Air cooling device and semiconductor equipment

Abstract

The invention provides an air cooling device and semiconductor equipment, the semiconductor equipment comprises a protection cover, a top cover of the protection cover is provided with a plurality of communication ports, the air cooling device comprises an air inlet structure arranged above the protection cover, and the air inlet structure comprises an air inlet arranged on the top surface of the air inlet structure and a plurality of independent ventilation ducts located in the air inlet structure; the air inlet comprises a plurality of sub-air inlets, the inflow end of each ventilating duct correspondingly communicates with at least one sub-air inlet, and the outflow end of each ventilating duct correspondingly communicates with at least one communicating opening; and the ratio of the total flow area of the communicating ports corresponding to the ventilating ducts to the total flow area of the sub air inlets corresponding to the ventilating ducts is the same. According to the air cooling device, the cooling air enters and exits from the side, so that the difference of the volume of the cooling air flowing to all the parts of the annular reflecting part can be reduced, the temperature consistency of the cooling air flowing to all the parts of the annular reflecting part can be improved, and the cooling uniformity of all the parts of the annular reflecting part can be improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to an air cooling device and semiconductor equipment. Background Art

[0002] The working principle of silicon epitaxial equipment is to apply Chemical Vapor Deposition (CVD) technology to transport reactive gases into the process chamber, heat them to react, and deposit them on the substrate to form a single crystal layer.

[0003] The process chamber is heated using a heating module consisting of a heating lamp and a reflector. The infrared light emitted by the lamp is reflected by the reflector and irradiated onto the tray holding the substrate, bringing the tray's temperature to the process temperature. Since process temperatures typically range from 1000°C to 1200°C, the heating module can overheat as the process progresses, seriously impacting its lifespan. To mitigate the negative impact of this overheating, an air cooling system is used to cool the module.

[0004] Currently, air cooling devices use a side-inlet, side-outlet approach. Specifically, cooling air flows in through the sidewalls of the protective cover that covers the heating module. After flowing through the reflector and the heater lamps within the protective cover, it flows downward and out through the sidewalls, removing the heat from the reflector and the heater lamps. However, this approach results in poor cooling uniformity. Summary of the Invention

[0005] The present invention aims to at least solve the technical problem of poor cooling uniformity in the prior art, and proposes an air cooling device and a semiconductor device.

[0006] In a first aspect, the present invention provides an air cooling device, which is applied to semiconductor equipment, the semiconductor equipment including a heating module and a protective cover, the protective cover including an annular shell and a top cover covering the top of the shell, the inner circumference of the shell and the bottom surface of the top cover together forming a mounting cavity for accommodating the heating module; the top cover is provided with a plurality of communication ports communicating with the mounting cavity, the plurality of communication ports being spaced and evenly distributed around the central axis of the protective cover, and the shell is provided with an air outlet; the air cooling device includes: an air inlet structure provided above the protective cover;

[0007] The air inlet structure includes: an air inlet provided on the top surface of the air inlet structure and a plurality of independent ventilation ducts located inside the air inlet structure; the air inlet includes a plurality of sub-air inlets, and the inflow end of each of the ventilation ducts is connected to at least one of the sub-air inlets, and the outflow end is connected to at least one of the connecting ports;

[0008] The ratio of the total flow area of ​​the communication openings corresponding to the ventilation ducts to the total flow area of ​​the sub-air inlets corresponding thereto is the same.

[0009] In one implementation of the first aspect of the present invention, an annular space is defined within the air inlet structure, and the annular space is divided into a plurality of ventilation ducts; each of the ventilation ducts includes at least a first communication area, and the first communication areas of the ventilation ducts are distributed around the central axis of the protective cover, and the orthographic projection of the communication opening corresponding to each ventilation duct in the vertical direction falls within the first communication area of ​​the ventilation duct;

[0010] The ventilation duct having a first communication area that is not directly opposite to the corresponding sub-air inlet also includes a second communication area, which is connected to the first communication area of ​​the ventilation duct, and the second communication area extends along the circumference of the annular space to the corresponding sub-air inlet.

[0011] In an implementation of the first aspect of the present invention, the air inlet structure includes a first annular partition plate and a second annular partition plate which are coaxially arranged in the internal hollow cavity, and the second annular partition plate is arranged around the outside of the first annular partition plate. The first annular partition plate, the second annular partition plate, the top surface and the bottom surface of the air inlet structure together form the annular space.

[0012] In an implementation of the first aspect of the present invention, there are five ventilation ducts, which are respectively an inner duct, a first middle duct, a second middle duct, a first outer duct and a second outer duct arranged concentrically; except the inner duct, the first middle duct, the second middle duct, the first outer duct and the second outer duct all include a second connecting area; part of the inner duct, the second connecting area of ​​the first middle duct and the second connecting area of ​​the first outer duct are arranged in sequence from the inside of the installation cavity to the outside of the installation cavity, and the rest of the inner duct, the second connecting area of ​​the second middle duct and the second connecting area of ​​the second outer duct are arranged in sequence from the inside of the installation cavity to the outside of the installation cavity.

[0013] In an implementation of the first aspect of the present invention, an orthographic projection of one of the communication openings in the vertical direction falls into the first communication area of ​​the first external air duct and the first communication area of ​​the second external air duct simultaneously.

