Cleaning device and cleaning method

Abstract

The invention relates to the technical field of wafer cleaning, and particularly discloses a cleaning device and a cleaning method.In the cleaning device, a first spraying piece is provided with a hollow channel, the side wall of the first spraying piece is provided with a plurality of first spraying holes communicating with the hollow channel, and the first spraying holes are used for spraying cleaning liquid and / or gas; the bearing table is rotationally arranged on the periphery of the first spraying piece; the bearing table is used for bearing a plurality of accommodating pieces for accommodating wafers, and the accommodating pieces can accommodate the plurality of wafers which are arranged at intervals in the vertical direction; the multiple containing pieces are arranged around the axis of the bearing table at intervals, and the first spraying holes all face the bearing table. The second spraying assembly comprises a second spraying piece, the second spraying piece is cylindrical and arranged on the periphery of the bearing table in a surrounding mode, and the second spraying piece is provided with a plurality of second spraying holes facing the bearing table; the second spraying holes are used for spraying cleaning liquid and / or gas; the output end of the driving assembly can be in transmission connection with the bearing table and drive the bearing table to rotate. According to the arrangement, the wafer cleaning and drying effects are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and in particular to a cleaning device and a cleaning method. Background Art

[0002] As the specifications of electronic products become smaller and smaller, chips are also getting smaller and smaller. Chips are processed from wafers. During the processing, cleaning is required every two steps. As the processing technology moves from 2D to 3D, new challenges are posed to wafer cleaning. The difficulty of cleaning wafers that are no longer flat also increases. The nozzles in existing cleaning devices are generally only set above the wafer. The cleaning liquid is sprayed from top to bottom and carries away impurities during the flow process after falling on the wafer. Due to the concave and convex structures on the wafer, impurities on the wafer are easily blocked, making it difficult to move to the outside of the wafer, resulting in poor cleaning effect.

[0003] Therefore, it is urgent to study a cleaning device and a cleaning method to solve the above problems. Summary of the Invention

[0004] The object of the present invention is to provide a cleaning device and a cleaning method to solve the problem of poor wafer cleaning effect in the prior art.

[0005] To achieve the above object, the present invention adopts the following technical solutions:

[0006] Cleaning device, comprising:

[0007] a first spraying member, wherein a hollow channel is provided in the interior of the first spraying member, and a plurality of first spraying holes communicating with the hollow channel are formed on a side wall of the first spraying member, wherein the first spraying holes are used to spray cleaning liquid and / or gas;

[0008] A carrier platform is rotatably disposed on the outer periphery of the first spraying member; the carrier platform is used to support a plurality of accommodating members for accommodating wafers, and the accommodating members can accommodate a plurality of wafers spaced apart in a vertical direction; the plurality of accommodating members are spaced apart around the axis of the carrier platform, and the first spray holes are all facing the carrier platform;

[0009] a second spray assembly, comprising a second spray member, the second spray member being cylindrical and disposed around the outer periphery of the carrier platform, the second spray member having a plurality of second spray holes all facing the carrier platform; the second spray holes being used to spray cleaning liquid and / or gas;

[0010] A driving component, the output end of which can be transmission-connected to the supporting platform and drive the supporting platform to rotate.

[0011] As an optional technical solution of the cleaning device, the second spray member is provided with a spray channel, the second spray hole is formed at one end of the spray channel toward the supporting platform, and the diameter of the spray channel gradually decreases in the direction toward the supporting platform; and / or,

[0012] The accommodating component is rotatably arranged on the supporting platform so as to enable the wafer to rotate around its own axis.

[0013] As an optional technical solution for a cleaning device, the second spray member is provided with an annular cavity, and the spray channel is connected to the annular cavity. The second spray assembly also includes a stop member, which is annular and has a plurality of communicating holes, and the plurality of communicating holes correspond one-to-one to the plurality of spray channels; the stop member is provided in the annular cavity and can rotate between a connecting position and a stop position to connect or block the spray channel.

[0014] As an optional technical solution of the cleaning device, the first spray member is cylindrical, and the plurality of first spray holes form a plurality of groups, the first spray holes in each group are spaced apart in the vertical direction, and the plurality of first spray holes in each group are evenly spaced around the axis of the first spray member; and / or,

[0015] The second spraying member is cylindrical, and a plurality of the second spraying holes form a plurality of groups. The second spraying holes in each group are spaced apart in the vertical direction, and the plurality of the second spraying holes in each group are evenly spaced around the axis of the second spraying member.

