Cable assembly with integrated filter

Abstract

A power cable assembly includes a cable portion and a connector housing portion coupled to the cable portion. The cable portion includes a first electrical conductor circumferentially wrapped by a first set of layers. The first set of layers includes a first semiconductor layer, a first insulating layer, a second semiconductor layer, a magnetic layer, a second insulating layer, and an electrically conductive sleeve. The connector housing portion includes a connector housing, a printed circuit board disposed within the connector housing, and a set of capacitors mounted to the printed circuit board and coupled to the magnetic layer.

Description

Technical Field

[0001] The present disclosure relates to electromagnetic shielding and filtering for electrical conductors. More particularly, the present disclosure relates to power cables circumferentially wrapped by one or more layers. Background Art

[0002] Commercial aircraft and other applications, including industrial, commercial, and residential applications, typically include electrical power distribution systems. The purpose of an electrical power distribution system is to distribute electrical power to loads, protect the lines and loads from hazards, and route the most appropriate power source to each load. Such electrical power distribution systems typically include flexible conductive cables or rigid busbars with insulation and shielding to transmit signals (such as power or data signals) from a source to a destination (such as a device or application). In operation, the conductive cables may be a source of electromagnetic interference (EMI) that is radiated, conducted, or both. BRIEF DESCRIPTION OF THE DRAWINGS

[0003] In the figure:

[0004] Figure 1 is an isometric view of a power cable assembly according to aspects as described herein.

[0005] Figure 2 According to the aspects described herein Figure 1 An isometric view of a portion of a power cable assembly.

[0006] Figure 3A depiction Figure 1 Non-limiting aspects of the power cable assembly further comprising a ring electromagnetic interference filter according to aspects as described herein.

[0007] Figure 3B depiction Figure 1 Another non-limiting aspect of the power cable assembly further includes a ring electromagnetic interference filter according to aspects as described herein.

[0008] Figure 3C depiction Figure 1 Yet another non-limiting aspect of the power cable assembly further includes a set of annular electromagnetic interference filters defining a set of clamps according to aspects as described herein.

[0009] Figure 4 Depicting an embodiment according to aspects as described herein Figure 1 An end view of a cross section of a non-limiting aspect of a cable portion of a power cable assembly.

[0010] Figure 5 Depicting an embodiment according to aspects as described herein Figure 1 An end view cross section of another non-limiting aspect of a cable portion of a power cable assembly.

[0011] Figure 6 Depicts a method for assembling a system according to aspects described herein. Figure 1 A flow chart of a method for a power cable assembly. DETAILED DESCRIPTION

[0012] Aspects of the present disclosure are directed to insulated, shielded electrical conductors. For illustrative purposes, the present disclosure will be described with respect to flexible power cables such as those used in power distribution systems (e.g., power distribution systems for aircraft). The present disclosure may have applicability in a variety of electrical conductors and power distribution systems, and may be used to provide benefits in other industrial, commercial, military, and residential applications. Further non-limiting examples of other vehicles or engines to which the present disclosure may relate may include ships, helicopters, vehicles, or other water, air, space, or land vehicles. Industrial, commercial, or residential applications of the present disclosure may include, but are not limited to, marine power equipment, wind turbines, hybrid electric machines, or low-power devices. However, it will be understood that the present disclosure is not so limited, and may have general applicability in non-aircraft applications, such as power distribution requirements in power distribution applications for non-aircraft.

[0013] The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. In addition, all aspects described herein should be considered as exemplary unless specifically identified otherwise.

[0014] As used herein, the terms "first," "second," and "third," etc., may be used interchangeably to distinguish one component from another and are not intended to represent the position or importance of a separate component. Unless the context clearly indicates otherwise, the singular forms "a," "an," and "the" include plural references. Additionally, as used herein, the terms "group" or "group" of elements may be any number of elements, including only one. All directional references (e.g., radial, axial, proximal, distal, upper, lower, upward, downward, left, right, lateral, front, rear, top, bottom, above, below, vertical, horizontal, clockwise, counterclockwise, upstream, downstream, rear, etc.) are provided solely for identification purposes to help the reader understand the present disclosure and do not create limitations, particularly with respect to the position, orientation, or use of the present disclosure.

[0015] Unless otherwise indicated, connection references (eg, attached, coupled, connected, and joined) are to be construed broadly and may include intermediate components between a set of elements and relative movement between elements. As such, connection references do not necessarily infer that two elements are directly connected and in fixed relation to each other.

[0016] As used herein, elements being "electrically connected," "electrically coupled," or "in signal communication" includes electrical transmission or signals being sent, received, or communicated to or from such connected or coupled elements. In addition, such electrical connections or couplings may include wired or wireless connections, or a combination thereof. In non-limiting examples, the connection or disconnection may be selectively configured to provide, enable, disable, etc., an electrical connection between the respective elements. The electrical connection or disconnection of the non-limiting examples may be enabled or operated by means of a switch, busbar logic, or any other connector configured to enable or disable energization of an electrical load downstream of the connection. In addition, while terms such as "voltage," "current," and "power" may be used herein, it will be apparent to those skilled in the art that these terms may be interrelated when describing aspects of circuits or circuit operations.

