A microfluidic chip packaging device

Abstract

The application provides a micro-fluidic chip packaging device, which comprises a base and a ceiling, and further comprises: a rotating disc rotatably installed above the base through a driving shaft, a plurality of packaging grooves are arranged on the circumferential disc surface of the rotating disc, the size of the packaging grooves is consistent with the size of the chip, a pair of positioning holes are arranged on the inner bottom of the rotating disc, a pair of butt joint assemblies for screwing chip liquid inlet heads and liquid outlet heads are threadedly connected in the positioning holes, a feeding position, a butt joint position, a cover pasting position, a packaging position, a solidification position, a flushing position, a separation position and a discharging position are sequentially arranged according to the rotating direction of the rotating disc, and a plurality of pump liquid mechanisms are arranged. The device adopts the form of injecting phase change liquid into a micro channel, which can discharge the residual glue or solvent in the micro channel on one hand, and fill the channel in a solid state form during the pressing process, so that the channel is prevented from being blocked, a set of packaging devices are designed according to the phase change liquid protection mode, and the automatic feeding, positioning, packaging, solidification and discharging processes are realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the microfluidic chip packaging technical field, especially to a microfluidic chip packaging device. BACKGROUND

[0002] Microfluidic technology is a technology that uses micron and sub-micron pipes to process or manipulate microfluids. Compared with traditional analysis and detection methods, it has significant advantages such as fast speed, less reagent consumption, high throughput, and high degree of system integration. It has shown great potential in single-cell analysis, food testing, nanoparticle synthesis, high-throughput drug screening, and in-vitro physiological and pathological model construction (i.e. organ chip).

[0003] Commonly used microfluidic chip manufacturing materials include PMMA (polymethyl methacrylate), COC (cycloolefin copolymer), PS (polystyrene), PC (polycarbonate), glass, etc. The packaging of a microfluidic chip is to package between the substrate and the cover plate. Currently commonly used packaging technologies include thermal compression bonding, solvent bonding, glue bonding, and laser or ultrasonic bonding.

[0004] Among them, glue bonding and solvent bonding are common packaging methods, which use glue or solvent to achieve packaging. However, during the process of applying glue or solvent, the microchannels in the substrate will also be coated with glue or solvent. With compression, the solidified glue will block the microchannels, and the solvent will also cause corrosion of the microchannels, affecting the yield. SUMMARY

[0005] To solve the above problems, the present application provides a microfluidic chip packaging device, which uses a microchannel injection phase change liquid form. On the one hand, it can discharge the glue or solvent remaining in the microchannel, and on the other hand, it can fill the channel in solid form during compression to avoid channel blockage. A set of packaging devices is designed for phase change liquid protection, which realizes the automatic processes of feeding, positioning, packaging, solidification, and discharging.

[0006] To solve the above problems, the technical solution adopted by the present application is:

[0007] A microfluidic chip packaging device, comprising a base and a ceiling, further comprising:

[0008] A turntable is rotatably installed above the base by a drive shaft, and a plurality of packaging grooves are arranged on the circumferential disc surface of the turntable. The size of the packaging groove is consistent with the size of the chip. A pair of positioning holes are arranged on the inner bottom of the turntable, and a pair of butt joint assemblies for screwing the chip liquid inlet head and the liquid outlet head are threadedly connected in the positioning holes.

[0009] The feeding position, the butt joint position, the cover sticking position, the packaging position, the solidification position, the flushing position, the separation position, and the discharging position are distributed in the rotation direction of the turntable.

[0010] A plurality of pumping mechanisms are installed on the bottom of the rotating disc and correspond to the plurality of packaging grooves, for pumping phase change liquid into the chip channel at the packaging position, pumping phase change liquid out at the solidification position, and pumping cleaning liquid to flush residual phase change liquid at the flushing position;

[0011] A lifting groove disc is installed above the base, and a driving assembly for driving the docking assembly to dock or separate is installed on the disc wall at the corresponding docking position and separation position;

[0012] A cover sticking mechanism includes a cover sticking plate and a glue coating groove, the cover sticking plate is installed below the ceiling and can move horizontally and vertically, and a plurality of suction cups are installed on the bottom for sucking the cover plate after coating glue in the glue coating groove to stick on the substrate at the cover sticking position;

[0013] A cooling press plate and a solidification press plate are respectively installed below the ceiling at the packaging position and the solidification position, the cooling press plate is used for pressing the chip and solidifying the phase change liquid, and the solidification press plate is used for solidifying the chip and liquefying the phase change liquid.

