An fpc micro-optics module packaging system and method for ai glasses

Abstract

The application relates to the technical field of AI glasses packaging, in particular to an FPC micro-optical module packaging system and method for AI glasses, which comprises at least one first optical element and at least one second optical element, an optical tweezers array generation system, an in-situ monitoring and feedback system and a curing system. The application aims to solve the problems of low optical module packaging alignment precision and poor yield in the prior art, and provides a micro-optical module precision packaging system and method capable of realizing active, real-time feedback and in-situ self-alignment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of AI glasses packaging, in particular to an FPC micro-optical module packaging system and method for AI glasses. BACKGROUND

[0002] The core of the current AI glasses is the optical waveguide display module, and the imaging quality thereof is highly dependent on the relative position accuracy of internal FPCs and optical elements (such as Micro-LED display screens, collimating lenses, coupling gratings, waveguide sheets, etc.), which is usually required to reach a sub-micron level. The existing technology mainly adopts high-precision mechanical arms for blind alignment and bonding, that is, relying on the positioning accuracy of the equipment itself, the pressing and glue curing are completed at one time, but this method has the following defects:

[0003] The manufacturing tolerances of individual elements and the positioning errors of mechanical arms will accumulate, resulting in poor final alignment accuracy;

[0004] The shrinkage stress and thermal stress during the glue curing process will cause the elements to be slightly displaced, thereby destroying the aligned position;

[0005] The above factors result in low yield of finished products and high production cost, which has become a key bottleneck restricting the popularization of AI glasses.

[0006] Therefore, there is an urgent need in the industry for a precision packaging technology that can overcome the above-mentioned defects and realize dynamic closed-loop alignment. SUMMARY

[0007] In order to overcome the shortcomings and deficiencies in the prior art, the present application aims to solve the problems of low alignment accuracy and poor yield of optical module packaging in the prior art, and provides a micro-optical module precision packaging system and method which can realize active, real-time feedback and in-situ self-alignment.

[0008] The present application is realized by the following technical solutions:

[0009] In a first aspect, the present application discloses an FPC micro-optical module packaging system for AI glasses, which comprises:

[0010] At least one first optical element and at least one second optical element, at least one of the first optical element or the second optical element is provided with a plurality of dielectric microspheres for non-contact manipulation;

[0011] An optical tweezer array generation system for generating an independently addressable optical tweezer array to capture and manipulate the dielectric microspheres respectively, and adjust the relative position and attitude of the first optical element and the second optical element in three-dimensional space;

[0012] The in-situ monitoring and feedback system is used to acquire the output image of the optical system composed of the first optical element and the second optical element in real time during the alignment process, analyze the quality parameters of the image, and generate a control signal based on the difference between the quality parameters and the preset target, and output it to the optical tweezers array generation system.

[0013] A curing system is used to cure the liquid medium between the first optical element and the second optical element when the in-situ monitoring and feedback system determines that the image quality parameters of the optical system have reached a preset target, so as to permanently lock their relative positions.

[0014] In conjunction with the first aspect, the optical tweezers array generation system further includes a laser source and a spatial light modulator, wherein the spatial light modulator is used to receive the control signal and perform phase modulation on the beam emitted by the laser source to generate the independently addressable optical tweezers array.

[0015] In conjunction with the first aspect, the in-situ monitoring and feedback system further quantifies the quality parameters of the image by calculating at least one of the modulation transfer function value, brightness uniformity, or distortion coefficient of the output image.

[0016] In conjunction with the first aspect, the first optical element is further described as a micro-display module, which is electrically connected to the in-situ monitoring and feedback system via a flexible circuit board, for receiving instructions and displaying test images as test light sources during the alignment process.

[0017] In conjunction with the first aspect, it further includes a micro-dispensing device, which employs a non-contact piezoelectric jet valve for injecting liquid optical adhesive as the liquid medium between the first optical element and the second optical element with a preset amount and path.

[0018] Secondly, this invention discloses an FPC micro-optical module packaging method for AI glasses, which includes the following steps:

[0019] S100. Provide the first optical element and the second optical element, and inject liquid optical adhesive between them;

[0020] S200. Start the optical tweezers array generation system to capture the dielectric microspheres, and start the in-situ monitoring and feedback system to acquire the initial output image and calculate the initial quality parameters;

[0021] S300. The in-situ monitoring and feedback system continuously generates control signals to drive the optical tweezers array generation system based on the difference between the quality parameters and the preset target, and adjusts the relative positions of the first optical element and the second optical element in an iterative manner until the quality parameters reach the preset target.

[0022] S400. Start the curing system to cure the liquid optical adhesive.

[0023] In conjunction with the second aspect, the optical tweezers array is further generated by a near-infrared laser, and the liquid optical adhesive has high transmittance to the near-infrared laser.

[0024] In conjunction with the second aspect, furthermore, the curing in step S400 is accomplished by irradiating the liquid optical adhesive with an ultraviolet light source.

[0025] In conjunction with the second aspect, further, in steps S200 and S300, power is supplied to the first optical element and signals for generating the test image are transmitted through a flexible circuit board connected to the first optical element.

[0026] In conjunction with the second aspect, further, in step S100, the liquid optical adhesive is sprayed in the form of microdroplets onto a designated area between the first optical element and the second optical element using a non-contact piezoelectric jet dispensing device.

[0027] Thirdly, the present invention also discloses a computer device, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the FPC micro-optical module packaging method as described above.