[0017] As used herein, the terms "electrically insulating," "insulator," or "insulation" refer to materials that exhibit low electrical conductivity, for example, less than about 10-8 Siemens per meter (S / m). Unless otherwise specified, as used herein, the term "insulating" refers to electrical insulation, and the term "insulator" refers to an electrical insulator.

[0018] As used herein, the term "conductivity" refers to the property of a material that allows an electric charge or electric current to flow through it. Furthermore, as used herein, the term "electrical conductor" refers to a material that exhibits relatively high electrical conductivity (e.g., greater than about 10-7 S / m). Unless otherwise specified, as used herein, the term "conductive" refers to electrical conductivity, and the term "conductor" refers to an electrical conductor.

[0019] As used herein, the term "semiconducting" refers to the property of a material having an electrical conductivity value that falls between those of conductors and insulators (e.g., about 10-2 to 10-4 S / m). Furthermore, as used herein, the term "semiconductor" refers to a semiconductor material.

[0020] As used herein, the term "ground," "electrical ground," or "system ground" refers to a reference point in an electrical circuit from which voltage can be measured or referenced. As used herein, "ground" provides a common return path for electrical current. For example, in the context of a power system in an aircraft, in some instances, the "electrical ground" may be the internal metal chassis, or the external frame of the fuselage of the aircraft itself. It will be understood that an element coupled to the electrical ground via a resistive element or impedance (e.g., a resistor) is considered to be electrically isolated relative to the electrical ground.

[0021] In many cases, conventional aircraft and industrial applications can be electrically noisy environments. Electrical noise can be associated with any electrical conductor that is charged to a non-zero potential or conducts current. Electrical noise can typically be radiated, conducted, or both as electromagnetic interference (EMI), and can disrupt the proper operation of connected and nearby equipment. Conducted EMI couples via conduction through parasitic impedances, power connections, and ground connections. Radiated EMI is transmitted to the surrounding environment in the form of near-field electric and magnetic fields (E and M fields) and far-field electromagnetic fields (EM fields). Typically, for EMI at low frequencies (e.g., below 1 megahertz (MHz)), coupling is primarily caused by conduction, for EMI at medium frequencies (e.g., between 1 MHz and 10 MHz), coupling is primarily through near-field electric and magnetic fields, and for EMI at higher frequencies (e.g., above 10 MHz), coupling is primarily from radiation from far-field electromagnetic fields. Energy emitted from radiation can couple to other nearby conductors and radiate into the environment.

[0022] When conducting current in a power system, power cables can be a major source of EMI transfer, acting as both a source and a sink. As a source, power cables can conduct EMI to nearby equipment and act as antennas that radiate noise. As a sink, power cables can receive or pick up EMI radiated from other sources.

[0023] While electrical insulation on or around the central main conductor of a power cable can protect the main conductor mechanically from abrasion and environmentally from moisture, electrical insulation is typically permeable to electromagnetic energy and does not provide protection or shielding from radiated EMI. Consequently, conventional power distribution circuits often use so-called "shielded cables" or "jacketed cables" to provide shielding from radiated EMI. Conventional shielded cables typically employ an outer conductive shield, such as a braided metal mesh jacket. In some instances, radiated EMI is attenuated via discrete ferrite beads or cores (e.g., "clip-on" ferrite beads) arranged circumferentially around the outer surface of the cable.

[0024] Electrical loads (e.g., electric motors, power converters, etc.) are typically energized using power sources that include high-speed semiconductor switching devices (e.g., metal-oxide semiconductor field-effect transistors (MOSFETs)) that rapidly switch between on and off states (e.g., switch-mode operation) to reduce power consumption. The use of these devices can generate electrical noise, or conducted electromagnetic interference, on associated power cables. Conducted EMI typically manifests as the rate of change of the voltage applied to the electrical load. In some cases, conducted EMI can cause premature insulation breakdown (e.g., partial discharge events) and can further cause standing waves to propagate down long cables, resulting in undesirable amplified voltages. Various industry standards (such as NEMA MG1 Parts 31 and 30) limit the acceptable voltage rise times and peak voltages applied to certain electrical loads. To meet these requirements, EMI filters can be used to suppress conducted electromagnetic noise. Such EMI filters typically employ passive components, such as capacitors and inductors, coupled between the power source and the electrical load and are sometimes referred to as "LC filters." In an LC filter, the inductor allows low-frequency or even DC signals to pass, but will block unwanted higher-frequency components. The capacitor in the LC filter will typically direct high-frequency noise back to the power supply ground or system ground through a low-impedance path. Thus, the LC filter extracts any unwanted current (e.g., at a predetermined frequency) conducted through the wire or cable, while allowing the desired current to flow freely.

