A semiconductor chip on-line testing device

Abstract

The application provides a kind of semiconductor chip on-line testing device, specifically relates to chip performance test technical field, including test box, the top of one side of test box is equipped with main controller, the middle part of the inner chamber of test box is fixedly provided with vertical heat insulation plate, the test space is divided into independent low-temperature test area and high-temperature test area by vertical heat insulation plate and horizontal heat insulation plate, annular groove is equipped on the top surface of horizontal heat insulation plate and the position corresponding to permanent magnet ring, and two symmetrical permanent magnet blocks are slidably arranged in the annular groove, the positions of the two permanent magnet blocks correspond to the positions of the permanent magnet ring, the test plate can enter different temperature zones simultaneously for synchronous testing under the driving of the circular plate, avoiding the temperature fluctuation problem caused by switching environment and exposing environment in the prior art, without frequent adjustment of temperature zone temperature, both ensuring the stability of test environment and improving the test efficiency of semiconductor chip.

Description

Technical Field

[0001] This invention provides an online testing device for semiconductor chips, specifically relating to the field of chip performance testing technology. Background Technology

[0002] High and low temperature testing is an indispensable part of semiconductor chip development, used to verify the chip's ability to operate under extreme temperature conditions. By simulating the chip's operation in different temperature environments, it can be ensured that it can operate stably in a wide range of usage environments.

[0003] A search revealed that CN117169699B, a patent announcement number, discloses a chip high and low temperature testing device. Under the action of a connecting platform, a temperature control mechanism moves towards the chip on the placement platform. With the cooperation of the temperature control mechanism, a linear temperature test is performed on the chip. When switching to instantaneous temperature testing, the temperatures of the two sets of temperature control mechanisms are set relative to each other and move closer to the chip on the placement platform. As the connecting platform moves upward, it drives the drive rod upward. Under the action of a switching block, the slider and the spiral groove collide, causing the rotating platform to rotate and the two placement platforms to switch positions. This achieves the effect of performing different testing methods on chips with different requirements.

[0004] The aforementioned testing apparatus achieves high and low temperature testing switching through "stage repositioning," which is a form of "time-sharing testing" (the same chip experiences high and low temperatures sequentially) rather than "synchronous testing" (multiple chips simultaneously in different temperature zones). This limits overall testing efficiency and fails to meet the demands of large-scale parallel testing. More importantly, when switching stages for instantaneous temperature testing, the testing environment is completely exposed, directly disrupting the constant temperature of the testing environment and affecting the high and low temperature testing of the semiconductor chip. Adjusting the testing environment temperature again would undoubtedly increase the time and manpower costs of the testing process; while directly testing the chip would lead to data distortion.

[0005] Therefore, this invention proposes an online testing device for semiconductor chips to overcome the shortcomings of existing technologies. Summary of the Invention

[0006] In view of the shortcomings of the existing technology, the present invention provides a semiconductor chip online testing device, which can effectively solve the related technical problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] This invention discloses an online semiconductor chip testing device, including a test chamber. A main controller is installed on the top of one side of the test chamber. A vertical heat insulation plate is fixedly installed in the middle of the inner cavity of the test chamber, and two sealing holes are symmetrically provided on the side of the vertical heat insulation plate near its bottom. A horizontal heat insulation plate is fixedly installed in the inner cavity of the test chamber and directly below the vertical heat insulation plate. A test space is formed in the inner cavity of the test chamber and above the horizontal heat insulation plate through the horizontal heat insulation plate. The test space is symmetrically arranged on both sides with the vertical heat insulation plate as the middle boundary, with a low temperature test area and a high temperature test area respectively.

[0009] The testing mechanism, located inside the testing chamber, includes: a drive module, a switching testing module, and an adsorption module;

[0010] The drive module is located at the bottom of the horizontal heat insulation plate and includes a drive motor, a transmission component, and a horizontal plate. The transmission component includes a gear transmission mechanism or a synchronous belt transmission mechanism, which can transmit the rotational motion of the drive motor to the horizontal plate.

