Array type microwave assembly and quantum computer

Abstract

The invention discloses an array type microwave assembly and a quantum computer. The array type microwave assembly comprises a box body, a plurality of circuit boards and a connecting assembly, two ends of the circuit board are respectively connected with the connecting assemblies, and at least one row of through holes are formed in the box body; the circuit board is located in the corresponding through hole; and the circuit board is obliquely arranged relative to the arrangement direction of the through holes. The circuit board is obliquely arranged relative to the arrangement direction of the through holes, so that in the arrangement direction of the through holes, the structure of the array type microwave assembly is more compact, and the integration level is higher.

Description

Technical Field

[0001] The present invention relates to the field of quantum computing technology, and in particular to an array-type microwave component and a quantum computer. Background Art

[0002] In recent years, superconducting quantum computing has experienced rapid development and has become one of the most popular quantum computing technology approaches. Superconducting quantum computing relies on microwave circuits to read and manipulate bits. With the massive expansion of the number of bits, the number of transmission lines and microwave components required has also rapidly increased. Dilution refrigerators have very limited space and cooling capacity, necessitating increased link integration.

[0003] In the prior art, a clustered structure is used to encapsulate discrete microwave circuit components. In the clustered microwave circuit component, the circuit board is usually laid flat in a receiving groove, which still has the problems of bloated structure and low integration.

[0004] Therefore, the existing technology still needs to be improved and developed. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide an array-type microwave component and a quantum computer in response to the above-mentioned defects of the prior art, aiming to solve the problem of bloated structure and low integration of microwave circuit components in the prior art.

[0006] The technical solutions adopted by the present invention to solve the technical problems are as follows:

[0007] An array microwave assembly comprises: a box body, a plurality of circuit boards, and a connecting assembly; the two ends of the circuit boards are respectively connected to the connecting assembly, wherein at least one row of through holes is formed in the box body; the circuit boards are located in the corresponding through holes; and the circuit boards are arranged at an angle relative to the arrangement direction of the through holes.

[0008] In the array-type microwave assembly, the circuit boards in the same row of through holes have the same inclination direction; the inclination angle of the circuit boards relative to the arrangement direction of the through holes is 30° to 60°.

[0009] In the array-type microwave component, a filtering module or an attenuation module is provided on the circuit board.

[0010] The array-type microwave assembly, wherein a window structure is formed on the box body, and the window structure is connected to the through hole.

[0011] In the array-type microwave assembly, there are two rows of through holes, and the window structures corresponding to the two rows of through holes are respectively located on both sides of the box body.

[0012] In the array-type microwave assembly, each row of through holes has two window structures, which are respectively located at two ends of the through holes.

[0013] The array-type microwave assembly, wherein the array-type microwave assembly further comprises:

[0014] A plurality of covers covering the window structure;

[0015] The connection component includes:

[0016] A first connector and a second connector are connected to two ends of the circuit board respectively;

[0017] Wherein, the cover is connected to the first connector or the second connector.

[0018] The array-type microwave assembly, wherein the first connector comprises:

[0019] a first mounting seat connected to the box body and formed with a first mounting groove and at least one row of first mounting holes;

[0020] A plurality of first connecting terminals are located in corresponding first mounting holes and connected to the circuit board;

[0021] The second connector includes:

[0022] a second mounting seat connected to the box body and formed with a second mounting groove and at least one row of second mounting holes;

[0023] A plurality of second connection terminals are located in corresponding second mounting holes and connected to the circuit board;

[0024] Wherein, the cover is installed in the first installation slot or the second installation slot.

[0025] The array-type microwave assembly, wherein the first connection end and the second connection end both include:

[0026] a center pin connected to the circuit board;

[0027] an insulator, sleeved outside the center needle;

[0028] The conductor is sleeved outside the insulator.

[0029] A quantum computer, comprising: an array microwave component as described in any one of the above.

[0030] Beneficial effect: Since the circuit board is arranged at an angle relative to the arrangement direction of the through holes, the structure of the array microwave component is more compact and the integration is higher in the arrangement direction of the through holes. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 1 is an exploded view of an array microwave assembly according to an embodiment of the present invention.

[0032] Figure 2 4 is a front view of an array microwave assembly according to an embodiment of the present invention.

[0033] Figure 3 1 is a graph showing the S-parameter test results of the array microwave assembly in an embodiment of the present invention.