[0025] Because EMI filters (e.g., LC filters) only protect against conducted EMI, they are often used in conjunction with shielding to block radiated EMI. However, unshielded EMI filters may still transmit electrical noise through the air, which may cause damage to some devices. For example, in some cases, EMI may be emitted from a cable on one side of the EMI filter and then transmitted to the electrical load by recoupling with the cable on the other side. Furthermore, in some cases, EMI filters may be very large, heavy, and add significant cost to manufacturing and installation. Additionally, in some cases, such as where a device or electrical load (e.g., a motor drive) has been upgraded, installing a new EMI filter may be difficult, requiring additional space in the enclosure that is not readily available.

[0026] As described in more detail herein, aspects of the disclosure may provide a power cable assembly suitable for current-carrying operation in applications at high altitudes, high frequencies, and high power densities. These aspects may include a cable having a layered structure with an integrated LC filter. For example, a non-limiting aspect may include a power cable having a center conductor circumferentially surrounded by a set of layers, the set of layers including an electrically insulating layer, a semiconducting layer, a magnetic layer, and a conductive shielding layer. The power cable assembly may also include a connector housing supporting a set of capacitors. The capacitors may be coupled to the magnetic layer to define an integrated LC filter. Thus, these aspects may reduce or eliminate the need for conventional discrete LC filters to reduce conducted EMI, while the conductive shielding layer may simultaneously provide EMI shielding to reduce radiated EMI. Furthermore, the semiconducting layer may improve electrical insulation performance (e.g., increased partial discharge and eddy current resistance) compared to conventional insulation, particularly at high altitudes (e.g., above 30,000 feet above sea level). Thus, the power cable assembly may be arranged as a transmission line in a power distribution system that also functions as an EMI filter and EMI shield to attenuate conducted and radiated EMI while reducing eddy currents and reducing partial discharge events on conventional cables.

[0027] Reference will now be made in detail to the present aspects of the present disclosure, one or more examples of which are illustrated in the accompanying drawings. The detailed description uses numerical and letter designations to refer to features in the drawings. Like or similar designations in the drawings and the description are used to refer to like or similar parts of the present disclosure.

[0028] Figure 1 An isometric view illustrating non-limiting example aspects of a power cable assembly 100. The power cable assembly 100 includes an elongated cable portion 101 extending from a first end 101a to an opposite second end 101b, and a housing portion 102 coupled to the cable portion 101 at the first end 101a. The cable portion 101 includes a set of electrical conductors 110 extending from the first end 101a to the second end 101b. The set of electrical conductors 110 may include a first electrical conductor 111 and a second electrical conductor 112. The cable portion 101 is formed using a plurality of concentric layers or sleeves circumferentially surrounding the set of electrical conductors 110, portions of which are shown for clarity. Figure 1 That is, for illustration purposes only, the power cable assembly 100 is shown as a telescoping assembly by stripping away or omitting portions of subsequent layers of the power cable assembly 100 .

[0029] For example, the first electrical conductor 111 may be circumferentially surrounded by a first concentric set of layers 120 , and the second electrical conductor 112 may be circumferentially surrounded by a second concentric set of layers 130 .

[0030] The concentric first set of layers 120 may include a respective first semiconducting layer 121 a , a respective first insulating layer 131 a , a respective second semiconducting layer 122 a , a magnetic layer 141 , a second insulating layer 132 , an electrically conductive sheath 150 , and an outer insulating sheath 160 .

[0031] The concentric second set of layers 130 may include a respective third semiconductor layer 121 b , a respective third insulating layer 131 b , a respective fourth semiconductor layer 122 b , a magnetic layer 141 , a second insulating layer 132 , an electrically conductive sheath 150 , and an outer insulating sheath 160 .

[0032] The corresponding first semiconductor layer 121a and the third semiconductor layer 121b may circumferentially surround the first electrical conductor 111 and the second electrical conductor 112, respectively. The corresponding first insulating layer 131a and the third insulating layer 131b may circumferentially surround the corresponding first semiconductor layer 121a and the third semiconductor layer 121b, respectively. The corresponding second semiconductor layer 122a and the fourth semiconductor layer 122b may circumferentially surround the corresponding first insulating layer 131a and the third insulating layer 131b, respectively. The magnetic layer 141 may circumferentially surround the corresponding second semiconductor layer 122a and the fourth semiconductor layer 122b. The second insulating layer 132 may circumferentially surround the magnetic layer 141. The conductive sleeve 150 may circumferentially surround the second insulating layer 132. The outer insulating sleeve 160 may circumferentially surround the conductive sleeve 150.

[0033] The first electrical conductor 111 and the second electrical conductor 112 can each comprise a flexible conductor, such as a solid cable or a multi-strand cable. Although the first electrical conductor 111 and the second electrical conductor 112 will be described herein in terms of flexible conductors, they are not otherwise limited. For example, in other aspects, the first electrical conductor 111 and the second electrical conductor 112 can each comprise a rigid conductor, such as a bus bar, without departing from the scope of the present disclosure. The first electrical conductor 111 and the second electrical conductor 112 can be formed of any desired electrically conductive material or alloy, such as copper or aluminum.