[0011] The switching test module is set on the upper and lower sides of the horizontal heat insulation plate. It includes two test boards for loading semiconductor chips and a circular plate set outside the two test boards. The circular plate is sealed through two sealing holes. The low temperature test area and the high temperature test area are isolated by the circular plate and the vertical heat insulation plate. After the semiconductor chip is loaded on the test board, high and low temperature tests are performed simultaneously in the two test areas.

[0012] The aforementioned drive motor drives the transmission components to rotate the horizontal plate half a revolution, thereby causing the switching test module to rotate synchronously.

[0013] The adsorption module is located on the side of the vertical heat insulation plate near the low temperature test area, and is situated on the path along which the drive module rotates from the high temperature test area to the low temperature test area to switch the test module.

[0014] The switching test module also includes a permanent magnet ring fixedly connected to the top of the horizontal plate. An annular groove is provided on the top surface of the horizontal heat insulation plate at a position corresponding to the permanent magnet ring. Two symmetrically arranged permanent magnet blocks are slidably arranged in the annular groove. The positions of the two permanent magnet blocks correspond vertically to the position of the permanent magnet ring, and the two have opposite magnetic properties. The top of the permanent magnet blocks is fixedly connected to the bottom of the test plate.

[0015] A perforated layer is provided inside the horizontal heat insulation plate at the position corresponding to the permanent magnet ring and permanent magnet block;

[0016] A semi-ring plate is fixedly installed between the two permanent magnet blocks. The semi-ring plate is located in the annular groove. The bottom of the vertical heat insulation plate has a notch for the permanent magnet blocks and the semi-ring plate to pass through. The semi-ring plate is always sealed in the notch.

[0017] The adsorption module includes a first electric telescopic rod fixedly installed on one side of a vertical heat insulation plate near the low-temperature test area, and a wiping component for adsorbing water droplets is connected to the telescopic end of the first electric telescopic rod.

[0018] Preferably, both the vertical and horizontal insulation panels are made of aerogel material.

[0019] Preferably, the drive motor is fixedly installed on the bottom surface of the test chamber, and the shaft of the drive motor is connected to the transmission assembly, and the top of the transmission assembly on the side away from the shaft is fixedly connected to the cross plate.

[0020] Preferably, the wiping assembly consists of a housing, a connector plate, and an absorbent cotton strip. The housing is fixedly connected to the telescopic end of the first electric telescopic rod. The top of the connector plate is provided with a T-shaped protrusion, which is inserted into the T-shaped groove on the top of the housing. The absorbent cotton strip is adhered to the bottom surface of the connector plate. The bottom and one side of the housing are provided with openings, and the bottom of the absorbent cotton strip is located at the opening at the bottom.

[0021] Preferably, a processing mechanism is provided below the wiping assembly and on the vertical heat insulation plate. The mechanism includes two electric guide rails fixedly installed on the side of the vertical heat insulation plate near the wiping assembly. Electric sliders are slidably connected to both electric guide rails. A second electric telescopic rod is fixedly installed on the top of each electric slider. A collection box is fixedly connected to the telescopic end of the second electric telescopic rod. A grid plate is slidably connected inside the collection box. At least four springs are evenly connected between the bottom of the grid plate and the bottom surface inside the collection box. The at least four springs are arranged symmetrically in pairs.

[0022] When the electric slider slides and moves to the end of its stroke on the electric guide rail, the collection box is located directly below the absorbent cotton strip in the wiping assembly. When the extension end of the second electric telescopic rod extends to the end of its stroke, the collection box covers the outside of the absorbent cotton strip, and the grid plate and the absorbent cotton strip are pressed together.

[0023] Preferably, the bottom of the collection box is connected to a drain pipe for connecting to an external pipe body.

[0024] Compared with the known prior art, the technical solution provided by this invention has the following beneficial effects:

[0025] Compared with existing technologies, this online semiconductor chip testing device divides the testing space into independent low-temperature and high-temperature testing zones using vertical and horizontal heat insulation plates. The test board can simultaneously enter different temperature zones for synchronous testing under the drive of the ring plate, avoiding the temperature fluctuation problem caused by environmental exposure when switching environments in existing technologies. It eliminates the need for frequent temperature adjustments, ensuring the stability of the testing environment and improving the testing efficiency of semiconductor chips.