[0028] Fourthly, the present invention also discloses a computer-readable storage medium having a computer program stored thereon, the program being executed by a processor to implement the FPC micro-optical module packaging method as described above.

[0029] The beneficial effects of this invention are:

[0030] This invention discloses an FPC micro-optical module packaging system, method, computer device, and storage medium for AI glasses. By pre-setting micro-handles that can be manipulated by non-contact force on the optical components to be stacked, and after the components are stacked and uncured optical adhesive is injected, a closed-loop feedback system monitors the imaging quality in real time, and uses optical tweezers array technology to manipulate the handles to fine-tune the components until they reach the optimal position, and then the adhesive is instantly cured to complete the encapsulation. This effectively solves the problems of low yield and high production cost caused by tolerance accumulation and stress. Attached Figure Description

[0031] The present invention will be further described with reference to the accompanying drawings, but the embodiments in the drawings do not constitute any limitation on the present invention. For those skilled in the art, other drawings can be obtained based on the following drawings without creative effort.

[0032] Figure 1This is a schematic diagram of the modules of a database system according to an embodiment of the present invention.

[0033] Figure 2 This is a flowchart of an embodiment of the FPC micro-optical module packaging method of the present invention.

[0034] Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of the present invention.

[0035] Figure 4 A schematic diagram of a storage medium provided in an embodiment of the present invention. Detailed Implementation

[0036] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0037] Example 1

[0038] like Figure 1 As shown, this embodiment discloses an FPC micro-optical module packaging system for AI glasses, which includes:

[0039] At least one first optical element 104 and at least one second optical element 105, wherein at least one of the first optical element 104 or the second optical element 105 is provided with a plurality of dielectric microspheres for non-contact manipulation.

[0040] The optical tweezers array generation system 103 is used to generate an independently addressable optical tweezers array to capture and manipulate the dielectric microspheres respectively, and adjust the relative position and orientation of the first optical element 104 and the second optical element 105 in three-dimensional space.

[0041] The in-situ monitoring and feedback system 102 is used to acquire the output image of the optical system composed of the first optical element 104 and the second optical element 105 in real time during the alignment process, analyze the quality parameters of the image, and generate a control signal based on the difference between the quality parameters and the preset target, and output it to the optical tweezers array generation system 103.

[0042] The curing system 101 is used to cure the liquid medium between the first optical element 104 and the second optical element 105 to permanently lock their relative positions when the in-situ monitoring and feedback system 102 determines that the image quality parameters of the optical system have reached a preset target.

[0043] In this embodiment, several transparent microspheres (such as silica microspheres) with a diameter only on the micrometer scale and a high refractive index are pre-fixed to the non-functional area at the edge of the optical element (such as the substrate of a Micro-LED display) that needs to be aligned, using semiconductor technology. Since the element itself cannot be directly grasped, these microspheres become handles that can be manipulated without contact force. When a highly focused laser beam shines on the microspheres, the "optical gradient force" effect is generated due to the light field gradient, firmly adhering the microspheres to the focal point of the beam. By moving the laser focal point, the microspheres can be precisely dragged in a non-contact, non-damaging manner, thereby moving the entire optical element.

[0044] The optical tweezers array generation system 103 consists of core components such as a laser and a spatial light modulator (SLM). The SLM acts like a programmable dynamic diffraction grating; by loading a specific grayscale image onto the SLM, the beam of light can be decomposed and reshaped in space into hundreds or thousands of independently controllable laser focal points. In this embodiment, optical tweezers focal points corresponding to the number of dielectric microspheres are generated, forming an optical tweezers array. The control system can move the position of each optical tweezer independently and in real time by changing the grayscale image loaded onto the SLM, thereby achieving nanometer-level precision manipulation of the six degrees of freedom (X / Y / Z translation and rotation around the three axes) of the optical element.

[0045] The in-situ monitoring and feedback system 102 is a system that sets up a high-resolution industrial camera array at the light-emitting position of the finished optical module to capture test images being generated inside the module in real time. The image data is then sent to a high-performance image processing computer.

[0046] The camera captures images emitted by the microdisplay in real time, passing through the entire optical system—this process is "in-situ." The computer performs objective quantitative analysis of the captured images, calculating key performance indicators such as MTF (Modulation Transfer Function). It compares the measured values ​​with ideal target values ​​in a database, calculating the deviation. This deviation is then translated into specific control commands for the optical tweezers array, forming a closed-loop feedback loop for the entire system. For example, moving the display screen 0.2 micrometers along the positive X-axis and rotating it 0.01 degrees clockwise.

[0047] After a series of iterative optimizations, once the in-situ monitoring and feedback system 102 determines that the optical element has been adjusted to its optimal global position (i.e., the image quality parameters have reached their peak), it issues two coordinated commands: 1) instructing the optical tweezers system to maintain a strong clamping force, ensuring the element remains perfectly still; 2) instructing the curing system 101 to activate instantaneously, emitting intense ultraviolet light that completely polymerizes and cures the liquid optical adhesive between the elements within hundreds of milliseconds. This process is fast enough that any displacement caused by curing stress cannot occur in time, thus achieving precise alignment.

[0048] The implementation of this embodiment will bring about:

[0049] Revolutionary improvement in yield, ultimate and highly consistent product performance, and significant reduction in production costs.

