Conductive pin and electronic equipment test socket equipped with conductive pin
Through the design of conductive pins, the conductive pins manufactured by stamping achieve stable contact during electronic equipment testing, solving the processing difficulties and assembly complexity of Pogo pins in the existing technology and adapting to the fine pitch requirements of semiconductor products.
Patent Information
- Application Number
- CN202411384807.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-03-20
- Filing Date
- 2024-09-30
- Publication Date
- 2025-09-23
AI Technical Summary
In the existing technology, it is difficult to achieve precise processing and stable electrical connection of Pogo pins between semiconductor devices and test equipment, and the assembly process is complicated, especially in terms of fine pitch and electrical connection stability.
It adopts a conductive pin design, including first and second contact parts, a connecting part and an extension rod. It is manufactured by stamping without the need for a separate assembly process, and uses an elastic connecting part and a tip structure to ensure stable contact.
It achieves stable electrical connections without the need for a separate assembly process during electronic equipment testing, improves processing accuracy and connection stability, and adapts to the needs of semiconductor product technology development.
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Figure CN120691147A_ABST
Abstract
Description
[0001] CROSS-REFERENCE TO RELATED APPLICATIONS
[0002] This application claims priority from Korean Patent Application No. 10-2024-0038388, filed on Mar. 20, 2024, which is hereby incorporated by reference herein in its entirety for all purposes. Technical Field
[0003] The present disclosure relates to a conductive pin and an electronic device test socket equipped with the conductive pin. Background Art
[0004] Typically, a stable electrical connection needs to be established between a semiconductor device and test equipment to test the electrical characteristics of an electronic device such as a semiconductor device. To achieve this electrical connection, a test socket is required.
[0005] A typical test socket includes multiple pogo pins.
[0006] Figure 1 A cross-sectional view of a pogo pin 100 is shown according to a conventional embodiment.
[0007] Pogo pins 100 are used to facilitate connection between semiconductor devices and test equipment and are used in most test sockets due to their mechanical shock absorption and electrical properties.
[0008] The Pogo pin 100 is generally made of metal, and a spring s is inserted into the barrel 110 together with at least one of the two plungers p1 and p2 to support the plungers p1 and p2. Therefore, the plungers p1 and p2 receive forces from the spring s in opposite directions.
[0009] However, plugs p1 and p2 are typically cut into three-dimensional shapes, making them difficult to precisely process, and as semiconductor product technology advances, these plugs are becoming an obstacle to coping with fine pitches.
[0010] Furthermore, a gap (clearance) must be left between the plungers p1 and p2 inserted into the barrel 110 and the spring s to allow for smooth movement, and this gap must be within an acceptable range. Furthermore, the gaps between the plungers p1 and p2 and the barrel 110 must be caulked. To ensure stable electrical connections between the plungers p1 and barrel 110, and between the barrel 110 and the plunger p2, the diameter tolerances (clearances) between the plungers p1 and p2 and the barrel 110 must be managed, which presents difficulties during the production and assembly process.
[0011] Korean Patent No. 10-2046808 discloses a bidirectional conductive pin that can be manufactured by stamping without requiring an assembly process, and discloses a bidirectional conductive module using the bidirectional conductive pin and a manufacturing method thereof.
[0012] However, this case has a problem in that since the upper and lower contact bars 340 come into contact along the inner slope of the pin contact portion 322 , it is expected that it is difficult to maintain stable contact between the pin contact portion 322 and the upper and lower contact bars 340 . Summary of the Invention
[0013] Therefore, the present disclosure has been made in consideration of the above-mentioned problems occurring in the related art, and aims to provide a conductive pin that can be manufactured by stamping without requiring a separate assembly process, and an electronic device test socket equipped with the conductive pin.
[0014] In addition, an object of the present disclosure is to provide a conductive pin capable of maintaining stable contact during an electronic device test process and an electronic device test socket equipped with the conductive pin.
[0015] In order to achieve the above-mentioned objectives, according to an embodiment of the present disclosure, a conductive pin is provided, which includes: a first contact portion, capable of contacting a first electronic device; a second contact portion, capable of contacting a second electronic device; a connecting portion, configured to connect the first contact portion and the second contact portion, and having an empty internal space, wherein at least some parts of the connecting portion are elastic; and an extension rod, bent from the first contact portion, and extending toward the second contact portion through the internal space of the connecting portion.