[0014] In an implementation of the first aspect of the present invention, the air inlet is provided with a first diverter plate, and a second diverter plate and a third diverter plate parallel to each other; one end of the first diverter plate is connected to the inner wall of the air inlet, and the other end is connected to the second diverter plate, and the first diverter plate is cross-connected with the third diverter plate, and the air inlet is divided into five sub-air inlets, and the five sub-air inlets are connected to the five ventilation ducts one by one.

[0015] In an implementation of the first aspect of the present invention, the total flow areas of the communication openings corresponding to the ventilation ducts are the same; or, the total flow areas of the communication openings corresponding to at least two of the ventilation ducts are different.

[0016] In an implementation of the first aspect of the present invention, the flow areas of the communication ports are the same.

[0017] In an implementation of the first aspect of the present invention, a guide slope is formed in each of the sub-air inlets, and the guide slope extends obliquely downward from the top surface to the bottom surface of the air inlet structure.

[0018] In the second aspect, the present invention also provides a semiconductor device, comprising: a process chamber, a protective cover, a heating module and any one of the above-mentioned air cooling devices provided in the first aspect of the present invention, the heating module is arranged in the installation cavity of the protective cover, and the air inlet structure of the air cooling device is arranged above the protective cover.

[0019] In an implementation of the second aspect of the present invention, the heating module includes a plurality of heating lamps spaced and evenly distributed around the central axis of the protective cover; the orthographic projection of each of the connecting ports on the top surface of the air inlet structure is located between the orthographic projections of two adjacent heating lamps on the top surface of the air inlet structure; and the flow areas of each of the connecting ports are the same.

[0020] The present invention has the following beneficial effects:

[0021] In the air-cooling device and semiconductor equipment provided by the present invention, cooling air forms a top-inlet and side-outlet flow channel on the protective cover, and the ratio of the total flow area of ​​the corresponding connecting openings of each ventilation channel to the total flow area of ​​the corresponding sub-inlet is the same. This helps to reduce the difference in the cooling air volume flowing to different parts of the annular reflector. Moreover, after entering the installation cavity through each connecting opening, the cooling air flows from top to bottom. Part of the cooling air entering through the connecting opening flows directly to contact the corresponding part of the annular reflector. Therefore, the cooling air contacting the annular reflector does not carry heat from other components, and the temperature of the cooling air contacting various parts of the annular reflector is the same.

[0022] In summary, by reducing the difference in the cooling air volume flowing through various parts of the annular reflector and improving the uniformity of the cooling air temperature in contact with various parts of the annular reflector, the difference in the cooling effect of various parts of the annular reflector can be effectively reduced and the cooling uniformity of the annular reflector can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic cross-sectional view of a semiconductor device in a top view is provided for related technology;

[0024] Figure 2 for Figure 1 A schematic cross-sectional view of the semiconductor device shown along line AA;

[0025] Figure 3 for Figure 1 The shown schematic diagram is a three-dimensional diagram of a semiconductor device omitting a portion of the structure of the process chamber;

[0026] Figure 4 A schematic cross-sectional view of a semiconductor device in a top view according to an embodiment of the present application;

[0027] Figure 5 for Figure 4 A schematic cross-sectional view of the semiconductor device shown along line BB;

[0028] Figure 6 A schematic perspective view of a semiconductor device provided in an embodiment of the present application, omitting a portion of the process chamber structure;

[0029] Figure 7 A schematic diagram of a three-dimensional structure of the connection between the protective cover and the air inlet structure provided in one embodiment of the present application;

[0030] Figure 8 A schematic cross-sectional view of an air inlet structure provided in an embodiment of the present application when viewed from above;

[0031] Figure 9 A schematic diagram of the structure of an air inlet structure of an air cooling device provided in an embodiment of the present application;

[0032] Figure 10 A schematic top view of an air inlet structure of an air cooling device provided in an embodiment of the present application;

[0033] Figure 11 A schematic diagram of the air inlet of the air inlet structure of the air cooling device provided in one embodiment of the present application.

[0034] Description of reference numerals:

[0035] 100-Semiconductor equipment;

[0036] 10-air cooling device; 11-air inlet structure; 111-first diverter plate; 112-second diverter plate;

[0037] 1122 - air inlet; 1124 - guide slope; 1125 - inner air duct; 1126 - first middle air duct; 1127 - second middle air duct; 1128 - first outer air duct; 1129 - second outer air duct; 113 - third diverter plate; 14 - air inlet duct; 15 - air outlet duct; 160 - first annular partition plate; 161 - second annular partition plate; 162 - first curved partition plate; 163 - second curved partition plate; 164 - first baffle plate; 165 - second baffle plate; 166 - third baffle plate; 167 - fourth baffle plate; 168 - fifth baffle plate; 169 - sixth baffle plate;

[0038] 20-process chamber; 21-upper dome; 22-tray;

[0039] 30-protective cover; 31-housing; 310-air outlet; 32-top cover; 321-connecting port; 33-annular support plate;

[0040] 40-heating module; 41-heating lamp; 42-annular reflector;