[0026] The drive module uses a hollow layer of permanent magnet ring to transmit power, ensuring the airtightness of the two test spaces, thereby ensuring the temperature stability of the two test areas.

[0027] After cleaning is completed by the first electric telescopic rod, the collection box is raised by the electric guide rail. The grid plate squeezes the absorbent cotton strips and collects the waste liquid into the collection box. This not only ensures the absorbency of the absorbent cotton strips, but also prevents the waste liquid from dripping and contaminating the test space or chip. The drain pipe at the bottom of the collection box can be connected to an external recycling system to realize centralized treatment of waste liquid and prevent waste liquid from remaining in the test space and affecting the humidity of the test space.

[0028] In summary, this testing device, through the coordinated design of the testing mechanism, adsorption module, and processing mechanism, systematically solves the problems of low testing efficiency, poor environmental stability, and high pollution risk in existing technologies, forming a technical closed loop of "synchronous testing, clean transmission, and automatic cleaning," providing a high-precision and highly adaptable innovative solution for the temperature resistance testing of semiconductor chips. Attached Figure Description

[0029] Figure 1 This is a front-view perspective view of the present invention.

[0030] Figure 2 This is a three-dimensional structural diagram of the test box in cross-section in this invention;

[0031] Figure 3 This is a three-dimensional structural diagram of the test box in the cross-section state from another perspective in this invention;

[0032] Figure 4 This is a partial three-dimensional structural diagram of the relevant components at the drive motor in this invention;

[0033] Figure 5 This is a partial three-dimensional structural diagram of the relevant components at the annular groove in this invention;

[0034] Figure 6 This is a partially exploded three-dimensional structural diagram of the relevant components at the switching test module in this invention;

[0035] Figure 7 This is a partial three-dimensional structural diagram of the relevant components in the cross-section state of the horizontal heat insulation plate in this invention;

[0036] Figure 8 This is a partially exploded three-dimensional structural view of the wiping component in this invention;

[0037] Figure 9 This is a schematic diagram showing the motion state of components such as the test board in this invention;

[0038] Figure 10 This is a partial three-dimensional structural diagram of the relevant components at the grid plate in this invention;

[0039] Figure 11 This is a partial bottom-view three-dimensional structural diagram of the electric guide rail in this invention;

[0040] Figure 12 This is a partial three-dimensional structural diagram of the relevant components in the cross-section state of the collection box in this invention.

[0041] The labels in the diagram represent:

[0042] 1. Test chamber; 11. Main controller; 12. Vertical heat insulation plate; 121. Sealing hole; 13. Horizontal heat insulation plate; 131. Perforated layer;

[0043] Testing organization:

[0044] Drive module: 21. Drive motor; 22. Transmission assembly; 23. Horizontal plate;

[0045] Switching test modules: 24. Permanent magnet ring; 25. Annular groove; 26. Permanent magnet block; 261. Semi-annular plate; 27. Test board; 28. Circular plate;

[0046] Adsorption module: 29. First electric telescopic rod; 210. Wiping assembly;

[0047] Processing mechanism: 31. Electric guide rail; 32. Electric slider; 33. Second electric telescopic rod; 34. Collection box; 35. Grid plate; 36. Spring. Detailed Implementation

[0048] The present invention will be further described below with reference to embodiments.

[0049] Example 1:

[0050] like Figures 1 to 9 As shown, an online semiconductor chip testing device includes a test chamber 1 and a cooling and heating device mounted on the test chamber 1. A main controller 11 is installed on the top of one side of the test chamber 1. A vertical heat insulation plate 12 is fixedly installed in the middle of the inner cavity of the test chamber 1, and two sealing holes 121 are symmetrically provided on the side of the vertical heat insulation plate 12 near its bottom. A horizontal heat insulation plate 13 is fixedly installed in the inner cavity of the test chamber 1 directly below the vertical heat insulation plate 12. A test space is formed in the inner cavity of the test chamber 1 above the horizontal heat insulation plate 13. The test space is symmetrically arranged on both sides with the vertical heat insulation plate 12 as the middle boundary, with a low temperature test area and a high temperature test area respectively. Both the vertical heat insulation plate 12 and the horizontal heat insulation plate 13 are made of aerogel material, which serves to both block heat exchange and allow magnetic force to pass through, ensuring temperature stability during the switching process.