[0034] The electrically conductive sleeve 150 may include a foil sleeve, a braided metal mesh, or the like. The foil sleeve may include a relatively thin layer of conductor (e.g., aluminum) attached to an insulating carrier (e.g., polyester) and circumferentially wrapped around the primary conductor or wire. Alternatively, the braided metal mesh may include a braided mesh formed into a tubular sheath of bare or tinned copper wire. It is contemplated that a low-impedance drain wire (not shown) may optionally be coupled to the electrically conductive sleeve 150 to electrically couple or short the sleeve directly to an electrical ground (e.g., chassis ground).

[0035] The connector housing portion 102 may include a connector housing 171 that is Figure 117. The connector housing 171 may be formed from any desired material, such as metal (e.g., aluminum, steel, etc.). In other aspects, the connector housing may be formed from an insulating material (e.g., polyester). The connector housing 171 may include a connector housing surface 171a that surrounds and defines an inner cavity 173. An aperture 172 defined through the connector housing surface 171a may extend into the inner cavity 173 and be fluidically coupled to the inner cavity 173. The cable portion 101 may be received in the inner cavity 173. For example, the first end 101a may be received in the inner cavity 173 via the aperture 172. In non-limiting aspects, the connector housing portion 102 may also include a set of capacitors 115. The connector housing 171 may support the set of capacitors 115. For example, the set of capacitors 115 may be mounted on a printed circuit board (PCB) 116, and in non-limiting aspects, the PCB 116 may be supportably mounted on or within the connector housing 171. For example, in some aspects, the PCB 116 can be fastened to the connector housing 171 via a set of mechanical fasteners 123 (e.g., screws). Other aspects are not so limited, and the PCB 116 can be disposed in any desired location (including away from the connector housing 171) and in any desired orientation. In non-limiting aspects, the magnetic layer 141 can be electrically coupled to the set of capacitors 115, for example, via conductive wires 144 (at Figure 3A shown in ).

[0036] The set of capacitors 115 may include discrete capacitors having any desired dielectric material and may include electrolytic capacitors, ceramic capacitors, rolled film capacitors, and combinations thereof. For example, in non-limiting aspects, the set of capacitors 115 may be compact, high-voltage ceramic capacitors. In various aspects, the capacitance value of each capacitor 115 may be fixed (e.g., 1 microfarad) or may have an adjustable capacitance value.

[0037] Although Figure 1 The present invention depicts a cable portion 101 having two electrical conductors 110 (e.g., a first electrical conductor 111 and a second electrical conductor 112), but is not otherwise limited. In other non-limiting aspects, the set of electrical conductors 110 can include any desired number of electrical conductors 110, including only one. For example, in other non-limiting aspects, the set of electrical conductors can include three electrical conductors (not shown), such as for a three-phase electrical system.

[0038] For example, Figure 2 A non-limiting aspect of a cable portion 101 is depicted having only one electrical conductor 110 (i.e., a first electrical conductor 111), with connector portions omitted for clarity. The first electrical conductor 111 extends from a first end 101a to a second end 101b and is circumferentially surrounded by a first set of concentric layers 120 extending from the first end 101a to the second end 101b, with portions of the first set of layers 120 being circumferentially surrounded for clarity. Figure 2 Omit.

[0039] The concentric first set of layers 120 includes a first semiconducting layer 121 a , a first insulating layer 131 a , a second semiconducting layer 122 a , a magnetic layer 141 , a second insulating layer 132 , an electrically conductive sheath 150 , and an outer insulating sheath 160 .

[0040] Figure 3A Describing another non-limiting aspect of the power cable assembly 100, it also includes an annular EMI filter 142 disposed within the connector housing 171 and arranged to circumferentially surround the cable portion 101. In non-limiting aspects, the annular EMI filter 142 may include a ferrite core or ferrite beads. For example, in non-limiting aspects, the ferrite beads may be formed from ferrite, nanocrystals, or soft magnetic composite (SMC) materials. In other non-limiting aspects, the annular EMI filter 142 may include a radio frequency (RF) inductor. For example, in one non-limiting aspect, the annular EMI filter 142 may be a 1.5 microhenry (uH) inductor. The annular EMI filter 142 may be disposed within the connector housing 171.

[0041] As shown, conductive lines 144 can electrically couple the set of capacitors to magnetic layer 141. For example, in some aspects, conductive lines 144 can be coupled to the magnetic layer and further coupled to traces (not shown) on PCB 116, which can further couple to the set of capacitors 115.

[0042] Figure 3B Yet another non-limiting aspect of the power cable assembly 100 is depicted having an annular EMI filter 142 disposed outside of the connector housing 171 and between the connector housing 171 and the electrical conductive sleeve 150 .