[0016] As an optional technical solution for a cleaning device, the cleaning device also includes a collecting piece, which is cylindrical and connected to the bottom of the second spray piece, and the first spray piece is passed through the interior of the collecting piece; wherein, the collecting piece is a closing structure, and the inner diameter of the collecting piece gradually decreases in the direction away from the second spray piece.

[0017] As an optional technical solution of the cleaning device, the cleaning device further includes a suction member, which is arranged in the collecting member and is used to suck water mist.

[0018] As an optional technical solution of the cleaning device, the suction member includes a suction part and a transmission part that are connected to each other, a suction cavity is provided inside the suction part, and the suction part also includes a plurality of suction holes connected to the suction cavity.

[0019] As an optional technical solution of the cleaning device, the suction part is cylindrical, wherein:

[0020] The suction portion is funnel-shaped, and its diameter gradually decreases as it moves away from the first spraying element; and / or

[0021] The suction cavity is annular, and the inner side and the outer side of the suction portion are both provided with the suction holes communicating with the suction cavity.

[0022] As an optional technical solution for a cleaning device, the driving assembly includes a lifting driving member and a rotating driving member. The output end of the lifting driving member is connected to the rotating driving member and drives the rotating driving member to move between a lifting position and a lowering position. When the rotating driving member is in the lowering position, the output end of the rotating driving member is connected to the supporting platform for transmission.

[0023] A cleaning method, applied to the cleaning device described in any of the above technical solutions, comprises the following steps:

[0024] Place the wafer on the carrier;

[0025] The carrier table rotates at a first speed, and the first spray element and the second spray element spray cleaning liquid to clean the wafer;

[0026] The carrier platform rotates at a second speed, and the first spraying member sprays gas toward the wafer;

[0027] The first spraying member and the second spraying member spray the cleaning liquid simultaneously or alternately.

[0028] The present invention has at least the following beneficial effects:

[0029] The present invention provides a cleaning device and a cleaning method, which includes a first spray part, a supporting platform, a second spray assembly and a driving assembly, wherein a hollow channel is provided inside the first spray part, and a plurality of first spray holes connected to the hollow channel are opened on the side wall of the first spray part, and the first spray holes are used to spray cleaning liquid and / or gas; the supporting platform is rotatably arranged on the outer periphery of the first spray part; the supporting platform is used to carry a plurality of accommodating parts for accommodating wafers, and the accommodating parts can accommodate a plurality of wafers arranged at intervals along the vertical direction; the plurality of accommodating parts are evenly spaced around the axis of the supporting platform, and the first spray holes are all facing the supporting platform; the second spray assembly includes a second spray part, the second spray part is cylindrical, and is arranged around the outer periphery of the supporting platform, and the second spray part has a plurality of second spray holes all facing the supporting platform; the second spray holes are used to spray cleaning liquid and / or gas; the output end of the driving assembly can be transmission-connected to the supporting platform and drive the supporting platform to rotate. The cleaning liquid sprayed by the first spray part and the second spray part can flow evenly to the wafer of the accommodating part and rinse from all angles, thereby cleaning the impurities on the surface of the wafer. Among them, the cleaning liquid sprayed by the first spray part can flush the impurities on the wafer outward, and the cleaning liquid sprayed by the second spray part can flush the impurities on the wafer inward. In addition, when the supporting platform is rotating at the first speed, the impact angle of the cleaning liquid on the impurities is further increased, so that impurities in different corners can be separated from the wafer; when the cleaning is completed, the rotation speed is increased, and the supporting platform rotates at the second speed to shake off the cleaning liquid on the wafer; finally, in the drying process, the first spray part can spray gas to further accelerate the drying effect of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in describing the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without any creative work.

[0031] Figure 1 A schematic structural diagram of a cleaning device according to an embodiment of the present invention;

[0032] Figure 2 A schematic cross-sectional view of a cleaning device according to an embodiment of the present invention;

[0033] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0034] Figure 4 Schematic diagram of the structure of the stopper in an embodiment of the present invention;

[0035] Figure 5 for Figure 2Enlarged view of point B in the middle.

