Semiconductor wafer processing and planarization apparatus

Abstract

The application discloses a semiconductor wafer processing uniform glue device, including box, a plurality of adsorption components, center positioning mechanism, wafer transmission mechanism and glue dropping mechanism, the inside of the box is rotatably connected with a rotary table, a plurality of adsorption components annular array are arranged on the upper surface of the rotary table; the center positioning mechanism is arranged on the rotary table; one side of the box is equipped with a support, the support is rotatably connected with a support shaft, and two first connecting plates are fixedly arranged on the support shaft; the wafer transmission mechanism is connected with one of the first connecting plates, and the wafer transmission mechanism comprises a supporting plate, a driving assembly and a plurality of grabbing assemblies; the supporting plate is connected with the first connecting plate; the driving assembly is arranged on the lower surface of the supporting plate; a plurality of grabbing assemblies are respectively connected with the driving assembly; the glue dropping mechanism is connected with the other first connecting plate. Thus, the center positioning is carried out in the wafer taking and placing process, the wafer is placed in the center of the rotary table, the positioning precision is improved, and then the uniformity of the photoresist on the wafer surface is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor wafer processing, and particularly relates to a semiconductor wafer processing uniform glue device. BACKGROUND

[0002] In a semiconductor manufacturing process, uniform glue is a key step in the front process of photolithography technology, and the purpose is to uniformly coat a layer of photoresist film with consistent thickness on the surface of a silicon wafer. The uniformity of the coating directly affects the precision of subsequent processes such as photolithography, development, and etching, and ultimately determines the performance and yield of the chip.

[0003] At present, in the related technology, the wafer is placed on a rotating chuck of a uniform glue machine, and a certain amount of photoresist is added to the center of the wafer by using a nozzle, then the rotating chuck drives the wafer to rotate at a low speed (500-1500 rpm), and the centrifugal force is used to initially spread the photoresist from the center to the outside to cover the entire wafer surface, and then the speed is rapidly increased to a high speed (usually 2000-8000 rpm, depending on the viscosity of the photoresist, the required thickness, and the process requirements), to spin off the excess photoresist, achieve uniformity and control the final thickness, and at the same time, the solvent begins to volatilize.

[0004] In order to improve the efficiency of uniform glue and reduce the risk of manual intervention and pollution, modern uniform glue equipment generally uses an automatic mechanical hand to load and unload the wafer, that is, the mechanical hand is responsible for picking up the wafer from the input carrier, placing it on the bearing surface of the rotating table, and taking back the wafer after the coating is completed. However, the vibration of the equipment caused by the operation of the mechanical hand or the slight deformation or wear of the parts caused by long-term use may introduce slight tilting or deviation when the wafer is grabbed and released, and then affect the uniformity of the photoresist on the wafer surface. SUMMARY

[0005] The present application aims to at least solve one of the technical problems in the related art to some extent.

[0006] To this end, one purpose of the present application is to provide a semiconductor wafer processing uniform glue device that performs centering positioning during wafer picking and placing, ensures that the wafer is placed in the center of the rotating table, improves positioning accuracy, and then improves the uniformity of the photoresist on the wafer surface.

[0007] To achieve the above object, the first aspect of the present application provides a semiconductor wafer processing uniform glue device, comprising a box, a plurality of adsorption assemblies, a center positioning mechanism, a wafer transmission mechanism and a glue dropping mechanism, wherein the inside of the box is rotationally connected with a turntable, a plurality of adsorption assemblies are arranged in an annular array on the upper surface of the turntable; the center positioning mechanism is arranged on the turntable; one side of the box is provided with a support, a support shaft is rotationally connected with the support, two first connecting plates are fixedly arranged on the support shaft, and the two first connecting plates are perpendicular to each other; the wafer transmission mechanism is connected with one of the first connecting plates, and the wafer transmission mechanism comprises a support plate, a driving assembly and a plurality of grabbing assemblies, wherein the support plate is connected with the first connecting plate; the driving assembly is arranged on the lower surface of the support plate; a plurality of grabbing assemblies are respectively connected with the driving assembly; the glue dropping mechanism is connected with the other first connecting plate.

[0008] In addition, the semiconductor wafer processing uniform glue device provided by the present application can have the following additional technical features:

[0009] In an embodiment of the present application, the center positioning mechanism comprises a rotating shaft, a complete gear and a plurality of center assemblies, wherein the rotating shaft is rotationally arranged at the center of the turntable; the complete gear is arranged on the rotating shaft; and the plurality of center assemblies are uniformly distributed around the complete gear.