[0043] In some aspects, the loop EMI filters 142 can be arranged as a group of loop EMI filters 142. For example, instead of a single loop EMI filter 142, ferrite or other soft ferromagnetic material can be arranged to form multiple loop EMI filters 142 instead of a single one. Figure 3CYet another non-limiting aspect of the power cable assembly 100 is depicted as having a set of annular EMI filters 142 disposed exteriorly of the connector housing 171, spaced apart along the length thereof, and circumferentially surrounding the cable portion 101. The annular EMI filters 142 can be spaced apart along the length of the cable portion 101. In a non-limiting aspect, one or more of the annular EMI filters in the set of annular EMI filters 142 can be configured to further define a mechanical clamp arranged to retain or couple the cable portion 101 to an external surface, such as a mounting surface (not shown). For example, in some aspects, one or more of the annular EMI filters can include a protrusion or tab portion 143. The tab portion 143 can define an aperture 145 sized to receive a mechanical fastener 146 (e.g., a threaded member) therethrough. In this manner, the annular EMI filters 142 can couple the power cable assembly 100 to an external structure.

[0044] Figure 4 The diagram includes a first electrical conductor 111 and a second electrical conductor 112. Figure 1 FIG1 is an end view cross-section of a cable portion 101 of a non-limiting aspect of a power cable assembly 100. The first electrical conductor 111, the corresponding first semiconducting layer 121a, the corresponding first insulating layer 131a, and the corresponding second semiconducting layer 122a can be arranged concentrically. The second electrical conductor 112, the corresponding third semiconducting layer 121b, the corresponding third insulating layer 131b, and the corresponding fourth semiconducting layer 122b can be arranged concentrically.

[0045] The respective first and third insulating layers 131a, 131b, second insulating layer 132, and outer insulating jacket 160 can each be formed from any desired electrically insulating or dielectric material. In non-limiting aspects, the respective first and third insulating layers 131a, 131b, and second insulating layer 132 can be formed from high-density or low-density polyethylene, and can be cross-linked or non-cross-linked. For example, in various aspects, the respective first and third insulating layers 131a, 131b, second insulating layer 132, and outer insulating jacket 160 can be formed from any of polyvinyl chloride (PVC), cross-linked polyethylene (XLPE), high modulus ethylene-propylene (HEPR), ethylene-propylene (EPR), and combinations thereof.

[0046] The respective first and third semiconductor layers 121a, 121b and the respective second and fourth semiconductor layers 122a, 122b may be formed from a polymer matrix (e.g., an ethylene copolymer) with an electrically conductive filler (e.g., carbon black dispersed within the polymer matrix). The copolymer forming the respective first and third semiconductor layers 121a, 121b and the respective second and fourth semiconductor layers 122a, 122b may be considered a "carrier," but also adheres to the respective first and third insulating layers 131a, 131b, and second insulating layers 132, respectively. The polymer matrix may include polar groups, such as hydrophilic groups (e.g., a copolymer of ethylene and an alkyl acrylate). The concentration of carbon black may be selected to provide a desired conductivity or resistivity. For example, in non-limiting aspects, the resistivity of the respective first and third semiconductor layers 121a, 121b and the respective second and fourth semiconductor layers 122a, 122b may be less than 100 milliohms.

[0047] The magnetic layer 141 may extend in the longitudinal direction of the first electrical conductor 111 and the second electrical conductor 112 (eg, from the first end 101a to the second end 101b). Figure 1)) circumferentially surrounds the corresponding second semiconductor layer 122a and the fourth semiconductor layer 122b. In some aspects, the magnetic layer 141 can be formed of a polymer-based composite with soft magnetic particles or powder. For example, in non-limiting aspects, the magnetic layer 141 can be formed of, but not limited to, iron, silicon steel (e.g., iron silicide (FeSi)), nickel-iron (Ni-Fe) alloy, iron pentacarbonyl (FeCo) alloy, soft ferrite (e.g., manganese ferrite such as manganese zinc (MnZn) ferrite, nickel-zinc (Ni-Zn) ferrite, etc.), amorphous or nanocrystalline alloys / composites (e.g., alloys or composites based on iron (Fe) or cobalt (Co)), or the like having relatively high magnetic permeability injected or otherwise dispersed therein. The magnetic particles may be, without limitation, iron, silicon steel (e.g., Fe6.5Si), Ni-Fe alloys, FeCo alloys, soft ferrites (e.g., MnZn ferrites, Ni-Zn ferrites), amorphous or nanocrystalline alloys / composites (iron-based, cobalt-based), or the like having relatively high magnetic permeability. The morphology of the magnetic particles may include, but is not limited to, spherical, irregular, flaky, fibrous, and the like. For example, the magnetic layer 141 may have a conductivity greater than 10 microhenries per meter (uH / m). It is contemplated that the amount and size of the magnetic particles dispersed in the polymer-based composite material may be varied as necessary to achieve the desired or predetermined performance characteristics of the magnetic layer 141. For example, in non-limiting aspects, the magnetic layer 141 may be configured to have a cutoff frequency greater than 1 MHz. In some non-limiting aspects, the magnetic layer 141 may be configured to have a DC saturation level greater than 1 Tesla (e.g., 1.5 Tesla). Thus, the magnetic layer 141 may define an inductive element ( Figure 1 ). It is contemplated that, in non-limiting aspects, the magnetic layer 141 can be a coating of magnetic particles or powder disposed on the respective second and fourth semiconductor layers 122a, 122b.