[0036] In the picture:

[0037] 1000, wafer;

[0038] 100, first spray element; 110, first spray hole;

[0039] 200, carrying platform; 210, receiving member;

[0040] 300, second spray assembly; 310, second spray member; 311, spray channel; 3111, second spray hole; 312, annular cavity; 313, operating hole; 320, stopper; 321, communicating hole; 322, toggle member; 330, collecting member;

[0041] 400, drive assembly;

[0042] 500, suction piece; 510, suction portion; 511, suction hole; 512, suction cavity; 520, transmission portion. DETAILED DESCRIPTION

[0043] Before any embodiments of the present application are explained in detail, it is to be understood that the application is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the foregoing drawings.

[0044] In this application, the terms "comprises," "includes," "has," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0045] In this application, the term "and / or" describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Additionally, the character " / " in this application generally indicates that the related objects are in an "and / or" relationship.

[0046] In this application, the terms "connect," "combine," "couple," and "install" may refer to direct connection, combination, coupling, or installation, or indirect connection, combination, coupling, or installation. For example, a direct connection refers to two parts or components being connected together without an intermediary, and an indirect connection refers to two parts or components being connected to at least one intermediary, with the two parts or components being connected via the intermediary. Furthermore, "connect" and "couple" are not limited to physical or mechanical connections or couplings and may include electrical connections or couplings.

[0047] In this application, it will be understood by those skilled in the art that relative terms (e.g., "about," "approximately," "substantially," etc.) used in conjunction with quantities or conditions include the values ​​and have the meaning indicated by the context. For example, the relative terms include at least the degree of error associated with the measurement of a specific value, the tolerance caused by manufacturing, assembly, use, etc. associated with a specific value. Such terms should also be considered to disclose a range defined by the absolute values ​​of the two endpoints. Relative terms may refer to plus or minus a certain percentage (e.g., 1%, 5%, 10% or more) of the indicated value. Numerical values ​​that do not use relative terms should also be disclosed as specific values ​​with tolerances. In addition, "substantially" may refer to plus or minus a certain degree (e.g., 1 degree, 5 degrees, 10 degrees or more) on the basis of the indicated angle when expressing a relative angular position relationship (e.g., substantially parallel, substantially perpendicular).

[0048] In this application, it will be understood by those skilled in the art that the function performed by an assembly can be performed by one assembly, multiple assemblies, one part, or multiple parts. Similarly, the function performed by a part can also be performed by one part, one assembly, or a combination of multiple parts.

[0049] In the present application, the terms "upper", "lower", "left", "right", "front", "back" and other directional words are described based on the orientation and positional relationship shown in the accompanying drawings, and should not be understood as limiting the embodiments of the present application. In addition, in the context, it is also necessary to understand that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to the other element "upper" or "lower", but also be indirectly connected to the other element "upper" or "lower" through an intermediate element. It should also be understood that directional words such as upper side, lower side, left side, right side, front side, back side, etc. not only represent the positive orientation, but can also be understood as the lateral orientation. For example, below can include directly below, lower left, lower right, lower front and lower back, etc.

[0050] like Figures 1 to 5As shown, this embodiment provides a cleaning device, which includes a first spray part 100, a carrier 200, a second spray assembly 300 and a drive assembly 400. The first spray part 100 has a hollow channel inside, and a plurality of first spray holes 110 connected to the hollow channel are opened on the side wall of the first spray part 100. The first spray holes 110 are used to spray cleaning liquid and / or gas; the carrier 200 is annular and rotatably arranged on the outer periphery of the first spray part 100; the carrier 200 is used to carry a plurality of accommodating parts 210 for accommodating wafers 1000. The accommodating parts 210 can accommodate a plurality of wafers 1000 arranged at intervals in the vertical direction. The wafers 1000 are arranged in a uniform arrangement; a plurality of accommodating members 210 are spaced evenly around the axis of the carrier 200, with the first spray holes 110 all facing the carrier 200; a second spray assembly 300 includes a second spray member 310, which is cylindrical and disposed around the outer periphery of the carrier 200. The second spray member 310 has a plurality of second spray holes 3111, all facing the carrier 200; the second spray holes 3111 are used to spray cleaning liquid and / or gas. The output end of the drive assembly 400 is capable of transmission connection with the carrier 200 and drives the carrier 200 to rotate.