[0014] Preferably, the docking assembly includes a docking cavity arranged in the rotating disc, a pair of rotating pipes are rotatably connected in the docking cavity, a threaded joint is slidably sleeved on the upper end of the rotating pipe in a sealing manner, and the threaded joint is threadedly connected in the corresponding positioning hole.

[0015] Preferably, the driving assembly includes a deflection air cylinder installed on the top of the disc wall of the lifting groove disc, a first air cylinder radially extends and retracts is fixedly installed on the rotating end of the deflection air cylinder, a rack is fixedly installed on the extension end of the first air cylinder, a gear wheel cooperating with the rack is fixed on the rotating pipe, an arc-shaped opening for the rack to insert is arranged on the side wall of the rotating disc, the tooth surfaces of the racks at the docking position and the separation position are opposite, a limiting plate is fixedly installed below the ceiling at the corresponding docking position through a suspender, and the limiting plate abuts against the upper surface of the rotating disc.

[0016] Preferably, the pumping mechanism includes a pumping cylinder fixedly installed on the bottom of the rotating disc, a liquid suction pipe and a liquid outlet pipe are connected to the top and the bottom of the pumping cylinder respectively, a one-way valve is installed in each of the liquid suction pipe and the liquid outlet pipe, the liquid outlet pipe is docked with one of the rotating pipes through a rotary joint, the lower end of the other rotating pipe is docked with a liquid discharge pipe through a rotary joint, a piston is arranged in the pumping cylinder, a piston rod extending out of the pumping cylinder is connected to the side wall of the piston, and a push-pull assembly capable of driving the piston rod to move is installed on the disc wall at the corresponding packaging position, solidification position and flushing position of the lifting groove disc.

[0017] Preferably, the push-pull assembly includes a second air cylinder fixedly installed on the disc wall of the lifting groove disc, and magnetic discs magnetically attracted to each other are fixed to the extension end of the piston rod and the extension end of the second air cylinder.

[0018] Preferably, the lifting groove disc is provided with a liquid tank and a pair of pipe holes at the bottom of the packaging position, the curing position and the flushing position, the pipe holes correspond to the suction pipe and the drainage pipe respectively, the liquid tank at the packaging position and the flushing position is provided with phase change liquid and cleaning liquid respectively, and the liquid tank at the curing position is used for collecting the phase change liquid.

[0019] Preferably, the phase change liquid is paraffin.

[0020] Preferably, a pair of hydraulic cylinders are installed on the base, and the telescopic ends of the hydraulic cylinders are fixedly connected with the lifting groove disc.

[0021] Preferably, the cover pasting mechanism further comprises an electric sliding rail fixedly installed at the bottom of the ceiling, a third air cylinder is installed on the sliding block of the electric sliding rail, the telescopic end of the third air cylinder is fixedly connected with the cover pasting plate, the glue applying groove is hung below the ceiling through a hanging arm, and a plurality of glue applying rollers are rotatably connected at the groove opening of the glue applying groove.

[0022] Preferably, the bottom of the ceiling is provided with a fourth air cylinder for driving the lifting of the cooling pressing plate and the curing pressing plate, the cooling pressing plate is provided with a cooling channel, and the curing pressing plate is provided with a heating plate.