[0048] Figure 5 depiction Figure 1 FIG2 is another end view cross-section of another non-limiting aspect of the cable portion 101 of the power cable assembly 100, wherein the magnetic layer 141 is defined by a respective magnetic layer 141a, 141b circumferentially surrounding each respective second semiconducting layer 122a and fourth semiconducting layer 122b. The respective magnetic layers 141a, 141b may be defined by a respective coating of magnetic particles disposed on each respective second semiconducting layer 122a and fourth semiconducting layer 122b.

[0049] The respective magnetic layers 141a, 141b may extend in the longitudinal direction of the first and second electrical conductors 111, 112 (eg, from the first end 101a to the second end 101b). Figure 1)) circumferentially surrounds the respective second semiconductor layer 122a and the fourth semiconductor layer 122b. It is contemplated that the amount and size of the magnetic particles provided on each respective second semiconductor layer 122a and the fourth semiconductor layer 122b may be varied as necessary to achieve a predetermined conductivity for each respective magnetic layer 141a, 141b. Thus, the respective magnetic layers 141a, 141b may define an inductive element ( Figure 1 ).

[0050] Aspects as described herein provide a power cable having a multi-layer structure that can simultaneously achieve EMI shielding, EMI filtering, eddy current reduction, high voltage and / or high altitude insulation, and partial discharge protection, thereby providing improved performance and ampacity when conducting current over conventional cables.

[0051] For example, during operation (e.g., when current flows through the first electrical conductor 111 or the second electrical conductor 112, or both), the electrically conductive sleeve 150 can define a low impedance path (e.g., a short circuit) to electrical ground. In this manner, the electrically conductive sleeve 150 operates as an EMI shield by reducing radiated EMI (by reflecting radiated energy, conducting it to ground, or both).

[0052] Furthermore, during operation, the respective first semiconductor layer 121a and the third semiconductor layer 121b can provide a smooth interface between the first electrical conductor 111 and the second electrical conductor 112, respectively, to reduce the occurrence of high voltage stress regions, limit the injection of space charge into the adjacent respective first insulating layer 131a and the third insulating layer 131b, and prevent partial discharge events, particularly during operation at high altitudes or at relatively high voltages (e.g., 10 kilovolts). Similarly, during operation, the respective second semiconductor layer 122a and the fourth semiconductor layer 122b can provide a smooth interface between the magnetic layer 141, further reducing high voltage stress regions, limiting the injection of space charge into the adjacent second insulating layer 132, and preventing partial discharge events, particularly during operation at high altitudes or at relatively high voltages.

[0053] Furthermore, in operation, the magnetic layer 141 or the corresponding magnetic layers 141a, 141b ( Figure 4-5 ) are arranged to extend substantially parallel to magnetic field lines (not shown) caused by current flowing through the first electrical conductor 111 or the second electrical conductor 112, or both, and can be operable to reduce or prevent the generation of eddy currents. In addition, the magnetic layer 141 or the respective magnetic layers 141a, 141b can reduce the inherent shielding loss of the electrical sleeve 150 (e.g., a shielding loss reduction of greater than 50%).

[0054] Furthermore, the magnetic layer 141 or the corresponding magnetic layers 141a, 141b and the electrically coupled set of capacitors 115 cooperate to act as an LC filter to suppress conducted EMI. In non-limiting aspects, the magnetic layer 141 or the corresponding magnetic layers 141a, 141b can further cooperate with an optional ring EMI filter 142 to further filter radiated EMI at a predetermined frequency.

[0055] Figure 6 A non-limiting example of a method 400 for manufacturing a power cable assembly 100 is shown. Although reference will be made to the referenced Figure 1-5 The method 400 is described with reference to the power cable assembly 100 , but aspects of the method 400 are not so limited and may be implemented in other cable assemblies without departing from the scope of the present disclosure.

[0056] The power cable assembly 100 may include a cable portion 101 and a connector housing portion 102. The cable portion 101 may include a first electrical conductor 111 extending from a first end 101a to an opposite second end 101b.

[0057] Method 400 can begin at 410 by forming cable portion 101. In non-limiting aspects, forming cable portion 101 can include circumferentially wrapping electrical conductor 110 with a first set of concentric layers extending from first end 101a to second end 101b. The set of layers can include a first semiconducting layer 121a, a first insulating layer 131a, a second semiconducting layer 122a, a magnetic layer 141, a second insulating layer 132, and an electrically conductive sleeve 150.

[0058] In some aspects, the cable portion 101 can further include a second electrical conductor 112 extending from the first end 101a to an opposite second end 101b. In such aspects, forming the cable portion can further include circumferentially surrounding the second electrical conductor 112 with a second set of concentric layers extending from the first end 101a to the second end 101b, wherein the second set of concentric layers includes a respective third semiconducting layer 121b, a respective third insulating layer 131b, and a respective fourth semiconducting layer 122b. The magnetic layer 141, the second insulating layer 132, and the electrically conductive sleeve 150 can circumferentially surround the respective fourth semiconducting layer 122b.

