Warping degree measuring device

Abstract

A warping degree measuring device comprises a light-emitting platform, a light transmitting part and a light sensing unit, and the light-emitting platform is provided with a bearing surface for bearing and irradiating a target object; the light-transmitting piece is vertically arranged on the bearing surface; the light sensing unit is arranged on the light-emitting platform, is adjacent to the light transmitting piece and is used for obtaining a light spot area of the target object, and the light spot area has the maximum vertical height relative to the bearing surface and serves as the warping degree of the target object.

Description

Technical Field

[0001] The present disclosure relates to a measuring device, and more particularly to a warpage measuring device for measuring the warpage state of a carrier board. Background Art

[0002] Chip carriers, as the support for electronic components and the carrier for electrical connections within electronic products, significantly impact their performance. With the advancement of miniaturization and high integration in electronic products, the performance requirements for circuit boards are becoming increasingly stringent. During electronics manufacturing and assembly, ensuring the flatness and accuracy of chip carriers is crucial for proper operation and reliability, especially during shipment when warpage is inspected. Warp measurement accuracy must be guaranteed while maintaining high efficiency.

[0003] The mainstream method for measuring carrier warpage currently uses a Shadow Moire measurement system. However, this system is expensive, takes a long time to analyze, and requires specific dimensions for the carrier being measured. Another alternative is the use of a pingauge, which uses a gap gauge for manual measurement. However, this method is subject to significant errors, high labor and time costs, and the possibility of damage to the carrier surface when the gap gauge comes into direct contact with the carrier.

[0004] Therefore, how to overcome the various problems of the above-mentioned prior art has become a topic that needs to be solved urgently. Summary of the Invention

[0005] The present disclosure aims to provide a warpage measurement device to solve at least one of the above problems.

[0006] The present disclosure provides a warpage measurement device, comprising: a light-emitting platform having a supporting surface for supporting and illuminating a target; a light-transmitting element disposed upright on the supporting surface and in close contact with a side of the target; and a photosensitive unit disposed on the light-emitting platform and adjacent to the light-transmitting element for capturing a light spot region of the target. The light spot region has a maximum vertical height relative to the supporting surface, which serves as the warpage of the target.

[0007] As in the aforementioned warpage measuring device, the light-emitting platform includes a platform body having the supporting surface and a light-emitting element disposed on another surface opposite to the supporting surface.

[0008] As in the aforementioned warpage measuring device, the platform body is made of a light-transmitting material so that the light emitted by the light-emitting element can pass through the platform body to illuminate the target object.

[0009] As in the aforementioned warpage measuring device, the light-emitting element is a surface light source.

[0010] The warpage measuring device as described above further includes a fixing member, which is erected on the supporting surface and is located on two opposite sides of the supporting surface with the light-transmitting member, so that the fixing member and the light-transmitting member clamp the target object.

[0011] The warpage measuring device as described above further comprises a track structure provided on the supporting surface, so that the fixing member can be linearly displaced along the track structure.

[0012] As in the aforementioned warpage measuring device, the track structure has two support plates and a plurality of guide rails arranged on the two support plates, the fixing member has a plurality of guide grooves, the two support plates are erected on the supporting surface and are respectively located on opposite sides of the light-transmitting member and the fixing member, and the plurality of guide grooves are slidably arranged on the guide rails.

[0013] The warpage measuring device as described above further includes at least one calibration member disposed on the supporting surface and abutting against the fixing member, so as to keep the surface of the fixing member parallel to the light-transmitting member during the movement of the fixing member.

[0014] As in the aforementioned warpage measuring device, the photosensitive unit includes a photosensitive element and a slide rail. The slide rail is disposed on the light-emitting platform, and the photosensitive element is slidably disposed on the slide rail.

[0015] As in the aforementioned warpage measurement device, the light spot area is arched.