[0016] In a cross-sectional view, the extension rod may extend obliquely from the interior space of the connecting portion toward the second contact portion. When pressure is applied to the first contact portion and the second contact portion, the extension rod may move toward the second contact portion and contact the inner wall surface of the second contact portion. The inner wall surface contacted by the extension rod and the second contact portion may be flat.
[0017] The connecting portion may include: a spring portion having elasticity; at least one first protrusion located between the first contact portion and the spring portion; and at least one second protrusion located between the second contact portion and the spring portion. When viewed from the side, the at least one first protrusion and the at least one second protrusion may protrude further than the first contact portion and the second contact portion, respectively.
[0018] The second contact portion may include: a second body having a hollow interior space; a tip portion 2-1 extending from the second body and capable of contacting a second electronic device; and a tip portion 2-2 extending from the second body and located opposite the tip portion 2-1. When viewed from the side, the tip portion 2-1 and the tip portion 2-2 may be angled relative to each other. Furthermore, the height of the tip portion 2-1 may be greater than the height of the tip portion 2-2, and the tip portion 2-1 may have a sharp end, while the tip portion 2-2 may have a blunt end.
[0019] The second body may include: a second slit penetrating the wall of the second body in a longitudinal direction; and a second window connected to the second slit and penetrating the wall of the second body but having a width greater than that of the second slit.
[0020] The conductive pin and the electronic device test socket equipped with the conductive pin according to the present disclosure can be manufactured by stamping without a separate assembly process, and can maintain stable contact during the electronic device testing process. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] The above and other objects, features and other advantages of the present disclosure will be more clearly understood from the following detailed description in conjunction with the accompanying drawings, in which:
[0022] Figure 1 is a cross-sectional view of a pogo pin according to a conventional embodiment;
[0023] Figure 2 is a perspective view of a conductive pin according to an embodiment;
[0024] Figure 3 is a cross-sectional view of a conductive pin according to an embodiment;
[0025] Figure 4 is a first side view of a conductive pin according to an embodiment;
[0026] Figure 5 is a second side view of a conductive pin according to an embodiment;
[0027] Figure 6 is a perspective view of a pressing conductive pin according to an embodiment;
[0028] Figure 7 is an enlarged view of a second contact portion of a conductive pin according to one embodiment; and
[0029] Figure 8 FIG. 1 is a schematic diagram showing conductive pins installed in a housing of an electronic device test socket according to an embodiment. DETAILED DESCRIPTION
[0030] Hereinafter, conductive pins and electronic device test sockets equipped with the conductive pins according to embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The following embodiments of the present disclosure are intended only to further illustrate the present disclosure and are not intended to limit or restrict the scope of the present disclosure. It should be understood that any content that can be readily inferred by an expert in the technical field of the present disclosure from the detailed description and examples herein falls within the scope of the present disclosure.
[0031] Figures 2 to 5 1 and 2 show a perspective view, a cross-sectional view, a first side view and a second side view of a conductive pin 200 according to an embodiment. Figure 61 shows a perspective view of pressing the conductive pin according to an embodiment. For reference, Figure 2 is a perspective view showing a state where no pressure is applied to the conductive pin 200 according to an embodiment.
[0032] Figure 7 is an enlarged view of the second contact portion 220 of the conductive pin 200 according to an embodiment, Figure 8 FIG. 1 is an explanatory diagram showing that the conductive pin 200 according to the embodiment is installed in the housing H of the electronic equipment test socket.
[0033] Reference Figures 2 to 8 , the conductive pin 200 according to the embodiment will be described in detail.
[0034] The conductive pin 200 according to the embodiment is manufactured by stamping using a single metal plate without a separate assembly process, and may include a first contact portion 210 , a second contact portion 220 , a connecting portion 230 , and an extending rod 240 .
[0035] The first contact portion 210 can be in contact with a first electronic device. In this case, the first electronic device is a type of electronic device, such as a semiconductor device to be tested or a test device.
[0036] The first contact portion 210 includes: a first body 211 having an empty internal space; a 1-1 tip 212 formed by extending from the first body 211 and capable of contacting the first electronic device; and a 1-2 tip 213 formed by extending from the first body 211 and located at a position opposite to the 1-1 tip 212.
[0037] The first body 211 has a first slit SL1 that penetrates the wall of the first body 211 in the longitudinal direction. The first body 211 is hexahedral in shape, with four walls having gently curved corners. The upper and lower surfaces of the first body 211 are both hollow surfaces. In other words, the middle portions of the four walls are flat.