[0059] In non-limiting aspects, forming cable portion 101 may further include disposing an annular EMI filter 142 circumferentially surrounding second insulating layer 132 outside connector housing 171 between connector housing 171 and electrically conductive sleeve 150. Annular EMI filter 142 may include one of a ferrite bead or an inductor.

[0060] The method 400 may include, at 420, forming the connector housing portion 102. In non-limiting aspects, forming the connector housing portion 102 includes positioning the PCB 116 including the set of capacitors 115 within the connector housing 171. In non-limiting aspects, forming the connector housing portion 102 may also include positioning the annular EMI filter 142 within the connector housing 171 to circumferentially surround the second insulating layer 132.

[0061] The method 400 may include, at 430 , coupling the cable portion 101 at the first end 101 a to the connector housing 171 ; and, at 440 , coupling the set of capacitors 115 to the magnetic layer 141 .

[0062] The depicted order is for illustrative purposes only and is not intended to limit method 400 in any way, as it is understood that portions of the method may be performed in a different logical order, may include additional or intervening portions, or the described portion of the method may be divided into multiple portions, or the described portion of the method may be omitted without detracting from the described method. For example, method 400 may include various other intervening steps. The examples provided herein are intended to be non-limiting.

[0063] To the extent not yet described, the various features and structures of each aspect may be used in combination with one another as desired. A feature may not be shown in all aspects, which is not intended to be interpreted as indicating that it may not be present, but rather is done for the sake of brevity of description. Thus, various features of different embodiments may be mixed and matched as desired to form new embodiments, whether or not the new embodiments are explicitly described. All combinations or permutations of the features described herein are encompassed by this disclosure.

[0064] This written description uses examples, including the best mode, and is intended to enable any person skilled in the art to practice the disclosure, including making and using any devices or systems and performing any incorporated methods. The patentable scope of the disclosure is defined by the claims and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal language of the claims.

[0065] The various features, aspects, and advantages of the present disclosure may also be embodied in any arrangement of aspects of the present disclosure, including but not limited to the following technical solutions as defined in the enumerated aspects:

[0066] A power cable assembly, the power cable assembly comprising: a cable portion having a first end and an opposite second end, and a connector housing portion, wherein the cable portion comprises: a first electrical conductor extending from the first end to the second end and circumferentially surrounded by a first set of layers extending from the first end to the second end, the first set of layers comprising: a first semiconductor layer circumferentially surrounding the first electrical conductor; a first insulating layer circumferentially surrounding the first semiconductor layer; a second semiconductor layer circumferentially surrounding the first insulating layer; a magnetic layer circumferentially surrounding the second semiconductor layer; a second insulating layer circumferentially surrounding the magnetic layer; an electrically conductive sleeve circumferentially surrounding the second insulating layer; wherein the connector housing portion comprises a connector housing coupled to the first end of the cable portion; a printed circuit board (PCB) coupled to the connector housing; and a group of capacitors mounted to the PCB and coupled to the magnetic layer.

[0067] The power cable assembly according to the preceding clause, wherein the PCB is disposed within the connector housing.

[0068] The power cable assembly of any preceding clause, further comprising an insulating jacket circumferentially surrounding the electrically conductive jacket.

[0069] The power cable assembly of any preceding clause, further comprising a second electrical conductor extending from the first end to the second end and coupled to the set of capacitors at the first end, circumferentially surrounded by a second set of layers extending from the first end to the second end, the second set of layers comprising: a respective third semiconducting layer circumferentially surrounding the second electrical conductor; a respective third insulating layer circumferentially surrounding the third semiconducting layer; and a respective fourth semiconducting layer circumferentially surrounding the third insulating layer, wherein the magnetic layer, the second insulating layer, and the electrically conductive sleeve circumferentially surround the respective fourth semiconducting layer.

[0070] A power cable assembly according to any preceding clause, wherein the magnetic layer is defined by a coating of magnetic particles provided on the second semiconducting layer.

[0071] A power cable assembly according to any preceding clause, wherein the magnetic layer comprises a polymer-based composite material having magnetic particles dispersed therein.

[0072] A power cable assembly according to any preceding clause, comprising an annular electromagnetic interference (EMI) filter circumferentially surrounding the second semiconducting layer.

[0073] The power cable assembly of any preceding clause, wherein the annular EMI filter defines an aperture configured to receive a mechanical fastener therethrough for coupling the cable assembly to an external structure.

[0074] The power cable assembly of any preceding clause, wherein the annular EMI filter comprises one of a ferrite bead or an inductor.

[0075] A power cable assembly according to any preceding clause, wherein an annular EMI filter is provided in the connector housing.

[0076] A power cable assembly according to any preceding clause, wherein the annular EMI filter is disposed externally of the connector housing between the connector housing and the electrically conductive sleeve.