[0010] In an embodiment of the present application, the center assembly comprises an incomplete gear, a second connecting plate, a connecting rod and a roller body, wherein the incomplete gear is rotationally arranged above the turntable through a connecting shaft, and the incomplete gear is meshingly connected with the complete gear; the two ends of the second connecting plate are respectively connected with the incomplete gear and the connecting rod; and the roller body is rotationally arranged on the top of the connecting rod.

[0011] In an embodiment of the present application, the adsorption assembly comprises an electric push rod and a vacuum suction cup, wherein the electric push rod is arranged on the turntable, and the output end of the electric push rod is connected with the vacuum suction cup.

[0012] In an embodiment of the present application, the driving assembly comprises a driving member, a rotating plate, a center shaft and a push rod, wherein the driving member and the center shaft are both arranged on the lower surface of the support plate; one end of the push rod is connected with the center shaft, and the other end of the push rod is connected with the output end of the driving member; and the rotating plate is arranged on the center shaft.

[0013] In an embodiment of the present application, the grabbing assembly comprises a third connecting plate, a grabbing plate, a guide rail and a sliding block, wherein the guide rail is arranged on the lower surface of the support plate; the sliding block is in sliding connection with the guide rail; the grabbing plate is connected with the sliding block; and the two ends of the third connecting plate are respectively connected with the rotating plate and the grabbing plate.

[0014] In an embodiment of the present application, the glue dropping mechanism comprises a support frame, a sliding table module, a sliding plate and a glue dropping gun, wherein the support frame is arranged at the end of the first connecting plate, and a sliding groove is arranged on the support frame; the sliding table module is arranged on the support frame, and a sliding table is in sliding connection with the sliding table module; one end of the sliding plate is connected with the sliding table, and the other end of the sliding plate passes through the sliding groove and is connected with the glue dropping gun.

[0015] Compared with the prior art, the present application has at least the following beneficial effects: the plurality of grabbing assemblies can be simultaneously driven to move centripetally and centrifugally by the driving assembly to centrally grab and release the wafer, and the wafer is centrally positioned again by the central positioning mechanism, so that the wafer is placed in the center of the rotating table, the positioning accuracy is improved, and the uniformity of the photoresist on the wafer surface is improved.

[0016] The additional aspects and advantages of the present application will be partially given in the following description, partially will become obvious from the following description, or will be understood by the practice of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0017] The above and / or additional aspects and advantages of the present application will become apparent and more readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:

[0018] Figure 1 Structure schematic view of the semiconductor wafer processing photoresist uniformity device according to an embodiment of the present application;

[0019] Figure 2 Structure schematic view of the central positioning mechanism in the semiconductor wafer processing photoresist uniformity device according to an embodiment of the present application;

[0020] Figure 3 Structure schematic view of the wafer conveying mechanism in the semiconductor wafer processing photoresist uniformity device according to an embodiment of the present application;

[0021] Figure 4 Structure schematic view of the grabbing assembly in the semiconductor wafer processing photoresist uniformity device according to an embodiment of the present application;

[0022] Figure 5 Structure schematic view of the glue dropping mechanism in the semiconductor wafer processing photoresist uniformity device according to an embodiment of the present application.

[0023] As shown in the figure: 1, box; 2, adsorption assembly; 3, center positioning mechanism; 4, wafer transmission mechanism; 5, glue dropping mechanism; 6, rotary table; 7, support; 8, support shaft; 9, first connecting plate; 21, electric push rod; 22, vacuum chuck; 31, rotating shaft; 32, complete gear; 33, centering assembly; 331, incomplete gear; 332, second connecting plate; 333, connecting rod; 334, roller body; 41, support plate; 42, driving assembly; 43, grabbing assembly; 421, driving piece; 422, rotating plate; 423, center shaft; 424, push rod; 431, third connecting plate; 432, grabbing plate; 433, guide rail; 434, sliding block; 51, support frame; 52, sliding table module; 53, sliding plate; 54, drop gun. DETAILED DESCRIPTION

[0024] The embodiments of the present application are described in detail below with reference to the accompanying drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are intended to explain the present application, and cannot be understood as limiting the present application. On the contrary, the embodiments of the present application include all changes, modifications and equivalents falling within the spirit and scope of the appended claims.

[0025] The semiconductor wafer processing uniform glue device of the embodiments of the present application is described below in conjunction with the accompanying drawings.

[0026] As Figures 1 to 4 shown, the semiconductor wafer processing uniform glue device of the embodiments of the present application can include a box 1, a plurality of adsorption assemblies 2, a center positioning mechanism 3, a wafer transmission mechanism 4 and a glue dropping mechanism 5.