[0041] 200-substrate. DETAILED DESCRIPTION

[0042] Figure 1 A schematic cross-sectional view of a semiconductor device in a top view is provided for related technology. Figure 2 for Figure 1 The schematic cross-sectional view of the semiconductor device shown is along the AA direction. Figure 3 for Figure 1 The semiconductor device shown is a three-dimensional schematic diagram omitting part of the process chamber structure. Figures 1 to 3 The semiconductor device 100' of the related art shown has a process chamber 20' with an upper dome 21'. A tray 22' is placed within the process chamber 20', which is used to support a substrate 200. Infrared light emitted by a heating lamp 41' is reflected by a reflector 42' through the transparent upper dome 21' and illuminates the tray 22', raising the temperature of the tray 22' to 1000°C to 1200°C, causing a single crystal layer to grow on the surface of the substrate 200 supported by the tray 22'. To achieve cooling, the outlet end of the air inlet duct 14' communicates with an air inlet 1122' on the side wall of the protective cover 30', and the inlet end of the air outlet duct 15' communicates with an air outlet 310' on the side wall of the protective cover 30'. In actual application, the heat dissipation path is generally as follows: cooling air flows into the air inlet duct 14' from the inlet end of the air inlet duct 14', then enters the protective cover 30' through the air inlet 1122', the cooling air diffuses in the protective cover 30' and flows through the reflector 42' and the heating lamp 41', then enters the air outlet duct 15' through the air outlet 310' and flows out to the outside of the protective cover 30'. The flow path of the cooling air in the protective cover 30' is as follows: Figure 1 and Figure 2 Indicated by the dotted arrow.

[0043] When using this semiconductor device for epitaxial growth, the process quality is poor. The inventors of this application discovered that one of the causes of this problem is that different parts of the reflector have different cooling effects, that is, the cooling uniformity of the reflector is poor. This results in large temperature differences and different reflectivities across the reflector surface. As a result, different infrared light is reflected from different parts onto the tray, resulting in temperature differences across the tray, which in turn affects the uniformity of the epitaxial growth process.

[0044] Another reason for this problem is that during the epitaxial process, reactants, namely a coating, will also be deposited on the inner wall of the process chamber. The cooling air flowing through the upper surface of the upper dome will also cool the upper dome. However, the cooling effects of different parts of the upper dome vary greatly, that is, the cooling uniformity of the upper dome is poor, resulting in temperature differences in various parts of the upper dome. The thin films grown in various parts of the lower surface of the upper dome also have distribution differences, which in turn affects the distribution of infrared light passing through the upper dome, thereby affecting the uniformity of the epitaxial process.

[0045] In general, the uniformity of the epitaxial process is closely related to the uniformity of the cooling effect. After further careful research, the inventors found that the uniformity of the cooling effect is related to the flow path of the cooling air. First, the flow path of the cooling air in the related art is side-in and side-out. In this way, the cooling air volume in the area near the air inlet in the protective cover is large, and the cooling air volume in the area near the air outlet is small, and the air volume is uneven, which leads to the reflector dissipating heat quickly near the air inlet and dissipating heat slowly at the position away from the air inlet. Second, the cooling air entering the protective cover from the side wall of the protective cover has kinetic energy to flow obliquely downward, resulting in less cooling air flowing between the heating lamp near the air inlet and the upper dome, resulting in a large difference in the heat dissipation effect of the partial surface of the upper dome corresponding to the heating lamp and the heat dissipation effect of the partial surface of the upper dome corresponding to other heating lamps. Third, the cooling air enters the protective cover from the side wall of the protective cover. In the process of diffusing from the area close to the air inlet in the protective cover to the area far away from the air inlet, the cooling air will carry part of the heat of the heating lamp and reflector it passes through, thereby causing the temperature of the cooling air in contact with different parts of the reflector and each heating lamp to be different.

[0046] Based on this, the following embodiments of the present application provide an air cooling device and a semiconductor device. To enable those skilled in the art to better understand the technical solution of the present invention, the air cooling device and the semiconductor device provided by the present invention are described in detail below with reference to the accompanying drawings.

[0047] Figure 4 A schematic cross-sectional view of a semiconductor device in a top view according to an embodiment of the present application is shown in FIG. Figure 5 for Figure 4The schematic cross-sectional view of the semiconductor device along the BB direction is shown. Figure 6 This is a three-dimensional schematic diagram of a semiconductor device provided in an embodiment of the present application, omitting part of the process chamber structure. Figures 4 to 6 The semiconductor device 100 includes a process chamber 20, a heating module 40, an air cooling device 10, and a protective cover 30 disposed above the process chamber 20. The process chamber 20 has an upper dome 21. A tray 22 is placed in the process chamber 20 for supporting a substrate 200. The semiconductor device 100 is used to implement a silicon epitaxial growth process to grow an epitaxial layer on the substrate 200.

[0048] The protective cover 30 includes an annular shell 31 and a top cover 32 covering the top of the shell 31 . The bottom surface of the top cover 32 and the inner circumference of the shell 31 together form an installation cavity for accommodating the heating module 40 .

[0049] For example, the protective cover 30 can be a separate component. For example, the housing 31 and the top cover 32 can be connected by means of snap-fitting, welding, bonding, or screwing. For example, in another feasible embodiment, the protective cover 30 can also be a single piece formed by an integrated molding process. Compared to a separate protective cover 30, this not only eliminates the assembly process of the housing 31 and the top cover 32, but also helps improve the structural strength of the protective cover 30 without increasing costs.

[0050] An annular support plate 33 is also fixedly installed in the installation cavity. The annular support plate 33 is connected to the inner circumferential surface of the shell 31. The annular support plate 33 divides the installation cavity into a first space and a second space. The first space is located above the second space. The first space and the second space are connected through a central through hole of the annular support plate 33.

[0051] like Figure 4 and Figure 6 As shown, the cross-sectional shape of the housing 31 and the top cover 32 along the extension direction of the central axis of the protective cover 30 can be a regular hexagon. Of course, the cross-sectional shape of the housing 31 and the top cover 32 is not limited thereto, and can also be circular, rectangular, regular pentagonal, octagonal, etc.