[0023] The present application has the following advantages:

[0024] 1. By installing the rotating disc, the plurality of packaging grooves, the feeding position, the discharging position, the butt joint position, the separation position, the butt joint assembly and the driving assembly, the substrate can be placed into the packaging groove at the feeding position in the way of being grabbed by the suction cup, positioning is realized due to the fact that the size of the packaging groove is consistent with the size of the substrate, the rotating disc is rotated by the driving shaft, after being rotated to the butt joint position, the first air cylinder is started to insert the rack into the butt joint cavity through the corresponding arc-shaped opening, after the rack is rotated to be engaged with the pair of gears by the deflection air cylinder, the first air cylinder drives the rack to continue to move, thereby driving the pair of rotating pipes to rotate, and then driving the threaded joint to rotate, the threaded joint is rotated out of the positioning hole and then rotated into the liquid inlet and the liquid outlet at the bottom of the substrate, on the one hand, the position of the substrate is locked, and deviation in the process of pasting and packaging is avoided, on the other hand, the communication of the pipelines is realized, after butt joint, the rack can be pulled out by the deflection of the rack by the deflection air cylinder, the rotating disc continues to rotate, after packaging, the rotating disc is rotated to the separation position, the threaded joint is reversely rotated out of the packaging groove by the driving assembly cooperating with the butt joint assembly, separation is realized, the rotating disc is rotated to the discharging position, and the chip is taken out in the way of being grabbed by the suction cup again, and precise positioning is realized.

[0025] 2. Through the installation of the cover plate, the glue coating groove and the cover position, the positioned substrate is transferred to the cover position, the cover plate at the other end of the cover position uses the suction cup to suck the cover, moves transversely through the electric sliding rail, starts the third cylinder to drive the cover to move downward, makes it contact the glue coating roller, the glue coating roller is soaked in the glue coating groove, realizes the uniform glue coating process of the bottom of the cover, moves transversely to above the cover position, the third cylinder drives the cover to descend and adhere to the substrate, realizes the automatic cover process.

[0026] 3. Through the installation of the packaging position, the pump liquid mechanism and the cooling press plate, the covered chip is transferred to the packaging position, first starts the fourth cylinder to drive the cooling press plate to descend, pre-presses the cover and the substrate, part of the glue is pressed into the micro channel, at this time, the pump liquid mechanism is started, the hydraulic cylinder drives the lifting groove disc to rise, the liquid suction pipe and the liquid discharge pipe pass through the corresponding pipe hole, the liquid suction pipe is inserted into the liquid tank containing the phase change liquid, the second cylinder at the packaging position is started, pushes to make the two magnetic disks magnetically attract, completes the coupling, under the action of the magnetic attraction force, pushes and pulls the piston rod, under the action of the piston, the paraffin liquid is pumped into the liquid inlet head through the liquid outlet pipe, the transfer pipe and the threaded joint under the action of the piston, injects into the micro channel, the excess glue in the micro channel is finally discharged through the liquid discharge pipe after the paraffin liquid passes through the liquid outlet head, then the unblended paraffin liquid is left in the micro channel, the cooling press plate cools the chip, so that its temperature drops to the solidification temperature of the paraffin liquid, the solidified paraffin fills the micro channel, at this time, the cooling press plate increases the pressing force to package, the solidified paraffin can protect the micro channel and improve the yield.

[0027] 4. Through the installation of the solidification position, the flushing position, the pump liquid mechanism and the solidification press plate, the packaged chip is transferred to the solidification position, the fourth cylinder drives the solidification press plate to descend and touch the chip, the chip is heated by the heating plate, so that the temperature rises, on the one hand, the glue is solidified, on the other hand, the temperature reaches the liquefaction temperature of the paraffin liquid, through the pump liquid mechanism, gas is pumped into the micro channel, the paraffin liquid is squeezed out into the collected liquid tank, the solidified chip is transferred to the flushing position, the pump liquid mechanism pumps the cleaning liquid into the micro channel, so that the paraffin remaining on the inner wall of the channel is cleaned, so as to avoid affecting the use of the micro channel. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 It is a perspective view of the present application;

[0029] Figure 2 It is a side perspective view of the present application;

[0030] Figure 3 It is a top view of the rotating disc proposed by the present application;

[0031] Figure 4 It is a perspective view of the rotating disc proposed by the present application;