[0051] The cleaning liquid (cleaning liquid is liquid or two fluids, wherein the two fluids are liquid-gas mixture) sprayed by the first spray part 100 and the second spray part 310 can flow evenly onto the wafer 1000 of the accommodating part 210 and rinse from all angles, thereby cleaning impurities on the surface of the wafer 1000. The cleaning liquid sprayed by the first spray part 100 can flush the impurities on the wafer 1000 outwards, and the cleaning liquid sprayed by the second spray part 310 can flush the impurities on the wafer 1000 inwards. In addition, when the carrier 200 rotates at the first speed, the impact angle of the cleaning liquid on the impurities is further increased, so that the impurities in different corners can be separated from the wafer 1000; when the cleaning is completed, the rotation speed is increased, and the carrier 200 rotates at the second speed, thereby throwing the liquid on the wafer 1000 outward; finally, in the drying process, the first spray part 100 and / or the second spray hole 3111 can spray gas, thereby further accelerating the drying effect of the wafer 1000.

[0052] Of course, in some embodiments, the carrier 200 can also rotate at a third speed to improve the cleaning effect, wherein the third speed is greater than the first speed and less than the second speed, which helps to throw out impurities under the action of inertia.

[0053] The receiving member 210 is rotatably mounted on the carrier 200, allowing the wafer 1000 to rotate about its own axis. This allows the wafer 1000 to both rotate about its own axis and revolve around the axis of the carrier 200. This further increases the angle of the cleaning liquid relative to the wafer 1000. During the cleaning liquid spraying process, the rotation of the wafer 1000 allows impurities at all angles to be impacted and separated from the wafer 1000.

[0054] The accommodating member 210 is driven by a servo motor. The servo motor is mounted on the support platform 200 and is provided with a driving pulley. The accommodating member 210 is provided with a driven pulley. A transmission member is wound around the driven pulley and the driving pulley. The transmission member is a transmission belt. Furthermore, the transmission member is a synchronous belt, and both the driving pulley and the driven pulley are synchronous pulleys.

[0055] Regarding the spraying angle of the cleaning liquid, in this embodiment, the axes of the first spray hole 110 and the second spray hole 3111 have a certain angle with the horizontal line, so that the cleaning liquid is sprayed obliquely downward toward the wafer 1000. The distance between the first spray hole 110 and the wafer 1000 is 10mm-15mm. The distance between the second spray hole 3111 and the wafer 1000 is 10mm-15mm. In the vertical direction, the number of the first spray hole 110 and the wafers 1000 in each accommodating part 210 is the same, and they correspond one to one; the number of the second spray hole 3111 and the wafers 1000 in each accommodating part 210 is the same, and they correspond one to one.

[0056] To prevent impurities from entering the second spray hole 3111 during the spin-drying process, in some embodiments, the second spray member 310 is provided with a spray channel 311, and the spray channel 311 forms a second spray hole 3111 at one end toward the carrier 200. The diameter of the spray channel 311 gradually decreases in the direction toward the carrier 200 to reduce the probability of impurities entering the second spray hole 3111 during the spin-drying process of the wafer 1000.

[0057] Furthermore, the flow rate of the cleaning liquid is constant as it flows through spray channel 311. As spray channel 311 becomes narrower, the flow rate of the cleaning liquid increases. According to Bernoulli's principle, an increase in flow rate results in a decrease in pressure, but the pressure here refers to static pressure. In reality, dynamic pressure increases, resulting in an overall increase in pressure, enhancing the cleaning effect on wafer 1000.

[0058] As the spray channel 311 narrows, the cleaning liquid flows faster, increasing resistance and causing pressure fluctuations. Compared to spray channels 311 with larger diameters, spray channels 311 with smaller diameters experience greater pressure losses. According to Bernoulli's theorem, when cleaning liquid flows through spray channels 311 with smaller diameters, the flow rate increases and the pressure decreases. However, considering that the total resistance of spray channels 311 with smaller diameters is equal to the cleaning liquid flow rate, an increase in pipe resistance inevitably leads to an increase in pressure. When cleaning liquid is not flowing through spray channels 311 with smaller diameters, the increased pipe resistance inevitably prevents accidental flow or dripping of cleaning liquid.

[0059] The end of the spray channel 311 away from the carrier 200 serves as the spray inlet. Several liquid inlet pipes are connected to the spray inlets in a one-to-one correspondence. The other ends of these liquid inlet pipes are connected to a cleaning liquid or gas ejection device. In this embodiment, the hollow channel is connected to the cleaning liquid ejection device to eject cleaning liquid from the first spray holes 110, or the hollow channel is connected to the gas ejection device to eject nitrogen or other inert gas from the first spray holes 110. The process of spraying two fluids from the multiple first spray holes 110 creates a similar effect to a fireworks display.