[0052] The heating module 40 mentioned above is used to heat the tray 22 so that the tray 22 reaches the process temperature. Figures 4 to 6The heating module 40 includes an annular reflector 42 and a plurality of heating lamps 41. The heating lamp 41 can be specifically arranged in the first space and fixed on the annular support plate 33. In this way, the annular support plate 33 can provide support for the heating lamp 41, so that the heating lamp 41 can be stably installed in the installation cavity. The annular reflector 42 can also be specifically arranged in the first space and located above the heating lamp 41, so as to be able to reflect the infrared light emitted by the heating lamp 41 to the tray 22. Among them, the annular reflector 42 can specifically be a gold-plated part, which has the advantages of heat preservation and high reflectivity.

[0053] Specific basis Figure 4 In the example shown, twelve heating lamps 41 may be provided, and the twelve heating lamps 41 are spaced and evenly distributed around the central axis of the protective cover 30 so that the infrared light projected onto the annular reflector 42 is evenly distributed.

[0054] The top cover 32 is provided with a plurality of communication openings 321 which pass through the thickness of the top cover 32. The central axis of the communication openings 321 coincides with the central axis of the annular reflector 42. The number of the communication openings 321 can be the same as the number of the heating lamps 41. Figure 4 In the illustrated example, twelve heating lamps 41 are provided, and twelve communication openings 321 are also provided. The twelve communication openings 321 are spaced and evenly distributed around the central axis of the protective cover 30. It will be appreciated that the number of heating lamps 41 and the number of communication openings 321 are not limited to the above numbers, as long as a plurality of heating lamps 41 and communication openings 321 are provided.

[0055] The housing 31 is also provided with an air outlet 310 that penetrates the thickness of the housing. Thus, the connecting port 321, the mounting cavity, and the air outlet 310 are sequentially connected to form a flow channel, along which the cooling air flows. The air outlet 310 is arranged below the heating lamp 41 so that as much cooling air as possible flows through the heating lamp 41 and is discharged outside the protective cover 30. Figure 5 As shown, the air outlet 310 can be specifically arranged below the annular support plate 33 and communicate with the second space of the installation cavity.

[0056] Figure 7 This is a schematic diagram of the three-dimensional structure of the connection between the protective cover and the air inlet structure provided in one embodiment of the present application. Figure 7 The air cooling device 10 provided in the embodiment of the present application further includes an air inlet structure 11 arranged above the protective cover 30 , and an air inlet 1122 is provided on the top surface of the air inlet structure 11 .

[0057] Figure 8 This is a schematic cross-sectional view of an air inlet structure provided in an embodiment of the present application in a top view. Figure 8 , a plurality of independent ventilation ducts are also provided inside the air inlet structure 11.

[0058] Figure 9This is a schematic diagram of the air inlet structure of an air cooling device provided in an embodiment of the present application. Figure 10 This is a schematic top view of the air inlet structure of an air cooling device provided in an embodiment of the present application. The air inlet 1122 includes multiple sub-inlets. Each ventilation duct's inflow end is connected to at least one sub-inlet, and its outflow end is connected to at least one connecting port 321. The orthographic projection of each sub-inlet on the bottom surface of the top cover 32 falls within the corresponding ventilation duct, achieving connectivity.

[0059] Furthermore, the ratio of the total flow area of ​​the connecting openings 321 corresponding to each ventilation duct to the total flow area of ​​the corresponding sub-inlets is the same. In other words, for any ventilation duct, if the ratio of the total flow area of ​​the sub-inlets corresponding to the ventilation duct to the total flow area of ​​the corresponding connecting openings 321 is K, then the K corresponding to each ventilation duct in this application is the same. For example, if the total flow area of ​​the sub-inlets corresponding to one ventilation duct is 1mm 2 The total flow area of ​​the communication port 321 corresponding to the ventilation duct is 1mm 2 , the K corresponding to this ventilation duct is 1. The total flow area of ​​the sub-inlet corresponding to the other ventilation duct is 2mm 2 The total flow area of ​​the communication port 321 corresponding to the ventilation duct is 2mm 2 , K corresponding to the ventilation duct is also 1. It can be seen that the total flow area of ​​the communication opening 321 corresponding to the ventilation duct is proportional to the total flow area of ​​the sub-inlet corresponding thereto.

[0060] In this way, the cooling air delivered to the air inlet 1122 is distributed according to the ratio of the total flow area of ​​each sub-inlet. Since the ratio of the total flow area of ​​the sub-inlets corresponding to each ventilation duct to the total flow area of ​​its corresponding connecting opening 321 is the same, the ratio of the cooling air volume in each ventilation duct to the total flow area of ​​its corresponding connecting opening 321 is also equal, thereby making the ratio of the air volume of each connecting opening 321 to its flow area equal. In this way, the air volume per unit area of ​​each connecting opening 321 is the same.