[0027] Among them, the box 1 is rotatably connected with a rotary table 6 in the inside, a plurality of adsorption assemblies 2 are arranged in a ring array on the upper surface of the rotary table 6, and the center positioning mechanism 3 is arranged on the rotary table 6.

[0028] It should be noted that the box 1 is a hollow cavity structure with an upper opening, the rotary table 6 is horizontally arranged, and the rotary table 6 is connected with an external motor, which can drive the rotary table 6 to rotate, and the rotation speed of the rotary table 6 can be accurately controlled by a controller, ensuring that the photoresist can be evenly laid on the wafer surface.

[0029] Further, the adsorption assembly 2 can be provided with three, and arranged in an equilateral triangle, which can stably adsorb the wafer, and also can adjust the height of the wafer as needed.

[0030] In the embodiments of the present application, the center positioning mechanism 3 can ensure that the center of the wafer is on the same vertical line as the center of the rotary table 6, thereby facilitating the uniform dispersion of the photoresist and ensuring the uniform thickness of the photoresist.

[0031] One side of the box body 1 is provided with a support 7, the support 7 is rotatably connected with a support shaft 8, two first connecting plates 9 are fixedly arranged on the support shaft 8, and the two first connecting plates 9 are perpendicular to each other.

[0032] It should be noted that the support 7 is a U-shaped plate structure, the support 7 supports the support shaft 8, one end of the support shaft 8 is connected with an external driving motor, and the support shaft 8 can be driven to rotate 90 degrees by the motor.

[0033] The wafer conveying mechanism 4 is connected with one of the first connecting plates 9, and the wafer conveying mechanism 4 comprises a support plate 41, a driving assembly 42 and a plurality of grabbing assemblies 43, wherein the support plate 41 is connected with the first connecting plate 9; the driving assembly 42 is arranged on the lower surface of the support plate 41; the plurality of grabbing assemblies 43 are respectively connected with the driving assembly 42; and the glue dropping mechanism 5 is connected with the other first connecting plate 9.

[0034] In the embodiment of the present application, the grabbing assembly 43 can be provided with three, when the driving assembly 42 is started, the grabbing assembly 43 can move towards the center of the support plate 41 or away from the center of the support plate 41, so as to facilitate grabbing and releasing the wafer, and at the same time, it can also ensure that the wafer can be centrally arranged below the support plate 41 during conveying the wafer.

[0035] Further, the glue dropping mechanism 5 can drop photoresist liquid to the center of the wafer, and the volume of the dropping can be accurately controlled by the controller.

[0036] In one embodiment of the present application, as shown in Figure 2 The center positioning mechanism 3 comprises a rotating shaft 31, a complete gear 32 and a plurality of centering assemblies 33, wherein the rotating shaft 31 is rotatably arranged at the center of the turntable 6; the complete gear 32 is arranged on the rotating shaft 31; and the plurality of centering assemblies 33 are uniformly distributed around the complete gear 32.

[0037] It should be noted that the centering assembly 33 can be provided with three, and is arranged in an annular array, one end of the rotating shaft 31 is connected with an external driving motor, the complete gear 32 can be driven to rotate a certain angle by the motor, and then the position of the centering assembly 33 is adjusted.

[0038] Further, as shown in Figure 2 The centering assembly 33 comprises an incomplete gear 331, a second connecting plate 332, a connecting rod 333 and a roller body 334, wherein the incomplete gear 331 is rotatably arranged above the turntable 6 through a connecting shaft, and the incomplete gear 331 is meshingly connected with the complete gear 32; the two ends of the second connecting plate 332 are respectively connected with the incomplete gear 331 and the connecting rod 333; and the roller body 334 is rotatably arranged at the top of the connecting rod 333.

[0039] In the embodiment of the present application, the roller body 334 can be made of elastic material, so as not to damage the wafer when the wafer is centered.

[0040] Further, when the complete gear 32 rotates, the second connecting plate 332, the connecting rod 333 and the roller body 334 are driven to rotate a certain angle under the cooperation of the incomplete gear 331, so as to move the roller body 334 close to the edge of the wafer, thereby centering the wafer.

[0041] In one embodiment of the present application, as shown in Figure 2 The adsorption assembly 2 comprises an electric push rod 21 and a vacuum chuck 22, wherein the electric push rod 21 is arranged on the turntable 6, and the output end of the electric push rod 21 is connected with the vacuum chuck 22.

[0042] In the embodiment of the present application, the electric push rod 21 can adjust the height of the vacuum chuck 22, so as to facilitate the wafer to be taken or placed on the vacuum chuck 22, and when the wafer is higher than the roller body 334, the roller body 334 can be hidden below the wafer by driving the complete gear 32 to rotate, so that the photoresist does not pollute the roller body 334 in the process of spreading the photoresist on the surface of the wafer.