[0038] As can be seen from the first and second side views, tip 1-1 212 and tip 1-2 213 are angled relative to each other. Furthermore, tip 1-1 212 is higher than tip 1-2 213, ensuring that only tip 1-1 212 comes into contact with the first electronic device during testing. Tip 1-2 213 maintains the balance of conductive pin 200. In some cases, tip 1-2 213 can support tip 1-1 212 when pressure is applied to it.
[0039] The end of the 1-1 tip portion 212 that contacts the first electronic device is sharp, while the end of the 1-2 tip portion 213 is blunt. That is, the 1-1 tip portion 212 is triangular, while the end of the 1-2 tip portion 213 is gently curved.
[0040] The structure of the second contact portion 220 is similar to that of the first contact portion 210 .
[0041] Specifically, the second contact portion 220 can be in contact with a second electronic device. In this case, the second electronic device is another electronic device, such as a semiconductor device to be tested or a test device.
[0042] The second contact portion 220 includes: a second body 221 having an empty internal space; a 2-1 tip 222 formed by extending from the second body 221 and capable of contacting a second electronic device; and a 2-2 tip 223 formed by extending from the second body 221 and located at a position opposite to the 2-1 tip 222.
[0043] The second body 221 has a second slit SL2 extending longitudinally through the wall of the second body 221, and a second window W2 extending from the second slit SL2 and extending through one wall of the second body 221, but having a width wider than the second slit SL2. The second body 221 is hexahedral, with four walls having gently curved corners. Both the top and bottom surfaces of the second body 221 are hollow. In other words, the middle portion of each of the four walls is flat. The second window W2 serves as an inlet for the plating solution to flow smoothly during the electroplating process after the conductive pin 200 is formed.
[0044] As can be seen from the first and second side views, tip 222 of 2-1 and tip 223 are angled relative to each other. Furthermore, tip 222 of 2-1 is higher than tip 223 of 2-2, so that during testing, only tip 222 of 2-1 comes into contact with the second electronic device. Tip 223 of 2-2 maintains the balance of conductive pin 200. In some cases, tip 223 of 2-2 can support tip 222 of 2-1 when pressure is applied to it.
[0045] The end of the 2-1 tip portion 222 that contacts the second electronic device is sharp, while the end of the 2-2 tip portion 223 is blunt. That is, the 2-1 tip portion 222 is triangular, while the end of the 2-2 tip portion 223 is gently curved.
[0046] For reference, the 1-1 tip 212 and the 2-1 tip 222 are positioned facing each other, while the 1-2 tip 213 and the 2-2 tip 223 are positioned facing each other. In other words, as can be seen from the first side view, the 1-1 tip 212 is located on the left, and the 2-1 tip 222 is located on the right. This arrangement of tips 212, 213, 222, and 223 maintains the balance of the conductive pin 200.
[0047] The connecting portion 230 connects the first contact portion 210 and the second contact portion 220 , has a hollow inner space, and at least some portions thereof have elasticity.
[0048] Specifically, the connection portion 230 has a spring portion 231 , a first protruding portion 232 , and a second protruding portion 233 .
[0049] The spring portion 231 is a spring-shaped portion having elasticity, that is, during a test, when the first contact portion 210 and the second contact portion 220 are pressed, the spring shape is compressed.
[0050] The first protruding portion 232 extends from the first contact portion 210, connecting the first contact portion 210 and the spring portion 231. It includes a first extension portion E1 and at least one first protrusion PJ1 located between the first contact portion 210 and the spring portion 231. The width of the first extension portion E1 extending from the first contact portion 210 is significantly greater than the spring thickness of the spring portion 231. Furthermore, the first protruding portion 232 may include a first protrusion PJ1 on at least one of the left and right sides of the first extension portion E1 extending from the first contact portion 210. For reference, in the conductive pin 200 according to the embodiment, only one first protrusion PJ1 is shown. The thickness of the first protrusion PJ1 is also greater than the spring thickness of the spring portion 231. Furthermore, when the first contact portion 210 and the second contact portion 220 are pressed, the first protruding portion 232 is not compressed. For reference, the thickness of the first protrusion PJ1 and the spring thickness refer to the vertical height in the first and second side views. The width of the first extension portion E1 refers to the horizontal width in the first and second side views.
[0051] As can be seen from the first and second side views, the at least one first protrusion PJ1 protrudes further than the spring portion 231. For reference, the width of the spring portion 231 is the same as the width of the first body 211 or the second body 221. That is, in the first and second side views, the shape of the at least one first protrusion PJ1 protrudes further to the left or right than the first contact portion 210 and the second contact portion 220.