[0051] Specifically, the aforementioned refrigeration device and heating device are both existing technologies. They are located on the top of the test chamber 1 and are both controlled by the main controller 11. Their output / air supply ends are both installed inside the test chamber 1 and correspond to the low-temperature test area and the high-temperature test area, respectively.

[0052] The testing mechanism, located inside test box 1, includes: a drive module and a switching test module.

[0053] The drive module, located at the bottom of the horizontal heat insulation plate 13, includes a drive motor 21, a transmission assembly 22, and a horizontal plate 23. The transmission assembly 22 includes a gear transmission mechanism or a synchronous belt transmission mechanism, which can transmit the rotational motion of the drive motor 21 to the horizontal plate 23.

[0054] The drive motor 21 is fixedly installed on the bottom surface of the inner cavity of the test chamber 1, and the shaft of the drive motor 21 is connected to the transmission assembly 22. The top of the transmission assembly 22 on the side away from the shaft is fixedly connected to the horizontal plate 23.

[0055] Preferably, the transmission assembly 22 is a gear transmission mechanism, configured as follows: a set of two meshing gears, one large and one small, wherein the small gear is coaxially connected to the shaft of the drive motor 21 via a coupling, while the large gear is rotatably mounted on the bottom of the horizontal heat insulation plate 13, and its top center is fixedly connected to the bottom center of the horizontal plate 23. Alternatively, the transmission assembly 22 can also be a synchronous belt transmission mechanism, specifically consisting of two synchronous pulleys and a synchronous belt connecting the two pulleys, wherein one synchronous pulley is connected to the shaft of the drive motor 21, and the other synchronous pulley is fixedly connected to the bottom center of the horizontal plate 23.

[0056] Note: Other mechanisms that can drive the shaft of the drive motor 21 to drive the horizontal plate 23 to rotate synchronously can also be used. Gear transmission mechanism and synchronous belt transmission mechanism are conventional transmission methods in the mechanical field. Those skilled in the art can choose the appropriate transmission form according to actual needs.

[0057] The switching test module is set on the upper and lower sides of the horizontal heat insulation plate 13. It includes two test plates 27 for loading semiconductor chips and a circular plate 28 set outside the two test plates 27. The circular plate 28 is sealed through two sealing holes 121. The low temperature test area and the high temperature test area are isolated by the circular plate 28 and the vertical heat insulation plate 12. After the semiconductor chip is loaded on the test plate 27, high and low temperature tests are performed simultaneously in the two test areas. The upper surface of the test plate 27 is evenly provided with multiple loading slots for loading semiconductor chips.

[0058] The switching test module also includes a permanent magnet ring 24 fixedly connected to the top of the horizontal plate 23. An annular groove 25 is provided on the top surface of the horizontal heat insulation plate 13 at a position corresponding to the permanent magnet ring 24. Two symmetrically arranged permanent magnet blocks 26 are slidably disposed within the annular groove 25. The positions of the two permanent magnet blocks 26 correspond vertically to the positions of the permanent magnet ring 24, and they have opposite magnetic properties. Both are made of neodymium iron boron material. Furthermore, the top of the permanent magnet blocks 26 is fixedly connected to the bottom of the test plate 27.

[0059] The drive motor 21 drives the transmission assembly 22 to rotate the horizontal plate 23 half a revolution, and then drives the switching test module to rotate synchronously.

[0060] Furthermore, a perforated layer 131 is provided inside the horizontal heat insulation plate 13 at a position corresponding to the permanent magnet ring 24 and the permanent magnet block 26. Its function is to further reduce the influence on the magnetic attraction between the permanent magnet ring 24 and the permanent magnet block 26.