[0032] Figure 5 It is a perspective view of the lifting groove disc proposed by the present application;

[0033] Figure 6 is a sectional view of the present application;

[0034] Figure 7 is an enlarged schematic view of the structure at A in Figure 6

[0035] In the figure: 1 base, 2 lifting groove disc, 3 rotating disc, 4 ceiling, 5 electric sliding rail, 6 third cylinder, 7 cover plate, 8 packaging groove, 9 positioning hole, 10 arc-shaped port, 11 pump liquid cylinder, 12 second cylinder, 13 first cylinder, 14 deflection cylinder, 15 rack, 16 limiting plate, 17 glue coating groove, 18 glue coating roller, 19 cooling pressing plate, 20 curing pressing plate, 21 magnetic disc, 22 liquid tank, 23 hydraulic cylinder, 24 driving shaft, 25 fourth cylinder, 26 pipe hole, 27 liquid suction pipe, 28 liquid discharge pipe, 29 suction disc, 30 butt joint cavity, 31 gear, 32 rotating pipe, 33 rotating joint, 34 piston, 35 piston rod, 36 feeding position, 37 butt joint position, 38 cover pasting position, 39 packaging position, 40 curing position, 41 flushing position, 42 separation position, 43 discharging position, 44 threaded joint. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below in combination with the drawings. In the following description, a large number of specific details are set forth in order to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the concept of the present application, so the present application is not limited to the specific implementation disclosed below.

[0037] Referring to Figures 1-7 , a microfluidic chip packaging device, comprising a base 1 and a ceiling 4, further comprising: a feeding position 36, a butt joint position 37, a cover pasting position 38, a packaging position 39, a curing position 40, a flushing position 41, a separation position 42 and a discharging position 43, which are distributed in the rotating direction of the rotating disc 3 in turn.

[0038] The rotating disc 3 is rotatably installed above the base 1 by the driving shaft 24, and a plurality of packaging grooves 8 are arranged on the circumferential disc surface of the rotating disc 3, the size of the packaging groove 8 is consistent with the size of the chip, and the inner bottom of the rotating disc 3 is provided with a pair of positioning holes 9, a butt joint assembly for screwing the liquid inlet head and the liquid outlet head is threadedly connected in each of the pair of positioning holes 9, the butt joint assembly comprises a butt joint cavity 30 arranged in the rotating disc 3, a pair of rotating pipes 32 are rotatably connected in the butt joint cavity 30, a threaded joint 44 is slidably sleeved on the upper end of the rotating pipe 32 in a sealing manner, the threaded joint 44 is threadedly connected in the corresponding positioning hole 9, and the threaded joint 44 is rotated, and after being rotated out of the positioning hole 9, the threaded joint 44 is rotated into the liquid inlet head and the liquid outlet head at the bottom of the substrate, on the one hand, the locking of the substrate position is realized, and the deviation in the process of pasting and packaging is avoided, and on the other hand, the communication of the pipeline is realized.

[0039] ​The lifting groove disc 2 is installed above the base 1, and a driving assembly for driving the docking assembly to dock or separate is installed on the disc wall of the lifting groove disc 2 at the corresponding docking position 37 and the separating position 42, the driving assembly comprises a deflection air cylinder 14 installed on the top of the disc wall of the lifting groove disc 2, a first air cylinder 13 radially extending and retracting is fixedly installed on the rotating end of the deflection air cylinder 14, a rack 15 is fixedly installed on the extending end of the first air cylinder 13, a gear 31 cooperating with the rack 15 is fixed on the rotating pipe 32, the side wall of the rotating disc 3 is provided with an arc-shaped opening 10 for the rack 15 to insert, the tooth surfaces of the racks 15 at the docking position 37 and the separating position 42 are opposite, the lower portion of the ceiling 4 is provided with a limiting plate 16 fixedly installed through a hanger rod at the corresponding docking position 37, the limiting plate 16 is attached to the upper surface of the rotating disc 3, the first air cylinder 13 is started to insert the rack 15 into the docking cavity 30 through the corresponding arc-shaped opening 10, after the rack 15 is driven by the deflection air cylinder 14 to rotate to engage with a pair of gears 31, the first air cylinder 13 drives the rack 15 to continue to move, and then a pair of rotating pipes 32 are driven to rotate by the gears 31, the docking is realized, and after encapsulation, the separating position 42 is rotated to separate, the driving assembly cooperates with the docking assembly to drive the threaded joint 44 to rotate out in reverse, and the separation is realized.