[0060] Furthermore, the second spray element 310 is provided with an annular cavity 312, with the spray channel 311 communicating with the annular cavity 312. The second spray assembly 300 also includes a stopper 320. The stopper 320 is annular and has a plurality of communication holes 321, which correspond one-to-one with the plurality of spray channels 311. The stopper 320 is disposed within the annular cavity 312 and can rotate between a connecting position and a blocking position to connect or block the spray channel 311. When the spray channel 311 is blocked, even if impurities enter the second spray hole 3111, they will be intercepted by the stopper 320, reducing the depth of the impurities' entry and making them easier to spray out when the cleaning fluid is sprayed a second time.

[0061] When the stopper 320 is in the connecting position, the connecting holes 321 are connected one by one to the corresponding spray channels 311. When the stopper 320 is in the blocking position, the stopper 320 blocks all spray channels 311. To ensure convenient operation of the stopper 320, the second sprayer 310 has an operating hole 313 that connects to the annular cavity 312. A toggle 322 is provided on the outside of the stopper 320. The toggle 322 passes through the operating hole 313 and is partially located outside the operating hole 313, facilitating handheld operation. Pushing the toggle 322 causes the stopper 320 to rotate between the connecting position and the blocking position.

[0062] The accommodating member 210 accommodates a plurality of wafers 1000, which are spaced apart in the vertical direction. To improve the spray coverage, in some embodiments, the first spray member 100 is cylindrical, and the plurality of first spray holes 110 form a plurality of first spray groups. Each first spray group is spaced apart in the vertical direction, and the plurality of first spray holes 110 in each first spray group are evenly spaced around the axis of the first spray member 100. The second spray member 310 is cylindrical, and the plurality of second spray holes 3111 form a plurality of second spray groups. Each second spray group is spaced apart in the vertical direction, and the plurality of second spray holes 3111 in each second spray group are evenly spaced around the axis of the second spray member 310.

[0063] To facilitate the recovery of impurities and cleaning fluid, in some embodiments, the cleaning apparatus further includes a collecting member 330. This collecting member 330 is cylindrical and communicates with the lower portion of the second spray member 310. The first spray member 100 is disposed within the collecting member 330. The collecting member 330 is a tapered cylindrical structure, with its inner diameter gradually decreasing as it moves away from the second spray member 310, facilitating connection to a liquid extraction device at its lower end. In some embodiments, the collecting member 330 and the second spray member 310 are integrally formed.

[0064] The first spray member 100 and the second spray member 310 are both made of high-strength, corrosion-resistant materials. For example, the first spray member 100 and the second spray member 310 are both made of 316 stainless steel or Teflon.

[0065] During the cleaning process, splashing cleaning liquid or escaping water mist will be generated. In order to protect the internal structure, the cleaning device also includes a suction member 500. The suction member 500 is arranged in the collecting member 330 and is used to suck the water mist.

[0066] Specifically, the suction member 500 includes a suction portion 510 and a transmission portion 520 that are connected to each other. The suction portion 510 has a suction cavity 512 inside. The suction portion 510 also includes a plurality of suction holes 511 connected to the suction cavity 512 to improve the suction range and suction effect. The transmission portion 520 is connected to the suction device.

[0067] To further increase the suction area, the suction portion 510 is cylindrical. Furthermore, the suction portion 510 is funnel-shaped, and its diameter gradually decreases away from the first spraying element 100 to adapt to the shape of the collecting element 330 and maximize the suction area.

[0068] Suction holes 511 communicating with the suction cavity 512 are provided on both the inner and outer sides of the suction portion 510 , thereby further expanding the total area of ​​the suction holes 511 and improving the suction effect.

[0069] In some embodiments, the drive assembly 400 includes a lifting drive member and a rotating drive member. The output end of the lifting drive member is in transmission connection with the rotating drive member, and drives the rotating drive member to move between a raised position and a lowered position. When the rotating drive member is in the lowered position, the output end of the rotating drive member is in transmission connection with the carrier 200. When the lifting drive member drives the rotating drive member to the raised position, the container 210 carrying the wafer 1000 can be placed on the carrier 200, or the container 210 carrying the cleaned wafer 1000 can be removed.