[0050] By actively compensating for component tolerances and equipment errors, and overcoming the effects of curing stress, this system can increase the packaging yield of optical modules from below 70% to 98% or even higher, which means that waste is minimized. The increase in yield is directly equivalent to a significant reduction in material, energy, and labor costs. Due to the system's strong self-calibration capability, it reduces the dependence on the absolute accuracy of the initial mechanical positioning platform, allowing manufacturers to use lower-cost equipment, thereby reducing capital investment.

[0051] In addition, optical engineers can be bolder in designing and experimenting with more complex and powerful optical structures because they know that this intelligent packaging system can accurately turn design drawings into reality, thereby accelerating the technological iteration of the entire AI glasses industry.

[0052] In the above embodiments, an optical tweezers array generation system 103 is defined to act as a robotic arm in the microscopic world. Further, the optical tweezers array generation system 103 includes a laser source and a spatial light modulator. The spatial light modulator is used to receive the control signal and perform phase modulation on the beam emitted by the laser source to generate the independently addressable optical tweezers array.

[0053] In this embodiment, a near-infrared high-power laser (such as a 1064nm wavelength) is preferred as the laser source. This wavelength is chosen because it is transparent to most optical components and uncured UV adhesives, preventing damage or premature curing; and because high power is a prerequisite for generating a sufficiently strong light gradient force, ensuring the clamping force of the optical tweezers.

[0054] SLMs do not regulate the color or brightness of light, but rather the phase of light. Their surface is composed of millions of tiny liquid crystal pixels, each of which can be independently programmed to produce a precise phase delay between 0 and 2π for the light wavefront passing through it.

[0055] At any given moment, the in-situ monitoring and feedback system 102 will issue an instruction, specifying which three-dimensional spatial coordinate points need to be used to generate optical tweezer traps. The iterative Fourier transform algorithm will then perform inverse calculations, using the target light field as input, to reverse-calculate the parameters needed to form a complex two-dimensional phase map, i.e., a computer-generated hologram.

[0056] This phase map is loaded onto the SLM in grayscale form. When a uniform, flat laser wavefront emitted from the laser source illuminates the SLM, each part is given a different phase delay according to the grayscale value of the corresponding pixel. After the laser beam carrying holographic information passes through a Fourier lens, according to the principle of diffraction, a precisely arranged array of optical tweezers composed of multiple high-intensity light spots is automatically reconstructed on the back focal plane of the lens.

[0057] It should be noted that in this embodiment, to move a single optical tweezer, the operator does not need to adjust any mechanical parts. The control system only needs to calculate a new hologram and refresh it onto the SLM within milliseconds, and the shape of the optical tweezer array will change instantaneously. This achieves purely software-defined, inertia-free, and ultra-high-precision real-time optical field manipulation.

[0058] Furthermore, the in-situ monitoring and feedback system 102 quantifies the quality parameters of the image by calculating at least one of the modulation transfer function (MTF) value, brightness uniformity, or distortion coefficient of the output image.

[0059] In this embodiment, MTF is the ultimate indicator of an optical system's ability to convey object details (i.e., contrast at different spatial frequencies).

[0060] The control system commands a micro-display to display a specific test pattern, most commonly a high-contrast bright white straight line (for generating the Line Spread Function (LSF)) or a sharp black-and-white boundary (for generating the Edge Spread Function (ESF)). It captures the image of this line or boundary becoming blurred after passing through the entire optical system. The image processing unit performs a Fourier transform on the acquired LSF or ESF data. Mathematically, the MTF is the normalized modulus of the system's Optical Transfer Function (OTF). The result is a curve representing the contrast transfer at different spatial frequencies (unit: line pairs / mm, lp / mm). The system can output the MTF value at a key frequency point (e.g., 50 lp / mm), or the area under the curve, as a core KPI (Key Performance Indicator). During optimization, the algorithm aims to maximize this KPI.

[0061] Brightness uniformity measures whether the brightness distribution is even across the entire field of view. In AI glasses, due to uneven waveguide coupling efficiency or stray light, phenomena such as a bright center, dark edges, or localized bright spots often occur, severely impacting immersion. The control system commands a micro-display to display a full-screen, uniformly bright gray or white image. The camera captures the actual image of this uniform image after processing by the system. The computer divides the acquired image into an N×M grid. Then, the average pixel brightness value within each grid is calculated.

[0062] By comparing the maximum brightness of all grids and minimum brightness Uniformity can be calculated (usually expressed as...) Alternatively, the algorithm can calculate the standard deviation of all grid brightness values. During optimization, the goal is to maximize the uniformity ratio (approaching 100%) or minimize the standard deviation.

[0063] The distortion coefficient refers to the degree of distortion of an image relative to the shape of an object. Common distortions include barrel distortion (the image bulges outward) and pincushion distortion (the image concave inward).

[0064] To solve this problem, the control system needs to instruct a micro-display to display a grid of precise horizontal and vertical straight lines, or an array of dots; the camera captures images of these lines, which should be straight, bending or the dots shifting after passing through the system; image processing algorithms (such as Hough transform or corner detection) accurately identify the positions of the lines or dots in the acquired image and mathematically compare them with their ideal positions in the original test image; the positional deviations of all feature points are calculated, and a single distortion coefficient value is defined by the maximum deviation or the root mean square (RMS) value of all deviations. During optimization, the algorithm aims to minimize this distortion coefficient value (approaching 0).

[0065] Furthermore, the first optical element 104 is a micro display module, which is electrically connected to the in-situ monitoring and feedback system 102 via a flexible circuit board, and is used to receive instructions and display test images as test light sources during the alignment process.