[0040] A plurality of pump liquid mechanisms are circumferentially installed at the bottom of the rotating disc 3 and correspond to the plurality of encapsulation grooves 8 one by one, and are used for pumping phase change liquid into the chip channel at the encapsulation position 39, pumping the phase change liquid out at the solidification position 40, and pumping the cleaning liquid to flush the residual phase change liquid at the flushing position 41.

[0041] Specifically, the pump liquid mechanism comprises a pump liquid cylinder 11 fixedly installed at the bottom of the rotating disc 3, a liquid suction pipe 27 and a liquid outlet pipe are connected to the top and the bottom of the pump liquid cylinder 11 respectively, a one-way valve is installed in each of the liquid suction pipe 27 and the liquid outlet pipe, the liquid outlet pipe is connected to one of the rotating pipes 32 through a rotary joint 33, the lower end of the other rotating pipe 32 is connected to a liquid discharge pipe 28 through a rotary joint 33, a piston 34 is arranged in the pump liquid cylinder 11, a piston rod 35 extending out of the pump liquid cylinder 11 is connected to the side wall of the piston 34, a push-pull assembly capable of driving the piston rod 35 to move is installed on the disc wall of the lifting groove disc 2 at the corresponding encapsulation position 39, solidification position 40 and flushing position 41, the push-pull assembly comprises a second air cylinder 12 fixedly installed on the disc wall of the lifting groove disc 2, magnetic discs 21 magnetically attracted to each other are fixedly arranged on the extending end of the piston rod 35 and the extending end of the second air cylinder 12, the second air cylinder 12 is started to push the two magnetic discs 21 to magnetically attract each other, the coupling is completed, the piston rod 35 is pushed and pulled under the action of the magnetic attraction force, and the pump liquid process is completed under the action of the piston 34.

[0042] Further, the lifting groove disc 2 is provided with a liquid tank 22 and a pair of pipe holes 26 corresponding to the bottom of the packaging position 39, the curing position 40 and the flushing position 41, and the pipe holes 26 correspond to the suction pipe 27 and the discharge pipe 28 respectively. The liquid tank 22 at the packaging position 39 and the flushing position 41 is provided with phase change liquid and cleaning liquid respectively, and the liquid tank 22 at the curing position 40 is provided with a pipe hole 26 corresponding to the discharge pipe 28 for collecting phase change liquid. A pair of hydraulic cylinders 23 is installed on the substrate 1, and the extension end of the hydraulic cylinder 23 is fixedly connected with the lifting groove disc 2. When the rotating disc 3 rotates to a working position, the lifting groove disc 2 completes one lifting under the action of the hydraulic cylinder 23, and realizes the insertion of the suction pipe 27 and the discharge pipe 28.

[0043] The phase change liquid is paraffin, and the phase change temperature is 10-80℃, which is easy to control.

[0044] The cover sticking mechanism includes a cover sticking plate 7 and a glue coating groove 17. The cover sticking plate 7 is installed below the ceiling 4 and can move horizontally and vertically. A plurality of suction cups 29 are installed at the bottom of the cover sticking plate 7 for sucking the cover plate after coating glue in the glue coating groove 17 and sticking the cover plate on the substrate at the cover sticking position 38.