[0034] Description of reference numerals:

[0035] 10. Box body; 11. Through hole; 12. Window structure; 20. Circuit board; 31. First connector; 311. First mounting seat; 3111. First mounting groove; 312. First connection terminal; 32. Second connector; 321. Second mounting seat; 3211. Second mounting groove; 322. Second connection terminal; 301. Center pin; 41. First upper cover; 42. First lower cover; 43. Second upper cover; 44. Second lower cover; α, tilt angle. DETAILED DESCRIPTION

[0036] In order to make the purpose, technical solutions and advantages of the present invention more clear and distinct, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0037] Please also see Figure 1-Figure 3 , the present invention provides some embodiments of an array microwave assembly.

[0038] like Figure 1-Figure 2 As shown, the array type microwave assembly of the present invention comprises:

[0039] A box body 10, wherein at least one row of through holes 11 is formed in the box body 10;

[0040] A plurality of circuit boards 20, each of which is located in a corresponding through hole 11;

[0041] Connect components;

[0042] The two ends of the circuit board 20 are respectively connected to the connecting components; the circuit board 20 is tilted relative to the arrangement direction of the through holes 11.

[0043] Specifically, a through-hole 11 is formed within the box body 10. The through-hole 11 is used to accommodate a circuit board 20. The first and second ends of the circuit board 20 are respectively connected to the connection assembly. There is at least one row of through-holes 11, with each row of through-holes 11 containing at least two through-holes 11. Thus, all through-holes 11 form an array of through-holes 11, and the circuit boards 20 form an array of circuit boards 20. Because the circuit boards 20 are not arranged flat, the arrangement direction of the circuit boards 20 and the through-holes 11 is inconsistent. Instead, the circuit boards 20 are arranged at an angle relative to the arrangement direction of the through-holes 11. This results in a more compact structure and a higher degree of integration in the arrangement direction of the through-holes 11.

[0044] In a preferred implementation of the embodiment of the present invention, Figure 1-Figure 2 As shown, the circuit boards 20 in the same row of through holes 11 have the same inclination direction.

[0045] Specifically, the circuit boards 20 in the same row of through holes 11 have the same tilt direction. All circuit boards 20 in each row of through holes 11 have the same tilt direction. The arrangement of circuit boards 20 in the same tilt direction is conducive to further improving the integration of the array microwave assembly.

[0046] In a preferred implementation of the embodiment of the present invention, Figure 1-Figure 2 As shown, the inclination angle α of the circuit board 20 relative to the arrangement direction of the through holes 11 is 30° to 60°.

[0047] Specifically, the inclination angle α of the circuit board 20 relative to the arrangement direction of the through holes 11 is 30° to 60°, which is conducive to improving the channel density. Preferably, the inclination angle α of the circuit board 20 relative to the arrangement direction of the through holes 11 is 40° to 50°, and the best effect is achieved when the inclination angle α of the circuit board 20 relative to the arrangement direction of the through holes 11 is 45°.

[0048] In a preferred implementation of the embodiment of the present invention, Figure 2 As shown, the projections of the circuit boards 20 in the same row of through holes 11 along the normal direction of the circuit boards 20 are separated from each other.

[0049] In a preferred implementation of the embodiment of the present invention, a filtering module or an attenuation module is provided on the circuit board 20 .

[0050] In a preferred implementation of the embodiment of the present invention, Figure 1-Figure 2 As shown, a window structure 12 is formed on the box body 10 , and the window structure 12 is communicated with the through hole 11 .

[0051] Specifically, a window structure 12 is formed on the box body 10, and the window structure 12 is connected to the through hole 11. The window structure 12 does not completely cover the entire area of ​​the through hole 11. Some areas of the through hole 11 do not have the window structure 12, so the through hole 11 does not form a groove structure. This makes the through hole 11 more sealed and isolated, and the signal is less likely to leak from one channel to another. The circuit board 20 and the connection component can be connected at the window structure 12. For example, the connection terminals of the circuit board 20 and the connection component can be welded at the window structure 12, thereby improving the reliability of the array microwave assembly and making the array microwave assembly more maintainable.

[0052] In a preferred implementation of the embodiment of the present invention, Figure 1-Figure 2 As shown, there are two rows of through holes 11 , and the window structures 12 corresponding to the two rows of through holes 11 are respectively located on both sides of the box body 10 .