[0066] Since the micro-display module is shipped as an independent component, its tail is already connected to one or more thin flexible circuit boards (FPCs) through a high-density bonding process. After entering the packaging system of this embodiment, before the module is glued and packaged, the end connector of its FPC is temporarily connected to a specially designed test adapter board. This adapter board is the I / O interface of the entire system. One end of it is connected to the FPC of the display module, and the other end is connected to the central control computer of the packaging system, i.e., part of the in-situ monitoring and feedback system 102, through a standard cable.

[0067] Once the connection is established, the central control computer provides two core elements to the driver chip of the micro-display module through this FPC:

[0068] The power supply and video / control signals are also included. The power supply provides the necessary voltage and current to illuminate the display screen; the video / control signals transmit specific image signals generated by the computer for testing purposes.

[0069] At this point, the display module, which has not yet been packaged, is in the alignment process:

[0070] When sharpness needs to be assessed, the computer sends a command via FPC, and a precise bright line immediately appears on the screen;

[0071] When geometric fidelity needs to be evaluated, the command changes and the screen instantly switches to a standard checkerboard or dot matrix pattern.

[0072] After the entire alignment and curing process is completed, the display module is permanently fixed in the optimal position. At this point, its FPC will be disconnected from the test adapter board. In the subsequent assembly process, this identical FPC will be carefully routed and connected to the main logic board of the AI ​​glasses to achieve the final packaging of the AI ​​glasses.

[0073] Furthermore, the packaging system of this embodiment also includes a micro-dispensing device, which employs a non-contact piezoelectric jet valve for injecting liquid optical adhesive as the liquid medium between the first optical element 104 and the second optical element 105 with a preset amount and path.

[0074] In this embodiment, the micro-dispensing device typically consists of three parts: a high-precision three-axis or five-axis motion platform, a fluid temperature and pressure control unit, and the core piezoelectric jet valve head. The motion platform is responsible for driving the valve head to move above the workpiece along a preset path.

[0075] The piezoelectric injection valve contains a stack of piezoelectric crystals inside its valve body. This stack is connected to a tiny striking pin or piston, the tip of which seals the valve seat leading to the nozzle. When no voltage is applied, the piezoelectric crystal stack is at its original length, and the striking pin, under spring force, tightly closes the valve seat, preventing glue from flowing out. When the controller applies a reverse voltage pulse, the piezoelectric crystal stack contracts instantaneously, causing the striking pin to retract rapidly. The valve seat opens, and under negative pressure, a precisely measured drop of glue is drawn into the chamber in front of the striking pin.

[0076] The controller then immediately applies a positive high-voltage pulse. The piezoelectric crystal stack generates an impact force at microsecond speeds, creating a strong pressure wave in the adhesive within the chamber. This forcefully extrudes the adhesive from a nozzle only tens of micrometers in diameter. Due to the extremely high speed and concentrated energy, the extruded adhesive overcomes surface tension, separates from the nozzle, and forms a regular, uniformly shaped spherical droplet. This droplet travels a short distance (typically 1-3 millimeters) with a certain initial velocity, ultimately landing precisely on the surface of the target component, completing the dispensing process.

[0077] Before dispensing, the system calculates the optimal amount of adhesive based on the shape of the component and claim 11. The system automatically plans an optimal dispensing path. The controller sets parameters such as the drive voltage and pulse width of the piezoelectric valve based on the adhesive's viscosity and surface tension to ensure that the volume of each ejected droplet is constant and known. The motion platform drives the piezoelectric valve head, maintaining a safe distance from the component surface, to move at high speed along the planned path. Simultaneously, the piezoelectric valve continuously ejects tiny droplets at an extremely high frequency, coating the component surface with the designed adhesive distribution pattern. The entire process is fast, quiet, and extremely precise.

[0078] Example 2

[0079] like Figure 2 As shown, this embodiment discloses an FPC micro-optical module packaging method for AI glasses, which includes the following steps:

[0080] S100. Provide the first optical element 104 and the second optical element 105, and inject liquid optical adhesive between them;

[0081] S200. Start the optical tweezers array generation system 103 to capture the dielectric microspheres, and start the in-situ monitoring and feedback system 102 to acquire the initial output image and calculate the initial quality parameters;

[0082] S300. The in-situ monitoring and feedback system 102 continuously generates control signals to drive the optical tweezers array generation system 103 according to the difference between the quality parameters and the preset target, and adjusts the relative positions of the first optical element 104 and the second optical element 105 in an iterative manner until the quality parameters reach the preset target.

[0083] S400. Start the curing system 101 to cure the liquid optical adhesive.

[0084] In this embodiment, step S100 is the preparation stage. First, the first optical element 104 (such as a Micro-LED module) and the second optical element 105 (such as an optical waveguide lens) are placed on the worktable of the packaging system by a robotic arm, with an initial gap of micrometers between them; then, the non-contact piezoelectric injection valve defined in the middle is activated, the precise amount of adhesive required including all surface micromorphologies is calculated, and the liquid optical adhesive of this volume is injected into the gap between the elements through a specific path.

[0085] At the end of this step, an ideal initial state is obtained: the two optical elements are suspended in a volume-precise, bubble-free, and contamination-free liquid optical adhesive environment, which is fully prepared for subsequent resistance-free and high-precision movement.