[0070] Regarding the drive of the carrier 200, in some embodiments, the output end of the rotary drive member is provided with a plug-in member, and the carrier 200 is provided with a plug-in slot. The lifting drive member is located outside the second spray member 310 and will not be affected during the cleaning process, which helps to increase the service life.

[0071] The cover plate is located at the lower end of the rotary drive element. The upper end of the second spray element 310 has an opening, which the cover plate can cover to seal. The second spray element 310 and the cover plate form a cleaning chamber, within which the carrier 200 is located. The cover plate has a rotation channel, through which the output end of the rotary drive element passes. This allows the rotary drive element to be located outside the second spray element 310, unaffected by the cleaning process and thus extending its service life.

[0072] To ensure connection stability, the output end of the rotary drive has a mounting plate, onto which the connectors are mounted. The platform 200 has several slots spaced apart around its axis, and the mounting plate is equipped with connectors, each corresponding to a slot. The rotary drive is a servo motor, while the lifting drive is a pneumatic cylinder or push rod motor.

[0073] In some embodiments, the cleaning apparatus further includes a destaticizing mechanism that can spray plasma onto wafer 1000 as needed to remove static electricity from the surface of wafer 1000 and prevent it from attracting new contaminants. Plasma is sprayed before drying. The structure and operating principle of the destaticizing mechanism can be referenced in the prior art and will not be described in detail here.

[0074] This embodiment further provides a cleaning method, which is applied to the cleaning device in any of the above embodiments, and is characterized by comprising the following steps:

[0075] The wafer 1000 is placed on the carrier 200 .

[0076] The carrier 200 rotates at a first speed, and the first spraying member 100 and the second spraying member 310 spray cleaning liquid to clean the wafer 1000 .

[0077] The carrier 200 rotates at a second speed, and the first spraying member 100 sprays an inert gas such as nitrogen toward the wafer 1000. The second speed is greater than the first speed.

[0078] The first spraying member 100 and the second spraying member 310 spray the cleaning liquid simultaneously or alternately.

[0079] The above method can effectively impact impurities at all angles, thereby flushing them off wafer 1000. The alternating spraying of cleaning fluid by the first and second spray elements 100, 310, helps improve flow consistency during the rinsing process. The simultaneous spraying of cleaning fluid by the first and second spray elements 100, 310, helps create impact, facilitating the separation of impurities from wafer 1000.

[0080] Wherein, plasma is sprayed by a destaticizing mechanism before and / or during the drying process.

[0081] During the drying process, the cleaning chamber is in a sub-vacuum state. Sub-vacuum refers to a relatively vacuum environment, that is, the pressure of the environment is lower than atmospheric pressure, but it is not completely pressureless. The pressure range is usually between 10^3 Pa and 10^6 Pa. Under constant temperature conditions, as the air pressure decreases, water molecules continue to evaporate. At the same time, the boiling point of water will decrease, enhancing the drying effect of the wafer 1000. In some embodiments, the sub-vacuum state is achieved by the suction process of the cleaning chamber by the suction member 500.

[0082] To improve the drying effect, the suction element 500 continuously draws suction from the cleaning chamber to extract the water mist. However, this continuous suction causes the pressure inside the cleaning chamber to drop continuously. To ensure that the cleaning chamber remains in a sub-vacuum state, an inert gas is sprayed into the cleaning chamber through the first spray holes 110. While the first spray holes 110 spray inert gas, the suction element 500 continuously draws suction. The difference in the inert gas flow rates between the two stabilizes the pressure inside the cleaning chamber, maintaining a sub-vacuum state.

[0083] The cleaning method also includes the following steps: conducting a trial run of the cleaning device, checking the cleaning and drying effects of the wafer 1000, and adjusting and optimizing the spray parameters of the cleaning liquid, the rotation speed of the carrier 200, etc. according to actual conditions.