[0016] In summary, the fixing parts in the warpage measuring device disclosed in the present invention are movable and can match carriers of different sizes, and the photosensitive elements can adopt existing specifications. Therefore, the overall structure of the warpage measuring device disclosed in the present invention is simple and easy to build, and the cost is low. Furthermore, the warpage measuring device disclosed in the present invention is more accurate than manual measurement, and non-contact measurement can be achieved for important areas on the surface of the carrier during the measurement process, avoiding damage to the surface of the carrier. In addition, the present invention can adopt automated analysis to greatly reduce time costs, and the error is extremely small. Compared with the current plug gauges and high-end warpage measurement equipment, the present invention has the advantage of being more efficient. In addition, the photosensitive element in the warpage measuring device disclosed in the present invention can adjust the shooting position, angle and direction, which can effectively reduce the influence of the carrier automatically on the warpage of the measurement plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of a three-dimensional perspective view of the warpage measurement device disclosed herein.

[0018] Figure 2 Schematic diagram of the use effect of the warpage measurement device disclosed in the present invention.

[0019] The reference numerals are as follows:

[0020] 1. Warpage measurement device

[0021] 10 Illuminated Platform

[0022] 10a bearing surface

[0023] 100 Platform

[0024] 101 Luminous Parts

[0025] 11 Translucent parts

[0026] 12 photosensitive units

[0027] 120 slide rails

[0028] 121 Photosensitive element

[0029] 13 Fixing parts

[0030] 130 guide groove

[0031] 14 Track structure

[0032] 140 guide rail

[0033] 141 support plate

[0034] 15 Calibration parts

[0035] 9 Target

[0036] A Light spot area

[0037] H Maximum vertical height

[0038] S: Storage space. DETAILED DESCRIPTION

[0039] The following describes the embodiments of the present disclosure with reference to specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification.

[0040] It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present disclosure. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed in the present disclosure without affecting the efficacy and purpose that can be achieved by the present disclosure. At the same time, terms such as "on", "one", "at least one", etc. quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of the present disclosure. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present disclosure without substantially changing the technical content.

[0041] See also Figure 1The warpage measurement device 1 disclosed herein is used to measure the warpage state of a substrate in a semiconductor process. The warpage measurement device 1 includes a light-emitting platform 10, a light-transmitting member 11, a light-sensing unit 12, a fixing member 13, a track structure 14, and at least one calibration member 15. The light-transmitting member 11 is vertically mounted on the light-emitting platform 10, the light-sensing unit 12 is disposed on the light-emitting platform 10 and adjacent to the light-transmitting member 11, the fixing member 13 is vertically mounted on the light-emitting platform 10 and spaced apart from the light-transmitting member 11, the track structure 14 is disposed on the light-emitting platform 10 and is located on opposite sides of the light-transmitting member 11 and the fixing member 13, and the calibration member 15 is disposed on the light-emitting platform 10 and abuts against the fixing member 13.

[0042] The light-emitting platform 10 includes a platform body 100 and a light-emitting element 101. The platform body 100 has a supporting surface 10a. The light-emitting element 101 is disposed on a surface opposite to the supporting surface 10a, that is, the light-emitting element 101 is disposed at the bottom of the platform body 100. The supporting surface 10a is used to support a target 9.

[0043] In this embodiment, the platform body 100 is a rectangular stage made of a light-transmitting material (e.g., a transparent material). The light-emitting element 101 is a surface light source, and the light emitted by the light-emitting element 101 can pass through the platform body 100 to illuminate the target object 9. For example, the light-emitting element 101 can emit uniform light to serve as a backlight source, and the platform body 100 can homogenize the light source so that the light of the light-emitting element 101 can be evenly dispersed and penetrate the platform body 100, and at the same time have a heat dissipation function. In addition, the illumination area of ​​the light-emitting element 101 can be controlled to be limited to the range of the supporting surface 10a in front of the photosensitive unit 12, or the platform body 100 behind the light-transmitting element 11 can be made not to transmit light, for example, a light-proof material is set on the platform body 100 to block the light, etc.

[0044] The light-transmitting member 11 is disposed upright on the supporting surface 10a and is in close contact with one side of the target object 9. The fixing member 13 is disposed upright on the supporting surface 10a and is located on opposite sides of the supporting surface 10a with the light-transmitting member 11. The fixing member 13 is positioned against the other side of the target object 9, so that the fixing member 13 and the light-transmitting member 11 together clamp the opposite sides of the target object 9. In this embodiment, the light-transmitting member 11 and the fixing member 13 may be rectangular clamping plates made of a light-transmitting material, but the present disclosure is not limited thereto.