[0052] In addition, each of the at least one first protrusion PJ1 has a width greater than the left or right side of the spring portion 231 and is bent into a " " shape, but its corners form gentle curves.
[0053] The second protruding portion 233 is similar to the first protruding portion 232 .
[0054] Specifically, the second protruding portion 233 extends from the second contact portion 220, connecting the second contact portion 220 and the spring portion 231. It includes a second extension portion E2 and at least one second protrusion PJ2 located between the second contact portion 220 and the spring portion 231. The width of the second extension portion E2 extending from the second contact portion 220 is significantly greater than the spring thickness of the spring portion 231. Furthermore, the second protruding portion 233 may include a second protrusion PJ2 on at least one of the left and right sides of the second extension portion E2 extending from the second contact portion 220. For reference, in the conductive pin 200 according to the embodiment, two second protrusions PJ2 are shown. The thickness of the second protrusion PJ2 is also greater than the spring thickness of the spring portion 231. Furthermore, when the first contact portion 210 and the second contact portion 220 are pressed, the second protruding portion 233 is not compressed. For reference, the thickness of the second protrusion PJ2 and the spring thickness refer to the vertical height in the first and second side views. Furthermore, the width of the second extension portion E2 refers to the horizontal width in the first and second side views.
[0055] As can be seen from the first and second side views, the at least one second protrusion PJ2 protrudes further than the spring portion 231. For reference, the width of the spring portion 231 is the same as the width of the first body 211 or the second body 221. That is, in the first and second side views, the shape of the at least one second protrusion PJ2 protrudes further to the left or right than the first contact portion 210 and the second contact portion 220.
[0056] In addition, each of the at least one second protrusion PJ2 has a width greater than the left or right side of the spring portion 231 and is bent into a " " shape, but its corners form gentle curves.
[0057] Due to the at least one first protrusion PJ1 and the at least one second protrusion PJ2 , when the conductive pin 200 is inserted into the housing H of the socket and stored, the conductive pin 200 can be prevented from being removed from the housing H.
[0058] When pressure is applied to the first contact portion 210 and the second contact portion 220 during a test, the extension rod 240 enables a quick and stable electrical connection between the first contact portion 210 and the second contact portion 220 .
[0059] Extension rod 240 is formed by bending from first contact portion 210 and extending through the interior space of connecting portion 230 toward second contact portion 220. Specifically, extension rod 240 includes a straight portion 241 that bends from and connects to first contact portion 210, and an annular portion 242 that connects to straight portion 241 and protrudes in an annular shape at the distal end of extension rod 240. The portion connecting extension rod 240 to first contact portion 210 is not an extension of 1-1 tip 212 and 1-2 tip 213 of first body 211, but rather a portion between the extensions of 1-1 tip 212 and 1-2 tip 213.
[0060] As seen from the cross-sectional view, the straight portion 241 extends obliquely toward the second contact portion 220 in the inner space of the connecting portion 230. In addition, the annular portion 242 has a protruding "C" shape relative to the straight portion 241.
[0061] When pressure is applied to first contact portion 210 and second contact portion 220, extension rod 240 moves toward second contact portion 220, causing the inner wall surface of second contact portion 220 to contact annular portion 242. Linear portion 241 extends obliquely toward second contact portion 220 within the interior space of connecting portion 230. With annular portion 242 protruding from its end, extension rod 240 can maintain stable contact with second contact portion 220 when pressure is applied to first contact portion 210 and second contact portion 220. Annular portion 242 does not contact second contact portion 220 unless pressure is applied to first contact portion 210 and second contact portion 220.
[0062] The extension rod 240 operates by pushing the inner wall of the second contact portion 220. The angle or width of the diagonal line, the shape of the annular portion 242, and the size of the annular portion 242 can be adjusted to adjust the force with which the extension rod 240 pushes the inner wall of the second contact portion 220. Furthermore, as can be seen from the cross-sectional view, the width of the extension rod 240 is smaller than the inner diameter of the first body 211 or the second body 221.
[0063] In addition, when pressure is applied to the first contact portion 210 and the second contact portion 220, the inner wall surface of the extension rod 240 in contact with the second contact portion 220 is flat, and thus can maintain wider and more stable contact with the second contact portion 220. That is, by having the second body 221 have a flat inner wall surface, the extension rod 240 and the second contact portion 220 can stably contact over a wide area.