[0086] Step S200 is the initialization and benchmark establishment stage. After the optical tweezers array generation system 103 is started, multiple optical tweezers traps are generated to capture and stably hold the dielectric microspheres on the component. At this time, although the component is firmly controlled, it can still be driven by optical tweezers to make micro-movements. Subsequently, the micro-display module is lit up by the FPC to display the preset test pattern. At the same time, the in-situ monitoring system starts to work and acquires the first blurred image in the misaligned state that has passed through the entire optical system. The feedback system analyzes this initial image and calculates various initial quality parameters according to the standards defined in Example 1.

[0087] Step S300 is the closed-loop iterative optimization stage. Based on the initial quality parameters obtained in step S200, the system calculates the first most promising movement scheme for improving quality, which is precisely executed by the optical tweezers system. After the movement is completed, the monitoring system immediately acquires an image at the new position and calculates new quality parameters. Based on the old and new sets of pose-quality data, the system updates its understanding model of the entire quality space and calculates the next better movement scheme. This "decision-execution-evaluation" cycle repeats continuously at an extremely high rate of several to dozens of times per second.

[0088] After hundreds or thousands of fine-tuning steps, the quality parameters no longer show significant improvement and stabilize at a peak. At this point, the system determines that it has found the globally optimal alignment position. At the end of this step, the optical element is being held stably in the optimal position with sub-nanometer precision by optical tweezers.

[0089] Step S400 is the permanent locking stage. After step S300 announces that the optimal position has been found, the optimization cycle stops, but the optical tweezers system continues to maintain a strong clamping force to ensure the absolute stability of the component position. At this time, the control system immediately triggers the curing system 101 defined in Example 1 to rapidly and uniformly irradiate the liquid optical adhesive.

[0090] At the end of this step, the liquid optical adhesive fully cures within a few hundred milliseconds, transforming into a robust, transparent solid that bonds the two optical components and the FPC attached to them together. Encapsulation is now complete, and the optical tweezers system can release its energy, ready for the next task.

[0091] In this embodiment, the optical tweezers array is generated by a near-infrared laser, and the liquid optical adhesive has high transmittance to the near-infrared laser; the curing in step S400 is accomplished by irradiating the liquid optical adhesive with an ultraviolet light source.

[0092] The implementation of this embodiment relies on laser physics and materials science, specifically in the following two aspects:

[0093] 1. Laser source selection: near-infrared band

[0094] The system utilizes a mature, stable, and high-power 1064 nm Nd:YAG laser, a technology widely used in the industry. Located in the near-infrared spectral region, 1064 nm infrared light has only about one-third the energy of a single photon compared to 365 nm ultraviolet light. This energy level is far below the excitation threshold of chemical bonds in most UV-curable adhesives (such as acrylates or epoxy resins). Therefore, regardless of the laser power, it cannot chemically initiate the polymerization reaction of the adhesive, completely eliminating the risk of accidental curing.

[0095] Furthermore, water, as well as most organic polymers and optical glass, typically possess a high transmittance window in the visible and near-infrared regions. 1064nm lies precisely in the center of this window, meaning these materials exhibit extremely low absorption. This fundamentally avoids the thermal effects caused by light absorption, ensuring that the adhesive and components are not significantly heated.

[0096] 2. Matching requirements for liquid optical adhesives: high transmittance at specific wavelengths.

[0097] When selecting a suitable liquid optical adhesive, its spectral transmittance curve becomes a key screening criterion. This embodiment requires that the selected adhesive must meet the following requirements:

[0098] It exhibits extremely high transmittance for 1064nm near-infrared light and extremely high absorption for 365nm ultraviolet light (or other specific curing wavelengths). For example, theoretically, the transmittance is required to be greater than 99.5%, which means that when the optical tweezers laser passes through the adhesive layer, almost all the energy passes through unimpeded, with only a negligible amount of energy being absorbed. When irradiated by 365nm ultraviolet light emitted by the curing system 101, the adhesive can efficiently absorb the energy and quickly and completely complete the curing process.

[0099] Furthermore, in steps S200 and S300, power is supplied to the first optical element 104 and signals for generating the test image are transmitted through a flexible circuit board connected to the first optical element 104.

[0100] Since the packaging process is in steps S200 and S300, the first optical element 104 has been held by optical tweezers and suspended in uncured optical adhesive, and its built-in FPC has been connected to the test adapter board.

[0101] The in-situ monitoring and feedback system 102 determines, based on its optimization algorithm, that it needs to acquire optical data at the current pose. For example, it first measures the system's sharpness (MTF).

[0102] The computer's internal signal generator immediately generates digital video signals for displaying high-contrast bright lines. These digital video signals, along with the stable DC power supply required to drive the display screen, are loaded onto the test adapter board. Energy and signals pass through the adapter board into the thin circuitry of the FPC, and current and data signals are precisely transmitted along the FPC's traces to the driver control chip of the connected micro-display module. The display module's driver chip receives and decodes the signals from the FPC, then precisely controls a row or column of its millions of Micro-LED pixels to be illuminated, thus forming a bright, sharp test line on the screen.

[0103] The light emitted by the bright line passes through the entire optical system and is captured by the camera at the back end, completing one MTF data acquisition. Assuming that the algorithm needs to evaluate geometric distortion, the central computer immediately stops sending the bright line signal and instead generates a standard grid video signal.

[0104] Within milliseconds, a new signal is transmitted to the display module via the same FPC, and the image on the screen instantly changes from a bright line to a grid, at which point the camera captures the new image.