[0061] According to the present embodiment, the heat dissipation path during the epitaxial process of the semiconductor device 100 is as follows: the cooling air flows to the air inlet 1122 on the top surface of the air inlet structure 11, and is distributed into multiple streams according to the flow area of ​​each sub-air inlet. The multiple streams of cooling air flow into the ventilation ducts corresponding to the sub-air inlets respectively, and then enter the installation cavity through the connecting port 321 corresponding to the ventilation duct, and then flow from top to bottom to the bottom of the shell 31. Part of the cooling air flows through the annular reflector 42, takes away part of the heat of the annular reflector 42, and then continues to flow downward. Part of the cooling air flows between two adjacent heating lamps 41, takes away part of the heat of the heating lamps 41, and then continues to flow downward. The cooling air then flows through the middle through hole of the annular support plate 33 to the second space and diffuses in the second space. The cooling air contacts the upper surface of the upper dome 21, takes away part of the heat of the upper dome 21, and is discharged from the air outlet 310 to the outside of the protective cover 30. Among them, the flow path of the cooling air in the protective cover 30 is as follows: Figure 4 and Figure 5 Indicated by the dotted arrow.

[0062] As can be seen, during the processing of semiconductor equipment 100 using the air cooling device 10 of this embodiment, cooling air forms a top-inlet, side-outlet flow path, and the ratio of the total flow area of ​​the corresponding connecting openings 321 to the total flow area of ​​the corresponding sub-inlet is the same for each ventilation path. Thus, cooling air diffuses into the protective cover 30 through the multiple connecting openings 321 and flows from top to bottom after the installation cavity. The airflow per unit area of ​​each connecting opening 321 is the same, which helps minimize differences in the cooling air volume flowing to different parts of the annular reflector 42.

[0063] Moreover, since the cooling air flows from top to bottom after entering the installation cavity through each connecting port 321, part of the cooling air entering through the connecting port 321 flows directly to contact the corresponding part on the annular reflector 42. Therefore, the cooling air in contact with the annular reflector 42 does not carry heat from other components, and the temperature of the cooling air in contact with each part of the annular reflector 42 is the same.

[0064] In general, by reducing the difference in the amount of cooling air flowing through various parts of the annular reflector 42 and improving the uniformity of the temperature of the cooling air in contact with various parts of the annular reflector 42, the difference in the cooling effect of various parts of the annular reflector 42 can be effectively reduced, and the cooling uniformity of the annular reflector 42 can be improved.

[0065] In addition, with Figure 2 Compared with the related technologies shown in the figure, the cooling air entering the protective cover 30 from the connecting port 321 of the top cover 32 in this embodiment has kinetic energy from top to bottom, which can reduce the adverse effects of the side-in and side-out cooling air on the uniformity of the heat dissipation effect of each part of the upper dome, and is conducive to improving the consistency of the heat dissipation effect of each part of the upper dome.

[0066] In some embodiments, as Figure 6 As shown, the air cooling device 10 may further include an air inlet duct 14, which is disposed outside the protective cover 30. The outlet end of the air inlet duct 14 is connected to the air inlet 1122, and the air inlet duct 14 serves to introduce cooling air. Driven by the fan, the cooling air flows through the air inlet duct 14 to the air inlet 1122, then into the ventilation duct, and then along the outlet end of the ventilation duct to the connecting port 321.

[0067] In some embodiments, as Figure 6 As shown, the air cooling device 10 may further include an air outlet duct 15, which is disposed outside the protective cover 30. The inlet end of the air outlet duct 15 is connected to the air outlet 310, and the air outlet duct 15 serves to guide the cooling air. Thus, the cooling air carrying heat flows into the air outlet duct 15 through the air outlet 310, and is then discharged along the air outlet duct 15 to the outside of the protective cover 30.

[0068] In some embodiments, please combine Figure 8 and Figure 10 The air inlet structure 11 defines an annular space, which is divided into a plurality of ventilation channels. In other words, a plurality of ventilation channels can be constructed together to form an annular space. It should be noted that the annular space referred to here can be Figure 8 The circular ring shape shown may also be a square ring shape.

[0069] Furthermore, each ventilation duct includes at least a first communication area. The first communication areas of each ventilation duct are sequentially distributed around the central axis of the protective cover 30, and the vertical projection of the corresponding communication opening of each ventilation duct falls within the first communication area of ​​the ventilation duct. Furthermore, ventilation ducts with first communication areas that do not directly face the corresponding sub-inlet also include a second communication area that connects to the first communication area of ​​the ventilation duct and extends along the circumference of the annular space to the corresponding sub-inlet.

[0070] By such an arrangement, it can be ensured that each communication port spaced and evenly distributed around the central axis of the protective cover 30 can be communicated with a corresponding sub-air inlet through the corresponding ventilation duct.

[0071] It should be understood that, as in the air cooling device 10 disclosed herein, the specific structure of the air inlet structure 11 is diverse. For example, the bottom of the air inlet structure 11 is open, and the air inlet structure 11 can be regarded as a cover to cover the protective cover 30. For another example, the bottom of the air inlet structure 11 can be closed, and the air inlet structure 11 can be regarded as a box with a hollow interior. In this example, a plurality of openings corresponding to the plurality of connecting ports 321 are provided on the bottom plate of the air inlet structure 11. The plurality of openings are spaced and evenly distributed around the central axis of the protective cover 30. The orthographic projection of each opening on the top surface of the air inlet structure 11 completely coincides with the orthographic projection of the corresponding connecting port 321 on the top surface of the air inlet structure 11. In this way, the cooling air flowing into the ventilation duct from the sub-air inlet flows to the corresponding connecting port 321 through the opening.

[0072] Taking the air intake structure 11 as an example, which is a hollow box, the air intake structure 11 includes a first annular partition plate 160 and a second annular partition plate 161 disposed within the internal hollow cavity. The first annular partition plate 160 and the second annular partition plate 161 are coaxially arranged, with the centers of both located on the central axis of the protective cover 30. The second annular partition plate 161 surrounds the outside of the first annular partition plate 160. In this way, the first annular partition plate 160, the second annular partition plate 161, and the top and bottom surfaces of the air intake structure 11 together form an annular space, which is in the shape of a circular ring.