[0061] Furthermore, a semi-ring plate 261 is fixedly installed between the two permanent magnet blocks 26. The semi-ring plate 261 is located in the annular groove 25. The bottom of the vertical heat insulation plate 12 is provided with a notch for the permanent magnet blocks 26 and the semi-ring plate 261 to pass through. The semi-ring plate 261 is always sealed in the notch. Its function is to ensure the sealing barrier between the high and low temperature test areas of the vertical heat insulation plate 12.

[0062] In use: First, the operator loads each semiconductor chip to be tested onto the loading slot of the test board 27. Then, the main controller 11 activates the cooling and heating devices to deliver cold / hot airflow to the low-temperature test area and high-temperature test area separated by the vertical heat insulation plate 12 and the horizontal heat insulation plate 13 within the test chamber 1, creating a stable test environment. The semiconductor chips in both areas are then subjected to simultaneous high and low temperature tests.

[0063] The permanent magnet block 26 at the bottom of the test board 27 and the permanent magnet ring 24 at the bottom of the horizontal plate 23 are magnetically coupled through the perforated layer 131 of the horizontal heat insulation plate 13. The semi-annular plate 261 simultaneously seals the gap in the vertical heat insulation plate 12, ensuring the temperature zone is sealed and isolated. After the above tests are completed, when an instantaneous temperature test is required, the drive motor 21 is started, and the horizontal plate 23 is rotated half a revolution through the transmission component 22. The horizontal plate 23 drives the permanent magnet ring 24 to rotate, and the magnetic field penetrates the horizontal heat insulation plate 13 to drive the permanent magnet block 26 to slide in the annular groove 25. This causes the test board 27 and the annular plate 28 to rotate around the central axis of the vertical heat insulation plate 12, causing the semiconductor chip in the high-temperature test area to rotate towards the low-temperature test area, realizing the synchronous switching of the two semiconductor chips in the high and low temperature zones. For details, please refer to [reference needed]. Figure 9 As shown.

[0064] Example 2:

[0065] like Figure 8 , Figure 9 As shown, the above-mentioned online semiconductor chip testing device also includes an adsorption module, which is disposed on the side of the vertical heat insulation plate 12 near the low temperature test area, and is located on the path of the drive module driving the switching test module to rotate from the high temperature test area to the low temperature test area.

[0066] The adsorption module includes a first electric telescopic rod 29 fixedly installed on the side of the vertical heat insulation plate 12 near the low temperature test area, and a wiping component 210 for adsorbing water droplets is connected to the telescopic end of the first electric telescopic rod 29; the adsorption module also includes a detection sensor set on the vertical heat insulation plate 12.

[0067] The wiping assembly 210 consists of an outer shell, a connector plate, and an absorbent cotton strip. The outer shell is fixedly connected to the telescopic end of the first electric telescopic rod 29. The top of the connector plate is provided with a T-shaped protrusion, which is inserted into the T-shaped groove on the top of the outer shell. The absorbent cotton strip is adhered to the bottom surface of the connector plate. The bottom and one side of the outer shell are provided with openings. The bottom of the absorbent cotton strip is located at the bottom opening. Specifically, the bottom of the connector plate is provided with Velcro, and the absorbent cotton strip is adhered to the Velcro.

[0068] In use: When the semiconductor chip rotates from the high-temperature test zone to the low-temperature test zone, condensation may form on the surface of the semiconductor chip due to the sudden temperature drop. The adsorption module is located at a fixed position on this rotation path. When the main controller 11 detects the preset coordinates of the test board 27 before it enters the low-temperature test zone through the detection sensor, it automatically triggers the first electric telescopic rod 29 to move.

[0069] The telescopic end of the first telescopic rod 29 drives the wiping assembly 210 to extend towards the rotating chip surface, allowing the absorbent cotton strip to adhere to the top surface of the semiconductor chip and the test board 27, quickly absorbing the condensate on the semiconductor chip surface. After wiping is completed, the telescopic end of the first telescopic rod 29 retracts, and the wiping assembly 210 returns to its initial position.

[0070] When the absorbent swab is saturated or heavily contaminated, staff can manually pull both sides of the absorbent swab and use the sliding structure between the T-shaped protrusion and the outer shell to pull the plug-in plate out from the top of the outer shell; tear off the old absorbent swab, attach the new swab, and reinsert it into the outer shell to complete the replacement.