[0084] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the embodiments of the present invention. A person skilled in the art would be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. A cleaning device, characterized in that: include: A first spraying member (100), wherein a hollow channel is provided inside the first spraying member (100), and a plurality of first spraying holes (110) communicating with the hollow channel are opened on a side wall of the first spraying member (100), wherein the first spraying holes (110) are used for spraying cleaning liquid and / or gas; A carrier platform (200) is rotatably arranged on the outer periphery of the first spraying member (100); the carrier platform (200) is used to carry a plurality of accommodating members (210) for accommodating wafers (1000), and the accommodating members (210) can accommodate a plurality of wafers (1000) arranged at intervals along a vertical direction; the plurality of accommodating members (210) are arranged at intervals around the axis of the carrier platform (200), and the first spraying holes (110) all face the carrier platform (200); The second spray assembly (300) comprises a second spray member (310), the second spray member (310) being cylindrical and arranged around the outer periphery of the carrier platform (200), the second spray member (310) having a plurality of second spray holes (3111) all facing the carrier platform (200); the second spray holes (3111) are used for spraying cleaning liquid and / or gas; A driving assembly (400), wherein the output end of the driving assembly (400) can be connected to the supporting platform (200) for driving and driving the supporting platform (200) to rotate.

2. The cleaning device according to claim 1, characterized in that The second spraying member (310) is provided with a spraying channel (311), the second spraying hole (3111) is formed at one end of the spraying channel (311) facing the supporting platform (200), and the diameter of the spraying channel (311) gradually decreases in a direction toward the supporting platform (200); and / or, The accommodating part (210) is rotatably arranged on the supporting platform (200) so as to enable the wafer (1000) to rotate around its own axis.

3. The cleaning device according to claim 2, characterized in that The second spraying member (310) is provided with an annular cavity (312), and the spraying channel (311) is communicated with the annular cavity (312). The second spraying assembly (300) further includes a stopper (320), the stopper (320) is annular and has a plurality of communicating holes (321), and the plurality of communicating holes (321) correspond one-to-one to the plurality of spraying channels (311); the stopper (320) is provided in the annular cavity (312) and can rotate between a communicating position and a blocking position to connect or block the spraying channel (311).

4. The cleaning device according to claim 1, characterized in that The first spraying member (100) is cylindrical, and a plurality of the first spraying holes (110) form a plurality of groups, the first spraying holes (110) in each group are spaced apart in a vertical direction, and the plurality of the first spraying holes (110) in each group are evenly spaced around the axis of the first spraying member (100); and / or, The second spraying member (310) is cylindrical, and a plurality of the second spraying holes (3111) form a plurality of groups. The second spraying holes (3111) in each group are spaced apart in the vertical direction, and the plurality of the second spraying holes (3111) in each group are evenly spaced around the axis of the second spraying member (310).

5. The cleaning device according to claim 1, characterized in that The cleaning device further comprises a collecting member (330), the collecting member (330) being cylindrical and connected to the lower side of the second spray member (310), and the first spray member (100) being arranged inside the collecting member (330); wherein the collecting member (330) is a closing structure, and the inner diameter of the collecting member (330) gradually decreases in a direction away from the second spray member (310).

6. The cleaning device according to claim 5, characterized in that: The cleaning device further comprises a suction member (500), which is arranged in the collecting member (330) and is used for sucking water mist.

7. The cleaning device according to claim 6, characterized in that The suction piece (500) includes a suction portion (510) and a transfer portion (520) that are connected to each other. The suction portion (510) has a suction cavity (512) inside. The suction portion (510) also includes a plurality of suction holes (511) connected to the suction cavity (512).

8. The cleaning device according to claim 7, characterized in that: The suction portion (510) is cylindrical, wherein: The suction portion (510) is funnel-shaped, and the diameter of the suction portion (510) gradually decreases in a direction away from the first spraying element (100); and / or, The suction cavity (512) is annular, and the suction holes (511) communicating with the suction cavity (512) are provided on both the inner side and the outer side of the suction portion (510).

9. The cleaning device according to any one of claims 1 to 8, characterized in that: The driving assembly (400) comprises a lifting driving member and a rotating driving member, wherein the output end of the lifting driving member is connected to the rotating driving member and drives the rotating driving member to move between a lifting position and a lowering position; when the rotating driving member is in the lowering position, the output end of the rotating driving member is in transmission connection with the supporting platform (200).

10. A cleaning method, applied to the cleaning device according to any one of claims 1 to 9, characterized in that: The following steps are involved: Placing the wafer (1000) on the carrier platform (200); The carrier platform (200) rotates at a first speed, and the first spraying member (100) and the second spraying member (310) spray cleaning liquid to clean the wafer (1000); The carrier platform (200) rotates at a second speed, and the first spraying member (100) sprays gas toward the wafer (1000); The first spraying member (100) and the second spraying member (310) spray the cleaning liquid simultaneously or alternately.

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