[0043] In one embodiment of the present application, as shown in Figure 3 and Figure 4 The driving assembly 42 comprises a driving member 421, a rotating plate 422, a center shaft 423 and a push rod 424, wherein the driving member 421 and the center shaft 423 are arranged on the lower surface of the support plate 41; one end of the push rod 424 is connected with the center shaft 423, and the other end of the push rod 424 is connected with the output end of the driving member 421; the rotating plate 422 is arranged on the center shaft 423.

[0044] It should be noted that the driving member 421 can be a pneumatic rod, and the driving member 421 can drive the center shaft 423 and the rotating plate 422 to rotate a certain angle, so as to adjust the position of the grabbing assembly 43.

[0045] Further, as shown in Figure 3 The grabbing assembly 43 comprises a third connecting plate 431, a grabbing plate 432, a guide rail 433 and a sliding block 434, wherein the guide rail 433 is arranged on the lower surface of the support plate 41; the sliding block 434 is slidingly connected with the guide rail 433; the grabbing plate 432 is connected with the sliding block 434; the two ends of the third connecting plate 431 are respectively connected with the rotating plate 422 and the grabbing plate 432.

[0046] It should be noted that the extension line of the guide rail 433 passes through the center of the support plate 41, and the guide rail 433 and the sliding block 434 can guide the movement direction of the grabbing plate 432, the grabbing plate 432 is a U-shaped plate, and the grabbing plate 432 can grab or release the wafer and ensure that the wafer is centrally arranged during grabbing or releasing.

[0047] In an embodiment of the present application, as shown in Figure 1 and Figure 5 The glue dropping mechanism 5 includes a support frame 51, a sliding table module 52, a sliding plate 53, and a glue dropping gun 54. The support frame 51 is arranged at the end of the first connecting plate 9, and the support frame 51 is provided with a sliding groove. The sliding table module 52 is arranged on the support frame 51, and the sliding table module 52 is slidably connected with a sliding table. One end of the sliding plate 53 is connected with the sliding table, and the other end of the sliding plate 53 passes through the sliding groove and is connected with the glue dropping gun 54.

[0048] It should be noted that the upper surface of the support frame 7 is provided with a glue tank and a liquid pump, and the liquid inlet end of the liquid pump is communicated with the glue tank. The liquid outlet end of the liquid pump is communicated with the glue dropping gun 54 through a conduit, so that the photoresist can be delivered to the center of the wafer.

[0049] Further, the sliding table module 52 can adjust the height of the glue dropping gun 54, so that the glue dropping gun 54 can extend into the inside of the box body 1, and the bottom of the glue dropping gun 54 is close to the upper side of the center of the wafer, avoiding the offset of the glue due to the distance difference.

[0050] Specifically, when the support plate 41 is located directly above the wafer, the relevant personnel control the driving assembly 42 to start, so that the plurality of grabbing assemblies 43 move to the center of the wafer, and finally the grabbing plate 432 is inserted into the upper and lower sides of the wafer. Then, the support shaft 8 is controlled to rotate 90°, at this time the grabbing plate 432 drives the wafer to rotate to the upper side of the vacuum chuck 22, then the relevant personnel control the electric push rod 21 to start, the electric push rod 21 drives the vacuum chuck 22 to rise, the vacuum chuck 22 is attached to the lower surface of the wafer, the grabbing plate 432 is controlled to move away from each other and separate from the wafer, the support shaft 8 is controlled to rotate in the opposite direction, the wafer conveying mechanism 4 is reset, and the glue dropping mechanism 5 is rotated to the upper side of the wafer.

[0051] Then, the relevant personnel control the vacuum chuck 22 to move downward to drive the wafer into the inside of the box body 1, then the centering assembly 33 is used to ensure that the wafer is centrally placed, and the wafer is stably adsorbed by the vacuum chuck 22. At this time, the wafer is adjusted again and moved upward, when the wafer is higher than the roller body 334, the complete gear 32 is controlled to rotate, the centering assembly 33 is driven to rotate, and the roller body 334 is hidden below the wafer, so as to avoid that the photoresist is thrown on the roller body 334 by the rotation of the wafer.

[0052] Finally, the relevant personnel control the slide module 52 to start, and the slide module 52 drives the drop gun 54 to move downwards. When the bottom of the drop gun 54 approaches the wafer, the liquid pump can be started to deliver the glue liquid into the drop gun 54, and finally drop to the center of the wafer. Then the drop gun 54 is reset, the turntable 6 is first rotated at a low speed, and the photoresist is preliminarily spread outward from the center to cover the entire wafer surface by using the centrifugal force, and then rotated at a high speed to shake off the excess photoresist, so as to realize uniformity.