[0071] Example 3:

[0072] like Figures 10 to 12 As shown, the above-mentioned semiconductor chip online testing device also includes a processing mechanism disposed below the wiping assembly 210 and located on the vertical heat insulation plate 12;

[0073] It includes two electric guide rails 31 fixedly installed on the side of the vertical heat insulation plate 12 near the wiping assembly 210. Electric sliders 32 are slidably connected to both electric guide rails 31. A second electric telescopic rod 33 is fixedly installed on the top of each electric slider 32. A collection box 34 is fixedly connected to the telescopic end of the second electric telescopic rod 33. A grid plate 35 is slidably connected inside the collection box 34. At least four springs 36 are evenly connected between the bottom of the grid plate 35 and the bottom surface inside the collection box 34, and the at least four springs 36 are arranged symmetrically in pairs.

[0074] When the electric slider 32 slides and moves to the end of its stroke on the electric guide rail 31, the collection box 34 is located directly below the absorbent cotton strip in the wiping assembly 210. When the extension end of the second electric telescopic rod 33 extends to the end of its stroke, the collection box 34 covers the outside of the absorbent cotton strip, and the grid plate 35 is pressed and engaged with the absorbent cotton strip.

[0075] Furthermore, a drain pipe is connected to the bottom of the collection box 34 for connecting an external pipe body. Specifically, one end of the external pipe body is connected to the drain pipe via a quick-connect coupling, and the other end is connected to the suction end of the water pump via a quick-connect coupling.

[0076] In use: After the adsorption module completes the wiping and adsorption of condensate on the surface of the semiconductor chip, the main controller 11 confirms through the detection sensor that the wiping assembly 210 has returned to its initial position, and then triggers the processing mechanism. The two electric guide rails 31 synchronously drive the electric slider 32 to slide, moving the collection box 34 to directly below the adsorption cotton strip, so that the top opening of the collection box 34 is completely aligned with the bottom of the cotton strip. Then, the telescopic end of the second electric telescopic rod 33 extends upward, so that the collection box 34 covers the outside of the adsorption cotton strip until the grid plate 35 contacts the bottom surface of the adsorption cotton strip and begins to squeeze. During this process, the spring 36 synchronously compresses to provide a reaction force on the adsorption cotton strip, causing the water on the adsorption cotton strip to be squeezed out. The squeezed water flows into the bottom of the collection box 34 through the mesh of the grid plate 35, enters the external pipe body through the drain pipe and connects to the water pump, and then the main controller 11 synchronously starts to deliver the collected water to the external collection device in a timely manner, realizing closed-loop recycling.