[0073] When the bottom of the air inlet structure 11 is open, the first annular partition plate 160 , the second annular partition plate 161 , the top surface of the air inlet structure 11 and the top surface of the top cover 32 together form an annular space.

[0074] In a specific example of this application, please continue to see Figure 8 and Figure 10 The air intake structure 11 may further include a first curved partition plate 162, a second curved partition plate 163, a first blocking plate 164, a second blocking plate 165, a third blocking plate 166, a fourth blocking plate 167, a fifth blocking plate 168, and a sixth blocking plate 169, which are disposed in the annular space. The top ends of the partition plates and the blocking plates are connected to the top surface of the air intake structure 11.

[0075] The first curved partition plate 162 is located between the first annular partition plate 160 and the second annular partition plate 161. The center of the first curved partition plate 162 is located on the central axis of the annular reflector 42. The first blocking plate 164 and the second blocking plate 165 extend radially along the annular reflector 42. The two ends of the first blocking plate 164 are connected to the first ends of the first annular partition plate 160 and the first curved partition plate 162, respectively. The two ends of the second blocking plate 165 are connected to the second ends of the first annular partition plate 160 and the first curved partition plate 162, respectively. In this way, the first curved partition plate 162, the first blocking plate 164, the second blocking plate 165, and the first annular partition plate 160 collectively form a sub-channel.

[0076] The second curved partition plate 163 is located within the sub-channel, between the first curved partition plate 162 and the first annular partition plate 160. The center of the second curved partition plate 163 is located on the central axis of the annular reflector 42. The third and fourth blocking plates 166 and 167 extend radially along the annular reflector 42. The ends of the third blocking plate 166 are connected to the first ends of the first annular partition plate 160 and the second curved partition plate 163, respectively. The ends of the fourth blocking plate 167 are connected to the second ends of the first annular partition plate 160 and the second curved partition plate 163, respectively. Thus, the second curved partition plate 163, the third blocking plate 166, the fourth blocking plate 167, and the top and bottom surfaces of the top cover 32 collectively form an inner air duct 1125. The inner air duct 1125 is curved and located within the sub-channel.

[0077] The above-mentioned fifth blocking plate 168 and sixth blocking plate 169 also extend radially along the annular reflector 42. One end of the fifth blocking plate 168 is connected to the side of the second arc-shaped partition plate 163 facing the first arc-shaped partition plate 162, and the other end is connected to the inner circumferential surface of the second annular partition plate 161. One end of the sixth blocking plate 169 is connected to the inner circumferential surface of the second annular partition plate 161, and there is a gap between the other end and the first annular partition plate 160.

[0078] It can be seen that the third baffle plate 166, the second curved partition plate 163, the fourth baffle plate 167, and the first annular partition plate 160 collectively form the inner air duct 1125. The second curved partition plate 163, the fourth baffle plate 167, a portion of the fifth baffle plate 168, the second baffle plate 165, a portion of the first curved partition plate 162, and the first annular partition plate 160 collectively form the first intermediate air duct 1126. The third baffle plate 166, the second curved partition plate 163, a portion of the fifth baffle plate 168, the first baffle plate 164, the remaining portion of the first curved partition plate 162, and the first annular partition plate 160 collectively form the second intermediate air duct 1127. The first curved partition plate 162, the second baffle plate 165, a portion of the fifth baffle plate 168, a portion of the second annular partition plate 161, the first annular partition plate 160, and the sixth baffle plate 169 collectively form a first external air duct 1128. The first curved partition plate 162, the first baffle plate 164, a portion of the fifth baffle plate 168, the remaining portion of the second annular partition plate 161, the first annular partition plate 160, and the sixth baffle plate 169 collectively form a second external air duct 1129. Due to a gap between the other end of the sixth baffle plate 169 and the first annular partition plate 160, the first external air duct 1128 and the second external air duct 1129 are connected.

[0079] Thus, in this embodiment, five ventilation ducts are formed, namely, an inner duct 1125, a first middle duct 1126, a second middle duct 1127, a first outer duct 1128, and a second outer duct 1129, which are arranged concentrically. Except for the inner duct 1125, the first middle duct 1126, the second middle duct 1127, the first outer duct 1128, and the second outer duct 1129 all include second communication areas. Along the radial direction of the annular reflector 42, a portion of the inner duct 1125, the second communication area of ​​the first middle duct 1126, and the second communication area of ​​the first outer duct 1128 are arranged sequentially from the inside of the mounting cavity to the outside of the mounting cavity. The remaining portion of the inner duct 1125, the second communication area of ​​the second middle duct 1127, and the second communication area of ​​the second outer duct 1129 are arranged sequentially from the inside of the mounting cavity to the outside of the mounting cavity.

[0080] With this design, the five ventilation ducts are all arc-shaped, and their centers are located on the central axis of the annular reflector 42. In this way, the cooling air flowing out of each sub-air inlet can flow smoothly along the corresponding arc-shaped ventilation duct with low wind resistance, so as to minimize the flow kinetic energy loss of the cooling air.

[0081] Of course, the number of ventilation ducts is not limited to the above number, and can be designed according to needs and actual working conditions.