[0053] After the glue spreading is completed, the wafer conveying mechanism 4 is rotated again to above the wafer, and the distance between the three grabbing plates 432 is sufficient for the wafer to pass through. At this time, the wafer is lifted to the center of the grabbing plate 432 by using the adsorption assembly 2, and the adsorption of the wafer is released. The three grabbing plates 432 move towards the center to surround the wafer, and the adsorption assembly 2 moves downwards to separate from the wafer. At this time, the wafer conveying mechanism 4 places the wafer after the glue spreading is completed on the wafer rack.

[0054] In summary, the semiconductor wafer processing glue spreading device of the embodiment of the present application can drive multiple grabbing assemblies to move towards the center and away from the center at the same time by using the driving assembly, so as to center and release the wafer, and then center the wafer again by using the centering positioning mechanism, so as to ensure that the wafer is placed in the center of the turntable, improve the positioning accuracy, and further improve the uniformity of the photoresist on the wafer surface.

[0055] In the description of the present specification, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can be explicitly or implicitly included at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0056] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable manner in any one or more embodiments or examples. In addition, the different embodiments or examples described in the present specification and the features of the different embodiments or examples can be combined and combined by those skilled in the art without contradiction.

[0057] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary and are not to be construed as limiting the present application, and that changes, modifications, substitutions and variations can be made by those skilled in the art without departing from the scope of the present application.

Claims

1. A semiconductor wafer processing deglazing apparatus characterized by comprising: The box, a plurality of adsorption components, central positioning mechanism, wafer transmission mechanism and glue dropping mechanism are provided, The inner side of the box is rotatably connected with a rotary table, and a plurality of adsorption components are arranged in an annular array on the upper surface of the rotary table; The central positioning mechanism is arranged on the rotary table; One side of the box is provided with a support, a support shaft is rotatably connected to the support, two first connecting plates are fixedly arranged on the support shaft, and the two first connecting plates are perpendicular to each other; The wafer transmission mechanism is connected with one of the first connecting plates, and the wafer transmission mechanism comprises a support plate, a driving assembly and a plurality of grabbing assemblies, wherein The support plate is connected with the first connecting plate; The driving assembly is arranged on the lower surface of the support plate; A plurality of grabbing assemblies are connected with the driving assembly respectively; The glue dropping mechanism is connected with the other first connecting plate.

2. The apparatus according to claim 1, wherein The central positioning mechanism comprises a rotating shaft, a complete gear and a plurality of central components, wherein The rotating shaft is rotatably arranged at the center of the rotary table; The complete gear is arranged on the rotating shaft; A plurality of central components are uniformly distributed around the complete gear.

3. The apparatus according to claim 2, wherein The central component comprises an incomplete gear, a second connecting plate, a connecting rod and a roller body, wherein The incomplete gear is rotatably arranged above the rotary table through a connecting shaft, and the incomplete gear is meshingly connected with the complete gear; The two ends of the second connecting plate are respectively connected with the incomplete gear and the connecting rod; The roller body is rotatably arranged at the top of the connecting rod.

4. The apparatus according to claim 1, wherein The adsorption component comprises an electric push rod and a vacuum suction cup, wherein The electric push rod is arranged on the rotary table, and the output end of the electric push rod is connected with the vacuum suction cup.

5. The apparatus according to claim 1, wherein The driving assembly comprises a driving member, a rotating plate, a central shaft and a push rod, wherein The driving member and the central shaft are arranged on the lower surface of the support plate; One end of the push rod is connected with the central shaft, and the other end of the push rod is connected with the output end of the driving member; The rotating plate is arranged on the central shaft.

6. The apparatus according to claim 5, wherein The grabbing assembly comprises a third connecting plate, a grabbing plate, a guide rail and a sliding block, wherein The guide rail is arranged on the lower surface of the support plate; The sliding block is slidably connected with the guide rail; The grabbing plate is connected with the sliding block; The two ends of the third connecting plate are respectively connected with the rotating plate and the grabbing plate.

7. The apparatus according to claim 1, wherein The glue dropping mechanism comprises a support frame, a sliding table module, a sliding plate and a dropping gun, wherein The support frame is arranged at the end of the first connecting plate, and a sliding groove is arranged on the support frame; The sliding table module is arranged on the support frame, and a sliding table is slidably connected to the sliding table module; One end of the sliding plate is connected with the sliding table, and the other end of the sliding plate passes through the sliding groove and is connected with the dropping gun.

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