[0077] A method of manufacturing a power cable assembly, the power cable assembly including a cable portion and a connector housing portion, the method comprising: forming the cable portion having a first electrical conductor extending from a first end and an opposite second end, wherein the forming comprises circumferentially wrapping the first electrical conductor with a first set of layers extending from the first end to the second end, the first set of layers comprising a first semiconducting layer, a first insulating layer, a second semiconducting layer, a magnetic layer, a second insulating layer, and an electrically conductive sleeve; forming the connector housing portion, wherein the forming comprises coupling a PCB having a group of capacitors mounted thereon to the connector housing; coupling the cable portion to the connector housing at the first end; and coupling the group of capacitors to the magnetic layer.

[0078] A method as in any preceding clause, wherein coupling the PCB to the connector housing comprises disposing the PCB within the connector housing.

[0079] A method according to any preceding clause, wherein the first set of layers further comprises an insulating sleeve circumferentially surrounding the electrically conductive sleeve.

[0080] A method according to any preceding clause, wherein the cable portion further comprises a second electrical conductor extending from the first end to an opposite second end, wherein forming the cable portion further comprises circumferentially wrapping the second electrical conductor with a second set of layers extending from the first end to the second end, the second set of layers comprising a respective third semiconducting layer, a respective third insulating layer, a respective fourth semiconducting layer, wherein the magnetic layer, the second insulating layer, and the electrically conductive sleeve circumferentially wrap around the respective fourth semiconducting layer.

[0081] A method as in any preceding clause, wherein the magnetic layer is defined by a coating of magnetic particles provided on the second semiconductor layer.

[0082] A method according to any preceding clause, wherein the magnetic layer comprises a polymer-based composite material having magnetic particles dispersed therein.

[0083] A method according to any preceding clause, wherein forming the connector housing portion further comprises providing an annular EMI filter within the connector housing to circumferentially surround the second semiconducting layer.

[0084] A method as in any preceding clause, wherein the ring EMI filter comprises one of a ferrite bead or an inductor.

[0085] A method according to any preceding clause, wherein forming the cable portion further comprises providing an annular EMI filter external to the connector housing circumferentially surrounding the second semiconducting layer between the connector housing and the electrically conductive sleeve.

Claims

1. A power cable assembly, comprising: a cable portion having a first end and an opposite second end, and a connector housing portion having a connector housing coupled to the first end of the cable portion, wherein the cable portion comprises: a first electrical conductor extending from the first end to the second end, the first electrical conductor being circumferentially surrounded by a first set of layers extending from the first end to the second end, the first set of layers comprising: a first semiconductor layer, the first semiconductor layer circumferentially surrounding the first electrical conductor, a first insulating layer, the first insulating layer circumferentially surrounding the first semiconductor layer; a second semiconductor layer, wherein the second semiconductor layer circumferentially surrounds the first insulating layer; a magnetic layer, the magnetic layer circumferentially surrounding the second semiconductor layer, a second insulating layer, the second insulating layer circumferentially surrounding the magnetic layer, and an electrically conductive sleeve, the electrically conductive sleeve circumferentially surrounding the second insulating layer; a printed circuit board coupled to the connector housing; and A set of capacitors is mounted to the printed circuit board and coupled to the magnetic layer.

2. The power cable assembly according to claim 1, wherein: The printed circuit board is disposed in the connector housing. 3 . The power cable assembly according to claim 1 , further comprising an insulating sleeve circumferentially surrounding the electrically conductive sleeve.

4. The power cable assembly of claim 1 , further comprising a second electrical conductor extending from the first end to the second end and coupled to the set of capacitors at the first end, the second electrical conductor being circumferentially surrounded by a second set of layers extending from the first end to the second end, the second set of layers comprising: a corresponding third semiconductor layer, said third semiconductor layer circumferentially surrounding said second electrical conductor; a corresponding third insulating layer, the third insulating layer circumferentially surrounding the second semiconductor layer; as well as A corresponding fourth semiconductor layer circumferentially surrounds the third insulating layer, wherein the magnetic layer, the second insulating layer, and the electrically conductive sleeve circumferentially surround the corresponding fourth semiconductor layer.

5. The power cable assembly according to claim 1, wherein: The magnetic layer is defined by a coating of magnetic particles disposed on the second semiconductor layer.

6. The power cable assembly according to claim 1, wherein: The magnetic layer includes a polymer-based composite material having magnetic particles dispersed therein. 7 . The power cable assembly according to claim 1 , comprising an annular electromagnetic interference filter circumferentially surrounding the second semiconducting layer.

8. The power cable assembly according to claim 7, wherein: The annular electromagnetic interference filter defines an aperture configured to receive a mechanical fastener therethrough for coupling the cable assembly to an external structure.

9. The power cable assembly according to claim 7, wherein: The ring electromagnetic interference filter includes one of a ferrite bead or an inductor.

10. The power cable assembly according to claim 7, wherein: The annular electromagnetic interference filter is disposed in the connector housing.

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