[0082] As a further optional embodiment, please refer to Figure 8 and Figure 10The vertical projection of one of the communication openings 321 falls simultaneously into the first communication area of ​​the first external air duct 1128 and the first communication area of ​​the second external air duct 1129. This communication opening 321 is located in the gap between the first annular partition plate 160 and the sixth baffle plate 169. With this arrangement, the first external air duct 1128 and the second external air duct 1129 are connected.

[0083] In some embodiments, all communication openings 321 have the same flow area. Since each communication opening 321 has the same airflow volume per unit area, this embodiment designs each communication opening 321 to have the same flow area, and thus the airflow volume of each communication opening 321 is correspondingly the same. This further improves the uniformity of the distribution of cooling air within the protective cover 30, improves the consistency of the cooling air volume flowing from top to bottom to various parts of the annular reflector 42, and further improves the cooling uniformity of the annular reflector 42.

[0084] It can be understood that the number and total flow area of ​​the sub-inlets and the communication openings 321 corresponding to the inflow end of each ventilation duct are non-restrictive.

[0085] In one possible implementation, the total flow area of ​​the connecting openings 321 corresponding to each ventilation duct can be the same, and the total airflow volume of the connecting openings 321 corresponding to each ventilation duct is the same. When the flow area of ​​each connecting opening 321 is the same, the number of connecting openings 321 corresponding to each ventilation duct is also the same, and the ventilation volume delivered to each ventilation duct is the same. For example, the inflow end of each ventilation duct is connected to one sub-air inlet, and the outflow end is connected to one connecting opening. For another example, the inflow end of each ventilation duct is connected to one sub-air inlet, and the outflow end is connected to multiple connecting openings 321. On this basis, taking the number of connecting openings 321 as twelve and the ventilation duct being provided with four as an example, the outflow end of each ventilation duct is connected to three of the twelve connecting openings 321, and there are four sub-air inlets, and the ratio of the flow area of ​​the four sub-air inlets is 1:1:1:1. It should be understood that, compared with the embodiment in which the outflow end of each ventilation duct is connected to one connecting port 321, in which the outflow end of each ventilation duct is connected to multiple connecting ports 321, the number of ventilation ducts can be reduced, the structure of the ventilation duct is simplified, and the internal structure of the air inlet structure 11 can be simplified.

[0086] In one implementation, the number of the corresponding communication ports 321 connected to the outflow ends of at least two ventilation channels is different. Figure 8 and Figure 10 As shown, there are twelve communication ports 321 and five ventilation ducts. The inner duct 1125, the first middle duct 1126 and the second middle duct 1127 are respectively connected to three of the twelve communication ports 321. The ventilation volume of these three ventilation ducts is, for example, 2A m 3 / h, the first external air duct 1128 and the second external air duct 1129 are connected to the remaining three communication ports 321, and the ventilation volume of these two ventilation ducts is 1A m 3 / h.

[0087] Figure 11 This is a schematic diagram of the air inlet of the air inlet structure of the air cooling device provided in one embodiment of the present application. Please refer to Figures 8 to 11 In an embodiment in which five ventilation ducts are provided, namely an inner duct 1125, a first middle duct 1126, a second middle duct 1127, a first outer duct 1128, and a second outer duct 1129, and twelve communication ports 321 are provided, a first diverter plate 111 is provided within the air inlet, along with a second diverter plate 112 and a third diverter plate 113 that are parallel to each other. One end of the first diverter plate 111 is connected to the inner wall of the air inlet, and the other end is connected to the second diverter plate 112. The first diverter plate 111 and the third diverter plate 113 are cross-connected.

[0088] In this example, the air inlet 1122 is divided into five sub-air inlets 1122a, 1122b, 1122c, 1122d, and 1122e. The flow areas of the sub-air inlet 1122a corresponding to the inner air duct 1125, the sub-air inlet 1122b corresponding to the first middle air duct 1126, and the sub-air inlet 1122c corresponding to the second middle air duct 1127 are equal, for example, B m 2 Correspondingly, the flow areas of a sub-air inlet 1122d corresponding to the first external air duct 1128 and a sub-air inlet 1122e corresponding to the second external air duct 1129 are equal and both are 0.5B m 2 .

[0089] That is to say, if Figure 11 As shown, the sum of the flow areas of one sub-air inlet 1122a corresponding to the inner air duct 1125, one sub-air inlet 1122b corresponding to the first middle air duct 1126, one sub-air inlet 1122c corresponding to the second middle air duct 1127, one sub-air inlet 1122d corresponding to the first outer air duct 1128, and one sub-air inlet 1122e corresponding to the second outer air duct 1129 is 1:1:1:1. Thus, the ratio of the total flow area of ​​the connecting openings 321 corresponding to the ventilation ducts is the same as the ratio of the total flow area of ​​the corresponding sub-air inlets.

[0090] As an optional embodiment, please continue to refer to Figure 9Each sub-air inlet may further include a guide slope 1124 extending obliquely downward from the top to the bottom of the air inlet structure 11. The guide slope 1124 may be implemented by a guide block or guide plate fixedly disposed within the sub-air inlet, as long as the guide block or guide plate does not block the sub-air inlet.

[0091] With such a design, the guide slope 1124 can play a guiding role, so as to guide the cooling air to flow into the interior of the ventilation duct along the guide slope 1124 .