[0064] The electronic device test socket according to the embodiment has a plurality of conductive pins 200 mounted in a housing H.
[0065] Features of the conductive pin 200 and the electronic device test socket equipped with the conductive pin 200 according to an embodiment of the present disclosure are summarized below.
[0066] The extension rod 240 has a certain inclination so as to contact the planar inner wall surface of the second body 221, and is bent into a V-shaped contact rod shape so as to maintain contact with the inner wall surface of the second body 221. In addition, before pressing the first contact portion 210 and the second contact portion 220, the basic shape of the extension rod 240 is that the extension rod 240 does not contact the inner wall surface of the second body 221, so as to facilitate the electroplating process.
[0067] The conductive pin 200 according to the embodiment is formed by forming a plate-like material into a spring shape with tension, and then folding the spring-shaped plate-like material into a square shape. In addition, the first protruding portion 232 and the second protruding portion 233 at the upper and lower portions of the spring portion 231 are folded to a greater extent than the first contact portion 210 and the second contact portion 220, so as to serve as a catch jaw when the conductive pin 200 is assembled into the housing H.
[0068] The conductive pin 200 according to the embodiment is a single-piece pin made from a single plate. Since no physical spring is used, the connecting portion 230 of the conductive pin 200 has a spring shape derived from the plate itself to maintain elasticity in the vertical direction. The conductive pin 200 according to the embodiment uses a plate-shaped material that is easy to stamp, such as BeCu. In addition, after the shape is achieved through stamping, a heat treatment process is performed to increase the strength of the conductive pin 200 and enhance the elasticity of the spring. In addition, after the heat treatment, the conductive pin 200 is also subjected to a gold plating process to improve the conductivity and corrosion resistance, thereby improving the electrical properties of the material and preventing oxidation during use.
[0069] Furthermore, the electronic device test socket according to the embodiment absorbs mechanical shock transmitted by contact between the first electronic device and the second electronic device, and electrically connects the first electronic device and the second electronic device to check whether there is an electrical defect.
[0070] As described above, the conductive pin 200 and the electronic device test socket equipped with the conductive pin 200 according to the embodiment can be manufactured by stamping without a separate assembly process and can maintain stable contact during electronic device testing.
Claims
1. A conductive pin, comprising: a first contact portion capable of contacting a first electronic device; a second contact portion capable of contacting a second electronic device; a connecting portion configured to connect the first contact portion and the second contact portion and having a hollow interior space, wherein at least some portion of the connecting portion is elastic; as well as An extension rod is bent from the first contact portion and extends toward the second contact portion through an inner space of the connecting portion.
2. The conductive pin according to claim 1, wherein: From a cross-sectional view, the extension rod extends obliquely from the inner space of the connecting portion toward the second contact portion.
3. The conductive pin according to claim 2, wherein: When pressure is applied to the first contact portion and the second contact portion, the extension rod moves toward the second contact portion and contacts an inner wall surface of the second contact portion, and the inner wall surface where the extension rod contacts the second contact portion is flat.
4. The conductive pin according to claim 1, wherein: The connecting portion includes: The spring part has elasticity; at least one first protrusion located between the first contact portion and the spring portion; and at least one second protrusion located between the second contact portion and the spring portion, Wherein, as seen from a side view, the at least one first protrusion and the at least one second protrusion protrude further than the first contact portion and the second contact portion, respectively.
5. The conductive pin according to claim 1, wherein: The second contact portion includes: a second body having an empty interior space; 2-1 a tip portion formed by extending from the second body and capable of contacting the second electronic device; and The 2-2 tip portion is formed by extending from the second body and is located opposite to the 2-1 tip portion.
6. The conductive pin according to claim 5, wherein: From a side view, the 2-1 tip and the 2-2 tip are angled with each other, and the height of the 2-1 tip is greater than the height of the 2-2 tip.
7. The conductive pin according to claim 5, wherein: The end of the 2-1 tip is sharp, and the end of the 2-2 tip is blunt.
8. The conductive pin according to claim 5, wherein: The second body includes: a second slit penetrating the wall of the second body in the longitudinal direction; and The second window is connected to the second slit and penetrates the wall of the second body, but has a width greater than that of the second slit.
9. An electronic equipment test socket equipped with the conductive pin according to claim 1.
Citation Information
Patent Citations
By-directional electrically conductive pin, by-directional electrically conductive module and manufacturing method thereof
KR102046808B1