[0045] Furthermore, the fixing member 13 is movable and has a plurality of guide slots 130 that can be linearly displaced in conjunction with the track structure 14, for example, toward or away from the light-transmitting member 11. The plurality of guide slots 130 can be provided at the four corners of the fixing member 13.

[0046] In this embodiment, the track structure 14 comprises a plurality of guide rails 140 and two support plates 141. The support plates 141 are erected on the supporting surface 10a and located on opposite sides of the light-transmitting member 11 and the fixing member 13. Together with the light-transmitting member 11, the fixing member 13, and the platform body 100, they define a receiving space S. The guide rails 140 are arranged in groups of two at the top and bottom edges of the support plates 141, facing the receiving space S. One end of each guide rail 140 can be fixed to the light-transmitting member 11, allowing the guide grooves 130 at the four corners of the fixing member 13 to slide onto the guide rails 140, allowing the guide rails 140 to engage within the guide grooves 130. The cross-section of the guide grooves 130 (e.g., a square cross-section) can be approximately equal to the cross-section of the guide rails 140 (e.g., a square cross-section), enabling the fixing member 13 to move smoothly and linearly forward and backward, preventing wobbling during movement.

[0047] In this embodiment, the guide rail 140 may be a guide edge, and the support plate 141 may be a rectangular clamping plate made of a light-transmitting material, but the present disclosure is not limited thereto.

[0048] Calibration members 15 (e.g., two) are disposed on the support surface 10a and abut the fixed member 13 to maintain the surface of the fixed member 13 parallel to the light-transmitting member 11 during movement of the fixed member 13. For example, calibration member 15 may be a right-angle bracket, with one side of the right angle disposed on a reference surface (e.g., the support surface 10a) and the other side of the right angle abutting the fixed member 13 to ensure that the fixed member 13 is firmly pressed against the target object 9. Alternatively, two calibration members 15 may be disposed on the support plate 141 and abut the fixed member 13. The number of calibration members 15 can be configured as needed, and this disclosure is not limited thereto.

[0049] The target object 9 is a wafer, a carrier for carrying semiconductor chips (such as a package substrate, a wire bonding frame, a silicon interposer or other carrier), or other plate material, without particular limitation.

[0050] The photosensitive unit 12 includes a photosensitive element 121 and a slide rail 120. The slide rail 120 is disposed on the light-emitting platform 10 and outside the accommodation space S. The photosensitive element 121 slides on the slide rail 120 and is adjacent to the light-transmitting member 11 and can be electrically connected to a terminal computer (not shown). In this embodiment, the photosensitive element 121 can be a charge-coupled device (CCD) or a complementary metal oxide semiconductor (CMOS), but the present disclosure is not limited thereto.

[0051] When using the warpage measurement device 1 of the present disclosure, the light-emitting element 101 and the light-sensing element 121 are first turned on. Next, the target object 9 is placed on the supporting surface 10a of the platform body 100 within the accommodation space S, so that the target object 9 assumes an upwardly arched position and the rear side of the target object 9 is in close contact with the light-transmitting element 11.

[0052] Afterwards, the fixing member 13 is slowly moved along the track structure 14 toward the transparent member 11, and at the same time, the correction member 15 is used to ensure that the fixing member 13 is pushed toward the target object 9 at a parallel angle until the fixing member 13 contacts the front side of the target object 9 and clamps the target object 9 together with the transparent member 11.

[0053] Finally, the photosensitive element 121 is slid along the slide rail 120 to an appropriate position to perform a photosensitive operation on the target 9 (e.g., capture an image, the capture range covers the target 9 and the supporting surface 10a), so as to obtain a light spot area A of the target 9, such as Figure 2 As shown in FIG. 1 , the light emitted by the light emitting element 101 is blocked by the target 9, so the light spot area A is only formed between the target 9 and the supporting surface 10a. In this embodiment, the light spot area A is arched.