[0105] The operation of power supply and dynamic content transmission using FPC will be repeated and performed at high speed during the alignment cycle of steps S200 and S300 until the system finds the optimal solution.

[0106] Furthermore, in step S100, the liquid optical adhesive is sprayed in the form of microdroplets onto a designated area between the first optical element 104 and the second optical element 105 using a non-contact piezoelectric jet dispensing device.

[0107] The encapsulation process begins at step S100 of this embodiment. The optical components have been placed on the worktable, and the control system calculates the optimal total adhesive amount required. And the optimal dispensing path diagram.

[0108] Specifically, the control system first determines the total adhesive volume based on the calibration parameters of the piezoelectric jet valve used (i.e., the precise volume of a single microdroplet ejected in each jet, for example, 2.1 nanoliters / droplet). Converted to the required total number of droplets ejected ( / single drop volume).

[0109] At the same time, the system converts the optimal dispensing path diagram into G-code (a machine tool control language) for the motion platform. This code specifies the precise movement trajectory and speed of the injection valve head in the XY plane.

[0110] Subsequently, the high-precision motion platform drives the piezoelectric injection valve head to the starting point of the path. The nozzle of the valve head maintains a preset, safe flight height with the surface of the component below, typically between 1 and 3 millimeters. The motion platform begins to drive the valve head to move strictly according to the G-code. At the same time, the central controller sends a series of high-frequency electronic pulses to the piezoelectric injection valve to execute the non-contact injection action.

[0111] In the subsequent process, with each pulse received, the piezoelectric stack inside the piezoelectric valve completes a contraction-expansion action, ejecting a microdroplet of constant volume from the nozzle. These microdroplets cross the safety gap at extremely high speed and precise angle, landing accurately at the designated location on the component surface. Due to the non-contact spraying, the droplets are highly regular in shape, forming perfect spheres or hemispheres, without any tailing or stringing.

[0112] The valve head moves at high speed while continuously spraying droplets at a frequency of up to several thousand hertz. When the total number of sprayed droplets reaches the preset value N, the system stops spraying. At this point, a uniformly distributed array of adhesive with precise total amount and reserved venting channels is perfectly presented on the surface of the component.

[0113] Example 3

[0114] In Example 2, step S100 provides an optical element and injects liquid optical adhesive therebetween, further including a precision adhesive injection sub-step based on surface topography integration, the specific process of which is as follows:

[0115] Before adhesive injection, a high-precision three-dimensional topographic scan of the surfaces to be bonded between the first optical element 104 and the second optical element 105 is performed using a white light interferometer or a confocal microscope to obtain their surface height function. and ;

[0116] Based on survey data, algorithms are used to calculate the ideal fitting distance. Below, the theoretical space volume between the two components ;

[0117] Taking into account the curing shrinkage rate of the adhesive and dynamic compression compensation coefficient Calculate the optimal amount of adhesive to inject. ;

[0118] Control the micro-dispensing device to precisely inject a volume of [volume]. Liquid optical adhesive.

[0119] In this embodiment, the optimal glue injection amount optimization algorithm is as follows:

[0120]

[0121] in, This refers to the overlapping bonding area of ​​two optical elements; The double integral over the height difference between the two surfaces in the mating region A is used to calculate the precise spatial volume of the region. The average roughness of the two surfaces; To fit the perimeter of the area.

[0122] This step abandons volume estimation based on an ideal plane, and instead precisely takes into account the micro-roughness, curvature, and manufacturing tolerances of the component surface. By pre-calculating the actual amount of adhesive required, precise control of the dispensing process is achieved.

[0123] This greatly avoids adhesive overflow contamination of the optical surface caused by excessive adhesive, or encapsulation defects such as bubbles and voids caused by insufficient adhesive. It ensures the uniformity and stress distribution of the bonding layer after curing, laying the foundation for subsequent precise alignment and long-term reliability.

[0124] Example 4

[0125] In Example 2, step S200, which involves acquiring the initial output image and calculating the initial quality parameters, further includes a modulation transfer function (MTF) characterization sub-step based on Fourier transform. The specific process is as follows:

[0126] The micro-display module is controlled to display a high-contrast bright line, and the image of the line spread function (LSF) after passing through the entire optical system is captured by the in-situ monitoring system.

[0127] The acquired LSF image data is subjected to noise reduction and background light correction.

[0128] After processing Perform a one-dimensional Fast Fourier Transform (FFT);

[0129] The modulus of the transformation result is normalized to obtain the initial MTF curve representing the contrast transfer capability of the system at different spatial frequencies.

[0130] In this embodiment, the formula for calculating the modulation transfer function is:

[0131]

[0132] in, For spatial frequency The modulation transfer function value at that time; The line spread function is obtained experimentally and has undergone preprocessing such as noise reduction. It is a theoretically infinitely narrow ideal line pulse function, whose Fourier transform magnitude is a constant, used for normalization; It is a Fourier transform operator that transforms the LSF in the spatial domain to the frequency domain; To take the modulus of a complex number.

[0133] MTF (Mean Transmission Scale) is one of the most objective and comprehensive indicators for evaluating the imaging quality of an optical system. It describes the system's ability to transmit different fine details of an object. Through the core principles of Fourier optics, the system's performance across the entire frequency domain can be fully analyzed from a simple line image.

[0134] The initial image quality, which is blurry and difficult to quantify, is transformed into an accurate MTF curve that can be analyzed by the algorithm. This provides a clear and reliable quantitative input and optimization target for the subsequent closed-loop optimization steps, avoiding the subjectivity and inaccuracy of relying on human eyes or simple brightness assessments.