[0045] Specifically, the cover sticking mechanism further includes an electric sliding rail 5 fixedly installed at the bottom of the ceiling 4. A third air cylinder 6 is installed on the sliding block of the electric sliding rail 5, and the extension end of the third air cylinder 6 is fixedly connected with the cover sticking plate 7. The glue coating groove 17 is hung below the ceiling 4 by a hanging arm. A plurality of glue coating rollers 18 are rotatably connected at the groove opening of the glue coating groove 17. The cover sticking plate 7 sucks the cover plate at the other end of the cover sticking position 38 by the suction cup 29, moves horizontally by the electric sliding rail 5, starts the third air cylinder 6 to drive the cover plate to move downward, so that the cover plate contacts the glue coating roller 18. The glue coating roller 18 is immersed in the glue coating groove 17 to realize the uniform glue coating process of the bottom of the cover plate. The cover plate is moved to the top of the cover sticking position 38, the third air cylinder 6 drives the cover plate to move downward to stick the substrate, and the automatic cover sticking process is realized.

[0046] The cooling pressure plate 19 and the curing pressure plate 20 are respectively installed below the ceiling 4 at the packaging position 39 and the curing position 40. The cooling pressure plate 19 is used for pressing the chip and curing the phase change liquid. The curing pressure plate 20 is used for curing the chip and liquefying the phase change liquid. The bottom of the ceiling 4 is provided with a fourth air cylinder 25 for driving the cooling pressure plate 19 and the curing pressure plate 20 to move up and down. The cooling pressure plate 19 is provided with a cooling channel, and the curing pressure plate 20 is provided with a heating plate. The cooling pressure plate 19 cools the chip to make the temperature of the chip drop to the curing temperature of the paraffin liquid. The cured paraffin fills the micro channel. At this time, the cooling pressure plate increases the pressing force to realize packaging, and the cured paraffin can protect the micro channel. The curing pressure plate 20 moves downward to contact the chip. The chip is heated by the heating plate to make the temperature of the chip rise. On the one hand, the glue is cured. On the other hand, the temperature reaches the liquefaction temperature of the paraffin liquid. The pump liquid mechanism is used to pump gas into the micro channel to extrude the paraffin liquid into the collected liquid tank 22.

[0047] The substrate can be placed into the packaging slot 8 at the loading position 36 by suction cup grabbing. Since the size of the packaging slot 8 is consistent with the size of the substrate, positioning is achieved. The driving shaft 24 drives the rotating disc 3 to rotate to the docking position 37, and the first air cylinder 13 is started to insert the rack 15 into the docking cavity 30 through the corresponding arc-shaped opening 10. After the rack 15 is driven by the deflection air cylinder 14 to mesh with a pair of gears 31, the first air cylinder 13 drives the rack 15 to continue to move, and then drives a pair of rotating pipes 32 to rotate through the gears 31, and then drives the threaded joint 44 to rotate out of the positioning hole 9 and then into the liquid inlet head and the liquid outlet head at the bottom of the substrate. On the one hand, the position of the substrate is locked to avoid deviation during the process of patching and packaging. On the other hand, the pipeline is connected. After docking, the rack 15 can be pulled out by driving the rack 15 to deviate from the gears 31 by the deflection air cylinder 14. The rotating disc 3 continues to rotate to the separation position 42. The driving assembly cooperates with the docking assembly to drive the threaded joint 44 to rotate in the opposite direction to achieve separation. The rotating disc 3 rotates to the unloading position 43, and the chip is taken out again by suction cup grabbing.

[0048] The positioned substrate rotates to the cover pasting position 38. The cover plate 7 at the other end of the cover pasting position 38 uses the suction cup 29 to suck the cover, moves laterally through the electric sliding rail 5, and drives the cover to move downward by the third air cylinder 6, so that the cover contacts the glue roller 18. The glue roller 18 is immersed in the glue groove 17 to achieve uniform glue coating at the bottom of the cover. The cover is moved to the top of the cover pasting position 38, and the cover is lowered by the third air cylinder 6 to paste the substrate, thereby achieving automatic cover pasting.