[0053] Specifically, there are two rows of through holes 11, and the window structures 12 are respectively located on two sides of the box body 10, so the overall structure is more compact, and the circuit board 20 and the connection components can be connected from the window structures 12 on different sides.

[0054] In a preferred implementation of the embodiment of the present invention, Figure 1 As shown, the window structure 12 is located at the end of the through hole 11.

[0055] Specifically, in order to further facilitate the connection between the circuit board 20 and the connection component at the window structure 12, the window structure 12 is located at the end of the through hole 11. The window structure 12 is closer to the connection component, which is more convenient for welding operations.

[0056] In a preferred implementation of the embodiment of the present invention, Figure 1-Figure 2 As shown, each row of the through holes 11 has two window structures 12 , which are respectively located at two ends of the through holes 11 .

[0057] Specifically, each row of through holes 11 has two window structures 12 , and the two window structures 12 are respectively located at two ends of the through holes 11 , which is conducive to connecting to the connection components from both ends of the circuit board 20 .

[0058] In a preferred implementation of the embodiment of the present invention, Figure 1-Figure 2 As shown, the array microwave assembly further includes:

[0059] A plurality of covers cover the window structure 12 .

[0060] Specifically, the window structure 12 is covered and sealed by a cover, thereby encapsulating the circuit board 20 in the through hole 11 .

[0061] In a preferred implementation of the embodiment of the present invention, Figure 1-Figure 2 As shown, the connection component includes:

[0062] The first connector 31 and the second connector 32 are connected to two ends of the circuit board 20 respectively.

[0063] Specifically, the first connector 31 is connected to a first end of the circuit board 20 , and the second connector 32 is connected to a second end of the circuit board 20 .

[0064] In a preferred implementation of the embodiment of the present invention, Figure 1-Figure 2 As shown, the cover is connected to the first connector 31 or the second connector 32 .

[0065] Specifically, the cover is connected to the first connector 31 or the second connector 32. The number of covers is the same as the number of window structures 12. For example, if two rows of through holes 11 are used, and each row of through holes 11 is equipped with two window structures 12, there are four window structures 12, and four covers: a first upper cover 41, a first lower cover 42, a second upper cover 43, and a second lower cover 44. The first upper cover 41 and the first lower cover 42 are both connected to the first connector 31, and the second upper cover 43 and the second lower cover 44 are both connected to the second connector 32.

[0066] In a preferred implementation of the embodiment of the present invention, Figure 1-Figure 2 As shown, the first connector 31 includes:

[0067] A first mounting seat 311 is connected to the box body 10 and is formed with a first mounting groove 3111 and at least one row of first mounting holes;

[0068] A plurality of first connection terminals 312 are located in corresponding first mounting holes and connected to the circuit board 20 .

[0069] Specifically, the first connector 31 adopts an integrated structure, and multiple first connection terminals 312 are mounted on the first mounting base 311. The positions of the first mounting holes correspond to the positions of the through holes 11. Each through hole 11 is used to place a circuit board 20, and each first mounting hole is used to place a first connection terminal 312. The first connection terminal 312 is then connected to the first end of the corresponding circuit board 20.

[0070] In a preferred implementation of the embodiment of the present invention, Figure 1-Figure 2 As shown, the second connector 32 includes:

[0071] The second mounting seat 321 is connected to the box body 10 and is formed with a second mounting groove 3211 and at least one row of second mounting holes;

[0072] A plurality of second connection terminals 322 are located in corresponding second mounting holes and connected to the circuit board 20 .

[0073] Specifically, the second connector 32 adopts an integrated structure, and multiple second connection terminals 322 are mounted on the second mounting base 321. The positions of the second mounting holes correspond to the positions of the through holes 11. Each through hole 11 is placed with a circuit board 20, and each second mounting hole is placed with a second connection terminal 322. The second connection terminal 322 is then connected to the second end of the corresponding circuit board 20.

[0074] The first mounting seat 311 and the second mounting seat 321 are respectively located on two sides of the box body 10 , and the through hole 11 is sealed by the cover, the first connector 31 and the second connector 32 .

[0075] In a preferred implementation of the embodiment of the present invention, Figure 1-Figure 2 As shown, the cover is installed in the first installation groove 3111 or the second installation groove 3211.

[0076] Specifically, the first mounting groove 3111 is used to mount the cover, specifically the first upper cover 41 and the first lower cover 42. The second mounting groove 3211 is used to mount the cover, specifically the second upper cover 43 and the second lower cover 44.