[0092] In some embodiments, please refer to Figure 4 The orthographic projection of each connecting port 321 on the top surface of the air inlet structure 11 is located between the orthographic projections of two adjacent heating lamps 41 on the top surface of the air inlet structure 11. Therefore, the cooling air entering the installation cavity through each connecting port 321 flows between the two adjacent heating lamps 41. The cooling air flowing between the two adjacent heating lamps 41 carries part of the heat of the heating lamps 41 and then diffuses downward to the second space, thereby achieving cooling of each heating lamp 41.

[0093] It should be noted that in embodiments where the orthographic projection of each communication opening 321 on the top surface of the air inlet structure 11 is located between the orthographic projections of two adjacent heating lamps 41 on the top surface of the air inlet structure 11, and all communication openings 321 have the same flow area, the volume and heat of the cooling air flowing through each surface of the upper dome 21 are substantially consistent, resulting in a consistent cooling effect across the upper dome 21. This improves the uniformity of the thin film grown across the lower surface of the upper dome 21, further facilitating a uniform distribution of infrared light passing through the upper dome 21. Consequently, when the semiconductor device 100 is used to perform an epitaxial growth process on the substrate 200, the epitaxial growth process achieves a high degree of uniformity.

[0094] It will be understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art will appreciate that various modifications and improvements can be made without departing from the spirit and substance of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. An air cooling device for semiconductor equipment, characterized in that: The semiconductor device includes a heating module and a protective cover, wherein the protective cover includes an annular shell and a top cover covering the top of the shell, wherein the inner circumference of the shell and the bottom surface of the top cover together form a mounting cavity for accommodating the heating module; the top cover is provided with a plurality of communication ports communicating with the mounting cavity, wherein the plurality of communication ports are spaced and evenly distributed around the central axis of the protective cover, and the shell is provided with an air outlet; the air cooling device includes: an air inlet structure provided above the protective cover; The air inlet structure includes: an air inlet provided on the top surface of the air inlet structure and a plurality of independent ventilation ducts located inside the air inlet structure; the air inlet includes a plurality of sub-air inlets, and the inflow end of each of the ventilation ducts is connected to at least one of the sub-air inlets, and the outflow end is connected to at least one of the connecting ports; The ratio of the total flow area of ​​the communication openings corresponding to the ventilation ducts to the total flow area of ​​the sub-air inlets corresponding thereto is the same.

2. The air cooling device according to claim 1, characterized in that An annular space is defined in the air inlet structure, and the annular space is divided into a plurality of ventilation channels; Each of the ventilation ducts includes at least a first communication area, and the first communication areas of the ventilation ducts are sequentially distributed around the central axis of the protective cover, and the vertical projection of the communication opening corresponding to each ventilation duct falls within the first communication area of ​​the ventilation duct; The ventilation duct having a first communication area that is not directly opposite to the corresponding sub-air inlet also includes a second communication area, which is connected to the first communication area of ​​the ventilation duct, and the second communication area extends along the circumference of the annular space to the corresponding sub-air inlet.

3. The air cooling device according to claim 2, characterized in that: The air inlet structure includes a first annular partition plate and a second annular partition plate which are coaxially arranged in the internal hollow cavity. The second annular partition plate is arranged around the outside of the first annular partition plate. The first annular partition plate, the second annular partition plate, the top surface and the bottom surface of the air inlet structure together form the annular space.

4. The air cooling device according to claim 2, characterized in that: There are five ventilation ducts, which are concentrically arranged inner duct, first middle duct, second middle duct, first outer duct, and second outer duct; except for the inner duct, the first middle duct, the second middle duct, the first outer duct, and the second outer duct all include a second connecting area; Part of the inner air duct, the second connecting area of ​​the first middle air duct and the second connecting area of ​​the first outer air duct are arranged in sequence from the inside of the installation cavity to the outside of the installation cavity, and the remaining part of the inner air duct, the second connecting area of ​​the second middle air duct and the second connecting area of ​​the second outer air duct are arranged in sequence from the inside of the installation cavity to the outside of the installation cavity.

5. The air cooling device according to claim 4, characterized in that: The orthographic projection of one of the communication openings in the vertical direction falls into the first communication area of ​​the first external air duct and the first communication area of ​​the second external air duct at the same time.

6. The air cooling device according to claim 4, characterized in that: The air inlet is provided with a first diverter plate, a second diverter plate and a third diverter plate parallel to each other; One end of the first diverter plate is connected to the inner wall of the air inlet, and the other end is connected to the second diverter plate, and the first diverter plate is cross-connected with the third diverter plate. The air inlet is divided into five sub-air inlets, and the five sub-air inlets are connected to the five ventilation ducts one by one.

7. The air cooling device according to claim 1, characterized in that: The total flow areas of the communication openings corresponding to the ventilation channels are the same; or, the total flow areas of the communication openings corresponding to at least two of the ventilation channels are different.

8. The air cooling device according to claim 1, characterized in that A guide slope is formed in each of the sub-air inlets, and the guide slope extends obliquely downward from the top surface to the bottom surface of the air inlet structure; and / or, The flow areas of the communication ports are the same.

9. A semiconductor device, characterized in that: include: process chamber; protective cover; A heating module is arranged in the installation cavity of the protective cover; as well as The air cooling device according to any one of claims 1 to 8, wherein the air inlet structure of the air cooling device is arranged above the protective cover.

10. The semiconductor device according to claim 9, wherein The heating module includes a plurality of heating lamps spaced and evenly distributed around the central axis of the protective cover; The orthographic projection of each of the communication ports on the top surface of the air inlet structure is located between the orthographic projections of two adjacent heating lamps on the top surface of the air inlet structure.

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