[0135] Example 5

[0136] In Example 2, step S300 iteratively adjusts the relative position, and further includes a six-DOF pose search sub-step based on Bayesian optimization, the specific process of which is as follows:

[0137] Establish a Gaussian process model as a prior probability distribution to describe the relationship between pose and image quality;

[0138] The upper confidence bound is selected as the acquisition function to balance between regions with high uncertainty and regions with high expected value;

[0139] At each iteration step, the next most promising test pose is selected by maximizing the acquisition function. ;

[0140] The command optical tweezers system drives the component to its pose. Measure the corresponding image quality and will this pair of new data points Used to update the posterior distribution of the Gaussian process model;

[0141] Repeat steps 3 and 4 until the gain of the acquisition function is below the threshold or the maximum number of iterations is reached. At this point, the maximum point of the mean function of the GP model is the optimal pose found. .

[0142] In this embodiment, the calculation formula for the next test pose point selection algorithm is:

[0143]

[0144] in, In the next iteration, the algorithm selects the target pose to move to; For a six-dimensional pose vector , representing the six degrees of freedom of the element; The feasible region consists of all possible and safe poses; In the feasible region Find the parameters that maximize the objective function. ; For Gaussian processes that have already been performed After the next iteration, the pose The predicted mean of image quality at that location; For Gaussian processes in pose The predicted standard deviation of image quality; It is an adjustable hyperparameter used to balance the weights of regions with high uncertainty and regions with high expected value.

[0145] For time-consuming physical measurements, Bayesian optimization is an efficient global optimization strategy. It learns the shape of the objective function by establishing a probabilistic surrogate model and intelligently selects the next sampling point, thereby finding the global optimum with as few iterations as possible, avoiding the pitfall of traditional gradient descent methods that are prone to getting trapped in local optima.

[0146] Compared to grid search or random search, it can converge to the global optimal alignment position faster, significantly shorten the encapsulation time of a single module, and increase the probability of finding the optimal solution, thus greatly improving alignment efficiency and success rate.

[0147] Example 6

[0148] In Example 2, step S400, which involves curing the liquid optical adhesive, further includes a spatiotemporal energy dose control sub-step based on photochemical dynamics, as detailed below:

[0149] Establish a description of glue monomer conversion rate Partial differential equation models that vary with time and space;

[0150] The solidification region is meshed, and based on the model, the solidification conversion rate for all meshes is calculated in reverse. Achieving the target value and minimizing variance, each grid point throughout the curing time The cumulative energy dose required to be received ;

[0151] The output intensity of the UV curing light source (assuming it is a UV-DLP or LED array with independently controllable pixels) is time-controlled so that at any given moment... Its point light intensity It can optimally approximate the preset dose target;

[0152] The solidification process is carried out according to the planned spatiotemporal light intensity distribution.

[0153] In this embodiment, the calculation formula for the monomer conversion rate kinetic control model is as follows:

[0154]

[0155] Optimization goal:

[0156]

[0157] in, For in position ,time monomer conversion rate; The parameters for photochemical reaction kinetics, determined experimentally, represent the reaction rate constant and the reaction order, respectively. For UV light at position ,time Light intensity; This is a variance operator used to measure the uniformity of the final degree of curing; Total curing time; This represents the average degree of curing in the entire area after curing is complete. This is the minimum acceptable average degree of curing target set.

[0158] Traditional uniform exposure methods can lead to uneven energy reception in different areas of the adhesive layer due to focusing effects or shadows in the optical system. This results in uneven shrinkage, creating internal stress and causing micrometer-level misalignment of aligned components. This method achieves pixel-level control of the curing process through active compensation.

[0159] This embodiment ensures that the entire adhesive layer is cured uniformly and synchronously, minimizing alignment failures caused by curing stress, significantly improving the long-term dimensional stability and reliability of the packaged product, and ensuring that the optical performance of the AI ​​glasses remains stable after experiencing environmental changes such as temperature cycling and vibration.

[0160] Example 7

[0161] Please refer to Figure 3 The diagram illustrates a structural schematic of a computer device provided by some embodiments of this application. The electronic device 20 includes a processor 200, a memory 201, a bus 202, and a communication interface 203. The processor 200, the communication interface 203, and the memory 201 are connected via the bus 202. The memory 201 stores a computer program that can run on the processor 200. The processor 200 is used to operate according to the instructions to execute the steps of the method described in any one of embodiments 2-6.

[0162] The memory 201 may include high-speed random access memory (RAM) or non-volatile memory, such as at least one disk storage device. Communication between this system network element and at least one other network element is achieved through at least one communication interface 203 (which can be wired or wireless), such as the Internet, wide area network, local area network, or metropolitan area network.

[0163] Bus 202 can be an ISA bus, PCI bus, or EISA bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. The memory 201 is used to store programs. After receiving an execution instruction, the processor 200 executes the program. The FPC micro-optical module packaging method disclosed in any of the foregoing embodiments of this application can be applied to the processor 200, or implemented by the processor 200.

[0164] The processor 200 may be an integrated circuit chip with signal processing capabilities. In implementation, each step of the above method can be completed by the integrated logic circuitry in the hardware of the processor 200 or by instructions in software form. The processor 200 may be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), an off-the-shelf programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. It can implement or execute the methods, steps, and logic block diagrams disclosed in the embodiments of this application. The general-purpose processor may be a microprocessor or any conventional processor. The steps of the methods disclosed in the embodiments of this application can be directly embodied in the execution of a hardware decoding processor, or executed by a combination of hardware and software modules in the decoding processor. The software modules may reside in random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, or other mature storage media in the art. The storage medium is located in memory 201. The processor 200 reads the information in memory 201 and, in conjunction with its hardware, completes the steps of the above method.