[0054] Furthermore, the light-sensing range of the photosensitive element 121 can correspond to the distribution range of the light spot area A, so that a single image can cover the entire target object 9, the supporting surface 10a, and the light spot area A. However, if a single image still cannot cover the entire target object 9, the supporting surface 10a, and the light spot area A, the photosensitive element 121 can capture multiple images at different positions along the slide rail 120, and the terminal computer can combine the multiple images to obtain the light spot area A corresponding to the target object 9. Furthermore, the photosensitive element 121 can also adjust the shooting angle and direction to make the image meet the needs.

[0055] After obtaining the light spot area A of the target object 9, the terminal computer can calculate the maximum vertical height H of the light spot area A relative to the supporting surface 10a. The maximum vertical height H can be used as the warping degree of the target object 9. For example, the larger the maximum vertical height H, the higher the warping degree of the target object 9.

[0056] In summary, the fixing parts in the warpage measuring device disclosed in the present invention are movable and can match carriers of different sizes, and the photosensitive elements can adopt existing specifications. Therefore, the overall structure of the warpage measuring device disclosed in the present invention is simple and easy to build, and the cost is low. Furthermore, the warpage measuring device disclosed in the present invention is more accurate than manual measurement, and non-contact measurement can be achieved for important areas on the surface of the carrier during the measurement process, avoiding damage to the surface of the carrier. In addition, the present invention can adopt automated analysis to greatly reduce time costs, and the error is extremely small. Compared with the current plug gauges and high-end warpage measurement equipment, the present invention has the advantage of being more efficient. In addition, the photosensitive element in the warpage measuring device disclosed in the present invention can adjust the shooting position, angle and direction, which can effectively reduce the influence of the carrier automatically on the warpage of the measurement plate.

[0057] The above embodiments are intended to illustrate the principles and effects of the present disclosure and are not intended to limit the present disclosure. Those skilled in the art may modify the above embodiments without departing from the spirit and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be as set forth in the claims.

Claims

1. A warpage measuring device, characterized in that: include: The light-emitting platform has a supporting surface for supporting and illuminating a target object; a light-transmitting member, erected on the supporting surface and closely attached to one side of the target object; as well as The photosensitive unit is disposed on the light-emitting platform and adjacent to the light-transmitting component for obtaining a light spot area of ​​the target object, wherein the light spot area has a maximum vertical height relative to the supporting surface as the warpage of the target object.

2. The warpage measuring device according to claim 1, wherein: The light-emitting platform includes a platform body having the carrying surface and a light-emitting component arranged on the other surface opposite to the carrying surface.

3. The warpage measuring device according to claim 2, wherein: The platform body is made of a light-transmitting material so that the light emitted by the light-emitting element can pass through the platform body to illuminate the target object.

4. The warpage measuring device according to claim 2, wherein: The light-emitting element is a surface light source.

5. The warpage measuring device according to claim 1, wherein: The warpage measuring device further includes a fixing member erected on the carrying surface and located on two opposite sides of the carrying surface with the light-transmitting member, so that the fixing member and the light-transmitting member clamp the target object.

6. The warpage measuring device according to claim 5, wherein: The warpage measuring device further comprises a track structure arranged on the bearing surface, so as to enable the fixing component to move linearly along the track structure.

7. The warpage measuring device according to claim 6, wherein: The track structure has two support plates and multiple guide rails arranged on the two support plates. The fixing member has multiple guide grooves. The two support plates are erected on the supporting surface and are respectively located on opposite sides of the light-transmitting member and the fixing member, and the multiple guide grooves are slidably arranged on the guide rails.

8. The warpage measuring device according to claim 6, wherein: The warpage measuring device further includes at least one calibration member disposed on the carrying surface and abutting against the fixing member, so as to keep the surface of the fixing member parallel to the light-transmitting member during the movement of the fixing member.

9. The warpage measuring device according to claim 1, wherein: The photosensitive unit includes a photosensitive element and a slide rail. The slide rail is arranged on the light-emitting platform, and the photosensitive element is slidably arranged on the slide rail.

10. The warpage measuring device according to claim 1, wherein: The light spot area is arched.

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