[0049] The chip after pasting the cover rotates to the packaging position 39. The fourth air cylinder 25 is started to drive the cooling press plate 19 to descend to pre-press the cover and the substrate. Part of the glue is pressed into the micro-channel. At this time, the pump liquid mechanism is started, the lifting groove disc 2 is lifted by the hydraulic cylinder 23 to make the liquid suction pipe 27 and the liquid discharge pipe 28 pass through the corresponding pipe hole 26. The liquid suction pipe 27 is inserted into the liquid tank 22 containing the phase change liquid. The second air cylinder 12 at the packaging position 39 is started to drive the two magnetic disks 21 to be magnetically attracted, thereby completing coupling. The piston rod 35 is pushed and pulled under the action of the magnetic force, and the paraffin liquid is pumped into the liquid inlet head through the liquid outlet pipe, the rotating pipe 32 and the threaded joint 44 under the action of the piston 34. The paraffin liquid is injected into the micro-channel, and the excess glue in the micro-channel is discharged through the liquid outlet pipe after the paraffin liquid. Subsequently, the paraffin liquid is left in the micro-channel without mixing. The cooling press plate 19 cools the chip to reduce the temperature to the solidification temperature of the paraffin liquid. The solidified paraffin fills the micro-channel. At this time, the cooling press plate increases the pressing force to package. The solidified paraffin can protect the micro-channel and improve the yield.

[0050] The encapsulated chip is transferred to the solidification position 40, the fourth cylinder 25 drives the solidification pressing plate 20 to descend and abut against the chip, the chip is heated by the heating plate, the temperature is increased, the glue is solidified on one hand, and on the other hand, the temperature reaches the liquefaction temperature of the paraffin liquid, the paraffin liquid is extruded into the liquid tank 22 for collection through the pump liquid mechanism, the solidified chip is transferred to the flushing position 41, the pump liquid mechanism is used for pumping the cleaning liquid into the micro channel, the paraffin remaining on the inner wall of the channel is cleaned, and the use of the micro channel is avoided.

[0051] The above merely describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A microfluidic chip packaging device comprising a substrate (1) and a ceiling (4), characterized in that, Also include: Rotary disc (3), through the drive shaft (24) is installed above the base (1), its circumferential disc surface is provided with a plurality of packaging groove (8), the size of the packaging groove (8) is consistent with the size of the chip, the inner bottom of rotary disc (3) is provided with a pair of positioning hole (9), a pair of the positioning hole (9) is threadedly connected with the docking assembly for screwing the chip liquid inlet head and liquid outlet head; The feeding position (36), the docking position (37), the cover sticking position (38), the packaging position (39), the curing position (40), the flushing position (41), the separation position (42) and the discharging position (43) are distributed in the rotation direction of the rotary disc (3) in sequence; A plurality of pump liquid mechanisms are circumferentially installed on the bottom of the rotary disc (3) and correspond to the plurality of packaging grooves (8) one by one, for pumping phase change liquid into the chip channel at the packaging position (39), pumping out the phase change liquid at the curing position (40), and pumping in cleaning liquid to flush the residual phase change liquid at the flushing position (41); The lifting groove disc (2) is installed above the base (1), and the driving assembly for driving the docking or separation of the docking assembly is installed on the disc wall corresponding to the docking position (37) and the separation position (42); The cover sticking mechanism includes a cover sticking plate (7) and a glue coating groove (17), the cover sticking plate (7) is installed below the ceiling (4) and can move horizontally and vertically, and a plurality of suction cups (29) are installed on the bottom for sucking the cover plate after coating glue through the glue coating groove (17) and sticking it on the substrate at the cover sticking position (38); The cooling press plate (19) and the curing press plate (20) are respectively installed below the ceiling (4) of the packaging position (39) and the curing position (40), the cooling press plate (19) is used for pressing the chip and curing the phase change liquid, and the curing press plate (20) is used for curing the chip and liquefying the phase change liquid.

2. The microfluidic chip packaging device of claim 1, wherein, The docking assembly includes a docking cavity (30) arranged in the rotary disc (3), a pair of rotating pipes (32) are rotatably connected in the docking cavity (30), a threaded joint (44) is slidably sleeved on the upper end of the rotating pipe (32), and the threaded joint (44) is threadedly connected in the corresponding positioning hole (9).