[0077] In a preferred implementation of the embodiment of the present invention, Figure 1-Figure 2 As shown, the first connection terminal 312 and the second connection terminal 322 both include:

[0078] A center pin 301 connected to the circuit board 20;

[0079] an insulator, sleeved outside the center needle 301;

[0080] The conductor is sleeved outside the insulator.

[0081] Specifically, the center pin 301 is electrically connected to the circuit board 20, for example, by welding. The insulator is located between the center pin 301 and the conductor to isolate the center pin 301 and the conductor to prevent a short circuit between the two.

[0082] The array microwave assembly has the following benefits but is not limited to:

[0083] (1) High integration. The cross-section of existing circuit boards is generally a flat structure. This application maximizes space utilization efficiency by forming a certain inclination angle between the circuit board and the arrangement direction of the through holes, especially a 45-degree inclination angle, so that the widest part of the circuit board cross-section is placed on the diagonal line. The first connector or the second connector used in conjunction with the box body is an integrated array structure. Compared with discrete coaxial connectors, more connectors can be accommodated within the same cross-sectional size.

[0084] (2) High isolation. The through-holes of the box body are only partially open at the two ends near the connector. Compared with fully open windows, the sealing is stronger and the possibility of signal leakage from one channel to another is lower, so the channel isolation is higher.

[0085] (3) High reliability. The through-holes of the box body have window structures at both ends near the connector, which reserve windows for welding, making the electrical connection between the circuit board and the connector more convenient, increasing reliability and maintainability. The integrated array connector also greatly simplifies the assembly process.

[0086] like Figure 3 As shown, the circuit board is a 20dB attenuation module, and the channel isolation is better than -130dB, indicating high isolation.

[0087] Based on the array microwave assembly described in any of the above embodiments, the present invention further provides a preferred embodiment of a quantum computer:

[0088] A quantum computer according to an embodiment of the present invention includes: an array-type microwave component as described in any one of the above embodiments.

[0089] It should be understood that the application of the present invention is not limited to the above examples. For those skilled in the art, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.

Claims

1. An array microwave assembly, comprising: A box body, several circuit boards and a connecting component; the two ends of the circuit board are respectively connected to the connecting component, characterized in that at least one row of through holes is formed in the box body; the circuit board is located in the corresponding through holes; the circuit board is arranged at an angle relative to the arrangement direction of the through holes.

2. The array type microwave assembly according to claim 1, characterized in that: The inclination direction of each circuit board in the same row of through holes is the same; the inclination angle of the circuit board relative to the arrangement direction of the through holes is 30° to 60°.

3. The array type microwave assembly according to claim 1, characterized in that: A filtering module or an attenuation module is provided on the circuit board.

4. The array microwave assembly according to any one of claims 1 to 3, characterized in that: A window structure is formed on the box body, and the window structure is communicated with the through hole.

5. The array type microwave assembly according to claim 4, characterized in that: There are two rows of through holes, and the window structures corresponding to the two rows of through holes are respectively located on both sides of the box body.

6. The array type microwave assembly according to claim 4, characterized in that: Each row of through holes has two window structures, which are respectively located at two ends of the through holes.

7. The array type microwave assembly according to claim 6, characterized in that: The array type microwave assembly further comprises: A plurality of covers covering the window structure; The connection component includes: A first connector and a second connector are connected to two ends of the circuit board respectively; Wherein, the cover is connected to the first connector or the second connector.

8. The array type microwave assembly according to claim 7, characterized in that: The first connector includes: a first mounting seat connected to the box body and formed with a first mounting groove and at least one row of first mounting holes; A plurality of first connecting terminals are located in corresponding first mounting holes and connected to the circuit board; The second connector includes: a second mounting seat connected to the box body and formed with a second mounting groove and at least one row of second mounting holes; A plurality of second connection terminals are located in corresponding second mounting holes and connected to the circuit board; Wherein, the cover is installed in the first installation slot or the second installation slot.

9. The array type microwave assembly according to claim 8, characterized in that: The first connection terminal and the second connection terminal both include: a center pin connected to the circuit board; an insulator, sleeved outside the center needle; The conductor is sleeved outside the insulator.

10. A quantum computer, characterized in that: include: The array microwave assembly according to any one of claims 1 to 9.

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