[0165] Example 8

[0166] This embodiment also provides a computer-readable storage medium corresponding to the FPC micro-optical module packaging method provided in the foregoing embodiments. Please refer to... Figure 4The computer-readable storage medium shown is an optical disc, on which a computer program (i.e., program product 30) is stored. When the computer program is run by a processor, it executes the FPC micro-optical module packaging method provided in any of the foregoing embodiments.

[0167] It should be noted that examples of the computer-readable storage medium may also include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other optical and magnetic storage media, which will not be elaborated here.

[0168] The computer-readable storage medium provided in the above embodiments of this application and the FPC micro-optical module packaging method provided in the embodiments of this application are based on the same application concept and have the same beneficial effects as the methods adopted, run or implemented by the application programs stored therein.

[0169] It should be noted that in the above text, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0170] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, air conditioner, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0171] In summary, the FPC micro-optical module packaging system, method, computer device, and storage medium for AI glasses of the present invention, by pre-positioning micro-handles that can be manipulated by non-contact force on the optical elements to be stacked, and by monitoring the imaging quality in real time through a closed-loop feedback system after the elements are stacked and uncured optical adhesive is injected, and by using optical tweezers array technology to manipulate the handles to fine-tune the elements until the optimal position is reached, and then instantly curing the adhesive to complete the encapsulation, can effectively solve the problems of low yield and high production cost caused by tolerance accumulation and stress influence.

[0172] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the essence and scope of the technical solutions of the present invention.

Claims

1. An FPC micro-optical module packaging system for AI glasses, characterized in that, include: At least one first optical element and at least one second optical element, wherein at least one of the first optical element or the second optical element is provided with a plurality of dielectric microspheres for non-contact manipulation. An optical tweezers array generation system is used to generate independently addressable optical tweezers arrays to capture and manipulate the dielectric microspheres respectively, and adjust the relative position and orientation of the first optical element and the second optical element in three-dimensional space. The in-situ monitoring and feedback system is used to acquire the output image of the optical system composed of the first optical element and the second optical element in real time during the alignment process, analyze the quality parameters of the image, and generate a control signal based on the difference between the quality parameters and the preset target, and output it to the optical tweezers array generation system. A curing system is used to cure the liquid medium between the first optical element and the second optical element when the in-situ monitoring and feedback system determines that the image quality parameters of the optical system have reached a preset target, so as to permanently lock their relative positions.

2. The FPC micro-optical module packaging system for AI glasses according to claim 1, characterized in that, The optical tweezers array generation system includes a laser source and a spatial light modulator. The spatial light modulator is used to receive the control signal and perform phase modulation on the beam emitted by the laser source to generate the independently addressable optical tweezers array.

3. The FPC micro-optical module packaging system for AI glasses according to claim 1, characterized in that, The in-situ monitoring and feedback system quantifies the quality parameters of the image by calculating at least one of the modulation transfer function value, brightness uniformity, or distortion coefficient of the output image.

4. The FPC micro-optical module packaging system for AI glasses according to claim 1, characterized in that, The first optical element is a micro-display module, which is electrically connected to the in-situ monitoring and feedback system via a flexible circuit board. It is used to receive instructions and display test images as test light sources during the alignment process.

5. The FPC micro-optical module packaging system for AI glasses according to claim 1, characterized in that, It also includes a micro-dispensing device, which employs a non-contact piezoelectric jet valve for injecting liquid optical adhesive as the liquid medium between the first optical element and the second optical element with a preset amount and path.

6. A method for packaging an FPC micro-optical module for AI glasses, implemented using the FPC micro-optical module packaging system according to any one of claims 1-5, characterized in that, Includes the following steps: S100. Provide a first optical element and a second optical element, and inject liquid optical adhesive between them; S200. Start the optical tweezers array generation system to capture the dielectric microspheres, and start the in-situ monitoring and feedback system to acquire the initial output image and calculate the initial quality parameters; S300. The in-situ monitoring and feedback system continuously generates control signals to drive the optical tweezers array generation system based on the difference between the quality parameters and the preset target, and adjusts the relative positions of the first optical element and the second optical element in an iterative manner until the quality parameters reach the preset target. S400. Start the curing system to cure the liquid optical adhesive.

7. The FPC micro-optical module packaging method for AI glasses according to claim 6, characterized in that, The optical tweezers array is generated by a near-infrared laser, and the liquid optical adhesive has high transmittance to the near-infrared laser.

8. The FPC micro-optical module packaging method for AI glasses according to claim 6 is characterized in that, The curing in step S400 is accomplished by irradiating the liquid optical adhesive with an ultraviolet light source.

9. A method for packaging an FPC micro-optical module for AI glasses according to claim 6, characterized in that, In steps S200 and S300, power is supplied to the first optical element and signals for generating test images are transmitted through a flexible circuit board connected to the first optical element.

10. A method for packaging an FPC micro-optical module for AI glasses according to claim 6, characterized in that, In step S100, the liquid optical adhesive is sprayed in the form of micro-droplets onto a designated area between the first optical element and the second optical element using a micro-dispensing device.

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