip card packaging structure according to any one of claims 1 to 3, characterized in that: The lower structural layer (14) comprises a lower plastic layer (141) and a lower coating layer (142) which are stacked together. The lower surface of the lower coating layer (142) is connected to a magnetic strip (18) for storing information.

5. The metal smart chip card packaging structure according to any one of claims 1 to 3, characterized in that: The conductive contact portion (150) is a serpentine structure formed by winding, so that the conductive contact portion (150) is composed of a plurality of straight segments (151) and curved segments (152) connected together, wherein at least two straight segments (151) are exposed in the conductive connection groove (160).

6. The metal smart chip card packaging structure according to claim 5, characterized in that: Three straight segments (151) are exposed in the conductive connection groove (160), the conductive connection groove (160) is circular, and its diameter is D1, then 1.0mm≤D1≤2.0mm, the line thickness diameter of the straight segment (151) is d2, then 0.07mm≤d2≤0.15mm, and the spacing between adjacent straight segments (151) is L1, then 0.1mm≤L1≤0.25mm.

7. The metal smart chip card packaging structure according to claim 6, characterized in that: The minimum distance between the groove wall of the conductive connection groove (160) and the groove wall of the mounting groove (16) is L2, then 8. The metal smart chip card packaging structure according to any one of claims 1 to 3, characterized in that: The conductive material column (17) is conductive glue, solder paste or solder ball.

9. The metal smart chip card packaging structure according to claim 8, characterized in that: The conductive material column (17) is conductive glue, which is a mixture of epoxy resin and filler, and the filler is metal particles or conductive carbon particles.

10. A method for manufacturing a metal smart chip card packaging structure, wherein the metal smart chip card comprises a card base (1) and a chip module (11) connected to the card base (1), wherein the card base (1) comprises at least five sheet material layers stacked from top to bottom, namely, a metal layer (121), a shielding layer (122), an antenna layer (13), a lower plastic layer (141), and a lower covering film layer (142), wherein: The following steps are involved: A. The chip module (11) is packaged and the chip contacts (111) are exposed at the bottom; B. stacking and pressing the various flaky material layers in sequence to form a card base (1); C. A mounting groove (16) having a shape matching that of the chip module (11) is provided on the upper surface of the card base (1); D. A conductive connection groove (160) is provided at the bottom of the installation groove (16), and the conductive connection groove (160) is provided at the conductive contact portion (150) of the radio frequency antenna (15) of the antenna layer (13). At the corresponding position, the conductive connection groove (160) is opened from top to bottom until the conductive contact portion is exposed; E. Using a glue dispenser, apply conductive glue in the conductive connection groove (160) so that the conductive glue protrudes upward; F. Installing the chip module (11) in the installation groove (16) and making the chip contacts (111) of the chip module (11) contact the conductive adhesive; G. Hot pressing the card base (1) on which the chip module (11) is installed, so that the chip module (11) is fixedly bonded to the card base (1).

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