3. The microfluidic chip packaging device of claim 2, wherein, The driving assembly includes a deflection air cylinder (14) installed on the top of the disc wall of the lifting groove disc (2), a first air cylinder (13) radially extending and retracting is fixedly installed on the rotating end of the deflection air cylinder (14), a rack (15) is fixedly installed on the retracting end of the first air cylinder (13), a gear (31) cooperating with the rack (15) is fixedly installed on the rotating pipe (32), an arc-shaped opening (10) is arranged on the side wall of the rotary disc (3) for the rack (15) to insert, the tooth surfaces of the racks (15) at the docking position (37) and the separation position (42) are opposite, a limiting plate (16) is fixedly installed below the ceiling (4) corresponding to the docking position (37) through a hanger, and the limiting plate (16) is attached to the upper surface of the rotary disc (3).

4. The microfluidic chip packaging device of claim 3, wherein, The pump liquid mechanism comprises a pump liquid cylinder (11) fixedly installed at the bottom of the rotating disc (3), a liquid suction pipe (27) and a liquid outlet pipe are connected to the top and bottom of the pump liquid cylinder (11) respectively, one-way valves are installed in the liquid suction pipe (27) and the liquid outlet pipe, the liquid outlet pipe is connected to one of the rotating pipes (32) through a rotary joint (33), the lower end of the other rotating pipe (32) is connected to a liquid discharge pipe (28) through a rotary joint (33), a piston (34) is arranged in the pump liquid cylinder (11), a piston rod (35) extending out of the pump liquid cylinder (11) is connected to the side wall of the piston (34), and push-pull assemblies for driving the piston rod (35) to move are installed on the disc wall of the lifting groove disc (2) corresponding to the positions of the sealing position (39), the solidifying position (40) and the flushing position (41).

5. The microfluidic chip packaging device of claim 4, wherein, The push-pull assembly comprises a second air cylinder (12) fixedly installed on the disc wall of the lifting groove disc (2), and magnetic discs (21) magnetically attracted to each other are fixed to the extension end of the piston rod (35) and the telescopic end of the second air cylinder (12).

6. The microfluidic chip packaging device of claim 5, wherein, The bottom of the lifting groove disc (2) corresponding to the sealing position (39), the solidifying position (40) and the flushing position (41) is provided with a liquid tank (22) and a pair of pipe holes (26), the pipe holes (26) correspond to the liquid suction pipe (27) and the liquid discharge pipe (28) respectively, the pipe hole (26) corresponding to the liquid suction pipe (27) is arranged in the liquid tank (22) at the sealing position (39) and the flushing position (41), and the pipe hole (26) corresponding to the liquid discharge pipe (28) is arranged in the liquid tank (22) at the solidifying position (40), wherein the liquid tank (22) at the sealing position (39) and the flushing position (41) is respectively filled with phase change liquid and cleaning liquid, and the liquid tank (22) at the solidifying position (40) is used for collecting the phase change liquid.

7. The microfluidic chip packaging device of claim 1, wherein, The phase change liquid is paraffin.

8. The microfluidic chip packaging device of claim 1, wherein, A pair of hydraulic cylinders (23) are installed on the base (1), and the telescopic ends of the hydraulic cylinders (23) are fixedly connected with the lifting groove disc (2).

9. The microfluidic chip packaging device of claim 1, wherein, The cover pasting mechanism further comprises an electric sliding rail (5) fixedly installed at the bottom of the ceiling (4), a third air cylinder (6) is installed on the sliding block of the electric sliding rail (5), the telescopic end of the third air cylinder (6) is fixedly connected with a cover pasting plate (7), the glue coating groove (17) is hung below the ceiling (4) through a hanging arm, and a plurality of glue coating rollers (18) are rotatably connected to the groove opening of the glue coating groove (17).

10. The microfluidic chip packaging device of claim 1, wherein, The bottom of the ceiling (4) is provided with a fourth air cylinder (25) for driving the cooling pressing plate (19) and the solidifying pressing plate (20) to move up and down, the cooling pressing plate (19) is provided with a cooling channel, and the solidifying pressing plate (20) is provided with a heating plate.

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