[0077] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor chip online testing device, comprising a test chamber (1), wherein a main controller (11) is mounted on the top side of one side of the test chamber (1), characterized in that: A vertical heat insulation plate (12) is fixedly installed in the middle of the inner cavity of the test chamber (1), and two sealing holes (121) are symmetrically provided on the side of the vertical heat insulation plate (12) near its bottom. A horizontal heat insulation plate (13) is fixedly installed in the inner cavity of the test chamber (1) directly below the vertical heat insulation plate (12). A test space is formed in the inner cavity of the test chamber (1) and above the horizontal heat insulation plate (13) through the horizontal heat insulation plate (13). The test space is symmetrically set on both sides with the vertical heat insulation plate (12) as the middle boundary, and a low temperature test area and a high temperature test area are respectively provided. The testing mechanism is located inside the test box (1) and includes: a driving module, a switching test module, and an adsorption module; The drive module is located at the bottom of the horizontal heat insulation plate (13) and includes a drive motor (21), a transmission assembly (22), and a horizontal plate (23). The transmission assembly (22) includes a gear transmission mechanism or a synchronous belt transmission mechanism, which can transmit the rotational motion of the drive motor (21) to the horizontal plate (23). The switching test module is set on the upper and lower sides of the horizontal heat insulation plate (13). It includes two test boards (27) for loading semiconductor chips and a circular plate (28) set on the outside of the two test boards (27). The circular plate (28) is sealed through two sealing holes (121). The low temperature test area and the high temperature test area are isolated by the circular plate (28) and the vertical heat insulation plate (12). After the semiconductor chip is loaded on the test board (27), the high and low temperature tests are performed simultaneously in the two test areas respectively. The drive motor (21) drives the transmission assembly (22) to rotate the horizontal plate (23) half a revolution, thereby causing the switching test module to rotate synchronously. The adsorption module is located on the side of the vertical heat insulation plate (12) near the low temperature test area, and is located on the path of the drive module driving the switching test module to rotate from the high temperature test area to the low temperature test area; The switching test module also includes a permanent magnet ring (24) fixedly connected to the top of the horizontal plate (23). An annular groove (25) is provided on the top surface of the horizontal heat insulation plate (13) at a position corresponding to the permanent magnet ring (24). Two symmetrically arranged permanent magnet blocks (26) are slidably arranged in the annular groove (25). The positions of the two permanent magnet blocks (26) correspond vertically to the positions of the permanent magnet ring (24), and the two have opposite magnetic properties. The top of the permanent magnet blocks (26) is fixedly connected to the bottom of the test plate (27). A perforated layer (131) is provided inside the horizontal heat insulation plate (13) at a position corresponding to the permanent magnet ring (24) and the permanent magnet block (26); A semi-ring plate (261) is fixedly installed between the two permanent magnet blocks (26). The semi-ring plate (261) is located in the annular groove (25). The bottom of the vertical heat insulation plate (12) is provided with a notch for the permanent magnet blocks (26) and the semi-ring plate (261) to pass through. The semi-ring plate (261) is always sealed in the notch. The adsorption module includes a first electric telescopic rod (29) fixedly installed on the side of the vertical heat insulation plate (12) near the low temperature test area, and a wiping component (210) for adsorbing water droplets is connected to the telescopic end of the first electric telescopic rod (29).

2. The semiconductor chip online testing device according to claim 1, characterized in that, Both the vertical insulation board (12) and the horizontal insulation board (13) are made of aerogel material.

3. The semiconductor chip online testing device according to claim 1, characterized in that, The drive motor (21) is fixedly installed on the bottom surface of the inner cavity of the test box (1), and the shaft of the drive motor (21) is connected to the transmission assembly (22) for transmission, and the top of the transmission assembly (22) on the side away from the shaft is fixedly connected to the horizontal plate (23).

4. The semiconductor chip online testing device according to claim 1, characterized in that, The wiping assembly (210) consists of an outer shell, a plug plate, and an absorbent cotton strip. The outer shell is fixedly connected to the telescopic end of the first electric telescopic rod (29). The top of the plug plate is provided with a T-shaped protrusion, which is inserted into the T-shaped groove on the top of the outer shell. The absorbent cotton strip is adhered to the bottom surface of the plug plate. The bottom and one side of the outer shell are provided with openings, and the bottom of the absorbent cotton strip is located at the opening at the bottom.

5. The semiconductor chip online testing device according to claim 1, characterized in that, Below the wiping assembly (210) and on the vertical heat insulation plate (12), there is also a processing mechanism, which includes two electric guide rails (31) fixedly installed on the side of the vertical heat insulation plate (12) near the wiping assembly (210). Electric sliders (32) are slidably connected on both electric guide rails (31). A second electric telescopic rod (33) is fixedly installed on the top of each electric slider (32). A collection box (34) is fixedly connected to the telescopic end of the second electric telescopic rod (33). A grid plate (35) is slidably connected inside the collection box (34). At least four springs (36) are evenly connected between the bottom of the grid plate (35) and the bottom surface inside the collection box (34). The at least four springs (36) are arranged symmetrically in pairs. When the electric slider (32) slides and moves to the end of its stroke on the electric guide rail (31), the collection box (34) is located directly below the absorbent cotton strip in the wiping assembly (210). When the extension end of the second electric telescopic rod (33) extends to the end of its stroke, the collection box (34) covers the outside of the absorbent cotton strip, and the grid plate (35) is pressed and engaged with the absorbent cotton strip.

6. The semiconductor chip online testing device according to claim 5, characterized in that, The bottom of the collection box (34) is connected to a drain pipe for connecting to the outer pipe body.

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